Double-wafer bonding clamping device and application method thereof

Abstract

The invention discloses a double-wafer bonding clamping device and an application method thereof, and relates to the field of wafer bonding, the double-wafer bonding clamping device comprises a chuck, an upper chuck used for adsorbing an upper wafer, a lower chuck, a chassis seat and three clamping positioning mechanisms, the lower chuck is arranged at the bottom of the upper chuck, the chassis seat is arranged at the bottom of the lower chuck, and the three clamping positioning mechanisms are arranged on the chassis seat. A fixing part used for fixing the lower chuck is arranged on the chassis base, the three clamping and positioning mechanisms are arranged in a circumferential array shape with the axis of the lower chuck as the center, and each clamping and positioning mechanism comprises an air cylinder assembly, a Spacer-Clamp fixing base assembly, a Spacer assembly and a Clamp assembly. Through the spacing piece which can be fed in the horizontal direction, spacing clamping of the two wafers after the marking point alignment process is achieved, the upper wafer is pressed through the driving pressing wheel, alignment fixing between the upper wafer and the lower wafer is guaranteed, the wafer gap vacuumizing technology before bonding in the clamp can be achieved, and bubbles of a bonding glue layer are effectively avoided.

Description

Technical Field

[0001] The invention relates to a wafer bonding technology, and in particular to a double wafer bonding clamping device and an application method thereof. Background Art

[0002] In the field of semiconductor manufacturing, wafer bonding is a core process step, especially in advanced packaging technologies such as 3D packaging and wafer-level packaging, and plays a pivotal role. The quality of wafer bonding directly determines the performance and reliability of the final product, and any minor defects may lead to a significant decrease in product yield. However, existing wafer bonding clamping equipment has many shortcomings in design and application.

[0003] Specifically, existing wafer bonding clamping equipment usually uses a complex clamping mechanism to fix the upper wafer and the lower wafer. The operation is cumbersome and costly, and it is not convenient for the subsequent process transfer of the clamping mechanism. In addition, the upper and lower wafers are in contact in advance during bonding. During the vacuum pumping process of the chamber, the upper and lower wafers are in contact in advance, resulting in the bubbles between the upper and lower wafers not being discharged in time after the bonding is completed, and the process yield is not high. Summary of the invention

[0004] The purpose of the present invention is to provide a dual wafer bonding clamping device and an application method thereof, so as to solve the problem that the existing wafer bonding clamping equipment usually adopts a complex clamping mechanism to fix the upper wafer and the lower wafer, which is cumbersome to operate and costly, is not convenient for the subsequent process transfer of the clamping mechanism, and the upper and lower wafers contact in advance during bonding, resulting in the problem that the bubbles between the upper and lower wafers are not discharged in time after the bonding is completed.

[0005] In order to achieve the above-mentioned object, the present invention provides the following technical solutions: a dual wafer bonding clamping device, comprising an upper chuck, the upper chuck is used to adsorb the upper wafer, and also comprises a dual wafer bonding clamping mechanism, the dual wafer bonding clamping mechanism comprises a lower chuck, a chassis seat and three clamping positioning mechanisms, the lower chuck is arranged at the bottom of the upper chuck, the chassis seat is arranged at the bottom of the lower chuck, and a fixing member for fixing the lower chuck is arranged on the chassis seat;

[0006] The three clamping and positioning mechanisms are arranged in a circular array with the axis of the lower chuck as the center, and the clamping and positioning mechanisms include a cylinder assembly, a Spacer-Clamp fixed seat assembly, a Spacer assembly and a Clamp assembly;

[0007] The Spacer-Clamp fixed seat assembly is installed on the lower chuck, and the Spacer-Clamp fixed seat assembly includes a fixed seat, a first L-shaped rod, a second L-shaped rod, a first special-shaped push rod, a second special-shaped push rod and a shaft sleeve. The fixed seat is fixedly installed on the lower chuck, one end of the first special-shaped push rod and the second special-shaped push rod are both rotatably connected to the fixed seat, one end of the first L-shaped rod is rotatably connected to the first special-shaped push rod, and one end of the second L-shaped rod is rotatably connected to the second special-shaped push rod;

[0008] The spacer assembly includes a spacer shaft frame, a slider, a spacer rod and a spacer sheet. The spacer shaft frame is fixedly mounted on a fixed seat, the spacer sheet is fixedly mounted on the spacer rod, one side of the slider is connected to a guide member for limiting the movement of the spacer rod relative to the spacer shaft frame along the length direction of the spacer rod, one side of the slider is fixedly connected to the spacer rod, and the other side of the slider is rotatably connected to the first L-shaped rod through a transmission pin;

[0009] The Clamp assembly includes a pressure rod base, a pressure rod upper seat, a connecting block, a cam, an adapter block, a pressure rod, a pressure wheel, a Clamp connecting shaft and a pressure rod shaft. The pressure rod base is fixedly mounted on the fixed seat, the pressure rod upper seat is transmission-connected to the pressure rod base through the connecting block and the cam, one end of the adapter block is rotationally connected to the connecting block through a transmission pin, one side of the adapter block is fixedly connected to the second special-shaped push rod, the pressure rod is fixedly mounted on the pressure rod upper seat, and the pressure wheel is rotationally mounted on the end of the pressure rod through the pressure rod shaft;

[0010] The cylinder assembly is installed on the lower chuck and located at the bottom of the Spacer-Clamp fixed seat assembly. The cylinder assembly can drive the first special-shaped push rod and / or the second special-shaped push rod to rotate with the connection between the first push rod and the fixed seat as the center of the circle.

[0011] Furthermore, the supporting positioning member includes two positioning pins and two suction cup seats, which are evenly arranged on the chassis seat. Two positioning holes corresponding to the two positioning pins are opened on the lower chuck. A vacuum air duct is distributed inside the suction cup seat. The vacuum air duct is connected to an external vacuum generator through a pipe. The lower chuck and the suction cup seat are positioned by positioning pins and are installed and fixed by vacuum adsorption.

[0012] Furthermore, the cylinder assembly includes a first lifting cylinder and a second lifting cylinder, the fixed ends of the first lifting cylinder and the second lifting cylinder are fixedly connected to the chassis seat through a cylinder connecting seat, and the movable ends of the first lifting cylinder and the second lifting cylinder are fixedly connected to a guide wheel frame, and a guide wheel is rotatably installed on the top of the guide wheel frame through a guide wheel shaft.

[0013] Furthermore, the guide member includes two guide shafts, both ends of the two guide shafts are fixedly connected to the Spacer shaft frame, and the outer side walls of the two guide shafts are slidably connected to the slider.

[0014] Furthermore, the connecting block and the cam are respectively arranged at the two ends of the pressure rod base, the connecting block and the upper end of the cam are rotatably connected to the pressure rod upper seat through a transmission pin, and one side of the connecting block and the lower end of the cam are rotatably connected to the pressure rod base through a transmission pin.

[0015] Furthermore, a contoured boss based on the wafer shape is processed at the center of the lower chuck, and vacuum air passages for adsorbing the wafer are distributed inside the lower chuck and the upper chuck.

[0016] Furthermore, a first spring sheet is fixedly mounted on the spacing rod, the first spring sheet is partially located on the upper portion of the spacing sheet, and a second spring sheet is fixedly mounted on the upper portion of the pressure rod.

[0017] Furthermore, the ends of the first special-shaped push rod and the second special-shaped push rod away from the fixing seat are both wedge-shaped.

[0018] Furthermore, tension springs are installed between the fixed seat and the first special-shaped push rod and the second special-shaped push rod. The two ends of the tension spring between the fixed seat and the first special-shaped push rod are respectively fixedly connected to the fixed seat and the first special-shaped push rod, and the two ends of the tension spring between the fixed seat and the second special-shaped push rod are respectively fixedly connected to the fixed seat and the second special-shaped push rod.

[0019] An application method of a dual wafer bonding clamping device, applicable to the dual wafer bonding clamping device described above, comprises the following steps:

[0020] S1. First, the upper wafer is adsorbed to the upper chuck, and then the lower wafer is placed in the center of the lower chuck manually or by a robot, and the lower chuck is turned on for vacuum adsorption;

[0021] S2, control the moving end of the first lifting cylinder to extend, drive the three sets of spacers evenly distributed on the lower chuck to extend, after the alignment work is completed, drive the lower chuck to rise to the upper wafer connection position through the driving member, after the upper wafer falls to the spacer, the lower chuck is driven by the driving member to descend to the safety position;

[0022] S3, controlling the moving end of the second lifting cylinder to extend, driving the three groups of pressure rods evenly distributed on the lower chuck to extend, and the pressure wheels fix the upper and lower wafers;

[0023] S4. After the above process is completed, the vacuum adsorption of the suction cup seat is turned off, and the lower chuck can be taken away manually.

[0024] Compared with the prior art, the dual wafer bonding clamping device and the application method thereof provided by the present invention reduce the complexity and cost of the wafer bonding clamping device by means of vacuum adsorption, which not only improves the reliability and stability of the device, but also facilitates the subsequent process transfer of the clamping device, is conducive to manual loading and unloading operations, and has a simple and convenient structure.

[0025] By using a spacer that can be fed horizontally, the two wafers are clamped at an interval after the mark point alignment process. By driving the pressure wheel to press the upper wafer, the alignment and fixation between the upper and lower wafers are guaranteed. This device can realize the vacuuming technology of the wafer gap before bonding in the fixture, effectively avoiding the generation of bubbles in the bonding layer, and avoiding premature contact between the upper and lower wafers during the vacuuming process of the cavity, thereby improving the process yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0027] Figure 1 A schematic diagram of the overall structure provided by an embodiment of the present invention;

[0028] Figure 2 A schematic diagram of a partial three-dimensional structure provided by an embodiment of the present invention;

[0029] Figure 3 A schematic diagram of the combination of a cylinder assembly, a chassis seat and a suction cup seat provided in an embodiment of the present invention;

[0030] Figure 4 A schematic diagram of the structure of a Spacer-Clamp fixing seat assembly provided in an embodiment of the present invention;

[0031] Figure 5 A schematic diagram of the structure of a Spacer component provided in an embodiment of the present invention;

[0032] Figure 6 A schematic diagram of the structure of the Clamp component provided in an embodiment of the present invention;

[0033] Figure 7 A schematic diagram of the combination of a second L-shaped rod and an adapter block provided in an embodiment of the present invention;

[0034] Figure 8 A schematic diagram of the combination of a first L-shaped rod and a sliding block provided in an embodiment of the present invention.

[0035] Description of reference numerals:

[0036] 1. Upper chuck; 2. Dual wafer bonding clamping mechanism; 21. Lower chuck; 3. Chassis seat; 4. Positioning pin; 5. Suction cup seat; 6. Guide wheel; 7. Guide wheel shaft; 8. Guide wheel frame; 9. Cylinder connecting seat; 10. First lifting cylinder; 11. Second lifting cylinder; 12. Fixed seat; 13. Second L-shaped rod; 14. First L-shaped rod; 15. Bushing; 16. First special-shaped push rod; 17. Bottom plate; 18. Second special-shaped push rod; 19. First spring sheet; 20. Spacer rod; 21. Spacer; 22. Slider; 23. Guide shaft; 24. Spacer shaft frame; 25. Pressure wheel; 26. Pressure rod; 27. Second spring sheet; 28. Pressure rod upper seat; 29. ​​Connecting block; 30. Adapter block; 31. Clamp connecting shaft; 32. Pressure rod base; 33. Cam; 34. Pressure rod shaft. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0038] Embodiment 1:

[0039] See also Figures 1 to 8 A dual wafer bonding clamping device includes an upper chuck 1, the upper chuck 1 is used to absorb the upper wafer, and also includes a dual wafer bonding clamping mechanism 2, the dual wafer bonding clamping mechanism 2 includes a lower chuck 21, a chassis seat 3 and three clamping positioning mechanisms, the lower chuck 21 is arranged at the bottom of the upper chuck 1, the chassis seat 3 is arranged at the bottom of the lower chuck 21, and the chassis seat 3 is provided with a fixing member for fixing the lower chuck 21;

[0040] The three clamping and positioning mechanisms are arranged in a circular array with the axis of the lower chuck 21 as the center, and the clamping and positioning mechanisms include a cylinder assembly, a Spacer-Clamp fixed seat assembly, a Spacer assembly and a Clamp assembly;

[0041] The Spacer-Clamp fixed seat assembly is installed on the lower chuck 21. The Spacer-Clamp fixed seat assembly includes a fixed seat 12, a first L-shaped rod 14, a second L-shaped rod 13, a first special-shaped push rod 16, a second special-shaped push rod 18 and a sleeve 15. The fixed seat 12 is fixedly installed on the lower chuck 21. The bottom of the fixed seat 12 is fixedly connected with a bottom plate 17 by bolts. One end of the first special-shaped push rod 16 and the second special-shaped push rod 18 are both rotatably connected to the fixed seat 12. The first special-shaped push rod 16 and the second special-shaped push rod 18 are rotatably installed on the fixed seat 12 through the same transmission pin. The sleeve 15 is sleeved on the outside of the transmission pin connected to the first special-shaped push rod 16 and the second special-shaped push rod 18 and is used to separate the first special-shaped push rod 16 and the second special-shaped push rod 18. One end of the first L-shaped rod 14 is rotatably connected to the first special-shaped push rod 16, and one end of the second L-shaped rod 13 is rotatably connected to the second special-shaped push rod 18.

[0042] The spacer assembly includes a spacer shaft frame 24, a slider 22, a spacer rod 20 and a spacer sheet 21. The spacer shaft frame 24 is fixedly mounted on the fixing seat 12, the spacer sheet 21 is fixedly mounted on the spacer rod 20, one side of the slider 22 is connected to a guide member for limiting the spacer rod 20 from moving relative to the spacer shaft frame 24 along the length direction of the spacer rod 20, one side of the slider 22 is fixedly connected to the spacer rod 20, and the other side of the slider 22 is rotatably connected to the first L-shaped rod 14 through a transmission pin;

[0043] The Clamp assembly includes a pressure rod base 32, a pressure rod upper seat 28, a connecting block 29, a cam 33, an adapter block 30, a pressure rod 26, a pressure wheel 25, a Clamp connecting shaft 31 and a pressure rod shaft 34. The pressure rod base 32 is fixedly mounted on the fixed seat 12, the pressure rod upper seat 28 is transmission-connected to the pressure rod base 32 through the connecting block 29 and the cam 33, one end of the adapter block 30 is rotationally connected to the connecting block 29 through a transmission pin, one side of the adapter block 30 is fixedly connected to the second special-shaped push rod 18, the pressure rod 26 is fixedly mounted on the pressure rod upper seat 28, and the pressure wheel 25 is rotationally mounted on the end of the pressure rod 26 through the pressure rod shaft 34;

[0044] The cylinder assembly is mounted on the lower chuck 21 and is located at the bottom of the Spacer-Clamp fixed seat assembly. The cylinder assembly can drive the first special-shaped push rod 16 and / or the second special-shaped push rod 18 to rotate with the connection between the first push rod 16 and the fixed seat 12 as the center.

[0045] Existing wafer bonding clamping equipment usually uses a complex clamping mechanism to fix the upper wafer and the lower wafer. The operation is cumbersome and costly. It is not convenient for the subsequent process transfer of the clamping mechanism, and it is difficult to realize the vacuuming technology of the wafer gap before bonding in the clamping mechanism. During the vacuuming process of the chamber, the upper and lower wafers are in contact in advance, which easily leads to the generation of bubbles in the bonding layer, and the process yield is not high.

[0046] To this end, the present application is to adsorb the upper wafer onto the upper chuck 1, and then manually or mechanically place the lower wafer at the center of the lower chuck 21, the lower chuck 21 starts vacuum adsorption, and the first special-shaped push rod 16 is driven by the cylinder assembly to rotate around the connection between it and the fixed seat 12 as the center of the circle, and the first special-shaped push rod 16 drives the slider 22 to move along the length direction of the spacer rod 20 when rotating, and the spacer rod 20 drives the spacer plate 21 to extend, and after the alignment work is completed, the lower chuck 21 rises to the upper wafer joint. After the upper wafer falls to the spacer 21, the lower chuck 21 descends to a safe position, and the second special-shaped push rod 18 is driven by the cylinder assembly to rotate around the connection between it and the fixed seat 12 as the center of a circle. When the second special-shaped push rod 18 rotates, it drives the pressure rod upper seat 28 and the pressure rod 26 to move along the radial direction of the lower chuck 21 toward the center of the lower chuck 21 through the adapter block 30. The pressure wheel 25 fixes the upper and lower wafers, and then the fixing of the fixing part to the lower chuck 21 is released, and the lower chuck 21 can be taken away manually.

[0047] See also Figures 2 to 3 In one embodiment of the present invention, the supporting positioning member includes two positioning pins 4 and two suction cup seats 5, the two positioning pins 4 and the two suction cup seats 5 are evenly arranged on the chassis seat 3, and two positioning holes corresponding to the two positioning pins 4 are opened on the lower chuck 21. A vacuum air duct is distributed inside the suction cup seat 5, and the vacuum air duct is connected to an external vacuum generator through a pipeline. The lower chuck 21 and the suction cup seat 5 are installed and fixed by vacuum adsorption; mechanical sealing vacuum adsorption is adopted between the upper surface of the suction cup seat 5 and the mating surface of the lower chuck 21, and the mating surface needs to be polished to ensure the roughness and flatness of the mating surface.

[0048] See also Figures 2 to 3 In one embodiment of the present invention, the cylinder assembly includes a first lifting cylinder 10 and a second lifting cylinder 11, the fixed ends of the first lifting cylinder 10 and the second lifting cylinder 11 are fixedly connected to the chassis seat 3 through a cylinder connecting seat 9, and the movable ends of the first lifting cylinder 10 and the second lifting cylinder 11 are fixedly connected to a guide wheel frame 8, and the top end of the guide wheel frame 8 is rotatably installed with a guide wheel 6 through a guide wheel shaft 7;

[0049] The guide wheel frame 8 connected to the moving end of the first lifting cylinder 10 is located at the bottom of the first special-shaped push rod 16. When the moving end of the first lifting cylinder 10 is extended, the guide wheel frame 8 and the guide wheel shaft 7 connected thereto drive the guide wheel 6 to move, and the guide wheel 6 pushes the first special-shaped push rod 16, and the first special-shaped push rod 16 rotates with the connection between it and the fixed seat 12 as the center of the circle;

[0050] The guide wheel frame 8 connected to the moving end of the second lifting cylinder 11 is located at the bottom of the second special-shaped push rod 18. When the moving end of the second lifting cylinder 11 is extended, the guide wheel 6 is driven to move through the guide wheel frame 8 and the guide wheel shaft 7 connected thereto. The guide wheel 6 pushes the second special-shaped push rod 18, and the second special-shaped push rod 18 rotates with the connection between it and the fixed seat 12 as the center of the circle.

[0051] See also Figure 5 In one embodiment of the present invention, the guide member includes two guide shafts 23, both ends of the two guide shafts 23 are fixedly connected to the Spacer shaft frame 24, and the outer side walls of the two guide shafts 23 are slidably connected to the slider 22. The two guide shafts 23 limit the five reverse degrees of freedom of the slider 22, ensuring the horizontal feeding movement of the spacer 21 along the radial direction of the lower chuck 21, and the distance between the lower edge of the spacer 21 and the lower chuck 21 is always maintained at 1 mm (the thickness of the lower wafer);

[0052] According to the different thickness of the adhesive layer of the upper wafer, in order to avoid the generation of bubbles in the bonding adhesive layer between the upper and lower wafers, the thickness of the spacer 21 can be selected in different specifications of 0.5mm-1mm;

[0053] The end of the clamp assembly's pressure rod 26 uses a guide wheel 6, which helps to avoid slippage of the upper wafer caused by hard contact.

[0054] See also Figure 6 and Figure 7 In one embodiment of the present invention, the connecting block 29 and the cam 33 are respectively arranged at the two ends of the pressure rod base 32, and the upper ends of the connecting block 29 and the cam 33 are rotatably connected to the pressure rod upper seat 28 through a transmission pin, and one side of the connecting block 29 and the lower end of the cam 33 are rotatably connected to the pressure rod base 32 through a transmission pin;

[0055] The second special-shaped push rod 18 drives the connecting block 29 through the adapter block 30 to rotate with the connection between the adapter block 30 and the pressure rod base 32 as the center, and the cam 33 rotates with the connection between it and the pressure rod base 32 as the center, and the pressure rod 26 moves toward the center of the lower chuck 21, and the pressure wheel 25 at the end of the pressure rod 26 fixes the wafer.

[0056] In one embodiment of the present invention, a contoured boss based on the wafer shape is processed in the center of the lower chuck 21, and its processing accuracy can be within 0.1mm, ensuring the manual wafer placement constraint function. Vacuum air ducts for adsorbing wafers are distributed inside the lower chuck 21 and the upper chuck 1.

[0057] See also Figure 5 and Figure 6 In one embodiment of the present invention, in order to prevent the pressure rod 26 and the spacer 21 from generating large deflection warping when the upper and lower wafers are respectively attached, a first spring sheet 19 is fixedly mounted on the spacer 20, and a portion of the first spring sheet 19 is located at the upper portion of the spacer 21. A second spring sheet 27 is fixedly mounted on the upper portion of the pressure rod 26 to increase the stiffness of the pressure rod 26 and the spacer 21.

[0058] See also Figures 3 to 5In one embodiment of the present invention, in order to avoid the influence of mechanism instability caused by instantaneous impact force and reduce friction, the first special-shaped push rod 16 and the second special-shaped push rod 18 are both wedge-shaped in design at one end away from the fixed seat 12, and are matched with the guide wheel 6 in the cylinder assembly.

[0059] In one embodiment of the present invention, tension springs are installed between the fixing seat 12 and the first special-shaped push rod 16 and the second special-shaped push rod 18, and the two ends of the tension spring between the fixing seat 12 and the first special-shaped push rod 16 are fixedly connected to the fixing seat 12 and the first special-shaped push rod 16 respectively, and the two ends of the tension spring between the fixing seat 12 and the second special-shaped push rod 18 are fixedly connected to the fixing seat 12 and the second special-shaped push rod 18 respectively;

[0060] When the wedge-shaped ends of the first special-shaped push rod 16 and the second special-shaped push rod 18 are lifted and rotated, the tension spring is in a stretched state to keep the spacer 21 and the pressure rod 26 in an extended state.

[0061] In one embodiment of the present invention, the lower chuck 21 can be driven by a motor to achieve uniform feeding motion in the XYZ directions. Specifically, a servo motor XYZ three-axis motion mechanism can be used to drive the lower chuck 21 to move.

[0062] Embodiment 2:

[0063] See also Figures 1 to 8 , an application method of a dual wafer bonding clamping device, applicable to the above-mentioned dual wafer bonding clamping device, comprising the following steps:

[0064] S1, first adsorb the upper wafer to the upper chuck 1, then place the lower wafer at the center of the lower chuck 21 manually or by a robot, and start vacuum adsorption of the lower chuck 21;

[0065] S2, control the moving end of the first lifting cylinder 10 to extend, drive the three sets of spacers evenly distributed on the lower chuck 21 to extend, after the alignment work is completed, drive the lower chuck 21 to rise to the upper wafer connection position through the driving member, after the upper wafer falls to the spacer 21, the lower chuck 21 is driven by the driving member to descend to the safety position;

[0066] The movement of the lower chuck 21 can be driven by a servo motor XYZ three-axis motion mechanism;

[0067] S3, controlling the moving end of the second lifting cylinder 11 to extend, driving the three groups of pressing rods 26 evenly distributed on the lower chuck 21 to extend, and the pressing wheel 25 fixes the upper and lower wafers;

[0068] S4. After the above steps are completed, the vacuum adsorption of the suction cup seat 5 is turned off, and the lower chuck 21 can be taken away manually.

[0069] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A dual wafer bonding clamping device, comprising an upper chuck (1), the upper chuck (1) being used for adsorbing an upper wafer, characterized in that: The dual wafer bonding clamping mechanism (2) also includes a dual wafer bonding clamping mechanism (2), which includes a lower chuck (21), a chassis seat (3) and three clamping positioning mechanisms, wherein the lower chuck (21) is arranged at the bottom of the upper chuck (1), the chassis seat (3) is arranged at the bottom of the lower chuck (21), and a fixing member for fixing the lower chuck (21) is arranged on the chassis seat (3); The three clamping and positioning mechanisms are arranged in a circular array with the axis of the lower chuck (21) as the center, and the clamping and positioning mechanisms include a cylinder assembly, a Spacer-Clamp fixed seat assembly, a Spacer assembly and a Clamp assembly; The Spacer-Clamp fixed seat assembly is installed on the lower chuck (21), and the Spacer-Clamp fixed seat assembly includes a fixed seat (12), a first L-shaped rod (14), a second L-shaped rod (13), a first special-shaped push rod (16), a second special-shaped push rod (18) and a shaft sleeve (15). The fixed seat (12) is fixedly installed on the lower chuck (21), one end of the first special-shaped push rod (16) and the second special-shaped push rod (18) are both rotatably connected to the fixed seat (12), one end of the first L-shaped rod (14) is rotatably connected to the first special-shaped push rod (16), and one end of the second L-shaped rod (13) is rotatably connected to the second special-shaped push rod (18); The spacer assembly comprises a spacer shaft frame (24), a slider (22), a spacer rod (20) and a spacer plate (21), wherein the spacer shaft frame (24) is fixedly mounted on a fixing seat (12), the spacer plate (21) is fixedly mounted on the spacer rod (20), one side of the slider (22) is connected with a guide member for limiting the movement of the spacer rod (20) relative to the spacer shaft frame (24) along the length direction of the spacer rod (20), one side of the slider (22) is fixedly connected to the spacer rod (20), and the other side of the slider (22) is rotatably connected to the first L-shaped rod (14) through a transmission pin; The clamp assembly comprises a pressure rod base (32), a pressure rod upper seat (28), a connecting block (29), a cam (33), an adapter block (30), a pressure rod (26), a pressure wheel (25), a clamp connecting shaft (31) and a pressure rod shaft (34); the pressure rod base (32) is fixedly mounted on the fixed seat (12); the pressure rod upper seat (28) is transmission-connected to the pressure rod base (32) via the connecting block (29) and the cam (33); one end of the adapter block (30) is rotationally connected to the connecting block (29) via a transmission pin; one side of the adapter block (30) is fixedly connected to the second special-shaped push rod (18); the pressure rod (26) is fixedly mounted on the pressure rod upper seat (28); and the pressure wheel (25) is rotationally mounted on the end of the pressure rod (26) via the pressure rod shaft (34); The cylinder assembly is mounted on the lower chuck (21) and is located at the bottom of the Spacer-Clamp fixed seat assembly. The cylinder assembly can drive the first special-shaped push rod (16) and / or the second special-shaped push rod (18) to rotate with the connection between them and the fixed seat (12) as the center of the circle.

2. A dual wafer bonding clamping device according to claim 1, characterized in that: The supporting positioning member comprises two positioning pins (4) and two suction cup seats (5), the two positioning pins (4) and the two suction cup seats (5) are evenly arranged on the chassis seat (3), two positioning holes corresponding to the two positioning pins (4) are opened on the lower chuck (21), and vacuum air passages are distributed inside the suction cup seats (5).

3. The dual wafer bonding clamping device according to claim 1, characterized in that: The cylinder assembly comprises a first lifting cylinder (10) and a second lifting cylinder (11); the fixed ends of the first lifting cylinder (10) and the second lifting cylinder (11) are fixedly connected to the chassis seat (3) via a cylinder connecting seat (9); the movable ends of the first lifting cylinder (10) and the second lifting cylinder (11) are fixedly connected to a guide wheel frame (8); and the top end of the guide wheel frame (8) is rotatably mounted with a guide wheel (6) via a guide wheel shaft (7).

4. The dual wafer bonding clamping device according to claim 1, characterized in that: The guide member comprises two guide shafts (23), both ends of the two guide shafts (23) are fixedly connected to the Spacer shaft frame (24), and the outer side walls of the two guide shafts (23) are slidably connected to the slider (22).

5. The dual wafer bonding clamping device according to claim 1, characterized in that: The connecting block (29) and the cam (33) are respectively arranged at the two ends of the pressure rod base (32); the upper ends of the connecting block (29) and the cam (33) are rotatably connected to the pressure rod upper seat (28) through a transmission pin; and one side of the connecting block (29) and the lower end of the cam (33) are rotatably connected to the pressure rod base (32) through a transmission pin.

6. The dual wafer bonding clamping device according to claim 1, characterized in that: The center of the lower chuck (21) is processed with a profiling boss based on the shape of the wafer, and vacuum air passages for adsorbing the wafer are distributed inside the lower chuck (21) and the upper chuck (1).

7. The dual wafer bonding clamping device according to claim 1, characterized in that: A first spring sheet (19) is fixedly mounted on the spacing rod (20), a portion of the first spring sheet (19) is located above the spacing sheet (21), and a second spring sheet (27) is fixedly mounted on the upper portion of the pressure rod (26).

8. The dual wafer bonding clamping device according to claim 1, characterized in that: The ends of the first special-shaped push rod (16) and the second special-shaped push rod (18) away from the fixing seat (12) are both wedge-shaped.

9. The dual wafer bonding clamping device according to claim 1, characterized in that: Tension springs are installed between the fixed seat (12) and the first special-shaped push rod (16) and the second special-shaped push rod (18); two ends of the tension spring between the fixed seat (12) and the first special-shaped push rod (16) are respectively fixedly connected to the fixed seat (12) and the first special-shaped push rod (16); and two ends of the tension spring between the fixed seat (12) and the second special-shaped push rod (18) are respectively fixedly connected to the fixed seat (12) and the second special-shaped push rod (18).

10. An application method of a dual wafer bonding clamping device, characterized in that: The dual wafer bonding clamping device according to any one of claims 1 to 9 comprises the following steps: S1, firstly adsorb the upper wafer onto the upper chuck (1), then manually or by a robot, place the lower wafer at the center of the lower chuck (21), and start vacuum adsorption of the lower chuck (21); S2, controlling the moving end of the first lifting cylinder (10) to extend, driving the three groups of spacers evenly distributed on the lower chuck (21) to extend, after the alignment work is completed, driving the lower chuck (21) to rise to the upper wafer connection position through the driving member, and after the upper wafer falls to the spacer (21), the lower chuck (21) is driven by the driving member to descend to the safety position; S3, controlling the moving end of the second lifting cylinder (11) to extend, driving three groups of pressure rods (26) evenly distributed on the lower chuck (21) to extend, and the pressure wheel (25) to fix the upper and lower wafers; S4. After the above steps are completed, the vacuum adsorption of the suction cup seat (5) is turned off, and the lower chuck (21) can be taken away manually.

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