Power module and manufacturing method

Abstract

The invention relates to a power module and a manufacturing method. A power supply module (1) comprises:-a first housing element (10) having a first housing element (20) for accommodating a first chip (70; 70 '; 70 ''),-the first chip (70; 70 '; 70 '') at least partially accommodated in the first cutout and having electrical contacts (71, 72, 73; 71 ', 72', 73 '; 71 ', 72', 73 '), connecting elements (41, 43, 45) electrically connected to the electrical contacts of the first chip, at least one insulating spacer (90; 90 ', 90' ') provided at least partially in the first cutout so as to at least partially cover the chip and having at least one opening (91, 92, 91', 92 ', 91' ', 92' ') providing access through the gasket to at least one electrical contact of the chip and / or at least one track (97' ') ensuring a connection with one of the connection elements and / or the capacitor.

Description

Technical Field

[0001] The invention relates to a semiconductor power module and a method for manufacturing a semiconductor power module. Background Art

[0002] A power module typically includes at least two electronic chips electrically connected to connecting elements (eg, metal tabs), and may also include one or more capacitors electrically connected to the chips or the connecting elements.

[0003] Examples of power modules are disclosed in publications FR3115651, WO2018 / 024973 and US9041183.

[0004] In application WO 2018 / 024973, the chip is accommodated in a suitably shaped cutout in the support.

[0005] Existing power modules are developed specifically for a specific chip and take into account the size of the chip and the location of the electrical contacts. Therefore, some power modules include screen-printed electrical tracks that depend on the arrangement of these contacts.

[0006] A disadvantage of these modules is that it is not possible to use a chip different from the one for which the module was developed, without having to review the manufacturing method extensively, in particular the screen printing steps and / or the shape of the support housing the chip.

[0007] However, module manufacturers sometimes face supply difficulties which prompt changes in chip suppliers and redesign of manufacturing methods resulting in severe manufacturing delays and significantly increased costs when chip models are changed and new models are used that do not have the same size and / or contact arrangement. Summary of the invention

[0008] Therefore, there is a need to overcome this shortcoming.

[0009] The present invention aims to meet this demand. According to one aspect of the present invention, the present invention meets this demand by proposing a power module, the power module comprising:

[0010] a first housing element having a first cutout for accommodating a first chip,

[0011] a first chip, which is at least partially accommodated in the first cutout and has electrical contacts,

[0012] - connecting elements electrically connected to electrical contacts of said first chip,

[0013] - at least one insulating spacer, said at least one insulating spacer being at least partially arranged in said first cutout so as to at least partially cover said chip and having at least one opening providing access through said spacer to at least one electrical contact of said chip and / or at least one track ensuring connection to one of said connection elements and / or to a potential capacitor.

[0014] By means of the invention, multiple chips with different sizes and / or contact arrangements can be used while limiting the changes applied to the module when switching from one chip type to another.

[0015] Specifically, different gaskets may be used according to the chip to make the chip compatible with most of the components constituting the module, and thus these components may remain unchanged.

[0016] This greatly simplifies the process of replacing one chip with another, as there is no longer a need to review manufacturing methods as extensively as with prior art.

[0017] Therefore, in a preferred exemplary implementation of the present invention, the spacer is the only element that needs to be modified to enable the use of a different chip on an existing module.

[0018] The modules may include:

[0019] a second housing element having a second cutout for accommodating a second chip,

[0020] a third housing element, which is arranged between the first housing element and the second housing element and which in particular has at least a third cutout for accommodating a capacitor,

[0021] a second chip, which is at least partially accommodated in the second cutout and has electrical contacts,

[0022] - connecting elements electrically connected to electrical contacts of the second chip,

[0023] - at least one capacitor, which is at least partially accommodated in said third cutout and is electrically connected to at least one of said chips and / or to said connection element.

[0024] Gasket

[0025] The spacer may be manufactured without any conducting elements (such as electrical tracks) or, as a variant, may have at least one such conducting element.

[0026] The spacer may be made of any suitable material, in particular ceramic or other material, the shape of the spacer being obtained by sintering, 3D printing, machining or in other ways.

[0027] The spacer is already present when it is introduced into the corresponding cutout of the module.

[0028] The shape of the pad depends on the chip model it is associated with.

[0029] In an example, the pad has at least one lateral opening at an edge, into which a corresponding connection element electrically connected to a contact of the chip engages. The connection element is, for example, a metal electrical connection tab with a flat cross section.

[0030] In an example, the gasket has two corresponding lateral openings at two opposite longitudinal edges, into which two corresponding connecting elements electrically connected to two corresponding contacts of the chip are engaged. These connecting elements are, for example, metal tabs extending in a direction away from the power module. For example, these metal tabs are contacts corresponding to power terminals (such as source or drain) of the transistor.

[0031] The one or more connecting elements may be soldered to the corresponding contact(s) of the chip by any means, for example by means of a solder paste provided at the interface between the components to be soldered together.

[0032] The pad may have an additional opening at an edge substantially perpendicular to the longitudinal edge, into which an additional connection element electrically connected to a corresponding contact of the chip engages. For example, the contact is a contact corresponding to a control terminal, such as a gate contact of a power transistor.

[0033] The additional connecting element can be soldered directly to the corresponding contact of the chip or, as a variant, the pad carries an electrical track soldered to the corresponding contact of the chip and the additional connecting element is soldered to this track.

[0034] The first cutout that accommodates the chip may have a rectangular or other shaped outline; however, a rectangular shape is preferred.

[0035] The chip may not occupy the entire cutout in top view.

[0036] The cutout may allow the chip to be positioned therein to be within the assembly gap when the chip occupies the entire cutout in top view. In this case, the spacer may just overlap the chip without being interposed between the chip and one or more edges of the cutout. The spacer may then have only the function of thickness compensation, assisting in the positioning of the connection element and potentially also serving to establish an electrical connection between the contact of the chip and a connection element that is not directly overlapping it.

[0037] In contrast, when the chip does not occupy the entire cutout in top view, the spacer advantageously helps to position the chip in the cutout by being interposed between the chip and at least one edge of the cutout.

[0038] Thus, in an embodiment example, the gasket is longer than the chip at the contacts of the chip and has at least one portion that engages in the cutout between the chip and the housing element defining the cutout for accommodating the chip. The gasket is inserted between the chip and the housing element defining the cutout for accommodating the chip, for example, on at least three sides, in particular on four sides.

[0039] The pad may have a surface that is substantially coplanar with a surface of a housing member that defines a cutout that receives a chip in contact with the pad.

[0040] Other features

[0041] The third housing element may have a cutout for accommodating the connecting element, said cutout being positioned such that the connecting element can overlap the electrical contacts of the second chip.

[0042] The housing element may be penetrated by holes which allow the passage of fixing means, in particular screws, for fixing the housing element in the assembled state.

[0043] The module may comprise at least one heat transfer element in contact with the outer surface of the chip, even better two heat transfer elements, each heat transfer element being in contact with the outer surface of a respective chip, the heat transfer element or elements preferably each comprising a metal plate, preferably a copper plate.

[0044] Module array

[0045] Another subject of the invention is a power module array, comprising at least a first module and a second module according to the invention, at least one of the chips of the first module being different from the corresponding chip of the other module, the two modules comprising different gaskets and at least the same first and second housing elements. "Different chips" is understood to mean that the chip models differ in at least one of their dimensions, in particular length and / or width, and / or in the arrangement of the contacts.

[0046] The connecting elements may be identical, and the third housing elements may also be identical.

[0047] Manufacturing method

[0048] Another subject of the invention is a method for producing a power module, in particular a module according to the invention as described above, the module comprising:

[0049] - a lower housing element having a first cutout for accommodating a first chip,

[0050] a first chip, which is at least partially accommodated in the first cutout and has electrical contacts,

[0051] The method comprises the following steps:

[0052] - covering the chip present in said first cutout with an insulating spacer defining at least one opening superimposed with at least one electrical contact of the chip or having electrical tracks to be connected to an electrical contact of the chip, in particular tracks leading to openings in the spacer for accommodating connection elements.

[0053] In this method, the gasket can help position one or more connecting elements relative to the chip and position the chip in the cut-out, particularly when the cut-out is larger than the chip in a top view and the gasket is inserted between at least one edge of the cut-out and the chip. The gasket can be selected from a plurality of pre-existing gaskets depending on the type of chip used, all of which are suitable for positioning in the cut-out of the lower housing element.

[0054] The gasket is for example selected from a group of gaskets, the group of gaskets comprising:

[0055] a gasket, preferably of substantially constant thickness, having two opposite openings on its long sides and one opening on its short sides, the dimensions of which substantially correspond to the dimensions of the cutout of the first housing element;

[0056] - a gasket having two opposite openings on its long sides and one opening on its short sides, the dimensions of the gasket substantially corresponding to the dimensions of the cut-out of the first housing element, the gasket having: on its surface facing the chip, opposite lateral returns, each return being intended to be inserted between a long side of the chip and a corresponding edge of the first cut-out; and at least one end tab being intended to be inserted between a short side of the chip and a corresponding edge of the first cut-out; and at least one portion on opposite sides of the end tab being intended to engage in the cut-out between the chip and the lower housing element;

[0057] - A gasket having two opposite openings on its long sides and one opening on its short sides, the dimensions of the gasket substantially corresponding to the dimensions of the cut-out of the first housing element, the gasket having at least two parts, each part being used to be inserted between the short sides of the gasket and the corresponding edge of the cut-out, the gasket having opposite lateral returns on its surface facing the chip, each return being used to be inserted between the long sides of the chip and the corresponding edge of the first cut-out, the gasket also having at least one conductive track arranged to at least partially overlap with the contacts and connecting elements of the chip.

[0058] The above-mentioned opening in each gasket may be in the form of a notch.

[0059] In an exemplary implementation of the present invention, the method includes:

[0060] - introducing an upper housing element having a second cutout for accommodating a second chip,

[0061] - introducing an intermediate housing element, which is arranged between the upper housing element and the lower housing element,

[0062] - introducing a second chip which is at least partially accommodated in the second cutout and has electrical contacts,

[0063] - introducing connecting elements electrically connected to the electrical contacts of the chip,

[0064] - Introducing at least one capacitor which is electrically connected to at least one of the chips and / or to the connecting element.

[0065] The method advantageously comprises the use of an assembly guide having at least a primary cutout adapted to accommodate at least the lower housing element. The assembly guide preferably has a secondary cutout adapted to accommodate the connection element.

[0066] The main cut-out may have a bottom comprising at least one indentation for accommodating a nut or a screw head, and the method may comprise positioning at least one nut or a screw head in the main cut-out, in particular before introducing the lower housing element into the main cut-out.

[0067] The method may comprise positioning a heat transfer element, in particular a metal plate, preferably a copper plate, at the bottom of the main cutout.

[0068] In an exemplary implementation, the method comprises the following consecutive steps:

[0069] - in the main cutout of the assembly guide, optionally introducing a nut into a corresponding cutout potentially provided at the bottom of said main cutout,

[0070] - introducing a heat transfer element, preferably in the form of a metal plate, into the main cutout, covering the nut where appropriate,

[0071] - introducing the lower housing element onto the metal heat transfer element,

[0072] - introducing the first chip into the cutout defined by the first housing element,

[0073] - introducing the spacer onto the first chip,

[0074] - introducing a connecting element covering at least one contact of the chip and / or a track electrically connected to a contact of the chip,

[0075] - introduction of intermediate housing elements,

[0076] - introducing a capacitor onto one of the connecting elements, in particular into a corresponding cutout of the intermediate housing element, the capacitor having a first electrical contact facing the connecting element placed thereto,

[0077] - introducing at least one further connecting element which extends at least partially towards the second electrical contact of the capacitor,

[0078] - introducing the upper housing element onto the assembly present in the main cutout of the assembly guide,

[0079] - introducing the second chip into the cutout of the upper housing element,

[0080] - introducing a second heat transfer element, in particular in the form of a metal plate, preferably a copper plate,

[0081] - assembling the housing elements superimposed in this way, where appropriate by means of screws engaging in nuts, and

[0082] The electrical contact is established by soldering, in particular by subjecting the components to a temperature that melts the solder paste between the surfaces to be soldered.

[0083] The method may include replacing a gasket with a gasket of a different shape suitable for a different chip model.

[0084] Another subject of the invention is the assembly guide itself, as well as the assembly guide and the assembly of components of a module intended for assembly with the aid of this guide. BRIEF DESCRIPTION OF THE DRAWINGS

[0085] The present invention will be better understood after reading the following detailed description of non-limiting example implementations of the invention and examining the accompanying drawings, in which:

[0086] Figure 1 is a perspective view of an example of a power module according to the present invention,

[0087] Figure 2 yes Figure 1 Exploded view of the modules and assembly guides in

[0088] Figure 3 A separate assembly guide is shown,

[0089] Figure 4 The introduction of the nut into the bottom of the main cutout of the assembly guide is shown,

[0090] Figure 5 shows the introduction of the first copper plate into the main cutout of the assembly guide,

[0091] Figure 6 shows the introduction of the first housing element into the main cutout of the assembly guide,

[0092] Figure 7 shows the introduction of a first chip into a cutout defined by a first housing element,

[0093] Figure 8 shows the introduction of a gasket onto a first chip,

[0094] Fig. 9 shows the introduction of the first connecting element,

[0095] Fig.10 shows the introduction of the intermediate housing element,

[0096] Fig.11 shows the introduction of a capacitor,

[0097] Fig.12 shows the introduction of other connecting elements,

[0098] Fig.13 shows the introduction of the upper housing element,

[0099] Fig.14 shows the introduction of the second chip into the cutout of the upper housing element,

[0100] Fig.15 shows the introduction of a second copper plate onto the second chip,

[0101] Fig.16 shows the introduction of the fixing screw,

[0102] Fig.17 Shown are separate gaskets,

[0103] Fig.18 is similar to using different chips Figure 7 View,

[0104] Fig.19 Shows a separate application Fig.18 Example of a gasket for a chip in

[0105] Fig. 20 yes Fig.19 A perspective view of the middle gasket from another angle.

[0106] Fig.21 is similar to using different chips Figure 7 View,

[0107] Fig. 22 Shows a separate application Fig.21 Example of a gasket for a chip in

[0108] Fig.23 yes Fig. 22 A perspective view of the center gasket from another angle, and

[0109] Fig.24 The establishment of electrical connection between the connecting element and the chip is shown. DETAILED DESCRIPTION

[0110] Figure 1 The power module 1 shown comprises three stacked housing elements, namely a first lower housing element 10 , a second intermediate housing element 20 and a third upper housing element 30 .

[0111] The module 1 also comprises connecting elements, namely, in the example shown, metal tabs 41 and 42 extending opposite a first side of the module 1 , a metal tab 43 extending on the opposite side thereof, and opposite metal tabs 44 and 45 extending from the other two sides.

[0112] As shown, the module 1 may include heat transfer plates on its main faces, wherein one heat transfer plate 50 is disposed on the Figure 1 Visible in.

[0113] As shown, the various housing elements and the heat transfer plate may be fixed by screws 60 .

[0114] Module 1 before possible encapsulation such as Figure 1 shown.

[0115] At least one housing element, for example the lower element 10, may comprise an opening 11 for injecting a filling insulating resin (called "underfill").

[0116] If reference Figure 2 , it can be seen that the module 1 includes a first electronic chip 70 and a second electronic chip 80 , and at least one gasket 90 .

[0117] exist Figure 2 Also visible in the figure are the lower heat transfer plate 51 and the nut 61 with which the screw 60 engages.

[0118] The capacitor 100 may be disposed between the connection elements 41 and 42 .

[0119] Chips 70 and 80 are, for example, power transistors, such as GaN-based power transistors; for example, the source of one power transistor is connected to the drain of another power transistor through a center tap, connecting elements 41 and 42 are, for example, connected to the drain of one power transistor and the source of the other power transistor, and connecting element 43 is connected to the center tap. Connecting elements 44 and 45 are, for example, connected to the gates of these transistors.

[0120] The capacitor 100 is, for example, a decoupling capacitor, and its value is, for example, several nF.

[0121] Figure 2 Also shown is an assembly guide 200 used during the manufacture of the module 1 .

[0122] The guide element 200 is made of plastic, for example, and can be produced by injection molding with relatively rough manufacturing tolerances.

[0123] The guide 200 may comprise a horizontal base 201 , topped by a vertical wall 207 defining a main cutout 202 and four secondary cutouts 203 to 206 arranged around the main cutout 202 in the same way as the connection elements on the module.

[0124] Figure 3 The assembly guide is shown separately in FIG. 2. It can be seen that the bottom 201 of the main cutout includes an indentation 208 for receiving the nut 61.

[0125] refer to Figures 4 to 17 , a further description will now be given of the various elements that make up the module and an example of a method for manufacturing the module.

[0126] like Figure 4 As shown, when screws are used to secure the assembled housing elements, the manufacturing method may begin by placing the nuts 61 in the corresponding indentations 208 .

[0127] Then, if Figure 5 As shown, a lower plate 51 is placed in the bottom 201 of the cutout; this lower plate comprises holes 52 for the passage of screws 60.

[0128] In the example considered, the plate 51 is made of copper, but it could be replaced by any suitable heat sink, for example made of another metal or of a thermally conductive ceramic.

[0129] The different elements making up the module may be placed by any suitable tool, in particular a conventional "pick and place" tool.

[0130] The lower housing element 10 may then be placed in the cutout 201 .

[0131] The element 10 comprises a first central through cutout 12 for accommodating the first chip 70, and incomplete through cutouts 13, 14 and 15 for accommodating the connection elements 41, 45 and 43, respectively. These cutouts 13, 14 and 15 lead respectively to the cutouts 203, 204 and 205 of the guide 200. A hole 16 is provided for the passage of the screw 60.

[0132] Figure 7The guide 200 is shown after the chip 70 has been placed in the cutout 12 .

[0133] In this example, the chip 70 has the general shape of a parallelepiped, the outline of which corresponds substantially to the outline of the cutout 12 in top view.

[0134] Chip 70 may have electrical contacts 71 , 72 , and 73 on its inner surface.

[0135] Gasket 90 in Fig.17 Shown separately in.

[0136] The length and width of the spacer are suitable for being positioned in the cutout 12 with a small gap.

[0137] The gasket may be made of any electrically insulating material compatible with the conditions of use, such as ceramic or polymeric materials.

[0138] The spacer 90 has two lateral openings 91 and 92 and, at the ends, an opening 93 which is in the form of a notch.

[0139] like Figure 8 As shown, once the pad 90 is placed on the chip 70 , the contacts 71 , 72 , and 73 are still accessible through the openings 91 , 92 , and 93 , respectively.

[0140] Then, the connecting elements 41 and 45 can be placed in the cutouts 203 and 204, respectively, so as to partially cover the contacts 71 and 73, as shown in FIG. Fig. 9 For the subsequent soldering operation, solder paste can be deposited at the interface between the contacts of the chip and the connecting elements.

[0141] It may be useful to form reliefs 313 and 315 in the cutouts 13 and 15, which are intended to cooperate with corresponding reliefs of the connecting element housed in these cutouts, so as to improve the positioning and retention of the connecting element during the assembly operation. For example, the reliefs 313 or 315 are in the form of bosses facing each other, and the connecting element then has two notches 341 or 343, respectively at Fig.10 and Fig.12 As can be seen in the figure, these two notches are used to fit on those bosses.

[0142] As can be seen in the figures, for each of the five connection elements of the module, there may be mating reliefs in the form of bosses and recesses between the housing element and the connection element and will not be described in detail below.

[0143] The intermediate housing element 20 can then be introduced into the cutout 201 in order to cover the already existing components.

[0144] The element 20 has a hole 23 for the passage of the screw 60 and openings 24, 25 and 26 for receiving the connecting elements 44, 42 and 43 respectively.

[0145] Openings 26 provide access to contacts 72 of chip 70 .

[0146] exist Fig.11 In the step shown, the capacitor 100 is placed on the connecting element 41 in the opening 25 .

[0147] The connecting element 42 may then be introduced so as to cover the capacitor 100, such as Fig.12 As shown, capacitor 100 serves as a spacer between connecting elements 41 and 42 .

[0148] The connecting element 43 is introduced on the opposite side.

[0149] When necessary, solder paste is provided between the components to be soldered, in particular between the capacitor 100 and the connecting elements 41 and 42 and between the connecting element 43 and the corresponding contacts 72 of the chip 70 .

[0150] The connecting elements 44 are introduced into corresponding cutouts 27 of the housing element 20 .

[0151] Then, if Fig.13 As shown, the housing element 30 is introduced onto the previously mounted connecting element.

[0152] As shown, the housing element 30 has a central opening 33, for example rectangular. The opening 33 provides access to the connecting elements 42, 43 and 44.

[0153] The housing element 30 comprises a hole 32 for the passage of a screw 60 .

[0154] Then, if Fig.14 As shown, the second chip 80 may be disposed in the cutout 33 .

[0155] The chip 80 has contacts on its inwardly facing surface, which contacts are positioned facing the connection elements 42 , 43 and 44 , respectively.

[0156] Solder paste may be provided at the interface between the contacts of the chip 80 and the connection elements to enable soldering in a subsequent heating step.

[0157] Once the chip 80 is in place, a second heat transfer plate 50, for example made of copper, can be placed against the chip 80, such as Fig.15 As shown, the plate 50 is, for example, identical to the first plate 51 and includes holes for the passage of the screws 60, just like the first plate 51. Then, as shown in FIG. Fig.16As shown, these screws can be mounted and engaged on nuts 61 located at the bottom of the main cutout 202 of the guide 200.

[0158] Once the screws 60 are tightened, the assembly can be removed from the guide 200 and heated in an oven at a temperature suitable for melting the solder paste and for producing solder joints between the different components of the module.

[0159] After soldering, a filling resin may be injected through the opening 11 and the assembly may be encapsulated in the encapsulating resin if necessary, leaving accessible the connecting elements and, where appropriate, the copper plates when thermal coupling to a heat sink is intended.

[0160] The use of the gasket 90 is advantageous because it allows the first chip 70 to be replaced with a second chip 70' of a different design without modifying the lower housing element 10, such as Fig.18 shown.

[0161] In the example shown, the dimensions of chip 70 ′ are smaller than the dimensions of chip 70 .

[0162] Gasket 90 can be replaced by Fig.19 and Fig. 20 1 , the gasket 90 ′ is shown separately in FIG. 1 , and has openings 91 ′, 92 ′, and 93 ′ like the gasket 90 , and has a protrusion on one surface for engaging into a space provided between the chip 70 ′ and the edge of the cutout 12 .

[0163] In the example considered, the spacer 90 ′ therefore comprises two end tabs 94 ′ situated on either side of the opening 93 ′, intended to engage between the chip 70 ′ and the short side 12 a of the cutout 12 .

[0164] The spacer 90 ′ also comprises two lateral tabs 95 ′, each of which is configured to be inserted between a long side of the chip 70 ′ and a long side 12 b of the cutout.

[0165] The gasket 90 ′ includes a stub 96 ′ on the opposite side of the tab 94 ′, which is arranged to engage between the chip 70 ′ and the other short side 12 a of the cutout 12 .

[0166] Thus, the pad 90 ′ is precisely positioned in the cutout 12 due to its outer dimensions, while the chip 70 ′ is precisely held within the cutout 12 and in a position suitable for establishing electrical connection with the associated connection elements.

[0167] When the chip model used does not have the same electrical contacts as the other chips used, the pad may comprise at least one conductive track for electrically connecting at least one corresponding contact of the chip to the associated connection element.

[0168] For example, Figure 21 to Figure 24 This situation is shown.

[0169] Fig.21 A chip variant 70" is shown which is not only smaller than the chip 70, like the chip 70', but also has differently arranged contacts 71", 72" and 73", in particular, the contacts 73" are laterally offset relative to the connecting element 45. Fig.21 In FIG. 1 , the connecting elements are shown to illustrate this offset, although they are introduced later.

[0170] Like the other gaskets 90 and 90 ′, the gasket 90 ″ has a cutout 91 ″, a cutout 92 ″ and a cutout 93 ″ for receiving the ends of the connecting element 41 , the connecting element 43 and the connecting element 45 , respectively.

[0171] The spacer 90 ″ includes relief features, such as lateral tabs 95 ″ and an end portion 96 ″, for positioning the chip 70 ″ in the cutout 12 .

[0172] Some of the tabs 95" may extend to adjacent end portions.

[0173] The spacer 90 ″ comprises a conductive track 97 ″, for example in the form of a bend as shown, which is positioned so as to overlap the contact 73 ″ via an end 97 a ″. The track 97 ″ extends at another end 97 b ″ into the bottom of the cutout 93 ″ in order to be connected to the connection element 45 .

[0174] For example, during the manufacture of the gasket 90 ″, the track 97 ″ is integrated into said gasket. This track can be a metal part inserted into the ceramic or a metal part produced by injection molding or screen printing.

[0175] The housing elements 10, 20 and 30, as well as the gaskets 90, 90' or 90" can be manufactured in a manner already present during the assembly process, made of any electrically insulating material compatible with the desired use, for example of ceramic, in particular by 3D printing or sintering methods. The materials are chosen so as to thermally withstand the soldering operation of the contacts, the heat released during normal use of the module, and the operating environment; thus, the assembly can withstand temperatures of, for example, at least 150°C.

[0176] To produce the electrical connections, solder paste may be used, the invention not being limited to a particular technique for establishing the electrical connections.

[0177] The invention is not limited to the examples that have just been described.

[0178] For example, the module may comprise more than one gasket, in particular a second gasket may be used to be able to mount a chip of different size and / or contact implementation as the second chip; where appropriate, the intermediate housing element is also modified to facilitate accommodating different chip models.

[0179] It is also possible to assemble more than two chips in a module and to use one or more spacers that can be used for different chip models.

[0180] The cutout of the housing element for accommodating the chip may have a shape other than a rectangle, such as a square or other shapes. It is also possible to have multiple cutouts for accommodating individual chips in the same housing element, and to have one or more gaskets associated with these chips.

[0181] Some connection elements, such as element 44 and element 45 connected to the gates of the transistors, may be brought out from the same side of the housing to facilitate control of the module.

Claims

1. A power module (1), comprising: - a first housing element (10), the first housing element having a first chip (70; 70’； 70”) of the first incision (12), - a first chip (70; 70'; 70”), the first chip is at least partially accommodated in the first cutout and has electrical contacts (71, 72, 73; 71', 72', 73'; 71", 72", 73"), - connection elements (41, 43, 45) electrically connected to electrical contacts of said first chip, - at least one insulating spacer (90; 90'; 90"), the at least one insulating spacer being at least partially arranged in the first cutout so as to at least partially cover the chip and having at least one opening (91, 92; 91’，92’； 91", 92") and / or at least one track (97"), the opening providing access to at least one electrical contact of the chip through the pad, the track ensuring connection to one of the connection elements and / or a potential capacitor.

2. The module according to claim 1, comprising: a second housing element (30) having a second cutout (33) for accommodating a second chip (80), a third housing element (20), which is arranged between the first housing element and the second housing element and which in particular has at least a third cutout (25) for accommodating a capacitor (100), a second chip (80) at least partially received in the second cutout and having electrical contacts, - connection elements (42, 44) electrically connected to electrical contacts of the second chip, - at least one capacitor (100) which is at least partially accommodated in the third cutout (25) and is electrically connected to at least one of the chips and / or to the connection elements (41, 42).

3. The module according to claim 1 or 2, wherein: The pad (90; 90'; 90") has at least one lateral opening at an edge, into which a corresponding connection element electrically connected to a contact of the chip engages.

4. The module according to claim 3, wherein: The spacer has two corresponding lateral openings at two opposite longitudinal edges, into which two corresponding connecting elements electrically connected to two corresponding contacts of the chip engage.

5. The module according to claim 3 or 4, wherein: The connecting elements are soldered to corresponding contacts of the chip.

6. The module according to claim 5, wherein: The pad has, at an edge substantially perpendicular to the longitudinal edge, an additional opening (93; 93'; 93") in which an additional connection element electrically connected to a corresponding contact of the chip engages.

7. The module according to claim 6, wherein: The additional connecting elements are soldered to corresponding contacts of the chip.

8. The module according to claim 6, wherein: The pads carry electrical tracks (73") soldered to corresponding contacts of the chip, and the additional connection elements are soldered to the electrical tracks.

9. The module according to any one of claims 1 to 8, wherein: The pad is longer than the chip at the chip contacts and has at least one portion (96', 96") that engages in a cutout between the chip and a housing element defining a cutout that receives the chip in contact with the pad.

10. The module according to claim 9, wherein: The gasket is inserted on at least three sides, in particular on four sides, between the chip and a housing element defining a cutout for accommodating the chip in contact with the gasket.

11. The module according to any one of claims 1 to 10, wherein: The gasket has a surface that is substantially coplanar with a surface of the housing member, the housing member defining a cutout that receives the chip in contact with the gasket.

12. A module according to any one of claims 1 to 11, wherein: The intermediate housing element (20) has a cutout for accommodating a connection element, the cutout being positioned so as to enable the connection element to overlap with the electrical contacts of the second chip.

13. A module according to any one of claims 1 to 12, wherein: The housing element is penetrated by a hole which allows the passage of a fixing member, in particular a screw (60), for fixing the housing element in the assembled state.

14. The module according to any one of claims 1 to 13, comprising at least one heat transfer element (50; 51) in contact with the outer surface of the chip, and even better two heat transfer elements, each heat transfer element being in contact with the outer surface of a corresponding chip, the heat transfer elements preferably each comprising a metal plate, preferably a copper plate.

15. A power module array, comprising at least a first module and a second module (1) according to any one of claims 1 to 14, at least one of the chips of the first module being different from the corresponding chip of the second module, the two modules comprising different gaskets and the same housing element (10, 20).

16. The array of claim 15, wherein: The connecting elements (41, 42, 43, 44, 45) are identical.

17. A method for manufacturing a power module, in particular a module (1) according to any one of claims 1 to 14, the module comprising: - a lower housing element (10) having a first cutout for accommodating a first chip, - a first chip (70; 70’； 70″), the first chip is at least partially accommodated in the first cutout and has electrical contacts, The method comprises the following steps: - covering the chip present in the first cutout with an insulating spacer (90; 90'; 90"), the spacer defining at least one opening (91, 92; 91', 92'; 91", 92") superimposed with at least one electrical contact of the chip, or having an electrical track (97") to be connected to an electrical contact of the chip, in particular a track leading to an opening in the spacer for accommodating a connection element.

18. The method according to claim 17, wherein: The gasket is selected from a plurality of pre-existing gaskets (90; 90'; 90") according to the type of chip used, all of which are suitable for being positioned in the cutout of the lower housing element, the gasket being preferably selected from a group of gaskets comprising: a gasket (90), preferably of substantially constant thickness, having two opposite openings on its long sides and one opening on its short sides, the dimensions of which substantially correspond to the dimensions of the cutout of the first housing element; - a gasket (90') having two opposite openings on its long sides and one opening on its short sides, the dimensions of which substantially correspond to the dimensions of the cut-out of the first housing element, the gasket having: on its surface facing the chip, opposite lateral returns, each return being intended to be inserted between a long side of the chip and a corresponding edge of the first cut-out; and at least one end tab for insertion between a short side of the chip and a corresponding edge of the first cut-out; and at least one portion on opposite sides of the end tab for engaging in the cut-out between the chip and the lower housing element; - A gasket (90") having two opposite openings on its long sides and one opening on its short sides, the dimensions of the gasket substantially corresponding to the dimensions of the cut-out of the first housing element, the gasket having at least two parts, each part being used to be inserted between the short side of the gasket and the corresponding edge of the cut-out, the gasket having opposite lateral return pieces on its surface facing the chip, each return piece being used to be inserted between the long side of the chip and the corresponding edge of the first cut-out, the gasket also having at least one conductive track (97"), which is arranged to at least partially overlap with the contacts and connecting elements of the chip.

19. The method according to claim 17 or 18, wherein: The method comprises: - introducing an upper housing element (30) having a second cutout (33) for accommodating a second chip, - introducing an intermediate housing element (20) which is arranged between the upper housing element and the lower housing element and has at least a third cutout for accommodating a capacitor, - introducing a second chip, which is at least partially accommodated in the second cutout and has electrical contacts, - introducing connecting elements electrically connected to the electrical contacts of the chip, - introducing at least one capacitor, which is at least partially accommodated in said third cutout and is electrically connected to at least one of said chips and / or said connecting element.

20. A method according to any one of claims 17 to 19, comprising: An assembly guide (200) is used, which has at least a main cutout (201) adapted to accommodate at least the lower housing element.

21. The method according to claim 19 or 20, wherein: The assembly guide has a secondary cutout adapted to accommodate the connecting element.

22. The method according to claim 20 or 21, wherein: The main cut-out has a bottom comprising at least one indentation (208) for accommodating a nut or a screw head, and the method comprises positioning at least one nut or a screw head in the main cut-out, in particular before introducing the first housing element into the main cut-out.

23. A method according to any one of claims 20 to 22, comprising: At the bottom of the main cutout a heat transfer element is positioned, in particular a metal plate, preferably a copper plate.

24. The method according to any one of claims 17 to 23, comprising the following consecutive steps: - in said main cutout of said assembly guide, optionally introducing a nut into a corresponding cutout potentially provided at the bottom of said main cutout, - introducing a heat transfer element, preferably in the form of a metal plate, into the main cutout, where appropriate covering the nut, - introducing the lower housing element (10) onto the metal heat transfer element, - introducing said first chip (70; 70'; 70") into a cutout (12) defined by said first housing element, - introducing said spacer (90; 90'; 90") onto said first chip, - introducing a connection element covering at least one contact of the chip and / or a track electrically connected to a contact of the chip, - introducing said intermediate housing element (20), - introducing the capacitor (100) onto one of the connecting elements, in particular into a corresponding cutout of the intermediate housing element, the capacitor having a first electrical contact facing the connecting element placed thereon, - introducing at least one further connecting element, which extends at least partially towards the second electrical contact of the capacitor (100), - introducing the upper housing element (30) onto the assembly present in the main cutout of the assembly guide, - introducing the second core sheet (80) into the cutout of the upper housing element, - introducing a second heat transfer element (50), in particular in the form of a metal plate, preferably a copper plate, - assembling the housing elements stacked in this way, where appropriate by means of screws (60) engaging in the nuts, and -Electrical contact is established by welding.

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