Power module hot backup circuit based on VPX case architecture

Abstract

The invention relates to the technical field of power supply or power distribution circuit systems, and provides a power module hot backup circuit based on a VPX case architecture, which comprises an LTC chip, the LTC chip is connected to a G pole of an MOS tube, an S pole and a D pole of the MOS tube are connected in series to a power output circuit, and the LTC chip is further connected to the power output circuit through two paths of pins for measuring voltage. Each of the two pins is connected in series with a resistor and is connected in parallel with a capacitor. The method is particularly suitable for multi-module power supply redundancy backup, and can seamlessly use modules with normal functions after a single module fails, so that the reliability and the stability of power supply voltage are improved, and the requirement that system equipment continuously works for a long time is met; load balanced distribution between the dual-power-supply modules can be conveniently realized, load distribution approximately equal to 1: 1 is achieved, the reliability of the dual-power-supply modules during working is improved, and the requirement of small modules for high power is met.

Description

Technical Field

[0001] The invention relates to a power module hot backup circuit based on a VPX chassis architecture, and belongs to the technical field of power supply or power distribution circuit systems. Background Art

[0002] Power modules are used in military, communication, industry, medical, automobile and other fields to provide stable and reliable voltage input for different devices. The present invention belongs to the field of VPX architecture chassis technology, especially to a board-level, lightweight power chassis, which is applied in the field of military communications and has the characteristics of providing different stable voltage outputs to ensure the normal operation of the entire communication system. The space inside the power supply cabin is small and complex, and the design research of lightweight, integrated and small-capacity power modules to achieve high power consumption is a research and development trend.

[0003] Existing technical solutions mostly use a single power module or dual power modules to power the chassis, which can provide multiple backups of the chassis power modules, but they need to be powered off and plugged in during use. A single module works continuously for a long time under overload, and the failure of a single module affects the operation of the entire machine. The existing integrated power module design method can solve the problem of power module plugging and unplugging in the chassis with power on, and dual power modules evenly distributing the load, but when the dual power modules work together, when one of the modules fails, the entire machine will be powered off, affecting the normal operation of the chassis, and cannot meet the uninterrupted operation of the chassis system. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a power module hot backup circuit based on the VPX chassis architecture. The power module hot backup circuit based on the VPX chassis architecture is particularly suitable for multi-module power redundant backup, which can achieve seamless use of modules with normal functions after a single module fails, thereby improving the reliability and stability of the power supply voltage and meeting the requirements of uninterrupted long-term operation of system equipment.

[0005] The present invention is achieved through the following technical solutions.

[0006] The present invention provides a power module hot backup circuit based on a VPX chassis architecture, comprising an LTC chip, wherein the LTC chip is connected to the G pole of a MOS tube, the S pole and the D pole of the MOS tube are connected in series to a power output circuit, and the LTC chip is also connected to the power output circuit through two pins for measuring voltage, and the two pins are connected in series with a resistor and in parallel with a capacitor.

[0007] The LTC chip is also connected to a circuit of a power supply output through two pins for measuring current, and a resistor is connected in series between the contacts of the two pins connected to the circuit of the power supply output.

[0008] The resistor is connected in parallel with a capacitor.

[0009] The LTC chip is also connected to the power output circuit through a pin, the pin connection is located on the S pole side of the MOS tube, and the contact point of the two pins used to measure the voltage is located on the D pole side of the MOS tube.

[0010] The LTC chip is powered by a node located at the D-pole side of the MOS tube in the power output circuit.

[0011] The LTC chip is also connected to a backup power supply via a pin, and the pin is connected in series with a gain resistor, and the load is adjusted by adjusting the resistance value of the gain resistor.

[0012] The connection where the LTC chip is connected to the MOS tube and one of the two pin connections are both connected with a filter capacitor.

[0013] The pin connection is also connected with a voltage dividing resistor.

[0014] The power supply connection is connected with a filter capacitor.

[0015] The beneficial effects of the present invention are: it is particularly suitable for redundant backup of multi-module power supplies, and can achieve seamless use of modules with normal functions after a single module fails, thereby improving the reliability and stability of the power supply voltage and meeting the requirements of uninterrupted long-term operation of system equipment; it is easy to achieve load balancing distribution between dual power modules to achieve a load distribution approximately equal to 1:1, improve the reliability of the dual power modules when working, and meet the requirements of small modules and high power. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a connection diagram of at least one embodiment of the present invention. DETAILED DESCRIPTION

[0017] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0018] Example 1

[0019] like Figure 1 A power module hot backup circuit based on a VPX chassis architecture is shown, including an LTC chip, wherein the LTC chip is connected to the G pole of a MOS tube, and the S pole and D pole of the MOS tube are connected in series to the power output circuit. The LTC chip is also connected to the power output circuit through two pins for measuring voltage, and the two pins are connected in series with a resistor and in parallel with a capacitor.

[0020] Example 2

[0021] Consistent with Example 1, and further optimized in details, the LTC chip is also connected to the circuit of the power output through two pins for measuring current, and a resistor is connected in series between the contacts of the two pins connected to the circuit of the power output.

[0022] Furthermore, the resistor is connected in parallel with the capacitor.

[0023] Example 3

[0024] Consistent with Example 1, and further optimized in details, the LTC chip is also connected to the power output circuit through a pin, the pin connection is located on the S pole side of the MOS tube, and the contact point of the two pins for measuring voltage is located on the D pole side of the MOS tube.

[0025] Furthermore, a voltage dividing resistor is connected to one of the pin connections.

[0026] Example 4

[0027] Consistent with the first embodiment and further optimized in details, the LTC chip is powered by a node located on the D-pole side of the MOS tube in the power output circuit.

[0028] Furthermore, a filter capacitor is connected to the power supply connection circuit.

[0029] Example 5

[0030] Consistent with Example 1, and further optimized in details, the LTC chip is also connected to the backup power supply through a pin, and the pin is connected in series with a gain resistor, and the load is adjusted by adjusting the resistance value of the gain resistor.

[0031] Furthermore, a filter capacitor is connected to the connection of the LTC chip to the MOS tube and to one of the two pin connections.

[0032] Example 6

[0033] Basically consistent with the above embodiment, a hot backup circuit of the power supply is built with LTC chips, resistors, capacitors and MOS tubes. When the two power modules are working normally, the output voltage is continuously adjusted by the LTC chip until the currents of the two power modules match. When the output voltage fails, the LTC chip disconnects the output voltage by turning off the MOS tube, thereby isolating the module in the system, and removing the faulty power supply and replacing it with a new device without turning off the system power supply.

[0034] When using: build a hot backup design circuit on the existing power module printed circuit board, and prepare relevant testing tools such as an ammeter.

[0035] Power is supplied to the two power modules, and the output current sharing buses of the two power modules are connected together, that is, the 7 pins of the LTC chip are connected; when the dual power modules are working normally, the LTC chip is powered on and reset and then works normally. At this time, the G pole of the MOS tube is at a high level, and the MOS tube starts to work normally and outputs voltage normally. A suitable resistance value is selected at the R22 resistor to form the gain multiple of the LTC chip, and the 12th and 13th pins of the LTC chip continuously obtain the sampling voltage through the sampling resistor RF1; the LTC chip processes the sampling voltage and the gain multiple of the LTC chip internally, and the processed sampling current value is transmitted through the 7 pin of the LTC chip, and the sampling current data of the two power modules are continuously matched. When the sampling current values ​​are different, the LTC chip adjusts the output voltage by setting the gain multiple and calculating the sampling current until the current values ​​of the two power modules match.

[0036] When the two power modules are working stably, a multimeter is used to connect to the output load ends of the two power modules. It is found that the gain resistor R22 obtained by calculation still cannot make the current sharing load of the two power modules close to 1:1. The resistance value of the gain resistor R22 is continuously changed and adjusted within the gain resistance range to make the current sharing load ratio of the two power modules approximately equal to 1:1.

[0037] The LTC chip sets the voltage threshold through pins 1 and 2. When the output voltage is overvoltage or undervoltage, the LTC chip will pull down pin 14 to turn off the MOS tube, making it unable to work normally, and then disconnect the output voltage, thereby isolating the module in the system and removing the faulty power supply and replacing it with a new device without turning off the system power supply.

[0038] Therefore, the present invention aims at the defects that the dual power modules in the VPX chassis cannot be hot-swapped during use, the power consumption cannot be evenly distributed, and the chassis cannot work normally after a single module fails. The present invention is mainly used to solve the problem of balanced load of the dual power modules and improve the ability of the VPX chassis to work continuously, so that the power modules can be replaced during use without affecting the normal operation of the chassis, the power modules can evenly distribute the power consumption to avoid overloading of a single module, and the normal operation of the chassis will not be affected after the failure of a single module.

Claims

1. A power module hot backup circuit based on VPX chassis architecture, characterized in that: The invention comprises an LTC chip, wherein the LTC chip is connected to the G pole of a MOS tube, the S pole and the D pole of the MOS tube are connected in series to the circuit of the power output, and the LTC chip is also connected to the circuit of the power output through two pins for measuring voltage, and the two pins are connected in series with a resistor and in parallel with a capacitor.

2. The power module hot backup circuit based on the VPX chassis architecture according to claim 1, characterized in that: The LTC chip is also connected to a circuit outputted by a power supply through two pins for measuring current, and a resistor is connected in series between the contact points of the two pins connected to the circuit outputted by the power supply.

3. The power module hot backup circuit based on the VPX chassis architecture according to claim 1, characterized in that: The resistor is connected in parallel with a capacitor.

4. The power module hot backup circuit based on the VPX chassis architecture according to claim 1, characterized in that: The LTC chip is also connected to the power output circuit through a pin, the pin connection is located on the S pole side of the MOS tube, and the contact point of the two pins used to measure the voltage is located on the D pole side of the MOS tube.

5. The power module hot backup circuit based on the VPX chassis architecture according to claim 1, characterized in that: The LTC chip is powered by a node located at the D-pole side of the MOS tube in the power output circuit.

6. The power module hot backup circuit based on the VPX chassis architecture according to claim 1, characterized in that: The LTC chip is also connected to a backup power supply via a pin, and the pin is connected in series with a gain resistor, and the load is adjusted by adjusting the resistance value of the gain resistor.

7. The power module hot backup circuit based on the VPX chassis architecture according to claim 1, characterized in that: The connection where the LTC chip is connected to the MOS tube and one of the two pin connections are both connected with a filter capacitor.

8. The power module hot backup circuit based on the VPX chassis architecture as claimed in claim 4, characterized in that: The pin connection is also connected with a voltage dividing resistor.

9. The power module hot backup circuit based on the VPX chassis architecture as claimed in claim 5, characterized in that: The power supply connection is connected with a filter capacitor.

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