Sensor circuit board and manufacturing method thereof

Abstract

The invention provides a sensor circuit board and a manufacturing method thereof. The sensor circuit board comprises a movable unit, a fixed unit, a plurality of suspensions, two X-axis actuators and two Y-axis actuators. The fixed units are arranged around the movable unit at intervals and comprise a plurality of fixed blocks. Part of the fixed blocks are arranged on the two outer sides of the movable unit respectively in the X-axis direction, and part of the fixed blocks are arranged on the other two outer sides of the movable unit respectively in the Y-axis direction. Part of the suspension is connected with the movable unit and the fixed unit. The X-axis actuator and the Y-axis actuator are respectively located between the suspension and the fixed unit, and are respectively connected with the fixed block and the movable unit. An anti-shake effect can be provided through the suspension, the X-axis actuator and the Y-axis actuator.

Description

Technical Field

[0001] The invention relates to a circuit board, and in particular to a sensor circuit board and a manufacturing method thereof. Background Art

[0002] In order to improve the stability of the camera lens, a sensor anti-shake device is currently provided. The sensor anti-shake device uses a voice coil motor as the power for the sensor to move. Since the voice coil motor includes a coil and a permanent magnet, the package size is increased, and the permanent magnet may interfere with the signal. Summary of the invention

[0003] Therefore, the present invention provides a sensor circuit board and a manufacturing method thereof, thereby solving the problems of increased package size and permanent magnet interference signal.

[0004] At least one embodiment of the present invention provides a sensor circuit board. The sensor circuit board includes a movable unit, a fixed unit, a plurality of suspensions, two X-axis actuators, and two Y-axis actuators. The fixed unit is arranged around the movable unit at intervals, and includes two first fixed blocks and two second fixed blocks. The first fixed blocks are respectively arranged at two outer sides of the movable unit along the X-axis direction, and the second fixed blocks are respectively arranged at the other two outer sides of the movable unit along the Y-axis direction. A partial suspension connects the movable unit and the fixed unit. The X-axis actuator is respectively located between one of the suspensions and the fixed unit, and is connected to the first fixed block and the movable unit. The Y-axis actuator is respectively located between one of the suspensions and the fixed unit, and is connected to the second fixed block and the movable unit.

[0005] In at least one embodiment of the present invention, the active unit further includes a plurality of sensor connection pads.

[0006] In at least one embodiment of the present invention, the fixing unit further includes a connecting portion, and the connecting portion is connected to one of the first fixing blocks.

[0007] In at least one embodiment of the present invention, the suspension is a suspension wire or a spring.

[0008] In at least one embodiment of the present invention, the movable unit includes a central area and two edge areas. Part of the suspension is respectively connected to the central area and the first fixed block, and part of the suspension is respectively connected to the central area and the Y-axis actuator. The edge areas are respectively arranged on opposite sides of the central area along the X-axis, and part of the suspension is respectively connected to the edge area and the X-axis actuator. The central area has a first width, and each edge area has a second width, wherein the second width is greater than the first width.

[0009] In at least one embodiment of the present invention, the width of the suspension is smaller than the thickness of the suspension, and the width of the suspension is smaller than 500 μm.

[0010] In at least one embodiment of the present invention, the X-axis actuator includes a pair of first comb-shaped electrodes facing each other, wherein the first comb-shaped electrodes include a plurality of first fingers, and the first fingers are spaced apart and arranged in parallel.

[0011] In at least one embodiment of the present invention, the minimum distance between two adjacent first fingers is less than 30 μm, and the aspect ratio of the first fingers is greater than 5.

[0012] In at least one embodiment of the present invention, the Y-axis actuator includes a pair of second comb-shaped electrodes opposite to each other, wherein the second comb-shaped electrodes include a plurality of second fingers, and the second fingers are spaced apart and arranged in parallel.

[0013] In at least one embodiment of the present invention, the minimum distance between two adjacent second fingers is less than 30 μm, and the aspect ratio of the second fingers is greater than 5.

[0014] According to the above-mentioned purpose of the present invention, a manufacturing method of a sensor circuit board is proposed. The manufacturing method of the sensor circuit board includes providing a substrate; forming a plurality of vias on the substrate; patterning the substrate; after patterning the substrate, bonding a metal layer with an insulating medium on the top and bottom surfaces of the substrate respectively; patterning the metal layer; removing a portion of the metal layer on the top surface of the substrate; after removing a portion of the metal layer on the top surface of the substrate, removing a portion of the base layer of the substrate; after removing a portion of the base layer, forming a protective film on the metal layer; and cutting the insulating medium and the base layer.

[0015] Based on the above, the X-axis actuator and the Y-axis actuator of the sensor circuit board of the present invention can generate thrust or tension after voltage is applied, and the suspension connects the movable unit and the fixed unit. Through the cooperation of the suspension, the X-axis actuator and the Y-axis actuator, the sensor welded on the movable unit can be stabilized to achieve an anti-shake effect. Therefore, the sensor can only move on the XY plane, and the height will not change, thereby ensuring the stability of the image quality. In addition to providing support and rebound functions, the suspension can also provide signal and electrical energy transmission functions, which improves the current problem of permanent magnet interference signals. In addition, the configuration of the suspension, the X-axis actuator and the Y-axis actuator can solve the problem of increased packaging size of the current voice coil motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0017] Figure 1 The figure is a top view schematically illustrating a sensor circuit board according to at least one embodiment of the present invention.

[0018] Figure 2 To illustrate the sensor circuit board Figure 1Schematic cross-sectional view along line segment AA.

[0019] Figure 3 The figure is a schematic diagram illustrating the use status of a sensor circuit board according to at least one embodiment of the present invention.

[0020] Figure 4 The figure is a schematic diagram showing the use status of a sensor circuit board according to another embodiment of the present invention.

[0021] Figure 5 FIG. 4 is a schematic top view of a comb-shaped electrode.

[0022] Figure 6 To illustrate Figure 5 Schematic cross-sectional view along line segment BB.

[0023] Figure 7 To illustrate another embodiment of the sensor circuit board of the present invention, Figure 1 Schematic cross-sectional view of line segment AA in FIG.

[0024] FIG. 8A to FIG. 8G To illustrate Figure 1 A schematic cross-sectional view of the sensor circuit board manufacturing method along the CC line segment. DETAILED DESCRIPTION

[0025] The following is a detailed discussion of embodiments of the present invention. However, it is understood that the embodiments provide many applicable concepts that can be implemented in a variety of specific contexts. The embodiments discussed and disclosed are for illustration only and are not intended to limit the scope of the present invention. For example, the description of "a first feature formed on a second feature" includes embodiments in which the first feature is in direct contact with the second feature, and also includes embodiments in which other features are formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact.

[0026] In addition, spatially relative terms, such as "below," "below," "above," "above," etc., are used to simply describe the relationship of an element or feature illustrated in the drawings to other elements or features. These spatially relative terms also cover different orientations of use or operation in addition to the orientation depicted in the drawings. When an element can be oriented in other ways (rotated 90 degrees or in other orientations), the spatially relative descriptions used herein can be interpreted accordingly.

[0027] See also Figure 1 and Figure 2 ,in Figure 1 FIG. 1 is a schematic top view of a sensor circuit board 100 according to at least one embodiment of the present invention. Figure 2 To illustrate the sensor circuit board 100 Figure 1The sensor circuit board 100 includes a movable unit 110 , a fixed unit 120 , a plurality of suspensions 131 , 132 , 133 , 134 , 135 , 136 , 137 and 138 , two X-axis actuators 140 and 141 , and two Y-axis actuators 150 and 151 .

[0028] like Figure 1 As shown, the fixed unit 120 is arranged around the movable unit 110 at intervals and includes two first fixed blocks 121 and 121'. These first fixed blocks 121 and 121' are respectively arranged on the two outer sides of the movable unit 110 along the X-axis direction DX. In detail, the first fixed block 121 is located on the left side of the movable unit 110, and the first fixed block 121' is located on the right side of the movable unit 110. In this embodiment, the fixed unit 120 further includes a connecting portion 125, and the connecting portion 125 is connected to one of the first fixed blocks. Specifically, Figure 1 The connecting portion 125 is located on the right side of the movable unit 110 and is connected to the first fixing block 121 ′.

[0029] The fixed unit 120 further includes two second fixed blocks 122 and 122'. The second fixed blocks 122 and 122' are respectively disposed on the other two outer sides of the movable unit 110 along the Y-axis direction DY. Specifically, the second fixed block 122 is located above the movable unit 110, and the second fixed block 122' is located below the movable unit 110.

[0030] See also Figure 1 , the movable unit 110 includes a central area 112 and two edge areas 114a and 114b, wherein the edge areas 114a and 114b are respectively disposed at opposite sides of the central area 112 along the X-axis direction DX. The suspensions 131, 133, 135 and 137 are spaced apart from each other and connect the movable unit 110 and the fixed unit 120. Specifically, the suspensions 131 and 133 are respectively connected to the central area 112 and the first fixed block 121, while the suspensions 135 and 137 are respectively connected to the central area 112 and the first fixed block 121'. On the other hand, the suspensions 132, 134, 136 and 138 are also spaced apart from each other, but are not connected to the movable unit 110 and the fixed unit 120.

[0031] like Figure 1As shown, the suspensions 132 and 136 are respectively connected to the edge regions 114a and 114b and the X-axis actuators 140 and 141. Specifically, the suspension 132 is connected to the edge region 114a and the X-axis actuator 140, and the suspension 136 is connected to the edge region 114b and the X-axis actuator 141. In other words, the X-axis actuators 140 and 141 are respectively located between one of the suspensions 132 and 136 and the fixed unit 120, and are connected to the first fixed blocks 121 and 121' and the movable unit 110.

[0032] The suspensions 134 and 138 are respectively connected to the central area 112 and the Y-axis actuators 150 and 151. Specifically, the suspension 134 is connected to the central area 112 and the Y-axis actuator 150, while the suspension 138 is connected to the central area 112 and the Y-axis actuator 151. In other words, the Y-axis actuators 150 and 151 are respectively located between one of the suspensions 132 and 136 and the fixed unit 120, and are connected to the second fixed blocks 122 and 122' and the movable unit 110.

[0033] In this embodiment, the active unit 110 further includes a plurality of sensor connection pads 113. The sensor connection pads 113 are disposed on the edge regions 114a and 114b. Figure 1 and Figure 3 ,in Figure 3 The schematic diagram of the sensor circuit board 100 in use according to at least one embodiment of the present invention is shown in FIG.

[0034] Although in Figure 3 In the embodiment shown, the sensor 300 is mounted on the sensor circuit board 100 by means of Chips On Board (COB), but the present invention is not limited thereto. Figure 4 In this embodiment, the sensor 300 is first packaged on a substrate 400 (the substrate 400 may include a printed circuit board or a ceramic substrate) by using a plurality of solder materials 402. Then, the substrate 400 is disposed on the sensor connection pad 113 (not shown) by using a plurality of solder materials 402. Figure 4 )superior.

[0035] It is worth mentioning that the suspensions 131, 133, 135 and 137 connect the movable unit 110 and the fixed unit 120, and have greater rigidity and bending fatigue resistance. In addition to providing support and rebound functions, the suspensions 131, 133, 135 and 137 can also provide signal, power and other transmission. That is, the signal of the sensor 300 can be transmitted to the fixed unit 120 through the suspensions 131, 133, 135 and 137, and then transmitted to the connecting portion 125.

[0036] In some embodiments, the suspensions 131, 132, 133, 134, 135, 136, 137 and 138 may be supporting and resilient components such as suspension wires or springs. The materials of the suspensions 131, 132, 133, 134, 135, 136, 137 and 138 may be alloys such as titanium and copper, and may also include but are not limited to transition metals such as titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, tungsten, molybdenum, beryllium, or their carbides or oxides, or alloy materials of the above metals and two or more metal elements such as iron, cobalt, nickel, copper, etc.

[0037] Further, by etching, the suspensions 131, 132, 133, 134, 135, 136, 137 and 138 are formed into different sizes, such as a smaller width and a larger thickness. In this embodiment, the width of the suspensions 131, 132, 133, 134, 135, 136, 137 and 138 is smaller than the thickness, that is, each suspension has a high aspect ratio, thereby achieving movement and rebound in the plane direction and high anti-bending characteristics in the height direction. For example, in some embodiments, the width of the suspensions 131, 132, 133, 134, 135, 136, 137 and 138 is less than 500μm, and the thickness can fall within the range of 0.1mm to 0.5mm.

[0038] In addition, the number of the suspensions (such as the suspensions 131, 133, 135 or 137) connecting the fixed unit 120 and the movable unit 110 is not limited to the present embodiment, and the number thereof may be between 1 and 10. The number of the suspensions (such as the suspensions 132, 134, 136 or 138) connecting the movable unit 110 and the axial actuator is also not limited to the present embodiment, and the number thereof may be between 1 and 10.

[0039] See also Figure 1 In this embodiment, the central area 112 of the active unit 110 has a width W1, and the edge area 114a (and the edge area 114b) has a width W2, and the width W2 is greater than the width W1. Specifically, from a top view, the active unit 110 can present an H shape with wide sides and a narrow middle section. In this way, on the one hand, the size and weight of the active unit 110 can be reduced to reduce the power consumption required to move the active unit 110. On the other hand, the length of the suspensions 131, 133, 135 and 137 can be increased to increase the torque, thereby reducing the force required to move the active unit 110.

[0040] See also Figure 1 , Figure 5 and Figure 6 ,in Figure 5 FIG. 4 is a schematic top view of a comb-shaped electrode. Figure 6 To illustrate Figure 5 Schematic diagram of a cross-section along line segment BB. The structures of the X-axis actuators 140 and 141 are the same. Taking the X-axis actuator 140 as an example, the X-axis actuator 140 includes a pair of first comb electrodes 140b opposite to each other. The first comb electrode 140b includes a plurality of first fingers 140f, and these first fingers 140f are spaced and arranged side by side. In this embodiment, the minimum spacing d between adjacent first fingers 140f is less than 30μm. The aspect ratio of the first finger 140f is greater than 5, specifically as shown in FIG. Figure 6 , the aspect ratio is the ratio of height h to width w.

[0041] The structures of the Y-axis actuators 150 and 151 are substantially the same as those of the X-axis actuators 140 and 141. Figure 5 and Figure 6 As shown. Taking the Y-axis actuator 150 as an example, the Y-axis actuator 150 includes a pair of second comb electrodes 150b opposite to each other. The second comb electrode 150b includes a plurality of second fingers 150f, and these second fingers 150f are spaced and arranged side by side. In this embodiment, the minimum spacing d between adjacent second fingers 150f is less than 30μm, and the aspect ratio of the second fingers 150f is greater than 5. In some embodiments, the X-axis actuators 140 and 141 and the Y-axis actuators 150 and 151 may be actuators driven by thermal expansion, but the present invention is not limited thereto. In other embodiments, the X-axis actuators 140 and 141 and the Y-axis actuators 150 and 151 may be actuators driven by piezoelectricity.

[0042] However, embodiments using other actuators as axial actuators are slightly different in structure from this embodiment. Figure 7 , Figure 7 To illustrate another embodiment of the sensor circuit board of the present invention, Figure 1 The actuator 741 is provided on the fixing unit 120 ( Figure 7 Only the lower part of the first fixed block 121' is shown. It is worth mentioning that the actuator 741 is also connected to the suspension (such as the suspensions 132, 134, 136 and 138) to drive the movable unit 110 ( Figure 7 Only the movement of the edge region 114 b ) in the xy plane direction is shown.

[0043] See also Figure 1 The sensor circuit board 100 can drive the X-axis actuators 140 and 141 to allow the movable unit 110 to generate displacement parallel to the X-axis direction DX. Specifically, after voltage is applied to the sensor circuit board 100, the X-axis actuator 140 generates thrust, while the X-axis actuator 141 generates tension.

[0044] On the other hand, the sensor circuit board 100 can drive the Y-axis actuators 150 and 151 to cause the movable unit 110 to generate displacement parallel to the Y-axis DY. Specifically, after voltage is applied, the Y-axis actuator 150 generates a pulling force, while the Y-axis actuator 151 generates a thrust force.

[0045] It can be seen that the X-axis actuators 140 and 141 can drive the active unit 110 to generate displacement in the X-axis direction, and the Y-axis actuators 150 and 151 can drive the active unit 110 to generate displacement in the Y-axis direction. Further, the suspensions 131, 133, 135 and 137 have greater rigidity and bending fatigue resistance, and achieve movement and rebound in the plane direction, as well as high bending resistance in the height direction. Therefore, when vibrating, the sensor 300 set on the active unit 110 only moves in the plane (i.e., the XY plane), and its height will not change, thereby not affecting the image quality.

[0046] See also FIG. 8A to FIG. 8G , which is a drawing Figure 1 FIG. 1 is a cross-sectional schematic diagram of a method for manufacturing a sensor circuit board 100 along line segment CC. Fig. 8A First, a substrate 900 is provided. The substrate 900 may be a copper clad laminate (CCL). Then, Figure 8B , a plurality of conductive through holes 900h are formed on the substrate 900. Figure 8C , the substrate 900 is patterned using, for example, photolithography and etching processes.

[0047] Then as Fig.8D After patterning the substrate 900, the metal layer 912 and the metal layer 920 are bonded to the top surface 900t and the bottom surface 900b of the substrate 900 respectively with the insulating medium 905, and a cavity 930 is formed between the metal layer 912 on the top surface 900t of the substrate 900 and the metal layer 920 on the bottom surface 900b of the substrate 900. It is particularly mentioned that in this embodiment, the bonding metal layer 912 further includes bonding a flexible copper clad laminate 910 (FCCL) to the top surface 900t of the substrate 900, and the flexible copper clad laminate 910 includes a metal layer 912 and an insulating layer 914.

[0048] Then as Fig. 8E, patterning the metal layers 912 and 920, and removing a portion of the metal layer 912 on the top surface 900t of the substrate 900. That is, the metal layer 912 above the cavity portion 930 is removed. In addition, after removing a portion of the metal layer 912 on the top surface 900t of the substrate 900, a portion of the insulating layer 914 and a portion of the base layer 900y of the substrate 900 are removed by, for example, laser cutting, that is, the base layer 900y located in the cavity portion 930 is removed.

[0049] Then as Fig.8F After removing a portion of the base layer 900y of the substrate 900, a protective film 940 is formed on the metal layer 912 and the metal layer 920. In this embodiment, the protective film 940 may be a solder mask. Figure 8G As shown, the insulating medium 905 and the base layer 900y of the substrate 900 are cut. That is, the insulating medium 905 and the base layer 900y located between the suspension and the active unit 110 are cut. For example, the insulating medium 905 and the base layer 900y located between the suspension 137 and the edge region 114b of the active unit 110 are cut.

[0050] In summary, the X-axis actuator and the Y-axis actuator of the sensor circuit board in the present invention can generate thrust or tension after voltage is applied. And because the suspension connects the movable unit and the fixed unit, the sensor welded on the movable unit can be stabilized through the cooperation of the suspension, the X-axis actuator and the Y-axis actuator to achieve an anti-shake effect. In this way, the sensor can only move on the XY plane, and its height will not change, thereby ensuring the stability of the image quality. Among them, in addition to providing support and rebound functions, the suspension can also provide signal and electrical energy transmission functions, thereby improving the current problem of permanent magnet interference signals. In addition, the configuration of the suspension, the X-axis actuator and the Y-axis actuator can also solve the problem of increased packaging size of the current voice coil motor.

[0051] Although the present disclosure has been disclosed as above by way of embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be determined by the definition of the attached claims.

[0052]

Explanation of symbols

[0053] 100:Sensor circuit board

[0054] 110:Activity Unit

[0055] 112: Central Area

[0056] 113: Sensor connection pad

[0057] 114a, 114b: Edge area

[0058] 120: Fixed unit

[0059] 121,121': First fixed block

[0060] 122,122': The second fixed block

[0061] 125: Connecting part

[0062] 131,132,133,134,135,136,137,138: Suspension

[0063] 140,141:X-axis actuator

[0064] 140b: first comb-shaped electrode

[0065] 140f: first finger

[0066] 150,151: Y-axis actuator

[0067] 150b: second comb electrode

[0068] 150f: second finger

[0069] 200: Camera lens

[0070] 300: Sensor

[0071] 400,900:Substrate

[0072] 402,702:Solder materials

[0073] 741: Actuator

[0074] 900b: bottom

[0075] 900h: Conductive vias

[0076] 900t: Top

[0077] 905: Insulation medium

[0078] 910: Flexible copper foil substrate

[0079] 912,920:Metal layer

[0080] 914: Insulation layer

[0081] 930: Cavity

[0082] 940: Protective film

[0083] 900y: Grassroots

[0084] AA,BB,CC: Line segment

[0085] d: minimum spacing

[0086] DX: X-axis

[0087] DY: Y axis

[0088] h: height

[0089] W1,W2,w:width.

Claims

1. A sensor circuit board, characterized in that: Include: Activity Unit; The fixed unit is arranged at intervals around the movable unit and includes: Two first fixed blocks, and the first fixed blocks are respectively arranged at two outer sides of the movable unit along the X-axis direction; and Two second fixed blocks, and the second fixed blocks are respectively arranged on the other two outer sides of the movable unit along the Y-axis direction; A plurality of suspensions, some of which connect the movable unit and the fixed unit; two X-axis actuators, respectively located between one of the suspensions and the fixed unit, and connected to the first fixed block and the movable unit; and Two Y-axis actuators are respectively located between one of the suspensions and the fixed unit, and are connected to the second fixed block and the movable unit.

2. The sensor circuit board according to claim 1, characterized in that: The active unit also includes a plurality of sensor connection pads.

3. The sensor circuit board according to claim 1, characterized in that: The fixing unit further includes a connecting portion connected to one of the first fixing blocks.

4. The sensor circuit board according to claim 1, characterized in that: The suspension is a suspension wire or a spring.

5. The sensor circuit board according to claim 1, characterized in that: The activity unit comprises: A central region, wherein some of the suspensions are respectively connected to the central region and the first fixed block, and some of the suspensions are respectively connected to the central region and the Y-axis actuator; as well as Two edge regions are respectively arranged at opposite sides of the central region along the X-axis direction, wherein parts of the suspensions are respectively connected to the edge regions and the X-axis actuator; The central region has a first width, and each of the edge regions has a second width, wherein the second width is greater than the first width.

6. The sensor circuit board according to claim 1, characterized in that: The width of the suspension is smaller than the thickness of the suspension, and the width of the suspension is smaller than 500 μm.

7. The sensor circuit board according to claim 1, characterized in that: The X-axis actuator includes a pair of first comb electrodes facing each other, wherein the first comb electrodes include a plurality of first fingers, and the first fingers are spaced apart and arranged in parallel.

8. The sensor circuit board according to claim 7, characterized in that: The minimum distance between two adjacent first fingers is less than 30 μm, and the aspect ratio of the first fingers is greater than 5.

9. The sensor circuit board according to claim 1, characterized in that: The Y-axis actuator includes a pair of second comb-shaped electrodes facing each other, wherein the second comb-shaped electrodes include a plurality of second fingers, and the second fingers are spaced apart and arranged in parallel.

10. The sensor circuit board according to claim 9, characterized in that: The minimum distance between two adjacent second fingers is less than 30 μm, and the aspect ratio of the second fingers is greater than 5.

11. A method for manufacturing a sensor circuit board, characterized in that: Include: providing a substrate; forming a plurality of vias on the substrate; patterning the substrate; After patterning the substrate, bonding metal layers on the top and bottom surfaces of the substrate with insulating media respectively; patterning the metal layer; removing a portion of the metal layer on the top surface of the substrate; After removing a portion of the metal layer on the top surface of the substrate, removing a portion of the base layer of the substrate; After removing the portion of the base layer, forming a protective film on the metal layer; and The insulating medium and the base layer are cut.

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