A circuit board preparation and lamination device based on a continuous feeding structure

Abstract

The present invention relates to the technical field of circuit board processing, and discloses a circuit board preparation and laminating device based on a continuous feeding structure, including a placement part. The placement part includes a workbench, and the workbench is fixedly connected to a top plate through columns arranged on its upper surface. The workbench is slidably connected with a carrier plate for placing external multi-layer circuit boards through a cavity opened in its interior, and there are two carrier plates. This circuit board preparation and laminating device based on a continuous feeding structure can effectively solve the problem in the prior art that after the pre-pressing and laminating device for circuit boards completes the loading operation of one circuit board and starts the pressing program, until the pressing process of the multi-layer circuit board is completely finished, the device will enter the loading preparation stage for the next circuit board. This intermittent production operation will accumulate a large amount of time loss, seriously restricting the production capacity of the production line and greatly reducing the production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and particularly relates to a circuit board preparation and laminating device based on a continuous feeding structure. Background Art

[0002] A circuit board, also known as a printed circuit board or printed wiring board, is an essential component in electronic devices. With the development of electronic technology, in some high-end applications, multi-layer boards formed by alternately laminating three or more conductive layers and insulating layers are used. It has higher integration and more complex circuit design capabilities, and can greatly reduce the size of the circuit board.

[0003] In existing equipment, after the pre-pressing and laminating equipment for circuit boards completes the loading operation of one circuit board, the pressing program is started. It is not until the pressing process of the multi-layer circuit board is completely finished that the equipment will enter the loading preparation stage for the next circuit board. This intermittent production operation will accumulate a large amount of time loss, severely restricting the production capacity of the production line and greatly reducing the production efficiency. Summary of the Invention

[0004] Aiming at the above-mentioned disadvantages of the existing technology, the present invention provides a circuit board preparation and laminating device based on a continuous feeding structure, which can effectively solve the problem in the existing technology that after the pre-pressing and laminating equipment for circuit boards completes the loading operation of one circuit board, the pressing program is started. It is not until the pressing process of the multi-layer circuit board is completely finished that the equipment will enter the loading preparation stage for the next circuit board. This intermittent production operation will accumulate a large amount of time loss, severely restricting the production capacity of the production line and greatly reducing the production efficiency.

[0005] To achieve the above object, the present invention is realized through the following technical solutions:

[0006] The present invention provides a circuit board preparation and laminating device based on a continuous feeding structure, including:

[0007] A placing part, the placing part includes a workbench, the workbench is fixedly connected to a top plate through columns arranged on its upper surface, the workbench is slidably connected to a carrier plate for placing an external multi-layer circuit board through a cavity opened in its interior. There are two carrier plates. One of the carrier plates close to the top is slidably connected to the interior of the top plate through a hydraulic rod fixed on its upper surface. A guiding groove communicating with the interior of the cavity is opened in the interior of the workbench. A guiding column slidably connected to the inner wall of the guiding groove is fixedly connected to the lower surface of one of the carrier plates close to the bottom;

[0008] A positioning part for fixing an external multi-layer circuit board;

[0009] Among them, the positioning part includes positioning pins fixed on the upper surface of the bearing plate. There are two groups of the positioning pins, and the two groups of positioning pins are designed at a 90-degree angle. An active component that cooperates with the positioning pins to position the circuit board is arranged inside the bearing plate.

[0010] Furthermore, a spring sleeving the circumferential outer surface of the guiding post is connected to the bottom of one of the bearing plates close to the bottom end, and the bottom end of the spring is connected to the bottom of the inner wall of the cavity. The active component and the positioning pins are distributed on both sides of the bearing plate.

[0011] Furthermore, the active component includes a sliding groove opened on the upper surface of the bearing plate. A limiting piece that fits the side surface of the external circuit board is slidably connected to the inner wall of the sliding groove. The limiting piece is fixedly connected to a connecting rod through a connecting plate fixed on its outer surface.

[0012] Furthermore, a cylinder is embedded inside the workbench. The output end of the cylinder is fixedly connected to a clamping block. A clamping groove that fits the outer surface of the clamping block is opened at one end of the connecting rod far from the limiting piece.

[0013] Furthermore, a robotic arm for continuous feeding is fixedly connected above the workbench. The outer surface of the clamping block is designed in an inclined plane.

[0014] Furthermore, the limiting piece includes a sliding seat. The outer surface of the sliding seat is fixedly connected to one side of the connecting plate far from the cylinder. The sliding seat is slidably connected to a limiting post on the circumferential inner wall. A magnetic plate magnetically connected to the lower surface of the limiting post is rotatably connected to the bottom end of the sliding seat.

[0015] Among them, the upper surface of the sliding seat is lower than the upper surface of the bearing plate.

[0016] Furthermore, a first magnetic plate magnetically connected to the lower surface of the magnetic plate is fixedly connected to the bottom of the inner wall of the sliding groove. A placement groove connected to the inside of the sliding groove is opened inside the workbench. A second magnetic plate magnetically connected to the lower surface of the magnetic plate is fixedly connected to the bottom of the inner wall of the placement groove. The upper surface of the second magnetic plate is designed with a magnetic force opposite to that of the upper surface of the first magnetic plate. The first magnetic plate is designed with a magnetic force the same as that of the lower surface of the limiting post.

[0017] Furthermore, a limiting block is arranged at the bottom end of the sliding seat. The side close to the placement groove is designed in an arc surface. The bottom edge of the magnetic plate is designed in an arc edge.

[0018] The technical solution provided by the present invention has the following beneficial effects compared with the prior art:

[0019] The present invention is provided with two bearing plates. The upper bearing plate is slidably connected to the inside of the top plate through a hydraulic rod, and the lower bearing plate is slidably connected to the inside of the cavity. The upper surfaces of both bearing plates are provided with positioning pins and movable components capable of positioning multi-layer circuit boards. When the upper bearing plate moves upward through the hydraulic rod, the multi-layer circuit boards between the bearing plate and the top plate can be pressed, and at this time, the lower bearing plate can perform the operations of feeding and discharging. When the upper bearing plate moves downward through the hydraulic rod to be almost parallel to the upper surface of the workbench, the lower surface of the upper bearing plate tightly fits with the upper surface of the lower bearing plate, so that the multi-layer circuit boards between the two bearing plates are pressed, and the upper surface of the upper bearing plate can complete the processes of feeding, discharging, and fitting. The upper and lower bearing plates alternately perform pressing and feeding / discharging operations. The equipment does not need to wait for a complete cycle from pressing to feeding / discharging to end before starting a new operation. It can complete the rising and falling actions of the bearing plate in a short time, making the connection between the pressing and feeding / discharging processes closer, further shortening the single production cycle, improving the production rhythm, greatly reducing the idle time of the equipment, realizing a continuous production process, significantly increasing the number of circuit board fittings per unit time, and thus improving the overall production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0021] Figure 1 It is a three-dimensional structure schematic diagram of an embodiment of the present invention;

[0022] Figure 2 It is a sectional structure schematic diagram of the workbench of an embodiment of the present invention;

[0023] Figure 3 It is a separated structure schematic diagram of the top plate, bearing plate and workbench of an embodiment of the present invention;

[0024] Figure 4 It is a structure schematic diagram of the bearing plate, positioning pin and chute of an embodiment of the present invention;

[0025] Figure 5 It is a structure schematic diagram of the movable component of an embodiment of the present invention;

[0026] Figure 6 It is a sectional structure schematic diagram of the bearing plate of an embodiment of the present invention;

[0027] Figure 7Schematic diagram of the limiting member according to an embodiment of the present invention;

[0028] Figure 8 State conversion diagram of the limiting member according to an embodiment of the present invention.

[0029] The reference numerals in the figure respectively represent: 1, placement part; 11, workbench; 111, guide groove; 112, guide post; 113, spring; 12, top plate; 13, bearing plate; 14, robotic arm; 15, placement groove; 2, positioning part; 21, positioning pin; 22, movable assembly; 221, chute; 222, limiting member; 2221, sliding seat; 2222, limiting post; 2223, magnetic plate; 2224, magnetic plate 1; 2225, magnetic plate 2; 223, connecting plate; 224, connecting rod; 225, cylinder; 226, buckle block; 227, card slot. Detailed implementation manners

[0030] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0031] The present invention will be further described below with reference to the embodiments.

[0032] Embodiment:

[0033] Please refer to Figures 1-8 , the present invention provides a technical solution: a circuit board preparation and lamination device based on a continuous feeding structure, including:

[0034] Placement part 1, the placement part 1 includes a workbench 11, the workbench 11 is fixedly connected to a top plate 12 through a column provided on its upper surface, the workbench 11 is slidably connected to a bearing plate 13 for placing an external multi-layer circuit board through a cavity opened in its interior, there are two bearing plates 13, and a bearing plate 13 near the top is slidably connected to the interior of the top plate 12 through a hydraulic rod fixed on its upper surface, a guide groove 111 communicating with the interior of the cavity is opened in the interior of the workbench 11, a guide post 112 slidably connected to the inner wall of the guide groove 111 is fixedly connected to the lower surface of a bearing plate 13 near the bottom, and a spring 113 connected to the bottom of the bearing plate 13 near the bottom is sleeved on the outer circumferential surface of the guide post 112, and the bottom end of the spring 113 is connected to the bottom of the inner wall of the cavity;

[0035] Positioning part 2, used for fixing an external multi-layer circuit board.

[0036] The positioning part 2 includes positioning pins 21 fixed on the upper surface of the bearing plate 13. There are two groups of positioning pins 21, and the two groups of positioning pins 21 are designed at a 90-degree angle. An active component 22 that cooperates with the positioning pins 21 to position the circuit board is arranged inside the bearing plate 13. The active component 22 and the positioning pins 21 are distributed on both sides of the bearing plate 13.

[0037] The active component 22 includes a sliding groove 221 opened on the upper surface of the bearing plate 13. A limiting member 222 that fits against the side surface of the external circuit board is slidably connected to the inner wall of the sliding groove 221. The limiting member 222 is fixedly connected to a connecting rod 224 through a connecting plate 223 fixed on its outer surface.

[0038] A cylinder 225 is embedded inside the workbench 11. The output end of the cylinder 225 is fixedly connected to a buckle block 226. A clamping groove 227 that fits against the outer surface of the buckle block 226 is opened at one end of the connecting rod 224 away from the limiting member 222. One side of the connecting rod 224 away from the limiting member 222 extends into the workbench 11 to open the clamping groove 227.

[0039] A robotic arm 14 for continuous feeding is fixedly connected above the workbench 11. The outer surface of the buckle block 226 is designed in a beveled shape. The buckle block 226 has a certain thickness and can adapt to the pressing of different circuit boards. At the same time, the beveled design of the outer surface can guide the clamping groove 227 on the outer surface of the connecting rod 224.

[0040] The limiting member 222 includes a sliding seat 2221. The outer surface of the sliding seat 2221 is fixedly connected to the side of the connecting plate 223 away from the cylinder 225. A limiting column 2222 is slidably connected to the circumferential inner wall of the sliding seat 2221. A magnetic plate 2223 that is magnetically connected to the lower surface of the limiting column 2222 is rotatably connected to the bottom end of the sliding seat 2221;

[0041] Among them, the upper surface of the sliding seat 2221 is lower than the upper surface of the bearing plate 13.

[0042] A magnetic plate 2224 that is magnetically connected to the lower surface of the magnetic plate 2223 is fixedly connected to the bottom of the inner wall of the sliding groove 221. A placement groove 15 connected to the inside of the sliding groove 221 is opened inside the workbench 11. A magnetic plate 2225 that is magnetically connected to the lower surface of the magnetic plate 2223 is fixedly connected to the bottom of the inner wall of the placement groove 15. The upper surface of the magnetic plate 2225 is designed with a magnetic force opposite to that of the upper surface of the magnetic plate 2224. The magnetic plate 2224 is designed with the same magnetic force as the lower surface of the limiting column 2222.

[0043] A limiting block is provided at the bottom end of the sliding seat 2221. The side of the limiting block close to the placement groove 15 is designed with an arc surface, and the bottom edge of the magnetic plate 2223 is designed with an arc edge. The limiting block with the arc surface design avoids breakage caused by the impact during the rotation of the magnetic plate 2223.

[0044] Before the multi-layer circuit board is pressed under high temperature and high pressure, the multi-layer circuit board will be pressed by a pre-pressing device in an environment of normal temperature and low pressure. The main purpose is to ensure the alignment accuracy between layers during the high-temperature and high-pressure pressing process of the multi-layer circuit board. By quickly pressing at normal temperature and low pressure, the positions of each layer can be initially fixed, reducing the possible interlayer shift during the subsequent high-temperature and high-pressure process. The pre-pressing and laminating step can help improve the smoothness of the production line, reduce the adjustment time and reject rate during the high-temperature and high-pressure pressing stage, thereby improving the overall production efficiency.

[0045] When the limiting member 222 is inside the sliding groove 221, the magnetic plate 2223 is parallel to the upper surface of the bearing plate 13. Taking the upper surface of the magnetic plate 2223 as the S pole magnetism in this state as an example, the lower surface of the magnetic plate 2223 is the N pole, the upper surface of the magnetic plate one 2224 is the S pole magnetism, the upper surface of the magnetic plate two 2225 is the N pole, and the bottom end of the limiting column 2222 is the S pole.

[0046] In the initial state, the upper surface of the bearing plate 13 above tightly approaches the lower surface of the top plate 12. A multi-layer circuit board is placed between the bearing plate 13 and the top plate 12 and is pressed. The bearing plate 13 below is slidably connected inside the cavity and, under the action of the spring 113, its upper surface is almost flush with the upper surface of the workbench 11. The positioning pins 21 and the movable components 22 are symmetrically distributed with the bearing plate 13 as the center, and there are two groups of both the positioning pins 21 and the movable components 22. Among them, the two groups of positioning pins 21 are distributed on the adjacent sides of the upper surface of the bearing plate 13, and the included angle between the two groups of positioning pins 21 is ninety degrees, presenting an overall L-shaped distribution. The two groups of movable components 22 are distributed on the other two sides of the upper surface of the bearing plate 13, presenting an overall L-shaped distribution. The two groups of positioning pins 21 and the two groups of movable components 22 are diagonally distributed above the bearing plate 13.

[0047] The process of loading the multi-layer circuit board:

[0048] The air cylinder 225 is initially in a contracted state, and the limiting member 222 is inside the placement groove 15. Since there is a certain gap between the bottom of the limiting member 222 and the bottom of the inner wall of the placement groove 15, the magnetic plate 2223 can rotate at the bottom end of the sliding seat 2221. Since the lower surface of the inner wall of the placement groove 15 is fixedly connected with a second magnetic plate 2225 with an N magnetic pole on its upper surface, one side of the S magnetic pole of the magnetic plate 2223 is connected by the magnetic force of the second magnetic plate 2225, and rotation occurs inside the sliding seat 2221, being in an inclined state. At this time, the S magnetic pole side of the magnetic plate 2223 is on the lower surface, and the N magnetic pole side is on the upper surface. The S magnetic pole at the lower end of the limiting column 2222 is attracted by the N magnetic pole on the upper surface of the magnetic plate 2223 and is at the bottom of the inner wall of the sliding seat 2221. At this time, the upper surface of the limiting column 2222 is lower than the upper surface of the carrier plate 13, which does not affect the loading and unloading of the circuit board.

[0049] In practical applications, the robotic arm 14 in the placement part 1 is used to place the multi-layer circuit boards to be processed on the surface of the lower carrier plate 13. By starting the air cylinders 225 on both sides through the driving base, the connecting rod 224 in the lower carrier plate 13 is engaged with the snap block 226 at the output end of the air cylinder 225 through the card slot 227 on its outer surface, and the air cylinder 225 drives the connecting rod 224 to move towards the side close to the positioning pin 21. One end of the connecting rod 224 away from the air cylinder 225 is connected to the limiting member 222 through the connecting plate 223, driving the limiting member 222 to move away from the air cylinder 225.

[0050] Since the relatively square side of the magnetic plate 2223 is blocked by the limiting block on the lower surface of the sliding seat 2221, the magnetic plate 2223 is in an inclined state. At this time, the arc edge of the magnetic plate 2223 is lower than the lower surface of the inner wall of the sliding groove 221, and a stepped shape is formed at the connection between the sliding groove 221 and the placement groove 15. When the limiting member 222 moves away from the air cylinder 225, the sliding seat 2221 makes a relative movement, and the lower surface of the magnetic plate 2223 pauses briefly due to the step effect and completes rotation inside the sliding seat 2221. At this time, the magnetic plate 2223 is in a horizontal state, the lower surface of the magnetic plate 2223 is an N magnetic pole, and is attracted to the upper surface of the first magnetic plate 2224; the upper surface of the magnetic plate 2223 is an S magnetic pole, and the bottom end of the limiting column 2222 is also an S magnetic pole. Like poles repel each other, and the limiting column 2222 is in a protruding state extending out of the sliding seat 2221.

[0051] The upper surface of the sliding seat 2221 is lower than the upper surface of the bearing plate 13, and the height by which the limit posts 2222 protrude from the upper surface of the bearing plate 13 is greater than the thickness of the multilayer circuit board. This enables one side of the multilayer circuit board to be moved simultaneously towards the positioning pin 21, while the other set of limit members 222 moves the other side of the multilayer circuit board towards the other positioning pin 21. The air cylinder 225 continues to drive the limit members 222 to move until two sides of the circuit board come into contact with the outer circumferential surface of the positioning pin 21, and the other two adjacent sides come into contact with the outer circumferential surface of the limit posts 2222. The air cylinder 225 stops further output and maintains the current state. At this time, the four sides of the multilayer circuit board are all fixed by the positioning portion 2, which can prevent the circuit board from shifting in the horizontal, vertical, and horizontal rotation directions during the lamination and pre-pressing processes, enabling the circuit components and circuits on the circuit board to be accurately docked, avoiding problems such as circuit misalignment, short circuit, or open circuit, and thus improving the yield rate of the product.

[0052] Process of pressing the circuit board:

[0053] After the multilayer circuit board is fixed, the hydraulic rod inside the top plate 12 is activated to drive the upper bearing plate 13 to move downward. The upper bearing plate 13 gradually moves downward, and the distance between the upper and lower bearing plates 13 becomes smaller until the positioning pin 21 on the upper surface of the lower bearing plate 13 enters the positioning groove on the lower surface of the upper bearing plate 13. As it continues to move downward, the lower surface of the upper bearing plate 13 comes into contact with the upper surface of the limit posts 2222. The pressure exerted by the hydraulic rod on the limit posts 2222 is greater than the magnetic force of repulsion between the limit posts 2222 and the upper surface of the magnetic plate 2223. The limit posts 2222 are inside the sliding seat 2221 and move downward, causing the lower surface of the upper bearing plate 13 to come into contact with the upper surface of the multilayer circuit board.

[0054] Under the action of the hydraulic rod, the upper bearing plate 13 continues to squeeze the lower bearing plate 13 to move downward continuously. The distance between the lower bearing plate 13 and the lower surface of the inner wall of the cavity decreases, and the spring 113 undergoes elastic deformation. The length of the guiding post 112 inside the guiding groove 111 gradually increases. At the same time, the clamping groove 227 at the outer end of the connecting rod 224 in the lower bearing plate 13 is disengaged from the clamping block 226 at the output end of the air cylinder 225. The connecting rod 224 maintains this state and gradually (the limit member 222 is magnetically attracted to the upper surface of the magnetic plate 2224 through the magnetic plate 2223 and is in a fixed state, ensuring the stability of the circuit board during pressing and also avoiding the displacement of the connecting rod 224) moves stably downward towards the lower part of the through groove opened on the upper surface of the workbench 11. Until the spring 113 is compressed to the extreme, the upper bearing plate 13 continues to apply a certain pressure to the lower bearing plate 13 to perform pre-pressing treatment on the multilayer circuit board.

[0055] Meanwhile, the connecting rod 224 inside the upper bearing plate 13 is engaged with the snap block 226 at the output end of the air cylinder 225 through the card slot 227. The snap block 226 has a certain thickness, which can well receive the card slot 227 at the outer end of the connecting rod 224. At the same time, it can adapt to the pressing of circuit boards with different thicknesses, so that the height difference between the upper surface of the upper bearing plate 13 and the upper surface of the workbench 11 is within a certain range, and the air cylinder 225 can realize the engagement with the upper connecting rod 224 (the multi-layer circuit board is slightly thicker, and the upper surface of the bearing plate 13 is slightly higher in this state; the multi-layer circuit board is slightly thinner, and the upper surface of the bearing plate 13 is slightly lower in this state).

[0056] The process of discharging the circuit board that has been pressed on the surface of the upper bearing plate 13:

[0057] After the output end of the air cylinder 225 embedded in the workbench 11 is engaged with the outer end of the upper connecting rod 224, the air cylinder 225 starts and drives the connecting plate 223 and the limiting member 222 to move backward and recover. The connecting rod 224 drives the limiting member 222 to move away from the positioning pin 21. The outer circumferential surface of the limiting column 2222 is separated from the side surface of the pressed multi-layer circuit board. As the sliding seat 2221 continues to slide in the chute 221, there is no magnetic plate 2224 on the lower surface of the inner wall of the chute 221 at this position. When the sliding seat 2221 enters the placement groove 15, the lower surface of the magnetic plate 2223 does not contact the object and is inside the placement groove 15. Under the action of the N pole magnet of the bottom magnetic plate 2225, the magnetic plate 2223 rotates rapidly, and its S pole magnet side approaches downward. The magnetic plate 2223 is in an inclined state, and its square side is blocked by the limiting block on the lower surface of the sliding seat 2221.

[0058] At this time, the N pole magnet of the magnetic plate 2223 faces upward, and the bottom end of the limiting column 2222 is quickly attracted and moves downward inside the sliding seat 2221. The bottom end of the limiting column 2222 in this state is lower than the upper surface of the bearing plate 13, avoiding hindering the robot arm 14 from discharging the pressed multi-layer circuit board. After discharging, the robot arm 14 places the raw material of the multi-layer circuit board above the bearing plate 13 again, and continues to start the air cylinder 225, driving the connecting plate 223 and the limiting member 222 to move toward the positioning pin 21 to fix the new round of multi-layer circuit board in four directions. After the fixing is completed, the air cylinder 225 pauses moving.

[0059] The top plate 12 drives the hydraulic rod to move the upper bearing plate 13 upward, driving the new round of multi-layer circuit board closer to the lower surface of the top plate 12. After the lower bearing plate 13 is separated from the pressing, it moves upward under the action of the spring 113 until its upper surface is almost in the same plane as the upper surface of the workbench 11, and repeats the above actions. After the air cylinder 225 drives the limiting member 222 to recover, the robot arm 14 feeds the pressed circuit board and then feeds the next round again.

[0060] In summary, when laminating and pressing a multi-layer circuit board, the device has the following advantages:

[0061] Advantage 1: There are two carrier plates 13. On the upper surface of the carrier plate 13, there are positioning pins 21 and movable components 22 that can position the multi-layer circuit board. When the upper carrier plate 13 moves upward through the hydraulic rod, the multi-layer circuit board between the carrier plate 13 and the top plate 12 can be pressed. At this time, the lower carrier plate 13 can perform the operations of unloading and loading materials. When the upper carrier plate 13 moves downward through the hydraulic rod to be almost parallel to the upper surface of the workbench 11, the lower surface of the upper carrier plate 13 is tightly attached to the upper surface of the lower carrier plate 13, so that the multi-layer circuit board between the two carrier plates 13 is pressed. And the upper surface of the upper carrier plate 13 can complete the processes of unloading, loading, and laminating. It realizes the alternate pressing, unloading, and loading operations of the upper and lower carrier plates 13. The device does not need to wait for a complete cycle of pressing to unloading and loading to end before starting new work. It can complete the rising and falling actions of the carrier plate 13 in a short time, making the connection between the pressing and unloading and loading processes closer, further shortening the single production cycle, improving the production rhythm, greatly reducing the idle time of the device, realizing a continuous production process, significantly increasing the number of circuit board laminations per unit time, and thus improving the overall production efficiency.

[0062] Advantage 2: When fixing the multi-layer substrate, the positioning pins 21 do not move, and the limiting members 222 slide in the chute 221 through the cylinders 225, which can adapt to multi-layer circuit boards of different sizes within a certain range for pressing, improving production flexibility and meeting the needs of diversified orders.

[0063] Advantage 3: The positioning pins 21 are fixed on two adjacent sides of the carrier plate 13, and the multi-layer circuit board substrate in the middle is stably placed by moving the limiting members 222 on the other two sides. Only by adjusting the pressing position of the limiting members 222 through the connecting rod 224, there is no need to manually replace the fixture, improving the convenience of the device.

[0064] Advantage 4: After fixing the multi-layer circuit board with the limiting members 222, the magnetic plate 2223 of the limiting member 222 in the chute 221 has the opposite magnetic pole to the upper surface of the magnetic plate 1 2224 and attracts each other, ensuring the stability of the magnetic plate 2223 during the pressing process, ensuring the precise positioning of the multi-layer circuit board during the pressing process, reducing offset, improving the accuracy and quality of the product, and correspondingly reducing the adjustment time and scrap rate in the subsequent high-temperature and high-pressure pressing stage, improving the smoothness and overall efficiency of the production line.

[0065] Advantage Five: During the positioning process of the circuit board, the limit post 2222 protrudes from the outer surface of the carrier plate 13 under the influence of the opposite magnetic poles of the magnetic plate 2223, and the distance between the top of the limit post 2222 and the upper surface of the carrier plate 13 is greater than the thickness of the multi-layer circuit board. During pressing, the limit post 2222 contacts the lower surface of the carrier plate 13 or the top plate 12 above it, can adapt to the remaining thickness of the circuit board during compression, and always maintains the limit. Through the design of magnetic repulsion between the upper surface of the limit post 2222 and the magnetic plate 2223, the limit post 2222 can be compressed during pressing, adapt to multi-layer circuit boards with different thicknesses within a certain range, improve the production flexibility of the equipment, and can quickly adapt to different production requirements.

[0066] Advantage Six: When the air cylinder 225 drives the limiting member 222 to move into the placement groove 15, the magnetic plate 2223 is magnetically connected to the upper surface of the magnetic plate two 2225 and rotates instantly, driving the limit post 2222 to quickly contract inside the sliding seat 2221. At this time, the upper surface of the limit post 2222 is lower than the upper surface of the carrier plate 13, avoiding possible obstacles during the loading and unloading process, and enabling the robotic arm 14 to operate more smoothly.

[0067] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board preparation and bonding device based on a continuous feeding structure, characterized in that: include: A placement portion (1), the placement portion (1) comprising a workbench (11), the workbench (11) being fixedly connected to a top plate (12) via a column arranged on its upper surface, the workbench (11) being slidably connected to a carrier plate (13) for placing an external multilayer circuit board via a cavity provided inside the workbench (11), two carrier plates (13) being provided, one of the carrier plates (13) near the top being slidably connected to the inside of the top plate (12) via a hydraulic rod fixed on its upper surface, the inside of the workbench (11) being provided with a guide groove (111) communicating with the inside of the cavity, and the lower surface of one of the carrier plates (13) near the bottom being fixedly connected to a guide column (112) slidably connected to the inner wall of the guide groove (111); A positioning portion (2), used for fixing an external multi-layer circuit board; The positioning portion (2) comprises positioning pins (21) fixed on the upper surface of the carrier plate (13); the positioning pins (21) are provided in two groups, and the two groups of positioning pins (21) are designed to be at an angle of ninety degrees; and a movable component (22) is provided inside the carrier plate (13) for cooperating with the positioning pins (21) to position the external circuit board; The movable component (22) comprises a slide groove (221) provided on the upper surface of the carrier plate (13); the inner wall of the slide groove (221) is slidably connected with a stopper (222) which fits the side of the external circuit board; the stopper (222) is fixedly connected with a connecting rod (224) via a connecting plate (223) fixed on its outer surface; a cylinder (225) is embedded inside the workbench (11); the output end of the cylinder (225) is fixedly connected with a buckle block (226); the end of the connecting rod (224) away from the stopper (222) is provided with a stopper block (226) which is engaged with the buckle block (22 6) The limit member (222) comprises a sliding seat (2221) whose outer surface is fitted with a slot (227). The outer surface of the sliding seat (2221) is fixedly connected to the side of the connecting plate (223) away from the cylinder (225). The sliding seat (2221) has a circumferential inner wall that is slidably connected to the limit column (2222). The bottom end of the sliding seat (2221) is rotatably connected to a magnetic plate (2223) that is magnetically connected to the lower surface of the limit column (2222); the upper surface of the sliding seat (2221) is lower than the upper surface of the supporting plate (13).

2. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 1, characterized in that: The outer circumferential surface of the guide column (112) is sleeved with a spring (113) connected to the bottom of a bearing plate (13) near the bottom end, the bottom end of the spring (113) is connected to the bottom of the inner wall of the cavity, and the movable component (22) and the positioning pin (21) are distributed on both sides of the bearing plate (13).

3. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 1, characterized in that: A mechanical arm (14) for continuous loading is fixedly connected above the workbench (11), and the outer surface of the buckle block (226) adopts a sloped design.

4. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 3, characterized in that: The bottom of the inner wall of the slide groove (221) is fixedly connected with a magnetic plate 1 (2224) magnetically connected to the lower surface of the magnetic plate (2223); the interior of the workbench (11) is provided with a placement groove (15) connected to the interior of the slide groove (221); the bottom of the inner wall of the placement groove (15) is fixedly connected with a magnetic plate 2 (2225) magnetically connected to the lower surface of the magnetic plate (2223); the upper surface of the magnetic plate 2 (2225) adopts a magnetic design with opposite magnetic properties to the upper surface of the magnetic plate 1 (2224); the magnetic plate 1 (2224) adopts a magnetic design with the same magnetic properties as the lower surface of the limiting column (2222).

5. The circuit board preparation and bonding equipment based on a continuous feeding structure according to claim 4, characterized in that: A limiting block is arranged at the bottom end of the sliding seat (2221), and a side of the limiting block close to the placement slot (15) adopts an arc surface design, and the bottom edge of the magnetic plate (2223) adopts an arc edge design.

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