Gas-liquid mixing cooling system and method and gas-liquid mixing refrigerating cabinet
By adopting a gas-liquid hybrid cooling system in the data center, using the cooling plate and the air-cooling device for heat exchange, and adjusting the cooling parameters through the control module, the problems of low energy utilization and insufficient heat dissipation limit in the traditional air-cooled heat dissipation method in the big data center are solved, and efficient cooling and energy utilization are achieved.
Patent Information
- Application Number
- CN202311657612.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-05
- Publication Date
- 2025-04-18
AI Technical Summary
Traditional air-cooled heat dissipation methods in big data centers are difficult to meet the heat dissipation needs of high-power density data centers due to low energy utilization and insufficient heat dissipation limits.
A gas-liquid hybrid cooling system is adopted, including multiple cabinets, cooling modules and control modules. The cooling module consists of a cooling plate and an air-cooling device. The cooling plate comes into contact with the heat source component for heat exchange. The air-cooling device generates an airflow between the air outlet and the heat source component. The control module adjusts the temperature and flow rate of the coolant and the rotation speed of the air-cooling device based on the temperature information of the heat source components and the cooling plate.
It realizes efficient cooling and cooling of the heat source components of the data center, improves energy utilization, and meets the heat dissipation needs of high-power density data centers.
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Figure CN119855098A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of computer technology, and in particular to a gas-liquid mixed cooling system, a gas-liquid mixed cooling method and a gas-liquid mixed refrigeration cabinet. Background Art
[0002] Servers are an important part of electronic devices and are mainly used to provide computing services. According to the types of services provided by the server, they are mainly divided into storage servers, file servers, database servers, application servers, web servers, etc. The main components of the server include the motherboard, processor, hard disk, memory, etc., which are similar to the general computer architecture.
[0003] In the era of big data, a large number of information technology equipment will be concentrated in data centers. These data centers contain various types of servers, storage, switches, a large number of cabinets and other infrastructure. Traditional data centers use air cooling, but their energy utilization rate is low and does not meet the requirements of green development of the information industry. And when large data centers with high power density gradually become mainstream, conventional air cooling has been difficult to meet the ultra-high heat dissipation requirements of data centers due to its low heat dissipation limit.
[0004] Therefore, how to improve energy utilization and meet the heat dissipation needs of data centers has become an urgent problem to be solved by technical personnel in this field. Summary of the invention
[0005] The embodiment of the present application provides a gas-liquid mixed cooling system to solve the problem of improving energy utilization in the prior art and meet the heat dissipation requirements of data centers, which has become a problem that needs to be solved urgently by those skilled in the art. The embodiment of the present application also provides a gas-liquid mixed cooling method and a gas-liquid mixed refrigeration cabinet.
[0006] The present application provides a gas-liquid mixed cooling system, comprising:
[0007] A plurality of cabinets, each of which is provided with a heat source component;
[0008] A cooling module, comprising at least a cooling plate and an air cooling device, wherein the cooling plate can be in contact with the heat source component and is used to perform heat exchange on the heat source component; the air cooling device is arranged between the air outlet of the cabinet and the heat source component and is used to generate airflow to the heat source component and the air outlet;
[0009] A control module is used to obtain the first temperature information of the heat source component in each cabinet and the second temperature information of the corresponding cooling plate, control the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or control the rotation speed of each air cooling device according to the first temperature information and the second temperature information.
[0010] Optionally, controlling the temperature and flow rate of the coolant in the cooling plate according to the first temperature information and the second temperature information, and / or controlling the rotation speed of the air cooling device according to the first temperature information and the second temperature information includes:
[0011] Obtaining a correspondence between preset temperature information and a heat dissipation method, wherein the preset temperature information includes at least temperature information of the heat source component and temperature information of the cooling plate; the heat dissipation method includes a liquid cooling method, an air cooling method, and a combination of liquid cooling and air cooling;
[0012] Matching the first temperature information and the second temperature information with the preset temperature information, and determining a target heat dissipation mode according to a correspondence between the preset temperature information and the heat dissipation mode;
[0013] The temperature and flow rate of the coolant in the cooling plate are controlled according to the target heat dissipation mode, and / or the rotation speed of the air cooling device is controlled.
[0014] Optionally, the cooling module also includes a cold liquid circulation module, which is connected to each of the cooling plates through a liquid cooling pipeline; the control module controls the pump body and guide valve in the cold liquid circulation module to deliver circulating coolant to the corresponding cooling plate according to the first temperature information and the second temperature information.
[0015] Optionally, the cooling liquid circulation module also includes: a steam drainage pipe and a condensation channel; the steam drainage pipe is connected to the steam chamber of the cooling plate, and the condensation channel is connected to the connection between the steam drainage pipe and the liquid cooling pipeline, and is used to draw out the cooling liquid vapor formed after the cooling liquid in the cooling plate absorbs heat and changes its phase, and condense the cooling liquid vapor through the condensation channel and reflux it to the liquid cooling pipeline.
[0016] Optionally, the cooling liquid circulation module further includes: a purifier disposed on the steam drainage pipe to filter impurities from the two-phase cooling liquid formed by condensation.
[0017] Optionally, it also includes: a detection module, which is arranged in the cabinet, and is used to detect the first temperature information of the heat source component and the second temperature information of the cooling plate, as well as the flow information and flow rate information of the coolant circulating in the cold liquid circulation module, and feed back the first temperature information, the second temperature information, the flow information and the flow rate information to the control module.
[0018] Optionally, the air cooling device includes:
[0019] A radiator connected to the heat source component;
[0020] A fan is arranged at the air outlet of the cabinet and is used to generate airflow to the radiator and the air outlet.
[0021] The embodiment of the present application also provides a gas-liquid mixed cooling method, which uses the gas-liquid mixed cooling system described above, including:
[0022] Get the equipment information of the target cabinet;
[0023] Acquire first temperature information of a heat source component in the target cabinet and second temperature information of a corresponding cooling plate according to the device information of the target cabinet;
[0024] The temperature and flow rate of the coolant in the cooling plate are controlled according to the first temperature information and the second temperature information, and / or the rotation speed of the air cooling device is controlled according to the first temperature information and the second temperature information.
[0025] Optionally, controlling the temperature and flow rate of the coolant in the cooling plate according to the first temperature information and the second temperature information, and / or controlling the rotation speed of the air cooling device according to the first temperature information and the second temperature information includes:
[0026] Obtaining a correspondence between preset temperature information and a heat dissipation method, wherein the preset temperature information includes at least temperature information of the heat source component and temperature information of the cooling plate; the heat dissipation method includes a liquid cooling method, an air cooling method, and a combination of liquid cooling and air cooling;
[0027] Matching the first temperature information and the second temperature information with the preset temperature information, and determining a target heat dissipation mode according to a correspondence between the preset temperature information and the heat dissipation mode;
[0028] The temperature and flow rate of the coolant in the cooling plate are controlled according to the target heat dissipation mode, and / or the rotation speed of the air cooling device is controlled.
[0029] The embodiment of the present application also provides a gas-liquid mixed refrigeration cabinet, comprising:
[0030] A cooling plate, the cooling plate being in contact with a heat source component in the cabinet and being used for performing heat exchange on the heat source component;
[0031] An air cooling device, the air cooling device is arranged between the air outlet of the cabinet and the heat source component, and is used to generate airflow to the heat source component and the air outlet;
[0032] A cooling liquid circulation module is connected to each of the cooling plates through a liquid cooling pipeline. A pump body and a guide valve in the cooling liquid circulation module deliver circulating cooling liquid to the corresponding cooling plate.
[0033] Compared with the prior art, the embodiments of the present application have the following advantages:
[0034] An embodiment of the present application provides a gas-liquid mixed cooling system, comprising: a plurality of cabinets, each of which is provided with a heat source component; a cooling module, comprising at least a cooling plate and an air cooling device, the cooling plate being in contact with the heat source component for performing heat exchange on the heat source component; the air cooling device being arranged between an air outlet of the cabinet and the heat source component for generating an airflow to the heat source component and the air outlet; a control module, for obtaining first temperature information of the heat source component in each cabinet and second temperature information of the corresponding cooling plate, controlling the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or controlling the rotation speed of each air cooling device according to the first temperature information and the second temperature information.
[0035] The embodiment of the present application sets the cooling plate and the air cooling device at a position that can directly contact the heat source component in the cabinet, so that the cooling plate and the air cooling device can directly cool down the heat source component in the individual cabinet. Moreover, the control module can timely obtain the first temperature information of the heat source component in each cabinet and the second temperature information of the corresponding cooling plate, and control the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or control the rotation speed of each air cooling device according to the first temperature information and the second temperature information, so as to realize the reasonable operation of each cooling plate and each air cooling device, so as to ensure the accurate cooling of the heat source component in the corresponding cabinet, thereby improving the energy utilization rate while meeting the heat dissipation requirements of the data center.
[0036] Reference numerals:
[0037] Cabinet 10 , cooling module 20 , cooling plate 201 , air cooling device 202 , control module 30 , heat source component 40 . BRIEF DESCRIPTION OF THE DRAWINGS
[0038] Figure 1 It is a schematic diagram of a gas-liquid mixed cooling system provided in the first embodiment of the present application.
[0039] Figure 2 This is a flow chart of a gas-liquid mixed cooling method provided in the second embodiment of the present application.
[0040] Figure 3 A schematic structural diagram of a gas-liquid hybrid refrigeration cabinet provided in the third embodiment of the present application. DETAILED DESCRIPTION
[0041] Many specific details are described in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application, so the present application is not limited by the specific implementation disclosed below.
[0042] Servers are an important part of electronic devices and are mainly used to provide computing services. According to the types of services provided by the server, they are mainly divided into storage servers, file servers, database servers, application servers, web servers, etc. The main components of the server include the motherboard, processor, hard disk, memory, etc., which are similar to the general computer architecture.
[0043] In the era of big data, a large number of information technology equipment will be concentrated in data centers. These data centers contain various types of servers, storage, switches, a large number of cabinets 10 and other infrastructure. Traditional data centers use air cooling, but their energy utilization rate is low and does not meet the requirements of green development of the information industry. And when large data centers with high power density gradually become mainstream, conventional air cooling has been difficult to meet the ultra-high heat dissipation requirements of data centers due to their low heat dissipation limit.
[0044] Therefore, how to improve energy utilization and meet the heat dissipation needs of data centers has become an urgent problem to be solved by technical personnel in this field.
[0045] The present application is described in detail below through multiple embodiments and drawings.
[0046] First embodiment
[0047] The first embodiment of the present application provides a gas-liquid mixed cooling system as follows: Figure 1 The gas-liquid mixed cooling system is described in detail. Figure 1 It is a schematic diagram of a gas-liquid mixed cooling system provided in the first embodiment of the present application.
[0048] In this embodiment, the gas-liquid mixed cooling system includes: a plurality of cabinets 10, a cooling module 20 and a control module 30, wherein each cabinet 10 is provided with a heat source component, and the heat source component may include a motherboard, a processor, a hard disk, a memory, etc. The cooling module 20 includes at least a cooling plate and an air cooling device, wherein the cooling plate may contact the heat source component for heat exchange with the heat source component. The air cooling device is provided between the air outlet of the cabinet 10 and the heat source component, and is used to generate airflow to the heat source component and the air outlet. The control module 30 is used to obtain the first temperature information of the heat source component in each cabinet 10 and the second temperature information of the corresponding cooling plate, and control the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or control the rotation speed of each air cooling device according to the first temperature information and the second temperature information.
[0049] Specifically, in this embodiment, the cabinet 10 is an important part of the data center and the data supercomputing center, and multiple cabinets 10 are provided in the data center and the data supercomputing center. A heat source component may be installed in each cabinet 10, and the heat source component may include various components such as a motherboard, a processor, a hard disk, a memory, a computing software, a power supply, or a combination of several of the above components. In one example, the cabinet 10 can be set as a vertical cube structure, and a corresponding accommodation position for the heat source component is provided in the cabinet 10, and the heat source component is installed in the accommodation position accordingly. In one example, the front of the cabinet 10 is used for access to the heat source component, and the rear is used for wiring and pipelines. The front and rear parts of the cabinet 10 are arranged with a power supply unit and a data connection port to facilitate the power supply and data communication of the heat source component. The power supply unit is designed with a variety of redundancy and protection mechanisms to ensure stable operation of the system. The top or bottom of the cabinet 10 is provided with an interface for the entry and exit of the coolant. The internal space of the cabinet 10 is fully utilized to adapt to the installation and maintenance of the multi-cold plate structure. When the heat source component is working, it will generate a lot of heat, which will increase the temperature of the heat source component. This will not only affect the operating efficiency of the heat source component, but also cause application safety problems.
[0050] In this regard, the present embodiment is provided with a cooling module 20 in each cabinet 10, wherein the cooling module 20 includes at least a cooling plate and an air cooling device, and the cooling plate can contact the heat source component for heat exchange with the heat source component. In one example, the cooling plate is arranged above the heat source component, or the cooling plate is arranged below the heat source component, or the cooling plate is arranged at a relative position where the heat source component can have the largest contact area, so that the cooling plate can directly contact the heat source component to maximize heat conduction. In addition, microchannel technology is used inside the cooling plate to increase the contact area between the coolant and the cooling plate and enhance the heat exchange efficiency. In one example, the microchannel technology includes a multi-channel, that is, multiple channels are arranged inside the cooling plate, and the increase in channels can increase the contact area between the coolant and the cooling plate, thereby enhancing the heat exchange efficiency. In one example, the cooling pipe is made of a material with high thermal conductivity, such as copper or aluminum, or a graphene composite material, to ensure effective heat transfer.
[0051] In the present embodiment, the coolant in the cooling plate is a circulatory coolant to maintain the coolant in the cooling plate at a low temperature. In the present embodiment, in order to realize the circulation of the coolant in the cooling plate, the cooling module 20 also includes a cold liquid circulation module, wherein the cold liquid circulation module includes a liquid cooling pipeline, a pump body and a guide valve, and the cold liquid circulation module is connected to each cooling plate through a liquid cooling pipeline to transport the coolant in the cold liquid circulation module to the cooling plate. The liquid cooling pipeline includes a coolant output pipeline and a coolant return pipeline, the coolant output pipeline transports the coolant to the cooling plate, and the coolant return pipeline returns the coolant that has absorbed heat to the coolant accommodating cavity in the cold liquid circulation module. The coolant output pipeline, the cooling plate, the coolant return pipeline and the coolant accommodating cavity constitute a complete closed-loop coolant circulation system.
[0052] In one example, the coolant can be used as the refrigerant of the liquid-cooled server, that is, the coolant is directly provided to the liquid-cooled server as the refrigerant of the liquid-cooled server to cool the liquid-cooled server. In one example, the coolant of this embodiment can also be used in an air-cooled server, that is, the air-cooled server is cooled by a cooling plate.
[0053] In addition, in order to reasonably control the flow of the circulating coolant, the control module 30 controls the pump body and the guide valve in the cold liquid circulation module to deliver the circulating coolant to the corresponding cooling plate according to the first temperature information and the second temperature information. Specifically, the heat source component will generate heat during operation, that is, it will correspond to the first temperature information. After the coolant absorbs the heat of the cooling plate, the temperature of the cooling plate will also change, that is, it will correspond to the second temperature information. The control module 30 controls the pump body and the guide valve in the cold liquid circulation module to deliver the circulating coolant to the corresponding cooling plate according to the first temperature information and the second temperature information.
[0054] In this embodiment, the cold liquid circulation module also includes a steam drainage pipe and a condensation channel, wherein the steam drainage pipe is connected to the steam chamber of the cooling plate, and the condensation channel is connected to the steam drainage pipe and the coolant return pipe of the liquid cooling pipeline, which is used to draw out the coolant vapor formed after the coolant in the cooling plate absorbs heat and changes phase, and condenses the coolant vapor through the condensation channel and flows back to the liquid cooling pipeline. Specifically, the coolant in the cooling plate absorbs the heat of the heat source component and changes phase to form coolant vapor. The coolant vapor will contact the condensation channel during the rising process, and then be condensed by the condensation medium, and then flow back to the coolant return pipe after the phase change to form liquid coolant, thereby realizing the recycling of the coolant.
[0055] In this embodiment, the cooling liquid circulation module further includes: a purifier disposed on the steam drainage pipe to filter impurities from the two-phase cooling liquid formed by condensation.
[0056] In this embodiment, the air cooling device is arranged between the air outlet of the cabinet 10 and the heat source component, and is used to generate airflow to the heat source component and the air outlet. Specifically, the air cooling device includes a radiator and a fan, wherein the radiator is connected to the heat source component and is used to dissipate heat from the heat source component. The fan is arranged at the air outlet of the cabinet 10, and is used to generate airflow to the radiator and the air outlet, thereby leading the heat out of the cabinet 10, and reducing the overall temperature of the cabinet 10.
[0057] In one example, corresponding to the coolant vapor generated above, part of the coolant vapor is condensed by the condensation channel to form coolant, and the rest is converted by the driving mechanism of the fan or radiator into kinetic energy for driving the fan or radiator, thereby driving the fan or radiator to rotate. Since the rotational force of the fan or radiator comes from the coolant vapor, and the energy of the coolant vapor comes from the heat generated by the heat source components running in each cabinet 10, this embodiment reasonably utilizes the heat of the heat source components as kinetic energy, and there is no need to install additional components such as drive motors to drive the fan or radiator, nor is there any need to consume electricity to process the heat of the server through other refrigeration equipment. On the basis of achieving normal condensation of the two-phase coolant, it can reduce system energy consumption and improve energy utilization.
[0058] In one example, a fan can be disposed on the top of the cabinet 10. The fan on the top of the cabinet 10 assists cooling under low heat load conditions, reducing the work intensity of the pump body that transports the coolant, thereby saving energy. In addition, the speed of the fan can be automatically adjusted according to the temperature inside the system, maintaining uniform airflow circulation inside the cabinet 10, which helps maintain a balanced temperature of the components.
[0059] In this embodiment, in order to accurately obtain the first temperature information of the heat source component and the second temperature information of the cooling plate, it also includes: a detection module, the detection module is arranged in the cabinet 10, and is used to detect the first temperature information of the heat source component and the second temperature information of the cooling plate, and detect the flow information and flow rate information of the coolant circulating in the cold liquid circulation module, and feed back the first temperature information, the second temperature information, the flow information and the flow rate information to the control module 30.
[0060] In this embodiment, the control module 30 is a central cooling capacity distribution module, and the control module 30 is used to obtain the first temperature information of the heat source component in each cabinet 10 and the second temperature information of the corresponding cooling plate, and control the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or control the speed of each air cooling device according to the first temperature information and the second temperature information. Specifically, controlling the temperature and flow rate of the coolant in the cooling plate according to the first temperature information and the second temperature information, and / or controlling the speed of the air cooling device according to the first temperature information and the second temperature information, includes the following specific steps:
[0061] First, obtain the correspondence between the preset temperature information and the heat dissipation mode, wherein the preset temperature information at least includes the temperature information of the heat source component and the temperature information of the cooling plate, and the heat dissipation mode includes liquid cooling, air cooling, and a combination of liquid cooling and air cooling. In one example, in order to determine the correspondence between the preset temperature information and the heat dissipation mode, a large amount of temperature information of the heat source component and the temperature information of the cooling plate can be obtained first, and the correspondence between the temperature information of the heat source component, the temperature information of the cooling plate and the heat dissipation mode can be established. For example, if the temperature information of the heat source component is 10-30 degrees and the temperature information of the cooling plate is minus 5-0 degrees, the corresponding heat dissipation mode is air cooling; if the temperature information of the heat source component is 30-50 degrees and the temperature information of the cooling plate is 0-10 degrees, the corresponding heat dissipation mode is liquid cooling; if the temperature information of the heat source component is 50-70 degrees and the temperature information of the cooling plate is 10-15 degrees, the corresponding heat dissipation mode is a combination of liquid cooling and air cooling. After determining the correspondence between the preset temperature information and the heat dissipation mode, match the first temperature information and the second temperature information with the preset temperature information, and determine the target heat dissipation mode according to the correspondence between the preset temperature information and the heat dissipation mode. Finally, the temperature and flow rate of the coolant in the cooling plate are controlled according to the target heat dissipation mode, and / or the rotation speed of the air cooling device is controlled. For example, if the target heat dissipation mode is air cooling, the rotation speed of the air cooling device is controlled, and the pump body driving the coolant does not work; if the target heat dissipation mode is liquid cooling, the pump body driving the coolant is controlled to adjust the temperature and flow rate of the coolant in the cooling plate. If the target heat dissipation mode is a combination of liquid cooling and air cooling, the pump body driving the coolant is controlled to adjust the temperature and flow rate of the coolant in the cooling plate, and the rotation speed of the air cooling device is controlled. In this embodiment, the temperature and flow rate of the coolant, and the rotation speed of the air cooling device can be determined according to the first temperature information and the second temperature information.
[0062] Furthermore, in one example, the temperature and flow rate of the coolant in the cooling plate can be controlled according to the first temperature information, the second temperature information, the flow rate information, and the flow rate information, and / or the speed of the air cooling device can be controlled according to the first temperature information, the second temperature information, the flow rate information, and the flow rate information. The multi-dimensional information participation enables the control module 30 to predict the change of the thermal load of the system, automatically adjust the cooling strategy, and ensure that the system always operates in the best state.
[0063] The first embodiment of the present application provides a gas-liquid mixed cooling system, comprising: a plurality of cabinets 10, each of which is provided with a heat source component; a cooling module 20, comprising at least a cooling plate and an air cooling device, the cooling plate being in contact with the heat source component for performing heat exchange on the heat source component; the air cooling device being disposed between an air outlet of the cabinet 10 and the heat source component for generating an airflow to the heat source component and the air outlet; a control module 30, for obtaining first temperature information of the heat source component in each cabinet 10 and second temperature information of the corresponding cooling plate, controlling the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or controlling the rotation speed of each air cooling device according to the first temperature information and the second temperature information.
[0064] The embodiment of the present application sets the cooling plate and the air cooling device at a position where they can directly contact the heat source components in the cabinet 10, so that the cooling plate and the air cooling device can directly cool down the heat source components in the individual cabinets 10. Moreover, the control module 30 can timely obtain the first temperature information of the heat source components in each cabinet 10 and the second temperature information of the corresponding cooling plate, and control the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or control the rotation speed of each air cooling device according to the first temperature information and the second temperature information, so as to realize the reasonable operation of each cooling plate and each air cooling device, so as to ensure the accurate cooling down of the heat source components in the corresponding cabinet 10, thereby improving the energy utilization rate while meeting the heat dissipation requirements of the data center.
[0065] Second embodiment
[0066] In the above-mentioned first embodiment, a gas-liquid mixed cooling system is provided. Correspondingly, the second embodiment of the present application provides a gas-liquid mixed cooling method. The parts of this embodiment that are the same as those of the first embodiment will not be repeated here. Please refer to the corresponding parts in the first embodiment.
[0067] Please refer to Figure 2 , Figure 2 This is a flow chart of a gas-liquid mixed cooling method provided in the second embodiment of the present application.
[0068] Step S201: Obtain device information of a target cabinet.
[0069] The target cabinet is one of many cabinets in a data center or a data supercomputing center. In a data center or a data supercomputing center, each cabinet has corresponding equipment information, and the equipment information may include a cabinet number.
[0070] Step S202: acquiring first temperature information of a heat source component in the target cabinet and second temperature information of a corresponding cooling plate according to the device information of the target cabinet.
[0071] In this step, after the target cabinet is determined, the first temperature information of the heat source component in the target cabinet and the second temperature information of the corresponding cooling plate can be obtained. The first temperature information of the heat source component and the second temperature information of the cooling plate are detected by the detection module, and the first temperature information of the heat source component and the second temperature information of the cooling plate are fed back to the control module. In this embodiment, the heat source component may include various components such as a mainboard, a processor, a hard disk, a memory, a computing software, a power supply, or a combination of several of the above components.
[0072] Step S203: controlling the temperature and flow rate of the coolant in the cooling plate according to the first temperature information and the second temperature information, and / or controlling the rotation speed of the air cooling device according to the first temperature information and the second temperature information.
[0073] In this step, the air cooling device is also a device for cooling the heat source components in the cabinet. The air cooling device and the cooling plate in the cooling module cool the heat source components in the cabinet together. The air cooling device and the cooling plate cooperate with each other to make energy use reasonable, thereby improving energy utilization efficiency.
[0074] This step specifically includes the following steps: obtaining a correspondence between preset temperature information and a heat dissipation method, wherein the preset temperature information includes at least the temperature information of the heat source component and the temperature information of the cooling plate, and the heat dissipation method includes a liquid cooling method, an air cooling method, and a combination of liquid cooling and air cooling. In one example, in order to determine the correspondence between the preset temperature information and the heat dissipation method, a large amount of temperature information of the heat source component and the temperature information of the cooling plate can be first obtained, and a correspondence between the temperature information of the heat source component, the temperature information of the cooling plate and the heat dissipation method is established. For example, if the temperature information of the heat source component is 10-30 degrees and the temperature information of the cooling plate is minus 5-0 degrees, the corresponding heat dissipation method is air cooling; if the temperature information of the heat source component is 30-50 degrees and the temperature information of the cooling plate is 0-10 degrees, the corresponding heat dissipation method is liquid cooling; if the temperature information of the heat source component is 50-70 degrees and the temperature information of the cooling plate is 10-15 degrees, the corresponding heat dissipation method is a combination of liquid cooling and air cooling. After determining the correspondence between the preset temperature information and the heat dissipation mode, match the first temperature information and the second temperature information with the preset temperature information, and determine the target heat dissipation mode according to the correspondence between the preset temperature information and the heat dissipation mode. Finally, the temperature and flow rate of the coolant in the cooling plate are controlled according to the target heat dissipation mode, and / or the rotation speed of the air cooling device is controlled. For example, if the target heat dissipation mode is air cooling, the rotation speed of the air cooling device is controlled, and the pump body driving the coolant does not work; if the target heat dissipation mode is liquid cooling, the pump body driving the coolant is controlled to adjust the temperature and flow rate of the coolant in the cooling plate. If the target heat dissipation mode is a combination of liquid cooling and air cooling, the pump body driving the coolant is controlled to adjust the temperature and flow rate of the coolant in the cooling plate, and the rotation speed of the air cooling device is controlled. In this embodiment, the temperature and flow rate of the coolant, and the rotation speed of the air cooling device can be determined according to the first temperature information and the second temperature information.
[0075] Furthermore, in one example, the temperature and flow rate of the coolant in the cooling plate can be controlled according to the first temperature information, the second temperature information, the flow rate information, and the flow rate information, and / or the speed of the air cooling device can be controlled according to the first temperature information, the second temperature information, the flow rate information, and the flow rate information. The multi-dimensional information participation enables the control module to predict the thermal load changes of the system, automatically adjust the cooling strategy, and ensure that the system always operates in the best state.
[0076] The present embodiment provides a gas-liquid mixed cooling method, which achieves reasonable operation of each cooling plate and each air cooling device by obtaining first temperature information of a heat source component in each cabinet and second temperature information of a corresponding cooling plate, and controlling the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or controlling the rotation speed of each air cooling device according to the first temperature information and the second temperature information, so as to ensure accurate cooling of the heat source components in the corresponding cabinet, thereby improving energy utilization while meeting the heat dissipation needs of the data center.
[0077] Third embodiment
[0078] In the above-mentioned first embodiment, a gas-liquid mixed cooling system is provided. Correspondingly, the third embodiment of the present application provides a gas-liquid mixed refrigeration cabinet. Since the gas-liquid mixed refrigeration cabinet embodiment is basically similar to the first embodiment, the description is relatively simple. For the relevant parts, please refer to the partial description of the first embodiment. The embodiments described below are only exemplary.
[0079] Please refer to Figure 3 , Figure 3 A schematic structural diagram of a gas-liquid hybrid refrigeration cabinet provided in the third embodiment of the present application.
[0080] The gas-liquid hybrid refrigeration cabinet 10 includes: a cooling plate 201, an air cooling device 202 and a cold liquid circulation module, wherein the cooling plate 201 can contact the heat source component 40 in the cabinet 10, and is used to perform heat exchange on the heat source component 40. The air cooling device 202 is arranged between the air outlet of the cabinet 10 and the heat source component 40, and is used to generate airflow to the heat source component 40 and the air outlet. The cold liquid circulation module, the cold liquid circulation module is connected to each of the cooling plates 201 through a liquid cooling pipeline, and the pump body and the guide valve in the cold liquid circulation module convey circulating coolant to the corresponding cooling plate 201. The specific structure and working principle of each component of the cooling plate 201, the air cooling device 202 and the cold liquid circulation module refer to the description of the first embodiment above, and will not be repeated here.
[0081] Although the present application is disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field may make possible changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be based on the scope defined by the claims of the present application.
[0082] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.
[0083] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.
[0084] 1. Computer-readable media includes permanent and non-permanent, removable and non-removable media that can be used to store information by any method or technology. Information can be computer-readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include non-transitory media such as modulated data signals and carrier waves.
[0085] 2. Those skilled in the art should understand that the embodiments of the present application can be provided as methods, systems or computer program products. Therefore, the present application can take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware. Moreover, the present application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0086] It should be noted that the embodiments of the present application may involve the use of user data. In actual applications, user-specific personal data can be used in the scheme described herein within the scope permitted by applicable laws and regulations, subject to the requirements of applicable laws and regulations of the country where the user is located (for example, with the user's explicit consent, effective notification to the user, etc.).
[0087] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of the relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.
Claims
1. A gas-liquid mixed cooling system, characterized in that: include: A plurality of cabinets, each of which is provided with a heat source component; A cooling module, comprising at least a cooling plate and an air cooling device, wherein the cooling plate can be in contact with the heat source component and is used to perform heat exchange on the heat source component; the air cooling device is arranged between the air outlet of the cabinet and the heat source component and is used to generate airflow to the heat source component and the air outlet; A control module is used to obtain the first temperature information of the heat source component in each cabinet and the second temperature information of the corresponding cooling plate, control the temperature and flow rate of the coolant in each cooling plate according to the first temperature information and the second temperature information, and / or control the rotation speed of each air cooling device according to the first temperature information and the second temperature information.
2. The gas-liquid mixed cooling system according to claim 1, characterized in that: The controlling the temperature and flow rate of the coolant in the cooling plate according to the first temperature information and the second temperature information, and / or the controlling the rotation speed of the air cooling device according to the first temperature information and the second temperature information, comprises: Obtaining a correspondence between preset temperature information and a heat dissipation method, wherein the preset temperature information includes at least temperature information of the heat source component and temperature information of the cooling plate; the heat dissipation method includes a liquid cooling method, an air cooling method, and a combination of liquid cooling and air cooling; Matching the first temperature information and the second temperature information with the preset temperature information, and determining a target heat dissipation mode according to a correspondence between the preset temperature information and the heat dissipation mode; The temperature and flow rate of the coolant in the cooling plate are controlled according to the target heat dissipation mode, and / or the rotation speed of the air cooling device is controlled.
3. The gas-liquid mixed cooling system according to claim 1, characterized in that: The cooling module also includes a cold liquid circulation module, which is connected to each of the cooling plates through a liquid cooling pipeline; the control module controls the pump body and guide valve in the cold liquid circulation module to transport circulating coolant to the corresponding cooling plate according to the first temperature information and the second temperature information.
4. The gas-liquid mixed cooling system according to claim 3, characterized in that: The cooling liquid circulation module also includes: a steam drainage pipe and a condensation channel; the steam drainage pipe is connected to the steam chamber of the cooling plate, and the condensation channel is connected to the connection between the steam drainage pipe and the liquid cooling pipeline, and is used to draw out the cooling liquid vapor formed after the cooling liquid in the cooling plate absorbs heat and changes its phase, and condense the cooling liquid vapor through the condensation channel and reflux it to the liquid cooling pipeline.
5. The gas-liquid mixed cooling system according to claim 4, characterized in that: The cooling liquid circulation module further includes: a purifier disposed on the steam drainage pipe to filter impurities from the two-phase cooling liquid formed by condensation.
6. The gas-liquid mixed cooling system according to claim 3, characterized in that: Also includes: A detection module, wherein the detection module is arranged in the cabinet, and is used to detect the first temperature information of the heat source component and the second temperature information of the cooling plate, as well as the flow information and flow velocity information of the coolant circulating in the cold liquid circulation module, and feed back the first temperature information, the second temperature information, the flow information and the flow velocity information to the control module.
7. The gas-liquid mixed cooling system according to claim 1, characterized in that: The air cooling device comprises: A radiator connected to the heat source component; A fan is arranged at the air outlet of the cabinet and is used to generate airflow to the radiator and the air outlet.
8. A gas-liquid mixed cooling method, using the gas-liquid mixed cooling system according to claims 1 to 6, characterized in that: include: Get the equipment information of the target cabinet; Acquire first temperature information of a heat source component in the target cabinet and second temperature information of a corresponding cooling plate according to the device information of the target cabinet; The temperature and flow rate of the coolant in the cooling plate are controlled according to the first temperature information and the second temperature information, and / or the rotation speed of the air cooling device is controlled according to the first temperature information and the second temperature information.
9. The gas-liquid mixed cooling method according to claim 8, characterized in that: The controlling the temperature and flow rate of the coolant in the cooling plate according to the first temperature information and the second temperature information, and / or the controlling the rotation speed of the air cooling device according to the first temperature information and the second temperature information, comprises: Obtaining a correspondence between preset temperature information and a heat dissipation method, wherein the preset temperature information includes at least temperature information of the heat source component and temperature information of the cooling plate; the heat dissipation method includes a liquid cooling method, an air cooling method, and a combination of liquid cooling and air cooling; Matching the first temperature information and the second temperature information with the preset temperature information, and determining a target heat dissipation mode according to a correspondence between the preset temperature information and the heat dissipation mode; The temperature and flow rate of the coolant in the cooling plate are controlled according to the target heat dissipation mode, and / or the rotation speed of the air cooling device is controlled.
10. A gas-liquid mixed refrigeration cabinet, characterized in that: include: A cooling plate, the cooling plate being in contact with a heat source component in the cabinet and being used for performing heat exchange on the heat source component; An air cooling device, the air cooling device is arranged between the air outlet of the cabinet and the heat source component, and is used to generate airflow to the heat source component and the air outlet; A cooling liquid circulation module is connected to each of the cooling plates through a liquid cooling pipeline. A pump body and a guide valve in the cooling liquid circulation module deliver circulating cooling liquid to the corresponding cooling plate.