Efficient heat dissipation type perovskite reactor module packaging structure

Abstract

The invention provides an efficient heat dissipation type perovskite reactor module packaging structure, which relates to the field of electronic devices, and comprises a packaging base, a packaging frame, a packaging shell, a perovskite reactor, heat dissipation fins, a trigger sliding block, a packaging heat dissipation mechanism and a packaging stabilizing mechanism, the packaging frame is fixedly connected to the upper end face of the packaging base. The packaging shell is positioned on the upper sides of the packaging base and the packaging frame; the perovskite reactor is placed on the inner end face of the packaging frame; the heat dissipation fins are fixedly connected to the upper side of the packaging shell; the trigger sliding block is connected to the interior of the packaging frame in a sliding manner; the packaging heat dissipation mechanism is arranged on the packaging shell; and the packaging stabilizing mechanism is arranged in the packaging frame. Through the packaging heat dissipation mechanism, heat generated by the perovskite reactor is efficiently dissipated, and through the packaging stabilizing mechanism, the perovskite reactor is conveniently installed in the packaging base. The problem that packaging operation of an existing perovskite reactor module is tedious is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and in particular to a high-efficiency heat dissipation type perovskite reactor module packaging structure. Background Art

[0002] Perovskite has great application potential in solar cell applications. Perovskite is used in battery manufacturing and made into a perovskite reactor module. The perovskite reactor module can absorb photons to generate electrons. When the perovskite reactor module is in use, a packaging structure is needed to package the perovskite reactor module, and then the packaging structure is installed inside the solar cell to ensure the normal use of the perovskite reactor module.

[0003] According to CN201110446453.3, the present invention discloses a side packaging structure of an electronic module, comprising an upper substrate, a lower substrate and a sealing frame. The sealing frame is arranged around the periphery of the upper substrate and the lower substrate and forms an accommodating space with the upper substrate and the lower substrate. The main body of the sealing frame is composed of a silicone layer, thereby greatly improving the water-blocking effect of the external packaging structure and reducing the chance of water vapor penetrating into the interior of the electronic module through the side packaging structure. By virtue of the characteristics of silicone, the present invention can avoid damage from internal polar solvents or plasticizers.

[0004] However, the packaging structure is generally composed of an outer shell and a base. The heat sink structure on the packaging structure is generally installed on the outer shell to dissipate heat from the perovskite reactor module. When installing the perovskite reactor module on the packaging structure, the staff is required to first place the perovskite reactor module inside the base, then fix the perovskite reactor module inside the base, and then install the outer shell on the base to package the perovskite reactor module. The packaging operation of the perovskite reactor module is relatively cumbersome. Summary of the invention

[0005] In view of this, the present invention provides a high-efficiency heat dissipation perovskite reactor module packaging structure, which is convenient for workers to install the perovskite reactor inside the packaging base, improves the installation efficiency of the perovskite reactor, and ensures that the packaging structure dissipates high-efficiency heat for the perovskite reactor.

[0006] The invention provides a purpose and effect of an efficient heat dissipation type perovskite reactor module packaging structure, which specifically includes: a packaging base, a packaging frame, a packaging shell, a perovskite reactor, a heat dissipation fin, a trigger slider, a stabilizing slider, a packaging heat dissipation mechanism and a packaging stabilizing mechanism; the packaging frame is fixedly connected to the middle position of the upper end surface of the packaging base; the packaging shell is located on the upper side of the packaging base and the packaging frame, and the packaging shell is located on the outer side of the packaging frame; the perovskite reactor is placed on the inner end surface of the packaging frame; the heat dissipation fin is fixedly connected to the middle position of the upper side of the packaging shell, and the heat dissipation fin is located on the upper side of the perovskite reactor; the trigger slider is provided with two groups, and the two groups of trigger sliders are respectively slidably connected to the left and right sides of the inside of the packaging frame, and the upper sides of the two groups of trigger sliders are respectively slid on the left and right sides of the upper end surface of the packaging frame; the stabilizing slider is provided with two groups, and the two groups of stabilizing sliders are respectively slidably connected to the left and right sides of the inside of the packaging frame, and the two groups of stabilizing sliders are respectively slid on the left and right sides of the perovskite reactor; the packaging heat dissipation mechanism is arranged on the packaging shell; the packaging stabilizing mechanism is provided with two groups, and the two groups of packaging stabilizing mechanisms are respectively arranged on the left and right sides of the inside of the packaging frame.

[0007] Furthermore, the packaging heat dissipation mechanism includes: thermal grease and heat dissipation side holes; the upper side of the thermal grease is adhesively connected to the lower end surface of the heat dissipation fins, and the lower side of the thermal grease is adhesively connected to the upper end surface of the perovskite reactor, and the thermal grease is located between the heat dissipation fins and the perovskite reactor; the heat dissipation side holes are provided in a total of multiple groups, and the multiple groups of heat dissipation side holes are respectively opened in the middle position of the front and rear sides of the packaging frame and the packaging shell.

[0008] Furthermore, the packaging heat dissipation mechanism also includes: packaging screw holes and packaging bolts; the packaging screw holes are provided in four groups, and the four groups of packaging screw holes are respectively opened at the four corners of the packaging shell and the four corners inside the upper end surface of the packaging frame; the packaging bolts are provided in four groups, and the four groups of packaging bolts are respectively threadedly connected inside the four groups of packaging screw holes.

[0009] Furthermore, the packaging heat dissipation mechanism also includes: screw hole platforms; there are four groups of screw hole platforms, which are respectively opened at the four corners of the upper end surface of the packaging frame, and the four groups of screw hole platforms are respectively located on the upper sides of the four groups of packaging screw holes on the packaging frame, and the heads of the four groups of packaging bolts are respectively located inside the four groups of screw hole platforms.

[0010] Furthermore, the packaging stabilization mechanism includes: a trigger rack, a trigger shaft and a trigger gear; the trigger rack is fixedly connected to the lower side of the inner end surface of the trigger slider, and the trigger rack slides inside the packaging frame; the trigger shaft is rotatably connected to the inside of the packaging frame through a bearing seat; the trigger gear is coaxially fixedly connected to the rear side of the trigger shaft, and the trigger rack and the trigger gear are meshed to form a gear rack transmission mechanism.

[0011] Furthermore, the packaging stabilization mechanism also includes: a stabilizing gear and a stabilizing rack; the stabilizing gear is coaxially fixedly connected to the front side of the trigger shaft; the stabilizing rack is slidably connected inside the packaging frame, and the stabilizing rack is fixedly connected to the upper end surface of the stabilizing slider, and the stabilizing gear and the stabilizing rack are meshed together to form a gear and rack transmission mechanism.

[0012] Furthermore, the packaging stabilizing mechanism also includes: a stabilizing spring; the outer side of the stabilizing spring is fixedly connected to the inside of the packaging frame, and the inner side of the stabilizing spring is elastically connected to the stabilizing slider.

[0013] Furthermore, the packaging stabilization mechanism also includes: an extruded copper block, an extrusion spring and a thermally conductive gasket; the extruded copper block is slidably connected to the inner end surface of the stabilizing slider; the extrusion springs are provided in multiple groups, and the multiple groups of extrusion springs are respectively fixedly connected to the inside of the stabilizing slider, and the multiple groups of extrusion springs are respectively elastically connected to the outer end surface of the extruded copper block; the thermally conductive gasket is fixedly connected to the inner end surface of the extruded copper block, and the thermally conductive gasket slides on the outside of the perovskite reactor.

[0014] Furthermore, the packaging stabilization mechanism also includes: a connecting copper plate and a side heat sink; the connecting copper plate is fixedly connected to the front end surface of the stabilizing slider, and the connecting copper plate is slidably connected to the inside of the front end surface of the packaging frame; the side heat sink is fixedly connected to the front side of the packaging base, and the connecting copper plate slides on the rear side of the side heat sink.

[0015] Beneficial effect: The present invention adopts a packaging heat dissipation mechanism to realize packaging the perovskite reactor inside the packaging base and the packaging shell through packaging screw holes and packaging bolts. The heat dissipation fins and heat dissipation side holes are arranged on the upper side and front and rear sides of the perovskite reactor. The heat dissipation fins and heat dissipation side holes dissipate the heat on the upper side and front and rear sides of the perovskite reactor, ensuring efficient heat dissipation of the heat generated by the perovskite reactor and ensuring the efficiency of the perovskite reactor in generating electrons.

[0016] In addition, by adopting a packaging stabilization mechanism, when the perovskite reactor is installed in the packaging base and the packaging shell, the perovskite reactor is placed inside the packaging frame, and the packaging shell is directly installed on the packaging base, thereby driving the extruded copper block to slide. The extruded copper block slides to squeeze the perovskite reactor, ensuring the stability of the perovskite reactor inside the packaging base, avoiding the need for staff to manually fix the perovskite reactor inside the packaging base, making it convenient for staff to install the perovskite reactor inside the packaging base, and improving the installation efficiency of the perovskite reactor. At the same time, the side heat sink dissipates the heat on the left and right sides of the perovskite reactor, ensuring that the packaging structure dissipates high-efficiency heat from the perovskite reactor. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0018] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0019] In the attached picture: Figure 1 It is a schematic diagram of the front view of the module packaging structure of an embodiment of the present invention.

[0020] Figure 2 It is a structural schematic diagram of a rear view of a module packaging structure of an embodiment of the present invention.

[0021] Figure 3 It is a structural schematic diagram of the disassembly of the module packaging structure of an embodiment of the present invention.

[0022] Figure 4 It is a schematic diagram of the structure of the disassembled package base of an embodiment of the present invention.

[0023] Figure 5 It is a schematic diagram of the structure of the package shell of an embodiment of the present invention when viewed from below and disassembled.

[0024] Figure 6 It is a schematic structural diagram of a packaging heat dissipation mechanism according to an embodiment of the present invention.

[0025] Figure 7 It is a schematic diagram of the overall structure of the packaging stabilizing mechanism of an embodiment of the present invention.

[0026] Figure 8 It is a schematic structural diagram of the rear-side transmission of the packaging stabilizing mechanism of an embodiment of the present invention.

[0027] Fig. 9 It is a schematic diagram of the structure of the front side of the packaging stabilizing mechanism of an embodiment of the present invention being disassembled.

[0028] Reference numerals list 1. Package base; 2. Package frame; 3. Package shell; 4. Perovskite reactor; 5. Thermal grease; 6. Heat sink fins; 7. Heat sink side holes; 8. Package screw holes; 9. Package bolts; 10. Screw hole edge; 11. Trigger slider; 1101. Trigger rack; 12. Trigger shaft; 1201. Trigger gear; 1202. Stable gear; 13. Stable slider; 1301. Stable rack; 1302. Stable spring; 14. Extruded copper block; 1401. Extruded spring; 1402. Thermal pad; 15. Connecting copper sheet; 16. Side heat sink. DETAILED DESCRIPTION

[0029] Example 1: Please refer to Figures 1 to 6 As shown: The present invention provides a high-efficiency heat dissipation type perovskite reactor module packaging structure, comprising a packaging base 1, a packaging frame 2, a packaging shell 3, a perovskite reactor 4, a heat dissipation fin 6, a trigger slider 11, a stabilizing slider 13 and a packaging heat dissipation mechanism; the packaging frame 2 is fixedly connected to the middle position of the upper end surface of the packaging base 1; the packaging shell 3 is located on the upper side of the packaging base 1 and the packaging frame 2, and the packaging shell 3 is located on the outer side of the packaging frame 2; the perovskite reactor 4 is placed on the inner end surface of the packaging frame 2; the heat dissipation fin 6 is fixedly connected to the middle position of the upper side of the packaging shell 3, and the heat dissipation fin 6 is located on the upper side of the perovskite reactor 4; two groups of trigger sliders 11 are provided, and the two groups of trigger sliders 11 are respectively slidably connected to the left and right sides of the inside of the packaging frame 2, and the upper sides of the two groups of trigger sliders 11 are respectively slid on the left and right sides of the upper end surface of the packaging frame 2; two groups of stabilizing sliders 13 are provided, and the two groups of stabilizing sliders 13 are respectively slidably connected to the left and right sides of the inside of the packaging frame 2, and the two groups of stabilizing sliders 13 are respectively slid on the left and right sides of the perovskite reactor 4; the packaging heat dissipation mechanism is provided on the packaging shell 3.

[0030] The package heat dissipation mechanism includes: thermal grease 5 and heat dissipation side holes 7; the upper side of the thermal grease 5 is adhesively connected to the lower end surface of the heat dissipation fin 6, and the lower side of the thermal grease 5 is adhesively connected to the upper end surface of the perovskite reactor 4, and the thermal grease 5 is located between the heat dissipation fin 6 and the perovskite reactor 4; there are a total of multiple groups of heat dissipation side holes 7, and the multiple groups of heat dissipation side holes 7 are respectively opened in the middle position of the front and rear sides of the package frame 2 and the package shell 3. During use, when the package shell 3 is installed on the package base 1 and the package frame 2 When the perovskite reactor 4 is on the side, the thermal grease 5 adheres to the lower end surface of the heat sink fin 6, the packaging shell 3 moves to drive the thermal grease 5 and the heat sink fin 6 to move, the thermal grease 5 moves to the upper side of the perovskite reactor 4, the thermal grease 5 adheres to the upper end surface of the perovskite reactor 4, the heat sink fin 6 and the perovskite reactor 4 are connected through the thermal grease 5, when the perovskite reactor 4 dissipates heat, the heat on the upper side is quickly dissipated through the thermal grease 5 and the heat sink fin 6, and the heat dissipation side holes 7 disperse the heat on the front and back sides of the perovskite reactor 4.

[0031] Among them, the packaging heat dissipation mechanism also includes: packaging screw holes 8 and packaging bolts 9; there are four groups of packaging screw holes 8, which are respectively opened at the four corners of the packaging shell 3 and the four corners inside the upper end surface of the packaging frame 2; there are four groups of packaging bolts 9, which are respectively threadedly connected inside the four groups of packaging screw holes 8. During use, when the packaging shell 3 is fixed on the packaging base 1 and the upper side of the packaging frame 2, the movement of the packaging shell 3 drives the packaging screw holes 8 on the packaging shell 3 to move, the packaging shell 3 is placed on the packaging base 1 and the packaging frame 2, the packaging screw holes 8 on the packaging shell 3 are aligned with the packaging screw holes 8 on the packaging frame 2, and the packaging bolts 9 are installed inside the packaging screw holes 8, thereby connecting the packaging shell 3 and the packaging base 1 together.

[0032] Among them, the packaging heat dissipation mechanism also includes: screw hole platforms 10; there are four groups of screw hole platforms 10, and the four groups of screw hole platforms 10 are respectively opened at the four corners of the upper end surface of the packaging frame 2, and the four groups of screw hole platforms 10 are respectively located on the upper side of the four groups of packaging screw holes 8 on the packaging frame 2, and the heads of the four groups of packaging bolts 9 are respectively located inside the four groups of screw hole platforms 10. During use, when the packaging bolts 9 are installed inside the packaging screw holes 8, the heads of the packaging bolts 9 are driven to be located inside the screw hole platforms 10, so as to avoid the packaging bolts 9 being located outside the packaging shell 3 and affecting the installation of the packaging structure.

[0033] Specific usage and function of the first embodiment: During use of the present invention, when the packaging shell 3 is installed on the upper side of the packaging base 1 and the packaging frame 2, the thermal grease 5 adheres to the lower end surface of the heat sink fin 6, and the movement of the packaging shell 3 drives the thermal grease 5 and the heat sink fin 6 to move, and the thermal grease 5 moves to the upper side of the perovskite reactor 4, and the thermal grease 5 adheres to the upper end surface of the perovskite reactor 4, so that the heat sink fin 6 and the perovskite reactor 4 are connected through the thermal grease 5. When the perovskite reactor 4 dissipates heat, the heat on the upper side is quickly dissipated through the thermal grease 5 and the heat sink fin 6, and the heat dissipation side hole 7 disperses the heat on the front and rear sides of the perovskite reactor 4. When the packaging shell 3 is fixed on the upper side of the packaging base 1 and the packaging frame 2, the movement of the packaging shell 3 drives the packaging screw holes 8 on the packaging shell 3 to move. The packaging shell 3 is placed on the packaging base 1 and the packaging frame 2, the packaging screw holes 8 on the packaging shell 3 are aligned with the packaging screw holes 8 on the packaging frame 2, and the packaging bolts 9 are installed inside the packaging screw holes 8, thereby connecting the packaging shell 3 and the packaging base 1 together. When the packaging bolts 9 are installed inside the packaging screw holes 8, the heads of the packaging bolts 9 are driven to be located inside the screw hole platform 10, thereby avoiding the packaging bolts 9 being located outside the packaging shell 3 and affecting the installation of the packaging structure, thereby realizing the packaging and heat dissipation of the perovskite reactor 4.

[0034] Example 2: Based on Example 1, please refer to Figures 7 to 9 As shown: The present invention provides a high-efficiency heat dissipation type perovskite reactor module packaging structure, which also includes a packaging stabilizing mechanism. There are two groups of packaging stabilizing mechanisms, which are respectively arranged on the left and right sides of the packaging frame 2. The packaging stabilizing mechanism includes: a trigger rack 1101, a trigger shaft 12 and a trigger gear 1201; the trigger rack 1101 is fixedly connected to the lower side of the inner end surface of the trigger slider 11, and the trigger rack 1101 slides inside the packaging frame 2; the trigger shaft 12 is rotatably connected to the inside of the packaging frame 2 through a bearing seat; the trigger gear 1201 is coaxially fixedly connected to the rear side of the trigger shaft 12, and the trigger rack 1101 and the trigger gear 1201 are meshed to form a gear rack transmission mechanism. During use, when the packaging shell 3 is downwardly mounted on the packaging base 1, the packaging shell 3 slides downward to squeeze the trigger slider 11 to slide toward the inside of the packaging frame 2, the trigger slider 11 slides to drive the trigger rack 1101 to slide, the trigger rack 1101 slides to drive the meshed trigger gear 1201 to rotate, and the trigger gear 1201 rotates to drive the trigger shaft 12 to rotate.

[0035] Among them, the packaging stabilization mechanism also includes: a stabilizing gear 1202 and a stabilizing rack 1301; the stabilizing gear 1202 is coaxially fixedly connected to the front side of the trigger shaft 12; the stabilizing rack 1301 is slidably connected inside the packaging frame 2, and the stabilizing rack 1301 is fixedly connected to the upper end surface of the stabilizing slider 13. The stabilizing gear 1202 and the stabilizing rack 1301 are meshed to form a gear rack transmission mechanism. During use, the trigger shaft 12 rotates to drive the stabilizing gear 1202 to rotate, and the rotation of the stabilizing gear 1202 drives the meshing stabilizing rack 1301 to slide, and the sliding of the stabilizing rack 1301 drives the stabilizing slider 13 to slide.

[0036] Among them, the packaging stabilization mechanism also includes: a stabilizing spring 1302; the outer side of the stabilizing spring 1302 is fixedly connected to the inside of the packaging frame 2, and the inner side of the stabilizing spring 1302 is elastically connected to the stabilizing slider 13. During use, the sliding of the stabilizing slider 13 drives the stabilizing spring 1302 to expand and contract, and when the elastic force of the stabilizing spring 1302 contracts, it drives the stabilizing slider 13 to slide.

[0037] Among them, the packaging stabilizing mechanism also includes: an extruded copper block 14, an extruded spring 1401 and a thermally conductive gasket 1402; the extruded copper block 14 is slidably connected to the inner end surface of the stabilizing slider 13; there are multiple groups of extrusion springs 1401, multiple groups of extrusion springs 1401 are respectively fixedly connected to the inside of the stabilizing slider 13, and multiple groups of extrusion springs 1401 are respectively elastically connected to the outer end surface of the extruded copper block 14; the thermally conductive gasket 1402 is fixedly connected to the inner end surface of the extruded copper block 14, and the thermally conductive gasket 1402 slides on the outside of the perovskite reactor 4. During use, the stabilizing slider 13 slides The extruded copper block 14, the extruded spring 1401 and the thermally conductive gasket 1402 are driven to slide. When the thermally conductive gasket 1402 slides and squeezes the perovskite reactor 4, the thermally conductive gasket 1402 drives the extruded copper block 14 to slide into the stable slider 13. The extruded copper block 14 slides into the stable slider 13 and drives the extruded spring 1401 to be compressed, so that the extruded copper block 14 clamps the perovskite reactor 4 to ensure the stability of the perovskite reactor 4 inside the packaging frame 2. The heat generated on the left and right sides of the perovskite reactor 4 is absorbed and transmitted through the extruded copper block 14 and the thermally conductive gasket 1402.

[0038] Among them, the packaging stabilization mechanism also includes: a connecting copper sheet 15 and a side heat sink 16; the connecting copper sheet 15 is fixedly connected to the front end surface of the stabilizing slider 13, and the connecting copper sheet 15 is slidably connected to the inside of the front end surface of the packaging frame 2; the side heat sink 16 is fixedly connected to the front side of the packaging base 1, and the connecting copper sheet 15 slides on the rear side of the side heat sink 16. During use, the heat absorbed by the extruded copper block 14 and the thermal pad 1402 is transferred to the connecting copper sheet 15, and the heat on the connecting copper sheet 15 is then transferred to the position of the side heat sink 16 to disperse the heat, thereby allowing the perovskite reactor 4 to dissipate heat.

[0039] Specific usage and function of the second embodiment: During use of the present invention, when the packaging shell 3 is downwardly mounted on the packaging base 1, the packaging shell 3 slides downward to squeeze the trigger slider 11 to slide toward the inside of the packaging frame 2, and the sliding of the trigger slider 11 drives the sliding of the trigger rack 1101, and the sliding of the trigger rack 1101 drives the meshing trigger gear 1201 to rotate, and the rotation of the trigger gear 1201 drives the trigger shaft 12 to rotate, and the rotation of the trigger shaft 12 drives the stabilizing gear 1202 to rotate, and the rotation of the stabilizing gear 1202 drives the meshing stabilizing rack 1301 to slide, and the sliding of the stabilizing rack 1301 drives the sliding of the stabilizing slider 13, and the sliding of the stabilizing slider 13 drives the stabilizing spring 1302 to expand and contract, and when the elastic force of the stabilizing spring 1302 contracts, it drives the stabilizing slider 13 to slide, and the sliding of the stabilizing slider 13 drives the extrusion of the copper block 14, The compression spring 1401 and the thermally conductive gasket 1402 slide. When the thermally conductive gasket 1402 slides and squeezes the perovskite reactor 4, the thermally conductive gasket 1402 drives the extruded copper block 14 to slide into the inside of the stable slider 13. The extruded copper block 14 slides into the inside of the stable slider 13 to drive the extrusion spring 1401 to be compressed, so that the extruded copper block 14 clamps the perovskite reactor 4 to ensure the stability of the perovskite reactor 4 inside the packaging frame 2. The heat generated on the left and right sides of the perovskite reactor 4 is absorbed and transmitted by the extruded copper block 14 and the thermally conductive gasket 1402. The heat absorbed by the extruded copper block 14 and the thermally conductive gasket 1402 is transmitted to the connecting copper sheet 15. The heat on the connecting copper sheet 15 is then transmitted to the position of the side heat sink 16 to disperse the hot air, so that the perovskite reactor 4 dissipates heat, thereby achieving stable installation and heat dissipation of the perovskite reactor 4.

Claims

1. A high-efficiency heat dissipation perovskite reactor module packaging structure, comprising: A packaging base (1), a packaging frame (2), a packaging shell (3), a perovskite reactor (4), a heat sink fin (6), a trigger slider (11), a stabilizing slider (13), a packaging heat sink mechanism and a packaging stabilizing mechanism; the packaging frame (2) is firmly fixed to the center position of the upper end surface of the packaging base (1); it is characterized in that the packaging shell (3) is located above the packaging base (1) and the packaging frame (2), and is located on the outside of the packaging frame (2); the perovskite reactor (4) is placed on the inner end surface of the packaging frame (2); the heat sink fin (6) is fixedly connected to the middle position of the upper side of the packaging shell (3), and is located at the perovskite reactor (4); The trigger sliders (11) are provided in two groups, the two groups of trigger sliders (11) are respectively slidably connected to the left and right sides of the interior of the packaging frame (2), and the upper sides of the two groups of trigger sliders (11) slide respectively on the left and right sides of the upper end surface of the packaging frame (2); the stabilizing sliders (13) are provided in two groups, the two groups of stabilizing sliders (13) are respectively slidably connected to the left and right sides of the interior of the packaging frame (2), and the two groups of stabilizing sliders (13) slide respectively on the left and right sides of the perovskite reactor (4); the packaging heat dissipation mechanism is provided on the packaging shell (3); the packaging stabilizing mechanism is provided in two groups, the two groups of packaging stabilizing mechanisms are respectively provided on the left and right sides of the interior of the packaging frame (2).

2. The high-efficiency heat dissipation perovskite reactor module packaging structure according to claim 1, characterized in that: The package heat dissipation mechanism comprises: a thermally conductive silicone grease (5) and a heat dissipation side hole (7); the upper side of the thermally conductive silicone grease (5) is connected to the lower end surface of the heat dissipation fin (6) in an adhesive manner, the lower side of the thermally conductive silicone grease (5) is connected to the upper end surface of the perovskite reactor (4) in an adhesive manner, and the thermally conductive silicone grease (5) is located between the heat dissipation fin (6) and the perovskite reactor (4); a total of a plurality of groups of heat dissipation side holes (7) are provided, and the plurality of groups of heat dissipation side holes (7) are respectively opened at the middle positions of the front and rear sides of the package frame (2) and the package shell (3).

3. The high-efficiency heat dissipation perovskite reactor module packaging structure according to claim 1, characterized in that: The package heat dissipation mechanism further comprises: package screw holes (8) and package bolts (9); the package screw holes (8) are provided in four groups, and the four groups of package screw holes (8) are respectively opened at the four corners of the package shell (3) and the four corners inside the upper end surface of the package frame (2); the package bolts (9) are provided in four groups, and the four groups of package bolts (9) are respectively threadedly connected inside the four groups of package screw holes (8).

4. The high-efficiency heat dissipation type perovskite reactor module packaging structure as claimed in claim 3, characterized in that: The package heat dissipation mechanism further comprises: screw hole ledges (10); the screw hole ledges (10) are four in total, the four screw hole ledges (10) are respectively opened at four corners of the upper end surface of the package frame (2), and the four screw hole ledges (10) are respectively located on the upper sides of the four package screw holes (8) on the package frame (2), and the heads of the four package bolts (9) are respectively located inside the four screw hole ledges (10).

5. The high-efficiency heat dissipation perovskite reactor module packaging structure according to claim 1, characterized in that: The packaging stabilizing mechanism comprises: a trigger rack (1101), a trigger shaft (12) and a trigger gear (1201); the trigger rack (1101) is fixedly connected to the lower side of the inner end surface of the trigger slider (11), and the trigger rack (1101) slides inside the packaging frame (2); the trigger shaft (12) is rotatably connected inside the packaging frame (2) via a bearing seat; the trigger gear (1201) is coaxially fixedly connected to the rear side of the trigger shaft (12), and the trigger rack (1101) and the trigger gear (1201) are meshed to form a gear rack transmission mechanism.

6. The high-efficiency heat dissipation type perovskite reactor module packaging structure as claimed in claim 5, characterized in that: The packaging stabilization mechanism also includes: a stabilization gear (1202) and a stabilization rack (1301); the stabilization gear (1202) is coaxially fixedly connected to the front side of the trigger shaft (12); the stabilization rack (1301) is slidably connected to the inside of the packaging frame (2), the stabilization rack (1301) is fixedly connected to the upper end surface of the stabilization slider (13), and the stabilization gear (1202) and the stabilization rack (1301) are meshed to form a gear rack transmission mechanism.

7. The high-efficiency heat dissipation type perovskite reactor module packaging structure as claimed in claim 1, characterized in that: The packaging stabilizing mechanism further comprises: a stabilizing spring (1302); the outer side of the stabilizing spring (1302) is fixedly connected to the inside of the packaging frame (2), and the inner side of the stabilizing spring (1302) is elastically connected to the stabilizing slider (13).

8. The high-efficiency heat dissipation perovskite reactor module packaging structure according to claim 1, characterized in that: The packaging stabilizing mechanism further comprises: an extruded copper block (14), an extruded spring (1401) and a thermally conductive gasket (1402); the extruded copper block (14) is slidably connected to the inside of the inner end surface of the stabilizing slider (13); a plurality of groups of extrusion springs (1401) are provided, the plurality of groups of extrusion springs (1401) are respectively fixedly connected to the inside of the stabilizing slider (13), and the plurality of groups of extrusion springs (1401) are respectively elastically connected to the outer end surface of the extruded copper block (14); the thermally conductive gasket (1402) is fixedly connected to the inner end surface of the extruded copper block (14), and the thermally conductive gasket (1402) slides on the outside of the perovskite reactor (4).

9. The high-efficiency heat dissipation type perovskite reactor module packaging structure as claimed in claim 1, characterized in that: The packaging stabilizing mechanism further comprises: a connecting copper sheet (15) and a side heat sink (16); the connecting copper sheet (15) is fixedly connected to the front end surface of the stabilizing slider (13), and the connecting copper sheet (15) is slidably connected to the inside of the front end surface of the packaging frame (2); the side heat sink (16) is fixedly connected to the front side of the packaging base (1), and the connecting copper sheet (15) is slidably connected to the rear side of the side heat sink (16).

Images