Display panel, mask and preparation method of display panel

Abstract

The embodiment of the invention provides a display panel, a mask and a preparation method of the display panel, relates to the technical field of display, and can reduce the scratch risk of a metal wiring layer of the display panel. The display panel comprises a substrate, the substrate comprises a display area and a non-display area, and the non-display area at least partially surrounds the display area; the metal wiring layer is located on one side of the substrate, and the metal wiring layer is located in the non-display area; the first packaging layer comprises a first packaging structure and a second packaging structure, the first packaging structure is located on the side, away from the substrate, of the metal wiring layer, the second packaging structure and the metal wiring layer are located on the same side of the substrate, and the second packaging structure is located in the display area; the first packaging structure and the second packaging structure are connected, and the first packaging structure and the second packaging structure are arranged on the same layer; wherein the thickness of the first packaging structure is smaller than that of the second packaging structure.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of display technology, and in particular, to a display panel, a mask plate, and a method for manufacturing the display panel. Background Art

[0002] With the rapid development of display technology, the requirements for the reliability and stability of display panels are gradually increasing. In the traditional method of manufacturing a display panel, a first encapsulation layer is usually formed in the display area of ​​the display panel according to a mask by a process such as chemical vapor deposition.

[0003] However, in the actual preparation process, in order to improve the preparation efficiency, a grid-shaped mask is usually used to simultaneously prepare the first packaging layer of multiple display panels. As the number of openings and the opening area on the mask increase, the mask's own gravity will produce a certain amount of sinking, causing a certain degree of deformation. Therefore, when the mask is bonded to the substrate of the display panel, the sinking of the mask will cause the edge of the mask to contact the metal wiring in the non-display area of ​​the display panel, which will further cause scratches on the metal wiring, increase the risk of display defects such as short circuits on the display panel, affect the accuracy of the display image and the reliability and stability of the display panel, and affect the display effect of the display image and the display performance of the display panel. Summary of the invention

[0004] Based on this, the embodiments of the present application provide a display panel, a mask plate and a method for preparing a display panel, which can prevent the mask plate from scratching the metal wiring, and can prevent poor contact such as short circuits caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0005] According to a first aspect of an embodiment of the present application, a display panel is provided, comprising:

[0006] A substrate, the substrate comprising a display area and a non-display area, wherein the non-display area at least partially surrounds the display area;

[0007] A metal wiring layer, located on one side of the substrate, and the metal wiring layer is located in the non-display area;

[0008] A first packaging layer, comprising a first packaging structure and a second packaging structure, wherein the first packaging structure is located on a side of the metal wiring layer away from the substrate, the second packaging structure and the metal wiring layer are located on the same side of the substrate, and the second packaging structure is located in the display area, the first packaging structure and the second packaging structure are connected, and the first packaging structure and the second packaging structure are arranged on the same layer;

[0009] Wherein, the thickness of the first packaging structure is smaller than the thickness of the second packaging structure.

[0010] In some embodiments, the first packaging layer includes a packaging opening, the packaging opening is located in the non-display area, and the packaging opening exposes the metal wiring layer;

[0011] Preferably, a distance between an edge of the packaging opening and an edge of the second packaging structure is greater than 400 μm.

[0012] In some embodiments, an orthographic projection of a surface of the first packaging structure on a side away from the substrate on the substrate is located within an orthographic projection of a surface of the first packaging structure on a side close to the substrate on the substrate.

[0013] In some embodiments, the display panel further includes:

[0014] A planarization layer, located between the metal wiring layer and the first packaging layer;

[0015] The touch wiring layer is located on a side of the first packaging layer away from the substrate.

[0016] In some embodiments, the display panel further includes:

[0017] A second packaging layer, located between the metal wiring layer and the first packaging layer;

[0018] A third packaging layer is located between the second packaging layer and the metal wiring layer, wherein the first packaging layer, the second packaging layer and the third packaging layer are stacked in sequence along the thickness direction of the substrate;

[0019] Preferably, the first encapsulation layer and the third encapsulation layer include inorganic insulating materials, and the second encapsulation layer includes organic insulating materials.

[0020] In some embodiments, a ratio of the thickness of the first encapsulation structure to the thickness of the second encapsulation structure ranges from 20% to 50%;

[0021] Preferably, in the direction from the display area to the non-display area, the size of the first encapsulation structure is greater than 400 μm;

[0022] Preferably, the surface of the first packaging structure away from the substrate comprises a stepped surface and an arc-shaped surface;

[0023] Preferably, the material of the first encapsulation layer includes an inorganic material.

[0024] A second aspect of an embodiment of the present application provides a mask plate for preparing a first encapsulation layer of a display panel as described in any one of the first aspects above, the mask plate comprising:

[0025] First opening;

[0026] The first groove is connected to the first opening, and the depth of the first groove is smaller than the depth of the first opening.

[0027] In some embodiments, the mask further comprises:

[0028] a second groove, spaced apart from the first opening, and a depth of the second groove is smaller than a depth of the first opening;

[0029] Preferably, the first groove is used to form a first packaging structure of the display panel.

[0030] According to a third aspect of an embodiment of the present application, a method for preparing a display panel is provided, comprising:

[0031] A display panel is prepared by using the mask plate as described in any one of the second aspects above.

[0032] In some embodiments, the method for preparing the display panel includes:

[0033] The mask is arranged on a surface of one side of the substrate of the display panel, so that the opening of the first groove of the mask faces the substrate, wherein the orthographic projection of the first groove of the mask on the substrate overlaps with the orthographic projection of the metal wiring layer of the display panel on the substrate, and the mask and the metal wiring layer are located on the same side of the substrate;

[0034] According to the mask, a first packaging layer is formed on one side of the substrate, wherein the first packaging layer and the metal wiring layer are located on the same side of the substrate, the first packaging layer includes a first packaging structure and a second packaging structure, the first packaging structure is connected to the second packaging structure, the first packaging structure is formed in a first opening of the mask, and the second packaging structure is formed in a first groove of the mask;

[0035] removing the mask;

[0036] Preferably, when the first encapsulation layer includes an encapsulation opening and the mask includes a second groove, the step of arranging the mask on a side surface of the substrate of the display panel includes:

[0037] The mask is disposed on a surface of one side of a substrate of the display panel so that an opening of the second groove faces the substrate.

[0038] The embodiment of the present application provides a display panel, a mask plate and a method for preparing a display panel. By forming a first packaging structure on the side of the metal wiring layer away from the substrate, the first packaging structure can protect the metal wiring layer and reduce the risk of scratching the metal wiring layer. By forming a second packaging structure in the display area, external water vapor and oxygen can be prevented from entering the interior of the display panel. By setting the first packaging structure to be connected with the second packaging structure, the first packaging structure and the second packaging structure can be arranged on the same layer, so as to form the first packaging layer of the display panel in an integrated manner, and the first packaging structure in the non-display area can be prevented from being too high, thereby improving the packaging quality in the display area of ​​the display panel. Therefore, in the process of preparing the first packaging layer of the display panel through the mask plate, the thickness of the first packaging structure is less than the thickness of the second packaging structure. When the mask plate and the substrate of the display panel are relatively displaced, or when the mask plate sinks near the edge of the display area during the stretching process, the metal routing layer can be protected by the first packaging structure to prevent the mask plate from scratching the metal routing and reduce the risk of poor contact such as short circuit caused by scratches on the metal routing, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0040] Figure 1 A schematic structural diagram of a display panel provided in an embodiment of the present application;

[0041] Figure 2 A schematic top view of a display panel provided in an embodiment of the present application;

[0042] Figure 3 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0043] Figure 4 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0044] Figure 5 A schematic structural diagram of another display panel provided in an embodiment of the present application;

[0045] Figure 6 A schematic structural diagram of a mask provided in an embodiment of the present application;

[0046] Figure 7 A schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0047] Figure 8 A schematic structural diagram obtained by the step of setting a mask in a method for preparing a display panel provided in an embodiment of the present application;

[0048] Fig. 9 A schematic structural diagram of a step of forming a first encapsulation layer in a method for preparing a display panel provided in an embodiment of the present application;

[0049] Fig.10 A schematic structural diagram of a display panel obtained by a method for preparing a display panel provided in an embodiment of the present application.

[0050] Description of reference numerals:

[0051] 100, substrate; 101, display area; 102, non-display area; 200, metal routing layer; 300, first packaging layer; 301, second packaging layer; 302, third packaging layer; 310, first packaging structure; 320, second packaging structure; 330, packaging opening; 400, planarization layer; 500, touch routing layer; 1000, mask; 1001, first opening; 1002, first groove; 1003, second groove. DETAILED DESCRIPTION

[0052] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Preferred embodiments of the present invention are provided in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0053] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0054] In this document, spatially related terms such as "upper" and "lower" are defined with reference to the accompanying drawings. Therefore, it will be understood that "upper" and "lower" are used interchangeably. It will be understood that when a layer is referred to as being "on" another layer, it can be directly formed on the other layer, or intervening layers may also be present. Therefore, it will be understood that when a layer is referred to as being "directly on" another layer, there are no intervening layers interposed therebetween.

[0055] In the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as being "on" another layer or substrate, the layer or element may be directly on the other layer or substrate, or there may be an intermediate layer. In addition, it is also understood that when a layer is referred to as being "between" two layers, the layer may be the only layer between the two layers, or there may be one or more intermediate layers. In addition, the same reference numerals always represent the same elements.

[0056] Hereinafter, although terms such as "first", "second", etc. may be used to describe various components, these components are not necessarily limited to the above terms. The above terms are only used to distinguish one component from another component. It will also be understood that expressions used in the singular form include plural expressions, unless the expression in the singular form has a significantly different meaning in the context. In addition, in the following embodiments, it will also be understood that the terms "comprising" and / or "having" used herein illustrate the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0057] In the following embodiments, when a layer, region, or element is "connected", it can be interpreted that the layer, region, or element is not only directly connected but also connected through other constituent elements placed therebetween. For example, when a layer, region, element, etc. is described as being connected or electrically connected, the layer, region, element, etc. can be connected or electrically connected not only directly or directly, but also through another layer, region, element, etc. placed therebetween.

[0058] As used in the application documents, the term "and / or" includes any and all combinations of one or more of the related listed items. When a statement such as "at least one (one) of..." is placed after a list of elements (elements), it modifies the entire list of elements (elements), rather than modifying the individual elements (elements) in the list (elements).

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention pertains. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0060] It should also be understood that the terms “include / comprises” or “having” and the like specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0061] Electronic or electrical devices and / or any other related devices or components according to the embodiments of the inventive concepts described herein (e.g., a display device including a display panel and a display panel driver, wherein the display panel driver also includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver, and an emission driver) can be implemented using any appropriate hardware, firmware (e.g., a dedicated integrated circuit), software, or a combination of software, firmware, and hardware. For example, the various components of these devices may be formed on an integrated circuit (IC) chip or on separate IC chips. In addition, the various components of these devices may be implemented on a flexible printed circuit film, a tape carrier package (TCP), a printed circuit board (PCB), or formed on a substrate. In addition, the various components of these devices may be processes or threads that run on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. The computer program instructions are stored in a memory that can be implemented in a computing device using standard storage devices (e.g., such as random access memory (RAM). The computer program instructions can also be stored in other non-transitory computer-readable media (e.g., such as CD-ROMs, flash drives, etc.). Moreover, those skilled in the art should recognize that the functions of various computing devices can be combined or integrated into a single computing device, or the functions of a particular computing device can be distributed on one or more other computing devices without departing from the spirit and scope of the exemplary embodiments of the inventive concept.

[0062] Although exemplary embodiments of display modules and display devices including display modules have been specifically described herein, many modifications and variations will be apparent to those skilled in the art. Therefore, it will be understood that display modules and display devices including display modules constructed in accordance with the principles of the present invention may be implemented in addition to those specifically described herein. The present application is also defined in the claims and their equivalents.

[0063] With the rapid development of display technology, the requirements for the reliability and stability of display panels are gradually increasing. In the traditional method of manufacturing a display panel, a first encapsulation layer is usually formed in the display area of ​​the display panel according to a mask by a process such as chemical vapor deposition.

[0064] However, in the actual preparation process, in order to improve the preparation efficiency, a grid-shaped mask is usually used to simultaneously prepare the first encapsulation layer of multiple display panels. In the existing mask, the opening edge of the mask usually corresponds to the edge of the display area of ​​the display panel. Therefore, as the number of openings and the opening area on the mask increase, during the stretching process of the mask, due to the influence of its own gravity, the edge of the mask close to the display area is prone to sink to a certain extent. Further, when the mask is bonded to the substrate of the display panel, the sinking of the mask will cause the edge of the mask to contact the metal wiring in the non-display area of ​​the display panel, which will further cause scratches on the metal wiring. At the same time, for the first encapsulation layer grown by the chemical vapor deposition process, a certain temperature change will occur during the deposition process. Due to the different thermal expansion coefficients and heated areas of the substrate and the mask, the mask and the substrate will be relatively displaced during the deposition process. When the edge of the mask opening is relatively displaced toward the direction close to the metal trace, the mask will scratch the metal trace. When the edge of the mask opening is relatively displaced away from the metal trace, the metal trace may be exposed. When the organic first encapsulation layer is formed again on the surface of the first encapsulation layer, the scratch resistance of the organic encapsulation material is relatively weak, resulting in the inability of the organic first encapsulation layer to protect the metal trace, which increases the risk of scratches on the metal trace in the later stage of the process. Particles falling in the chamber will further aggravate the scratches caused by relative displacement. Therefore, traditional display panels are prone to display defects such as short circuits, which affect the accuracy of the displayed image, the reliability and stability of the display panel, and the display effect of the displayed image and the display performance of the display panel.

[0065] like Figure 1 As shown, in the first aspect of the embodiment of the present application, a display panel is provided, comprising: a substrate 100, a metal wiring layer 200 and a first packaging layer 300. The substrate 100 comprises a display area 101 and a non-display area 102, and the non-display area 102 at least partially surrounds the display area 101; the metal wiring layer 200 is located on one side of the substrate 100, and the metal wiring layer 200 is located in the non-display area 102; the first packaging layer 300 comprises a first packaging structure 310 and a second packaging structure 320, the first packaging structure 310 is located on the side of the metal wiring layer 200 away from the substrate 100, the second packaging structure 320 and the metal wiring layer 200 are located on the same side of the substrate 100, and the second packaging structure 320 is located in the display area 101, the first packaging structure 310 and the second packaging structure 320 are connected, and the first packaging structure 310 and the second packaging structure 320 are arranged in the same layer; the thickness of the first packaging structure 310 is less than the thickness of the second packaging structure 320.

[0066] like Figure 2As shown, the display panel includes a display area 101 and a non-display area 102, the non-display area 102 is arranged around the display area 101, and the metal wiring layer 200 is arranged around the display area 101. Exemplarily, the metal wiring layer 200 may include ESD (Electrostatic Discharge) wiring.

[0067] The display panel provided in the embodiment of the present application forms a first encapsulation structure 310 on a side of the metal wiring layer 200 away from the substrate 100, so that the first encapsulation structure 310 can protect the metal wiring layer 200 and reduce the risk of scratching the metal wiring layer 200. By forming a second encapsulation structure 320 in the display area 101, external water vapor and oxygen can be prevented from entering the interior of the display panel. By arranging the first encapsulation structure 310 and the second encapsulation structure 320 to be connected, the first encapsulation structure 310 and the second encapsulation structure 320 can be arranged on the same layer to facilitate the integrated formation of the first encapsulation layer 300 of the display panel, and the first encapsulation structure 310 in the non-display area 102 can be prevented from being too high, thereby improving the encapsulation quality in the display area 101 of the display panel. Therefore, in the process of preparing the first packaging layer 300 of the display panel through the mask, the thickness of the first packaging structure 310 is less than the thickness of the second packaging structure 320. When the mask and the substrate 100 of the display panel are relatively displaced, or when the edge of the mask near the display area 101 sinks during the stretching process, the metal wiring layer 200 can be protected by the first packaging structure 310 to prevent the mask from scratching the metal wiring and reduce the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0068] like Figure 1 As shown, in some feasible implementations, the first packaging layer 300 includes a packaging opening 330 , the packaging opening 330 is located in the non-display area 102 , and the packaging opening 330 exposes the metal wiring layer 200 .

[0069] Exemplarily, the package opening 330 may be prepared simultaneously with the first package structure 310 and the second package structure 320 .

[0070] The display panel provided in the embodiment of the present application, by setting a packaging opening 330, can facilitate the crimping of the metal wiring layer 200 exposed through the packaging opening 330 with other conductive structures, and at the same time can realize the integrated preparation of the first packaging layer 300, avoid opening the first packaging layer 300 to further increase the risk of scratching the metal wiring layer 200, and reduce the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0071] In some feasible implementations, a distance between an edge of the package opening 330 and an edge of the second package structure 320 is greater than 400 μm.

[0072] It should be noted that in the process of preparing the first packaging layer 300 through the mask, if the distance between the edge of the packaging opening 330 and the edge of the second packaging structure 320 is too small, the size of the mask will be too small, making the support strength of the mask between the second packaging structure 320 and the packaging opening 330 insufficient, further increasing the probability of sinking of the mask edge and increasing the risk of scratching the metal routing layer 200.

[0073] The display panel provided in the embodiment of the present application can improve the support strength of the mask plate, improve the stability during the packaging process, and further reduce the risk of poor contact such as short circuit caused by scratches on metal wiring, by setting the distance between the edge of the packaging opening 330 and the edge of the second packaging structure 320 to be greater than 400μm, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0074] like Figure 3 As shown, in some feasible implementations, the orthographic projection of the surface of the first packaging structure 310 away from the substrate 100 on the substrate 100 is located within the orthographic projection of the surface of the first packaging structure 310 close to the substrate 100 on the substrate 100 .

[0075] The display panel provided in the embodiment of the present application can improve the packaging quality of the second packaging structure 320 in the non-display area 102 of the display panel by reducing the surface area of ​​the first packaging structure 310 on the side away from the substrate 100, reduce the preparation cost of the first packaging structure 310, and improve the preparation efficiency of the first packaging layer 300.

[0076] In some feasible implementations, the orthographic projection of the first packaging structure 310 on the substrate 100 covers the orthographic projection of the metal routing layer 200 on the substrate 100 .

[0077] The display panel provided in the embodiment of the present application can further improve the protection capability of the first packaging structure 310 for the metal wiring layer 200 by completely covering the metal wiring layer 200 through the first packaging structure 310, and further reduce the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0078] like Figure 1 As shown, in some feasible implementations, the display panel further includes: a planarization layer 400 and a touch wiring layer 500. The planarization layer 400 is located between the metal wiring layer 200 and the first packaging layer 300; the touch wiring layer 500 is located on the side of the first packaging layer 300 away from the substrate 100.

[0079] The display panel provided in the embodiment of the present application can improve the surface flatness of the display panel by setting the planarization layer 400, improve the packaging quality of the first packaging layer 300, enhance the packaging effect, and at the same time protect the metal wiring layer 200, further reducing the risk of scratching the metal wiring layer 200. The touch wiring layer 500 can be provided to transmit the touch signal on the display panel to sense the user's touch operation, thereby improving the display performance of the display panel.

[0080] like Figure 4 As shown, in some feasible implementations, the display panel further includes: a second encapsulation layer 301 and a third encapsulation layer 302. The second encapsulation layer 301 is located between the metal wiring layer 200 and the first encapsulation layer 300; the third encapsulation layer 302 is located between the second encapsulation layer 301 and the metal wiring layer 200, and the first encapsulation layer 300, the second encapsulation layer 301 and the third encapsulation layer 302 are stacked in sequence along the thickness direction of the substrate 100.

[0081] Exemplarily, the thicknesses of the second encapsulation layer 301 and the third encapsulation layer 302 in the display area 101 and the non-display area 102 are equal.

[0082] The display panel provided in the embodiment of the present application includes a plurality of packaging layers stacked in sequence. By setting the first packaging layer 300 which is the longest distance from the substrate 100 to have a first packaging structure 310 and a second packaging structure 320, it is possible to avoid excessive difference in thickness between the total thickness of the packaging layers in the display area 101 and the total thickness of the packaging layers in the non-display area 102, thereby improving the surface flatness of the display panel and improving the packaging quality of the display panel.

[0083] In some feasible implementations, the first encapsulation layer 300 and the third encapsulation layer 302 include inorganic insulating materials, and the second encapsulation layer 301 includes organic insulating materials.

[0084] The display panel provided in the embodiment of the present application forms the third encapsulation layer 302 with an inorganic insulating material, which can prevent external water and oxygen from entering the interior of the display panel and avoid affecting the light-emitting elements, conductive structures, and transistors of the display panel. The second encapsulation layer 301 is formed with an organic insulating material, and a flexible encapsulation of the display panel can be formed. The first encapsulation layer 300 is formed with an inorganic insulating material, which can prevent external water vapor and oxygen from entering the second encapsulation layer 301. Thereby, the encapsulation quality of the display panel can be improved, the reliability, safety, and stability of the display panel can be improved, and the display effect of the display picture and the display performance of the display panel can be improved.

[0085] In some feasible implementations, a ratio of the thickness of the first encapsulation structure 310 to the thickness of the second encapsulation structure 320 ranges from 20% to 50%.

[0086] It should be noted that if the ratio of the thickness of the first encapsulation structure 310 to the thickness of the second encapsulation structure 320 is too large, the preparation cost of the first encapsulation structure 310 will increase, the preparation time of the first encapsulation structure 310 will be extended, and the preparation efficiency of the first encapsulation layer 300 will be affected. If the ratio of the thickness of the first encapsulation structure 310 to the thickness of the second encapsulation structure 320 is too small, when the mask is used to prepare the first encapsulation layer 300, the mask corresponding to the first encapsulation structure 310 is thicker and is prone to sinking under the action of its own gravity, resulting in a further increase in the risk of scratching the metal wiring layer 200.

[0087] The display panel provided in the embodiment of the present application can reduce the preparation cost of the first packaging structure 310, and at the same time can reduce the amount of sinking of the edge of the mask plate close to the display area 101 during the stretching process, thereby preventing the mask plate from scratching the metal wiring layer 200, and further reducing the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0088] In some feasible implementations, in the direction from the display area 101 to the non-display area 102 , the size of the first encapsulation structure 310 is greater than 400 μm.

[0089] It should be noted that in the process of preparing the first packaging layer 300 through the mask, in the direction from the display area 101 to the non-display area 102, the size of the first packaging structure 310 is too small, which will cause the size of the mask corresponding to the first packaging structure 310 to be too small, and there will be insufficient avoidance space for the metal routing layer 200, resulting in an increased risk of scratching the metal routing layer 200.

[0090] The display panel provided in the embodiment of the present application can improve the protection capability of the first packaging structure 310 for the metal wiring layer 200 by increasing the size of the first packaging structure 310, and further reduce the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0091] like Figure 4 and Figure 5 As shown, in some feasible implementations, the surface of the first packaging structure 310 away from the substrate 100 includes a stepped surface and a curved surface.

[0092] The display panel provided in the embodiment of the present application can reduce the weight of the mask plate and reduce the amount of sinking of the mask plate due to its own weight during the stretching process while preventing the mask plate from scratching the metal wiring layer 200 due to displacement by the side wall of the first packaging structure 310, thereby further suppressing the risk of the mask plate scratching the metal wiring layer 200, thereby improving the protective effect of the first packaging structure 310 on the metal wiring layer 200, avoiding poor contact such as short circuits caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0093] In some feasible implementations, the material of the first encapsulation layer 300 includes an inorganic material.

[0094] In the display panel provided in the embodiment of the present application, the inorganic material forms the first encapsulation layer 300, which can prevent external water and oxygen from entering the interior of the display panel and avoid affecting the light-emitting elements, conductive structures, transistors, etc. of the display panel. Thus, the encapsulation quality of the display panel can be improved, the reliability, safety, and stability of the display panel can be improved, and the display effect of the display picture and the display performance of the display panel can be improved.

[0095] like Figure 6 As shown, in a second aspect of the embodiment of the present application, a mask is provided for preparing a first encapsulation layer 300 of a display panel as described in any one of the first aspects. The mask 1000 includes: a first opening 1001 and a first groove 1002. The first groove 1002 is connected to the first opening 1001, and the depth of the first groove 1002 is less than the depth of the first opening 1001.

[0096] Exemplarily, the edge of the first opening 1001 coincides with the edge of the display area 101 of the display panel, and the first opening 1001 is used to form a second packaging structure 320 of the display panel. The second packaging structure 320 and the metal routing layer 200 of the display panel are located on the same side of the substrate 100 of the display panel, and the second packaging structure 320 is located in the display area 101.

[0097] The mask provided in the embodiment of the present application can form a second encapsulation structure 320 in the display area 101 through the first opening 1001, which can prevent external water vapor and oxygen from entering the interior of the display panel. The first encapsulation structure 310 can be formed on the side of the metal wiring layer 200 away from the substrate 100 through the first groove 1002, so that the first encapsulation structure 310 can protect the metal wiring layer 200 and reduce the risk of scratching the metal wiring layer 200. By setting the first encapsulation structure 310 to be connected with the second encapsulation structure 320, the first encapsulation structure 310 and the second encapsulation structure 320 can be set on the same layer, so as to form the first encapsulation layer 300 of the display panel in an integrated manner, and it can also avoid the first encapsulation structure 310 in the non-display area 102 from being too high, thereby improving the encapsulation quality in the display area 101 of the display panel. Therefore, in the process of preparing the first packaging layer 300 of the display panel through the mask plate 1000, the thickness of the first packaging structure 310 is less than the thickness of the second packaging structure 320. When the mask plate 1000 and the substrate 100 of the display panel are relatively displaced, or when the edge of the mask plate 1000 near the display area 101 sinks during the stretching process, the metal wiring layer 200 can be protected by the first packaging structure 310 to prevent the mask plate 1000 from scratching the metal wiring, thereby reducing the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0098] like Figure 6 As shown, in some feasible implementations, the mask 1000 further includes: a second groove 1003, which is spaced apart from the first opening 1001, and the depth of the second groove 1003 is less than the depth of the first opening 1001. The second groove 1003 is used to form a packaging opening 330 of the display panel.

[0099] The mask provided in the embodiment of the present application can form a mask on the metal wiring layer 200 through the second groove 1003 during the growth of the first packaging layer 300, and can directly form a packaging opening 330 during the integrated preparation of the first packaging layer 300, so as to facilitate the crimping of the metal wiring layer 200 exposed through the packaging opening 330 with other conductive structures. The risk of poor contact such as short circuit caused by scratches on the metal wiring can be further reduced, thereby improving the accuracy of the display image and the reliability and stability of the display panel, and improving the display effect of the display image and the display performance of the display panel.

[0100] In some feasible implementations, the first groove 1002 is used to form a first packaging structure 310 of the display panel.

[0101] The mask provided in the embodiment of the present application can form a first packaging structure 310 on the side of the metal wiring layer 200 away from the substrate 100 through the first groove 1002, so that the first packaging structure 310 can protect the metal wiring layer 200 and reduce the risk of scratching the metal wiring layer 200. When the mask 1000 and the substrate 100 of the display panel are relatively displaced, or when the edge of the mask 1000 near the display area 101 sinks during the meshing process, the metal wiring layer 200 can be protected by the first packaging structure 310 to prevent the mask 1000 from scratching the metal wiring, and reduce the risk of poor contact such as short circuit caused by scratching the metal wiring, thereby improving the accuracy of the display image and the reliability and stability of the display panel, and improving the display effect of the display image and the display performance of the display panel.

[0102] According to a third aspect of the embodiments of the present application, a method for manufacturing a display panel is provided, comprising: manufacturing a display panel using a mask plate 1000 as described in any one of the second aspects above.

[0103] The method for preparing a display panel provided in an embodiment of the present application can form a second encapsulation structure 320 in the display area 101 through the first opening 1001, which can prevent external water vapor and oxygen from entering the interior of the display panel. The first encapsulation structure 310 can be formed on the side of the metal wiring layer 200 away from the substrate 100 through the first groove 1002, so that the first encapsulation structure 310 can protect the metal wiring layer 200 and reduce the risk of scratching the metal wiring layer 200. By setting the first encapsulation structure 310 to be connected with the second encapsulation structure 320, the first encapsulation structure 310 and the second encapsulation structure 320 can be set on the same layer to facilitate the integrated formation of the first encapsulation layer 300 of the display panel, and it can also avoid the first encapsulation structure 310 in the non-display area 102 from being too high, thereby improving the encapsulation quality in the display area 101 of the display panel. Therefore, in the process of preparing the first packaging layer 300 of the display panel through the mask plate 1000, the thickness of the first packaging structure 310 is less than the thickness of the second packaging structure 320. When the mask plate 1000 and the substrate 100 of the display panel are relatively displaced, or when the edge of the mask plate 1000 near the display area 101 sinks during the stretching process, the metal wiring layer 200 can be protected by the first packaging structure 310 to prevent the mask plate 1000 from scratching the metal wiring, thereby reducing the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0104] like Figure 7 As shown, in some feasible implementations, a method for preparing a display panel includes:

[0105] Step S110, setting a mask plate on one side surface of the substrate of the display panel, so that the opening of the first groove of the mask plate faces the substrate, wherein the edge of the first opening of the mask plate corresponds to the edge of the display area of ​​the display panel, and the orthographic projection of the first groove of the mask plate on the substrate overlaps with the orthographic projection of the metal wiring layer of the display panel on the substrate, and the mask plate and the metal wiring layer are located on the same side of the substrate.

[0106] like Figure 8 As shown, the opening of the first groove 1002 of the mask 1000 faces the substrate 100 , wherein the edge of the first opening 1001 of the mask 1000 coincides with the edge of the display area 101 of the display panel.

[0107] Step S120: According to the mask, a first packaging layer is formed on one side of the substrate, wherein the first packaging layer and the metal routing layer are located on the same side of the substrate, the first packaging layer includes a first packaging structure and a second packaging structure, the first packaging structure is connected to the second packaging structure, the first packaging structure is formed in a first opening of the mask, and the second packaging structure is formed in a first groove of the mask.

[0108] like Fig. 9 As shown, according to the mask 1000 , the second packaging structure 320 is formed in the first opening 1001 , and the first packaging structure 310 is formed in the first cavity 1002 .

[0109] Step S130, removing the mask.

[0110] like Fig.10 As shown, the mask 1000 is removed to obtain a display panel.

[0111] The method for preparing a display panel provided in an embodiment of the present application, by directing the opening of the first groove 1002 toward the substrate, can enable the first packaging structure 310 formed according to the first groove 1002 to cover the surface of the metal wiring layer 200, and then the metal wiring layer 200 can be protected by the first packaging structure 310, so as to prevent the mask 1000 from scratching the metal wiring, and reduce the risk of poor contact such as short circuit caused by scratches on the metal wiring, thereby improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0112] In some feasible embodiments, when the first packaging layer 300 includes a packaging opening 330 and the mask plate 1000 includes a second groove 1003, the mask plate 1000 is set on a side surface of the substrate 100 of the display panel, including: setting the mask plate 1000 on a side surface of the substrate 100 of the display panel so that the opening of the second groove 1003 faces the substrate 100.

[0113] The method for preparing a display panel provided in an embodiment of the present application can make the second groove 1003 form a mask for the metal wiring layer 200 by directing the opening of the second groove 1003 toward the substrate 100, and can directly form a packaging opening 330 during the integrated preparation process of the first packaging layer 300, thereby improving the preparation efficiency of the display panel, improving the accuracy of the displayed image and the reliability and stability of the display panel, and improving the display effect of the displayed image and the display performance of the display panel.

[0114] It can be understood that the display device in the embodiments of the present application can be an OLED display device, a QLED display device, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, or any other product or component with a display function, and the embodiments disclosed in the present application are not limited to this.

[0115] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0116] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features of the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0117] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: A substrate, the substrate comprising a display area and a non-display area, wherein the non-display area at least partially surrounds the display area; A metal wiring layer, located on one side of the substrate, and the metal wiring layer is located in the non-display area; A first packaging layer, comprising a first packaging structure and a second packaging structure, wherein the first packaging structure is located on a side of the metal wiring layer away from the substrate, the second packaging structure and the metal wiring layer are located on the same side of the substrate, and the second packaging structure is located in the display area, the first packaging structure and the second packaging structure are connected, and the first packaging structure and the second packaging structure are arranged on the same layer; Wherein, the thickness of the first packaging structure is smaller than the thickness of the second packaging structure.

2. The display panel according to claim 1, characterized in that: The first packaging layer comprises a packaging opening, the packaging opening is located in the non-display area, and the packaging opening exposes the metal wiring layer; Preferably, a distance between an edge of the packaging opening and an edge of the second packaging structure is greater than 400 μm.

3. The display panel according to claim 1, characterized in that: An orthographic projection of a surface of the first packaging structure on a side away from the substrate on the substrate is located within an orthographic projection of a surface of the first packaging structure on a side close to the substrate on the substrate.

4. The display panel according to claim 1, characterized in that: Also includes: A planarization layer, located between the metal wiring layer and the first packaging layer; The touch wiring layer is located on a side of the first packaging layer away from the substrate.

5. The display panel according to claim 4, characterized in that: Also includes: A second packaging layer, located between the metal wiring layer and the first packaging layer; A third packaging layer is located between the second packaging layer and the metal wiring layer, wherein the first packaging layer, the second packaging layer and the third packaging layer are stacked in sequence along the thickness direction of the substrate; Preferably, the first encapsulation layer and the third encapsulation layer include inorganic insulating materials, and the second encapsulation layer includes organic insulating materials.

6. The display panel according to claim 1, characterized in that: A ratio of the thickness of the first packaging structure to the thickness of the second packaging structure is in a range of 20% to 50%; Preferably, in the direction from the display area to the non-display area, the size of the first encapsulation structure is greater than 400 μm; Preferably, the surface of the first packaging structure away from the substrate comprises a stepped surface and an arc-shaped surface; Preferably, the material of the first encapsulation layer includes an inorganic material.

7. A mask, characterized in that: For preparing the first encapsulation layer of the display panel according to any one of claims 1 to 6, the mask plate comprises: First opening; The first groove is connected to the first opening, and the depth of the first groove is smaller than the depth of the first opening.

8. The mask according to claim 7, characterized in that: Also includes: a second groove, spaced apart from the first opening, and a depth of the second groove is smaller than a depth of the first opening; Preferably, the first groove is used to form a first packaging structure of the display panel.

9. A method for preparing a display panel, characterized in that: include: A display panel is prepared by using the mask plate according to any one of claims 7 to 8.

10. The method for preparing a display panel according to claim 9, characterized in that: include: The mask is arranged on a surface of one side of the substrate of the display panel, so that the opening of the first groove of the mask faces the substrate, wherein the orthographic projection of the first groove of the mask on the substrate overlaps with the orthographic projection of the metal wiring layer of the display panel on the substrate, and the mask and the metal wiring layer are located on the same side of the substrate; According to the mask, a first packaging layer is formed on one side of the substrate, wherein the first packaging layer and the metal wiring layer are located on the same side of the substrate, the first packaging layer includes a first packaging structure and a second packaging structure, the first packaging structure is connected to the second packaging structure, the first packaging structure is formed in a first opening of the mask, and the second packaging structure is formed in a first groove of the mask; removing the mask; Preferably, when the first encapsulation layer includes an encapsulation opening and the mask includes a second groove, the step of arranging the mask on a side surface of the substrate of the display panel includes: The mask is disposed on a surface of one side of a substrate of the display panel so that an opening of the second groove faces the substrate.

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