TEC semiconductor refrigerator processing equipment

Abstract

The invention provides TEC semiconductor refrigerator processing equipment, which comprises a bottom fixing platform, an X-axis travel mechanism, a Y-axis travel mechanism, a Z-axis working mechanism and a working platform, and is characterized in that the bottom fixing platform is made of marble; the X-axis travel mechanism is fixedly connected to the bottom platform; the Y-axis stroke mechanism is connected to the X-axis stroke mechanism in a sliding mode, and the Y-axis stroke mechanism is perpendicular to the X-axis stroke mechanism. The Z-axis working mechanism is connected to the Y-axis stroke mechanism in a sliding mode, and the Z-axis working mechanism is perpendicular to the X-axis stroke mechanism and the Y-axis stroke mechanism. The working platform is fixedly connected to the bottom fixing platform, the working platform is arranged below the Z-axis working mechanism, and the Z-axis working mechanism works on materials on the working platform; a turnover mechanism is arranged on the working platform and used for turning over the first carrier plate to the position of the second carrier plate. Dispensing, material placing, overturning and upper and lower carrier plate connecting and placing can be completed on the same equipment, and the equipment integration degree is high.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing equipment, in particular to TEC semiconductor refrigerator processing equipment. Background Art

[0002] TEC semiconductor refrigerator (Thermo Electroctric Cooler) is made by using the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat.

[0003] The composition of TEC semiconductor cooler includes P-type semiconductor, N-type semiconductor, conductive metal and ceramic substrate for top and bottom temperature exchange. Therefore, the production of TEC semiconductor cooler is also to connect P-type semiconductor, N-type semiconductor and conductive metal between two ceramic substrates. In the existing production process of TEC semiconductor cooler, each process section is carried out by separate equipment, the production line occupies a long area, the complete process flow cannot be completed in a single device, and the matching degree between equipment and process is low. Summary of the invention

[0004] The invention provides a TEC semiconductor refrigerator processing device, which can complete the entire process in one device and improve the operation efficiency of the device.

[0005] To achieve the above-mentioned purpose, specifically, a TEC semiconductor refrigerator processing equipment includes a bottom fixed platform, an X-axis travel mechanism, a Y-axis travel mechanism, a Z-axis working mechanism and a working platform, wherein the bottom fixed platform is made of marble; the X-axis travel mechanism is fixedly connected to the bottom platform; the Y-axis travel mechanism is slidably connected to the X-axis travel mechanism, and the Y-axis travel mechanism is vertically arranged with the X-axis travel mechanism; the Z-axis working mechanism is slidably connected to the Y-axis travel mechanism, and the Z-axis working mechanism is vertical to both the X-axis travel mechanism and the Y-axis travel mechanism; the working platform is fixedly connected to the bottom fixed platform, and the working platform is arranged below the Z-axis working mechanism, and the Z-axis working mechanism works on the material on the working platform; a flipping mechanism is arranged on the working platform, and the flipping mechanism is used to flip the first carrier plate to the position of the second carrier plate.

[0006] Preferably, the X-axis travel mechanism includes two parallel and symmetrically arranged X-axis rails, the X-axis rails include an X-axis rail body, an X-axis limiter, an X-axis linear motor, an X-axis slide, an X-axis guide assembly and an X-axis measuring component, and the X-axis rail body is made of marble; the X-axis limiter is arranged at both ends of the X-axis rail body and is fixedly connected to the X-axis rail body; the X-axis linear motor is arranged on the X-axis rail body, and the permanent magnet of the X-axis linear motor is fixedly connected to the X-axis rail body along the direction of the X-axis rail body; the X-axis slide is arranged on the X-axis linear motor, and the X-axis linear motor drives the X-axis slide to perform linear motion along the X-axis rail body; the X-axis guide assembly includes an X-axis guide body and an X-axis motion assembly, the X-axis motion assembly is slidably connected to the X-axis guide body, and the X-axis motion assembly is fixedly connected to the X-axis slide; the X-axis measuring component is arranged on the X-axis rail body, and the X-axis measuring component is used to measure the specific position of the movement of the X-axis linear motor.

[0007] Preferably, the Y-axis travel mechanism includes a Y-axis track body, a Y-axis limiter, a Y-axis linear motor, a Y-axis slide, a Y-axis guide assembly and a Y-axis measuring component, and the Y-axis track body is made of marble; the Y-axis limiter is arranged at both ends of the Y-axis track body and is fixedly connected to the Y-axis track body; the Y-axis linear motor is arranged on the Y-axis track body, and the permanent magnet of the Y-axis linear motor is fixedly connected to the Y-axis track body along the direction of the Y-axis track body; the Y-axis slide is arranged on the Y-axis linear motor, and the Y-axis linear motor drives the Y-axis slide to perform linear motion along the Y-axis track body; the Y-axis guide assembly includes a Y-axis guide body and a Y-axis motion assembly, the Y-axis motion assembly is slidably connected to the Y-axis guide body, and the Y-axis motion assembly is fixedly connected to the Y-axis slide; the Y-axis measuring component is arranged on the Y-axis track body, and the Y-axis measuring component is used to measure the specific position of the movement of the Y-axis linear motor.

[0008] Preferably, the Z-axis working mechanism includes a mounting assembly, a material alignment assembly, a glue dispensing assembly, a suction assembly, a clamping assembly and a flipping alignment assembly. The mounting assembly is connected to the Y-axis stroke mechanism, and the Y-axis stroke mechanism drives the mounting assembly to move along the Y-axis direction; the material alignment assembly is fixedly connected to the mounting assembly, and the material alignment assembly is used to align the material to be aligned; the glue dispensing assembly is fixedly connected to the mounting assembly, and the glue dispensing assembly is used to dispense glue to the target carrier; the suction assembly is fixedly connected to the mounting assembly, and the suction assembly is used to suck the target carrier to the working position; the clamping assembly is fixedly connected to the mounting assembly, and the clamping assembly is used to clamp the material and place it on the target carrier; the flipping alignment assembly aligns the position of the carrier.

[0009] Preferably, the working platform includes a working platform base plate, a leveling component, a flipping component and a material placement component. The working platform base plate is arranged above the bottom fixed platform; the leveling component is arranged between the working platform base plate and the bottom fixed platform, and the leveling component is used to adjust the horizontality of the working platform base plate; the flipping component is arranged on the working platform base plate, and the flipping component is used to flip the designated substrate to a designated position; the material placement component is fixedly connected to the working platform base plate.

[0010] Preferably, the mounting assembly includes a first mounting assembly and a second mounting assembly, the first mounting assembly is connected to the Y-axis travel mechanism; the first mounting assembly includes a first mounting plate, a first mounting plate, a first motor and a first connecting member, the first mounting plate is connected to the Y-axis travel mechanism; the first mounting plate is connected to the first mounting plate; the first motor is fixedly connected to the surface of the first mounting plate facing away from the first mounting plate; the first connecting member is fixedly connected to the first mounting plate, and the first connecting member is fixedly connected to the second mounting assembly;

[0011] The second mounting assembly includes two second mounting plates, a second mounting plate, a second fixed plate and a third mounting plate, the second mounting plate is fixedly connected to the first connecting member; the second mounting plate is fixedly connected to the second mounting plate; the second fixed plate is fixedly connected to the second mounting plate and the second mounting plate; the third mounting plate is fixedly connected to the second mounting plate.

[0012] Preferably, the material alignment assembly includes an upper rough camera, an upper fine camera and a lower fine camera, the upper rough camera is fixedly connected to the first mounting plate; the upper fine camera is fixedly connected to the second mounting plate; the lower fine camera is arranged below the Z-axis working mechanism, the lower fine camera is connected to the bottom fixed platform, and the lower fine camera is arranged through the working platform.

[0013] Preferably, the dispensing assembly includes a dispensing motor, a dispensing connector and a dispensing machine, the dispensing motor is connected to the mounting assembly, the dispensing connector is fixedly connected to the output end of the dispensing motor, and the dispensing machine is fixedly connected to an end of the dispensing connector away from the dispensing motor.

[0014] Preferably, the suction assembly includes a suction motor, a first suction connector, a second suction connector and a suction head, the suction motor is connected to the mounting assembly, the first suction connector is fixedly connected to the output end of the suction motor, the second suction connector is fixedly connected to an end of the first suction connector away from the suction motor, the suction head is connected to the second suction connector, and the suction head is arranged toward the working platform.

[0015] Preferably, the flip assembly includes a flip axis, a flip rod, a first carrier plate placing component, a flip rod detection component, a fixed end, a second carrier plate placing component, a pressure sensor and a fixed end slide, the flip axis is arranged parallel to the working platform, the flip rod is fixedly connected to the flip axis, the flip axis drives the flip rod to rotate, the first carrier plate placing component is arranged at an end of the flip rod away from the flip axis, the flip rod detection component is arranged directly below the flip rod, the flip rod detection component is arranged on the working platform, the fixed end is arranged on the opposite side of the flip rod relative to the flip axis, the second carrier plate placing component is fixedly connected to the fixed end, the fixed end is arranged toward the Z-axis working mechanism, the pressure sensor is connected to the bottom of the fixed end, the fixed end slide is connected to the bottom of the pressure sensor, the fixed end slide is used to adjust the position of the fixed end, and the fixed end slide is connected to the bottom fixed platform.

[0016] Preferably, the clamping assembly includes a clamping rotating motor, a clamping connecting piece, a clamping head and a clamping measuring component. The clamping rotating motor is fixedly connected to the first mounting plate, the clamping connecting piece is connected to the clamping rotating motor, the clamping head is connected to the clamping connecting piece, the clamping rotating motor drives the clamping head to clamp, and the clamping measuring component is arranged between the clamping connecting piece and the clamping head, and the clamping measuring component is used to measure the rotation angle of the clamping head.

[0017] Preferably, the clamping head includes a clamping head piece and at least two clamping electromagnets, the clamping head piece is connected to the clamping connector, at least two clamping holes are provided on the clamping head piece, the clamping electromagnet is arranged in the clamping hole, the clamping electromagnet moves to clamp the material to be clamped into the clamping hole, and the number of the clamping electromagnets is the same as the number of the clamping holes and corresponds one to one.

[0018] The beneficial effects of the present invention include:

[0019] 1. One device can complete multiple processing steps, including dispensing, material placement, flipping and upper and lower board connections, with high equipment integration;

[0020] 2. The clamping components can clamp multiple materials at the same time, improving the operating efficiency of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a TEC semiconductor refrigerator manufacturing device according to an embodiment of the present invention;

[0022] Figure 2 is a first schematic diagram of an X-axis travel mechanism according to an embodiment of the present invention;

[0023] Figure 3 is a second schematic diagram of the X-axis travel mechanism according to an embodiment of the present invention;

[0024] Figure 4 Schematic diagram of a Y-axis travel mechanism according to an embodiment of the present invention;

[0025] Figure 5 This is a first schematic diagram of a Z-axis working mechanism according to an embodiment of the present invention;

[0026] Figure 6 A second schematic diagram of the Z-axis working mechanism of an embodiment of the present invention;

[0027] Figure 7 is a schematic diagram of a material alignment assembly according to an embodiment of the present invention;

[0028] Figure 8 Schematic diagram of a dispensing assembly, a suction assembly and a clamping assembly according to an embodiment of the present invention;

[0029] Fig. 9 is a schematic diagram of a clamping assembly according to an embodiment of the present invention;

[0030] Fig.10 is a schematic diagram of a clamping head according to an embodiment of the present invention;

[0031] Fig.11 is a first schematic diagram of a working platform according to an embodiment of the present invention;

[0032] Fig.12 is a second schematic diagram of a working platform according to an embodiment of the present invention;

[0033] In the figure: 1. Bottom fixed platform; 2. X-axis travel mechanism; 21. X-axis track body; 22. X-axis limiter; 23. X-axis linear motor; 24. X-axis slide; 25. X-axis guide assembly; 26. X-axis measurement component; 3. Y-axis travel mechanism; 31. Y-axis track body; 32. Y-axis limiter; 33. Y-axis linear motor; 34. Y-axis slide; 35. Y-axis guide assembly; 36. Y-axis measurement component; 4. Z-axis working machine Structure; 41, mounting assembly; 411, first mounting assembly; 4111, first mounting plate; 4112, first mounting plate; 4113, first motor; 4114, first connecting member; 412, second mounting assembly; 4121, second mounting plate; 4122, second mounting plate; 4123, second fixing plate; 4124, third mounting plate; 42, material alignment assembly; 421, upper rough camera; 422, upper fine camera; 423, Lower precision camera; 43, dispensing assembly; 431, dispensing motor; 432, dispensing connector; 433, dispensing machine; 44, suction assembly; 441, suction motor; 442, first suction connector; 443, second suction connector; 444, suction head; 45, clamping assembly; 451, clamping rotating motor; 452, clamping connector; 453, clamping head; 4531, clamping head piece; 45311, clamping hole; 4532, Clamping electromagnet; 454, clamping measurement component; 46, flip alignment component; 5, working platform; 51, working platform base plate; 52, leveling component; 53, flip component; 531, flip axis; 532, flip rod; 533, first carrier plate placement component; 534, flip rod detection component; 535, fixed end; 536, second carrier plate placement component; 537, pressure sensor; 538, fixed end slide; 54, material placement component. DETAILED DESCRIPTION

[0034] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. The described embodiments are only part of the embodiments of the present invention, but not all of the embodiments.

[0035] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0036] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

[0037] In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the numbering terms such as "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] Please refer to Figure 1 The present invention discloses a TEC semiconductor refrigerator processing equipment, comprising a bottom fixed platform 1, an X-axis travel mechanism 2, a Y-axis travel mechanism 3, a Z-axis working mechanism 4 and a working platform 5, wherein the bottom fixed platform 1 is made of marble, which is less sensitive to temperature and less affected by thermal expansion and contraction, and the TEC semiconductor refrigerator processing equipment will not be dislocated due to thermal expansion and contraction during operation. The X-axis travel mechanism 2 is fixedly connected to the bottom platform, the Y-axis travel mechanism 3 is slidably connected to the X-axis travel mechanism 2, and the Y-axis travel mechanism 3 is vertically arranged with the X-axis travel mechanism 2; the Z-axis working mechanism 4 is slidably connected to the Y-axis travel mechanism 3, and the Z-axis working mechanism 4 is vertical with both the X-axis travel mechanism 2 and the Y-axis travel mechanism 3; the working platform 5 is fixedly connected to the bottom fixed platform 1, and the working platform 5 is arranged below the Z-axis working mechanism 4, and the Z-axis working mechanism 4 works on the material on the working platform 5; a flipping mechanism is arranged on the working platform 5, and the flipping mechanism is used to flip the first carrier plate to the position of the second carrier plate.

[0040] The X-axis travel mechanism 2 and the Y-axis travel mechanism 3 drive the Z-axis working mechanism 4 to complete the relevant processes on the working platform 5, including material transfer and glue dispensing. At the same time, the Z-axis working mechanism 4 also monitors the processing process of the TEC semiconductor cooler, including visual monitoring, laser monitoring and other monitoring methods.

[0041] The various parts of the device disclosed in the present invention are described separately below to fully and clearly describe the technical solution disclosed in the present invention.

[0042] Please refer to Figure 2 and Figure 3 The X-axis travel mechanism 2 includes two parallel and symmetrically arranged X-axis rails, and the X-axis rails include an X-axis rail body 21, an X-axis stopper 22, an X-axis linear motor 23, an X-axis slide 24, an X-axis guide assembly 25, and an X-axis measuring component 26. The X-axis rail body 21 is arranged on the bottom fixed platform 1 and is fixedly connected to the bottom fixed platform 1. The X-axis rail body 21 is made of marble. The X-axis stopper 22 is arranged at both ends of the X-axis rail body 21 and is fixedly connected to the X-axis rail body 21. The X-axis linear motor 23 is arranged on the X-axis rail body 21, and the permanent magnet of the X-axis linear motor 23 is fixedly connected to the X-axis rail body 21 along the direction of the X-axis rail body 21. The X-axis slide 24 is arranged on the X-axis linear motor 23, and the X-axis linear motor 23 drives the X-axis slide to perform linear motion along the X-axis rail body 21. The X-axis rail assembly 25 includes an X-axis rail body and an X-axis motion assembly, the X-axis motion assembly is slidably connected to the X-axis rail body, and the X-axis motion assembly is fixedly connected to the X-axis slide 24. The X-axis measurement component 26 is arranged on the X-axis rail body 21, and the X-axis measurement component 26 is used to measure the specific position of the X-axis linear motor 23 movement.

[0043] The X-axis track is arranged in parallel on the bottom fixed platform 1. The X-axis track is arranged in parallel, which can evenly distribute the gravity of the structure carried by the X-axis travel mechanism 2 on the bottom fixed platform 1 to avoid the equipment from tilting or overturning during operation. Here, the specific method of fixing the X-axis track body 21 and the bottom fixed platform 1 is not limited. The X-axis track body 21 can be fixedly connected to the bottom fixed platform 1 by screws, or by various types of fixed connection methods such as welding, anchoring, mortise and tenon connection, gluing, etc. In order to ensure the stability of the connection between the X-axis track body 21 and the bottom fixed platform 1, the embodiment of the present invention uses screws to connect the X-axis track body 21 to the bottom fixed platform 1. The X-axis limiter 22 includes a rigid limiter plate and a limiter rod inserted on the limiter plate. The limiter rod and the limiter plate jointly limit the Y-axis travel mechanism 3 running on the X-axis track. The X-axis slide 24 is arranged on the X-axis guide assembly 25, and the X-axis slide 24 moves along the setting direction of the X-axis guide assembly 25. Due to the accuracy requirement, in this embodiment, the X-axis measuring component 26 adopts a grating ruler, and the detection accuracy of the grating ruler reaches the micron level. The X-axis measuring component 26 measures the running position of the X-axis slide 24 and the X-axis guide rail assembly 25.

[0044] Please refer to Figure 4The Y-axis travel mechanism 3 includes a Y-axis track body 31, a Y-axis stopper 32, a Y-axis linear motor 33, a Y-axis slide 34, a Y-axis guide assembly 35 and a Y-axis measuring component 36. The Y-axis track body 31 is arranged on the bottom fixed platform 1 and is fixedly connected to the bottom fixed platform 1. The Y-axis track body 31 is made of marble. The Y-axis stopper 32 is arranged at both ends of the Y-axis track body 31 and is fixedly connected to the Y-axis track body 31. The Y-axis linear motor 33 is arranged on the Y-axis track body 31, and the permanent magnet of the Y-axis linear motor 33 is fixedly connected to the Y-axis track body 31 along the direction of the Y-axis track body 31. The Y-axis slide 34 is arranged on the Y-axis linear motor 33, and the Y-axis linear motor 33 drives the Y-axis slide to perform linear motion along the Y-axis track body 31. The Y-axis guide assembly 35 includes a Y-axis guide body and a Y-axis motion assembly. The Y-axis motion assembly is slidably connected to the Y-axis guide body, and the Y-axis motion assembly is fixedly connected to the Y-axis slide 34. The Y-axis measuring component 36 is disposed on the Y-axis rail body 31 , and the Y-axis measuring component 36 is used to measure the specific position of the movement of the Y-axis linear motor 33 .

[0045] Here, the specific method of fixing the Y-axis track body 31 with the bottom fixed platform 1 is not limited. The Y-axis track body 31 can be fixedly connected to the bottom fixed platform 1 by screws, or by various types of fixed connection methods such as welding, anchoring, mortise and tenon connection, gluing, etc. In order to ensure the stability of the connection between the Y-axis track body 31 and the bottom fixed platform 1, the Y-axis track body 31 is connected to the bottom fixed platform 1 by screws in the embodiment of the present invention. The Y-axis limiter 32 includes a rigid limiter plate and a limiter rod inserted on the limiter plate. The limiter rod and the limiter plate jointly limit the Y-axis travel mechanism 3 running on the Y-axis track. The Y-axis slide 34 is set on the Y-axis guide assembly 35, and the Y-axis slide 34 moves along the setting direction of the Y-axis guide assembly 35. Due to the accuracy requirements, the Y-axis measurement component 36 in this embodiment adopts a grating ruler, and the detection accuracy of the grating ruler reaches the micron level. The Y-axis measurement component 36 measures the running position of the Y-axis slide 34 and the Y-axis guide assembly 35.

[0046] Please refer to Figure 5 The Z-axis working mechanism 4 includes a mounting component 41, a material alignment component 42, a dispensing component 43, a suction component 44, a clamping component 45 and a flipping alignment component 46.

[0047] Among them, the mounting component 41 is connected to the Y-axis travel mechanism 3, and the Y-axis travel mechanism 3 drives the mounting component 41 to move along the Y-axis direction. The material alignment component 42 is fixedly connected to the mounting component 41, and the material alignment component 42 is used to align the material to be aligned. The glue dispensing component 43 is fixedly connected to the mounting component 41, and the glue dispensing component 43 is used to dispense glue on the target carrier. The suction component 44 is fixedly connected to the mounting component 41, and the suction component 44 is used to suck the target carrier to the working position. The clamping component 45 is fixedly connected to the mounting component 41, and the clamping component 45 is used to clamp the material and place it on the target carrier, and the flip alignment component 46 aligns the position of the carrier.

[0048] The mounting component 41 is responsible for hanging the material alignment component 42, the dispensing component 43, the suction component 44, the clamping component 45 and the flipping alignment component 46 on the Y-axis travel mechanism 3. The Y-axis linear motor 33 drives the mounting component 41 to move and then drives other components to move to the corresponding positions. The suction component 44 sucks the first carrier plate and the second carrier plate from the material tray to the corresponding position. The dispensing component 43 is responsible for dispensing glue to the position where the column material will be placed on the first carrier plate and the second carrier plate. Then the clamping component 45 clamps the column material in another material tray to the dispensing position of the second carrier plate, and connects the column material to the second carrier plate. The flipping alignment component 46 aligns the first carrier plate to the corresponding position on the column material. The flipping alignment component 46 can be aligned before, during and after the first carrier plate is flipped, to ensure the relative position of the first carrier plate and the column material and the second carrier plate, to ensure that the dispensing position after the first carrier plate is flipped can be aligned and connected with the top of the column material, to ensure the performance of the TEC semiconductor refrigerator.

[0049] Please refer to Figure 6 Specifically, the mounting assembly 41 includes a first mounting assembly 411 and a second mounting assembly 412. The first mounting assembly 411 is connected to the Y-axis travel mechanism 3. The material alignment assembly 42, the dispensing assembly 43 and the suction assembly 44 are all fixedly connected to the first mounting assembly 411. The second mounting assembly 412 is connected to the flipping alignment assembly 46 and the clamping assembly 45.

[0050] The first mounting assembly 411 includes a first mounting plate 4111, a first mounting plate 4112, a first motor 4113 and a first connecting member 4114. The first mounting plate 4111 is connected to the Y-axis travel mechanism 3, and the first mounting plate 4112 is connected to the first mounting plate 4111. The first motor 4113 is fixedly connected to the surface of the first mounting plate 4112 that is away from the first mounting plate 4111, the first connecting member 4114 is fixedly connected to the first mounting plate 4112, and the first connecting member 4114 is fixedly connected to the second mounting assembly 412.

[0051] The first mounting plate 4111 is fixedly connected to the Y-axis guide rail assembly 35. The movement of the Y-axis guide rail assembly 35 drives the first mounting plate 4111 to move and then drives the entire Z-axis working mechanism 4 to move. The first motor 4113 is arranged perpendicular to the Y-axis guide rail assembly 35. The first motor 4113 drives the Z-axis working mechanism 4 to move as a whole in the Z-axis direction. The first mounting plate 4111 is fixedly connected to the first mounting plate 4112. A plurality of mounting holes are provided on the first mounting plate 4112. The mounting holes are used to connect the material alignment assembly 42, the dispensing assembly 43 and the suction assembly 44.

[0052] The second mounting assembly 412 includes two second mounting plates 4121, a second mounting plate 4122, a second fixing plate 4123 and a third mounting plate 4124. The second mounting plate 4121 is fixedly connected to the first connecting member 4114, the second mounting plate 4122 is fixedly connected to the second mounting plate 4121, the second fixing plate 4123 is fixedly connected to the second mounting plate 4122 and the second mounting plate 4121, and the third mounting plate 4124 is connected to the second mounting plate 4122.

[0053] The second mounting plate 4122 and the third mounting plate 4124 are both provided with mounting holes for installation, the clamping assembly 45 is fixedly connected to the second mounting plate 4122 through the mounting holes of the second mounting plate 4122, and the flip alignment assembly 46 is fixedly connected to the third mounting plate 4124 through the mounting holes provided on the third mounting plate 4124. In the embodiment of the present invention, in order to ensure that there is enough installation space for the clamping assembly 45 and the flip alignment assembly 46, and to prevent physical interference in the Y-axis direction during the operation of the device, the flip alignment assembly 46 and the clamping assembly 45 are arranged along the X-axis direction.

[0054] Please refer to Figure 7 The material alignment assembly 42 includes an upper rough camera 421, an upper fine camera 422 and a lower fine camera 423. The upper rough camera 421 is fixedly connected to the first mounting plate 4112, the upper fine camera 422 is fixedly connected to the second mounting plate 4122, the lower fine camera 423 is arranged below the Z-axis working mechanism 4, the lower fine camera 423 is connected to the bottom fixed platform 1, and the lower fine camera 423 is arranged through the working platform 5.

[0055] The upper coarse camera 421 has a large field of view and low recognition accuracy; the upper fine camera 422 and the lower fine camera 423 have a small field of view and high recognition accuracy. The upper coarse camera 421 is mainly used to roughly identify and locate the target within the field of view. After positioning, the upper fine camera 422 and the lower fine camera 423 are used to precisely locate and identify the target to ensure that the carrier is transferred to the corresponding position, the dispensing position is accurate, and the placement position of the column material is accurate.

[0056] Please refer to Figure 8The dispensing assembly 43 includes a dispensing motor 431, a dispensing connector 432 and a dispensing machine 433. The dispensing motor 431 is connected to the mounting assembly 41, the dispensing connector 432 is fixedly connected to the output end of the dispensing motor 431, and the dispensing machine 433 is fixedly connected to the end of the dispensing connector 432 away from the dispensing motor 431.

[0057] The dispensing motor 431 drives the dispensing machine 433 to move along the Z-axis direction. The dispensing motor 431 is set separately to ensure that other structures of the Z-axis working mechanism 4 will not physically interfere with the working platform 5 during the dispensing process.

[0058] The suction assembly 44 includes a suction motor 441, a first suction connection member 442, a second suction connection member 443 and a suction head 444. The suction motor 441 is connected to the mounting assembly 41, and the first suction connection member 442 is fixedly connected to the output end of the suction motor 441. The second suction connection member 443 is fixedly connected to an end of the first suction connection member 442 away from the suction motor 441, and the suction head 444 is connected to the second suction connection member 443, and the suction head 444 is arranged toward the working platform 5.

[0059] The suction motor 441 drives the suction head 444 to move along the Z-axis direction through the first suction connection member 442 and the second suction connection member 443. The suction motor 441 is set separately to ensure that other structures of the Z-axis working mechanism 4 will not physically interfere with the working platform 5 during the suction process.

[0060] Please refer to Fig. 9 and Fig.10 The clamping assembly 45 includes a clamping rotating motor 451, a clamping connecting piece 452, a clamping head 453 and a clamping measuring component 454. The clamping rotating motor 451 is fixedly connected to the first mounting plate 4112, the clamping connecting piece 452 is connected to the clamping rotating motor 451, the clamping head 453 is connected to the clamping connecting piece 452, the clamping rotating motor 451 drives the clamping head 453 to clamp, and the clamping measuring component 454 is arranged between the clamping connecting piece 452 and the clamping head 453, and the clamping measuring component 454 is used to measure the rotation angle of the clamping head 453. The clamping head 453 includes a clamping head piece 4531 and at least two clamping electromagnets 4532. The clamping head piece 4531 is connected to the clamping connector 452. At least two clamping holes 45311 are provided on the clamping head piece 4531. The clamping electromagnets 4532 are arranged in the clamping holes 45311. The clamping electromagnets 4532 move to clamp the material to be clamped into the clamping holes 45311. The number of clamping electromagnets 4532 is the same as the number of clamping holes 45311 and corresponds one to one.

[0061] In order to improve the clamping efficiency, a plurality of clamping holes 45311 are provided in the embodiment of the present invention, and a clamping electromagnet 4532 is provided in each clamping hole 45311. The embodiment of the present invention has ten clamping holes 45311 along the same direction, and a clamping electromagnet 4532 is provided in each clamping hole 45311 in a one-to-one correspondence. When clamping, the clamping hole 45311 moves downward to place the column material into the clamping hole 45311, and the electromagnet is energized to move toward the direction of the clamping hole 45311 to clamp the column material.

[0062] The working platform 5 includes a working platform base plate 41, a leveling component 52, a flipping component 53 and a material placement component 54. The working platform base plate 41 is arranged above the bottom fixed platform 1. The leveling component 52 is arranged between the working platform base plate 41 and the bottom fixed platform 1. The leveling component 52 is used to adjust the horizontality of the working platform base plate 41. The flipping component 53 is arranged on the working platform base plate 41. The flipping component 53 is used to flip the designated base plate to the designated position. The material placement component 54 is fixedly connected to the working platform base plate 41.

[0063] The leveling assembly 52 adjusts the horizontal position of the four corners of the working platform base plate 41 by setting a leveling motor under the four corners of the working platform base plate 41, thereby adjusting the horizontality of the working platform base plate 41. The material placement assembly 54 includes a carrier plate placement component and a column material placement component, the carrier plate placement component is used to place the carrier plate material, and the column material placement component is used to place the column material.

[0064] The flip assembly 53 includes a flip shaft 531, a flip rod 532, a first carrier plate placement component 533, a flip rod detection component 534, a second carrier plate placement component 536, a pressure sensor 537, and a fixed end slide 538. The flip shaft 531 is arranged parallel to the working platform 5, the flip rod 532 is fixedly connected to the flip shaft 531, and the flip shaft 531 drives the flip rod 532 to rotate. The first carrier plate placement component 533 is arranged at an end of the flip rod 532 away from the flip shaft 531, the flip rod detection component 534 is arranged directly below the flip rod 532, and the flip rod detection component 534 is arranged on the working platform 5. The fixed end 535 is arranged on the opposite side of the flip rod 532 relative to the flip axis 531, the second carrier plate placing component 536 is fixedly connected to the fixed end 535, the fixed end 535 is arranged toward the Z-axis working mechanism 4, the pressure sensor 537 is connected to the bottom of the fixed end 535, the fixed end slide 538 is connected to the bottom of the pressure sensor 537, the fixed end slide 538 is used to adjust the position of the fixed end 535, and the fixed end slide 538 is connected to the bottom fixed platform 1.

[0065] The flip rod detection component 534 detects the state of the flip rod 532 through laser. Before flipping, the laser emitted by the flip rod detection component 534 has a short stroke or is blocked. According to the detection result, the distance between the flip rod 532 and the flip rod detection component 534 can be judged, and then it can be determined whether the flip rod 532 is in the correct position.

[0066] Through the above technical solution, the embodiments of the present invention have at least the following positive technical effects:

[0067] 1. One device can complete multiple processing steps, including dispensing, material placement, flipping and upper and lower board connections, with high equipment integration;

[0068] 2. The clamping components can clamp multiple materials at the same time, improving the operating efficiency of the equipment.

Claims

1. TEC semiconductor refrigerator processing equipment, characterized in that: include: A bottom fixed platform (1), wherein the bottom fixed platform (1) is made of marble; An X-axis travel mechanism (2), the X-axis travel mechanism (2) being fixedly connected to the bottom platform; A Y-axis travel mechanism (3), wherein the Y-axis travel mechanism (3) is slidably connected to the X-axis travel mechanism (2), and the Y-axis travel mechanism (3) is vertically arranged with respect to the X-axis travel mechanism (2); A Z-axis working mechanism (4), wherein the Z-axis working mechanism (4) is slidably connected to the Y-axis travel mechanism (3), and the Z-axis working mechanism (4) is perpendicular to the X-axis travel mechanism (2) and the Y-axis travel mechanism (3); as well as A working platform (5), wherein the working platform (5) is fixedly connected to the bottom fixed platform (1), and the working platform (5) is arranged below the Z-axis working mechanism (4), and the Z-axis working mechanism (4) works on the material on the working platform (5); The working platform (5) is provided with a turning mechanism, which is used to turn the first carrier plate to the position of the second carrier plate.

2. The TEC semiconductor refrigerator processing equipment according to claim 1, characterized in that: The X-axis travel mechanism (2) comprises two parallel and symmetrically arranged X-axis tracks, wherein the X-axis tracks include: An X-axis track body (21), wherein the X-axis track body (21) is made of marble; X-axis stoppers (22), the X-axis stoppers (22) being arranged at two ends of the X-axis track body (21) and being fixedly connected to the X-axis track body (21); An X-axis linear motor (23), wherein the X-axis linear motor (23) is arranged on the X-axis track body (21), and a permanent magnet of the X-axis linear motor (23) is fixedly connected to the X-axis track body (21) along the direction of the X-axis track body (21); An X-axis slide table (24), wherein the X-axis slide table (24) is arranged on the X-axis linear motor (23), and the X-axis linear motor (23) drives the X-axis slide table to perform linear motion along the X-axis track body (21); An X-axis guide rail assembly (25), the X-axis guide rail assembly (25) comprising an X-axis guide rail body and an X-axis motion assembly, the X-axis motion assembly being slidably connected to the X-axis guide rail body, and the X-axis motion assembly being fixedly connected to the X-axis slide table (24); and An X-axis measuring component (26), wherein the X-axis measuring component (26) is arranged on the X-axis rail body (21), and the X-axis measuring component (26) is used to measure the specific position of the movement of the X-axis linear motor (23).

3. The TEC semiconductor refrigerator processing equipment according to claim 1, characterized in that: The Y-axis travel mechanism (3) comprises: A Y-axis track body (31), wherein the Y-axis track body (31) is made of marble; Y-axis stoppers (32), the Y-axis stoppers (32) being arranged at two ends of the Y-axis track main body and fixedly connected to the Y-axis track main body (31); A Y-axis linear motor (33), wherein the Y-axis linear motor (33) is arranged on the Y-axis track body (31), and a permanent magnet of the Y-axis linear motor (33) is fixedly connected to the Y-axis track body (31) along the direction of the Y-axis track body (31); A Y-axis slide (34), wherein the Y-axis slide (34) is arranged on the Y-axis linear motor (33), and the Y-axis linear motor (33) drives the Y-axis slide (34) to perform linear motion along the Y-axis track body (31); A Y-axis guide rail assembly (35), the Y-axis guide rail assembly (35) comprising a Y-axis guide rail body and a Y-axis motion assembly, the Y-axis motion assembly being slidably connected to the Y-axis guide rail body, and the Y-axis motion assembly being fixedly connected to the Y-axis slide table (34); as well as A Y-axis measuring component (36), wherein the Y-axis measuring component (36) is arranged on the Y-axis track body (31), and the Y-axis measuring component (36) is used to measure the specific position of the movement of the Y-axis linear motor (33).

4. The TEC semiconductor refrigerator processing equipment according to claim 3, characterized in that: The Z-axis working mechanism (4) comprises: A mounting assembly (41), wherein the mounting assembly (41) is connected to the Y-axis travel mechanism (3), and the Y-axis travel mechanism (3) drives the mounting assembly (41) to move along the Y-axis direction; A material alignment component (42), wherein the material alignment component (42) is fixedly connected to the mounting component (41), and the material alignment component (42) is used to align the material to be aligned; A glue dispensing component (43), the glue dispensing component (43) being fixedly connected to the mounting component (41), and the glue dispensing component (43) being used to dispense glue on a target carrier board; A suction component (44), the suction component (44) is fixedly connected to the mounting component (41), and the suction component (44) is used to suck the target carrier to a working position; a gripping assembly (45), the gripping assembly (45) being fixedly connected to the mounting assembly (41), the gripping assembly (45) being used to grip materials and place them on a target carrier; and A flip alignment component (46) is used to align the position of the carrier plate.

5. The TEC semiconductor refrigerator processing equipment according to claim 1, characterized in that: The working platform (5) comprises: A working platform substrate (51), wherein the working platform substrate (51) is arranged above the bottom fixed platform (1); A leveling component (52), the leveling component (52) being arranged between the working platform base plate (51) and the bottom fixed platform (1), the leveling component (52) being used to adjust the horizontality of the working platform base plate (51); A flipping assembly (53), wherein the flipping assembly (53) is arranged on the working platform substrate (51), and the flipping assembly (53) is used to flip a designated substrate to a designated position; and A material placement component (54), wherein the material placement component (54) is fixedly connected to the work platform base plate (51).

6. The TEC semiconductor refrigerator processing equipment according to claim 4, characterized in that: The mounting assembly (41) comprises a first mounting assembly (411) and a second mounting assembly (412), wherein the first mounting assembly (411) is connected to the Y-axis travel mechanism (3); The first mounting component (411) comprises: A first mounting plate (4111), wherein the first mounting plate (4111) is connected to the Y-axis travel mechanism (3); A first mounting plate (4112), wherein the first mounting plate (4112) is connected to the first mounting plate (4111); a first motor (4113), the first motor (4113) being fixedly connected to a surface of the first mounting plate (4112) facing away from the first mounting plate (4111); and A first connecting member (4114), wherein the first connecting member (4114) is fixedly connected to the first mounting plate (4112), and the first connecting member (4114) is fixedly connected to the second mounting assembly (412); The second mounting component (412) includes: Two second mounting plates (4121), wherein the second mounting plates (4121) are fixedly connected to the first connecting member (4114); A second mounting plate (4122), wherein the second mounting plate (4122) is fixedly connected to the second mounting plate (4121); a second fixing plate (4123), wherein the second fixing plate (4123) is fixedly connected to the second mounting plate (4122) and the second mounting plate (4121); and A third mounting plate (4124), wherein the third mounting plate (4124) is fixedly connected to the second mounting plate (4122).

7. The TEC semiconductor refrigerator processing equipment according to claim 6, characterized in that: The material alignment assembly (42) comprises: An upper coarse camera (421), wherein the upper coarse camera (421) is fixedly connected to the first mounting plate (4112); an upper precision camera (422), wherein the upper precision camera (422) is fixedly connected to the second mounting plate (4122); and A lower precision camera (423), wherein the lower precision camera (423) is arranged below the Z-axis working mechanism (4), the lower precision camera (423) is connected to the bottom fixed platform (1), and the lower precision camera (423) is arranged through the working platform (5).

8. The TEC semiconductor refrigerator processing equipment according to claim 4, characterized in that: The glue dispensing component (43) comprises: A glue dispensing motor (431), the glue dispensing motor (431) is connected to the mounting assembly (41); a glue dispensing connector (432), the glue dispensing connector (432) being fixedly connected to an output end of the glue dispensing motor (431); and A glue dispensing machine (433), wherein the glue dispensing machine (433) is fixedly connected to an end of the glue dispensing connecting piece (432) away from the glue dispensing motor (431).

9. The TEC semiconductor refrigerator processing equipment according to claim 4, characterized in that: The suction assembly (44) comprises: A suction motor (441), wherein the suction motor (441) is connected to the mounting assembly (41); A first suction connection member (442), wherein the first suction connection member (442) is fixedly connected to an output end of the suction motor (441); a second suction connection member (443), the second suction connection member (443) being fixedly connected to an end of the first suction connection member (442) away from the suction motor (441); and A suction head (444), the suction head (444) is connected to the second suction connecting piece (443), and the suction head (444) is arranged toward the working platform (5).

10. The TEC semiconductor refrigerator processing equipment according to claim 5, characterized in that: The flip assembly (53) comprises: A turning axis (531), wherein the turning axis (531) is arranged parallel to the working platform (5); A flip rod (532), wherein the flip rod (532) is fixedly connected to the flip shaft (531), and the flip shaft (531) drives the flip rod (532) to rotate; A first carrier plate placement component (533), the first carrier plate placement component (533) being arranged at an end of the flip rod (532) away from the flip axis (531); a flip rod detection component (534), wherein the flip rod detection component (534) is arranged directly below the flip rod (532), and the flip rod detection component (534) is arranged on the working platform (5); A fixed end (535), the fixed end (535) being arranged on the opposite side of the flip rod (532) relative to the flip axis (531); A second carrier plate placement component (536), the second carrier plate placement component (536) is fixedly connected to the fixed end (535), and the fixed end (535) is arranged toward the Z-axis working mechanism (4); a pressure sensor (537), the pressure sensor (537) being connected to the bottom of the fixed end (535); and A fixed end slide (538), the fixed end slide (538) is connected to the bottom of the pressure sensor (537), the fixed end slide (538) is used to adjust the position of the fixed end (535), and the fixed end slide (538) is connected to the bottom fixed platform (1).

11. The TEC semiconductor refrigerator processing equipment according to claim 6, characterized in that: The clamping assembly (45) comprises: A clamping rotating motor (451), wherein the clamping rotating motor (451) is fixedly connected to the first mounting plate (4112); A clamping connection member (452), wherein the clamping connection member (452) is connected to the clamping rotating motor (451); A clamping head (453), the clamping head (453) is connected to the clamping connection piece (452), and the clamping rotary motor (451) drives the clamping head (453) to clamp; and A clamping and measuring component (454), wherein the clamping and measuring component (454) is arranged between the clamping connecting piece (452) and the clamping head (453), and the clamping and measuring component (454) is used to measure the rotation angle of the clamping head (453).

12. The TEC semiconductor refrigerator processing equipment according to claim 11, characterized in that: The clamping head (453) comprises: A clamping head piece (4531), wherein the clamping head piece (4531) is connected to the clamping connector (452), and at least two clamping holes (45311) are formed on the clamping head piece (4531); At least two clamping electromagnets (4532) are provided in the clamping hole (45311). The clamping electromagnets (4532) move to clamp the material to be clamped into the clamping hole (45311). The number of the clamping electromagnets (4532) is the same as the number of the clamping holes (45311) and corresponds one to one.

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