Electronic device

Abstract

The invention discloses an electronic device. The electronic device comprises a first component, a second component and a connecting structure, the connecting structure comprises a first connector arranged on the first component and a second connector arranged on the second component, and the electronic device further comprises at least one vibration absorption structure, the vibration absorbing structure includes an elastic material disposed on the first member or the second member, in which the elastic material is compressed in a direction parallel to a direction in which the first connector and the second connector are connected to each other when the first member and the second member are connected through the connecting structure, and the elastic material is compressed in a direction parallel to a direction in which the first connector and the second connector are connected to each other. In this way, a damped connection is established between the first component and the second component. The electronic device can realize good vibration absorption performance, low cost and high durability.

Description

Technical Field

[0001] The present disclosure relates generally to electronic devices, and more particularly, to an electronic device having a vibration absorbing structure. Background Art

[0002] This section introduces aspects that may help to better understand the present disclosure. Therefore, the statements in this section should be read in this light and should not be understood as an admission of content in the prior art or content that does not exist in the prior art.

[0003] In an electronic device, different components of the electronic device usually need to be connected through a connection structure to establish mechanical and electrical connections between the different components. The connection structure usually includes a plurality of connectors arranged on different components of the electronic device and connectable to each other. For example, a first connector arranged on a first component of the electronic device and a second connector arranged on a second component of the electronic device.

[0004] During the operation of electronic devices, vibration often occurs. For example, forced air cooling is widely used in electronic devices. Many types of electronic devices use fans to enhance heat dissipation. Fans are usually arranged in fan trays. Fan trays usually integrate several fans, control boards, connectors and mechanical components. Fan trays are usually designed to be installed on specific electronic devices. When the fan tray is assembled with the electronic device, a mechanical and electrical connection is usually established between the fan tray and the chassis of the electronic device through a connecting structure, which includes a first connector provided on the fan tray and a second connector provided on the chassis. During operation, the rotor of the fan keeps rotating, and the rotation of the rotor inevitably causes vibration. Vibration is destructive to electronic devices. It may cause deformation or cracking of components, loosening of fasteners, fracture of interconnections, etc. The most common failure is fracture of interconnections caused by wear of the connecting structure.

[0005] Researchers have done quite a bit of research on connector failure mechanisms. They concluded that in electronic connectors, fretting (relative micro-movement between mating connectors) leads to fretting wear (wear through surface plating), which further leads to fretting corrosion (production of highly resistive corrosion products in the contact interface). When fretting corrosion reaches a certain level, the interconnection between the connectors fails. Vibrations can cause the two mating connectors to move relative to each other, which is a source of fretting motion. Fretting motion can be very small, in the thousandths of an inch range, and can be very destructive to the fretting surfaces. Summary of the invention

[0006] This summary is provided to introduce some selected concepts in a simplified form, which are further described in the detailed description below. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0007] An object of the present disclosure is to provide an electronic device capable of achieving good vibration absorption performance, low cost, and high durability.

[0008] According to a first aspect of the present disclosure, there is provided an electronic device, comprising a first component, a second component and a connection structure, wherein the connection structure comprises a first connector arranged on the first component and a second connector arranged on the second component, and the electronic device further comprises at least one vibration absorbing structure, wherein the vibration absorbing structure comprises an elastic material arranged on the first component or the second component, wherein when the first component and the second component are connected via the connection structure, the elastic material is compressed in a direction parallel to a direction in which the first connector and the second connector are connected to each other, so that a damping connection is established between the first component and the second component.

[0009] In an embodiment of the present disclosure, when the first component and the second component are connected by the connection structure, the elastic material does not generate a force that causes the first connector and the second connector to deviate from a mating position in a direction other than a direction in which the first connector and the second connector are connected to each other.

[0010] In an embodiment of the present disclosure, before the elastic material is compressed, the surface of the elastic material is flat, concave or convex.

[0011] In an embodiment of the present disclosure, the elastic material is rubber, silicone, latex, plastic, sponge or spring.

[0012] In an embodiment of the present disclosure, the vibration absorbing structure includes a first component arranged on one of the first component and the second component and a second component arranged on the other of the first component and the second component, the first component includes the elastic material, and the second component is configured to compress the elastic material when the first component and the second component are connected by the connecting structure.

[0013] In an embodiment of the present disclosure, the first component is a retaining sleeve, the elastic material is arranged inside and at the bottom of the retaining sleeve; and the second component is a guide pin, the end of which compresses the elastic material when the first component and the second component are connected by the connecting structure.

[0014] In an embodiment of the present disclosure, the elastic material is pressed to the bottom of the retaining sleeve and is self-retained; or the elastic material is adhered to the bottom of the retaining sleeve by glue.

[0015] In an embodiment of the present disclosure, the first component is an anti-vibration block made of the elastic material; and the second component is one of a guide pin and a retaining sleeve, and the end of the guide pin or the retaining sleeve compresses the anti-vibration block when the first component and the second component are connected by the connecting structure.

[0016] In an embodiment of the present disclosure, the first component is an anti-vibration block made of the elastic material; the second component is a protrusion having a contact plane, and when the first component and the second component are connected by the connecting structure, the contact plane of the protrusion compresses the anti-vibration block.

[0017] In an embodiment of the present disclosure, the first connector and one of the first component and the second component are arranged on the same side of the first component; and the second connector and the other of the first component and the second component are arranged on the same side of the second component.

[0018] In one embodiment of the present disclosure, one of the first component and the second component is a backplane of a chassis, and the other of the first component and the second component is a fan tray, wherein one of the first component and the second component is arranged on the backplane, and the other of the first component and the second component is arranged on a surface of the fan tray facing the backplane.

[0019] In one embodiment of the present disclosure, the first component includes a protrusion having a contact plane and an anti-vibration block made of an elastic material, wherein the anti-vibration block is attached to the contact plane of the protrusion; the second component is a contact surface of the first component or the second component, and the contact surface compresses the anti-vibration block when the first component and the second component are connected by the connecting structure.

[0020] In an embodiment of the present disclosure, when the first component is arranged on the first part, the first component and the first connector are arranged on the same side of the first part; and when the first component is arranged on the second part, the first component and the second connector are arranged on the same side of the second part.

[0021] In an embodiment of the present disclosure, one of the first component and the second component is a backplane of a chassis, and the other of the first component and the second component is a fan tray, wherein the first component is arranged on the first one of the backplane and the fan tray, and the second component is a contact surface of the other one of the backplane and the fan tray facing the first one. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] These and other objects, features and advantages of the present disclosure will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in conjunction with the accompanying drawings, in which:

[0023] Figure 1 , Figure 2 and Figure 3 An electronic device according to a first embodiment of the present disclosure is shown.

[0024] Figure 4 An electronic device according to a second embodiment of the present disclosure is shown.

[0025] Figure 5 and Figure 6 An electronic device according to a third embodiment of the present disclosure is shown.

[0026] Figure 7 An electronic device according to a fourth embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0027] Embodiments of the present disclosure are described in detail in conjunction with the accompanying drawings. It should be understood that the discussion of these embodiments is only to enable those skilled in the art to better understand and therefore implement the purpose of the present disclosure, rather than to imply any limitation on the scope of the present disclosure. References to features, advantages or similar language throughout this specification do not mean that all features and advantages that can be implemented with the present disclosure should be or are in any single embodiment of the present disclosure. On the contrary, the language related to features and advantages is understood to mean that the specific features, advantages or characteristics described in conjunction with the embodiments are included in at least one embodiment of the present disclosure. In addition, the described features, advantages and characteristics of the present disclosure may be combined in one or more embodiments in any suitable manner. Those skilled in the relevant art will recognize that the present disclosure can be practiced without one or more of the specific features or advantages of a specific embodiment. In other cases, additional features and advantages that may not be present in all embodiments of the present disclosure may be recognized in certain embodiments.

[0028] Generally, all terms used in this article will be interpreted according to their common meaning in the relevant technical field, unless different meanings are clearly given and / or implied from the context of their use. Unless otherwise clearly stated, all references to elements, equipment, components, devices, steps, etc. should be openly interpreted as referring to at least one instance of elements, equipment, components, devices, steps, etc. Any feature of any embodiment disclosed herein can be applied to any other embodiment where appropriate. Similarly, any advantage of any embodiment can be applied to any other embodiment, and vice versa. Other purposes, features and advantages of the attached embodiments will become apparent from the following description.

[0029] Generally, there are two ways to reduce the effect of fretting corrosion on the connection structure. One is to make the connection structure strong, such as a strong mechanical structure, a thick noble metal plating, and lubricated contacts. The other is to add elastic material around the vibration component in a direction other than the direction in which the first connector and the second connector are connected to each other to absorb vibration. However, although making the connection structure strong can increase durability, it will also greatly increase the cost (30% or more). In addition, although adding elastic material can reduce vibration, since the elastic material is added in a direction other than the direction in which the first connector and the second connector are connected to each other, the elastic material will generate a force that causes the mating connector to deviate from the mating position, thereby reducing the durability of the connection structure and the electronic device.

[0030] Therefore, it is necessary to design an electronic device with good vibration absorption performance, low cost and high durability.

[0031] The core inventive concept of the present application is that the electronic device includes not only a connection structure but also a vibration absorbing structure, wherein the vibration absorbing structure includes an elastic material and a component for compressing the elastic material. When different components of the electronic device are connected through the connection structure, the elastic material is compressed by the component in a direction substantially parallel to the direction in which the mating connectors of the connection structure are connected to each other, so that a damping connection is established between different components of the electronic device. The vibration absorbing structure absorbs not only vibrations in the direction in which the mating connectors are connected, but also vibrations in other directions, such as vibrations in a direction perpendicular to the direction in which the mating connectors are connected. Therefore, the damping connection prevents any relative movement between different components of the electronic device, thereby greatly reducing vibrations on the connection structure. In addition, since the elastic material is compressed in a direction substantially parallel to the direction in which the mating connectors are connected, the elastic material does not generate a force that causes the mating connector to deviate from the mating position in a direction different from the direction in which the mating connectors are connected to each other, thereby increasing the durability of the connection structure and the electronic device. In addition, compared with existing electronic devices, the electronic device of the present application only further includes an elastic material, so the cost of the electronic device is lower.

[0032] Those skilled in the art will appreciate that the elastic material may be any suitable material suitable for absorbing vibrations, such as rubber, silicone, latex, plastic, sponge or spring, and these variations are within the scope of protection of the present application.

[0033] Figure 1 , Figure 2 and Figure 3 An electronic device according to a first embodiment of the present disclosure is shown. Specifically, Figure 1 shows a partial perspective view of an electronic device before assembly, Figure 2 shows a partial cutaway perspective view of an assembled electronic device, Figure 3A partial cut-away perspective view of a retaining sleeve disposed in an electronic device is shown, wherein the retaining sleeve includes an elastic material disposed at a bottom thereof.

[0034] like Figure 1 , Figure 2 and Figure 3 As shown, the electronic device includes a chassis 10 and a fan tray 120. The chassis 10 has a slot 110 to accommodate the fan tray 120. The chassis 10 includes a back plate 130. The back plate 130 has two guide pins 132 and a connector 134. Correspondingly, the fan tray 120 has two retaining sleeves 122 and a connector 124 arranged on the surface facing the back plate 130. The fan tray 120 also has three fans 126 as a vibration source. The fan tray 120 has screws 128 fixed to the screw holes 101 on the chassis 10. A piece of elastic material 121 is added to the bottom of the retaining sleeve 122. Those skilled in the art will appreciate that the elastic material 121 can be added to the bottom of the retaining sleeve 122 in any appropriate manner, and these variations do not exceed the scope of protection of the present application. For example, the elastic material 121 can be pressed to the bottom of the retaining sleeve 122 and self-retained, or glued to the bottom of the retaining sleeve 122 by glue. As Figure 3 As shown, the front side 123 of the elastic material 121 is a plane. However, those skilled in the art will appreciate that before the elastic material 121 is compressed, the front side 123 of the elastic material 121 may also be concave or convex, and these deformations do not exceed the protection scope of the present application.

[0035] After assembling the electronic device, the screws 128 on the fan tray 120 engage with the screw holes 101 in the chassis 10, the connectors 134 on the back plate 130 mate with the connectors 124 on the fan tray 120, and the guide pins 132 are received in the retaining sleeves 122. During the insertion of the fan tray 120 into the slot 110, the guide pins 132 engage with the retaining sleeves 122 to guide the connectors 124 on the fan tray 120 to properly mate with the corresponding connectors 134 on the back plate 130. Then, when the fan tray 120 is further inserted until the two connectors 124 and 134 are fully mated, the ends of the guide pins 132 contact and compress the elastic material 121 at the bottom of the retaining sleeves 122. The guide pins 132, the elastic material 121, and the retaining sleeves 122 together form a vibration absorbing structure to establish a damped connection between the fan tray 120 and the back plate 130 of the chassis 10. The damping connection prevents any relative movement between the fan tray 120 and the back plate 130, so that the vibration on the connectors 124 and 134 is greatly reduced. When the fan generates vibration during operation, the vibration absorbing structure can attenuate the vibration, and the micro-motion between the connectors 124 and 134 can be greatly reduced. Therefore, the risk of micro-motion corrosion between the connectors 124 and 134 is reduced.

[0036] Furthermore, since the elastic material 121 is added to the bottom of the retaining sleeve 122, the elastic material 121 is compressed in a direction substantially parallel to the direction in which the connectors 124 and 134 are connected to each other. Therefore, the elastic material 121 does not generate a force that causes the connectors 124 and 134 to deviate from the mating position in a direction other than the direction in which the connectors 124 and 134 are connected to each other, thereby improving the durability of the connection structure and the electronic device. Figure 1 , Figure 2 and Figure 3 As shown, the guide pin 132 and the connector 134 are arranged on the same side of the back plate 130, and the retaining sleeve 122 and the connector 124 are arranged on the same side of the fan tray 120, so that it is easy to achieve compression of the elastic material 121 in a desired direction, which is parallel to the direction in which the connectors 124 and 134 are connected. Since the elastic material 121 is compressed in a direction substantially parallel to the direction in which the connectors 124 and 134 are connected to each other, a damping connection is mainly established along this direction.

[0037] Figure 4 FIG. 2 shows an electronic device according to a second embodiment of the present disclosure. Figure 4 As shown, compared with the first embodiment of the present disclosure, Figure 1 , Figure 2 and Figure 3 The guide pin 132 and the retaining sleeve 122 in the fan disk 120 are replaced with an anti-vibration block 135 and a retaining sleeve 127. The anti-vibration block 135 is made of an elastic material. When the fan disk 120 is fully seated in the groove 110, the end of the retaining sleeve 127 compresses the anti-vibration block 135. Therefore, the retaining sleeve 127 on the fan disk 120 establishes a damping connection with the back plate 130 through the anti-vibration block 135. Then, when the fan disk 120 vibrates, the anti-vibration block 135 absorbs most of the vibration, thereby reducing the fretting corrosion between the connectors 124 and 134. In addition, similar to the first embodiment of the present disclosure, since the anti-vibration block 135 is compressed in a direction substantially parallel to the direction in which the connectors 124 and 134 are connected to each other, the anti-vibration block 135 does not generate a force that causes the connectors 124 and 134 to deviate from the mating position in a direction other than the direction in which the connectors 124 and 134 are connected to each other, thereby increasing the durability of the connection structure and the electronic device. Although in Figure 4 The anti-vibration block 135 is shown to be disposed on the back plate 130 , but the anti-vibration block 135 may also be disposed on other components of the base frame 10 , such as a housing.

[0038] Those skilled in the art will understand that Figure 4 The retaining sleeve 122 in the embodiment may be replaced by any suitable structure suitable for compressing the anti-vibration block 135, such as Figure 5 and Figure 6 guide pin or protrusion as shown.

[0039] Figure 5 and Figure 6 FIG. 2 shows an electronic device according to a third embodiment of the present disclosure. Figure 5 shows a partial perspective view of an electronic device, Figure 6 A partial cutaway perspective view of an electronic device is shown. Figure 5 and Figure 6 As shown, compared with the second embodiment of the present disclosure, Figure 4 The retaining sleeve 127 is replaced by the projection 129. Figure 5 and Figure 6 1 shows that the protrusions 129 are arranged at two corners on the surface of the fan disk 120 facing the back plate 130, but the protrusions 129 can be arranged at other positions on the surface as long as the protrusions 129 and the anti-vibration blocks 135 can cooperate with each other. Preferably, the protrusions 129 are symmetrical about the connector 124. The protrusions 129 can be a part of the outer shell of the fan disk or a small pillar fixed to the fan disk. Two anti-vibration blocks 135 made of elastic material are attached to the back plate 130. When the fan disk 120 is completely placed in the groove 110, the contact plane of the protrusions 129 compresses the anti-vibration blocks 135. Therefore, a damping connection can be constructed between the fan disk 120 and the back plate 130 through the protrusions 129 and the anti-vibration blocks 135. When vibrations are generated on the fan disk 120, the anti-vibration blocks 135 can absorb most of the vibrations, thereby reducing the fretting corrosion between the connectors 124 and 134. Furthermore, similar to the first and second embodiments of the present disclosure, since the anti-vibration block 135 is compressed in a direction substantially parallel to the direction in which the connectors 124 and 134 are connected to each other, the anti-vibration block 135 does not generate a force that causes the connectors 124 and 134 to deviate from the mating position in a direction other than the direction in which the connectors 124 and 134 are connected to each other, thereby increasing the durability of the connection structure and the electronic device. Figure 6 The anti-vibration block 135 is shown to be disposed on the back plate 130 , but the anti-vibration block 135 may also be disposed on other parts of the base frame 10 , such as on the outer shell.

[0040] Figure 7 An electronic device according to a fourth embodiment of the present disclosure is shown. Specifically, Figure 7 A partial perspective view of an electronic device is shown. Figure 7As shown, compared with the third embodiment of the present disclosure, the anti-vibration block 135 provided on the back plate 130 in the third embodiment is replaced by an anti-vibration block 135' attached to the contact plane of the protrusion 129. It can be understood by those skilled in the art that the anti-vibration block 135' can be attached to the contact plane of the protrusion 129 in any appropriate manner, and these variations do not exceed the protection scope of the present application. For example, the anti-vibration block 135' can be attached to the contact plane of the protrusion 129 by glue. When the fan disk 120 is completely placed in the groove 110, the contact surface of the back plate 130 (i.e., the surface of the back plate 130 facing the fan disk 120) compresses the anti-vibration block 135'. Therefore, a damping connection can be constructed between the fan disk 120 and the back plate 130. When vibration is generated on the fan disk 120, the anti-vibration block 135' can absorb most of the vibration, thereby reducing the fretting corrosion between the connectors 124 and 134. In addition, similar to the first, second and third embodiments of the present disclosure, since the anti-vibration block 135' is compressed in a direction substantially parallel to the direction in which the connectors 124 and 134 are connected to each other, the anti-vibration block 135' does not generate a force that causes the connectors 124 and 134 to deviate from the mating position in a direction other than the direction in which the connectors 124 and 134 are connected to each other, thereby increasing the durability of the connection structure and the electronic device.

[0041] It is understood by those skilled in the art that the arrangement positions of the interaction components of the vibration absorbing structure in the first embodiment, the second embodiment, the third embodiment and the fourth embodiment can be interchanged. For example, in the first embodiment, the guide pin 132 can be modified to be arranged on the fan disk 120, and the retaining sleeve 122 can be modified to be arranged on the back plate 130. These variations do not exceed the protection scope of the present application.

[0042] References in this disclosure to "an embodiment," "another embodiment," etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but not every embodiment must include the particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is considered to be within the knowledge of those skilled in the art to implement such feature, structure, or characteristic in conjunction with other embodiments, whether or not explicitly described.

[0043] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present disclosure. As used herein, the term "and / or" includes any and all combinations of one or more associated listed terms.

[0044] The terms used herein are only used to describe the purpose of specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "one", "one" and "the" are also intended to include plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "include", "include", "have", "have", "include" and / or "include", when used in this article, specify the presence of the features, elements and / or components, but do not exclude the presence or addition of one or more other features, elements, components and / or their combinations. The terms "connect", "connect", "connect" and / or "connected" used herein cover the direct and / or indirect connection between two elements.

[0045] The present disclosure includes any novel feature or combination of features disclosed herein explicitly or in any general manner. When read in conjunction with the accompanying drawings, various modifications and adaptations to the aforementioned exemplary embodiments of the present disclosure may become apparent to those skilled in the relevant art in view of the foregoing description. However, any and all modifications will still fall within the scope of the non-limiting and exemplary embodiments of the present disclosure.

Claims

1. An electronic device, comprising a first component, a second component and a connection structure, wherein the connection structure comprises a first connector arranged on the first component and a second connector arranged on the second component, and the electronic device further comprises at least one vibration absorbing structure, wherein the vibration absorbing structure comprises an elastic material arranged on the first component or the second component, wherein: When the first component and the second component are connected by the connection structure, the elastic material is compressed in a direction parallel to a direction in which the first connector and the second connector are connected to each other, so that a damping connection is established between the first component and the second component.

2. The electronic device according to claim 1, wherein: When the first component and the second component are connected by the connection structure, the elastic material does not generate a force that deviates the first connector and the second connector from a mating position in a direction other than a direction in which the first connector and the second connector are connected to each other.

3. The electronic device according to claim 1, wherein: Before the elastic material is compressed, the surface of the elastic material is flat, concave or convex.

4. The electronic device according to claim 1, wherein: The elastic material is rubber, silicone, latex, plastic, sponge or spring.

5. The electronic device according to any one of claims 1 to 4, wherein: The vibration absorbing structure includes a first component arranged on one of the first part and the second part and a second component arranged on the other of the first part and the second part, the first component including the elastic material, and the second component is configured to compress the elastic material when the first part and the second part are connected by the connecting structure.

6. The electronic device according to claim 5, wherein: The first component is a retaining sleeve (122), and the elastic material (121) is arranged inside and at the bottom of the retaining sleeve (122); and The second component is a guide pin (132), the end of which compresses the elastic material (121) when the first component and the second component are connected via the connection structure.

7. The electronic device according to claim 6, wherein: The elastic material (121) is pressed to the bottom of the retaining sleeve (122) and is self-retaining; or The elastic material (121) is glued to the bottom of the retaining sleeve (122).

8. The electronic device according to claim 5, wherein: The first component is an anti-vibration block (135) made of the elastic material; and The second component is one of a guide pin and a retaining sleeve (127), and the end of the guide pin or the retaining sleeve (127) compresses the vibration-proof block (135) when the first component and the second component are connected by the connecting structure.

9. The electronic device according to claim 5, wherein: The first component is an anti-vibration block (135) made of the elastic material; and The second component is a protrusion (129) having a contact plane, and when the first component and the second component are connected through the connection structure, the contact plane of the protrusion (129) compresses the vibration-proof block (135).

10. The electronic device according to any one of claims 5 to 9, wherein: The first connector is disposed on the same side of the first component as one of the first component and the second component; and The second connector is arranged on a same side of the second component as the other of the first component and the second component.

11. The electronic device according to any one of claims 5 to 10, wherein: One of the first component and the second component is a back plate (130) of a chassis (10), and the other of the first component and the second component is a fan tray (120), wherein one of the first component and the second component is arranged on the back plate (130), and the other of the first component and the second component is arranged on a surface of the fan tray (120) facing the back plate (130).

12. The electronic device according to claim 5, wherein: The first component comprises a protrusion (129) having a contact plane and an anti-vibration block (135') made of an elastic material, the anti-vibration block (135') being attached to the contact plane of the protrusion (129); and The second component is a contact surface of the first component or the second component, and the contact surface compresses the anti-vibration block (135') when the first component and the second component are connected via the connection structure.

13. The electronic device according to claim 12, wherein: When the first component is arranged on the first part, the first component and the first connector are arranged on the same side of the first part; as well as When the first component is disposed on the second component, the first component and the second connector are arranged on the same side of the second component.

14. The electronic device according to any one of claims 12 to 13, wherein: One of the first component and the second component is a back plate (130) of a chassis (10), and the other of the first component and the second component is a fan tray (120), wherein the first component is arranged on the first one of the back plate (130) and the fan tray (120), and the second component is a contact surface of the other one of the back plate (130) and the fan tray (120) facing the first one.

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