Electronic adhesive preparation device and method

Abstract

The invention discloses an electronic adhesive preparation device and method.The electronic adhesive preparation device comprises a main tank and an auxiliary tank, the main tank is provided with a first interlayer used for containing cold liquid, the auxiliary tank is internally provided with a stirring component, and the volume of the auxiliary tank is smaller than that of the main tank; the auxiliary tank is provided with an inlet and an outlet, and the inlet and the outlet are both communicated with the internal space of the main tank; the auxiliary tank is provided with a second interlayer used for containing cold liquid. The driving part is used for driving the mixed liquid to flow from the inlet to the outlet in the auxiliary tank; and after the temperature of the electronic adhesive in the main tank is reduced to be 0-3 DEG C higher than the curing temperature, the temperature of the electronic adhesive is reduced to be lower than the curing temperature through the auxiliary tank. The method of the electronic adhesive preparation device comprises the steps of cooling preparation, stirring and mixing stopping. The electronic adhesive preparation device provided by the invention has the effects of high cooling speed and good adhesive performance maintenance.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesive preparation, and in particular, relates to a device and method for preparing an electronic adhesive. Background Art

[0002] The application of electronic adhesives has become an indispensable part of today's electronics industry. It plays a key role not only in the precise positioning of microcircuits, but also in the bonding of large motor coils. The diversity and versatility of electronic adhesives make them a key factor in the reliability and performance of electronic components.

[0003] The versatility of electronic adhesives is reflected in the fact that they not only provide a stable mechanical fixation, but also have a series of other properties to meet the complex needs of electronic products. For example, insulation properties can protect circuits from the risk of short circuits, conductive properties are used to create circuit connection points, sealing properties ensure that components are not affected by the external environment, shock absorption properties help improve the impact resistance of products, and anti-corrosion properties extend the service life of products in harsh environments.

[0004] Among the many electronic adhesives, epoxy resin adhesives, silicone adhesives, acrylic adhesives, polyurethane adhesives, cyanoacrylate adhesives, etc. are common choices in the market. Among them, epoxy resin adhesives occupy an important position in the electronics industry due to their excellent performance.

[0005] The widespread application of epoxy resin adhesives is due to its following significant features: first, it has a wide range of applicability and can be bonded to a variety of materials; second, its bonding performance is excellent and can provide long-term bonding effects; third, epoxy resin adhesives have good electrical properties and are suitable for the insulation and conductivity needs of electronic products; finally, its aging resistance ensures the stability of the adhesive during long-term use.

[0006] The curing process of epoxy resin adhesives is the key to their performance. According to the different curing temperatures, epoxy resin adhesives are mainly divided into two categories: room temperature curing and high temperature curing. The curing temperature of room temperature curing epoxy resin adhesives is usually between 15 and 60°C, while the curing temperature of high temperature curing epoxy resin adhesives is between 90 and 150°C. Room temperature curing epoxy resin adhesives have a relatively low curing temperature and are suitable for temperature-sensitive electronic components. High temperature curing epoxy resin adhesives are suitable for applications that require higher strength and heat resistance. Control of curing speed is crucial to product quality, so precise control of curing temperature is essential during the production process.

[0007] In the preparation process of epoxy resin adhesive, the choice of stirring equipment directly affects the final performance of the product. Different types of stirring equipment, such as paddle type, anchor paddle type, frame type, screw ribbon type, turbine type, dispersion disc type and combination type, have their specific application scenarios. Choosing the right stirring equipment can ensure the full mixing of raw materials, thereby improving the quality of the adhesive.

[0008] However, in the traditional stirring process, in order to control the temperature of the mixed liquid, a circulating cold liquid is usually injected into the interlayer of the stirring equipment. This method has the following problems: ① The heat generated by the friction between the blade and the mixed liquid will cause the mixed liquid on the surface of the blade to heat up in a short time and solidify slightly. This slight solidification will gradually spread to the entire mixed liquid as the stirring time increases, thus affecting the quality of the final adhesive.

[0009] ② In order to offset the influence of heat generated by blade friction on the mixed liquid, it is often necessary to reduce the temperature of the mixed liquid to a too low level. This not only increases energy consumption, but also increases the viscosity of the mixed liquid, thus affecting the stirring effect.

[0010] ③ Since the mixed liquid needs to be cooled to a lower temperature and is limited by the heat transfer rate of the mixed liquid, the cooling process before stirring usually takes a long time, which is not conducive to improving production efficiency.

[0011] ④ The method of controlling temperature through cold liquid has the problem of limited heat exchange rate. The heat change of the mixed liquid is actually achieved through heat transfer between the mixed liquid and the surrounding. The heat exchange rate of the mixed liquid is limited by the surface area of ​​the mixed liquid, resulting in low temperature control accuracy. Summary of the invention

[0012] In view of the deficiencies of the prior art, an object of the present invention is to provide an electronic adhesive preparation device and method.

[0013] In order to achieve the above-mentioned invention object, the technical solution adopted by the present invention includes: In one aspect, an electronic adhesive preparation device includes a main tank having a first interlayer for containing a cold liquid, and also includes a sub-tank, a stirring component is disposed in the sub-tank, and the volume of the sub-tank is smaller than the volume of the main tank; The auxiliary tank is provided with an inlet and an outlet, both of which are connected to the inner space of the main tank; the auxiliary tank has a second interlayer for containing cold liquid; It also includes a driving component, which is used to drive the mixed liquid to flow from the inlet to the outlet in the auxiliary tank; After the temperature of the electronic adhesive in the main tank drops to 0-3° C. higher than the curing temperature, the temperature of the electronic adhesive is dropped to below the curing temperature through the auxiliary tank.

[0014] In the present invention, the introduction of cold liquid into the first interlayer can slowly cool and keep the mixed liquid in the main tank warm; the driving component drives the mixed liquid to flow from the inlet to the outlet in the auxiliary tank, thereby driving the mixed liquid in the main tank to circulate.

[0015] In the present invention, the stirring component can achieve a stirring effect on the mixed liquid, and the circulating flow of the mixed liquid can achieve a mixing and stirring effect on the mixed liquid in the main tank.

[0016] Preferably, the inlet is connected to the internal space of the main tank at the bottom of the main tank.

[0017] Preferably, the outlet is connected to the internal space of the main tank at the top of the main tank.

[0018] In the present invention, the mixed liquid in the main tank flows out from the lower end and flows in again from the top, so that the mixed liquid in the main tank can circulate in the same direction, thereby stirring and mixing the mixed liquid in the main tank, which is beneficial to speeding up the stirring speed and improving the stirring effect.

[0019] In the present invention, the mixed liquid in the main tank circulates to achieve mixing and stirring. Compared with the stirring method using paddles in the prior art, the stirring process in the main tank in the present application does not require direct participation of paddles, thereby preventing the mixed liquid from being affected by frictional heat, thereby helping to slow down the solidification speed of the mixed liquid and maintaining the performance of the prepared adhesive.

[0020] Preferably, the internal space of the main tank is funnel-shaped, and the cross-sectional area of ​​the bottom of the main tank is smaller than the cross-sectional area of ​​the top of the main tank.

[0021] In the present invention, the main tank with a small bottom and a large top can avoid uneven mixing caused by flow dead corners, which is beneficial to improving the circulation and stirring effect of the mixed liquid in the main tank.

[0022] Preferably, the ratio of the volume of the main tank to the volume of the auxiliary tank is (3-8):1.

[0023] In the present invention, if the volume of the auxiliary tank is too large, the cooling effect on the mixed liquid in the auxiliary tank will be reduced, while if the volume of the auxiliary tank is too small, the circulation flow speed of the mixed liquid in the main tank will be affected, thereby affecting the circulation stirring effect and prolonging the mixing time of the mixed liquid.

[0024] In the present invention, when the ratio of the volume of the main tank to the volume of the sub-tank is (3-8):1, the circulation flow rate of the mixed liquid in the main tank and the cooling effect of the mixed liquid in the sub-tank can be taken into account.

[0025] Preferably, the stirring member comprises a spiral blade extending in a direction from the inlet to the outlet.

[0026] Preferably, the driving component is transmission-connected to the spiral blade, and the driving component drives the spiral blade to rotate so that the liquid in the auxiliary tank flows from the inlet to the outlet.

[0027] When the driving component drives the spiral blade to rotate in the present invention, the spiral blade can drive the mixed liquid in the auxiliary tank to move, and drive the mixed liquid to move while stirring the mixed liquid in the auxiliary tank.

[0028] Preferably, the auxiliary tank is arranged vertically, the inlet is located below the outlet, and the driving component is drivingly connected to the spiral blade at the top of the auxiliary tank.

[0029] In the present invention, the auxiliary tank is vertically arranged, the inlet is located below the outlet, and the mixed liquid in the auxiliary tank enters from the bottom and exits from the top, which can reduce the mixing of air into the mixed liquid. At the same time, the mixed liquid can fully exchange heat in the auxiliary tank, which is beneficial to improving the cooling effect of the mixed liquid.

[0030] Preferably, the stirring member comprises a stirring blade.

[0031] Preferably, the driving component comprises a driving pump, and the main tank is connected to the inlet or the outlet through the driving pump.

[0032] In the present invention, after the driving pump drives the mixed liquid into the auxiliary tank, the stirring blades are passively rotated under the flow of the mixed liquid, thereby forming a stirring effect on the mixed liquid; at the same time, since the stirring blades are passively rotated under the flow of the mixed liquid, compared with the active stirring of the stirring blades in the prior art, the stirring blades in the present invention have less shear and friction on the mixed liquid, which is beneficial to reduce the frictional heat generated by the stirring blades and the mixed liquid.

[0033] Preferably, a plurality of heat-conducting parts are provided on the auxiliary tank, one end of the heat-conducting part is located in the second interlayer, and the other end is located in the internal space of the auxiliary tank.

[0034] In the present invention, the heat conducting member is helpful to accelerate the heat exchange rate between the mixed liquid in the auxiliary tank and the cooling liquid in the second interlayer, thereby helping to improve the cooling effect of the mixed liquid in the auxiliary tank.

[0035] In another aspect, a method for preparing an electronic adhesive device comprises the following steps: Preparatory cooling: cool liquid is introduced into the first interlayer until the temperature of the mixed liquid is 0-3°C higher than the solidification temperature; Stirring: driving the mixed liquid from the inlet to the outlet through the driving component, and at the same time introducing cold liquid into the second interlayer, so that the temperature of the mixed liquid at the outlet drops below the solidification temperature; Stop mixing: After the temperature of the mixed liquid in the main tank is lower than the solidification temperature and the mixed liquid is evenly mixed, turn off the driving component; after the mixed liquid is removed, stop passing the cold liquid into the first interlayer and the second interlayer.

[0036] Preferably, in the preparatory cooling step, the mixed liquid is driven to flow from the inlet to the outlet by a driving component, and a cold liquid is introduced into the second interlayer, so that the temperature of the mixed liquid at the outlet drops below the solidification temperature.

[0037] In the present invention, driving the mixed liquid to circulate in the preparatory cooling step can achieve a stirring and mixing effect on the mixed liquid in the main tank, thereby increasing the cooling rate of the mixed liquid in the main tank and shortening the cooling time.

[0038] In the present invention, cold liquid is introduced into the second interlayer, the ratio of the surface area to the volume of the mixed liquid in the auxiliary tank is large, and the mixed liquid has a good cooling effect in the auxiliary tank, which is beneficial to accelerate the cooling speed of the mixed liquid in the main tank and shorten the cooling time.

[0039] Compared with the prior art, the advantages of the present invention include: (1) The electronic adhesive preparation device provided by the present invention has a large ratio of the surface area to the volume of the mixed liquid in the auxiliary tank, a high heat transfer efficiency, and a good cooling effect of the mixed liquid in the auxiliary tank, which is conducive to accelerating the cooling speed of the mixed liquid in the main tank and shortening the cooling time; (2) The electronic adhesive preparation device provided by the present invention can achieve the effect of mixing and stirring the mixed liquid in the main tank by circulating the mixed liquid. At the same time, compared with the active stirring of the stirring blade in the prior art, the circulating flow stirring in the present invention has less shear and friction on the mixed liquid, which is beneficial to reduce the frictional heat generated by the stirring blade and the mixed liquid; (3) In the electronic adhesive preparation device provided by the present invention, when the stirring component in the auxiliary tank stirs the mixed liquid, the mixed liquid cools down quickly in the auxiliary tank, thereby slowing down the slight solidification caused by the frictional heat generated by the stirring component and the mixed liquid, thereby facilitating the maintenance of the performance of the prepared adhesive; (4) Compared with the prior art, the frictional heat generated by the stirring component and the mixed liquid in the present invention is small, and the mixed liquid cools down quickly in the auxiliary tank, so there is no need to cool the mixed liquid in the main tank to an excessively low temperature, thereby reducing the time required for cooling and also reducing energy consumption; (5) In the electronic adhesive preparation device provided by the present invention, the stirring component and the circulating flow of the mixed liquid can both play a mixing and stirring role on the mixed liquid in the main tank, and the mixed liquid flow process in the auxiliary tank also has a mixing effect, so that the overall stirring effect of the electronic adhesive preparation device is good, which is conducive to reducing the preparation time of the adhesive; (6) In the electronic adhesive preparation device provided by the present invention, the circulation of the mixed liquid and the flow of the mixed liquid in the auxiliary tank both have the function of stirring and mixing, which can replace the part of the stirring amount required for the full mixing of the mixed liquid, thereby helping to reduce the influence of frictional heat generated by the stirring of the paddle blades on the mixed liquid; (7) In the electronic adhesive preparation device provided by the present invention, when the temperature of the mixed liquid in the auxiliary tank decreases and the viscosity increases, the required driving force is small due to the small volume of the auxiliary tank, which is conducive to reducing energy consumption; (8) In the prior art, after the temperature of the mixed liquid decreases, the viscosity increases, and the paddles need to stir all the liquid, the stirring force required by the paddles increases greatly, and the frictional heat generated by the paddles and the mixed liquid is more obvious; while in the present invention, after the temperature of the mixed liquid decreases and the viscosity increases, the additional driving force required is small, and the shear and friction of the mixed liquid by the stirring components and the driving components increase little, which is beneficial to reduce the frictional heat generated by the mixed liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 This is an overall schematic diagram of an electronic adhesive preparation device in Example 1 of the present invention; Figure 2 This is an internal schematic diagram of an electronic adhesive preparation device in Example 1 of the present invention; Figure 3 This is an enlarged schematic diagram of the interior of the auxiliary tank in Example 1 of the present invention; Figure 4 This is an internal schematic diagram of an electronic adhesive preparation device in Example 2 of the present invention; Figure 5 It is an enlarged schematic diagram of the interior of the auxiliary tank in Example 2 of the present invention.

[0042] Reference numerals: 11. Main tank; 12. First tank body; 13. First cover; 14. First interlayer; 15. First opening; 16. First flow outlet; 21. Sub-tank; 22. Second tank body; 23. Second cover; 24. Second interlayer; 25. Second opening; 26. Second flow outlet; 27. Inlet; 28. Outlet; 31. Drive motor; 32. Blade shaft; 33. Spiral blade; 34. Stirring blade; 35. Mounting frame; 36. Heat pipe. DETAILED DESCRIPTION

[0043] In view of the deficiencies in the prior art, the inventor of this case has proposed the technical solution of the present invention after long-term research and extensive practice. The following will further explain the technical solution, its implementation process and principle, etc. in conjunction with the drawings in the embodiments of this application and specific implementation cases.

[0044] It should be noted that the embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention. The described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, the present invention covers any substitution, modification, equivalent method and scheme made on the spirit, principle and scope of the present invention defined by the claims. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] In the description of the present application, "first", "second", "third" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "one" or "an" and other similar words do not indicate a quantity limitation, but indicate the existence of at least one. "Include" or "comprise" and other similar words mean that the elements or objects appearing before "include" or "comprises" include the elements or objects listed after "include" or "comprises" and their equivalents, and do not exclude other elements or objects. "Connect" or "connected" and other similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0046] In the description of the present application, the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, when positional terms such as both sides, outside, up and down are used, it should be understood that they are only used to facilitate understanding and description, considering that the structure may be facing other positions.

[0047] In the description of this application, unless otherwise clearly specified and limited, the technical or scientific terms used should have the usual meanings understood by persons with general skills in the field to which this application belongs. Terms such as "install", "connect", and "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection, or an integrated connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] The embodiments of the present invention are intended to introduce and illustrate the structural composition of an electronic adhesive preparation device and the matching relationship between the various components. Unless otherwise specified, the dimensions, materials and manufacturing processes of the various components in the electronic adhesive preparation device in the embodiments of the present invention can be selected according to specific circumstances and are not specifically limited or described herein.

[0049] Further, in order to make the public have a better understanding of the present invention, some specific details are described in detail in the following detailed description of the present invention. For those skilled in the art, the present invention can be fully understood without the description of these details.

[0050] Example 1 See also Figure 1 , Figure 2 and Figure 3 , an electronic adhesive preparation device includes a main tank 11 having a first interlayer 14 for containing a cold liquid.

[0051] Specifically, the main tank 11 includes a first tank body 12 and a first cover 13. The first tank body 12 is vertically arranged. The first cover 13 is sealingly installed on the first tank body 12, and forms a seal inside the first tank body 12. The first tank body 12 is provided with a first interlayer 14. The first tank body 12 is provided with a first through opening 15 and a first flow opening 16. The first through opening 15 is located below the first flow opening 16. The first through opening 15 and the first flow opening 16 are both connected to the first interlayer 14.

[0052] In this embodiment, cold liquid can be injected into the first interlayer 14 through the first opening 15, and the cold liquid finally flows out from the first flow port 16 at the top. The cold liquid flows in the first interlayer 14 in an in-bottom-in and out-top manner, which is beneficial to improving the cooling effect of the mixed liquid in the first tank body 12.

[0053] Preferably, the internal space of the main tank 11 is funnel-shaped, and the cross-sectional area of ​​the bottom of the main tank 11 is smaller than the cross-sectional area of ​​the top of the main tank 11 .

[0054] Specifically, the cross-section of the first tank body 12 gradually shrinks in the vertical direction, so that the main tank 11 as a whole is larger at the top and smaller at the bottom, so that the mixed liquid in the main tank 11 can be concentrated to the bottom of the main tank 11 under gravity, which is beneficial to avoid insufficient mixing of the mixed liquid due to the existence of dead corners in the flow inside the first tank body 12.

[0055] In this embodiment, an electronic adhesive preparation device also includes a sub-tank 21, which is provided with an inlet 27 and an outlet 28, both of which are connected to the internal space of the main tank 11; the sub-tank 21 has a second interlayer 24 for accommodating cold liquid.

[0056] Preferably, the inlet 27 is connected to the inner space of the main tank 11 at the bottom of the main tank 11 .

[0057] Preferably, the outlet 28 is connected to the inner space of the main tank 11 at the top of the main tank 11 .

[0058] More preferably, after the temperature of the electronic adhesive in the main tank drops to a temperature 0-3° C. higher than the curing temperature, the temperature of the electronic adhesive is dropped to a temperature lower than the curing temperature through the auxiliary tank.

[0059] Further preferably, the auxiliary tank 21 is vertically arranged, and the inlet 27 is located below the outlet 28 .

[0060] Specifically, the auxiliary tank 21 includes a second tank body 22 and a second cover 23. The second tank body 22 is vertically arranged. The second cover 23 is sealingly installed on the second tank body 22, and the interior of the second tank body 22 is sealed. The second tank body 22 is provided with a second interlayer 24. The second tank body 22 is provided with a second through port 25 and a second flow port 26. The second through port 25 is located below the second flow port 26. The second through port 25 and the second flow port 26 are both connected to the second interlayer 24.

[0061] In this embodiment, cold liquid can be injected into the second interlayer 24 through the second opening 25 , and the cold liquid finally flows out from the second flow port 26 at the top. The cold liquid flows in the second interlayer 24 in an in-bottom-in and out-top manner, which is beneficial to improving the cooling effect of the mixed liquid in the second tank body 22 .

[0062] Specifically, an inlet 27 is provided at the bottom of the second tank body 22 , and the inlet 27 is communicated with the bottom of the first tank body 12 ; an outlet 28 is provided at the top of the second tank body 22 , and the outlet 28 is communicated with the top of the first tank body 12 .

[0063] In this embodiment, the volume of the auxiliary tank 21 is smaller than the volume of the main tank 11 .

[0064] Preferably, the ratio of the volume of the main tank 11 to the volume of the auxiliary tank 21 is (3-8):1.

[0065] Specifically, in this embodiment, the ratio of the volume of the main tank 11 to the volume of the sub-tank 21 is (3:1), (4:1), (6:1), (7:1) or (8:1).

[0066] Preferably, in this embodiment, the ratio of the volume of the main tank 11 to the volume of the auxiliary tank 21 is 5:1.

[0067] In this embodiment, an electronic adhesive preparation device further includes a driving component, which is used to drive the mixed liquid to flow from the inlet 27 to the outlet 28 in the auxiliary tank 21 . A stirring component is provided in the auxiliary tank 21 .

[0068] Preferably, the stirring member comprises a spiral blade 33 , and the spiral blade 33 extends in a direction from the inlet 27 to the outlet 28 .

[0069] Specifically, the stirring component includes a spiral blade 33 and a blade shaft 32 , and the spiral blade 33 is spirally wound and fixedly connected to the surface of the blade shaft 32 .

[0070] Further preferably, the driving component is in transmission connection with the spiral blade 33 , and the driving component drives the spiral blade 33 to rotate so that the liquid in the auxiliary tank 21 flows from the inlet 27 to the outlet 28 .

[0071] Preferably, the driving component is transmission-connected to the spiral blade 33 at the top of the auxiliary tank 21 .

[0072] Specifically, in this embodiment, the driving component is a driving motor 31, which is fixedly mounted on the second cover 23. The power shaft of the driving motor 31 is vertical. The power shaft of the driving motor 31 penetrates the second cover 23 and extends into the second tank body 22. The power shaft of the driving motor 31 is connected to the second cover 23 through a bearing.

[0073] Specifically, the power shaft of the driving motor 31 is fixedly connected to the blade shaft 32 , and the power shaft of the driving motor 31 is coaxial with the blade shaft 32 , and the spiral blade 33 and the blade shaft 32 are both located in the second tank body 22 .

[0074] It is understandable that when the power shaft of the driving motor 31 rotates, it can drive the blade shaft 32 to move in the second tank body 22 , and by adjusting the rotation direction of the driving motor 31 , the mixed liquid can be driven to move from bottom to top in the second tank body 22 .

[0075] In this embodiment, a method for preparing an electronic adhesive device includes the following steps: Preliminary cooling: cool liquid is introduced into the first interlayer 14 until the temperature of the mixed liquid is 0-3°C higher than the solidification temperature; Stirring: driving the mixed liquid from the inlet 27 to the outlet 28 by a driving component, and at the same time introducing a cold liquid into the second interlayer 24, so that the temperature of the mixed liquid at the outlet 28 drops below the solidification temperature; Stop mixing: After the temperature of the mixed liquid in the main tank 11 is lower than the solidification temperature and the mixed liquid is evenly mixed, turn off the driving component; after the mixed liquid is removed, stop passing cold liquid into the first interlayer 14 and the second interlayer 24.

[0076] Specifically, in the preparatory cooling of this embodiment, the temperature of the mixed liquid is lowered to 0° C., 1° C., 2° C. or 3° C. higher than the solidification temperature.

[0077] Preferably, in the preliminary cooling of this embodiment, the temperature of the mixed liquid is reduced to 1° C. higher than the solidification temperature.

[0078] Specifically, when the electronic adhesive preparation device prepares the adhesive, the material is first put into the first tank body 12, and then the first cover 13 is fixedly sealed on the first tank body 12; then, cold liquid is introduced into the first interlayer 14 through the first port 15, and as the liquid level of the cold liquid rises, the cold liquid flows out from the first flow port 16; when the temperature of the mixed liquid in the first tank body 12 drops to 1°C higher than the curing temperature, cold liquid is introduced into the second interlayer 24 through the second port 25, and as the liquid level of the cold liquid rises, the cold liquid flows out from the second flow port 26; after the temperature in the second tank body 22 drops below the curing temperature, the drive motor 31 is started to drive the mixed liquid in the second tank body 22 to move from bottom to top; after the temperature of the mixed liquid in the main tank 11 is lower than the curing temperature and the mixed liquid is mixed evenly, the drive motor 31 is turned off, and then the mixed liquid is removed, and finally the cold liquid is recovered from the first port 15 and the second port 25.

[0079] Preferably, in the preparatory cooling step, the mixed liquid is driven to flow from the inlet 27 to the outlet 28 by a driving component, and a cold liquid is introduced into the second interlayer 24, so that the temperature of the mixed liquid at the outlet 28 drops below the solidification temperature.

[0080] Specifically, when the electronic adhesive preparation device prepares the adhesive, the material is first put into the first tank body 12, and then the first cover 13 is fixedly sealed on the first tank body 12; then, cold liquid is introduced into the first interlayer 14 through the first port 15, and at the same time, cold liquid is introduced into the second interlayer 24 through the second port 25. As the liquid level of the cold liquid rises, the cold liquid flows out from the first flow port 16 and the second flow port 26; when the temperature of the mixed liquid in the first tank body 12 drops to 1°C higher than the solidification temperature, the drive motor 31 is started to drive the mixed liquid in the second tank body 22 to move from bottom to top; when the temperature of the mixed liquid in the main tank 11 is lower than the solidification temperature and the mixed liquid is evenly mixed, the drive motor 31 is turned off, and then the mixed liquid is removed, and finally the cold liquid is recovered from the first port 15 and the second port 25.

[0081] Example 2 See also Figure 4 and Figure 5 The difference between this embodiment and embodiment 1 is that the stirring component includes a stirring blade 34.

[0082] Specifically, a mounting frame 35 is installed in the second tank body 22 , and the stirring blade 34 is connected to the mounting frame 35 via a bearing, and the rotation axis of the stirring blade 34 is vertical.

[0083] Specifically, in this embodiment, the number of the stirring blades 34 is two, and the two stirring blades 34 are sequentially distributed in the second tank body 22 along the vertical direction.

[0084] Preferably, the driving component includes a driving pump, and the main tank 11 is connected to the inlet 27 or the outlet 28 through the driving pump.

[0085] Specifically, the first tank body 12 and the inlet 27 are connected via a driving pump. In other embodiments, the first tank body 12 and the outlet 28 may also be connected via a driving pump.

[0086] Further preferably, a plurality of heat-conducting components are provided on the auxiliary tank 21 , one end of the heat-conducting component is located in the second interlayer 24 , and the other end is located in the internal space of the auxiliary tank 21 .

[0087] Specifically, the heat conducting member is a heat pipe 36 , and the heat pipes 36 are all fixedly mounted on the inner wall of the second tank body 22 ; for any heat pipe 36 , one end of the heat pipe 36 is located in the second tank body 22 , and the other end is located in the second interlayer 24 .

[0088] Specifically, the plurality of heat pipes 36 are distributed between the two stirring blades 34 .

[0089] In this embodiment, when the electronic adhesive preparation device prepares the adhesive, the material is first put into the first tank body 12, and then the first cover 13 is fixedly sealed on the first tank body 12; then, cold liquid is introduced into the first interlayer 14 through the first port 15, and at the same time, cold liquid is introduced into the second interlayer 24 through the second port 25. As the liquid level of the cold liquid rises, the cold liquid flows out from the first flow port 16 and the second flow port 26; when the temperature of the mixed liquid in the first tank body 12 drops to 1°C higher than the solidification temperature, the drive pump is started to drive the mixed liquid in the second tank body 22 to move from bottom to top; when the temperature of the mixed liquid in the main tank 11 is lower than the solidification temperature and the mixed liquid is mixed evenly, the drive pump is turned off, and then the mixed liquid is removed, and finally the cold liquid is recovered from the first port 15 and the second port 25.

[0090] It should be understood that the above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly. It cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, some simple deductions or substitutions can be made without departing from the concept of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. An electronic adhesive preparation device, comprising a main tank (11), wherein the main tank (11) has a first interlayer (14) for containing a cold liquid, characterized in that: It also comprises a secondary tank (21), wherein a stirring component is arranged in the secondary tank (21), and the volume of the secondary tank (21) is smaller than the volume of the main tank (11); The auxiliary tank (21) is provided with an inlet (27) and an outlet (28), and the inlet (27) and the outlet (28) are both communicated with the internal space of the main tank (11); the auxiliary tank (21) has a second interlayer (24) for containing cold liquid; It also includes a driving component, which is used to drive the mixed liquid to flow from the inlet (27) to the outlet (28) in the auxiliary tank (21); After the temperature of the electronic adhesive in the main tank (11) drops to a temperature 0 to 3° C. higher than the curing temperature, the temperature of the electronic adhesive is lowered to a temperature lower than the curing temperature through the auxiliary tank (21).

2. The electronic adhesive preparation device according to claim 1, characterized in that: The inlet (27) is connected to the inner space of the main tank (11) at the bottom of the main tank (11); and / or, the outlet (28) is connected to the internal space of the main tank (11) at the top of the main tank (11); And / or, the internal space of the main tank (11) is funnel-shaped, and the cross-sectional area of ​​the bottom of the main tank (11) is smaller than the cross-sectional area of ​​the top of the main tank (11); And / or, the ratio of the volume of the main tank (11) to the volume of the auxiliary tank (21) is (3-8):

1.

3. The electronic adhesive preparation device according to claim 1, characterized in that: The stirring member comprises a spiral blade (33), and the spiral blade (33) extends in a direction from the inlet (27) to the outlet (28).

4. The electronic adhesive preparation device according to claim 3, characterized in that: The driving component is in transmission connection with the spiral blade (33), and the driving component drives the spiral blade (33) to rotate so that the liquid in the auxiliary tank (21) flows from the inlet (27) to the outlet (28).

5. The electronic adhesive preparation device according to claim 4, characterized in that: The auxiliary tank (21) is arranged vertically, the inlet (27) is located below the outlet (28), and the driving component is drivingly connected to the spiral blade (33) at the top of the auxiliary tank (21).

6. The electronic adhesive preparation device according to claim 1, characterized in that: The stirring member includes a stirring blade (34).

7. The electronic adhesive preparation device according to claim 6, characterized in that: The driving component comprises a driving pump, and the main tank (11) is connected to the inlet (27) or the outlet (28) through the driving pump.

8. The electronic adhesive preparation device according to claim 6, characterized in that: The auxiliary tank (21) is provided with a plurality of heat-conducting components, one end of the heat-conducting component is located in the second interlayer (24), and the other end is located in the internal space of the auxiliary tank (21).

9. A method for preparing an electronic adhesive device according to claim 1, characterized in that: The steps include: Preliminary cooling: introducing a cold liquid into the first interlayer (14) until the temperature of the mixed liquid is 0 to 3°C higher than the solidification temperature; Stirring: driving the mixed liquid from the inlet (27) to the outlet (28) by a driving component, and simultaneously introducing a cold liquid into the second interlayer (24), so that the temperature of the mixed liquid at the outlet (28) drops below the solidification temperature; Stop mixing: After the temperature of the mixed liquid in the main tank (11) is lower than the solidification temperature and the mixed liquid is evenly mixed, turn off the driving component; after the mixed liquid is removed, stop passing cold liquid into the first interlayer (14) and the second interlayer (24).

10. The method for preparing an electronic adhesive device according to claim 9, characterized in that: In the preparatory cooling step, the mixed liquid is driven by a driving component to flow from the inlet (27) to the outlet (28), and at the same time, a cold liquid is introduced into the second interlayer (24), so that the temperature of the mixed liquid at the outlet (28) drops below the solidification temperature.

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