Glue bottle assembly for semiconductor equipment

Abstract

The invention relates to the field of semiconductor manufacturing, and provides a glue bottle assembly for semiconductor equipment, the glue bottle assembly comprises a glue bottle, a device table, a stand column arranged on the device table, a connecting rod, a sealing assembly, a glue pipe and a breather pipe, the glue pipe and the breather pipe are arranged on the sealing assembly, one end of the connecting rod is arranged on the stand column, and the other end of the connecting rod is arranged on the breather pipe. The connecting rod can ascend and descend along the stand column to adjust the height, the sealing assembly is arranged at the other end of the connecting rod and comprises a sealing cover and a sealing gasket, the sealing gasket is attached to the lower portion of the sealing cover, and during installation, the sealing gasket covers a bottle opening of the glue bottle. The bottle cap does not need to be customized according to the size of the glue bottle, the cost is low, and the equipment delivery period is greatly shortened.

Description

Technical Field

[0001] The invention relates to the field of semiconductor manufacturing, and in particular to a glue bottle assembly for semiconductor equipment. Background Art

[0002] The semiconductor wafer coating machine needs to draw glue from the photoresist bottle to the pipeline. The glue bottle part needs to have a cap that passes through the thread on the bottle mouth and screws onto the bottle mouth to ensure that the cap and the bottle are sealed.

[0003] There are many sizes of plastic bottles, and there is no unified standard. When customers replace plastic bottles of different models, they need to remake the plastic bottle cap according to the size of the plastic bottle, diameter and thread, etc. The cost is high and the delivery time is long.

[0004] Therefore, it is urgently necessary to develop a sealing component that can be widely applicable to plastic bottles of different sizes, so that the sealing component can be adapted to a variety of different models of plastic bottles, without the need to customize the plastic bottle caps (i.e., seals) according to the size of the plastic bottles, thereby shortening the delivery cycle of the equipment and reducing the manufacturing cost of the equipment. Summary of the invention

[0005] This application is proposed in order to solve the above technical problems.

[0006] A glue bottle assembly for semiconductor equipment includes a glue bottle, an apparatus table, a column arranged on the apparatus table, a connecting rod, a sealing assembly, a rubber hose and a vent pipe, wherein the rubber hose and the vent pipe are arranged on the sealing assembly, one end of the connecting rod is arranged on the column, and the connecting rod can be raised and lowered along the column to adjust the height, the sealing assembly is arranged at the other end of the connecting rod, the sealing assembly includes a sealing cover and a sealing gasket, the sealing gasket is fitted under the sealing cover, and when installed, the sealing gasket covers the bottle mouth of the glue bottle.

[0007] Preferably, the size of the sealing gasket is larger than the diameter of the bottle mouth of the plastic bottle, so that the sealing gasket can cover the bottle mouth to ensure the sealing effect.

[0008] Preferably, the sealing cover is provided with a vent hole, one end of the vent pipe is inserted into the vent hole, and the other end of the vent pipe is connected to the outside.

[0009] Preferably, the sealing cover is provided with a connecting hole, and one end of the rubber hose passes through the connecting hole and extends to the interior of the rubber bottle.

[0010] Preferably, the sealing pad is made of a soft material, such as a silicone material or other relatively soft materials.

[0011] Preferably, during installation, the sealing gasket covers the mouth of the glue bottle, and the mouth of the glue bottle and the sealing gasket are squeezed to cause the sealing gasket to deform. There is a certain squeezing force between the mouth of the glue bottle and the sealing gasket, so that the sealing effect is better, wherein the deformation degree of the sealing gasket is relatively light.

[0012] Preferably, the size of the sealing gasket is between 10 mm and 50 mm, which can meet the size of the bottle mouth of almost all plastic bottles.

[0013] Preferably, the sealing cover comprises a covering body and a boss arranged below the covering body, the boss is provided with an embedding groove, and the sealing gasket is clamped in the embedding groove to form a connection with the sealing cover.

[0014] Preferably, the size of the boss is smaller than the diameter of the mouth of the glue bottle.

[0015] Preferably, the connecting rod is fixed to the column in a clamping manner, and an operator manually adjusts the height of the connecting rod to accommodate plastic bottles of different heights.

[0016] Preferably, in another embodiment, a guide rail and a drive motor may also be provided on the column so that the height of the connecting rod can be electrically adjusted.

[0017] Compared with the prior art, the advantages of the technical solution of the present application include at least the following:

[0018] 1. Existing plastic bottles all require corresponding bottle caps to achieve sealing requirements, and most of the bottle caps are connected by threads. However, due to different manufacturing requirements of different customers, the sizes of plastic bottles are also diversified, and the bottle caps need to be customized according to the size of the plastic bottles, resulting in a long customization cycle and relatively high cost. Different from the prior art, the present invention is equipped with a sealing assembly for the plastic bottle, and the sealing assembly can adjust the required height through a column to meet the sealing of plastic bottles of different heights. At the same time, the sealing gasket covers the bottle mouth of the plastic bottle, so that the sealing assembly can adapt to bottle mouth diameters of different sizes, and there is no need to customize the bottle cap according to the size of the plastic bottle. The cost is low and the equipment delivery cycle is greatly shortened.

[0019] 2. Different from the prior art, the size of the sealing gasket in the present invention is larger than the diameter of the bottle mouth of the plastic bottle, so that the sealing gasket can cover the bottle mouth, and there is a certain squeezing force between the bottle mouth of the plastic bottle and the sealing gasket, so that the sealing effect is better.

[0020] The embodiments of the present application can achieve other advantageous technical effects that are not listed one by one. These other technical effects may be partially described below and are predictable and understandable to those skilled in the art after reading the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above-mentioned features and advantages and other features and advantages of these embodiments and the manner in which they are achieved will become more apparent, and the embodiments of the present application can be better understood by referring to the following description together with the accompanying drawings, in which:

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0023] Figure 2 It is a schematic structural diagram of the sealing assembly of the present invention.

[0024] The features indicated by the numbers in the accompanying drawings are as follows:

[0025] 1-glue bottle, 11-bottle mouth, 2-device platform, 3-column, 4-connecting rod, 5-sealing assembly, 51-sealing cover, 511-cover body, 512-boss, 513-embedded groove, 52-sealing gasket, 53-vent hole, 54-connecting hole, 6-rubber hose, 7-vent pipe. DETAILED DESCRIPTION

[0026] In the following description of the drawings and specific embodiments, the details of one or more embodiments of the present application will be described. From these descriptions, drawings and claims, other features, purposes and advantages of the present application can be clearly seen.

[0027] It should be understood that the illustrated and described embodiments are not limited in application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the accompanying drawings. The illustrated embodiments may be other embodiments and may be implemented or executed in various ways. Each example is provided by explaining the disclosed embodiments rather than limiting them. In fact, it will be apparent to those skilled in the art that various modifications and variations may be made to the embodiments of the present application without departing from the scope or essence disclosed in the present application. For example, a feature illustrated or described as part of an embodiment may be used together with another embodiment to still produce another embodiment. Therefore, the present application discloses and covers such modifications and variations within the scope of the appended claims and their equivalent elements.

[0028] Likewise, it is understood that the phrases and terms used herein are for descriptive purposes and should not be considered restrictive. The use of "include," "comprise," or "have" and variations thereof herein is intended to be open-ended to include the items listed thereafter and their equivalents and additional items.

[0029] The present application will be described in more detail below with reference to different embodiments and examples of several aspects of the present application.

[0030] Embodiment 1

[0031] A glue bottle 1 component for semiconductor equipment, such as Figure 1 As shown, it includes a glue bottle 1, a device platform 2, a column 3 arranged on the device platform 2, a connecting rod 4, a sealing component 5, a rubber hose 6 and a vent pipe 7, wherein the rubber hose 6 and the vent pipe 7 are arranged on the sealing component 5, one end of the connecting rod 4 is arranged on the column 3, and the connecting rod 4 can be raised and lowered along the column 3 to adjust the height, and the sealing component 5 is arranged on the other end of the connecting rod 4, as shown in FIG. Figure 2 As shown, the sealing assembly 5 includes a sealing cover 51 and a sealing gasket 52, and the sealing gasket 52 is fitted under the sealing cover 51. When installed, the sealing gasket 52 covers the bottle mouth 11 of the glue bottle 1. When replacing the glue bottle 1, the staff only needs to raise the connecting rod 4 along the column 3, separate the sealing assembly 5 from the bottle mouth 11, and then replace the glue bottle 1, and then pass the rubber hose 6 into the glue bottle 1, and the connecting rod 4 is lowered along the column 3 to a height relatively suitable for the bottle mouth 11 of the glue bottle 1, so that the sealing gasket 52 and the bottle mouth 11 are slightly squeezed, and the installation is completed. Compared with the threaded bottle cap method, its operation is more convenient, and there is no need to customize the bottle cap according to the size of the glue bottle 1, the cost is low and the equipment delivery cycle is greatly shortened.

[0032] In one embodiment, the size of the sealing gasket 52 is larger than the diameter of the bottle mouth 11 of the plastic bottle 1, so that the sealing gasket 52 can cover the bottle mouth 11 to ensure the sealing effect.

[0033] In one embodiment, a vent hole 53 is provided on the sealing cover 51 , one end of the vent pipe 7 is passed through the vent hole 53 , and the other end of the vent pipe 7 is connected to the outside.

[0034] In one embodiment, a connection hole 54 is formed on the sealing cover 51 , and one end of the rubber tube 6 passes through the connection hole 54 and extends to the inside of the rubber bottle 1 .

[0035] In one embodiment, the sealing pad 52 is made of a soft material, such as a silicone material or other softer materials.

[0036] In one embodiment, during installation, the sealing gasket 52 covers the bottle mouth 11 of the glue bottle 1, and the bottle mouth 11 of the glue bottle 1 and the sealing gasket 52 are squeezed to cause the sealing gasket 52 to deform. There is a certain squeezing force between the bottle mouth 11 of the glue bottle 1 and the sealing gasket 52, so that the sealing effect is better, wherein the deformation degree of the sealing gasket 52 is relatively light.

[0037] In one embodiment, the size of the sealing gasket 52 is preferably 50 mm, which can meet the size of the bottle mouth 11 of almost all plastic bottles 1.

[0038] In one embodiment, the sealing cover 51 includes a cover body 511 and a boss 512 disposed below the cover body 511 . The boss 512 is provided with a groove 513 (not shown in the figure). The sealing gasket 52 is stuck in the groove 513 to form a connection with the sealing cover 51 .

[0039] In one embodiment, the size of the boss 512 is smaller than the diameter of the bottle mouth 11 of the plastic bottle 1 .

[0040] In one embodiment, the connecting rod 4 is fixed to the column 3 in a clamping manner, and an operator manually adjusts the height of the connecting rod 4 to meet the needs of plastic bottles 1 of different heights.

[0041] The foregoing description of several embodiments of the present application is presented for illustrative purposes. The foregoing description is not intended to be exhaustive, nor is it intended to limit the present application to the precise configurations, constructions and / or steps disclosed, and it is apparent that many modifications and variations may be made in light of the teachings above. The scope of the present invention and all equivalents are intended to be defined by the appended claims.

Claims

1. A glue bottle assembly for semiconductor equipment, characterized in that: It includes a glue bottle, a device platform, a column arranged on the device platform, a connecting rod, a sealing assembly, a rubber hose and a ventilation pipe, wherein the rubber hose and the ventilation pipe are arranged on the sealing assembly, one end of the connecting rod is arranged on the column, and the connecting rod can be raised and lowered along the column to adjust the height, the sealing assembly is arranged at the other end of the connecting rod, and the sealing assembly includes a sealing cover and a sealing gasket, the sealing gasket is fitted under the sealing cover, and when installed, the sealing gasket covers the bottle mouth of the glue bottle.

2. The glue bottle assembly for semiconductor equipment according to claim 1, characterized in that: The sealing cover is provided with a vent hole, one end of the vent pipe is inserted into the vent hole, and the other end of the vent pipe is communicated with the outside.

3. The glue bottle assembly for semiconductor equipment according to claim 1, characterized in that: The sealing cover is provided with a connecting hole, and one end of the rubber hose passes through the connecting hole and extends to the inside of the rubber bottle.

4. The glue bottle assembly for semiconductor equipment according to claim 1, characterized in that: The sealing pad is made of soft material.

5. The glue bottle assembly for semiconductor equipment according to claim 4, characterized in that: During installation, the sealing gasket covers the bottle mouth of the glue bottle, and the bottle mouth of the glue bottle is squeezed by the sealing gasket so that the sealing gasket is deformed.

6. The glue bottle assembly for semiconductor equipment according to claim 1, characterized in that: The size of the sealing gasket is between 10mm and 50mm.

7. The glue bottle assembly for semiconductor equipment according to claim 1, characterized in that: The sealing cover comprises a covering body and a boss arranged below the covering body. The boss is provided with an embedding groove. The sealing gasket is clamped in the embedding groove to form a connection with the sealing cover.

8. The glue bottle assembly for semiconductor equipment according to claim 7, characterized in that: The size of the boss is smaller than the diameter of the mouth of the glue bottle.

9. The glue bottle assembly for semiconductor equipment according to claim 1, characterized in that: The connecting rod is fixed on the column in a clamping manner, and the height of the connecting rod is adjusted manually.

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