Semiconductor packaging resin tray cleaning device

Abstract

The invention relates to a semiconductor packaging resin tray cleaning device which comprises a conveying mechanism used for bearing a resin tray to move along a preset moving track and configured to be in non-contact bearing with the lower surface of the resin tray, and the conveying mechanism comprises an upper plate tightly sealing holes in the surface of the resin tray; the internal cleaning mechanism comprises a lower plate, a sealing plate capable of vertically moving, a sealing cover and an inner brush plate; an upper plate of the conveying mechanism is combined with a lower plate, a sealing cover, a sealing plate and other structures of the internal cleaning mechanism to form a separable and combinable closed cavity, the inner wall of a surface hole of the resin tray is always cleaned in the closed cavity, external dust contamination can be prevented, powder resin is prevented from flying and being contaminated everywhere, and the service life of the resin tray is prolonged. Powder resin on the surface of the resin tray is quickly and thoroughly cleaned, and defects such as glue overflowing and pits in semiconductor packaging are prevented.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor integrated circuit manufacturing equipment, and in particular to a semiconductor packaging resin tray cleaning device. Background Art

[0002] In order to protect electronic chips at room temperature, electronic parts are generally sealed with resin. There are two methods of resin sealing: injection molding and die casting. Die casting is performed by die casting through the upper and lower molds of the mold. Powdered resin is supplied to the cavity of the lower mold, and the substrate or lead frame with the electronic chip is adsorbed to the upper mold. The lower mold melts the powdered resin by heating, and the substrate with the electronic chip is encapsulated by die casting by combining the upper and lower molds. The existing traditional packaging device is a large particle that is heated and injected into the mold cavity of the mold, which will cause residual resin and waste; and the pressure and resin flow generated by the injection molding will cause damage and displacement of the chip leads or solder joints.

[0003] Using powdered resin instead of large-particle resin injection molding can effectively reduce damage to chip leads or solder joints, but powdered resin can easily cause contamination of the tray carrying the resin, which in turn leads to defects such as overflow of glue and pits in the package during continuous operation; in particular, a large amount of powdered resin will accumulate in the holes on the surface of the resin tray. In the prior art, powdered resin is easily splashed and contaminated everywhere by manual cleaning or cleaning in an open space, and it cannot be cleaned thoroughly, affecting the yield rate in the package; and the transfer and cleaning journey is long and the cleaning efficiency is low. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] The object of the present invention is to provide a semiconductor packaging resin tray cleaning device, which can quickly and thoroughly clean the powdered resin on the surface of the resin tray to prevent semiconductor packaging defects such as glue overflow and pits.

[0006] 2. Technical Solution

[0007] The present invention is achieved through the following technical solutions:

[0008] According to a first aspect of the present invention, there is provided a semiconductor packaging resin tray cleaning device, comprising:

[0009] A conveying mechanism, used to carry the resin tray and move it along a preset moving track, and is configured to carry the resin tray in a non-contact manner with the lower surface of the resin tray, wherein the conveying mechanism includes an upper plate that tightly seals the holes on the surface of the resin tray;

[0010] The internal cleaning mechanism includes a lower plate, a sealing plate capable of vertical movement, a sealing cover, and an inner brush plate; wherein,

[0011] The lower plate is used to support the resin tray. The surface of the lower plate is provided with a through groove whose circumferential contour completely encompasses the circumferential contour of the hole on the surface of the resin tray. The lower plate is configured to move in a vertical direction so that the resin tray can be pressed under the upper plate by the lower plate when it is transported by the transport mechanism to the end position of a preset moving track.

[0012] The sealing cover seamlessly connects the outer contour of the sealing plate and the circumferential edge of the through groove, and defines a connected closed chamber between the sealing cover, the sealing plate, the upper plate, the lower plate and the surface holes of the resin tray;

[0013] The inner brush plate is provided with bristles around its circumference, and the inner brush plate is fixed to the top of the sealing plate through a connecting rod, and can move vertically synchronously with the sealing plate to clean the surface holes of the resin tray;

[0014] The sealing plate is provided outside with a first negative pressure pipeline for communicating with the sealed chamber.

[0015] According to an embodiment of the present invention, a plurality of air holes are provided on the surface of the inner brush plate to connect the upper and lower spaces thereof;

[0016] The bristles are provided in multiple layers and are densely arranged. The bristles are in close contact with the inner walls of the holes on the surface of the resin tray, so that when the inner brush plate moves up and down, the gas between the upper and lower surfaces of the inner brush plate cannot flow quickly and fully to generate a pressure difference.

[0017] According to an embodiment of the present invention, the internal cleaning mechanism further comprises a bottom plate, a first cylinder fixed to the bottom plate, and four positioning rods respectively fixed to the four corners of the upper surface of the bottom plate;

[0018] The telescopic end of the first cylinder faces upward and is fixedly connected to the bottom surface of the lower plate;

[0019] A guide hole is provided at the top of the positioning rod, and fixing holes are provided at the four corners of the lower plate. Guide pins are fixed in the fixing holes, and the lower ends of the guide pins extend to the bottom of the lower plate and are slidably connected to the guide holes.

[0020] According to an embodiment of the present invention, a bracket is fixedly connected below the lower plate, and the internal cleaning mechanism further comprises a second cylinder fixedly connected to the bracket, wherein the telescopic end of the second cylinder faces upward and is fixedly connected to the sealing plate;

[0021] The surface of the bracket is provided with a square groove through which the first negative pressure pipe can pass.

[0022] According to an embodiment of the present invention, a bottom cleaning mechanism is provided in the middle of a predetermined moving track of the resin tray conveyed by the conveying mechanism, and the bottom cleaning mechanism includes a support frame, a third cylinder fixed on the support frame, and a bottom brush plate fixedly connected to the top of the third cylinder.

[0023] According to an embodiment of the present invention, bristles are densely arranged around the edge of the upper surface of the bottom brush plate, and a second negative pressure pipe is arranged at the bottom of the bottom brush plate, and the second negative pressure pipe is connected to the space above the bottom brush plate.

[0024] According to an embodiment of the present invention, the conveying mechanism includes a linear guide rail, a frame slidably connected to the linear guide rail, and a clamping assembly, the frame includes the upper plate, and the clamping assembly is arranged above the upper plate; wherein the clamping assembly includes:

[0025] Bidirectional linear module fixed on the frame;

[0026] Two sliders connected to the bidirectional linear module in an opposite and symmetrical sliding manner;

[0027] A sliding pin fixedly connected to the side of the slider;

[0028] Two pairs of bearing seat groups, each bearing seat group comprising two bearing seats relatively fixed on the upper plate;

[0029] A shaft rotatably connected to the bearing seat assembly, with both ends of the shaft extending to the outside of both sides of the upper plate;

[0030] A moving block fixedly connected to the middle of the shaft, wherein a waist-shaped groove is provided on the side of the moving block;

[0031] A clamping rod is fixedly connected to both ends of the shaft rod, and the end of the clamping rod extends to the bottom of the upper plate and is formed with a hook portion that is clamped and connected with preset notches on both sides of the resin tray.

[0032] Wherein, the sliding pin is slidably connected to the waist-shaped groove.

[0033] 3. Beneficial Effects

[0034] One or more of the above embodiments have the following advantages or beneficial effects:

[0035] 1. With a semiconductor packaging resin tray cleaning device according to an embodiment of the present invention, the upper plate of the conveying mechanism, the lower plate of the internal cleaning mechanism, the sealing cover, the sealing plate and other structures are combined to form a detachable and combined closed chamber. The inner wall cleaning process of the surface holes of the resin tray is always in the closed chamber, which can prevent external dust from being contaminated and prevent the powdered resin from flying and contaminating everywhere. The powdered resin on the surface of the resin tray is cleaned quickly and thoroughly, and the semiconductor packaging is prevented from having defects such as glue overflow and pits.

[0036] 2. The present invention integrates part of the structure of the closed chamber required for cleaning the holes on the surface of the resin tray on the conveying mechanism, combines the two processes of transferring the resin tray to the cleaning station and cleaning the holes on the surface of the resin tray, simplifies the mechanical structure and work flow, and improves the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above contents and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0038] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0039] Figure 2 yes Figure 1 A partial enlarged view of part A;

[0040] Figure 3 yes Figure 1 Front perspective view of

[0041] Figure 4 yes Figure 3 A partial enlarged view of part B;

[0042] Figure 5 It is an exploded view of the internal cleaning mechanism;

[0043] Figure 6 It is a schematic diagram of the structure of the internal cleaning mechanism;

[0044] Figure 7 It is a structural diagram of the bottom cleaning mechanism;

[0045] 1. Conveying mechanism; 101. Frame; 1011. Upper plate; 102. Linear guide; 103. Clamping assembly; 1031. Bidirectional linear module; 1032. Sliding block; 1033. Sliding pin; 1034. Bearing seat assembly; 1035. Shaft; 1036. Moving block; 10361. Waist groove; 1037. Clamping rod; 10371. Hook; 2. Internal cleaning mechanism; 201. Lower plate; 2011. Through groove; 2012. Fixing hole; 202. Sealing plate ; 203, sealing cover; 204, inner brush plate; 2041, air hole; 205, connecting rod; 206, bottom plate; 207, first cylinder; 208, positioning rod; 2081, guide hole; 209, guide pin; 210, bracket; 2101, square groove; 211, second cylinder; 3, closed chamber; 4, first negative pressure pipe; 5, bottom cleaning mechanism; 501, support frame; 502, third cylinder; 503, bottom brush plate; 504, second negative pressure pipe; 6-resin tray. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present invention.

[0047] It should be noted that in the drawings, the size and relative size of the elements may be exaggerated for the purpose of clarity and / or description. Thus, the size and relative size of each element are not necessarily limited to the size and relative size shown in the drawings. In the specification and drawings, the same or similar reference numerals indicate the same or similar parts.

[0048] When an element is described as being "on" another element, "connected to" another element, or "coupled to" another element, the element may be directly on, directly connected to, or directly coupled to the other element, or there may be intermediate elements. However, when an element is described as being "directly on", "directly connected to", or "directly coupled to" another element, there are no intermediate elements. Other terms and / or expressions used to describe the relationship between elements should be interpreted in a similar manner, for example, "between" versus "directly between", "adjacent" versus "directly adjacent", or "on" versus "directly on", etc. As used herein, the term "and / or" includes any and all combinations of one or more of the listed related items.

[0049] It should be noted that, although the terms "first", "second", etc. may be used herein to describe various parts, components, elements, regions, layers and / or parts, these parts, components, elements, regions, layers and / or parts should not be limited by these terms. Instead, these terms are used to distinguish one part, component, element, region, layer and / or part from another. Thus, for example, the first part, first member, first element, first region, first layer and / or first part discussed below may be referred to as the second part, second member, second element, second region, second layer and / or second part without departing from the teachings of the present invention.

[0050] For ease of description, spatial relational terms, such as "upper", "lower", "left", "right", etc., may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figure. It should be understood that the spatial relational terms are intended to cover other different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the figure is turned upside down, elements described as "below" or "beneath" other elements or features will be oriented "above" or "above" the other elements or features.

[0051] The embodiment of the present invention provides a semiconductor packaging resin tray 6 cleaning device, see Figure 1-6 , including a conveying mechanism 1, an internal cleaning structure and a bottom cleaning mechanism 5; wherein the internal cleaning structure is used to clean the surface holes of the semiconductor packaging resin tray 6, and the bottom cleaning mechanism 5 is used to clean the bottom of the resin tray 6.

[0052] The conveying mechanism 1 is used to carry the resin tray 6 and move it along a preset moving trajectory, the end of which is located above the internal cleaning mechanism 2; the bottom cleaning mechanism 5 is arranged in the middle of the preset moving trajectory of the resin tray 6 conveyed by the conveying mechanism 1, and cleans the lower surface of the resin tray 6 during the conveying process to ensure the cleanliness of the contact surface of the resin tray 6 and improve efficiency.

[0053] The conveying mechanism 1 is configured to carry the lower surface of the resin tray 6 in a non-contact manner, even if the lower surface of the resin tray 6 is a flat surface;

[0054] Figure 1-4 The specific structure of the conveying mechanism 1 is shown. The conveying mechanism 1 includes a linear guide 102, a frame 101 slidably connected to the linear guide 102, and a clamping assembly 103, wherein the clamping assembly 103 clamps the resin tray 6 from the side so that the resin tray 6 is in a non-contact supported state on the lower surface; the frame 101 includes an upper plate 1011, and the clamping assembly 103 is arranged above the upper plate 1011. The linear guide 102 drives the frame 101 to move, the frame 101 drives the clamping assembly 103 to move, and the clamping assembly 103 drives the resin tray 6 to move.

[0055] See also Figure 1-2The clamping assembly 103 includes a bidirectional linear module 1031 fixed on the frame 101, two sliders 1032 symmetrically connected to the bidirectional linear module 1031, a sliding pin 1033 fixedly connected to the side of the slider 1032, two pairs of bearing seat assemblies 1034, a shaft 1035 rotatably connected to the bearing seat assemblies 1034, a moving block 1036 fixedly connected to the middle of the shaft 1035, and a clamping rod 1037; wherein the bearing seat assemblies 1034 include two relatively fixed The bearing seat is fixed on the upper plate 1011; the two ends of the shaft 1035 extend to the outside of the two sides of the upper plate 1011, and the clamping rod 1037 is fixedly connected to the two ends of the shaft 1035, and the end of the clamping rod 1037 extends to the bottom of the upper plate 1011, and is formed with a hook portion 10371 that is engaged with the preset notches on both sides of the resin tray 6; a waist-shaped groove 10361 is opened on the side of the moving block 1036, and the sliding pin 1033 is slidably connected to the waist-shaped groove 10361, and the sliding pin 1033 can slide and rotate in the waist-shaped groove 10361. The process of the clamping assembly 103 clamping the resin tray 6 is that the two sliders 1032 thereon are driven to move in opposite directions through the bidirectional linear module 1031, the slider 1032 drives the sliding pin 1033 to move, the sliding pin 1033 rotates and moves in the waist-shaped groove 10361, driving the moving block 1036 and the shaft 1035 to rotate synchronously, the shaft 1035 drives the clamping rod 1037 to rotate, and the hooks 10371 of the two opposite clamping rods 1037 are engaged with the preset notches on both sides of the resin tray 6, so that the resin tray 6 is fit and fixed under the upper plate 1011, and the upper plate 1011 tightly closes the holes on the surface of the resin tray 6.

[0056] Among them, see Figure 5-6 The internal cleaning mechanism 2 includes a lower plate 201, a sealing plate 202 capable of vertical movement, a sealing cover 203, and an inner brush plate 204; the lower plate 201 supports the resin tray 6 from below, and a through groove 2011 is provided on the surface of the lower plate 201, and the circumferential contour line of the through groove 2011 completely covers the circumferential contour line of the hole on the surface of the resin tray 6;

[0057] The internal cleaning mechanism 2 also includes a bottom plate 206, a first cylinder 207 fixed on the bottom plate 206, and four positioning rods 208 respectively fixed at the four corners of the upper surface of the bottom plate 206; the telescopic end of the first cylinder 207 faces upward and is fixedly connected to the bottom surface of the lower plate 201; a guide hole 2081 is opened at the top of the positioning rod 208, and fixing holes 2012 are opened at the four corners of the lower plate 201. A guide pin 209 is fixed in the fixing hole 2012, and the lower end of the guide pin 209 extends to the bottom of the lower plate 201 and is connected to the guide pin 209. The first cylinder 207 is extended and retracted to drive the lower plate 201 to move up and down, and the guide pin 209 slides in the guide hole 2081 to stabilize the moving direction, so that the lower plate 201 is configured to move in the vertical direction; when the resin tray 6 is transported by the conveying mechanism 1 to the end position of the preset moving track, the first cylinder 207 lifts the lower plate 201, so that the resin tray 6 is pressed under the upper plate 1011 by the lower plate 201, and at this time, the through groove 2011 is located below the surface hole of the resin tray 6;

[0058] The sealing cover 203 is seamlessly connected between the outer contour of the sealing plate 202 and the circumferential edge of the through groove 2011, and the sealing cover 203, the sealing plate 202, the upper plate 1011, the lower plate 201 and the surface holes of the resin tray 6 are defined as a connected closed chamber 3, and a first negative pressure pipe 4 connected to the closed chamber 3 is arranged on the outside of the sealing plate 202; the first negative pressure pipe 4 is connected to an external dust suction device, and absorbs the powder resin cleaned out of the closed chamber 3 by the inner brush plate 204 through negative pressure, wherein a separable and combinable closed chamber 3 is formed by combining the upper plate 1011 of the conveying mechanism 1 with the lower plate 201 of the internal cleaning mechanism 2, the sealing cover 203, the sealing plate 202 and other structures, and part of the structure of the closed chamber 3 required for cleaning the holes on the surface of the resin tray 6 is integrated on the conveying mechanism 1, and the two processes of transferring the resin tray 6 to the cleaning station and cleaning the holes on the surface of the resin tray 6 are combined, thereby simplifying the mechanical structure and the work process and improving the cleaning efficiency.

[0059] A bracket 210 is fixedly connected below the lower plate 201, and the internal cleaning mechanism 2 also includes a second cylinder 211 fixedly connected to the bracket 210, and the telescopic end of the second cylinder 211 faces upward and is fixedly connected to the sealing plate 202; a square groove 2101 is provided on the surface of the bracket 210 so that the first negative pressure pipe 4 can pass through, and the second cylinder 211 drives the sealing plate 202 to move vertically;

[0060] The inner brush plate 204 is provided with bristles around its circumference, and the inner brush plate 204 is fixed above the sealing plate 202 by the connecting rod 205; the sealing plate 202 moves vertically with the extension and retraction of the second cylinder 211, and the sealing plate 202 drives the sealing cover 203 to expand and contract, and drives the inner brush plate 204 to move vertically synchronously to clean the surface holes of the resin tray 6; the cleaning process of the inner wall of the surface holes of the resin tray is always in a sealed environment, which can prevent external dust from being contaminated, and prevent powdered resin from flying and contaminating everywhere, thereby improving the cleaning effect.

[0061] According to the embodiment of the present invention, a plurality of air holes 2041 are provided on the surface of the inner brush plate 204 to connect the upper and lower spaces thereof; the bristles are provided in multiple layers and are densely arranged, and the bristles are in close contact with the inner wall of the holes on the surface of the resin tray 6; when the inner brush plate 204 moves up and down with the sealing plate 202, the gas between the upper and lower surfaces of the inner brush plate 204 cannot flow quickly and fully, and a pressure difference is generated;

[0062] Specifically, when the inner brush plate 204 moves downward, the volume of the space above the inner brush plate 204 becomes larger, the air pressure becomes lower, the air pressure below the inner brush plate 204 is higher than the air pressure above, and the air flow will flow from the air hole 2041, and the inner wall of the holes on the surface of the resin tray 6 from bottom to top, so that the bristles, the inner wall of the holes on the surface of the resin tray 6 and the powder resin in the space above the inner brush plate 204 float up with the air flow; when the inner brush plate 204 moves upward, the volume of the space above the inner brush plate 204 becomes smaller, the air pressure increases, the air pressure below the inner brush plate 204 is lower than the air pressure above, and the powder resin moves to the bottom of the inner brush plate 204 with the air flow, and when the inner brush plate 204 rises to the top in the closed cavity, the powder resin floating above the inner brush plate 204 is discharged to the bottom of the inner brush plate 204 with the gas flow, and then is sucked away by the first negative pressure pipe 4. In order to ensure the cleaning effect, during the lifting process of the inner brush plate 204, the first negative pressure pipe 4 can be set to be in a closed state so that the powder resin is repeatedly brushed and kept floating, or set to be in a slightly low pressure state so that most of the powder resin is continuously sucked into the first negative pressure pipe 4. When the inner brush plate 204 rises to the top in the closed cavity, the first negative pressure pipe 4 is in a maximum suction state, so that the powder resin in the closed chamber 3 is exhausted;

[0063] Through a single or multiple lifting process, the powdered resin contaminated on the inner walls of the holes on the surface of the resin tray 6 can be ensured to be cleaned up, avoiding packaging defects such as overflowing glue and pits due to contamination of the resin tray 6; at the same time, because the air flow flows between the bristles and the inner walls of the holes on the surface of the resin tray 6, the surface of the bristles is kept clean, avoiding the accumulation of powdered resin on the bristles, and extending the use time of the inner brush plate 204 and the bristles when cleaning multiple resin trays 6, thereby improving work efficiency.

[0064] According to an embodiment of the present invention, a bottom cleaning mechanism 5 is provided in the middle of a predetermined moving track of the resin tray 6 transported by the conveying mechanism 1, and the bottom cleaning mechanism 5 includes a support frame 501, a third cylinder 502 fixed on the support frame 501, and a bottom brush plate 503 fixedly connected to the top of the third cylinder 502. Bristles are densely arranged around the edge of the upper surface of the bottom brush plate 503, and a second negative pressure pipe 504 is arranged at the bottom of the bottom brush plate 503, and the second negative pressure pipe 504 is connected to the space above the bottom brush plate 503. In the process of the conveying mechanism 1 moving the resin tray 6 above the internal cleaning mechanism 2, the third cylinder 502 drives the bottom brush plate 503 to move upward, and the bristles on the bottom brush plate 503 clean the powdered resin contaminated on the working surface (lower surface) of the resin tray 6. At the same time, the second negative pressure pipe 504 absorbs the powdered resin through negative pressure.

[0065] It should be understood that the cutting device according to the embodiment of the present invention has all the characteristics and advantages of the above-mentioned alignment mechanism. For details, please refer to the above description, which will not be repeated here.

[0066] It will be appreciated by those skilled in the art that the features described in the various embodiments of the present invention may be combined and / or combined in various ways, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, without departing from the spirit and teachings of the present invention, the features described in the various embodiments of the present invention may be combined and / or combined in various ways. All of these combinations and / or combinations fall within the scope of the present invention.

Claims

1. A semiconductor packaging resin tray cleaning device, characterized in that: include: A conveying mechanism (1) is used to carry the resin tray (6) and move it along a preset moving track, and is configured to carry the resin tray (6) in a non-contact manner with the lower surface of the resin tray (6), wherein the conveying mechanism (1) comprises an upper plate (1011) that tightly seals holes on the surface of the resin tray (6); The internal cleaning mechanism (2) comprises a lower plate (201), a sealing plate (202) capable of vertical movement, a sealing cover (203), and an inner brush plate (204); wherein: The lower plate (201) is used to support the resin tray (6); a through groove (2011) is provided on the surface of the lower plate (201) and the circumferential contour line completely encompasses the circumferential contour line of the hole on the surface of the resin tray (6); the lower plate (201) is configured to move in a vertical direction so that the resin tray (6) can be pressed under the upper plate (1011) by the lower plate (201) when it is transported by the transport mechanism (1) to the end position of a preset movement track; The sealing cover (203) seamlessly connects the outer contour of the sealing plate (202) and the circumferential edge of the through groove (2011), and defines a connected closed chamber (3) between the surface holes of the sealing cover (203), the sealing plate (202), the upper plate (1011), the lower plate (201) and the resin tray (6); The inner brush plate (204) is provided with bristles around its circumference. The inner brush plate (204) is fixed to the top of the sealing plate (202) through a connecting rod (205) and can move vertically synchronously with the sealing plate (202) to clean the surface holes of the resin tray (6); The sealing plate (202) is provided outside with a first negative pressure pipe (4) for communicating with the sealed chamber (3).

2. A semiconductor packaging resin tray cleaning device according to claim 1, characterized in that: The surface of the inner brush plate (204) is provided with a plurality of air holes (2041) communicating with the upper and lower spaces thereof; The bristles are arranged in multiple layers and densely, and the bristles are in close contact with the inner walls of the holes on the surface of the resin tray (6), so that when the inner brush plate (204) moves up and down, the gas between the upper and lower surfaces of the inner brush plate (204) cannot flow quickly and fully to generate a pressure difference.

3. A semiconductor packaging resin tray cleaning device according to claim 2, characterized in that: The internal cleaning mechanism (2) further comprises a bottom plate (206), a first cylinder (207) fixed on the bottom plate (206), and four positioning rods (208) respectively fixed at four corners of the upper surface of the bottom plate (206); The telescopic end of the first cylinder (207) faces upward and is fixedly connected to the bottom surface of the lower plate (201); A guide hole (2081) is provided at the top of the positioning rod (208), and fixing holes (2012) are provided at the four corners of the lower plate (201). A guide pin (209) is fixed in the fixing hole (2012), and the lower end of the guide pin (209) extends to the bottom of the lower plate (201) and is slidably connected to the guide hole (2081).

4. A semiconductor packaging resin tray cleaning device according to claim 3, characterized in that: A bracket (210) is fixedly connected below the lower plate (201), and the internal cleaning mechanism (2) further comprises a second cylinder (211) fixedly connected to the bracket (210), wherein the telescopic end of the second cylinder (211) faces upward and is fixedly connected to the sealing plate (202); The surface of the support (210) is provided with a square groove (2101) capable of allowing the first negative pressure pipe (4) to pass through.

5. A semiconductor packaging resin tray cleaning device according to any one of claims 1 to 4, characterized in that: A bottom cleaning mechanism (5) is provided in the middle of a predetermined moving track of the conveying mechanism (1) conveying the resin tray (6), and the bottom cleaning mechanism (5) comprises a support frame (501), a third cylinder (502) fixed on the support frame (501), and a bottom brush plate (503) fixedly connected to the top of the third cylinder (502).

6. A semiconductor packaging resin tray cleaning device according to claim 5, characterized in that: Brush bristles are densely arranged around the edge of the upper surface of the bottom brush plate (503), and a second negative pressure pipe (504) is arranged at the bottom of the bottom brush plate (503), and the second negative pressure pipe (504) is connected to the space above the bottom brush plate (503).

7. A semiconductor packaging resin tray cleaning device according to claim 1, characterized in that: The conveying mechanism (1) comprises a linear guide rail (102), a frame (101) slidably connected to the linear guide rail (102), and a clamping assembly (103), wherein the frame (101) comprises the upper plate (1011), and the clamping assembly (103) is arranged above the upper plate (1011); wherein the clamping assembly (103) comprises: A bidirectional linear module (1031) fixed on the frame (101); Two sliders (1032) symmetrically and slidably connected to the bidirectional linear module (1031); A sliding pin (1033) fixedly connected to the side of the sliding block (1032); Two pairs of bearing seat groups (1034), wherein the bearing seat groups (1034) include two bearing seats relatively fixed on the upper plate (1011); A shaft (1035) rotatably connected to the bearing seat assembly (1034), wherein both ends of the shaft (1035) extend to the outside of both sides of the upper plate (1011); A moving block (1036) fixedly connected to the middle of the shaft (1035), wherein a waist-shaped groove (10361) is provided on a side surface of the moving block (1036); A clamping rod (1037) is fixedly connected to both ends of the shaft rod (1035), wherein the ends of the clamping rod (1037) extend below the upper plate (1011) and are formed with hooks (10371) that are engaged with preset notches on both sides of the resin tray (6). Wherein, the sliding pin (1033) is slidably connected to the waist-shaped groove (10361).

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