Diffusion furnace multi-temperature-zone wafer diffusion device and diffusion furnace multi-temperature-zone wafer diffusion process
By designing multiple sets of heating pipes and quartz pipes in the diffusion furnace, and using the cooperation of the drive motor, gears and electric push rods, the multi-temperature diffusion treatment of the wafer is achieved, solving the problem of temperature fixation of the traditional diffusion furnace and improving process flexibility and efficiency.
Patent Information
- Application Number
- CN202510102260.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-04-22
AI Technical Summary
The internal temperature of traditional diffusion furnaces is relatively fixed, making it difficult to achieve multi-temperature diffusion treatment on different wafer surfaces, resulting in an increase in economic consumption.
A multi-temperature wafer diffusion device of diffusion furnace is designed. By setting up multiple sets of heating pipes and quartz pipes in the diffusion furnace body, and using the cooperation of driving motors, gears and electric push rods, dynamic sleeve and control of heating pipes at different temperatures is achieved.
Multi-temperature diffusion processing of wafers is realized, the flexibility and efficiency of the diffusion process are improved, and the economic consumption of purchasing diffusion furnaces of different temperatures is reduced.
Smart Images
Figure CN119859853A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of wafer diffusion multi-temperature control, and in particular to a diffusion furnace multi-temperature zone wafer diffusion device and process. Background Art
[0002] The diffusion furnace is one of the important process equipment in the front process of the semiconductor production line. It is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices and optical fibers.
[0003] In the prior art, a diffusion furnace can be used to realize diffusion processing of wafers at different temperatures during the semiconductor manufacturing process. This device can improve the flexibility and efficiency of the diffusion process.
[0004] However, the internal temperature of traditional diffusion furnaces is relatively fixed, which is not convenient for achieving different temperature diffusion effects on different wafer surfaces. Therefore, it is necessary to purchase diffusion furnaces of different temperatures for use, which greatly increases the economic consumption problem. To this end, the present invention proposes a diffusion furnace multi-temperature zone wafer diffusion device and process to solve the above-mentioned technical problems. Summary of the invention
[0005] The object of the present invention is to provide a multi-temperature zone wafer diffusion device and process for a diffusion furnace to solve the problems raised in the above background technology.
[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a diffusion furnace multi-temperature zone wafer diffusion device, the diffusion furnace multi-temperature zone wafer diffusion device comprising: a diffusion furnace body, a control panel is arranged on the side of the diffusion furnace body, a sealing plate is arranged on the side of the diffusion furnace body, a quartz tube is arranged in the sealing plate, a placement tube can be inserted into the quartz tube, and a wafer can be placed in the placement tube, an electric push rod is arranged on the inner side of the diffusion furnace body, a mounting plate is arranged at one end of the electric push rod, a support rod is arranged on the surface of the mounting plate, a drive motor is arranged on the side of the support rod, and a gear is sleeved on the transmission end of the drive motor; A support frame is provided with a gear ring on its surface, a positioning ring is provided at one end of the support frame, a positioning plate is installed on the surface of the positioning ring, a heating tube is provided on the surface of the positioning plate, and a heater is provided on the side of the heating tube.
[0007] Preferably, a fixing ring is provided on the surface of the placement tube, a sealing gasket is provided on the end face of the quartz tube, the sealing gasket is in the form of an annular plate, a vertical plate is provided on the surface of the sealing plate, the vertical plate is in the form of a square plate, a rotating rod is inserted into the vertical plate, a bottom plate is provided at one end of the rotating rod, and the rotating rod can rotate in the vertical plate.
[0008] Preferably, a threaded tube is provided on the surface of the bottom plate, a limit screw is threaded inside the threaded tube, a limit bearing is sleeved on the surface of the limit screw, the limit screw is fixedly connected to the inner ring surface of the limit bearing, and a limit plate is provided on the outer ring surface of the limit bearing, and the limit plate can press the fixing ring.
[0009] Preferably, the electric push rod is fixedly connected to the inner side of the diffusion furnace body, the mounting plate is fixedly connected to the lifting end of the electric push rod, the control panel, the heater and the electric push rod are electrically connected, the heater and the heating tube are electrically connected, and the control panel can control the electric push rod and the heater.
[0010] Preferably, a movable plate is provided on the inner side of the diffusion furnace body, and the movable plate is an "L"-shaped plate structure as a whole. A through hole is opened on the side of the movable plate, and the support rod is inserted into the through hole opened on the side of the movable plate. The support rod can be displaced in the movable plate, and a mounting frame is provided on the side of the support rod, and the drive motor is fixedly connected in the mounting frame.
[0011] Preferably, a first bearing is provided on the surface of the support frame, one end of the support rod is fixedly connected to the inner ring surface of the first bearing, the gear ring is fixedly connected to the surface of the support frame, the gear and the gear ring are meshed with each other for transmission, the positioning ring is fixedly connected to the end face of the support frame, and a mounting hole is opened on the surface of the positioning ring.
[0012] Preferably, the positioning plate is fixedly connected to the end face of the heating tube, a positioning slot is provided on the surface of the positioning plate, a threaded rod is provided on the surface of the positioning slot, a limiting hole is provided on the side of the threaded rod, and the positioning ring can be mounted on the threaded rod using the mounting hole provided on the surface.
[0013] Preferably, a limiting nut is threaded on the threaded rod, a second vertical plate is provided on the surface of the limiting nut, a movable rod is provided on the side of the second vertical plate, an elastic band is provided on the side of the second vertical plate, a second fixed rod is provided on the side of the elastic band, a movable opening is opened on the side of the second fixed rod, the second fixed rod is mounted on the movable rod using the movable opening, the second fixed rod can be displaced along the movable rod, and the second fixed rod can be inserted into the limiting hole.
[0014] A process for a multi-temperature zone wafer diffusion device in a diffusion furnace specifically comprises the following steps: S1: First, the placement tube containing the wafer is inserted into the quartz tube and fixed and sealed with a limit plate; S2: Then the driving motor can be started to drive the multiple groups of heating tubes to rotate in coordination with the meshing action of the gear and the gear ring. When the heating tubes rotate to a suitable position, the electric push rod can be started to push the support rod, so that the heating tubes of the corresponding temperature can be set on the quartz tube; S3: Then the heater can be controlled to work through the control panel, so that the heating tube can heat the wafer in the quartz tube for temperature diffusion treatment. When heating at different temperatures is required at the same time, different heating tubes can be used to diffuse the wafer.
[0015] Compared with the prior art, the present invention has the following beneficial effects: The diffusion furnace multi-temperature zone wafer diffusion device and process proposed by the present invention, when in use, first the placement tube containing the wafers is inserted into the quartz tube for fixed sealing, and then the drive motor can be started to cooperate with the meshing action of the gear and the gear ring to drive the multiple groups of heating tubes to rotate, when the heating tubes are rotated to the appropriate position, the electric push rod can be started to push the support rod, so that the heating tubes of the corresponding temperature can be set on the quartz tube, and then the heater can be controlled to work through the control panel, so that the heating tubes can heat the wafers in the quartz tube for temperature diffusion treatment, when it is necessary to heat at different temperatures at the same time, it is more convenient to use different heating tubes to perform diffusion treatment on the wafers. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a top view of the structure of the present invention; Figure 3 for Figure 2 The enlarged structural diagram at A in the middle; Figure 4 It is a cross-sectional view of the structure of the present invention; Figure 5 This is a schematic diagram of the structure of the heating tube of the present invention; Figure 6 for Figure 5 The enlarged structural diagram at B in the middle; Figure 7 This is a side view of the heating tube structure of the present invention; Figure 8 for Figure 7 The enlarged structural diagram at C in the middle; Fig. 9 This is a schematic diagram of the structure of the present invention after a group of heating tubes are removed.
[0016] In the figure: 1. diffusion furnace body; 2. control panel; 3. sealing plate; 4. quartz tube; 5. placement tube; 6. electric push rod; 7. support rod; 8. driving motor; 9. gear; 10. support frame; 11. gear ring; 12. positioning plate; 13. heating tube; 14. heater; 15. positioning ring; 16. fixing ring; 17. sealing pad; 18. vertical plate; 19. rotating rod; 20. bottom plate; 21. threaded tube; 22. limiting screw; 23. limiting bearing; 24. limiting plate; 25. moving plate; 26. mounting frame; 27. first bearing; 28. mounting hole; 29. positioning slot; 30. threaded rod; 31. limiting hole; 32. limiting nut; 33. second vertical plate; 34. moving rod; 35. elastic band; 36. second fixing rod; 37. moving port; 38. mounting plate. DETAILED DESCRIPTION
[0017] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, not all of them, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0018] Example 1: Please refer to Figure 1-Figure 9 The present invention provides a technical solution: a diffusion furnace multi-temperature zone wafer diffusion device, the diffusion furnace multi-temperature zone wafer diffusion device comprising: a diffusion furnace body 1, a control panel 2 is arranged on the side of the diffusion furnace body 1, a sealing plate 3 is arranged on the side of the diffusion furnace body 1, a quartz tube 4 is arranged in the sealing plate 3, a placement tube 5 can be inserted into the quartz tube 4, and a wafer can be placed in the placement tube 5, an electric push rod 6 is arranged on the inner side of the diffusion furnace body 1, a mounting plate 38 is arranged at one end of the electric push rod 6, a support rod 7 is arranged on the surface of the mounting plate 38, a drive motor 8 is arranged on the side of the support rod 7, and a gear 9 is sleeved on the transmission end of the drive motor 8; A support frame 10, a gear ring 11 is arranged on the surface of the support frame 10, a positioning ring 15 is arranged at one end of the support frame 10, a positioning plate 12 is installed on the surface of the positioning ring 15, a heating tube 13 is arranged on the surface of the positioning plate 12, and a heater 14 is arranged on the side of the heating tube 13; First, the placement tube 5 containing the wafer is inserted into the quartz tube 4 for fixed sealing, and then the drive motor 8 can be started to cooperate with the meshing action of the gear 9 and the gear ring 11 to drive the multiple groups of heating tubes 13 to rotate. When the heating tubes 13 are rotated to the appropriate position, the electric push rod 6 can be started to push the support rod 7, so that the heating tubes 13 of the corresponding temperature can be sleeved on the quartz tube 4, and then the heater 14 can be controlled to work through the control panel 2, so that the heating tubes 13 can heat the wafers in the quartz tube 4 for temperature diffusion treatment. When heating at different temperatures is required at the same time, it is more convenient to use different heating tubes 13 to diffuse the wafers.
[0019] Embodiment 2: On the basis of embodiment 1, in order to facilitate the sealing of the placement tube 5 and the quartz tube 4, a limit plate 24 is provided, a fixing ring 16 is provided on the surface of the placement tube 5, a sealing gasket 17 is provided on the end face of the quartz tube 4, and the sealing gasket 17 is an annular plate structure, a vertical plate 18 is provided on the surface of the sealing plate 3, and the vertical plate 18 is a square plate structure, a rotating rod 19 is inserted into the vertical plate 18, and a bottom plate 20 is provided at one end of the rotating rod 19, and the rotating rod 19 can rotate in the vertical plate 18, a threaded tube 21 is provided on the surface of the bottom plate 20, and a limit screw 22 is threadedly connected in the threaded tube 21, and a limit bearing 23 is sleeved on the surface of the limit screw 22, and the limit screw 22 is fixedly connected to the inner ring surface of the limit bearing 23, and a limit plate 24 is provided on the outer ring surface of the limit bearing 23, and the limit plate 24 can press the fixing ring 16; When in use, first insert the placement tube 5 into the quartz tube 4 to facilitate the reaction of the wafer in the placement tube 5, and then rotate the bottom plate 20 to rotate the limit screw 22 to move the limit screw 22 downward in the threaded tube 21, thereby driving the limit plate 24 to press the fixing ring 16, so that the fixing ring 16 can squeeze the sealing gasket 17, thereby increasing the sealing of the gap between the fixing ring 16 and the end face of the quartz tube 4 to allow the wafer to react better.
[0020] For convenience, the heating tube 13 is sleeved on the quartz tube 4 and is provided with an electric push rod 6, the electric push rod 6 is fixedly connected to the inner side of the diffusion furnace body 1, the mounting plate 38 is fixedly connected to the lifting end of the electric push rod 6, the control panel 2 is electrically connected to the heater 14 and the electric push rod 6, the heater 14 is electrically connected to the heating tube 13, the control panel 2 can control the electric push rod 6 and the heater 14, and the inner side of the diffusion furnace body 1 is provided with a moving plate 25, the moving plate 25 is an "L"-shaped plate structure as a whole, a through hole is opened on the side of the moving plate 25, the support rod 7 is inserted into the through hole opened on the side of the moving plate 25, the support rod 7 can be displaced in the moving plate 25, a mounting frame 26 is provided on the side of the support rod 7, and the drive motor 8 is fixedly connected in the mounting frame 26; During use, when it is necessary to put the heating tube 13 on the quartz tube 4, the electric push rod 6 can be started through the control panel 2 first, and the support rod 7 can be pushed and displaced by the electric push rod 6. The setting of the movable plate 25 can conveniently support the support rod 7 and reduce the pressure problem borne by the electric push rod 6. Then, the electric push rod 6 can conveniently put the heating tube 13 on the quartz tube 4, and then the heater 14 can be started by using the control panel 2. The quartz tube 4 can be heated by heating the heating tube 13 through the heater 14.
[0021] Embodiment 3: On the basis of embodiment 2, in order to facilitate heating different quartz tubes 4 to different temperatures, a support frame 10 is provided, a first bearing 27 is provided on the surface of the support frame 10, one end of the support rod 7 is fixedly connected to the inner ring surface of the first bearing 27, the gear ring 11 is fixedly connected to the surface of the support frame 10, the gear 9 and the gear ring 11 are meshed with each other for transmission, the positioning ring 15 is fixedly connected to the end face of the support frame 10, a mounting hole 28 is provided on the surface of the positioning ring 15, the positioning plate 12 is fixedly connected to the end face of the heating tube 13, a positioning groove 29 is provided on the surface of the positioning plate 12, a threaded rod 30 is provided on the surface of the positioning groove 29, a limiting hole 31 is provided on the side of the threaded rod 30, and the positioning ring 15 can be sleeved on the threaded rod 30 by using the mounting hole 28 provided on the surface; During use, when it is necessary to heat different quartz tubes 4 in the diffusion furnace body 1 to different temperatures, the drive motor 8 can be started first to cooperate with the meshing action of the gear 9 and the gear ring 11, so that the setting of the first bearing 27 can drive the support frame 10 to rotate, so that different heating tubes 13 can be easily rotated to the front of the appropriate quartz tube 4, and then the heating tube 13 can be sleeved on the quartz tube 4 through the electric push rod 6, and different quartz tubes 4 can be heated to different temperatures by using different heating tubes 13.
[0022] In order to facilitate the disassembly of the positioning plate 12 and the positioning ring 15, a threaded rod 30 is provided, and a limiting nut 32 is screwed on the threaded rod 30. A second vertical plate 33 is provided on the surface of the limiting nut 32, and a moving rod 34 is provided on the side of the second vertical plate 33. An elastic belt 35 is provided on the side of the second vertical plate 33, and a second fixing rod 36 is provided on the side of the elastic belt 35. A moving opening 37 is opened on the side of the second fixing rod 36. The second fixing rod 36 is sleeved on the moving rod 34 using the moving opening 37. The second fixing rod 36 can be displaced along the moving rod 34, and the second fixing rod 36 can be inserted into the limiting hole 31; When it is necessary to separate the positioning ring 15 from the positioning plate 12 during use, first pull the second fixing rod 36 to make the second fixing rod 36 move backward along the movable rod 34, so that the second fixing rod 36 is pulled out from the limiting hole 31, so that the limiting nut 32 can be easily rotated, and the limiting nut 32 can be easily screwed out from the threaded rod 30, so that the positioning ring 15 can be disengaged from the positioning slot 29, and the positioning plate 12 can be separated from the positioning ring 15. The setting of the elastic band 35 can position the second fixing rod 36 on the one hand, and prevent the second fixing rod 36 from disengaging from the limiting hole 31 on the other hand. The second fixing rod 36 is inserted into the limiting hole 31 to avoid the problem of loosening of the limiting nut 32 on the threaded rod 30, which improves the stability of the installation of the positioning plate 12 and the positioning ring 15.
[0023] A process for a multi-temperature zone wafer diffusion device in a diffusion furnace specifically comprises the following steps: S1: First, the placement tube 5 containing the wafer is inserted into the quartz tube 4 and fixed and sealed with the limiting plate 24; S2: Then the driving motor 8 can be started to drive the multiple groups of heating tubes 13 to rotate in coordination with the meshing action of the gear 9 and the gear ring 11. When the heating tubes 13 rotate to a suitable position, the electric push rod 6 can be started to push the support rod 7, so that the heating tubes 13 of the corresponding temperature can be sleeved on the quartz tube 4; S3: Then the heater 14 can be controlled to work through the control panel 2, so that the heating tube 13 can heat the wafer in the quartz tube 4 for temperature diffusion treatment. When heating at different temperatures is required at the same time, different heating tubes 13 can be used to diffuse the wafer.
[0024] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A multi-temperature zone wafer diffusion device for a diffusion furnace, characterized in that: The diffusion furnace multi-temperature zone wafer diffusion device comprises: a diffusion furnace body (1), a control panel (2) is arranged on the side of the diffusion furnace body (1), a sealing plate (3) is arranged on the side of the diffusion furnace body (1), a quartz tube (4) is arranged in the sealing plate (3), a placement tube (5) can be inserted into the quartz tube (4), and a wafer can be placed in the placement tube (5), an electric push rod (6) is arranged on the inner side of the diffusion furnace body (1), a mounting plate (38) is arranged at one end of the electric push rod (6), a support rod (7) is arranged on the surface of the mounting plate (38), a drive motor (8) is arranged on the side of the support rod (7), and a gear (9) is sleeved on the transmission end of the drive motor (8); A support frame (10) is provided with a toothed ring (11) on the surface of the support frame (10), a positioning ring (15) is provided at one end of the support frame (10), a positioning plate (12) is mounted on the surface of the positioning ring (15), a heating tube (13) is provided on the surface of the positioning plate (12), and a heater (14) is provided on the side of the heating tube (13).
2. The multi-temperature zone wafer diffusion device of a diffusion furnace according to claim 1, characterized in that: The surface of the placement tube (5) is provided with a fixing ring (16), the end surface of the quartz tube (4) is provided with a sealing gasket (17), the sealing gasket (17) is in the form of an annular plate structure, the surface of the sealing plate (3) is provided with a vertical plate (18), the vertical plate (18) is in the form of a square plate structure, a rotating rod (19) is inserted into the vertical plate (18), a bottom plate (20) is provided at one end of the rotating rod (19), and the rotating rod (19) can rotate in the vertical plate (18).
3. The multi-temperature zone wafer diffusion device of a diffusion furnace according to claim 2, characterized in that: A threaded tube (21) is provided on the surface of the bottom plate (20), a limit screw (22) is threadedly connected inside the threaded tube (21), a limit bearing (23) is sleeved on the surface of the limit screw (22), the limit screw (22) is fixedly connected to the inner ring surface of the limit bearing (23), and a limit plate (24) is provided on the outer ring surface of the limit bearing (23), and the limit plate (24) can press the fixed ring (16).
4. The multi-temperature zone wafer diffusion device of a diffusion furnace according to claim 1, characterized in that: The electric push rod (6) is fixedly connected to the inner side of the diffusion furnace body (1), the mounting plate (38) is fixedly connected to the lifting end of the electric push rod (6), the control panel (2) is electrically connected to the heater (14) and the electric push rod (6), the heater (14) is electrically connected to the heating tube (13), and the control panel (2) can control the electric push rod (6) and the heater (14).
5. The multi-temperature zone wafer diffusion device of a diffusion furnace according to claim 1, characterized in that: A movable plate (25) is arranged on the inner side of the diffusion furnace body (1). The movable plate (25) is in an "L"-shaped plate structure as a whole. A through hole is provided on the side of the movable plate (25). The support rod (7) is inserted into the through hole provided on the side of the movable plate (25). The support rod (7) can be displaced in the movable plate (25). A mounting frame (26) is arranged on the side of the support rod (7). The drive motor (8) is fixedly connected in the mounting frame (26).
6. The multi-temperature zone wafer diffusion device of a diffusion furnace according to claim 1, characterized in that: A first bearing (27) is arranged on the surface of the support frame (10), one end of the support rod (7) is fixedly connected to the inner ring surface of the first bearing (27), the gear ring (11) is fixedly connected to the surface of the support frame (10), the gear (9) and the gear ring (11) are meshed with each other for transmission, and the positioning ring (15) is fixedly connected to the end surface of the support frame (10), and a mounting hole (28) is opened on the surface of the positioning ring (15).
7. The multi-temperature zone wafer diffusion device of a diffusion furnace according to claim 1, characterized in that: The positioning plate (12) is fixedly connected to the end surface of the heating tube (13); a positioning slot (29) is provided on the surface of the positioning plate (12); a threaded rod (30) is provided on the surface of the positioning slot (29); a limiting hole (31) is provided on the side of the threaded rod (30); and the positioning ring (15) can be sleeved on the threaded rod (30) by utilizing the mounting hole (28) provided on the surface.
8. The multi-temperature zone wafer diffusion device of a diffusion furnace according to claim 7, characterized in that: The threaded rod (30) is threadedly connected to a limit nut (32); a second vertical plate (33) is arranged on the surface of the limit nut (32); a moving rod (34) is arranged on the side of the second vertical plate (33); an elastic band (35) is arranged on the side of the second vertical plate (33); a second fixed rod (36) is arranged on the side of the elastic band (35); a moving opening (37) is opened on the side of the second fixed rod (36); the second fixed rod (36) is sleeved on the moving rod (34) by using the moving opening (37); the second fixed rod (36) can be displaced along the moving rod (34); and the second fixed rod (36) can be inserted into the limit hole (31).
9. A process for a multi-temperature zone wafer diffusion device in a diffusion furnace according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1: First, the placement tube (5) containing the wafer is inserted into the quartz tube (4) and fixed and sealed together with the limiting plate (24); S2: Then, the driving motor (8) is started to drive the plurality of heating tubes (13) to rotate in coordination with the meshing action of the gear (9) and the gear ring (11). When the heating tubes (13) rotate to a suitable position, the electric push rod (6) is started to push the support rod (7), so that the heating tubes (13) of corresponding temperature can be sleeved on the quartz tube (4); S3: Then, the heater (14) can be controlled to work through the control panel (2), so that the heating tube (13) can heat the wafer in the quartz tube (4) to perform temperature diffusion treatment. When heating at different temperatures is required at the same time, different heating tubes (13) can be used to perform diffusion treatment on the wafer.