Liquid cooling test system, liquid cooling server and liquid cooling server test method

Abstract

The invention discloses a liquid cooling test system, a liquid cooling server and a liquid cooling server test method, and relates to the technical field of server cooling, a first sensing assembly and a second sensing assembly are arranged at the liquid inlet end and the liquid outlet end of to-be-tested electronic equipment respectively, and according to data collected by the first sensing assembly and the second sensing assembly, the liquid cooling server is tested according to the data collected by the first sensing assembly and the second sensing assembly. The cooling liquid distribution unit adjusts the internal working state of the cooling liquid distribution unit to adapt to the flow and flow resistance characteristics of different electronic nodes in the to-be-tested electronic equipment, and compared with the related technology, the cooling liquid distribution unit does not need to be redesigned, so that the technical problem that the use efficiency of a model machine immersion cooling system in the related technology is reduced can be solved, and the test efficiency is improved. And the use efficiency of the immersion cooling system of the prototype is improved.

Description

Technical Field

[0001] The present application relates to the technical field of server cooling, and in particular to a liquid cooling test system, a liquid cooling server, and a liquid cooling server test method. Background Art

[0002] Immersion liquid cooling technology is to immerse the server hardware in coolant, directly absorb heat and conduct it to an external heat exchanger to achieve server heat dissipation. During the development of the immersion liquid cooling system, it is necessary to test the server prototype to verify the cooling capacity of the immersion liquid cooling system. In order to solve the problem of uneven heat dissipation of devices with different power consumption in the server, the devices of different electronic nodes in the server are immersed separately, and a directional cooling cold plate structure is designed on the surface of the device to evenly cool chips with different power consumption.

[0003] In the related art, the electronic nodes are designed to be structurally sealed and placed in a cabinet, and the inlet and outlet liquid circulation is achieved through the water distributor on the cabinet. At the same time, a directional cooling cold plate structure is designed on the device surface of different electronic nodes, and the fluid flows through the cold plate and then flows into the chassis to achieve cooling. However, in the related art, when conducting prototype testing, different server systems have different size structures and flow resistance and flow characteristics, and corresponding liquid cooling pipeline structures and coolant distribution unit selections need to be designed for different servers, resulting in reduced efficiency of the prototype immersion cooling system. Summary of the invention

[0004] The present application provides a liquid cooling test system, a liquid cooling server and a liquid cooling server test method, so as to at least solve the problem of reduced utilization efficiency of the prototype immersion cooling system in the related art.

[0005] The present application provides a liquid cooling test system, comprising: a cooling liquid distribution unit, a first water distributor, a second water distributor, a plurality of first control valves, a plurality of first sensor assemblies, a plurality of second control valves and a plurality of second sensor assemblies;

[0006] The liquid supply end of the cooling liquid distribution unit is communicated with the liquid inlet end of the first water distributor;

[0007] The liquid outlet of the first water distributor is connected to the liquid inlet of the electronic device to be tested through a first connecting pipeline;

[0008] Wherein, a first control valve and a first sensor assembly are provided on the first connecting pipeline;

[0009] The liquid outlet of the electronic device to be tested is connected to the liquid inlet of the second water distributor;

[0010] The liquid outlet end of the second water distributor is connected to the liquid return end of the coolant distribution unit through a second connecting pipeline;

[0011] Wherein, a second control valve and a second sensor assembly are arranged on the second connecting pipeline.

[0012] The present application also provides a liquid cooling server, comprising: a plurality of electronic nodes; the electronic nodes comprising: a cold plate assembly, a first sensing unit and a second sensing unit;

[0013] Wherein, the cold plate assembly is arranged between the liquid inlet end of the electronic node and the liquid outlet end of the electronic node;

[0014] The liquid inlet end of the electronic node is connected to the liquid inlet end of the cold plate assembly through a first internal pipeline;

[0015] Wherein, a first sensing unit is provided on the first internal pipeline;

[0016] The liquid outlet of the electronic node is connected to the liquid outlet of the cold plate assembly through a second internal pipeline;

[0017] Wherein, a second sensing unit is provided on the second internal pipeline.

[0018] The present application also provides a liquid cooling server testing method, which uses a liquid cooling testing system, including:

[0019] Opening the first control valve and the second control valve corresponding to the electronic device to be tested;

[0020] Opening the coolant distribution unit to allow the coolant to flow from the secondary side liquid supply end of the coolant distribution unit into the liquid inlet end of the first water distributor;

[0021] The coolant flows out from the liquid outlet of the first water distributor, passes through the first sensor assembly and the second sensor assembly in sequence, and flows into the liquid inlet of the second water distributor;

[0022] The coolant flows out through the liquid outlet end of the second water distributor and enters the secondary liquid return end of the coolant distribution unit;

[0023] The cooling liquid distribution unit adjusts the parameters of the cooling liquid distribution unit according to the parameter information of the first sensor component and the second sensor component to adapt to the electronic device to be tested.

[0024] Through the present application, a first sensor component and a second sensor component are respectively arranged at the liquid inlet and the liquid outlet of the electronic device to be tested. According to the data collected by the first sensor component and the second sensor component, the coolant distribution unit adjusts the internal working state of the coolant distribution unit to adapt to the flow and flow resistance characteristics of different electronic nodes in the electronic device to be tested. Compared with the related art, there is no need to redesign the coolant distribution unit. Therefore, the technical problem of reduced utilization efficiency of the prototype immersion cooling system in the related art can be solved, and the utilization efficiency of the prototype immersion cooling system is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of the system structure of a liquid cooling test system provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of the internal structure of a coolant distribution unit provided in an embodiment of the present application;

[0028] Figure 3 A schematic diagram of the flow rate limitation range of the liquid extraction device provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the system structure of a liquid cooling server equipped with a liquid cooling test system provided in an embodiment of the present application;

[0030] Figure 5 A flow chart of a liquid-cooled server testing method provided in an embodiment of the present application.

[0031] The above drawings include the following reference numerals:

[0032] 101-coolant distribution unit;

[0033] 102-first water distributor;

[0034] 103- second water distributor;

[0035] 104 - a plurality of first control valves;

[0036] 105-a plurality of first sensing components;

[0037] 106 - a plurality of second control valves;

[0038] 107-a plurality of second sensing components;

[0039] 201-Liquid extraction device;

[0040] 202-Liquid storage tank;

[0041] 2021-Liquid storage tank;

[0042] 2022-Liquid storage valve;

[0043] 203-heat exchanger;

[0044] 204-primary side pipeline;

[0045] 2041-primary side liquid supply pipeline;

[0046] 2042-primary side liquid return pipeline;

[0047] 205-secondary side pipeline;

[0048] 2051- Secondary side liquid supply pipeline;

[0049] 2052- Secondary side liquid return pipeline;

[0050] 206-Liquid bypass;

[0051] 207-Bypass valve;

[0052] 208-Control system;

[0053] 209-display panel;

[0054] 301-electronic node;

[0055] 3011-cold plate assembly;

[0056] 3012-first sensing unit;

[0057] 3013-Second sensing unit. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0059] It should be noted that, in the description of this application, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in this application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0060] First, the terms involved in this application are explained:

[0061] Manifold: Manifold is a water distribution and collection device used to connect various water systems.

[0062] Cooling Distribution Unit (CDU) is a device used to efficiently distribute cooling liquid in data centers, laboratories or industrial environments. Its main function is to provide precise cooling liquid distribution for servers, cabinets or other high-heat equipment to ensure that the equipment operates at an appropriate temperature.

[0063] Directional cooling cold plate: A directional cooling cold plate is a single-fluid heat exchanger whose internal channels are designed with specific directionality to guide the cooling medium, such as liquids such as water and ethylene glycol or gases such as air, to flow along a predetermined path. When the heat source, such as heat generated by electronic components, is transferred to the cold plate, the cooling medium flows away the heat to achieve a heat dissipation effect. Since the flow direction of the cooling medium is predetermined, directional cooling can be achieved, improving heat dissipation efficiency.

[0064] Immersion server liquid cooling system: The immersion server liquid cooling system uses the high thermal conductivity and specific heat capacity of liquid to directly immerse the electronic components that generate heat inside the server, such as the CPU, GPU, and memory, in an insulating, non-corrosive coolant. The coolant cools the server by absorbing the heat generated by the electronic components. After the heat is absorbed by the coolant, the coolant is transported to the heat exchanger through a circulating pump to exchange heat with the external environment and dissipate the heat. The cooled coolant then returns to the server to continue absorbing heat, forming a closed-loop cycle.

[0065] BMC: Baseboard Management Controller (BMC). The main functions of BMC include remote server management, hardware health monitoring, power control management, remote restart and firmware update.

[0066] In order to solve the problem of reduced utilization efficiency of the prototype immersion cooling system in the related art, the embodiments of the present application propose the following technical concepts: the inventors considered setting a plurality of first control valves and a plurality of first sensor components on the first connecting pipeline between the liquid inlet end of the electronic device to be tested and the liquid outlet end of the first water distributor, and setting a plurality of second control valves and a plurality of second sensor components on the second connecting pipeline between the liquid outlet end of the electronic device to be tested and the liquid inlet end of the second water distributor, considering controlling the circulation of the coolant of the electronic device to be tested by the first control valve and the second control valve, considering using the first sensor component and the second sensor component to collect parameter information of the electronic device to be tested, adjusting the internal working state of the coolant distribution unit according to the parameter information collected by the first sensor component and the second sensor component through the coolant distribution unit to adapt to the flow and flow resistance characteristics of different electronic devices to be tested. Compared with the related art, there is no need to redesign the coolant distribution unit according to the flow and flow resistance characteristics of each electronic device to be tested, thereby improving the utilization efficiency of the prototype immersion cooling system.

[0067] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0068] Figure 1 This is a schematic diagram of the system structure of the liquid cooling test system provided in the embodiment of the present application. Figure 1 As shown, the liquid cooling test system includes: a cooling liquid distribution unit 101, a first water distributor 102, a second water distributor 103, a plurality of first control valves 104, a plurality of first sensor components 105, a plurality of second control valves 106 and a plurality of second sensor components 107.

[0069] The liquid supply end of the cooling liquid distribution unit is communicated with the liquid inlet end of the first water distributor.

[0070] In this embodiment, the cooling system of the server is a box-type immersion server liquid cooling system.

[0071] In this embodiment, the electronic device to be tested is a single-node server or a cabinet server. When the electronic device to be tested is a cabinet server, it includes multiple electronic nodes, each electronic node is arranged at a different node layer in the cabinet, and the coolant distribution unit is arranged at the bottom of the cabinet.

[0072] In this embodiment, each electronic node includes but is not limited to a switching node (such as a Switch node), a computing node (such as a CPU node and / or a GPU node), and a storage node.

[0073] In this embodiment, in the liquid cooling test system, the connection mode of each electronic node in the electronic device to be tested is parallel connection.

[0074] In this embodiment, the cooling liquid distribution unit includes a liquid extraction device, a liquid storage tank, a heat exchanger, a control system and a display panel.

[0075] Among them, the coolant is pre-stored in the liquid storage tank.

[0076] Exemplarily, the components of the coolant include, but are not limited to, ethylene glycol solution, propylene glycol solution, deionized water, fluorinated liquid, mineral oil, nanofluid, and the like.

[0077] In this embodiment, the first water distributor is a water distributor connected to the liquid supply end of the coolant distribution unit.

[0078] In this embodiment, the first water distributor is configured with a liquid inlet end and at least one liquid outlet end.

[0079] In this embodiment, the first water divider is a columnar structure.

[0080] In this embodiment, the material of the first water divider may be brass, polypropylene or polyethylene.

[0081] In this embodiment, a valve may also be provided at the liquid inlet end of the first water distributor, wherein the valve at the liquid inlet end of the first water distributor is an electrically controlled valve, wherein the electrically controlled valve may also be manually controlled in terms of the opening and closing state and the valve opening.

[0082] The liquid outlet end of the first water distributor is connected to the liquid inlet end of the electronic device to be tested through a first connecting pipeline.

[0083] In this embodiment, the electronic device to be tested is a single-node server or a cabinet server. When the electronic device to be tested is a cabinet server, it includes multiple electronic nodes, each electronic node is arranged at a different node layer in the cabinet, and the coolant distribution unit is arranged at the bottom of the cabinet.

[0084] In this embodiment, each electronic node includes but is not limited to a switching node (such as a Switch node), a computing node (such as a CPU node and / or a GPU node), and a storage node.

[0085] In this embodiment, the first water distributor includes at least one liquid outlet.

[0086] In this embodiment, a control valve is provided between each liquid outlet of the first water distributor and the liquid inlet of the electronic device to be tested.

[0087] The control valve is an electrically controlled valve, and the opening and closing state and the valve opening degree of the electrically controlled valve can also be manually controlled.

[0088] The electronically controlled valve is controlled by a coolant distribution unit, and the coolant distribution unit controls the opening and closing state of the valve, as well as the opening degree of the valve.

[0089] In this embodiment, the cooling liquid distribution unit controls the control valves on each first communication pipeline by wired control.

[0090] In this embodiment, the pipelines between the liquid outlet ends of the first water distributor and the liquid inlet end of the electronic device to be tested are the first connecting pipelines.

[0091] Wherein, a first control valve and a first sensor component are arranged on the first communicating pipeline.

[0092] In this embodiment, the first control valve is a valve for controlling the flow rate of the coolant in the first communication pipeline.

[0093] In this embodiment, the first control valve is an electrically controlled valve, and the opening and closing state and the valve opening degree of the electrically controlled valve can also be manually controlled.

[0094] In this embodiment, the first sensor component is a sensor component close to the liquid inlet end of the electronic device to be tested.

[0095] In this embodiment, the first sensing assembly includes a plurality of first sensors, which are arranged on one side of the first control valve close to the liquid inlet end of the electronic device to be tested.

[0096] In this embodiment, a plurality of sensors in the first sensor assembly are arranged in series on one side of the first communicating pipeline close to the liquid inlet end of the electronic device to be tested.

[0097] In this embodiment, the first sensing component may be a sensor component insulated in the coolant.

[0098] Specifically, the coolant flows out from the liquid outlet of the first water distributor, passes through the first connecting pipe, and flows into the liquid inlet of the electronic device to be tested. The first sensor component collects parameter information when the coolant flows into the electronic device to be tested.

[0099] The parameter information includes temperature information, pressure information and flow information.

[0100] In this embodiment, one group of first sensor components may be provided on the first communicating pipeline, or multiple groups of first sensor components may be provided.

[0101] The liquid outlet of the electronic device to be tested is communicated with the liquid inlet of the second water distributor.

[0102] In this embodiment, the second water distributor is a water distributor connected to the liquid return end of the cooling liquid distribution unit.

[0103] In this embodiment, the second water distributor is configured with a liquid outlet and at least one liquid inlet.

[0104] In this embodiment, the second water divider is a columnar structure.

[0105] In this embodiment, the material of the second water divider can be brass, polypropylene or polyethylene.

[0106] In this embodiment, a control valve is provided between each liquid inlet end of the second water distributor and the liquid outlet end of the electronic device to be tested.

[0107] The control valve is an electrically controlled valve, and the opening and closing state and the valve opening degree of the electrically controlled valve can also be manually controlled.

[0108] The electronically controlled valve is controlled by a coolant distribution unit, and the coolant distribution unit controls the opening and closing state of the valve, as well as the opening degree of the valve.

[0109] In this embodiment, the cooling liquid distribution unit controls the control valves on each second communication pipeline by wired control.

[0110] The liquid outlet end of the second water distributor is communicated with the liquid return end of the cooling liquid distribution unit through a second communicating pipeline.

[0111] In this embodiment, a valve may also be provided at the liquid outlet of the second water distributor, wherein the valve at the liquid outlet of the second water distributor is an electrically controlled valve, wherein the electrically controlled valve may also be manually controlled in terms of the opening and closing state and the valve opening.

[0112] In this embodiment, the pipelines between the liquid inlet ends of the second water distributor and the liquid outlet end of the electronic device to be tested are the second connecting pipelines.

[0113] Wherein, a second control valve and a second sensor assembly are arranged on the second connecting pipeline.

[0114] In this embodiment, the second control valve is a valve for controlling the flow rate of the coolant in the second communicating pipeline.

[0115] In this embodiment, the second control valve is an electrically controlled valve, and the opening and closing state and the valve opening degree of the electrically controlled valve can also be manually controlled.

[0116] In this embodiment, the second sensor component is a sensor component close to the liquid outlet of the electronic device to be tested.

[0117] In this embodiment, the second sensor assembly includes a plurality of sensors, which are arranged on one side of the second control valve close to the liquid outlet of the electronic device to be tested.

[0118] In this embodiment, the first sensor includes but is not limited to: at least one of a temperature sensor, a pressure sensor, and a flow sensor.

[0119] In this embodiment, the second sensor includes but is not limited to: at least one of a temperature sensor, a pressure sensor, and a flow sensor.

[0120] In this embodiment, a plurality of sensors in the second sensor assembly are arranged in series on one side of the second communicating pipeline close to the liquid outlet of the electronic device to be tested.

[0121] In this embodiment, the second sensor component may be a sensor component insulated in the coolant.

[0122] Specifically, the coolant flows out from the liquid outlet of the electronic device to be tested, passes through the second connecting pipeline, and flows into each liquid inlet of the second water distributor. The second sensor component collects parameter information when the coolant flows out of the electronic device to be tested.

[0123] The parameter information includes temperature information, pressure information and flow information.

[0124] In this embodiment, one group of second sensor components may be provided on the second communicating pipeline, or multiple groups of second sensor components may be provided.

[0125] In this embodiment, the coolant distribution unit includes a control system, and each first control valve, each second control valve, each first sensor component and each second sensor component are controlled by the control system.

[0126] The control system is connected to each of the first control valves, each of the second control valves, each of the first sensor components and each of the second sensor components in an electrical connection.

[0127] Specifically, the cooling liquid distribution unit collects pressure parameters, flow parameters and temperature parameters at the liquid inlet and outlet of each electronic device to be tested by setting a first sensor component and a second sensor component at the liquid inlet and outlet of each electronic device to be tested, and calculates the power consumption of each electronic node in the electronic device to be tested based on the pressure parameters, flow parameters and temperature parameters.

[0128] In this embodiment, the cooling liquid distribution unit calculates and generates the power consumption of each electronic node in the electronic device under test under different working conditions based on the temperature parameters, flow parameters and temperature parameters of the cooling liquid flowing through each electronic node in the electronic device under test when the electronic device under test is running under different working conditions.

[0129] In this embodiment, the power consumption of each electronic node in the electronic device to be tested is calculated as follows:

[0130]

[0131] In the formula, Represents the power consumption of each electronic node; Indicates the specific heat capacity of the medium; represents mass flow rate; Indicates the temperature difference of the liquid.

[0132] In this embodiment, when each electronic node in the electronic device to be tested is placed in the cabinet, the connection mode of the liquid cooling pipeline is parallel connection. Among them, the height direction is affected by the gravitational potential energy, and the liquid supply flow rate of the electronic node at a high place is greatly attenuated. According to the power consumption of each electronic node under different working conditions calculated by the cooling liquid distribution unit, the flow resistance characteristics of the corresponding electronic node are obtained. According to the flow resistance characteristics of different electronic nodes, the placement mode of different electronic nodes under different working conditions is set, and according to the flow resistance characteristics of different electronic nodes, the appropriate cooling liquid distribution unit is adapted.

[0133] Exemplarily, the coolant distribution unit may be a large-flow and small-flow-resistance coolant distribution unit, or a small-flow and large-flow-resistance coolant distribution unit.

[0134] It can be seen from the above embodiments that by respectively arranging the first sensor component and the second sensor component at the liquid inlet end and the liquid outlet end of the electronic device to be tested, the coolant distribution unit adjusts the internal working state of the coolant distribution unit according to the data collected by the first sensor component and the second sensor component to adapt to the flow rate and flow resistance characteristics of different electronic nodes in the electronic device to be tested. Compared with the related art, there is no need to redesign the coolant distribution unit, thereby improving the utilization efficiency of the prototype immersion cooling system.

[0135] Figure 2 This is a schematic diagram of the internal structure of the cooling liquid distribution unit provided in the embodiment of the present application. Figure 2 As shown, the cooling liquid distribution unit includes: a liquid extraction device 201, a liquid storage tank 202, a heat exchanger 203, a primary side pipeline 204 and a secondary side pipeline 205;

[0136] Among them, the primary side pipeline includes a primary side liquid supply pipeline and a primary side liquid return pipeline.

[0137] In this embodiment, the primary-side liquid supply pipeline of the primary-side pipeline passes through the radiator of the coolant distribution unit, and the primary-side liquid return pipeline passes through the radiator of the coolant distribution unit.

[0138] In this embodiment, the primary side pipeline is connected to an external refrigeration device.

[0139] Exemplarily, the external refrigeration equipment includes, but is not limited to, a cooling tower, a dry cooler, and a chiller.

[0140] Among them, chillers include air-cooled chillers and water-cooled chillers.

[0141] In this embodiment, the coolant of the external refrigeration equipment flows into the primary side liquid supply pipeline through the liquid supply end of the primary side pipeline, exchanges heat with the secondary side pipeline through the heat exchanger of the coolant distribution unit to reduce the temperature of the secondary side pipeline, and the coolant of the external refrigeration equipment flows out from the primary side return pipeline and returns to the external refrigeration equipment.

[0142] Among them, the secondary side pipeline includes a secondary side liquid supply pipeline and a secondary side liquid return pipeline.

[0143] In this embodiment, the secondary-side liquid supply pipeline of the secondary-side pipeline passes through the radiator of the cooling liquid distribution unit, and the secondary-side liquid return pipeline passes through the radiator of the cooling liquid distribution unit.

[0144] In this embodiment, the secondary side pipeline connects the first water distributor and the second water distributor.

[0145] In this embodiment, a liquid extraction device is provided on the secondary side liquid supply pipeline.

[0146] In this embodiment, the liquid extraction device includes but is not limited to a water pump, a water diversion tank, and a pneumatic liquid extraction pump.

[0147] In this embodiment, the coolant flows into the first water distributor through the liquid supply end of the secondary side pipeline, flows into the electronic device to be tested through the liquid outlet end of the first water distributor, and after cooling the electronic device to be tested, flows into the liquid inlet ends of the second water distributor, flows into the liquid return end of the secondary side pipeline from the liquid outlet end of the second water distributor, and exchanges heat with the primary side pipeline through the heat exchanger to reduce the temperature of the coolant in the secondary side pipeline.

[0148] In this embodiment, the primary side pipeline and the secondary side pipeline transfer heat in a non-contact manner through the wall surface inside the heat exchanger to achieve cooling of the coolant.

[0149] The liquid extraction device is arranged on the secondary side liquid supply pipeline.

[0150] In this embodiment, the liquid extraction device passes through the secondary side liquid supply pipeline to extract the cooling liquid in the secondary side pipeline.

[0151] In this embodiment, the liquid extraction device is controlled to be in the forward working state and the reverse working state by the opening and closing state of the bypass valve on the liquid bypass.

[0152] In this embodiment, the forward working state of the liquid extraction device is: when the coolant flow rate required by the system is lower than the adjustable range of the liquid extraction device, the bypass valve is opened, and the liquid extraction device allows part of the coolant in the secondary side pipeline to flow into the liquid storage tank through the liquid bypass, thereby reducing the coolant flow rate of the secondary side pipeline entering the electronic equipment to be tested.

[0153] In this embodiment, the reverse working state of the liquid extraction device is: when the cooling liquid flow rate required by the system is higher than the adjustable range of the liquid extraction device, the bypass valve is opened, and the liquid extraction device extracts the cooling liquid from the liquid storage tank, passes through the liquid bypass, and flows into the secondary side pipeline, thereby increasing the cooling liquid flow rate of the secondary side pipeline entering the electronic equipment to be tested.

[0154] In this embodiment, the forward working state and the reverse working state of the liquid extraction device are regulated by a control system in the cooling liquid distribution unit.

[0155] The liquid storage tank is connected with the secondary side liquid return pipeline.

[0156] In one embodiment of the present application, the liquid storage box includes: a liquid storage tank and a liquid storage valve arranged on the liquid storage tank.

[0157] In this embodiment, a liquid storage valve is provided on the liquid storage tank, and the control system is an open system and a closed system by controlling the opening and closing of the liquid storage valve.

[0158] Specifically, when the liquid storage valve is fully opened, the liquid storage tank is connected to the atmosphere, forming an open system.

[0159] Specifically, when the liquid storage valve is fully closed, the liquid storage tank is isolated from the atmosphere and becomes a closed system.

[0160] In this embodiment, the liquid storage valve adjusts the air pressure value in the liquid storage tank by controlling the valve opening.

[0161] In this embodiment, when the coolant distribution unit is in a closed system, the working pressure of the system is ≥1.5 bar.

[0162] In this embodiment, the working pressures of different electronic nodes in the electronic device to be tested are different, and the working pressure of some electronic nodes is ≤1 bar.

[0163] Specifically, when the working pressure of the electronic node is lower than the working pressure of the closed system, the pressure inside the system is controlled by adjusting the opening of the liquid storage valve to adapt to the working pressure of the electronic node.

[0164] The primary side pipeline and the secondary side pipeline pass through both sides of the heat exchanger respectively.

[0165] In this embodiment, the primary side pipeline and the secondary side pipeline transfer heat in a non-contact manner through the wall surface inside the heat exchanger to achieve cooling of the coolant.

[0166] The primary side liquid supply pipeline and the primary side liquid return pipeline are respectively connected to the external refrigeration equipment.

[0167] Exemplarily, the external refrigeration equipment includes, but is not limited to, a cooling tower, a dry cooler, and a chiller.

[0168] Among them, chillers include air-cooled chillers and water-cooled chillers.

[0169] In this embodiment, the coolant of the external refrigeration equipment flows into the primary side liquid supply pipeline through the liquid supply end of the primary side pipeline, exchanges heat with the secondary side pipeline through the heat exchanger of the coolant distribution unit to reduce the temperature of the secondary side pipeline, and the coolant of the external refrigeration equipment flows out from the primary side return pipeline and returns to the external refrigeration equipment.

[0170] The secondary side liquid supply pipeline is communicated with the liquid inlet end of the first water distributor.

[0171] The secondary side liquid return pipeline is communicated with the liquid outlet end of the second water distributor.

[0172] It can be seen from the above embodiments that by providing a liquid storage tank connected to the atmosphere in the coolant distribution unit, the pressure inside the coolant distribution unit can be adjusted from zero, thereby improving the pressure adaptability of the coolant distribution unit to different electronic nodes.

[0173] In one embodiment of the present application, the cooling liquid distribution unit further includes: a liquid bypass and a bypass valve;

[0174] A bypass valve is provided on the liquid bypass.

[0175] Figure 3 A schematic diagram of the flow rate limitation range of the liquid extraction device provided in an embodiment of the present application.

[0176] like Figure 3 As shown, Figure 3 The flow rate power curves of the liquid extraction device at speeds of 500rpm, 1000rpm, 1500rpm, 2000rpm, 2500rpm, 2800rpm and 3000rpm are recorded in. Under any pressure, the secondary side pipeline cannot achieve a wide range of flow rate adjustment. Figure 3 In the area below the lowest speed and above the highest speed, there is an area that cannot be covered by the flow of the liquid extraction device. For example, at a speed of 500 rpm, within the pressure range of the system, the maximum flow of the liquid extraction device does not exceed 20 lpm. For different electronic nodes, when the flow required by the electronic node is greater than 20 lpm, the cooling effect of the system on the electronic node is reduced.

[0177] In this embodiment, when the flow rate required by the system is lower than the adjustable range of the liquid extraction device, the bypass valve is opened so that the liquid extraction device is in a forward working state. The liquid extraction device directs part of the coolant in the secondary side pipeline through the liquid bypass and flows into the liquid storage tank, thereby reducing the coolant flow rate of the secondary side pipeline entering the electronic node.

[0178] In this embodiment, when the flow rate required by the system is higher than the adjustable range of the liquid extraction device, the bypass valve is opened to put the liquid extraction device into a reverse working state. The liquid extraction device extracts the coolant from the liquid storage tank, passes through the liquid bypass, and flows into the secondary side pipeline, thereby increasing the coolant flow rate of the secondary side pipeline entering the electronic node.

[0179] One end of the liquid bypass is communicated with the secondary side liquid supply pipeline.

[0180] The other end of the liquid bypass is communicated with the liquid storage tank.

[0181] Liquid bypasses the heat exchanger.

[0182] In this embodiment, the liquid bypass passes through the heat exchanger and is located between the primary side pipeline and the secondary side pipeline, and is in parallel with the primary side pipeline and the secondary side pipeline.

[0183] It can be seen from the above embodiments that by setting a liquid bypass and a bypass valve, when the required flow rate is lower than the adjustable range of the liquid extraction device, part of the coolant is allowed to flow into the liquid storage tank through the bypass by controlling the valve; when the required flow rate is higher than the adjustable range of the liquid extraction device, the coolant in the liquid storage tank is allowed to enter the secondary side liquid supply pipeline through the bypass, thereby improving the adaptability of the coolant distribution unit to the flow rates of different electronic nodes.

[0184] In one embodiment of the present application, the coolant distribution unit further includes: a control system;

[0185] The control system is electrically connected to the first control valve, the second control valve and the liquid storage tank.

[0186] It can be seen from the above embodiments that by controlling the first control valve and the second control valve on each of the first connecting pipelines and the second connecting pipelines through the control system, the cooling capacity of different electronic nodes can be tested separately; by controlling the liquid storage valve of the liquid storage tank, the atmospheric pressure in the coolant distribution unit can be adjusted from zero.

[0187] In one embodiment of the present application, the cooling liquid distribution unit further includes: a display panel; the display panel is used to display the pressure information and temperature information of the liquid cooling test system.

[0188] In this embodiment, the display panel is used to display the pressure information and temperature information of each electronic node in the electronic device to be tested.

[0189] In this embodiment, the display panel is a touchable panel.

[0190] Figure 4 This is a schematic diagram of the system structure of a liquid cooling server equipped with a liquid cooling test system provided in an embodiment of the present application. Figure 4 As shown, the liquid cooling server includes a plurality of electronic nodes 301, and the electronic node 301 includes: a cold plate assembly 3011, a first sensor unit 3012 and a second sensor unit 3013;

[0191] In this embodiment, the cold plate assembly includes a plurality of cooling cold plates; the cooling cold plates are connected in parallel.

[0192] In this embodiment, the cooling cold plate is a directional cooling cold plate.

[0193] In this embodiment, the coolant flows through the cold plate according to the coolant flow direction of the directional cooling cold plate design.

[0194] The devices of each electronic node are embedded in the cooling plate.

[0195] Wherein, the cold plate assembly is arranged between the liquid inlet end of the electronic node and the liquid outlet end of the electronic node.

[0196] Specifically, the cooling liquid flows in from the liquid inlet end of the electronic node, flows through the cold plate assembly in each electronic node, cools the components in the electronic node, and flows out from the liquid outlet end of the electronic node.

[0197] In this embodiment, each electronic node is placed at a different node placement layer in the cabinet.

[0198] In this embodiment, the device of each electronic node in each electronic node is arranged in a sealed chassis, wherein a liquid inlet and a liquid outlet are provided on the chassis.

[0199] In this embodiment, each electronic node is immersed in the cooling liquid, and the chassis is a box-type chassis.

[0200] In this embodiment, each electronic node includes but is not limited to a switching node (such as a Switch node), a computing node (such as a CPU node and / or a GPU node), and a storage node.

[0201] The liquid inlet end of the electronic node is communicated with the liquid inlet end of the cold plate assembly through a first internal pipeline.

[0202] In this embodiment, the first internal pipeline is a pipeline between the liquid inlet end of the electronic node and the liquid inlet end of the cold plate assembly.

[0203] Wherein, a first sensing unit is provided on the first internal pipeline.

[0204] In this embodiment, the first sensing unit is a sensor unit provided on the first internal pipeline.

[0205] In this embodiment, the first sensing unit includes a plurality of first sensors, which are arranged on one side close to the liquid inlet end of the cold plate assembly.

[0206] In this embodiment, a plurality of sensors in the first sensing unit are arranged in series on one side of the first internal pipeline close to the liquid inlet end of the cold plate assembly.

[0207] In this embodiment, the first sensing unit is a sensor component insulated in the coolant.

[0208] Specifically, the coolant flows in from the liquid inlet end of the electronic node, passes through the first internal pipeline, and the parameter information of the coolant flowing into the cold plate is collected by the first sensor unit.

[0209] The parameter information includes temperature information, pressure information and flow information.

[0210] In this embodiment, one group of first sensing units may be disposed on the first internal pipeline, or multiple groups of first sensing units may be disposed.

[0211] The liquid outlet of the electronic node is communicated with the liquid outlet of the cold plate assembly through a second internal pipeline.

[0212] In this embodiment, the second internal pipeline is a pipeline between the liquid outlet end of the electronic node and the liquid outlet end of the cold plate assembly.

[0213] Wherein, a second sensing unit is provided on the second internal pipeline.

[0214] In this embodiment, the second sensing unit is a sensor unit provided on the second internal pipeline.

[0215] In this embodiment, a plurality of sensors in the second sensing unit are arranged in series on one side of the second internal pipeline close to the liquid outlet end of the cold plate assembly.

[0216] In this embodiment, the second sensing unit is a sensor component insulated in the coolant.

[0217] Specifically, the coolant flows out from the liquid outlet of the cold plate assembly, passes through the second internal pipeline, and the parameter information of the coolant flowing out of the cold plate is collected by the second sensor unit.

[0218] The parameter information includes temperature information, pressure information and flow information.

[0219] In this embodiment, one group of second sensing units may be disposed on the second internal pipeline, or multiple groups of second sensing units may be disposed.

[0220] In this embodiment, the second sensing unit includes a plurality of second sensors, which are arranged on a side close to the liquid outlet of the cold plate assembly.

[0221] In this embodiment, the first sensor includes but is not limited to: at least one of a temperature sensor, a pressure sensor, and a flow sensor.

[0222] In this embodiment, the second sensor includes but is not limited to: at least one of a temperature sensor, a pressure sensor, and a flow sensor.

[0223] In this embodiment, the electronic node is provided with a bus interface, and the first sensor unit and the second sensor unit are electrically connected to an external device through the bus interface.

[0224] In this embodiment, the electronic node is arranged inside the sealed chassis.

[0225] In this embodiment, the bus interface is an I2C bus interface.

[0226] In this embodiment, a bus interface is reserved on the mainboard of each electronic node.

[0227] In this embodiment, the external device includes a BMC and a display device.

[0228] The first sensor unit and the second sensor unit are connected to the BMC, and the temperature, flow rate and pressure parameters of the cold plate assembly are collected by the first sensor unit and the second sensor unit through the BMC, and the flow rate and flow resistance characteristics of the cold plate assembly are obtained according to the temperature, flow rate and pressure parameters of the cold plate assembly.

[0229] In this embodiment, the temperature, flow rate and pressure parameters of the cold plate assembly are collected by reading the first sensing unit and the second sensing unit through an external device, and the flow rate and flow resistance characteristics of the cold plate assembly are obtained according to the temperature, flow rate and pressure parameters of the cold plate assembly, which are compared with the simulation parameters, and the simulation parameters are corrected according to the flow rate and flow resistance characteristics.

[0230] The simulation parameters are the temperature, flow rate and pressure simulation parameters of the cold plate assembly when simulating the coolant flowing through the cold plate assembly when designing the cold plate assembly.

[0231] It can be seen from the above embodiments that by respectively setting the first sensor unit and the second sensor unit at the liquid inlet and liquid outlet positions of the cold plate in the electronic node, the flow resistance characteristics of the cold plate are obtained according to the data collected by the first sensor unit and the second sensor unit, and the simulation results of the cold plate are corrected according to the flow resistance characteristics.

[0232] Figure 5 A flow chart of a liquid cooling server testing method provided in an embodiment of the present application, the method comprising:

[0233] S501: Open the first control valve and the second control valve corresponding to the electronic device to be tested.

[0234] Specifically, an electric signal is sent to the first control valve and the second control valve through the control system of the coolant distribution unit to control the opening and closing states of the first control valve and the second control valve.

[0235] The control system of the coolant distribution unit can control the opening and closing of the first control valve and the second control valve, and can also control the opening degree of the first control valve and the second control valve.

[0236] Specifically, the control system of the cooling liquid distribution unit can control the opening and closing states of the first control valve and the second control valve corresponding to each electronic node in the electronic device to be tested, respectively, according to the electronic device to be tested.

[0237] S502: Turn on the coolant distribution unit to allow the coolant to flow from the secondary side liquid supply end of the coolant distribution unit to the liquid inlet end of the first water distributor.

[0238] In this embodiment, the components of the coolant include but are not limited to ethylene glycol solution, propylene glycol solution, deionized water, fluorinated liquid, mineral oil, nanofluid, and the like.

[0239] Specifically, the liquid extraction device in the coolant distribution unit extracts the coolant pre-stored in the liquid storage tank, so that the coolant flows from the secondary side liquid supply pipeline of the coolant distribution unit into the liquid inlet end of the first water distributor.

[0240] S503: The coolant flows out from the liquid outlet of the first water distributor, passes through the first sensor assembly and the second sensor assembly in sequence, and flows into the liquid inlet of the second water distributor.

[0241] Specifically, the first water distributor causes the coolant to flow out from the liquid outlet according to the electronic node to be tested and the opening and closing state of the first control valve corresponding to the electronic node to be tested. The coolant passes through the first sensor component set on the first connecting pipeline. The first sensor component reads the temperature value, flow value and pressure value of the coolant when entering the electronic node. The coolant flows into the electronic node through the liquid inlet end of the electronic node. Through the first sensor unit set inside the electronic node, the first sensor unit reads the temperature value, flow value and pressure value of the coolant when it flows into the cold plate assembly. The coolant flows through the cold plate assembly to cool the internal devices in the electronic node. The temperature value, flow value and pressure value of the coolant when it flows out of the cold plate assembly is read through the second sensor unit set inside the electronic node. The coolant flows out from the liquid outlet of the electronic node, passes through the second sensor component set on the second connecting pipeline, the second sensor component reads the temperature value, flow value and pressure value of the coolant when it flows out of the electronic node, and flows into the liquid inlet end of the second water distributor through the second control valve.

[0242] S504: The coolant flows out through the liquid outlet of the second water distributor and enters the secondary liquid return end of the coolant distribution unit.

[0243] Specifically, the coolant flows into the secondary liquid return end of the coolant distribution unit through the liquid outlet end of the second water distributor, and the heat in the coolant is exchanged with the outside for cooling through the heat exchanger in the coolant distribution unit.

[0244] S505: The cooling liquid distribution unit adjusts the parameters of the cooling liquid distribution unit according to the parameter information of the first sensor component and the second sensor component to adapt to the electronic device to be tested.

[0245] Specifically, the coolant distribution unit reads the temperature parameters, pressure parameters and flow parameters of each electronic node based on the parameter information collected by the first sensor component and the second sensor component, calculates the power consumption of each electronic node based on the temperature parameters, pressure parameters and flow parameters, obtains the flow and flow resistance characteristics of each electronic node based on the power consumption of the electronic node, and controls the opening of the liquid storage valve to adjust the pressure of the test system based on the flow and flow resistance characteristics of each electronic node. The coolant distribution unit controls the opening of the bypass valve to adjust the flow of the coolant into the secondary side pipeline, and adapts the electronic equipment to be tested according to different pressure values ​​and flow values.

[0246] It can be seen from the above embodiments that by respectively arranging the first sensor component and the second sensor component at the liquid inlet and outlet of each electronic node, the coolant distribution unit adjusts the internal working state of the coolant distribution unit according to the data collected by the first sensor component and the second sensor component to adapt to the flow rate and flow resistance characteristics of different electronic nodes. Compared with the related art, there is no need to redesign the coolant distribution unit, thereby improving the utilization efficiency of the prototype immersion cooling system.

[0247] In one embodiment of the present application, step S505 includes:

[0248] S5051: The coolant distribution unit obtains temperature parameters, pressure parameters and flow parameters based on the parameter information of the first sensor component and the second sensor component.

[0249] Specifically, the parameter information of the first sensor component and the second sensor component is read through the control system in the coolant distribution unit to obtain the temperature parameters, pressure parameters and flow parameters of the liquid inlet end of each electronic node and the temperature parameters, pressure parameters and flow parameters of the liquid outlet end.

[0250] S5052: Calculate the power consumption of each electronic node in the electronic device to be tested according to the temperature parameter, the pressure parameter and the flow parameter.

[0251] In one embodiment of the present application, the power consumption of each electronic node in the electronic device to be tested is calculated as follows:

[0252]

[0253] In the formula, Represents the power consumption of each electronic node; Indicates the specific heat capacity of the medium; represents mass flow rate; Indicates the temperature difference of the liquid.

[0254] S5053: Adjust the parameters of the coolant distribution unit according to the power consumption of each electronic node in the electronic device to be tested to adapt to the electronic device to be tested.

[0255] Specifically, according to the power consumption value of the electronic node generated by calculation, the coolant distribution unit obtains the flow rate and flow resistance characteristics of different electronic nodes. According to the flow rate and flow resistance characteristics of each electronic node, the coolant distribution unit controls the opening of the liquid storage valve to control the pressure of the system according to the opening of the liquid storage valve. The coolant distribution unit controls the opening of the bypass valve to adjust the flow rate of the coolant flowing into the secondary side pipeline, and adapts the electronic equipment to be tested according to different pressure values ​​and flow values.

[0256] It can be seen from the above embodiments that by respectively setting the first sensor component and the second sensor component at the liquid inlet and outlet ends of each electronic node, the coolant distribution unit calculates the power consumption of each electronic node based on the data collected by the first sensor component and the second sensor component, and adjusts the internal working state of the coolant distribution unit according to the power consumption of each electronic node to adapt to the flow rate and flow resistance characteristics of different electronic nodes. Compared with the related art, there is no need to redesign the coolant distribution unit, which improves the utilization efficiency of the prototype immersion cooling system.

[0257] In one embodiment of the present application, step S5053 includes:

[0258] S301: Generate a flow resistance characteristic curve of the electronic node according to the power consumption of each electronic node in the electronic device to be tested.

[0259] Specifically, according to the flow rate, temperature and pressure parameter values ​​corresponding to each electronic node, a flow rate and flow resistance characteristic curve of the electronic node is drawn and generated.

[0260] S302: Adjusting parameters of the coolant distribution unit according to the flow rate and flow resistance characteristic curve to adapt to the electronic device to be tested.

[0261] Specifically, the flow resistance coordinate points corresponding to the flow resistance characteristic curve are obtained, and the pressure and flow parameters inside the coolant distribution unit are adjusted according to the flow resistance parameters in the coordinate points to adapt to the electronic device to be tested.

[0262] It can be seen from the above embodiments that by acquiring the power consumption of each electronic node, drawing a flow resistance characteristic curve, and adjusting the pressure and flow parameter values ​​inside the coolant distribution unit according to the flow resistance characteristic curve, the flow resistance characteristics of each electronic node in the electronic device to be tested can be adapted, without redesigning the coolant distribution unit, thereby improving the use efficiency of the prototype immersion cooling system. It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0263] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0264] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" and "several" is two or more, unless otherwise clearly and specifically defined.

[0265] The above is a detailed introduction to a liquid cooling test system, a liquid cooling server and a liquid cooling server testing method provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A liquid cooling test system, characterized in that: include: A coolant distribution unit, a first water distributor, a second water distributor, a plurality of first control valves, a plurality of first sensor assemblies, a plurality of second control valves and a plurality of second sensor assemblies; The liquid supply end of the cooling liquid distribution unit is in communication with the liquid inlet end of the first water distributor; The liquid outlet end of the first water distributor is connected to the liquid inlet end of the electronic device to be tested through a first connecting pipeline; Wherein, the first control valve and the first sensor assembly are arranged on the first communicating pipeline; The liquid outlet of the electronic device to be tested is connected to the liquid inlet of the second water distributor; The liquid outlet end of the second water distributor is connected to the liquid return end of the coolant distribution unit through a second connecting pipeline; Wherein, the second connecting pipeline is provided with the second control valve and the second sensor assembly.

2. The liquid cooling test system according to claim 1, characterized in that: The first sensing assembly includes a plurality of first sensors, which are arranged on one side of the first control valve close to the liquid inlet end of the electronic device to be tested.

3. The liquid cooling test system according to claim 1, characterized in that: The second sensing assembly includes a plurality of second sensors, which are arranged on one side of the second control valve close to the liquid outlet of the electronic device to be tested.

4. The liquid cooling test system according to claim 2, characterized in that: The first sensor includes but is not limited to: at least one of a temperature sensor, a pressure sensor and a flow sensor.

5. The liquid cooling test system according to claim 3, characterized in that: The second sensor includes, but is not limited to, at least one of a temperature sensor, a pressure sensor, and a flow sensor.

6. The liquid cooling test system according to claim 1, characterized in that: The cooling liquid distribution unit comprises: a liquid extraction device, a liquid storage tank, a heat exchanger, a primary side pipeline and a secondary side pipeline; Wherein, the primary side pipeline includes a primary side liquid supply pipeline and a primary side liquid return pipeline; Wherein, the secondary side pipeline includes a secondary side liquid supply pipeline and a secondary side liquid return pipeline; The liquid extraction device is arranged on the secondary side liquid supply pipeline; The liquid storage tank is in communication with the secondary side liquid return pipeline; The primary side pipeline and the secondary side pipeline pass through two sides of the heat exchanger respectively; The primary side liquid supply pipeline and the primary side liquid return pipeline are respectively connected to an external refrigeration device; The secondary side liquid supply pipeline is connected to the liquid inlet end of the first water distributor; The secondary side liquid return pipeline is communicated with the liquid outlet end of the second water distributor.

7. The liquid cooling test system according to claim 6, characterized in that: The liquid storage box comprises: a liquid storage tank and a liquid storage valve arranged on the liquid storage tank.

8. The liquid cooling test system according to claim 7, characterized in that: The liquid storage valve is used to control the air pressure value inside the liquid storage tank.

9. The liquid cooling test system according to claim 6, characterized in that: The coolant distribution unit further includes: a liquid bypass and a bypass valve; The bypass valve is provided on the liquid bypass; One end of the liquid bypass is in communication with the secondary side liquid supply pipeline; The other end of the liquid bypass is in communication with the liquid storage tank; The liquid bypasses the heat exchanger.

10. The liquid cooling test system according to claim 6, characterized in that: The coolant distribution unit further includes: a control system; The control system is electrically connected to the first control valve, the second control valve and the liquid storage tank.

11. The liquid cooling test system according to claim 6, characterized in that: The cooling liquid distribution unit also includes: a display panel; the display panel is used to display the pressure information and temperature information of the liquid cooling test system.

12. A liquid cooling server, characterized in that: include: Multiple electronic nodes; The electronic node comprises: a cold plate assembly, a first sensing unit and a second sensing unit; Wherein, the cold plate assembly is arranged between the liquid inlet end of the electronic node and the liquid outlet end of the electronic node; The liquid inlet end of the electronic node is connected to the liquid inlet end of the cold plate assembly through a first internal pipeline; Wherein, the first internal pipeline is provided with the first sensing unit; The liquid outlet of the electronic node is connected to the liquid outlet of the cold plate assembly through a second internal pipeline; Wherein, the second internal pipeline is provided with the second sensing unit.

13. The liquid cooling server according to claim 12, characterized in that: The cold plate assembly comprises a plurality of cooling cold plates; The cooling plates are connected in parallel.

14. The liquid cooling server according to claim 12, characterized in that: The first sensing unit includes a plurality of first sensors, which are arranged on one side close to the liquid inlet end of the cold plate assembly.

15. The liquid cooling server according to claim 12, characterized in that: The second sensing unit includes a plurality of second sensors, which are arranged on one side close to the liquid outlet end of the cold plate assembly.

16. The liquid cooling server according to claim 14, characterized in that: The first sensor includes but is not limited to: at least one of a temperature sensor, a pressure sensor and a flow sensor.

17. The liquid cooling server according to claim 15, characterized in that: The second sensor includes, but is not limited to, at least one of a temperature sensor, a pressure sensor, and a flow sensor.

18. The liquid cooling server according to claim 12, characterized in that: The electronic node is provided with a bus interface, and the first sensor unit and the second sensor unit are electrically connected to an external device via the bus interface.

19. A liquid cooling server testing method, characterized in that: A liquid cooling test system as claimed in any one of claims 1 to 11, comprising: Opening the first control valve and the second control valve corresponding to the electronic device to be tested; Opening the coolant distribution unit to allow the coolant to flow from the secondary side liquid supply end of the coolant distribution unit into the liquid inlet end of the first water distributor; The coolant flows out from the liquid outlet of the first water distributor, passes through the first sensor assembly and the second sensor assembly in sequence, and flows into the liquid inlet of the second water distributor; The coolant flows out through the liquid outlet end of the second water distributor and enters the secondary liquid return end of the coolant distribution unit; The cooling liquid distribution unit adjusts the parameters of the cooling liquid distribution unit according to the parameter information of the first sensor component and the second sensor component to adapt to the electronic device to be tested.

20. The liquid cooling server testing method according to claim 19, characterized in that: The coolant distribution unit adjusts the parameters of the coolant distribution unit according to the parameter information of the first sensor component and the second sensor component to adapt to the electronic device to be tested, including: The coolant distribution unit obtains temperature parameters, pressure parameters and flow parameters according to reading parameter information of the first sensor component and the second sensor component; Calculating the power consumption of each electronic node in the electronic device to be tested according to the temperature parameter, pressure parameter and flow parameter; The parameters of the cooling liquid distribution unit are adjusted according to the power consumption of each electronic node in the electronic device to be tested to adapt to the electronic device to be tested.

21. The liquid cooling server testing method according to claim 20, characterized in that: The calculation formula for obtaining the power consumption of each electronic node in the electronic device to be tested is: In the formula, Represents the power consumption of each electronic node; Indicates the specific heat capacity of the medium; represents mass flow rate; Indicates the temperature difference of the liquid.

22. The liquid cooling server testing method according to claim 20, characterized in that: The step of adjusting the parameters of the cooling liquid distribution unit according to the power consumption of each electronic node in the electronic device to be tested to adapt the electronic device to be tested includes: Generating a flow resistance characteristic curve of each electronic node according to the power consumption of each electronic node in the electronic device to be tested; The parameters of the coolant distribution unit are adjusted according to the flow rate and flow resistance characteristic curve to adapt to the electronic device to be tested.

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