LCD photoelectric panel outer layer circuit pattern generation and precision single-point compensation method

Abstract

The invention discloses an LCD photoelectric board outer layer circuit pattern generation and precision single-point compensation method, circuit patterns of all PCS key pattern positions are generated at a time through a CAM software automation script, consistency compensation is carried out, all PAD, circuits, golden fingers, MARK and the like are compensated in one mode, but the requirement for the patterns of a photoelectric board is very high, and the problem that the PAD, the circuits, the golden fingers, the MARK and the like cannot be compensated in one mode is solved. Single-point compensation is carried out on the T disk positioned by the COF, the loss of pattern precision is reduced during etching, and the influence of the pattern precision is smaller; a laser direct imaging technology and a negative film technology are used, and a fixed pre-amplification coefficient is set in a design stage, so that errors in the manufacturing process are reduced, and the yield is improved; through exposure and development of data subjected to single-point compensation, the etching process can be better controlled, so that the COF spacing is more accurate, and smooth proceeding of subsequent procedures is facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of PCB boards, and in particular to a method for generating outer-layer circuit patterns of LCD photoelectric boards and a precision single-point compensation method. Background Art

[0002] As an indispensable part of modern electronic devices, every step in the manufacturing process of LCD optoelectronic panels has an important impact on the display effect and reliability of the final product. In particular, the accuracy of the outer circuit graphics of LCD optoelectronic panels is directly related to the key performance indicators of the display, such as resolution and contrast. With the development of LCD technology, the accuracy requirements for circuit graphics on optoelectronic panels are getting higher and higher, and traditional production methods have encountered challenges in ensuring the consistency of graphics.

[0003] Traditionally, the outer layer circuit pattern production of LCD optoelectronic panels usually uses CAM software to process design files, and the design data is converted into film through a photoplotter for subsequent etching processes. However, in this process, due to material characteristics, environmental factors and equipment precision limitations, the actual circuit pattern produced may have dimensional deviations, especially in key locations such as the T-finger graphic points on both sides of the DisplayPin. These deviations will lead to inconsistent COF spacing, which in turn affects the electrical connection performance and overall reliability of the display module.

[0004] The present invention is made based on the above situation. Summary of the invention

[0005] The invention overcomes the shortcomings of the prior art and provides a method for generating a pattern of an outer layer circuit of an LCD photoelectric panel and a precision single-point compensation method.

[0006] The present invention is achieved through the following technical solutions:

[0007] A method for generating a pattern of an outer layer circuit of an LCD photoelectric panel and a single-point compensation method for precision, the method comprising the following steps:

[0008] S1. According to the design rules and preparation requirements, the original design files are processed using CAM software and files suitable for production are generated. The circuit graphics of all PCS key graphic positions are generated at one time through automated scripts, and consistency compensation is performed.

[0009] S2. Identify the T-finger graphic points on both sides of the Display Pin on each PNL as the key compensation positions, determine the specific coordinates of the key compensation positions, and define a separate compensation parameter for each position. Convert the design data after single-point compensation into LDI laser data that can be read by the photoplotter, and use the photoplotter to make film based on the converted LDI laser data;

[0010] S3, preparing a substrate for an LCD photovoltaic panel;

[0011] S4. According to the design drawings and engineering drill belt, determine the locations where all holes need to be drilled, and use drilling equipment to drill holes;

[0012] S5, depositing a layer of chemical copper on the substrate, using VCP negative film process for electroplating, and baking the substrate at 150° C. for 2 hours after the electroplating is completed;

[0013] S6, cleaning and activating the surface of the substrate, and attaching the dry film photoresist to the surface of the substrate by hot pressing;

[0014] S7. Use laser direct imaging technology to expose the dry film photoresist, set a fixed pre-release coefficient in the CAM design stage, and use this fixed value for the outer layer pre-release coefficient;

[0015] S8, negative film etching, exposure and development with single point compensation data, etching and measuring COF spacing;

[0016] S9, measure the distance between T fingers on the board after etching, collect all measurement data, and perform statistical analysis;

[0017] S10, impedance printing: Pre-treatment uses a needle brush combined with volcanic ash to clean the surface, remove oil and tiny particles, and enhance the adhesion of the printed material. A 43-mesh screen is used for impedance printing. Aluminum mesh is used to plug holes during the printing process. After printing, pre-bake at 74 degrees Celsius for 45 minutes to initially solidify the impedance material in preparation for subsequent processing;

[0018] S11. Text printing: Use a 140-mesh fine screen for text printing, gradually remove the solvent through segmented baking, and finally bake in a high temperature zone of 150 degrees Celsius for 60 minutes to ensure that the ink is completely cured to form a firm text logo;

[0019] S12. Complete the chemical gold plating of the board according to the standard process, measure the distance between the T fingers again, analyze the measurement data, evaluate whether the chemical gold plating affects the accuracy of the circuit pattern, and make corresponding adjustments as needed.

[0020] In the LCD optoelectronic panel outer layer circuit pattern generation and precision single-point compensation method as described above, the T-finger positioning point is compensated outward by 0.012 mm.

[0021] In the above-mentioned method for generating the outer layer circuit pattern of the LCD photovoltaic panel and the single-point precision compensation, in step S6, the speed of cleaning and activating the surface of the substrate is 2.8 m / min.

[0022] In the LCD optoelectronic panel outer layer circuit pattern generation and precision single-point compensation method as described above, in step S6, the temperature during film pressing is set to 110 degrees Celsius to ensure that the dry film can be fully softened and tightly bonded to the substrate, and the applied pressure is 4 kgf / cm2.

[0023] The LCD optoelectronic panel outer layer circuit pattern generation and precision single-point compensation method as described above, the substrate includes a copper-clad plate, the copper-clad plate is connected with copper rings surrounding it and used for blocking glue, and the copper ring is provided with exhaust grooves that can exhaust gas when the copper-clad plate is pressed; the preparation steps of the substrate in step S3 include:

[0024] S31, cutting materials to prepare copper clad laminates;

[0025] S32. According to the design rules and preparation requirements, the original design files are processed using CAM software and files suitable for production are generated. According to the number of PCB layers and design requirements, the circuit information of each layer is separated, and the exhaust slots of each layer are defined to generate the corresponding film data. The PCS graphics corresponding to each layer of film are drawn by a photoplotter and converted into LDI laser data.

[0026] S33, performing micro-etching on the surface of the copper clad laminate to remove the oxide layer and activate the copper surface to improve the adhesion of the photosensitive ink or dry film, and coating a layer of photosensitive ink on the copper clad laminate;

[0027] S34, using an LDI exposure machine to expose the copper clad laminate coated with photosensitive ink according to the converted laser data;

[0028] S35, the unexposed photosensitive ink portion is dissolved by a developer to expose the copper surface to be etched, and a chemical etching solution is used to remove the exposed copper layer to form a desired circuit pattern and generate an exhaust groove. After the etching is completed, the remaining photosensitive ink is removed to expose a complete circuit pattern;

[0029] S36, check the inner layer circuit for open circuit, short circuit, notch, scratch and poor exposure through AOI, and remove defective products;

[0030] S37, performing browning treatment on the copper clad laminate, by cleaning the copper surface of the substrate, forming a browning film on the copper surface of the substrate, and enhancing the bonding force between the laminated substrate and the PP prepreg;

[0031] S38. Cut and cut the PP prepreg according to the design requirements;

[0032] S39. Pre-stack the copper clad laminate and the opened PP prepreg according to the requirements of the LOT card, with copper foil placed on the outermost layer and copper clad laminate and PP prepreg arranged alternately in the middle. Use an infrared positioning system to ensure the positioning of each layer of material.

[0033] S40, first perform hot pressing to bond the layers of material together to form a solid whole, then transfer to cold pressing for cooling, take out the laminated multilayer board from the press, drill the target hole through X-RAY positioning technology, and then perform edge cutting on the multilayer board.

[0034] In the LCD optoelectronic panel outer layer circuit pattern generation and precision single-point compensation method as described above, there is also a step S31.1 between step S31 and step S32, wherein the copper clad laminate is baked in an oven for four hours at a baking temperature of 155°C.

[0035] As described above, in the method for generating the outer layer circuit pattern of the LCD optoelectronic panel and the precision single-point compensation, in step S33, the processing speed is 4 meters / minute, the micro-etching amount is controlled at 0.80 microns, and the thickness of the ink is 11-13μm; in step S37, the line speed of the browning treatment is 3.5 meters / minute, and the micro-etching amount is controlled at 1.5 microns.

[0036] In the method for generating the outer layer circuit pattern of the LCD optoelectronic panel and the precision single-point compensation method as described above, in step S38, the model of the PP prepreg is 2116, the glue content is 56%, and the PP prepreg with a length of 622 mm and a width of 546 mm is cut out.

[0037] In the above-mentioned method for generating the outer layer circuit pattern of the LCD photovoltaic panel and the precision single-point compensation, in step S39, the length of the copper foil is 622 mm, the width is 546 mm, and the thickness is 15 μm.

[0038] In the method for generating the outer layer circuit pattern of the LCD optoelectronic panel and the precision single-point compensation as described above, in step S40, steel plates are added to the top, middle and bottom of the laminated stack, two new kraft papers are placed between the steel plates, and three layers of new kraft paper and eighteen layers of old kraft paper are used between the steel plates and the copper clad laminate, and the three layers of new kraft paper are located on the side close to the copper clad laminate.

[0039] Compared with the prior art, the present invention has the following advantages:

[0040] In this case, the circuit graphics of all PCS key graphic positions were generated at one time through the CAM software automation script, and consistency compensation was performed. All PADs, circuits, gold fingers, MARKs, etc. were compensated in one way. However, the graphics requirements of the optoelectronic board are particularly high. Single-point compensation was performed on the T-disk for COF positioning, which reduced the loss of graphic accuracy during etching and had a smaller impact on graphic accuracy. The use of laser direct imaging technology and negative film technology, as well as the setting of a fixed pre-release coefficient in the design stage, can help reduce errors in the manufacturing process and improve the yield rate. Through the exposure and development of data with single-point compensation, the etching process can be better controlled, making the COF spacing more accurate, which is conducive to the smooth progress of subsequent processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings, wherein:

[0042] Figure 1 It is a schematic diagram of the structure of the LCD photoelectric panel in the present invention;

[0043] Figure 2 It is a graph accuracy range chart in the present invention;

[0044] Figure 3 It is a schematic diagram of the structure of the copper rings connected around the copper clad plate in the present invention. DETAILED DESCRIPTION

[0045] The present invention will be further described below in conjunction with the accompanying drawings:

[0046] like Figures 1 to 3 The method for generating the outer layer circuit pattern of an LCD photoelectric panel and compensating the precision single point shown comprises the following steps:

[0047] S1. According to the design rules and preparation requirements, the original design files are processed using CAM software and files suitable for production are generated. The circuit graphics of all PCS key graphic positions are generated at one time through automated scripts, and consistency compensation is performed.

[0048] S2. Identify the T-finger graphic points on both sides of the Display Pin on each PNL as the key compensation positions, determine the specific coordinates of the key compensation positions, and define a separate compensation parameter for each position. Convert the design data after single-point compensation into LDI laser data that can be read by the photoplotter, and use the photoplotter to make film based on the converted LDI laser data;

[0049] S3, preparing a substrate for an LCD photovoltaic panel;

[0050] S4. According to the design drawings and engineering drill belt, determine the locations where all holes need to be drilled, and use drilling equipment to drill holes;

[0051] S5. Deposit a layer of copper on the substrate and use the VCP negative film process for electroplating; Hole copper thickness: Ensure that the copper layer in the hole reaches a minimum of 18 microns, which helps to improve the conductivity and reliability of the hole wall. Surface copper thickness: The surface copper thickness is controlled between 30 and 45 microns to meet the requirements of circuit design and ensure good electrical performance.

[0052] S6, cleaning and activating the substrate surface to remove impurities such as oil, oxides, etc., to enhance the adhesion between the dry film and the substrate, and attaching the dry film photoresist to the substrate surface by hot pressing;

[0053] S7. Use laser direct imaging technology to expose the dry film photoresist, set a fixed pre-release coefficient in the CAM design stage, and use this fixed value for the outer layer pre-release coefficient;

[0054] S8, negative film etching, exposure and development with single point compensation data, etching and measuring COF spacing; to verify the etching effect and adjust the parameters in time.

[0055] S9. Measure the distance between T fingers on the board after etching, which is one of the key indicators to ensure the accuracy of circuit graphics; collect all measurement data, perform statistical analysis, find out any deviations, and optimize the etching process or adjust other related processes accordingly.

[0056] S10, impedance printing: Pre-treatment uses a needle brush combined with volcanic ash to clean the surface, remove oil and tiny particles, and enhance the adhesion of the printing material. A 43-mesh screen is used for impedance printing to ensure that the pattern is fine and there is no missing printing. During the printing process, an aluminum mesh is used to plug the holes to prevent the impedance material from penetrating into unnecessary places. After printing, pre-bake at 74 degrees Celsius for 45 minutes to initially solidify the impedance material in preparation for subsequent processing;

[0057] S11. Text printing: Use a 140-mesh fine screen to print text to ensure that the text is clear and legible. Remove the solvent step by step through segmented baking to avoid ink overflow or bubbles in the holes caused by rapid heating. Finally, bake in a high temperature zone of 150 degrees Celsius for 60 minutes to ensure that the ink is completely cured and form a firm text logo.

[0058] S12. Complete the chemical gold plating treatment of the board according to the standard process to improve the conductivity and corrosion resistance. Measure the distance between the T fingers again to ensure that there is no significant change during the entire production process. Analyze the measurement data to evaluate whether the gold plating treatment affects the accuracy of the circuit pattern, and make corresponding adjustments as needed.

[0059] In this case, the circuit graphics of all PCS key graphic positions were generated at one time through the CAM software automation script, and consistency compensation was performed. All PADs, circuits, gold fingers, MARKs, etc. were compensated in one way. However, the graphics requirements of the photovoltaic board are particularly high. Single-point compensation was performed on the T-disk for COF positioning, which reduced the loss of graphic accuracy during etching and had less impact on graphic accuracy. The use of laser direct imaging technology and negative film process, as well as the setting of a fixed pre-release coefficient in the design stage, can help reduce errors in the manufacturing process and improve the yield rate. Exposure and development of data with single-point compensation can better control the etching process, making the COF spacing more accurate, which is conducive to the smooth progress of subsequent processes.

[0060] Specifically, the T-finger positioning point is compensated outward by 0.012mm. During the manufacturing process, the material may shrink or expand slightly due to heat treatment, mechanical stress or other factors. By pre-setting an outward compensation value, these dimensional changes can be offset to a certain extent to ensure the dimensional accuracy of the final product. As an important alignment reference point on the circuit board, the accuracy of the position of the T-finger directly affects the accuracy of subsequent process steps (such as drilling, etching, etc.). Outward compensation ensures that even with slight positional offsets, the T-finger can still be accurately aligned, thereby improving the accuracy of the overall alignment. When splicing multi-layer boards or multi-panels, small errors in each step may accumulate, resulting in large deviations in the final product. The compensation of 0.012mm helps to disperse and reduce the impact of these cumulative errors and maintain the consistency and reliability of the overall size.

[0061] In one embodiment, in step S6, the speed of cleaning and activating the substrate surface is 2.5 m / min, ensuring that each link in the treatment process meets the standards and does not affect the final effect.

[0062] In step S6, the temperature during film pressing is set to 110 degrees Celsius to ensure that the dry film can be fully softened and tightly bonded to the substrate. The applied pressure is 4 kgf / cm2 to ensure that the dry film is flat and free of bubbles and has sufficient adhesion to the substrate.

[0063] In one embodiment, the substrate includes a copper clad laminate 1, and the copper clad laminate 1 is connected with a copper ring 2 surrounding it and used for blocking glue. The copper ring 2 is provided with an exhaust groove 21 that can exhaust gas when the copper clad laminate 1 is pressed; the preparation steps of the substrate in step S3 include:

[0064] S31, cutting and preparing a copper clad laminate 1;

[0065] S32. According to the design rules and preparation requirements, the original design file is processed using CAM software, and a file suitable for production is generated. According to the number of layers of the PCB and the design requirements, the circuit information of each layer is separated, and the exhaust slots 21 of each layer are defined, and the corresponding film data is generated. The graphics of the film corresponding to the PCS of each layer are drawn by a photoplotter and converted into LDI laser data;

[0066] S33, performing micro-etching on the surface of the copper-clad laminate 1 to remove the oxide layer and activate the copper surface to improve the adhesion of the photosensitive ink or dry film, and coating a layer of photosensitive ink on the copper-clad laminate 1;

[0067] S34, using an LDI exposure machine to expose the copper clad laminate 1 coated with the photosensitive ink according to the converted laser data;

[0068] S35, the unexposed photosensitive ink portion is dissolved by a developer to expose the copper surface to be etched, and a chemical etching solution is used to remove the exposed copper layer to form a desired circuit pattern and generate an exhaust groove 21. After the etching is completed, the remaining photosensitive ink is removed to expose a complete circuit pattern;

[0069] S36, check the inner layer circuit for open circuit, short circuit, notch, scratch and poor exposure through AOI, and remove defective products;

[0070] S37, performing browning treatment on the copper clad laminate 1, by cleaning the copper surface of the substrate, forming a browning film on the copper surface of the substrate, thereby enhancing the bonding force between the pressed substrate and the PP prepreg;

[0071] S38. Cut and cut the PP prepreg according to the design requirements;

[0072] S39. Pre-stack the copper clad laminate 1 and the opened PP prepreg according to the requirements of the LOT card, with copper foil placed on the outermost layer and copper clad laminate 1 and PP prepreg arranged alternately in the middle. Use an infrared positioning system to ensure the positioning of each layer of material.

[0073] S40, first perform hot pressing to bond the layers of material together to form a solid whole, then transfer to cold pressing for cooling, take out the laminated multilayer board from the press, drill the target hole through X-RAY positioning technology, and then perform edge cutting on the multilayer board.

[0074] By connecting the copper ring 2 around the copper clad laminate 1, the excess glue can be effectively blocked from overflowing, ensuring that the amount of glue between the layers is more consistent, thereby improving the uniformity of the thickness of the board after lamination; the exhaust groove 21 is opened on the copper ring 2, thereby providing an effective exhaust channel for the gas between the boards during the lamination process, reducing the bubbles formed by gas residue, and thus avoiding the influence of these bubbles on the uniformity of the thickness and electrical properties of the board; the copper ring 2 not only plays the role of blocking the glue, but also enhances the mechanical strength of the edge of the copper clad laminate 1, which helps to prevent edge damage or warping; by defining the exhaust groove 21 of each layer and automatically generating the corresponding film data and laser data in the manufacturing process, the production process is more automated, the possibility of human intervention is reduced, and the production efficiency is improved.

[0075] In one embodiment, the copper clad board 1 and the copper ring 2 are rectangular, and each side of the copper ring 2 is provided with two exhaust grooves 21, thereby ensuring that the gas generated during the pressing process can be evenly discharged from four directions. This helps to prevent the formation of bubbles due to gas accumulation in local areas, thereby improving the uniformity of the board thickness and the quality of the finished product. Furthermore, the exhaust grooves 21 are evenly distributed on each side of the copper ring 2. At the same time, the copper ring 2 can serve as a shielding layer, effectively reducing the impact of external electromagnetic interference on the internal circuit, and also reducing the electromagnetic radiation of the PCB board itself to the external environment.

[0076] Furthermore, the width of the exhaust groove 21 is 2.0 mm, and the angle a between the extension direction of the exhaust groove 21 and the length direction of the copper ring 2 is 30°-60°. Since the fluidity of glue is not as good as that of gas, it tends to move along the shortest path, that is, flow in a direction perpendicular to the edge of the copper ring 2. By setting the exhaust groove 21 at a certain inclination angle, the glue can be effectively prevented from overflowing along the groove without affecting the discharge of gas.

[0077] In one embodiment, in step S31, a copper clad laminate 1 having a length of 622 mm and a width of 546 mm is cut out, the core board 11 of the copper clad laminate 1 has a thickness of 0.4 mm-0.6 mm, and the outer copper layer 12 of the copper clad laminate 1 has a thickness of 15 μm or H / HOZ. The size of 622 mm*546 mm is one of the common standard sizes for PCB manufacturing. This standardized size can use existing production equipment and process flow, reduce the complexity and cost of customized production, and help improve production efficiency. The core board 11 has a thickness range of 0.4 mm-0.6 mm, which is suitable for most conventional applications, ensuring sufficient mechanical strength without being too thick to increase weight or occupy too much space. For circuit boards that require a multi-layer structure, this thickness range is also convenient for subsequent lamination processes to ensure good bonding between the layers.

[0078] In step S38, the model of the PP prepreg is 2116, and the glue content is 56%, which helps to provide sufficient fluidity during the lamination process, ensures that the layers are fully bonded, and fills any small gaps that may exist. The PP prepreg is cut into a length of 622 mm and a width of 546 mm.

[0079] In step S39, the copper foil 12 has a length of 622 mm, a width of 546 mm, and a thickness of 15 μm.

[0080] In one embodiment, step S1.2 is provided between step S1 and step S2, wherein the copper clad laminate 1 is baked in an oven for four hours at a baking temperature of 155°C. The copper clad laminate 1 may absorb moisture from the environment during storage and transportation. If the moisture is not discharged in time during the subsequent high-temperature process, it may cause a large size shrinkage of the laminate, and the moisture can be removed by baking the laminate. At the same time, pre-baking can help stabilize the size of the copper clad laminate 1, reduce the impact of thermal expansion and contraction, and improve the yield rate.

[0081] In one embodiment, in step S33, the processing speed is 4 m / min, and the micro-etching amount is controlled at 0.80 μm to ensure uniform surface treatment without excessive corrosion of the copper surface; the thickness of the ink is 11-13 μm.

[0082] In step S36, open circuit: detect whether there are broken or discontinuous wires. Short circuit: check whether there is accidental contact between different circuits, resulting in electrical connection errors. Notch: find whether there are missing parts on the wire or pad. Scratches: identify surface damage caused by mechanical operation or other reasons. Poor exposure: evaluate possible problems in the exposure process, such as overexposure or underexposure, which affects the quality of pattern transfer. Inspection method: scan the PCB using a high-resolution camera and specific optical inspection conditions. The image processing software compares the actual image with the preset standard template and automatically identifies any deviations or defects. If the AOI system detects any of the above-mentioned defects, the PCB will be marked as unqualified and will usually be scrapped to avoid waste in subsequent processes.

[0083] If the PCB board is made of 6 to 8 layers of material, the required hole diameter can be accurately punched at the specified position according to the optical positioning system by using the OPE punching machine.

[0084] In one embodiment, the browning treatment is to form a uniform oxide layer on the surface to enhance the bonding between the copper surface and the PP prepreg. Speed: The processing line speed is 3.5 m / min to ensure that there is enough residence time during the treatment to form a stable oxide layer. Micro-etching amount: controlled at 1.5 microns, which helps to remove the slight oxide layer and contaminants on the copper surface without excessively corroding the copper surface, ensuring the subsequent bonding effect. After the browning treatment, the surface of the copper clad laminate 1 appears brown, indicating that an ideal oxide layer has been formed, which enhances the bonding with the PP prepreg.

[0085] In one embodiment, in step S40, steel plates are added to the top, middle and bottom of the pressed stack, two new kraft papers are placed between the steel plates, three layers of new kraft papers and eighteen layers of old kraft papers are used between the steel plates and the copper clad laminate 1, and the three layers of new kraft papers are located on the side close to the copper clad laminate 1. The new kraft paper is unused kraft paper or kraft paper without impurities or residues on the surface: it is mainly used to play a buffering role to ensure that no impurities or residues affect the quality of the final product. They have good flatness and thermal conductivity, which can make the heat conduction more uniform. The old kraft paper refers to the used kraft paper: it is used to further enhance the thermal conductivity, increase the buffering effect, and also reduce the cost. Although the old paper is not brand new, it can still provide the necessary buffering and thermal conductivity. By using multiple layers of kraft paper and steel plates, it is ensured that the pressure is evenly distributed during the entire pressing process, and the quality and flatness of the finished product are improved. Hot pressing, cold pressing, X-RAY positioning technology and gong edge are all conventional technical means for pressing PCB boards, which will not be repeated here.

[0086] Measurement data table: Unit / mm

[0087]

[0088]

[0089] It meets the PCB board LCD optoelectronic board industry standard within the range of 0.04mm.

[0090] This embodiment is verified by combining a large number of experiments, optimizing the PCS design of the working unit, and compensating the single-point graphics; the improvement of the test board graphic tolerance data is significant, which can greatly improve the accuracy of the photovoltaic panel graphic precision to the COF alignment, optimize the process flow, and greatly improve the production quality.

Claims

1. A method for generating a pattern of an outer layer circuit of an LCD photoelectric panel and a single-point compensation method for precision, characterized in that: The method comprises the following steps: S1. According to the design rules and preparation requirements, the original design files are processed using CAM software and files suitable for production are generated. The circuit graphics of all PCS key graphic positions are generated at one time through automated scripts, and consistency compensation is performed. S2. Identify the T-finger graphic points on both sides of the Display Pin on each PNL as the key compensation positions, determine the specific coordinates of the key compensation positions, and define a separate compensation parameter for each position. Convert the design data after single-point compensation into LDI laser data that can be read by the photoplotter, and use the photoplotter to make film based on the converted LDI laser data; S3, preparing a substrate for an LCD photovoltaic panel; S4. According to the design drawings and engineering drill belt, determine the locations where all holes need to be drilled, and use drilling equipment to drill holes; S5, depositing a layer of chemical copper on the substrate, using VCP negative film process for electroplating, and baking the substrate at 150° C. for 2 hours after the electroplating is completed; S6, cleaning and activating the surface of the substrate, and attaching the dry film photoresist to the surface of the substrate by hot pressing; S7. Use laser direct imaging technology to expose the dry film photoresist, set a fixed pre-release coefficient in the CAM design stage, and use this fixed value for the outer layer pre-release coefficient; S8, negative film etching, exposure and development with single point compensation data, etching and measuring COF spacing; S9, measure the distance between T fingers on the board after etching, collect all measurement data, and perform statistical analysis; S10, impedance printing: Pre-treatment uses a needle brush combined with volcanic ash to clean the surface, remove oil and tiny particles, and enhance the adhesion of the printed material. A 43-mesh screen is used for impedance printing. Aluminum mesh is used to plug holes during the printing process. After printing, pre-bake at 74 degrees Celsius for 45 minutes to initially solidify the impedance material in preparation for subsequent processing; S11. Text printing: Use a 140-mesh fine screen for text printing, gradually remove the solvent through segmented baking, and finally bake in a high temperature zone of 150 degrees Celsius for 60 minutes to ensure that the ink is completely cured to form a firm text logo; S12. Complete the chemical gold plating of the board according to the standard process, measure the distance between the T fingers again, analyze the measurement data, evaluate whether the chemical gold plating affects the accuracy of the circuit pattern, and make corresponding adjustments as needed.

2. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of the precision according to claim 1, characterized in that: The T finger positioning point is compensated outward by 0.012 mm.

3. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of the precision according to claim 1, characterized in that: In step S6, the speed of cleaning and activating the substrate surface is 2.8 m / min.

4. The method for generating a pattern of an outer layer of an LCD photoelectric panel and a single-point compensation for precision according to claim 3, characterized in that: In step S6, the temperature during film pressing is set to 110 degrees Celsius to ensure that the dry film can be fully softened and tightly bonded to the substrate, and the applied pressure is 4 kgf / cm2.

5. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of precision according to claim 1, characterized in that: The substrate comprises a copper-clad laminate, the copper-clad laminate is surrounded by a copper ring for blocking glue, and the copper ring is provided with an exhaust groove for exhausting gas when the copper-clad laminate is pressed; The steps of preparing the substrate in step S3 include: S31, cutting materials to prepare copper clad laminates; S32. According to the design rules and preparation requirements, the original design files are processed using CAM software and files suitable for production are generated. According to the number of PCB layers and design requirements, the circuit information of each layer is separated, and the exhaust slots of each layer are defined to generate the corresponding film data. The PCS graphics corresponding to each layer of film are drawn by a photoplotter and converted into LDI laser data. S33, performing micro-etching on the surface of the copper clad laminate to remove the oxide layer and activate the copper surface to improve the adhesion of the photosensitive ink or dry film, and coating a layer of photosensitive ink on the copper clad laminate; S34, using an LDI exposure machine to expose the copper clad laminate coated with photosensitive ink according to the converted laser data; S35, the unexposed photosensitive ink portion is dissolved by a developer to expose the copper surface to be etched, and a chemical etching solution is used to remove the exposed copper layer to form a desired circuit pattern and generate an exhaust groove. After the etching is completed, the remaining photosensitive ink is removed to expose a complete circuit pattern; S36, check the inner layer circuit for open circuit, short circuit, notch, scratch and poor exposure through AOI, and remove defective products; S37, performing browning treatment on the copper clad laminate, by cleaning the copper surface of the substrate, forming a browning film on the copper surface of the substrate, and enhancing the bonding force between the laminated substrate and the PP prepreg; S38. Cut and cut the PP prepreg according to the design requirements; S39. Pre-stack the copper clad laminate and the opened PP prepreg according to the requirements of the LOT card, with copper foil placed on the outermost layer and copper clad laminate and PP prepreg arranged alternately in the middle. Use an infrared positioning system to ensure the positioning of each layer of material. S40, first perform hot pressing to bond the layers of material together to form a solid whole, then transfer to cold pressing for cooling, take out the laminated multilayer board from the press, drill the target hole through X-RAY positioning technology, and then perform edge cutting on the multilayer board.

6. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of precision according to claim 5, characterized in that: There is also a step S31.1 between step S31 and step S32, in which the copper clad laminate is baked in an oven for four hours at a baking temperature of 155°C.

7. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of precision according to claim 5, characterized in that: In step S33, the processing speed is 4 m / min, the micro-etching amount is controlled at 0.80 μm, and the ink thickness is 11-13 μm; in step S37, the line speed of the browning treatment is 3.5 m / min, and the micro-etching amount is controlled at 1.5 μm.

8. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of precision according to claim 5, characterized in that: In step S38, the model of the PP prepreg is 2116, the glue content is 56%, and the PP prepreg is cut into a 622 mm long and 546 mm wide PP prepreg.

9. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of precision according to claim 5, characterized in that: In step S39, the copper foil has a length of 622 mm, a width of 546 mm, and a thickness of 15 μm.

10. The method for generating the outer layer circuit pattern of the LCD photoelectric panel and the single-point compensation of precision according to claim 1, characterized in that: In step S40, steel plates are added to the top, middle and bottom of the pressed stack, two new kraft papers are placed between the steel plates, three layers of new kraft paper and eighteen layers of old kraft paper are used between the steel plates and the copper clad laminate, and the three layers of new kraft paper are located on the side close to the copper clad laminate.

Images