Wiring distance detection method of printed circuit board, computer equipment and storage medium

Abstract

The embodiment of the invention provides a wiring distance detection method of a printed circuit board, computer equipment and a storage medium. The method comprises the steps of scanning a printed circuit board layer of a design page in response to a scanning instruction under the condition that a preset process distance value is obtained, and obtaining error warning information of the printed circuit board layer; screening the error warning information based on a preset process distance value to obtain wiring distance abnormity warning information; and displaying wiring distance abnormity warning information on the printed circuit board layer. The method is used for achieving the effect of improving the accuracy and efficiency of wiring distance detection.

Description

Technical Field

[0001] The present application relates to the field of printed circuit boards, and in particular to a wiring distance detection method for printed circuit boards, a computer device, and a storage medium. Background Art

[0002] During the design process of a printed circuit board, there may be a difference between the design rules of the reference board and the actual requirements, or due to negligence of the designer, the wiring distance of the designed printed circuit board may not meet the actual process requirements.

[0003] In the related art, after the printed circuit board is designed, it is manually checked whether the wiring distance of the printed circuit board meets the actual process requirements. However, manual inspection is time-consuming and prone to omissions, resulting in low accuracy and efficiency of wiring distance detection. Summary of the invention

[0004] The embodiments of the present application provide a wiring distance detection method for a printed circuit board, a computer device, and a storage medium to achieve the effect of improving the accuracy and efficiency of wiring distance detection.

[0005] In a first aspect, an embodiment of the present application provides a wiring distance detection method for a printed circuit board, comprising:

[0006] When the preset process distance value is obtained, in response to the scanning instruction, the printed circuit board layer of the design page is scanned to obtain error warning information of the printed circuit board layer;

[0007] Screening the error warning information based on the preset process distance value to obtain the wiring distance abnormality warning information;

[0008] A warning sign corresponding to the abnormal wiring distance warning information is displayed on the printed circuit board layer.

[0009] In one possible implementation, in response to a scanning instruction, the printed circuit board layer of the design page is scanned to obtain error warning information of the printed circuit board layer, including: in response to the scanning instruction, using a preset process distance value as a detection parameter of a wiring distance detection program, and using a reference threshold as a detection parameter of an error detection program; running the wiring distance detection program and the error detection program, scanning the printed circuit board layer of the design page, and obtaining error warning information of the printed circuit board layer.

[0010] In a possible implementation, error warning information is screened based on a preset process distance value to obtain wiring distance abnormality warning information, including: selecting candidate error warning information related to the wiring distance in the error warning information based on the name of the error warning information; obtaining the wiring distance included in the candidate error warning information; screening out wiring distance abnormality warning information in the candidate error warning information based on the wiring distance and the preset process distance value; the wiring distance of the wiring distance abnormality warning information is less than the preset process distance value.

[0011] In a possible implementation, after scanning the printed circuit board layer of the design page and obtaining the error warning information of the printed circuit board layer, it also includes: displaying a warning mark corresponding to the error warning information on the printed circuit board layer; displaying a warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer, including: removing the warning marks corresponding to the error warning information other than the wiring distance abnormality warning information in the error warning information, so as to display the warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer.

[0012] In a possible implementation, displaying a warning sign corresponding to the wiring distance abnormality warning information on a printed circuit board layer includes: obtaining coordinate information from the description information of the wiring distance abnormality warning information; and displaying a warning sign corresponding to the wiring distance abnormality warning information on the printed circuit board layer based on the coordinate information.

[0013] In one possible embodiment, the wiring distance detection method for a printed circuit board further includes: in response to a trigger operation for a wiring distance detection command, running a wiring distance detection program to display a process setting control on a design page; and obtaining a preset process distance value entered in the process setting control.

[0014] In a second aspect, an embodiment of the present application provides a wiring distance detection device for a printed circuit board, comprising:

[0015] The scanning module is used to scan the printed circuit board layer of the design page in response to the scanning instruction when the preset process distance value is obtained, and obtain the error warning information of the printed circuit board layer;

[0016] A screening module, used for screening the error warning information based on a preset process distance value to obtain wiring distance abnormality warning information;

[0017] The processing module is used to display a warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer.

[0018] In a third aspect, an embodiment of the present application provides a computer device, including: a memory, a processor;

[0019] Memory stores computer-executable instructions;

[0020] The processor executes the computer-executable instructions stored in the memory, so that the processor executes the above first aspect and / or various possible implementations of the first aspect.

[0021] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, in which computer-executable instructions are stored. When the computer-executable instructions are executed by a processor, they are used to implement the first aspect above and / or various possible implementations of the first aspect.

[0022] In a fifth aspect, an embodiment of the present application provides a computer program product, including a computer program, which, when executed by a processor, implements the above first aspect and / or various possible implementation methods of the first aspect.

[0023] The wiring distance detection method, computer equipment, storage medium and program product of the printed circuit board provided in the embodiments of the present application obtain a preset process distance value, so that error warning information related to the wiring distance can be scanned and obtained through a scanning instruction, and the wiring distance abnormality warning information is filtered out in the error warning information through the preset process distance value, and a warning mark corresponding to the wiring distance abnormality warning information is displayed on the printed circuit board layer; in the design stage of the printed circuit board, the wiring distance error is automatically detected based on the preset process distance value. Compared with manual detection of wiring distance errors, the accuracy and efficiency of wiring distance detection are improved, and it is also avoided that during the production of printed circuit boards, due to undetected wiring distance errors, the wiring layout does not meet the actual process requirements and needs to be redesigned, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0025] Figure 1 A schematic diagram of a scenario of a wiring distance detection method for a printed circuit board provided in the present application;

[0026] Figure 2 Schematic diagram of the process of the wiring distance detection method of the printed circuit board provided in this application Figure 1 ;

[0027] Figure 3 This is a schematic diagram of the related art without wiring distance detection;

[0028] Figure 4 A schematic diagram of a warning sign corresponding to abnormal wiring distance warning information provided by the present application;

[0029] Figure 5Schematic diagram of the process of the wiring distance detection method of the printed circuit board provided in this application Figure 2 ;

[0030] Figure 6 Schematic diagram of the process of the wiring distance detection method of the printed circuit board provided in this application Figure 3 ;

[0031] Figure 7 A schematic diagram of the structure of a wiring distance detection device for a printed circuit board provided in the present application;

[0032] Figure 8 A schematic diagram of the structure of the computer device provided for this application.

[0033] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0034] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0035] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] The wiring distance detection method of the printed circuit board provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown, the terminal 102 communicates with the server 104 through a network. The data storage system can store data that the server 104 needs to process. The data storage system can be integrated on the server 104, or placed on the cloud or other network servers.

[0037] The terminal 102 may be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, IoT devices, and portable wearable devices. The IoT devices may be smart speakers, smart TVs, smart air conditioners, smart car-mounted devices, etc. The portable wearable devices may be smart watches, smart bracelets, head-mounted devices, etc. The server 104 may be implemented as an independent server or a server cluster consisting of multiple servers.

[0038] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0039] Figure 2 Schematic diagram of the process of the wiring distance detection method of the printed circuit board provided in this application Figure 1 , taking a computer device executing a wiring distance detection method for a printed circuit board as an example, the computer device may be Figure 1 Terminals in Figure 2 As shown, the method includes:

[0040] S201. When a preset process distance value is obtained, in response to a scanning instruction, a printed circuit board layer of a design page is scanned to obtain error warning information of the printed circuit board layer.

[0041] The preset process distance value may be a minimum process distance value supported by a printed circuit board manufacturer, or may be a preset design index of the printed circuit board.

[0042] Scan command, used to scan the printed circuit board layer for possible errors.

[0043] The design page is a page used to draw printed circuit boards in the Printed Circuit Board (PCB) design application. Component layout and wiring can be performed on the design page.

[0044] A printed circuit board may include multiple layers, that is, the printed circuit board layer may be all the layers included in the printed circuit board; in actual applications, the multiple printed circuit board layers included in the printed circuit board may include but are not limited to a top layer, a bottom layer, a solder mask layer, a memory layer, a solder paste layer, etc.

[0045] The error warning information includes all possible error information obtained by scanning.

[0046] Specifically, the computer device can display a process setting control in the design page, and the user inputs a preset process distance value through the process setting control, and then the computer device can obtain the preset process distance value input by the user through the process setting control; the computer device can also obtain design indicators before starting to design the printed circuit board, and the design indicators include the preset process distance value.

[0047] When the computer device obtains the preset process distance value, the user triggers a scanning instruction through the design page. The computer device responds to the scanning instruction to scan multiple printed circuit board layers. The error warning information obtained by the scan includes error warning information related to the wiring distance obtained by scanning according to the preset process distance value, and also includes error warning information in other aspects.

[0048] It should be noted that since the error scan is performed after the preset process distance value is obtained, the error warning information obtained by the scan includes error warning information related to the wiring distance; if the preset process distance value is not obtained before the scan, the error warning information obtained by the scan does not include error warning information related to the wiring distance.

[0049] S202 , filtering the error warning information based on the preset process distance value to obtain wiring distance abnormality warning information.

[0050] The wiring distance abnormal warning information is error warning information when the wiring distance is less than a preset process distance value, that is, error warning information related to the wiring distance.

[0051] Specifically, since the error warning information includes error warning information related to the wiring distance, it also includes error warning information in other aspects; the computer device filters out the error warning information related to the wiring distance from the error warning information, obtains the wiring distance for the error warning information related to the wiring distance, and uses the error warning information in which the wiring distance is less than the preset process distance value as wiring distance abnormality warning information.

[0052] S203, displaying a warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer.

[0053] Specifically, the computer device can obtain the coordinates of the wiring error line in the wiring distance abnormality warning information, and display a warning mark corresponding to the wiring distance abnormality warning information of the wiring error line on the printed circuit board of the design page according to the coordinates.

[0054] In one possible manner, the computer device can also obtain the wiring error line and the corresponding wiring distance based on the wiring distance abnormality warning information, and generate a wiring distance error report based on the wiring error line and the corresponding wiring distance; the wiring distance error report can also include the coordinate information of the wiring error line and the preset process distance value; the wiring distance error report can be a document or a table.

[0055] In the wiring distance detection method of the above-mentioned printed circuit board, a preset process distance value is obtained, so that error warning information related to the wiring distance can be scanned and obtained through a scanning instruction, and the wiring distance abnormality warning information is filtered out in the error warning information through the preset process distance value, and a warning mark corresponding to the wiring distance abnormality warning information is displayed on the printed circuit board layer; in the design stage of the printed circuit board, the wiring distance error is automatically detected based on the preset process distance value. Compared with manual detection of wiring distance errors, the accuracy and efficiency of wiring distance detection are improved, and it also avoids the situation in which the wiring layout does not meet the actual process requirements due to undetected wiring distance errors during the production of printed circuit boards, thereby improving production efficiency.

[0056] In some embodiments, the wiring distance detection method for a printed circuit board also includes: saving a wiring distance detection program to a configuration file path of a printed circuit board design application; adding a wiring distance detection command to a menu file of the printed circuit board design application, and establishing a calling relationship between the wiring distance detection command and the wiring distance detection program.

[0057] Among them, the wiring distance detection program is a custom script file, specifically a script file used to detect wiring distance errors; the printed circuit board design application is an application for designing printed circuit boards, through which circuit schematics can be edited, printed circuit board layouts, printed circuit board wiring and other operations can be performed.

[0058] The menu file defines the menu structure of the printed circuit board design application. In actual applications, the menu structure includes file operations, editing functions, view operations, wiring functions, etc.

[0059] Specifically, the computer device obtains a written wiring distance detection program, saves the wiring distance detection program in the configuration file path of the printed circuit board design application, and integrates the wiring distance detection program into the printed circuit board design application, so that the printed circuit board design application can execute the customized wiring distance detection program, thereby expanding the function of the printed circuit board design application through the customized wiring distance detection program.

[0060] A wiring distance detection command is added to the menu file of the printed circuit board design application, that is, the customized wiring distance detection command is added to the menu structure of the printed circuit board design application by modifying the menu file; a calling relationship between the wiring distance detection command and the wiring distance detection program is established, so that the wiring distance detection program can be called through the wiring distance detection command added in the menu structure, and then the wiring distance detection is started.

[0061] Exemplarily, the printed circuit board design application is taken as an example of the Cadence application. The Cadence application is an electronic design automation tool. The computer device obtains a customized wiring distance detection program. Since the scripting language used by the Cadence application is Skill, the customized wiring distance detection program can be written in the Skill scripting language; the wiring distance detection program is installed to the pcbenv path of the Cadence application (the path of the Cadence application for storing environment variable settings and customized Skill scripts), so that the Cadence application can recognize the wiring distance detection program; the wiring distance detection command is added to the MANUFACTURE menu, and it is set to start the wiring distance detection program through the wiring distance detection command.

[0062] It should be noted that the above-mentioned Cadence application is only used as an example and is not used to limit the scope of protection of the present application; the embodiments of the present application can also be applied to other printed circuit board design applications to expand the wiring distance detection program of other printed circuit board design applications.

[0063] In some embodiments, the wiring distance detection method for a printed circuit board also includes: in response to a trigger operation for a wiring distance detection command, running a wiring distance detection program to display a process setting control on a design page; and obtaining a preset process distance value entered in the process setting control.

[0064] Specifically, a control corresponding to the wiring distance detection command is displayed in the menu of the printed circuit board design application, and the trigger operation for the wiring distance detection command can be implemented through the control. For example, click the control corresponding to the wiring distance detection command to implement the trigger operation for the wiring distance detection command.

[0065] The computer device responds to the trigger operation for the wiring distance detection command and runs the text box instruction of the wiring distance detection program to display the process setting control (which can be a text box style) on the design page. The user can enter the preset process distance value through the process setting control, and the computer device obtains the preset process distance value entered through the process setting control.

[0066] In the above embodiment, the customized wiring distance detection program is saved to the configuration file path of the printed circuit board design application, the customized wiring distance detection command is added to the menu structure of the printed circuit board design application, and a calling relationship between the wiring distance detection program and the wiring distance detection command is established to achieve functional expansion of the printed circuit board design application. The wiring distance detection program is called through the wiring distance detection command to display the process setting control on the design page, and then the input preset process distance value is obtained through the process setting control.

[0067] In some embodiments, in response to a scanning instruction, the printed circuit board layer of the design page is scanned to obtain error warning information of the printed circuit board layer, including: in response to the scanning instruction, using a preset process distance value as a detection parameter of a wiring distance detection program, and using a reference threshold as a detection parameter of an error detection program; running the wiring distance detection program and the error detection program, scanning the printed circuit board layer of the design page, and obtaining error warning information of the printed circuit board layer.

[0068] Among them, the wiring distance detection program is a script file used to detect wiring distance errors in the printed circuit board layer; the error detection program is the original error detection program of the printed circuit board design application, which is used to detect errors in the printed circuit board layer; the reference threshold is used to reflect the reference value of each detection item of the printed circuit board layer.

[0069] Specifically, the computer device responds to the scanning instruction, obtains the preset process distance value and the reference threshold, uses the preset process distance value as the detection parameter of the wiring distance detection program, uses the reference threshold as the detection parameter of the error detection program, runs the wiring distance error detection instruction of the wiring distance detection program to detect the wiring distance error of the printed circuit board layer, runs the error detection instruction of the error detection program, detects each detection item of the printed circuit board layer, and obtains error warning information; the error warning information may include information about the wiring distance error, as well as information about errors in other detection items.

[0070] It should be noted that the computer device pre-adds the wiring distance detection program to the call chain of the scanning instruction, so that the wiring distance detection program can be run when the scanning instruction is triggered, and the wiring distance error of the printed circuit board can be detected by the wiring distance detection program.

[0071] In the above embodiment, wiring distance detection is used as a new detection item in the printed circuit board design application. The wiring distance and original detection items of the printed circuit board layer are detected through scanning instructions to obtain error warning information of the printed circuit board layer, thereby realizing automatic detection of wiring distance errors of the printed circuit board layer.

[0072] In some embodiments, error warning information is screened based on a preset process distance value to obtain wiring distance abnormality error warning information, including: selecting candidate error warning information related to the wiring distance in the error warning information based on the name of the error warning information; obtaining the wiring distance included in the candidate error warning information; screening out wiring distance abnormality warning information in the candidate error warning information based on the wiring distance and the preset process distance value; the wiring distance of the wiring distance abnormality warning information is less than the preset process distance value.

[0073] The candidate error warning information is at least one of the error warning information; and the wiring distance abnormality warning information is at least one of the candidate error warning information.

[0074] Specifically, the computer device obtains the name of the error warning information, and for each error warning information, determines whether the name of the error warning information includes the screening keyword. If it does, the error warning information is used as a candidate error warning information related to the wiring distance. If it does not, the error warning information is discarded.

[0075] Among them, the filtering keywords may be names that characterize wiring distances; for example, the filtering keywords may include: "Line to Line Spacing", "Line to via Spacing" and "Line to shape Spacing", "Line to Line Spacing" is the minimum distance between two lines; "Line to via Spacing" is the minimum distance between a line and a hole, and "Line to shape Spacing" is the minimum distance between a line and a copper-plated area; it should be noted that the wiring distance of a printed circuit board needs to meet the process capabilities of the printed circuit board manufacturer.

[0076] Exemplarily, taking the Cadence application as an example for printed circuit board design application, in the Cadence application, the error warning information can be analyzed through data interaction instructions (such as the axlDBGetDesign instruction), and candidate error warning information with names including "Line to Line Spacing", "Line to viaSpacing" and "Line to shape Spacing" are selected from the error warning information; wherein the axlDBGetDesign instruction is used to interact with the database object of the currently designed printed circuit board.

[0077] For the selected candidate error warning information, obtain the wiring distance included in the candidate error warning information, and determine whether the wiring distance is less than the preset process distance value. If so, use the candidate error warning information as wiring distance abnormality warning information; if not, discard the candidate error warning information.

[0078] It should be noted that there may be candidate error warning information related to the wiring distance, but it is not an error warning information that the wiring distance is less than the preset process distance value. Therefore, it is necessary to use the preset process distance value to filter out the wiring distance abnormality warning information in the candidate error warning information.

[0079] Exemplarily, taking the Cadence application as an example of a printed circuit board design application, in the Cadence application, the judgment script can be customized through the Skill language. For example, when the judgment script is running, the lessp function (a judgment function) is used to compare the size relationship between the wiring distance included in the candidate error warning information and the preset process distance value to determine whether to use the candidate error warning information as a wiring distance abnormality warning information.

[0080] It should be noted that the above-mentioned Cadence application is only used as an example and is not used to limit the scope of protection of this application; the embodiments of this application can also be applied to other printed circuit board design applications to implement screening in error warning information based on preset process distance values ​​to obtain wiring distance abnormality warning information.

[0081] In the above embodiment, by presetting the process distance value, the wiring distance abnormality warning information related to the wiring distance and whose wiring distance is less than the preset process distance value is screened out from the error warning information, thereby realizing automatic screening of the wiring distance abnormality warning information and improving the efficiency of detecting wiring distance errors.

[0082] In some embodiments, after scanning the printed circuit board layer of the design page and obtaining the error warning information of the printed circuit board layer, it also includes: displaying a warning mark corresponding to the error warning information on the printed circuit board layer; displaying a warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer, including: removing the warning marks corresponding to other error warning information in the error warning information except for the wiring distance abnormality warning information, so as to display the warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer.

[0083] Specifically, the computer device obtains the line corresponding to the error warning information in the printed circuit board layer, displays the warning mark corresponding to the error warning information on the line, and obtains the printed circuit board layer displaying the warning mark corresponding to the error warning information; the computer device divides the error warning information into wiring distance abnormality warning information and other error warning information, and eliminates the warning marks corresponding to other error warning information through elimination instructions to retain the warning marks corresponding to the wiring distance abnormality warning information.

[0084] Exemplarily, taking the Cadence application as an example for printed circuit board design application, in the Cadence application, other error warning information can be eliminated through the error ignore instruction (such as the axlDRCWaive instruction), and only the warning mark corresponding to the wiring distance abnormality warning information displayed on the printed circuit board layer is retained; the axlDRCWaive instruction is an instruction used to ignore or exempt error warnings.

[0085] It should be noted that the above-mentioned Cadence application is only used as an example and is not used to limit the scope of protection of this application; the embodiments of this application can also be applied to other printed circuit board design applications to display warning signs corresponding to abnormal wiring distance warning information on the printed circuit board layer.

[0086] In the above embodiment, a warning mark corresponding to the abnormal wiring distance warning information is displayed on the printed circuit board layer, so that the circuits with incorrect wiring distances in the printed circuit board layer can be intuitively understood, so as to facilitate subsequent modification of the circuits.

[0087] In some embodiments, displaying a warning mark corresponding to the error warning information on the printed circuit board layer includes: obtaining coordinate information from the description information of the wiring distance abnormality warning information; and displaying a warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer based on the coordinate information.

[0088] The coordinate information is the position of the line with the wiring distance error in the printed circuit board layer.

[0089] Specifically, the computer device obtains description information of the wiring distance abnormality warning information, obtains coordinate information of the line with the wiring distance error from the description information, determines a coordinate point on the line with the wiring distance error based on the coordinate information, and displays a warning mark corresponding to the wiring distance abnormality warning information at the coordinate point.

[0090] For example, the minimum process distance value (preset process distance value) supported by the printed circuit board manufacturer is 0.04MM. If there is a line in the printed circuit board layer whose wiring distance is less than the preset process distance value, in the related art, it will not prompt that the wiring distance of the line is wrong, such as Figure 3As shown, the wiring distance between the lines is 0.03MM, and no warning prompt is given; in the embodiment of the present application, a warning mark (prompted error warning) corresponding to the wiring distance abnormal warning information can be displayed on the line where the wiring distance is less than the preset process distance value, such as Figure 4 As shown, Figure 4 The line corresponding to the triangle (warning sign) in the figure has a wiring distance error.

[0091] In the above embodiment, a warning mark corresponding to the abnormal wiring distance warning information is displayed on the printed circuit board layer, so that the circuits with incorrect wiring distances in the printed circuit board layer can be intuitively understood, so as to facilitate subsequent modification of the circuits.

[0092] In some embodiments, the wiring distance detection method of a printed circuit board also includes: obtaining coordinate information of a circuit corresponding to wiring distance abnormality warning information; establishing an association between the circuit corresponding to the wiring distance abnormality warning information and the coordinate information; displaying the coordinate information in a design page; when the displayed coordinate information is triggered, the circuit that is associated with the coordinate information is displayed in the center of the design page.

[0093] The wiring distance abnormality warning information corresponds to a line, which is a line with a wiring distance error, and the coordinate information of the line indicates the position of the line in the printed circuit board layer.

[0094] Specifically, the computer device obtains the coordinate information of the line corresponding to the wiring distance abnormality warning information, establishes an association relationship between the line and the coordinate information, and displays the coordinate information in the design page. When there are multiple wiring distance abnormality warning messages, the coordinate information of multiple lines can be displayed in the form of a coordinate list; when the computer device obtains the trigger operation for the coordinate information displayed in the design page, the line that has an association relationship with the triggered coordinate information is displayed in the center of the design page, so that the user can view the associated line through the displayed coordinate information and modify the wiring distance of the line, thereby improving the user experience, avoiding the lines with wiring distance errors from being ignored, and improving the effect of wiring distance error detection.

[0095] In some embodiments, if the error warning information is screened based on the preset process distance value and no wiring distance abnormality warning information is obtained, it means that there is no wiring distance error in the printed circuit board layer, and then no wiring distance error information is output; in actual applications, taking the printed circuit board design application as the Cadence application as an example, the no wiring distance error information can be output by displaying the instruction: "The inspection is completed and there is no wiring error that is less than the preset process distance value."

[0096] Figure 5 Schematic diagram of the process of the wiring distance detection method of the printed circuit board provided in this application Figure 2 ,like Figure 5 As shown, in this embodiment Figure 2 Based on the embodiment, a wiring distance detection method for a printed circuit board is described in detail, and the method includes:

[0097] S501, in response to a trigger operation for a wiring distance detection command, running a wiring distance detection program to display a process setting control on a design page; obtaining a preset process distance value input in the process setting control;

[0098] S502, in the case of obtaining the preset process distance value, in response to the scanning instruction, using the preset process distance value as a detection parameter of the wiring distance detection program, and using the reference threshold as a detection parameter of the error detection program; running the wiring distance detection program and the error detection program, scanning the printed circuit board layer of the design page, and obtaining error warning information of the printed circuit board layer; displaying a warning mark corresponding to the error warning information on the printed circuit board layer;

[0099] S503, selecting candidate error warning information related to the wiring distance from the error warning information according to the name of the error warning information; obtaining the wiring distance included in the candidate error warning information; filtering out abnormal wiring distance warning information from the candidate error warning information according to the wiring distance and the preset process distance value; the wiring distance of the abnormal wiring distance warning information is less than the preset process distance value;

[0100] S504, removing warning marks corresponding to other error warning messages except for the wiring distance abnormality warning message in the error warning message, so as to display the warning mark corresponding to the wiring distance abnormality warning message on the printed circuit board layer;

[0101] S505. Obtain the coordinate information of the line corresponding to the wiring distance abnormality warning information; establish an association relationship between the line corresponding to the wiring distance abnormality warning information and the coordinate information; display the coordinate information in the design page; when the coordinate information is used to be triggered, the line that has an association relationship with the coordinate information is displayed in the center of the design page.

[0102] In a specific example, Figure 6As shown in the figure, the printed circuit board design application is a Cadence application as an example for explanation. The printed circuit board layer is designed in the Cadence application, and the wiring distance detection command is triggered through the menu of the Cadence application. The text box instruction of the wiring distance detection program is run through the wiring distance detection command to display the process setting control in the design page, and the preset process distance value input by the user is obtained through the process setting control; when the preset process distance value is obtained, the scan command is executed to perform an error scan on the printed circuit board layer to obtain an error warning message, and a warning mark corresponding to the error warning message is displayed on the printed circuit half layer; the error warning message is analyzed by using a data interaction instruction (such as the axlDBGetDesign instruction), and the candidate error warning message related to the wiring distance is selected according to the name of the error warning message. information; using a judgment function (such as a lessp function) to compare the size relationship between the wiring distance value included in the candidate error warning information and the preset process distance value; if the wiring distance included in the candidate error warning information is less than the preset process distance value, the candidate error warning information is used as wiring distance abnormality warning information; if the wiring distance included in the candidate error warning information is not less than the preset process distance value, the candidate error warning information is used as other error warning information; using an error ignore instruction (such as an axlDRCWaive instruction) to remove the warning logo corresponding to the other error warning information, so as to retain the warning logo corresponding to the wiring distance abnormality warning information displayed on the printed circuit board layer; if the wiring distances included in the candidate error warning information are not less than the preset process distance value, it means that the lines of the printed circuit board layer meet the process requirements, and no wiring distance error information can be output.

[0103] It should be noted that the above-mentioned Cadence application is only used as an example and is not used to limit the scope of protection of the present application; the embodiments of the present application can also be applied to other printed circuit board design applications to achieve wiring distance error detection.

[0104] In the above-mentioned wiring distance detection method for a printed circuit board, a preset process distance value is obtained, so that error warning information related to the wiring distance can be scanned and obtained through a scanning instruction, and the wiring distance abnormality warning information is filtered out in the error warning information through the preset process distance value, and a warning mark corresponding to the wiring distance abnormality warning information is displayed on the printed circuit board layer; in the design stage of the printed circuit board, the wiring distance error is automatically detected based on the preset process distance value. Compared with manual detection of the wiring distance error, the accuracy and efficiency of the wiring distance detection are improved, and the situation that the printed circuit board needs to be redesigned due to undetected wiring distance errors is avoided during production is also avoided, thereby improving production efficiency.

[0105] It should be understood that, although the steps in the flowcharts involved in the above embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0106] Based on the same inventive concept, an embodiment of the present application further provides a wiring distance detection device for a printed circuit board for implementing the above-mentioned wiring distance detection method for a printed circuit board. Figure 7 The schematic diagram of the structure of the wiring distance detection device for the printed circuit board provided in this application is as follows: Figure 7 As shown, the wiring distance detection device 70 of the printed circuit board provided in this embodiment includes:

[0107] The scanning module 701 is used to scan the printed circuit board layer of the design page in response to the scanning instruction when the preset process distance value is obtained, and obtain the error warning information of the printed circuit board layer;

[0108] A screening module 702 is used to screen the error warning information based on a preset process distance value to obtain wiring distance abnormality warning information;

[0109] The processing module 703 is used to display a warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer.

[0110] In one possible implementation, the scanning module 701 is used to respond to a scanning instruction, use a preset process distance value as a detection parameter of a wiring distance detection program, and use a reference threshold as a detection parameter of an error detection program; run the wiring distance detection program and the error detection program, scan the printed circuit board layer of the design page, and obtain error warning information of the printed circuit board layer.

[0111] In one possible implementation, the filtering module 702 is used to select candidate error warning information related to the wiring distance from the error warning information based on the name of the error warning information; obtain the wiring distance included in the candidate error warning information; based on the wiring distance and the preset process distance value, filter out the wiring distance abnormality warning information from the candidate error warning information; the wiring distance of the wiring distance abnormality warning information is less than the preset process distance value.

[0112] In one possible implementation, the scanning module 701 is also used to display a warning mark corresponding to the error warning information on the printed circuit board layer; the processing module 703 is used to eliminate the warning marks corresponding to other error warning information in the error warning information except for the wiring distance abnormality warning information, so as to display the warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer.

[0113] In one possible implementation, the processing module 703 is also used to obtain the coordinate information of the line corresponding to the wiring distance abnormality warning information; establish an association between the line corresponding to the wiring distance abnormality warning information and the coordinate information; display the coordinate information in the design page; when the coordinate information is triggered, the line that has an association with the coordinate information is displayed in the center of the design page.

[0114] In a possible implementation, the wiring distance detection device for a printed circuit board further includes:

[0115] The acquisition module is used to respond to the trigger operation for the wiring distance detection command, run the wiring distance detection program to display the process setting control on the design page; and obtain the preset process distance value input in the process setting control.

[0116] The wiring distance detection device for a printed circuit board provided in this embodiment can execute the method provided in the above method embodiment. Its implementation principle and technical effect are similar, and this embodiment will not be described in detail here.

[0117] Figure 8 This is a schematic diagram of the structure of the computer device provided in this application. Figure 8 As shown, the computer device 80 provided in this embodiment includes: at least one processor 801 and a memory 802. Optionally, the device 80 also includes a communication component 803. The processor 801, the memory 802 and the communication component 803 are connected via a bus 804.

[0118] In a specific implementation process, at least one processor 801 executes the computer-executable instructions stored in the memory 802, so that at least one processor 801 executes the above method.

[0119] The specific implementation process of the processor 801 can be found in the above method embodiment, and its implementation principle and technical effect are similar, so this embodiment will not be repeated here.

[0120] In the above embodiments, it should be understood that the processor can be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. A general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in the invention can be directly implemented as a hardware processor, or can be implemented by a combination of hardware and software modules in the processor.

[0121] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (NVM), such as at least one disk storage.

[0122] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of this application is not limited to only one bus or one type of bus.

[0123] The present application also provides a computer program product, including a computer program, which implements the above method when executed by a processor.

[0124] The present application also provides a computer-readable storage medium, in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the above method is implemented.

[0125] The above-mentioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. The readable storage medium can be any available medium that can be accessed by a general or special-purpose computer.

[0126] An exemplary readable storage medium is coupled to a processor so that the processor can read information from the readable storage medium and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can be located in an application specific integrated circuit (Application Specific Integrated Circuits, referred to as: ASIC). Of course, the processor and the readable storage medium can also exist in the device as discrete components.

[0127] The division of units is only a logical function division, and there may be other divisions in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0128] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0129] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0130] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0131] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, disk or optical disk and other media that can store program codes.

[0132] Finally, it should be noted that those skilled in the art will readily conceive of other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention, which follow the general principles of the present invention and include common knowledge or customary technical means in the art not disclosed by the present invention, are not limited to the precise structure described above and shown in the drawings, and may be modified and changed in various ways without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A method for detecting wiring distance of a printed circuit board, characterized in that: include: When the preset process distance value is obtained, in response to the scanning instruction, the printed circuit board layer of the design page is scanned to obtain error warning information of the printed circuit board layer; The error warning information is screened based on the preset process distance value to obtain wiring distance abnormality warning information; A warning mark corresponding to the wiring distance abnormality warning information is displayed on the printed circuit board layer.

2. The method according to claim 1, characterized in that The step of scanning the printed circuit board layer of the design page in response to the scanning instruction to obtain error warning information of the printed circuit board layer includes: In response to the scanning instruction, the preset process distance value is used as a detection parameter of the wiring distance detection program, and the reference threshold value is used as a detection parameter of the error detection program; The wiring distance detection program and the error detection program are run to scan the printed circuit board layer of the design page to obtain error warning information of the printed circuit board layer.

3. The method according to claim 1, characterized in that: The error warning information is screened based on the preset process distance value to obtain wiring distance abnormality warning information, including: According to the name of the error warning information, selecting candidate error warning information related to the wiring distance from the error warning information; Obtaining the wiring distance included in the candidate error warning information; According to the wiring distance and the preset process distance value, the wiring distance abnormality warning information is screened out from the candidate error warning information; the wiring distance of the wiring distance abnormality warning information is smaller than the preset process distance value.

4. The method according to any one of claims 1 to 3, characterized in that After scanning the printed circuit board layer of the design page to obtain error warning information of the printed circuit board layer, the method further includes: Displaying a warning mark corresponding to the error warning information on the printed circuit board layer; The warning mark corresponding to the abnormal wiring distance warning information is displayed on the printed circuit board layer, including: The warning marks corresponding to the error warning messages other than the wiring distance abnormality warning message in the error warning message are removed, so as to display the warning marks corresponding to the wiring distance abnormality warning message on the printed circuit board layer.

5. The method according to any one of claims 1 to 3, characterized in that The method further comprises: Obtaining coordinate information of the line corresponding to the wiring distance abnormality warning information; Establishing an association relationship between the line corresponding to the wiring distance abnormality warning information and the coordinate information; The coordinate information is displayed in the design page; when the coordinate information is used to be triggered, a line associated with the coordinate information is displayed in the center of the design page.

6. The method according to any one of claims 1 to 3, characterized in that The method further comprises: In response to a trigger operation for a wiring distance detection command, running a wiring distance detection program to display a process setting control on the design page; The preset process distance value input in the process setting control is obtained.

7. A wiring distance detection device for a printed circuit board, characterized in that: The device comprises: A scanning module, for scanning the printed circuit board layer of the design page in response to a scanning instruction when a preset process distance value is obtained, to obtain error warning information of the printed circuit board layer; A screening module, used for screening the error warning information based on the preset process distance value to obtain wiring distance abnormality warning information; A processing module is used to display a warning mark corresponding to the wiring distance abnormality warning information on the printed circuit board layer.

8. A computer device, characterized in that: include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, which are used to implement the method according to any one of claims 1 to 6 when executed by a processor.

10. A computer program product, characterized in that The method comprises computer-executable instructions, which implement the method according to any one of claims 1 to 6 when executed by a processor.

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