Substrate processing apparatus and substrate processing method

Abstract

The invention provides a substrate processing apparatus and a substrate processing method which can determine processing liquid in a liquid discharge part with high precision. A substrate processing apparatus (100) includes a chamber (112), a substrate holding unit (120), a processing liquid supply unit (130), a liquid discharge unit (190), at least one near-infrared light source (140), a near-infrared imaging unit (150), and a control unit (102). The substrate holding part is accommodated in the chamber. The substrate holding unit holds a substrate (W). The processing liquid supply unit supplies a plurality of processing liquids to the substrate at different timings. The liquid discharge unit discharges the plurality of processing liquids to the outside of the chamber. The at least one near-infrared light source irradiates a region (AR1) including at least a portion of the liquid discharge section with near-infrared rays. The near-infrared imaging unit captures an image of a plurality of types of processing liquid in the liquid discharge unit irradiated by near-infrared rays and generates a captured image. The control unit determines the type of the processing liquid in the liquid discharge unit on the basis of the captured image.

Description

Technical Field

[0001] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0002] A substrate processing device is known that supplies a processing liquid to a substrate and performs substrate processing (for example, see Patent Document 1). The substrate processing device described in Patent Document 1 includes a substrate holding portion, a processing liquid supply portion, a common drain pipe, a switching valve, a cleaning liquid supply portion, and a liquid detection portion. The processing liquid supply portion independently supplies a plurality of processing liquids to the substrate. The liquid detection portion detects whether there is a valve cleaning liquid at a detection position on the common drain pipe. Thus, it is possible to easily clean the inside of the switching valve.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-208404 Summary of the invention

[0006] In the substrate processing device described in Patent Document 1, for example, when the switching valve switches the destination of the processing liquid, the opening and closing state of the switching valve connected to the common drain pipe is changed. In this case, it is difficult to confirm whether the processing liquid on the common drain pipe and in the flow path of the switching valve (draining part) has been switched. Specifically, usually, since the processing liquid used for substrate processing is transparent, the usual CCD camera cannot detect the processing liquid. Therefore, it is sometimes impossible to determine the processing liquid on the common drain pipe and in the switching valve (in the draining part) with high precision.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of accurately determining the processing liquid in a liquid discharge portion.

[0008] According to one aspect of the present invention, a substrate processing device includes a chamber, a substrate holding portion, a processing liquid supply portion, a liquid discharge portion, at least one near-infrared light source, a near-infrared camera portion, and a control portion. The substrate holding portion is accommodated in the chamber. The substrate holding portion holds a substrate. The processing liquid supply portion supplies a plurality of processing liquids to the substrate at different timings. The liquid discharge portion discharges the plurality of processing liquids out of the chamber. The at least one near-infrared light source irradiates an area including at least a portion of the liquid discharge portion with near-infrared rays. The near-infrared camera portion captures the plurality of processing liquids in the liquid discharge portion irradiated by the near-infrared rays and generates a captured image. The control portion controls the near-infrared camera portion. The control portion determines the type of the processing liquid in the liquid discharge portion based on the captured image.

[0009] In one embodiment, the control unit controls the liquid discharge unit based on a result of determining the type of the processing liquid.

[0010] In one embodiment, the liquid discharge unit includes an upstream pipe, a common pipe, and a plurality of downstream pipes. The upstream pipe is used to circulate the plurality of processing liquids discharged from the chamber. The common pipe is connected to the downstream end of the upstream pipe. The upstream ends of the plurality of downstream pipes are connected to the common pipe.

[0011] In one embodiment, the drain unit further includes a switching unit configured to switch a flow destination of the processing liquid flowing through the common pipe between the plurality of downstream pipes.

[0012] In one embodiment, the near-infrared light source irradiates an area including at least a portion of the upstream piping with the near-infrared rays. The near-infrared imaging unit generates the captured image. The captured image is generated by capturing the plurality of treatment liquids in the upstream piping irradiated with the near-infrared rays. The control unit determines the type of the treatment liquid in the upstream piping based on the captured image.

[0013] In one embodiment, the near-infrared light source irradiates an area including at least a portion of the common pipe with the near-infrared light. The near-infrared imaging unit photographs the plurality of treatment liquids in the common pipe irradiated with the near-infrared light to generate the photographed image. The control unit determines the type of the treatment liquid in the common pipe based on the photographed image.

[0014] In one embodiment, the control unit controls a switching timing for switching a flow destination of the process liquid flowing through the common pipe based on a result of identifying the type of the process liquid.

[0015] In one embodiment, the at least one near-infrared light source is a plurality of near-infrared light sources. The plurality of near-infrared light sources emit near-infrared light having different peak wavelengths. The control unit acquires type information indicating the type of the treatment liquid. The control unit changes the near-infrared light source that irradiates an area including at least a portion of the discharge portion based on the type information.

[0016] In one embodiment, the control unit controls the processing liquid supply unit based on a result of determining the type of the processing liquid.

[0017] According to another aspect of the present invention, a substrate processing method includes the following steps: a step of holding a substrate in a chamber; a step of supplying a plurality of processing liquids to the substrate at different timings; a step of discharging the plurality of processing liquids out of the chamber by a drainage section; a step of irradiating an area including at least a portion of the drainage section with near-infrared rays; a step of generating a captured image of the plurality of processing liquids in the drainage section irradiated with the near-infrared rays; and a step of determining the type of the processing liquid in the drainage section based on the captured image.

[0018] In one embodiment, the method further includes controlling the liquid discharge unit based on the result of determining the type of the treatment liquid.

[0019] In one embodiment, the liquid discharge unit includes an upstream pipe, a common pipe, and a downstream pipe. The upstream pipe is used to circulate the multiple processing liquids discharged from the chamber. The common pipe is connected to the downstream end of the upstream pipe. The upstream ends of the multiple downstream pipes are connected to the common pipe.

[0020] In one embodiment, in the step of controlling the drain unit, a flow destination of the processing liquid flowing through the common pipe is switched between the plurality of downstream pipes.

[0021] In one embodiment, in the step of irradiating with the near infrared ray, the region including at least a portion of the upstream pipe is irradiated with the near infrared ray. In the step of generating the captured image, the plurality of treatment liquids in the upstream pipe irradiated with the near infrared ray are captured and the captured image is generated. In the step of determining the type of the treatment liquid, the type of the treatment liquid in the upstream pipe is determined based on the captured image.

[0022] In one embodiment, in the step of irradiating with the near infrared ray, the region including the at least one portion is irradiated with the near infrared ray. In the step of generating the captured image, the plurality of processing liquids in the common pipe irradiated with the near infrared ray are captured to generate the captured image. In the step of determining the type of the processing liquid, the type of the processing liquid in the common pipe is determined based on the captured image.

[0023] In one embodiment, in the step of controlling the liquid discharge unit, a switching timing for switching a flow destination of the processing liquid flowing through the common pipe is controlled based on a result of identifying the type of the processing liquid.

[0024] In one embodiment, in the step of irradiating with the near-infrared ray, one of the plurality of near-infrared light sources emitting the near-infrared ray having different peak wavelengths irradiates the region including at least a portion of the liquid discharge portion with the near-infrared ray. The substrate processing method further includes the steps of: acquiring type information indicating the type of the processing liquid; and changing the near-infrared light source irradiating the region including at least a portion of the liquid discharge portion based on the type information.

[0025] In one embodiment, in the step of supplying the processing liquid at different timings, the processing liquid supplied to the substrate is switched based on a result of determining the type of the processing liquid.

[0026] Effects of the Invention

[0027] According to the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method capable of accurately determining the processing liquid in a liquid discharge portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 is a schematic top view of a substrate processing apparatus.

[0029] Figure 2 It is a schematic diagram of a substrate processing unit in a substrate processing apparatus.

[0030] Figure 3 is a block diagram of a substrate processing apparatus.

[0031] Figure 4 This is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment.

[0032] Figure 5 This is a block diagram showing the configuration of a control device and a switching unit included in the substrate processing apparatus according to the present embodiment.

[0033] Figure 6 is a flow chart of a substrate processing method.

[0034] Figure 7 It is a flowchart of a substrate processing step in the substrate processing method according to the present embodiment.

[0035] Figure 8 It is a flowchart of a substrate processing step in the substrate processing method according to the present embodiment.

[0036] Fig. 9 This is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment.

[0037] Fig.10This is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment.

[0038] Fig.11 This is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment.

[0039] Fig.12 This is a diagram showing an example of the configuration of a switching valve included in the substrate processing apparatus according to the present embodiment.

[0040] Fig.13 It is a schematic diagram of a substrate processing unit in a substrate processing apparatus having a plurality of near-infrared light sources.

[0041] Fig.14 It is a flowchart of a substrate processing step in the substrate processing method according to the present embodiment.

[0042] The reference numerals are described as follows:

[0043] 12 Upstream piping

[0044] 12b downstream end

[0045] 13Common piping

[0046] 14 Downstream piping

[0047] 14a Upstream end

[0048] 19 Switching Department

[0049] 100Substrate processing device

[0050] 102 Control Department

[0051] Chamber 112

[0052] 120 substrate holding part

[0053] 130 Treatment liquid supply unit

[0054] 130a: first processing liquid supply unit (processing liquid supply unit)

[0055] 130b: second processing liquid supply unit (processing liquid supply unit)

[0056] 130c Rinsing liquid supply unit (processing liquid supply unit)

[0057] 140, 140a, 140b Near infrared light source

[0058] 150 Near infrared camera unit

[0059] 190 drain part

[0060] AR1 Region

[0061] AR2 Region

[0062] W substrate

[0063] Step S120 (Step of irradiating with near infrared rays) and (Step of generating a captured image)

[0064] Step S125 (Process of Acquiring Type Information)

[0065] Step S130 (Process of supplying a plurality of treatment liquids at different timings)

[0066] Step S140 (liquid discharge process)

[0067] Step S160 (Process of supplying a plurality of treatment liquids at different timings)

[0068] Step S170 (liquid discharge process)

[0069] Step S180 (Step of determining the type of treatment liquid)

[0070] Step S205 (process of changing near infrared rays)

[0071] Step S210 (Process of supplying a plurality of treatment liquids at different timings)

[0072] Step S220 (liquid discharge process)

[0073] Step S230 (Step of determining the type of treatment liquid)

[0074] Step S250 (Process of controlling the drainage unit)

[0075] SB step (substrate holding step) DETAILED DESCRIPTION

[0076] Hereinafter, embodiments of the substrate processing device and the substrate processing method of the present invention are described with reference to the accompanying drawings. It should be noted that in the drawings, the same or equivalent parts are marked with the same reference numerals and no repeated description is made. It should be noted that in the specification of this application, in order to facilitate the understanding of the invention, mutually orthogonal X-axis, Y-axis and Z-axis are sometimes recorded. Typically, the X-axis and the Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0077] First, refer to Figure 1 A substrate processing apparatus 100 according to this embodiment will be described. Figure 1 1 is a schematic top view of the substrate processing apparatus 100 .

[0078] like Figure 1As shown, the substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by performing at least one of etching, surface processing, imparting characteristics, forming a process film, removing at least a portion of a film, and cleaning.

[0079] The substrate W is used as a semiconductor substrate. The substrate W includes a semiconductor wafer. For example, the substrate W is substantially disk-shaped. Here, the substrate processing apparatus 100 processes the substrates W one by one.

[0080] like Figure 1 As shown, the substrate processing apparatus 100 includes a plurality of substrate processing units 110, a fluid cabinet 10A, a fluid box 10B, a plurality of loading ports LP, an indexer robot IR, a central robot CR and a control device 101. The control device 101 controls the loading ports LP, the indexer robot IR, the central robot CR and the substrate processing units 110.

[0081] Each loading port LP accommodates a plurality of substrates W in a stacked manner. The indexer robot IR transports the substrates W between the loading port LP and the central robot CR. It should be noted that the device may also be configured as follows: a setting table (transfer unit) for temporarily placing the substrates W is provided between the indexer robot IR and the central robot CR, and the substrates W are indirectly transferred between the indexer robot IR and the central robot CR via the setting table. The central robot CR transports the substrates W between the indexer robot IR and the substrate processing unit 110. Each substrate processing unit 110 sprays a processing liquid onto the substrate W to process the substrate W. The fluid cabinet 10A accommodates the processing liquid. It should be noted that the fluid cabinet 10A may also accommodate gas.

[0082] The plurality of substrate processing units 110 form a plurality of towers TW (in a plan view) arranged so as to surround the central robot CR. Figure 1 Each tower TW includes a substrate processing unit 110 stacked up and down (in Figure 1 There are three substrate processing units 110 in the figure. The fluid boxes 10B correspond to the multiple towers TW respectively. The processing liquid in the fluid cabinet 10A is supplied to all the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via a certain fluid box 10B. In addition, the gas in the fluid cabinet 10A is supplied to all the substrate processing units 110 included in the tower TW corresponding to the fluid box 10B via a certain fluid box 10B.

[0083] The control device 101 controls various operations of the substrate processing apparatus 100. The control device 101 includes a control unit 102 and a storage unit 104. The control unit 102 has a processor. The control unit 102 has, for example, a central processing unit (CPU). Alternatively, the control unit 102 may have a general-purpose computing unit.

[0084] The storage unit 104 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. The storage unit 104 may also include a removable medium. The control unit 102 executes a computer program stored in the storage unit 104 to perform substrate processing operations.

[0085] The storage unit 104 stores data. The data includes process data. The process data includes information indicating a plurality of processes. The plurality of processes respectively define the processing contents and processing steps of the substrate W.

[0086] In addition, the storage unit 104 may store the brightness value or lightness of the reference processing liquid. Alternatively, the storage unit 104 may store a reference image obtained by photographing the reference processing liquid.

[0087] Next, refer to Figure 2 The substrate processing unit 110 in the substrate processing apparatus 100 according to the present embodiment will be described. Figure 2 2 is a schematic diagram of a substrate processing unit 110 in the substrate processing apparatus 100 .

[0088] The substrate processing unit 110 includes a chamber 112, a substrate holding portion 120, and a processing liquid supply portion 130. The chamber 112 accommodates the substrate holding portion 120 and the processing liquid supply portion 130.

[0089] The chamber 112 is substantially box-shaped with an internal space. The chamber 112 accommodates the substrate W. Here, the substrate processing unit 110 is a single-wafer type that processes the substrates W one by one, and accommodates one substrate W in the chamber 112 at a time. The substrate W is accommodated in the chamber 112 and processed in the chamber 112 .

[0090] The substrate holding part 120 holds the substrate W. The substrate holding part 120 holds the substrate W horizontally in such a manner that the upper surface (front surface) Wt of the substrate W faces upward and the back surface (lower surface) Wr of the substrate W faces vertically downward. In addition, the substrate holding part 120 rotates the substrate W while holding the substrate W. The upper surface Wt of the substrate W may also be flattened. Alternatively, a device surface or a columnar stack with grooves may be provided on the upper surface Wt of the substrate W. The substrate holding part 120 rotates the substrate W while holding the substrate W.

[0091] For example, the substrate holding portion 120 may also adopt a clamping type that clamps the end of the substrate W. Alternatively, the substrate holding portion 120 may also have an arbitrary mechanism that holds the substrate W from the back side Wr of the substrate W. For example, the substrate holding portion 120 may also adopt a vacuum type. In this case, the substrate holding portion 120 holds the substrate W horizontally by adsorbing the central portion of the back side Wr of the substrate W, which is a non-device forming surface, onto the upper surface. Alternatively, the substrate holding portion 120 may also use a combination of a vacuum type and a clamping type that brings a plurality of chuck pins into contact with the peripheral end surface of the substrate W.

[0092] For example, the substrate holding unit 120 includes a rotating base 121, a chuck member 122, a shaft 123, an electric motor 124, and a housing 125. The chuck member 122 is provided on the rotating base 121. The chuck member 122 clamps the substrate W. Typically, a plurality of chuck members 122 are provided on the rotating base 121.

[0093] The shaft 123 is a hollow shaft and extends in the vertical direction along the rotation axis Ax. The spin base 121 is coupled to the upper end of the shaft 123 . The substrate W is placed on the spin base 121 .

[0094] The rotating base 121 is in the shape of a disk. The chuck member 122 horizontally supports the substrate W. The shaft 123 extends downward from the center of the rotating base 121. The electric motor 124 imparts a rotational force to the shaft 123. The electric motor 124 rotates the shaft 123 in a rotation direction, thereby rotating the substrate W and the rotating base 121 around the rotation axis Ax. The housing 125 surrounds the shaft 123 and the electric motor 124.

[0095] The processing liquid supply unit 130 supplies a plurality of processing liquids at different timings to the substrate W. Typically, the processing liquid supply unit 130 supplies the processing liquids to the upper surface Wt of the substrate W held by the substrate holding unit 120 .

[0096] The processing liquid may also be an etching liquid for etching the substrate W. Examples of the etching liquid include nitric acid fluoride (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), and phosphoric acid (H3PO4). The type of etching liquid is not particularly limited, and for example, it may be acidic or alkaline.

[0097] Alternatively, the treatment liquid may be a rinse liquid, such as deionized water (DIW), carbonated water, electrolytic ionized water, ozone water, ammonia water, diluted hydrochloric acid water (eg, about 10 ppm to 100 ppm), and reduced water (hydrogen water).

[0098] Alternatively, the treatment liquid may be an organic solvent. Typically, the volatility of the organic solvent is higher than that of the rinse liquid. Examples of the organic solvent include isopropyl alcohol (IPA), methanol, ethanol, acetone, hydrofluoroether (HFE), propylene glycol ethyl ether (PGEE), and propylene glycol monomethyl ether acetate (PGMEA).

[0099] In this embodiment, the processing liquid supply unit 130 includes a first processing liquid supply unit 130a, a second processing liquid supply unit 130b, and a rinse liquid supply unit 130c. The first processing liquid supply unit 130a supplies a first processing liquid to the substrate W. The second processing liquid supply unit 130b supplies a second processing liquid different from the first processing liquid to the substrate W. The rinse liquid supply unit 130c supplies a rinse liquid to the substrate W.

[0100] The first processing liquid supply unit 130a includes a pipe 132a, a valve 134a, a nozzle 136a, and a moving mechanism 1381. The first processing liquid flows from a supply source to the pipe 132a. The valve 134a opens and closes the flow path in the pipe 132a. The nozzle 136a is connected to the pipe 132a. By allowing the first processing liquid to flow through the nozzle 136a, the nozzle 136a sprays the first processing liquid onto the upper surface Wt of the substrate W. It is preferred that the nozzle 136a is configured to be movable relative to the substrate W.

[0101] The pipe 132a and the nozzle 136a are made of resin. The pipe 132a and the nozzle 136a are not particularly limited, and are made of, for example, PFA (perfluoroalkoxyalkane) or PTFE (polytetrafluoroethylene).

[0102] The moving mechanism 1381 moves the nozzle 136a in the horizontal direction and the vertical direction. Specifically, the moving mechanism 1381 moves the nozzle 136a in the circumferential direction around the rotation axis extending in the vertical direction. In addition, the moving mechanism 1381 moves the nozzle 136a up and down in the vertical direction.

[0103] The moving mechanism 1381 includes an arm 138a, a shaft 138b, and a driving portion 138c. The arm 138a extends in the horizontal direction. The nozzle 136 is arranged at the front end of the arm 138a. The nozzle 136 is arranged at the front end of the arm 138a in a posture capable of supplying a processing liquid toward the upper surface Wt of the substrate W held by the chuck member 122. In detail, the nozzle 136a is coupled to the front end of the arm 138a and protrudes downward from the arm 138a. The base end of the arm 138a is coupled to the shaft 138b. The shaft 138b extends in the vertical direction.

[0104] The driving part 138c includes a rotation driving mechanism and a lifting driving mechanism. The rotation driving mechanism of the driving part 138c rotates the shaft 138b around the rotation axis, and rotates the arm 138a along the horizontal plane around the shaft 138b. As a result, the nozzle 136a moves along the horizontal plane. In detail, the nozzle 136a moves circumferentially around the shaft 138b. The rotation driving mechanism of the driving part 138c includes, for example, a motor capable of forward and reverse rotation.

[0105] The lifting drive mechanism of the driving unit 138c lifts the shaft 138b in the vertical direction. The lifting drive mechanism of the driving unit 138c lifts the shaft 138b, so that the nozzle 136 is lifted in the vertical direction. The lifting drive mechanism of the driving unit 138c includes a driving source such as a motor and a lifting mechanism, and the lifting mechanism is driven by the driving source to lift or lower the shaft 138b. The lifting mechanism includes, for example, a rack and pinion mechanism or a ball screw.

[0106] The second processing liquid supply unit 130b includes a pipe 132b, a valve 134b, a nozzle 136b, and a moving mechanism 1382. The second processing liquid flows from a supply source to the pipe 132b. The valve 134b opens and closes the flow path in the pipe 132b. The nozzle 136b is connected to the pipe 132b. By allowing the second processing liquid to flow through the nozzle 136b, the nozzle 136b sprays the second processing liquid onto the upper surface Wt of the substrate W. Preferably, the nozzle 136b is configured to be movable relative to the substrate W.

[0107] The pipe 132b and the nozzle 136b are made of resin. The pipe 132b and the nozzle 136b are not particularly limited, and are made of, for example, PFA or PTFE.

[0108] The moving mechanism 1382 moves the nozzle 136b in the horizontal direction and the vertical direction. The moving mechanism 1382 has the same structure as the moving mechanism 1381, and the description thereof is omitted.

[0109] The rinse liquid supply unit 130c includes a pipe 132c, a valve 134c, and a nozzle 136c. The rinse liquid flows from a supply source to the pipe 132c. The valve 134c opens and closes the flow path in the pipe 132c. The nozzle 136c is connected to the pipe 132c. By allowing the rinse liquid to flow through the nozzle 136c, the nozzle 136c sprays the rinse liquid onto the upper surface Wt of the substrate W. The nozzle 136c is fixed to the substrate W.

[0110] The pipe 132c and the nozzle 136c are made of resin. The pipe 132b and the nozzle 136b are not particularly limited, and are made of, for example, PFA or PTFE.

[0111] In this specification, the pipe 132a, the pipe 132b, and the pipe 132c are sometimes collectively referred to as the pipe 132. In addition, in this specification, the valve 134a, the valve 134b, and the valve 134c are sometimes collectively referred to as the valve 134. In addition, in this specification, the nozzle 136a, the nozzle 136b, and the nozzle 136c are sometimes collectively referred to as the nozzle 136. In addition, in this specification, the moving mechanism 1381 and the moving mechanism 1382 are sometimes collectively referred to as the moving mechanism 138.

[0112] The substrate processing apparatus 100 further includes a cup body 180. The cup body 180 recovers the processing liquid scattered from the substrate W. The cup body 180 rises and falls. For example, the cup body 180 rises vertically upward to the side of the substrate W during the entire period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. In this case, the cup body 180 recovers the processing liquid scattered from the substrate W due to the rotation of the substrate W. In addition, the cup body 180 falls vertically downward from the side of the substrate W when the processing liquid supply unit 130 ends supplying the processing liquid to the substrate W.

[0113] Next, refer to Figure 2 The substrate processing apparatus 100 is further described. Figure 2 As shown, the substrate processing apparatus 100 further includes a liquid discharge unit 190, at least one near-infrared light source 140, and a near-infrared imaging unit 150. In this embodiment, the substrate processing apparatus 100 includes one near-infrared light source 140.

[0114] The drain section 190 drains the various processing liquids to the outside of the chamber 112. The drain section 190 is disposed outside the chamber 112. The drain section 190 is disposed, for example, below the chamber 112. The drain section 190 includes an upstream pipe 12, a common pipe 13, a plurality of downstream pipes 14, a switching section 19, a first port P1, a second port P2, a third port P3, and a fourth port P4.

[0115] The upstream piping 12 is used to circulate various processing liquids discharged from the chamber 112. The upstream piping 12 is a tubular component that extends from the inside of the chamber 112 to the outside. One end 12a of the upstream piping 12 is connected to the bottom of the cup body 180. In more detail, a discharge hole is provided at the bottom of the cup body 180. The upstream piping 12 is connected to the bottom of the cup body 180 in a manner that is connected to the discharge hole. As a result, the processing liquid collected in the cup body 180 after substrate processing flows into the upstream piping 12 due to its own weight. In other words, the discharge liquid collected in the cup body 180 flows into the upstream piping 12 due to its own weight.

[0116] The common pipe 13 is connected to the downstream end 12b of the upstream pipe 12. The common pipe 13 is a tubular member and is arranged outside the chamber 112.

[0117] The upstream ends 14a of the plurality of downstream pipes 14 are connected to the common pipe 13. The plurality of downstream pipes 14 are tubular members. In the present embodiment, the plurality of downstream pipes 14 include a first pipe 141, a second pipe 142, a third pipe 143, and a fourth pipe 144.

[0118] The switching unit 19 switches the flow destination of the processing liquid flowing through the common pipe 13 (the destination of the processing liquid in the common pipe 13) between the plurality of downstream pipes 14. Specifically, the switching unit 19 is controlled by the control device 101 (control unit 102). The control device 101 (control unit 102) controls the switching unit 19 to switch the flow destination of the processing liquid flowing through the common pipe 13 between the plurality of downstream pipes 14. Hereinafter, the flow destination of the processing liquid flowing through the common pipe 13 is sometimes referred to as "the flow destination of the processing liquid".

[0119] In the present embodiment, the switching unit 19 switches the flow destination of the processing liquid flowing through the common pipe 13 among the first pipe 141 to the fourth pipe 144 .

[0120] In detail, the switching unit 19 includes a switching valve 191. The switching valve 191 includes a first switching valve 191a to a fourth switching valve 191d. The first switching valve 191a to the fourth switching valve 191d are arranged in a straight line in sequence. That is, the first switching valve 191a is adjacent to the second switching valve 191b, the second switching valve 191b is adjacent to the third switching valve 191c, and the third switching valve 191c is adjacent to the fourth switching valve 191d. Therefore, the first switching valve 191a is connected to the second switching valve 191b. Similarly, the second switching valve 191b is connected to the third switching valve 191c, and the third switching valve 191c is connected to the fourth switching valve 191d. In the present embodiment, the switching valve 191 extends straightly in a substantially horizontal posture. In the present embodiment, a multi-valve is formed by the common piping 13 and the first switching valve 191a to the fourth switching valve 191d.

[0121] The downstream end 12b of the upstream pipe 12 is connected to the first switching valve 191a. More specifically, in the present embodiment, the upstream pipe 12 includes a horizontal portion 12c extending in the horizontal direction, and one end of the horizontal portion 12c is connected to the first switching valve 191a. The first switching valve 191a is also connected to one end of the first pipe 141. The other end of the first pipe 141 is connected to the first port P1. The treatment liquid flowing through the upstream pipe 12 flows in the horizontal portion 12c in a substantially horizontal direction.

[0122] One end of the second pipe 142 is connected to the second switching valve 191b. The other end of the second pipe 142 is connected to the second port P2. One end of the third pipe 143 is connected to the third switching valve 191c. The other end of the third pipe 143 is connected to the third port P3. One end of the fourth pipe 144 is connected to the fourth switching valve 191d. The other end of the fourth pipe 144 is connected to the fourth port P4.

[0123] The control device 101 (control unit 102) controls the first switching valve 191a to the fourth switching valve 191d to switch the flow destination of the processing liquid between the first pipe 141 to the fourth pipe 144. In other words, the control device 101 (control unit 102) switches the flow destination of the processing liquid between the first port P1 to the fourth port P4. For example, when the first pipe 141 (first port P1) is selected as the flow destination of the processing liquid, the processing liquid flows into the first pipe 141 through the switching valve 191 and is guided to the first port P1 by the first pipe 141.

[0124] The first port P1, the second port P2, the third port P3, and the fourth port P4 are connected to, for example, a drain line (not shown). The drain line is laid in a factory where the substrate processing apparatus 100 is installed. It should be noted that the first port P1, the second port P2, the third port P3, and the fourth port P4 may also be connected to a drain tank (not shown) provided in the substrate processing apparatus 100 via a pipe (not shown).

[0125] The upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching unit 19 are made of resin. The upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching unit 19 transmit the near infrared rays emitted from the near infrared light source 140. The details of the near infrared light source 140 will be described later. In the present embodiment, the upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching unit 19 transmit the near infrared rays emitted from the near infrared light source 140. The upstream piping 12, the common piping 13, the plurality of downstream pipings 14, and the switching unit 19 are not particularly limited, and are formed of, for example, PFA or PTFE.

[0126] The near-infrared light source 140 emits at least near-infrared rays. The near-infrared light source 140 irradiates an area including at least a portion of the drain 190 with near-infrared rays. The near-infrared light source 140 is outside the chamber 112, and irradiates an area including at least a portion of the drain 190 with near-infrared rays. Specifically, the near-infrared light source 140 irradiates an area including at least a portion of the common pipe 13. Here, the near-infrared light source 140 emits near-infrared rays toward the entire area of ​​the common pipe 13.

[0127] For example, the near-infrared light source 140 emits at least near-infrared light having a wavelength in the range of 800 nm to 2.5 μm. Typically, the near-infrared light source 140 emits at least near-infrared light having a wavelength in the range of 800 nm to 1.5 μm. It should be noted that the near-infrared light source 140 may also emit visible light while emitting near-infrared light.

[0128] For example, the near infrared light emitted from the near infrared light source 140 travels linearly along the optical axis. Alternatively, the near infrared light emitted from the near infrared light source 140 travels while diffusing around the optical axis. The near infrared light source 140 is preferably arranged so that the optical axis of the near infrared light source 140 passes through the center of the common pipe 13.

[0129] The near-infrared imaging unit 150 has a plurality of pixels. The near-infrared imaging unit 150 has sensitivity at least to near-infrared rays. The near-infrared imaging unit 150 photographs a plurality of processing liquids in the liquid discharge unit 190 irradiated with near-infrared rays to generate photographic images. Specifically, the near-infrared imaging unit 150 photographs the inside of the liquid discharge unit 190 to generate photographic images by receiving the component of the near-infrared rays emitted from the near-infrared light source 140 that is transmitted and / or reflected from the components in the liquid discharge unit 190. Here, the near-infrared imaging unit 150 receives the component of the near-infrared rays emitted from the near-infrared light source 140 that is transmitted and / or reflected from the common pipe 13.

[0130] The near-infrared camera unit 150 captures an area including at least a portion of the drainage section 190. The near-infrared camera unit 150 is outside the chamber 112 and captures an area including at least a portion of the drainage section 190. The near-infrared camera unit 150 may capture the entire drainage section 190. Alternatively, the near-infrared camera unit 150 may capture a portion of the drainage section 190. In this case, the near-infrared camera unit 150 may switch the camera area for capturing the drainage section 190. Alternatively, the near-infrared camera unit 150 may switch the camera area between the entire drainage section 190 and a portion of the drainage section 112. The area captured by the near-infrared camera unit 150 may not be consistent with the area irradiated by the near-infrared light source 140.

[0131] In the near-infrared imaging unit 150 , the frame rate may be 30 fps or 60 fps. Alternatively, the frame rate may be 120 fps.

[0132] The near infrared imaging unit 150 may include a SWIR (Short Wavelength Infra-Red) image sensor. In this case, the near infrared imaging unit 150 detects near infrared rays having a wavelength of at least 800 nm and not more than 2.5 μm.

[0133] It should be noted that the near-infrared imaging unit 150 may have sensitivity not only to near-infrared rays but also to visible light. Alternatively, the near-infrared imaging unit 150 may switchably receive near-infrared rays and visible light.

[0134] The near-infrared imaging unit 150 captures the surroundings centered on the imaging optical axis. Typically, the imaging optical axis is located at the center of the captured image. For example, the center of the captured image of the near-infrared imaging unit 150 is located at the center of the common pipe 13. In this case, the imaging optical axis of the near-infrared imaging unit 150 is located at the center of the common pipe 13. Alternatively, the center of the captured image of the near-infrared imaging unit 150 may also be located at the upstream pipe 12.

[0135] The near-infrared imaging unit 150 generates a captured image of an area including at least a portion of the drain 190. The type of the processing liquid in the drain 190 is determined based on the captured image. For example, it is preferable to be able to determine the type of the processing liquid flowing in the common pipe 13 based on the captured image. Alternatively, it is preferable to be able to determine the type of the processing liquid flowing in the upstream pipe 12 based on the captured image.

[0136] When the substrate processing unit 110 is observed vertically from above, the optical axis of the near-infrared light source 140 and the imaging optical axis of the near-infrared imaging unit 150 pass through the drain portion 190. In addition, when the substrate processing unit 110 is observed vertically from above, the optical axis of the near-infrared light source 140 and the imaging optical axis of the near-infrared imaging unit 150 may be consistent or parallel. In addition, when the substrate processing unit 110 is observed vertically from above, the optical axis of the near-infrared light source 140 and the imaging optical axis of the near-infrared imaging unit 150 may not be parallel.

[0137] Here, the near infrared light source 140 and the near infrared imaging unit 150 are arranged near the drain 190. Specifically, the near infrared light source 140 and the near infrared imaging unit 150 are arranged near the common pipe 13. The near infrared light source 140 and the near infrared imaging unit 150 may be arranged fixed to each other.

[0138] The near-infrared light source 140 and the near-infrared camera unit 150 may also be movable relative to the discharge unit 190. For example, it is preferred that the near-infrared light source 140 and the near-infrared camera unit 150 can be moved in the horizontal direction and / or the vertical direction accompanied by a moving mechanism controlled by the control unit 102. When the near-infrared light source 140 and the near-infrared camera unit 150 move, the near-infrared light source 140 and the near-infrared camera unit 150 may also be able to move independently of each other. Alternatively, the near-infrared light source 140 and the near-infrared camera unit 150 may also be able to move as a whole.

[0139] The processing liquid may also contain organic matter. For example, among organic matter, the bonding of CH, CO, CN, CF, etc. absorbs a specific wavelength included in near-infrared rays. The absorption amount of the specific wavelength of near-infrared rays is proportional to the amount of the component having a specific bonding group, so the amount of the specific component present on the substrate W can be measured based on the near-infrared rays transmitted and / or reflected from the discharge portion 190. Therefore, the type of processing liquid flowing in the discharge portion 190 can be determined.

[0140] As described above, the control device 101 includes the control unit 102 and the storage unit 104. The control unit 102 controls the substrate holding unit 120, the processing liquid supply unit 130, the near-infrared light source 140, the near-infrared imaging unit 150, the cup 180, and / or the liquid discharge unit 190. In one example, the control unit 102 controls the electric motor 124, the valve 134a, the valve 134b, the valve 134c, the moving mechanism 1381, the moving mechanism 1382, the near-infrared light source 140, the near-infrared imaging unit 150, the cup 180, and / or the liquid discharge unit 190.

[0141] According to the substrate processing apparatus 100 of the present embodiment, the processing liquid in the chamber 112 irradiated with near-infrared light from the near-infrared light source 140 is photographed using the near-infrared imaging unit 150. Typically, the processing liquid is transparent and transmits visible light. On the other hand, the processing liquid mostly shows strong absorption in the near-infrared region. In addition, the processing liquid mostly shows unique absorption in the near-infrared region depending on the type. Therefore, the type of the processing liquid can be determined from the captured image obtained by the near-infrared imaging unit 150 photographing the processing liquid in the discharge unit 190.

[0142] It should be noted that, when the absorbance of the processing liquid to near infrared rays is quite high, it is preferable that the near infrared light source 140 emits near infrared rays as well as visible light. Thus, the captured image can show the processing liquid in the liquid discharge portion 190 with high brightness.

[0143] Alternatively, since the wavelength showing strong absorption varies depending on the processing liquid, the near-infrared light source 140 may change the wavelength of the emitted near-infrared light. This makes it possible to easily identify the outer edge and type of the processing liquid.

[0144] The substrate processing apparatus 100 of the present embodiment is suitable for manufacturing a semiconductor element provided with a semiconductor. Typically, in a semiconductor element, a conductive layer and an insulating layer are stacked on a substrate. When manufacturing a semiconductor element, the substrate processing apparatus 100 is suitable for cleaning and / or processing (e.g., etching, property change, etc.) the conductive layer and / or the insulating layer.

[0145] Next, refer to Figure 1 to Figure 3 A substrate processing apparatus 100 according to this embodiment will be described. Figure 32 is a block diagram of the substrate processing apparatus 100 .

[0146] like Figure 3 As shown, the control device 101 controls various actions of the substrate processing apparatus 100. The control device 101 controls the indexer robot IR, the central robot CR, the substrate holding part 120, the processing liquid supply part 130, the near-infrared light source 140, the near-infrared camera part 150, the cup body 180, and the liquid discharge part 190. Specifically, the control device 101 controls the indexer robot IR, the central robot CR, the substrate holding part 120, the processing liquid supply part 130, the near-infrared light source 140, the near-infrared camera part 150, the cup body 180, and the liquid discharge part 190 by sending control signals to the indexer robot IR, the central robot CR, the substrate holding part 120, the processing liquid supply part 130, the near-infrared light source 140, the near-infrared camera part 150, the cup body 180, and the liquid discharge part 190.

[0147] In addition, the storage unit 104 stores computer programs and data. The data includes process data. The process data includes information indicating a plurality of processes. The plurality of processes respectively specify the processing content, processing steps, and substrate processing conditions of the substrate W. The control unit 102 executes the computer program stored in the storage unit 104 to perform substrate processing operations.

[0148] In addition, the recipe data includes type information indicating the type of the processing liquid supplied from the nozzle 136 to the substrate W. In addition, the storage unit 104 stores in advance data associating the type of the processing liquid with the brightness or lightness of the processing liquid in the reference image.

[0149] The control unit 102 controls the indexer robot IR so that the substrate W is transferred by the indexer robot IR.

[0150] The control unit 102 controls the central robot CR to transfer the substrates W. For example, the central robot CR receives an unprocessed substrate W and carries the substrate W into one of the plurality of chambers 112. Also, the central robot CR receives a processed substrate W from the chamber 112 and carries the substrate W out.

[0151] The control unit 102 controls the substrate holding unit 120 to control the start of rotation of the substrate W, change of the rotation speed, and stop of the rotation of the substrate W. For example, the control unit 102 can control the substrate holding unit 120 to change the rotation speed of the substrate holding unit 120. Specifically, the control unit 102 can change the rotation speed of the substrate W by changing the rotation speed of the electric motor 124 of the substrate holding unit 120.

[0152] The control unit 102 can control the valve 134 of the processing liquid supply unit 130 to switch the state of the valve 134 between an open state and a closed state. Specifically, the control unit 102 can control the valve 134 of the processing liquid supply unit 130 to open the valve 134, thereby allowing the processing liquid flowing in the pipe 132 toward the nozzle 136 to pass. In addition, the control unit 102 can control the valve 134 of the processing liquid supply unit 130 to close the valve 134, thereby stopping the supply of the processing liquid flowing in the pipe 132 toward the nozzle 136.

[0153] The control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136. Specifically, the control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 above the upper surface Wt of the substrate W. In addition, the control unit 102 can control the moving mechanism 138 of the processing liquid supply unit 130 to move the nozzle 136 to a retreat position away from above the upper surface Wt of the substrate W.

[0154] The control unit 102 controls the near-infrared light source 140 and the near-infrared imaging unit 150 to capture an area including at least a portion of the discharge portion 190 and generate a captured image. The control unit 102 controls the near-infrared light source 140 to irradiate the area including at least a portion of the discharge portion 190 with near-infrared rays. In addition, the control unit 102 controls the near-infrared imaging unit 150 to capture an area including at least a portion of the discharge portion 190 and generate a captured image.

[0155] For example, the control unit 102 controls the near-infrared light source 140 and the near-infrared camera unit 150 to emit near-infrared light from the near-infrared light source 140 toward the common pipe 13, and the near-infrared camera unit 150 receives the near-infrared light transmitted or reflected from each component and measures the brightness value. It should be noted that the control unit 102 can also control the near-infrared light source 140 and the near-infrared camera unit 150 to move the near-infrared light source 140 and the near-infrared camera unit 150 relative to the common pipe 13.

[0156] In addition, the control unit 102 determines the type of the processing liquid in the discharge unit 190 based on the captured image. Specifically, the control unit 102 determines the type of the processing liquid in the captured image based on the brightness value in the captured image. The type of the processing liquid in the captured image is determined based on the brightness value in the captured image and the brightness value of the reference processing liquid stored in the storage unit 104. Alternatively, the control unit 102 determines the type of the processing liquid in the captured image based on the captured image and the reference image.

[0157] The control unit 102 may also control the cup body 180 to move the cup body 180 relative to the substrate W. Specifically, the control unit 102 raises the cup body 180 vertically upward to the side of the substrate W during the entire period in which the processing liquid supply unit 130 supplies the processing liquid to the substrate W. In addition, the control unit 102 lowers the cup body 180 from the side of the substrate W to the vertical downward when the processing liquid supply unit 130 ends supplying the processing liquid to the substrate W.

[0158] The substrate processing apparatus 100 of this embodiment is suitable for forming a semiconductor element. For example, the substrate processing apparatus 100 is suitable for processing a substrate W used as a semiconductor element of a stacked structure. The semiconductor element is a so-called 3D structure memory (storage device). As an example, the substrate W is suitable for use as a NAND flash memory.

[0159] The control unit 102 controls the drain unit 190 based on the identification result of the type of the processing liquid. For example, the control unit 102 controls the switching timing of the flow destination of the processing liquid flowing through the common pipe 13 based on the identification result of the type of the processing liquid.

[0160] Next, refer to Figure 4 An example of the structure of the switching valve 191 will be described. Figure 4 This is a diagram showing an example of the configuration of a switching valve 191 included in the substrate processing apparatus 100 according to the present embodiment.

[0161] like Figure 4 As shown, the switching valve 191 may also include the first valve core 193a to the fourth valve core 193d, the common flow path MR, and the first branch flow path BR1 to the fourth branch flow path BR4. The first valve core 193a and the first branch flow path BR1 are included in the first switching valve 191a. The second valve core 193b and the second branch flow path BR2 are included in the second switching valve 191b. The third valve core 193c and the third branch flow path BR3 are included in the third switching valve 191c. The fourth valve core 193d and the fourth branch flow path BR4 are included in the fourth switching valve 191d.

[0162] The common flow path MR extends linearly in a substantially horizontal posture. One end of the common flow path MR is open, and the other end of the common flow path MR is closed. The upstream pipe 12 is connected to one end of the common flow path MR, and the flow path R1 of the upstream pipe 12 communicates with the common flow path MR.

[0163] The first to fourth branch flow paths BR1 to BR4 are flow paths branched from the common flow path MR and communicate with the common flow path MR. The first to fourth branch flow paths BR1 to BR4 extend in a direction intersecting with the direction in which the common flow path MR extends.

[0164] One end of the first branch flow path BR1 is connected to the common flow path MR. The first pipe 141 is connected to the other end of the first branch flow path BR1, and the flow path R2a of the first pipe 141 communicates with the first branch flow path BR1.

[0165] One end of the second branch flow path BR2 is connected to the common flow path MR. The second pipe 142 is connected to the other end of the second branch flow path BR2, and the flow path R2b of the second pipe 142 communicates with the second branch flow path BR2.

[0166] One end of the third branch flow path BR3 is connected to the common flow path MR. The third pipe 143 is connected to the other end of the third branch flow path BR3, and the flow path R2c of the third pipe 143 communicates with the third branch flow path BR3.

[0167] One end of the fourth branch flow path BR4 is connected to the common flow path MR. The fourth pipe 144 is connected to the other end of the fourth branch flow path BR4, and the flow path R2d of the fourth pipe 144 communicates with the fourth branch flow path BR4.

[0168] The first valve core 193a is movable between a closed position and an open position. The closed position of the first valve core 193a indicates a position where the first valve core 193a closes one end of the first branch flow path BR1. The open position of the first valve core 193a indicates a position where the first valve core 193a opens one end of the first branch flow path BR1 to connect the first branch flow path BR1 to the common flow path MR.

[0169] When the first valve core 193a moves from the open position to the closed position, one end of the first branch flow path BR1 is closed, and the first branch flow path BR1 is not connected to the common flow path MR. Therefore, the first branch flow path BR1 is not connected to the flow path R1 of the upstream pipe 12. On the other hand, when the first valve core 193a moves from the closed position to the open position, one end of the first branch flow path BR1 is opened, and the first branch flow path BR1 is connected to the common flow path MR. That is, the first branch flow path BR1 is connected to the flow path R1 of the upstream pipe 12.

[0170] The second valve core 193b is similar to the first valve core 193a, and can move between a closed position and an open position. The closed position of the second valve core 193b indicates a position where the second valve core 193b closes one end of the second branch flow path BR2. The open position of the second valve core 193b indicates a position where the second valve core 193b opens one end of the second branch flow path BR2 to connect the second branch flow path BR2 with the common flow path MR.

[0171] When the second valve core 193b moves from the open position to the closed position, one end of the second branch flow path BR2 is closed, and the second branch flow path BR2 is disconnected from the common flow path MR. Therefore, the second branch flow path BR2 is disconnected from the flow path R1 of the upstream pipe 12. On the other hand, when the second valve core 193b moves from the closed position to the open position, one end of the second branch flow path BR2 is opened, and the second branch flow path BR2 is connected to the common flow path MR. That is, the second branch flow path BR2 is connected to the flow path R1 of the upstream pipe 12.

[0172] The third valve core 193c is movable between a closed position and an open position, similarly to the first valve core 193a and the second valve core 193b. The closed position of the third valve core 193c indicates a position where the third valve core 193c closes one end of the third branch flow path BR3. The open position of the third valve core 193c indicates a position where the third valve core 193c opens one end of the third branch flow path BR3 and connects the third branch flow path BR3 to the common flow path MR.

[0173] When the third valve core 193c moves from the open position to the closed position, one end of the third branch flow path BR3 is closed, and the third branch flow path BR3 is disconnected from the common flow path MR. Therefore, the third branch flow path BR3 is disconnected from the flow path R1 of the upstream pipe 12. On the other hand, when the third valve core 193c moves from the closed position to the open position, one end of the third branch flow path BR3 is opened, and the third branch flow path BR3 is connected to the common flow path MR. That is, the third branch flow path BR3 is connected to the flow path R1 of the upstream pipe 12.

[0174] The fourth valve core 193d is movable between a closed position and an open position, similarly to the first valve core 193a to the third valve core 193c. The closed position of the fourth valve core 193d indicates a position where the fourth valve core 193d closes one end of the fourth branch flow path BR4. The open position of the fourth valve core 193d indicates a position where the fourth valve core 193d opens one end of the fourth branch flow path BR4 and connects the fourth branch flow path BR4 to the common flow path MR.

[0175] When the fourth valve core 193d moves from the open position to the closed position, one end of the fourth branch flow path BR4 is closed, and the fourth branch flow path BR4 is disconnected from the common flow path MR. Therefore, the fourth branch flow path BR4 is disconnected from the flow path R1 of the upstream pipe 12. On the other hand, when the fourth valve core 193d moves from the closed position to the open position, one end of the fourth branch flow path BR4 is opened, and the fourth branch flow path BR4 is connected to the common flow path MR. That is, the fourth branch flow path BR4 is connected to the flow path R1 of the upstream pipe 12.

[0176] Figure 4The switching valve 191 is exemplified in which the first valve element 193a is located at the open position and the second to fourth valve elements 193b to 193d are located at the closed position. In this case, the first pipe 141 becomes the flow destination of the processing liquid (waste liquid) flowing through the common pipe 13.

[0177] Next, refer to Figure 5 A substrate processing apparatus 100 according to this embodiment will be described. Figure 5 1 is a block diagram showing the configuration of a control device 101 and a switching unit 19 included in the substrate processing apparatus 100 according to the present embodiment.

[0178] like Figure 5 As shown, the switching valve 191 further includes first to fourth valve driving units 192a to 192d. The first valve driving unit 192a is included in the first switching valve 191a. Similarly, the second to fourth valve driving units 192b to 192d are included in the second to fourth switching valves 191b to 191d, respectively.

[0179] The first valve driving unit 192a is controlled by the control device 101 (control unit 102) to move the first valve body 193a between the closed position and the open position. The first valve driving unit 192a may include, for example, a motor as a power source for the first valve body 193a.

[0180] Similarly, the second valve drive unit 192b is controlled by the control device 101 (control unit 102) to move the second valve core 193b between the closed position and the open position. The third valve drive unit 192c is controlled by the control device 101 (control unit 102) to move the third valve core 193c between the closed position and the open position. The fourth valve drive unit 192d is controlled by the control device 101 (control unit 102) to move the fourth valve core 193d between the closed position and the open position. The second valve drive unit 192b to the fourth valve drive unit 192d can include, for example, motors as power sources for the second valve core 193b to the fourth valve core 193d.

[0181] Next, refer to Figure 1 to Figure 6 A substrate processing method according to this embodiment will be described. Figure 6 It is a flow chart of the substrate processing method. It should be noted that step SB is an example of the "step of holding the substrate" of the present invention.

[0182] like Figure 6 As shown, in step SA, the substrate W is carried into the substrate processing apparatus 100. Specifically, the substrate W is carried into the chamber 112 of the substrate processing unit 110 by the indexer robot IR and the central robot CR.

[0183] In step SB, the substrate W is held. Specifically, the substrate holding unit 120 holds the substrate W in the chamber. When the substrate W is carried into the chamber 112 , the substrate W is held by the substrate holding unit 120 .

[0184] In step SC, the substrate W is processed. The substrate W is processed in the substrate processing unit 110. Typically, the substrate holding unit 120 rotates while holding the substrate W, and the processing liquid supply unit 130 supplies the processing liquid to the substrate W.

[0185] In the present embodiment, the near-infrared light source 140 emits near-infrared rays. The region including at least a portion of the liquid discharge portion 190 is irradiated with the near-infrared rays emitted from the near-infrared light source 140. For example, the common pipe 13 is irradiated with the near-infrared rays emitted from the near-infrared light source 140. The near-infrared imaging section 150 photographs the region including at least a portion of the liquid discharge portion 190 irradiated with the near-infrared rays. For example, the near-infrared imaging section 150 photographs the common pipe 13 irradiated with the near-infrared rays. By photographing the region including at least a portion of the liquid discharge portion 190 irradiated with the near-infrared rays from the near-infrared imaging section 150, even if the processing liquid in the liquid discharge portion 190 is substantially transparent, the processing liquid can be photographed with high precision.

[0186] In step SD, the substrate W is released from holding. Specifically, the substrate holding unit 120 releases the substrate W from holding.

[0187] In step SE, the substrate W is unloaded. The substrate W is unloaded from the substrate processing apparatus 100. Specifically, the substrate W is unloaded from the chamber 112 of the substrate processing unit 110 by the central robot CR and the indexer robot IR.

[0188] According to the present embodiment, the processing liquid irradiated with near infrared light from the near infrared light source 140 is photographed by the near infrared imaging unit 150. In many cases, the processing liquid shows a unique absorption in the near infrared region depending on the type. Therefore, the type of the processing liquid can be determined from the image obtained by the near infrared imaging unit 150 photographing the processing liquid in the drain 190.

[0189] Next, refer to Figures 1 to 11 A substrate processing step in the substrate processing method according to the present embodiment will be described. Figure 7 and Figure 8 It is a flowchart of a substrate processing step in the substrate processing method according to the present embodiment. Figures 9 to 11 1 is a diagram showing an example of the configuration of a switching valve 191 included in the substrate processing apparatus 100 according to the present embodiment.

[0190] exist Figure 7 and Figure 8, step S120 is an example of the "process of utilizing near-infrared irradiation", "process of generating captured images" and "process of changing near-infrared light source" of the present invention. Step S125 is an example of the "process of obtaining type information" of the present invention. Step S130, step S160 and step S210 are an example of the "process of supplying a plurality of treatment liquids at different timings" of the present invention. Step S140, step S170 and step S220 are an example of the "process of discharging liquid" of the present invention. Step S180 and step S230 are an example of the "process of determining the type of treatment liquid" of the present invention. Step S250 is an example of the "process of controlling the liquid discharge portion" of the present invention.

[0191] exist Fig. 9 In FIG. 1 , the area AR1 indicates an area where the near-infrared light source 140 irradiates near-infrared rays. The area AR2 indicates an area where the near-infrared imaging unit 150 captures images. In the present embodiment, the area AR1 coincides with the area AR2.

[0192] like Figure 7 As shown, in step S110, the substrate W is rotated while being held. Specifically, the substrate holding unit 120 rotates the substrate W while holding the substrate W. For example, the rotation speed of the substrate W is 10 rpm to 1500 rpm. The process proceeds to step S120.

[0193] In step S120, the near-infrared light source 140 irradiates the region including at least a portion of the liquid discharge portion 190 with near-infrared rays, and the near-infrared imaging unit 150 captures the region including at least a portion of the liquid discharge portion 190 irradiated with near-infrared rays. The near-infrared light source 140 irradiates the region including at least a portion of the liquid discharge portion 190 with near-infrared rays, and the near-infrared imaging unit 150 captures the region including at least a portion of the liquid discharge portion 190 irradiated with near-infrared rays to generate a captured image. The control unit 102 controls the near-infrared light source 140 and the near-infrared imaging unit 150 to emit near-infrared rays from the near-infrared light source 140 toward the region including at least a portion of the liquid discharge portion 190, and to capture the region including at least a portion of the liquid discharge portion 190 through the near-infrared imaging unit 150. It should be noted that the timing at which the near-infrared light source 140 starts emitting near-infrared rays and the timing at which the near-infrared imaging unit 150 starts capturing the substrate W may be the same as or different from each other. The timing at which the near-infrared light source 140 starts emitting near-infrared rays may be earlier or later than the timing at which the near-infrared imaging unit 150 starts imaging the substrate W. The process proceeds to step S125.

[0194] In step S125, type information indicating the type of the processing liquid is obtained. Specifically, the control unit 102 obtains type information indicating the type of the processing liquid from the process data stored in the storage unit 104. In the present embodiment, the types of the processing liquid are, for example, SC1 (aqueous solution of hydrogen peroxide), DIW, and IPA. In addition, the control unit 102 obtains data that associates the type of the processing liquid with the brightness or lightness of the processing liquid in the reference image from the process data stored in the storage unit 104. The process proceeds to step S130.

[0195] In step S130, the first processing liquid La is supplied to the upper surface Wt of the substrate W. Specifically, the first processing liquid supply unit 130a starts supplying the first processing liquid La to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the first processing liquid supply unit 130a to start supplying the first processing liquid La to the upper surface Wt of the substrate W. The first processing liquid La is, for example, SC1. The process proceeds to step S140.

[0196] It should be noted that the supply of the processing liquid in step S130 may be started before the irradiation of the near infrared rays in step S120 and / or the imaging by the near infrared imaging unit 150 , or may be started after the imaging.

[0197] In step S140, the drain unit 190 discharges the processing liquid after the substrate is processed to the outside of the chamber 112. Here, the drain unit 190 discharges the first processing liquid La after the substrate is processed to the outside of the chamber 112. Fig. 9 As shown, in the switching valve 191, the first valve core 193a is located in the open position, and the second valve core 193b to the fourth valve core 193d are located in the closed position. In this case, the first pipe 141 becomes the flow destination of the first processing liquid La flowing in the common pipe 13. Therefore, the first processing liquid La after the substrate processing flows in the upstream pipe 12, flows in the common pipe 13, and then flows in the first pipe 141. It should be noted that the first valve core 193a can be driven in the open position and the second valve core 193b to the fourth valve core 193d can be driven in the closed position at the timing of step S140. If the first valve core 193a is in the open position and the second valve core 193b to the fourth valve core 193d are in the closed position in advance, this state can also be maintained. The process enters step S150.

[0198] In step S150, the supply of the first processing liquid La is stopped. Specifically, the first processing liquid supply unit 130a stops the supply of the first processing liquid La with respect to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the first processing liquid supply unit 130a to stop the supply of the first processing liquid La after a prescribed period has elapsed after the supply of the first processing liquid La is started. The prescribed period is, for example, 30 seconds. The prescribed period, i.e., the time from the start of the supply of the first processing liquid La to the stop of the supply of the first processing liquid La, is specified according to the process represented by the process data stored in the storage unit 104. The process proceeds to step S160.

[0199] In step S160, the rinse liquid Lb is supplied to the upper surface Wt of the substrate W. In detail, the rinse liquid supply unit 130c starts supplying the rinse liquid Lb to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the rinse liquid supply unit 130c to start supplying the rinse liquid Lb to the upper surface Wt of the substrate W. By supplying the rinse liquid Lb to the upper surface Wt of the substrate W, the first processing liquid La covering the upper surface Wt of the substrate W is replaced with the rinse liquid Lb. The rinse liquid Lb is, for example, DIW. The process proceeds to step S170.

[0200] In step S170, the drain unit 190 discharges the processing liquid after the substrate is processed to the outside of the chamber 112. Here, the drain unit 190 discharges the rinse liquid Lb after the substrate is processed to the outside of the chamber 112. Fig.10 As shown, in the switching valve 191, the first valve core 193a is located in the open position, and the second valve core 193b to the fourth valve core 193d are located in the closed position. In this case, the first pipe 141 becomes the flow destination of the rinse liquid Lb flowing in the common pipe 13. Therefore, the rinse liquid Lb after the substrate processing flows in the upstream pipe 12, flows in the common pipe 13, and then flows in the first pipe 141 of the downstream pipe 14. The first processing liquid La flowing in the discharge part 190 is gradually diluted by the rinse liquid Lb. In other words, with the passage of time, the proportion of the first processing liquid La decreases and the proportion of the rinse liquid Lb increases. It should be noted that the first valve core 193a may be driven in an open position and the second valve core 193b to the fourth valve core 193d may be driven in a closed position at the timing of step S170, and if the first valve core 193a is driven in an open position and the second valve core 193b to the fourth valve core 193d are driven in a closed position, the state may be maintained. The process proceeds to step S180.

[0201] In step S180, the type of the processing liquid in the captured image is determined based on the captured image generated by the near-infrared imaging unit 150. The control unit 102 determines the type of the processing liquid in the captured image based on the captured image. In the present embodiment, the control unit 102 determines the type of the processing liquid in the common pipe 13 based on the captured image. It should be noted that the control unit 102 may also determine the type of the processing liquid in the upstream pipe 12 based on the captured image.

[0202] More specifically, the control unit 102 determines the type of the processing liquid in the captured image based on the brightness value or brightness in the captured image generated by the near-infrared imaging unit 150. Alternatively, the control unit 102 determines the type of the processing liquid in the captured image based on the brightness value or brightness in the captured image and the brightness value or brightness of the reference processing liquid stored in the storage unit 104. Alternatively, the control unit 102 determines the type of the processing liquid in the captured image based on the captured image and the reference image.

[0203] In addition, the control unit 102 determines the position of the rinse liquid Lb (treatment liquid) in the captured image based on the brightness value or brightness and type information in the captured image. In addition, the control unit 102 identifies the area where the first treatment liquid La is located and the area where the rinse liquid Lb is located in a specified area of ​​the captured image (for example, the area corresponding to the common piping 13) based on the brightness value or brightness in the captured image and the brightness value or brightness and type information of the reference treatment liquid stored in the storage unit 104. In addition, for example, the control unit 102 may also calculate the ratio of the number of pixels having the brightness value or brightness corresponding to the first treatment liquid La to the total number of pixels in the specified area in the specified area (for example, the area corresponding to the common piping 13). It should be noted that the control unit 102 may also calculate the total brightness value or brightness of all pixels in the specified area.

[0204] For example, when the area where the flushing liquid Lb is located is greater than a specified value (e.g., 99%) of a specified area of ​​the captured image (e.g., an area corresponding to the common pipe 13), the control unit 102 determines the type of the processing liquid as the flushing liquid Lb. In addition, for example, when the calculated above ratio is greater than a specified value (e.g., 99%), the control unit 102 determines the type of the processing liquid as the flushing liquid Lb. It should be noted that the control unit 102 may also determine the type of the processing liquid as the flushing liquid Lb when the calculated above total is greater than a specified value.

[0205] In step S190, the control unit 102 determines whether the type of the determined processing liquid is the rinse liquid Lb. In the case where the control unit 102 determines that the type of the determined processing liquid is not the rinse liquid Lb (the determination in step S190 is No), the process returns to step S180. Thus, the determination of the type of the processing liquid and the determination of whether the type of the determined processing liquid is the rinse liquid Lb are repeated until the processing liquid flowing in the discharge unit 190 is replaced from the first processing liquid La to the rinse liquid Lb. On the other hand, in the case where the control unit 102 determines that the type of the determined processing liquid is the rinse liquid Lb (the determination in step S190 is Yes), the process proceeds to step S190.

[0206] In step S200, the supply of the rinsing liquid Lb is stopped. In detail, the rinsing liquid supply unit 130c stops supplying the rinsing liquid Lb to the upper surface Wt of the substrate W. In more detail, the control unit 102 controls the rinsing liquid supply unit 130c (the processing liquid supply unit 130) based on the result of determining the type of the processing liquid to stop the supply of the rinsing liquid Lb. Specifically, when the control unit 102 determines that the determined type of processing liquid is the rinsing liquid Lb (yes in step S190), the control unit 102 controls the rinsing liquid supply unit 130c (the processing liquid supply unit 130) to stop the supply of the rinsing liquid Lb. Therefore, the supply of the rinsing liquid Lb can be stopped after the processing liquid flowing in the discharge unit 190 is fully replaced from the first processing liquid La to the rinsing liquid Lb. Therefore, the supply stop of the rinsing liquid Lb can be performed at an appropriate timing. As a result, the usage of the rinsing liquid Lb can be suppressed. The process proceeds to Figure 8 Step S210 is shown.

[0207] like Figure 8 As shown, in step S210, the second processing liquid Lc is supplied to the upper surface Wt of the substrate W. Specifically, the second processing liquid supply unit 130b starts supplying the second processing liquid Lc to the upper surface Wt of the substrate W. Here, the supply of the second processing liquid Lc starts with stopping the supply of the rinse liquid Lb to the substrate W. The second processing liquid Lc is, for example, isopropyl alcohol (IPA). The process proceeds to step S220.

[0208] In step S220, the drain unit 190 discharges the processing liquid after the substrate is processed to the outside of the chamber 112. Here, the drain unit 190 discharges the second processing liquid Lc after the substrate is processed to the outside of the chamber 112. Fig.10 As shown, in the switching valve 191, the first valve core 193a is in the open position, and the second valve core 193b to the fourth valve core 193d are in the closed position. As for the processing liquid flowing in the discharge part 190, as time passes, the proportion of the rinse liquid Lb decreases and the proportion of the second processing liquid Lc increases. The process proceeds to step S230.

[0209] In step S230, the type of the processing liquid in the captured image is determined based on the captured image generated by the near-infrared imaging unit 150. The control unit 102 determines the type of the processing liquid in the captured image based on the captured image. For example, the control unit 102 determines the type of the processing liquid in the captured image based on the captured image.

[0210] In addition, the control unit 102 determines the type of the processing liquid in the captured image based on the brightness value in the captured image. The type of the processing liquid in the captured image is determined based on the brightness value in the captured image and the brightness value of the reference processing liquid stored in the storage unit 104. Alternatively, the control unit 102 determines the type of the processing liquid in the captured image based on the captured image and the reference image.

[0211] In step S240, the control unit 102 determines whether the type of the determined treatment liquid is the second treatment liquid Lc. In the case where the control unit 102 determines that the type of the determined treatment liquid is not the second treatment liquid Lc (the determination is No in step S240), the process returns to step S230. Thus, the determination of the type of the treatment liquid and the determination of whether the type of the determined treatment liquid is the second treatment liquid Lc are repeated until the treatment liquid flowing in the discharge unit 190 is replaced from the rinse liquid Lb to the second treatment liquid Lc. On the other hand, in the case where the control unit 102 determines that the type of the determined treatment liquid is the second treatment liquid Lc (the determination is Yes in step S240), the process proceeds to step S250.

[0212] In step S250, the control unit 102 controls the drain unit 190 based on the result of determining the type of the processing liquid. Specifically, the control unit 102 switches the flow destination of the processing liquid flowing through the common pipe 13 between the plurality of downstream pipes 14. More specifically, when the control unit 102 determines in step S240 that the type of the determined processing liquid is the second processing liquid Lc (the determination in step S240 is yes), the control unit 102 controls the switching valve 191 to switch from the common pipe 13 to the downstream pipe 14. Fig.10 In the switching valve 191, the first valve body 193a is in the open position, and the second valve body 193b to the fourth valve body 193d are in the closed position. Fig.11 As shown in the figure, in the switching valve 191, the second valve core 193b is in the open position, and the first valve core 193a, the second valve core 193b, and the fourth valve core 193d are in the closed position. As a result, the flow destination of the processing liquid flowing in the common pipe 13 is switched from the first pipe 141 to the second pipe 142. Therefore, the second processing liquid Lc after the substrate processing flows through the upstream pipe 12, flows through the common pipe 13, and then flows through the second pipe 142. The process proceeds to step S260.

[0213] In step S260, the drain unit 190 drains the processing liquid after the substrate processing to the outside of the chamber 112. Here, the drain unit 190 discharges the second processing liquid Lc after the substrate processing to the outside of the chamber 112. In step S250, the flow destination of the processing liquid flowing in the common pipe 13 is switched from the first pipe 141 to the second pipe 142. Therefore, the second processing liquid Lc is discharged through the second pipe 142.

[0214] In step S270, the supply of the second processing liquid Lc is stopped. Specifically, the second processing liquid supply unit 130b stops the supply of the second processing liquid Lc with respect to the upper surface Wt of the substrate W. Specifically, the control unit 102 controls the second processing liquid supply unit 130b to stop the supply of the second processing liquid Lc after a prescribed period has passed since the start of the supply of the second processing liquid Lc. The prescribed period is, for example, 4 seconds. The prescribed period, i.e., the time from the start of the supply of the second processing liquid Lc to the stop of the supply of the second processing liquid Lc, is specified by the process represented by the process data stored in the storage unit 104. The process proceeds to step S280.

[0215] In step S280 , the rotation of the substrate W is stopped. Specifically, the control unit 102 controls the substrate holding unit 120 so that the substrate holding unit 120 stops the rotation of the substrate W. The process ends.

[0216] In the present embodiment, an area including at least a portion of the liquid discharge section 190 is photographed by near infrared ray irradiation from the near infrared camera section 150. The near infrared ray is selectively absorbed by the treatment liquid. Therefore, the treatment liquid in the liquid discharge section 190 can be photographed with high precision. Therefore, the type of the treatment liquid in the liquid discharge section 190 can be determined. As a result, the control section 102 can control the treatment of the liquid discharge section 190 according to the type of the treatment liquid in the liquid discharge section 190.

[0217] As described above, the near-infrared light source 140 may switch between emitting visible light and near-infrared light. In addition, the near-infrared imaging unit 150 may switch between the visible region and the near-infrared region for imaging.

[0218] In this embodiment, as described above, the control unit 102 specifies the type of processing liquid in the region including at least a portion of the liquid discharge unit 190 based on the captured image. Therefore, for example, it is possible to confirm whether the processing liquid in the liquid discharge unit 190 has been switched.

[0219] In addition, in the present embodiment, after the control unit 102 determines that the type of the determined processing liquid is the second processing liquid Lc (for example, IPA) (in step S240, it is determined to be yes), the control unit 102 controls the drain unit 190 (step S250). Specifically, for example, after the processing liquid in the drain unit 190 is fully replaced with the second processing liquid Lc, the flow destination of the processing liquid flowing through the common pipe 13 can be switched between the downstream pipes 14. Therefore, the mixing of the processing liquid in the downstream pipe 14 can be suppressed. For example, in the downstream pipe 14, the mixing of the first processing liquid La (for example, SC1) and the second processing liquid Lc (for example, IPA) can be suppressed.

[0220] In addition, usually, the time from the start of supplying the rinsing liquid (step S160) to the stop of supplying the rinsing liquid (step S200) is preset. Usually, it is preferred to continuously supply the rinsing liquid Lb to the substrate W from the rinsing liquid supply section 130c until the processing liquid flowing in the drainage section 190 is fully replaced by the rinsing liquid. In addition, usually, the time required for the processing liquid in the drainage section 190 to be fully replaced by the rinsing liquid varies due to differences in temperature, etc. Therefore, the time from the start of supplying the rinsing liquid Lb to the substrate W to the stop of supplying the rinsing liquid Lb to the substrate W is set to be longer. In the present embodiment, a supply setting time representing the time from the start of supplying the rinsing liquid Lb to the substrate W to the stop of supplying the rinsing liquid to the substrate W is also set in the process. Hereinafter, in the specification of this application, “the time from the start of supplying the rinsing liquid Lb to the substrate W to the stop of supplying the rinsing liquid to the substrate W” is sometimes referred to as “rinsing liquid supply period”. Also, hereafter, in the specification of this application, “the set time from the start of supplying the rinsing liquid Lb to the substrate W to the stop of supplying the rinsing liquid to the substrate W” is sometimes referred to as “rinsing liquid supply set time”.

[0221] In this embodiment, in step S190, when the control unit 102 determines that the type of the determined processing liquid is the rinse liquid Lb, the process proceeds to step S200 regardless of whether the rinse liquid supply setting time has passed. In this case, for example, the control unit 102 rewrites the process in accordance with the timing corresponding to the determination that the type of the determined processing liquid is the rinse liquid Lb, so as to shorten the rinse liquid supply setting time (for example, 15 seconds). It should be noted that, for example, the control unit 102 may also rewrite the process in accordance with the timing corresponding to the determination that the type of the determined processing liquid is the rinse liquid Lb, so as to increase the rinse liquid supply setting time (for example, 15 seconds).

[0222] In this way, since it is possible to confirm whether the processing liquid in the discharge section 190 has been switched, the supply of the processing liquid (for example, the rinse liquid Lb) of the processing liquid supply section 130 is stopped at the timing when it is determined that the processing liquid in the discharge section 190 has been switched, regardless of whether the rinse liquid supply setting time has passed, thereby shortening the substrate processing time. In addition, since the amount of rinse liquid Lb used can be reduced, the environmental load can be reduced. In addition, the amount of processing liquid after substrate processing, that is, the amount discharged, can be reduced by shortening the substrate processing time. If the amount discharged increases, the burden on the factory increases. According to this embodiment, the amount of discharge can be reduced to reduce the burden on the factory.

[0223] As described above, the processing liquid supply unit 130 supplies a plurality of processing liquids at different timings to the substrate W. When a plurality of processing liquids are supplied to the substrate W at different timings, that is, when the liquid discharge unit 190 discharges a plurality of processing liquids, the present invention is particularly effective.

[0224] As described above, the control unit 102 controls the processing liquid supply unit 130 based on the identification result of the processing liquid type. Therefore, the flow destination of the processing liquid flowing through the liquid discharge unit 190 can be easily switched according to the state of the processing liquid in the liquid discharge unit 190.

[0225] In addition, as described above, the drain section 190 includes the upstream pipe 12, the common pipe 13, and the downstream pipe 14. The upstream pipe 12 is used to circulate multiple types of processing liquids discharged from the chamber 112. The common pipe 13 is connected to the downstream end 12b of the upstream pipe 12. The downstream pipe 14 is connected to the upstream end 14a of the common pipe 13. In this way, when multiple types of processing liquids circulate in the upstream pipe 12, it is particularly effective to apply the present invention to determine the type of processing liquid.

[0226] In addition, as described above, the control unit 102 determines the type of the processing liquid in the area including the common pipe 13 based on the captured image. Therefore, it is easy to confirm the status of the processing liquid in the common pipe 13. For example, it is easy to confirm whether the processing liquid in the common pipe 13 has been switched. In other words, it is easy to confirm whether the processing liquid in the drain unit 190 has been switched.

[0227] In addition, as described above, the liquid discharge unit 190 includes the switching unit 19. The switching unit 19 switches the flow destination of the processing liquid flowing through the common pipe 13 between the plurality of downstream pipes 14. Therefore, the processing liquid can be divided and discharged to different downstream pipes 14. As a result, the mixing of the processing liquid in the downstream pipe 14 can be suppressed. For example, in the downstream pipe 14, the mixing of the first processing liquid La (e.g., SC1) and the second processing liquid Lc (e.g., IPA) can be suppressed.

[0228] In addition, as described above, the control unit 102 can also determine the type of the processing liquid in the area including the upstream pipe 12 based on the captured image. Therefore, it is easy to confirm the status of the processing liquid in the upstream pipe 12. For example, it is easy to confirm whether the processing liquid in the upstream pipe 12 has been switched. In other words, it is easy to confirm whether the processing liquid in the drain unit 190 has been switched.

[0229] It should be noted that, in reference Figures 9 to 11 In the example described above, the region AR1 irradiated with near infrared rays is a region including at least a portion of the common pipe 13 , but the present invention is not limited thereto. For example, the region AR1 irradiated with near infrared rays may be a region including at least a portion of the upstream pipe 12 .

[0230] In addition, in reference Figures 9 to 11 In the example described above, the area AR2 captured by the near infrared imaging unit 150 includes at least a portion of the common pipe 13 , but the present invention is not limited thereto. For example, the area AR2 captured by the near infrared imaging unit 150 may include at least a portion of the upstream pipe 12 .

[0231] Fig.12 1 is a diagram showing an example of the structure of the switching valve 191 included in the substrate processing apparatus 100 of the present embodiment. Fig.12 In FIG. 1 , area AR1 indicates an area where near-infrared light source 140 irradiates near-infrared rays. Area AR2 indicates an area captured by near-infrared imaging unit 150. Fig.12 As shown, the area AR1 irradiated with near infrared rays is an area including at least a part of the upstream pipe 12. The area AR2 imaged by the near infrared imaging unit 150 is an area including at least a part of the upstream pipe 12.

[0232] In this embodiment, the area AR1 and the area AR2 coincide with each other. It is preferable that the area AR1 and the area AR2 are provided on the downstream end 12b side of the upstream pipe 12 (see Figure 2 ). In other words, it is preferable that the area AR1 and the area AR2 are disposed near the common pipe 13. By disposing the area AR1 and the area AR2 near the common pipe 13, it is possible to shorten the time for the processing liquid in the area AR1 and the processing liquid in the area AR2 to reach the common pipe 13. Therefore, it is possible to suppress the mixing of the undesired processing liquid into the common pipe 13.

[0233] In the present embodiment, the near-infrared light source 140 irradiates the area AR1 including at least a portion of the upstream pipe 12 with near-infrared rays. The near-infrared imaging unit 150 captures a plurality of processing liquids in the upstream pipe 12 irradiated with near-infrared rays to generate a captured image. The control unit 102 determines the type of processing liquid in the upstream pipe 12 based on the captured image. Therefore, it is possible to confirm whether the processing liquid in the upstream pipe 12 has been switched.

[0234] It should be noted that the area AR1 irradiated with near-infrared rays may include an area AR1 including at least a portion of the common pipe 13 and an area AR1 including at least a portion of the upstream pipe 12. In addition, the area AR2 photographed by the near-infrared imaging unit 150 may include an area AR1 including at least a portion of the common pipe 13 and an area AR1 including at least a portion of the upstream pipe 12.

[0235] Next, refer to Fig.13 An example in which a plurality of near-infrared light sources 140 are provided will be described. Here, an example in which the near-infrared light source 140 includes a near-infrared light source 140a and a near-infrared light source 140b will be described. Fig.13 1 is a schematic diagram of a substrate processing unit 110 in a substrate processing apparatus 100 including a plurality of near-infrared light sources 140 (near-infrared light sources 140 a and near-infrared light sources 140 b ). Fig.13 The substrate processing unit 110 shown in FIG. 1 has the following features in addition to the plurality of near-infrared light sources 140. Figure 2 The substrate processing units 110 shown have the same structure, and repeated descriptions are omitted to avoid redundancy.

[0236] like Fig.13 As shown, the near infrared light source 140 includes a near infrared light source 140a and a near infrared light source 140b. The near infrared light source 140a and the near infrared light source 140b emit near infrared rays having mutually different peak wavelengths.

[0237] The control unit 102 acquires the process data from the storage unit 104, and acquires type information indicating the type of the process liquid supplied to the substrate W by the process liquid supply unit 130 (the first process liquid supply unit 130a, the second process liquid supply unit 130b, and the rinse liquid supply unit 130c) from the process data. In addition, for example, the process data may also include information indicating the type of the near-infrared light source 140 corresponding to the type of the process liquid. In addition, for example, the control unit 102 acquires type information indicating the type of the process liquid supplied by the process liquid supply unit 130 (the first process liquid supply unit 130a, the second process liquid supply unit 130b, and the rinse liquid supply unit 130c) from input information input by the user.

[0238] The control unit 102 changes the near-infrared light source 140 that irradiates the area including at least a part of the liquid discharge unit 190 based on the acquired type information. For example, the control unit 102 irradiates the area with the near-infrared light source 140a when the rinse liquid supply unit 130c supplies DIW to the substrate W, that is, when the liquid discharge unit 190 discharges DIW. On the other hand, the control unit 102 irradiates the area with the near-infrared light source 140b when the second processing liquid supply unit 130b supplies IPA to the substrate W, that is, when the liquid discharge unit 190 discharges IPA.

[0239] Reference Figure 7 , Fig.13 and Fig.14 A substrate processing step in the substrate processing method when a plurality of near-infrared light sources 140 are provided will be described. Fig.14 It is a flowchart of a substrate processing step in the substrate processing method according to the present embodiment. Fig.14 The flowchart is similar to Figure 8 The flowchart is the same as that of , and repeated description is omitted to avoid redundancy. It should be noted that step S205 in the example where a plurality of near-infrared light sources 140 are provided is an example of the "step of changing near-infrared light" of the present invention.

[0240] like Figure 7 As shown, the processing of steps S110 to S200 is performed. In this embodiment, after the processing of step S200 is completed, the processing proceeds to Fig.14 Step S205 shown.

[0241] like Fig.14 As shown, in step S205, the control unit 102 changes the near-infrared light source 140 that irradiates the area including at least a part of the discharge portion 190 based on the type information. Specifically, the control unit 102 changes the near-infrared light source 140 that irradiates the area including at least a part of the discharge portion 190 from the near-infrared light source 140a to the near-infrared light source 140b based on the type information. The process proceeds to step S210.

[0242] Steps S220 to S280 and Figure 8 Steps S220 to S280 shown are the same.

[0243] In the present embodiment, as described above, the control unit 102 acquires the type information indicating the type of the processing liquid, and based on the acquired type information, changes the near-infrared light source 140 that irradiates the region including at least a portion of the liquid discharge unit 190. Therefore, since the near-infrared light to be irradiated can be changed according to the absorbance (also referred to as absorbance) of the processing liquid, the type of the processing liquid can be more accurately determined even when the type of the processing liquid is changed.

[0244] Specifically, the absorbance of the treatment liquid varies depending on the type of the treatment liquid. Therefore, for example, by irradiating the second treatment liquid with light of a wavelength having a high absorbance and photographing the treatment liquid, the contrast between the brightness value or brightness of the area representing the second treatment liquid and the area other than the second treatment liquid in the photographed image can be increased. Thus, the type of the treatment liquid can be determined more accurately based on the photographed image.

[0245] Other effects and uses of the example in which a plurality of near-infrared light sources 140 are provided Figures 1 to 12 The effects of the substrate processing apparatus 100 described above are the same.

[0246] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above-mentioned embodiments and can be implemented in various ways without departing from the scope of its main purpose. In addition, a plurality of constituent elements disclosed in the above-mentioned embodiments can be appropriately combined to form a variety of inventions. For example, some constituent elements can also be deleted from all the constituent elements shown in the embodiments. In addition, the constituent elements in different embodiments can also be appropriately combined. For ease of understanding, the accompanying drawings mainly schematically illustrate the constituent elements, and for ease of drawing, the thickness, length, number, spacing, etc. of the constituent elements illustrated are sometimes different from the actual ones. In addition, the material, shape, size, etc. of the constituent elements shown in the above-mentioned embodiments are examples, and are not particularly limited, and can be subjected to various changes within the scope of the effects of the present invention.

[0247] For example, in the above-mentioned embodiment, an example of applying the present invention in a substrate processing step to shorten the substrate processing time is shown, but the present invention is not limited to this. For example, the present invention can also be applied when setting the rinse liquid supply setting time (for example, 10 seconds) (when creating a process). In this case, the process creation time can be shortened. In addition, as in the above-mentioned embodiment, since the amount of rinse liquid Lb used can be reduced, the environmental burden can be reduced.

[0248] In addition, in the above embodiment, an example is shown in which the liquid discharge unit 190 includes the switching unit 19 , but the present invention is not limited thereto. For example, the liquid discharge unit 190 may not include the switching unit 19 .

[0249] Industrial Applicability

[0250] The present invention can be applied to the field of substrate processing equipment.

Claims

1. A substrate processing device, characterized in that: include: Chamber; a substrate holding portion for holding a substrate, which is accommodated in the chamber; a processing liquid supply unit for supplying a plurality of processing liquids to the substrate at different timings; a liquid discharge portion for discharging the plurality of treatment liquids out of the chamber; at least one near-infrared light source for irradiating a region including at least a portion of the liquid discharge portion with near-infrared rays; a near-infrared imaging unit that captures the plurality of treatment liquids in the liquid discharge unit irradiated with the near-infrared rays and generates a captured image; as well as a control unit, which controls the near-infrared imaging unit, The control section specifies the type of the processing liquid in the liquid discharge section based on the captured image.

2. The substrate processing device according to claim 1, characterized in that: The control section controls the liquid discharge section based on a result of determining the kind of the processing liquid.

3. The substrate processing device according to claim 1 or 2, characterized in that: The liquid discharge portion comprises: an upstream pipe for allowing the plurality of processing liquids discharged from the chamber to flow; a common pipe to which the downstream end of the upstream pipe is connected; and The upstream ends of the plurality of downstream pipes are connected to the common pipe.

4. The substrate processing device according to claim 3, characterized in that: The liquid discharge unit further includes a switching unit that switches a flow destination of the processing liquid flowing through the common pipe between the plurality of downstream pipes.

5. The substrate processing device according to claim 3, characterized in that: The near-infrared light source irradiates a region including at least a portion of the upstream pipe with the near-infrared rays. The near infrared imaging unit captures images of the plurality of processing liquids in the upstream pipe irradiated with the near infrared rays and generates the captured images. The control unit specifies the type of the processing liquid in the upstream pipe based on the captured image.

6. The substrate processing device according to claim 3, characterized in that: The near-infrared light source irradiates a region including at least a portion of the common pipe with the near-infrared rays. The near infrared imaging unit captures images of the plurality of processing liquids in the common pipe irradiated with the near infrared rays to generate the captured images. The control unit specifies the type of the processing liquid in the common pipe based on the captured image.

7. The substrate processing device according to claim 4, characterized in that: The control unit controls a switching timing for switching a flow destination of the process liquid flowing through the common pipe based on a result of identifying the type of the process liquid.

8. The substrate processing device according to claim 1 or 2, characterized in that: The at least one near-infrared light source is multiple, The plurality of near-infrared light sources emit near-infrared rays having different peak wavelengths from each other. The control unit acquires type information indicating the type of the processing liquid. The control unit changes the near-infrared light source that irradiates a region including at least a part of the liquid discharge unit based on the type information.

9. The substrate processing device according to claim 1 or 2, characterized in that: The control section controls the processing liquid supply section based on a result of determining the kind of the processing liquid.

10. A substrate processing method, characterized in that: Include: a step of holding a substrate in a chamber; a step of supplying a plurality of processing liquids to the substrate at different timings; The process of discharging the plurality of processing liquids out of the chamber by the liquid discharge unit; a step of irradiating a region including at least a portion of the liquid discharge portion with near infrared rays; a step of generating a captured image of the plurality of types of processing liquids in the liquid discharge portion irradiated with the near infrared ray; and and a step of specifying the type of the processing liquid in the liquid discharge portion based on the captured image.

11. The substrate processing method according to claim 10, characterized in that: The method further includes a step of controlling the liquid discharge unit based on a result of determining the type of the processing liquid.

12. The substrate processing method according to claim 11, characterized in that: The liquid discharge portion comprises: an upstream pipe for allowing the plurality of processing liquids discharged from the chamber to flow; a common pipe to which the downstream end of the upstream pipe is connected; and The upstream ends of the plurality of downstream pipes are connected to the common pipe.

13. The substrate processing method according to claim 12, characterized in that: In the step of controlling the liquid discharge unit, a flow destination of the processing liquid flowing through the common pipe is switched between the plurality of downstream pipes.

14. The substrate processing method according to claim 12, characterized in that: In the step of irradiating with near infrared rays, a region including at least a portion of the upstream pipe is irradiated with the near infrared rays. In the step of generating the captured image, the plurality of processing liquids in the upstream pipe irradiated with the near infrared ray are captured to generate the captured image. In the step of specifying the type of the processing liquid, the type of the processing liquid in the upstream pipe is specified based on the captured image.

15. The substrate processing method according to claim 12, characterized in that: In the step of irradiating with near infrared rays, the region including the at least one portion is irradiated with the near infrared rays. In the step of generating the captured image, the plurality of processing liquids in the common pipe irradiated with the near infrared ray are captured to generate the captured image. In the step of specifying the type of the processing liquid, the type of the processing liquid in the common pipe is specified based on the captured image.

16. The substrate processing method according to claim 13, characterized in that: In the step of controlling the liquid discharge unit, a switching timing for switching a flow destination of the processing liquid flowing through the common pipe is controlled based on the identification result of the type of the processing liquid.

17. The substrate processing method according to claim 10 or 11, characterized in that: In the step of irradiating with the near infrared rays, one of the plurality of near infrared light sources emitting the near infrared rays having mutually different peak wavelengths irradiates a region including at least a portion of the liquid discharge portion with the near infrared rays, The substrate processing method further comprises the following steps: a step of acquiring type information indicating the type of the processing liquid; and The step of changing the near-infrared light source for irradiating a region including at least a part of the liquid discharge portion based on the type information.

18. The substrate processing method according to claim 10 or 11, characterized in that: In the step of supplying the processing liquid at different timings, the processing liquid supplied to the substrate is switched based on the result of determining the type of the processing liquid.

Images