Cooling plate capable of dissipating heat uniformly

Abstract

The invention provides a cooling plate capable of uniformly dissipating heat, and the cooling plate comprises a bottom plate which is a flat plate; the plurality of pin fins are arranged in multiple rows and multiple columns and are arranged on the upper surface of the bottom plate; the cover plate is provided with a convex cover and a flange which can contain all the pin fins, the flange is connected with the edge of the opening part of the convex cover and protrudes outwards, the cover plate is connected with the bottom plate through the flange, and a liquid inlet hole and a liquid outlet hole are formed in the cover plate; the silica gel strip is connected to the lower surface of the bottom plate and arranged around the edge of the bottom plate to form a closed pattern; and the heat-conducting silicone grease is laid in an area defined by the silica gel strips, and the bottom plate can be connected with the chip through the heat-conducting silicone grease. According to the cooling plate with the uniform heat dissipation function, the thermal resistance can be reduced, and the heat dissipation uniformity can be improved.

Description

Technical Field

[0001] The invention relates to the field of chip heat dissipation, and in particular to a cooling plate with uniform heat dissipation. Background Art

[0002] A cooling plate is usually used to dissipate heat from the chip to maintain healthy operation of the chip.

[0003] When the cooling plate dissipates heat for a large-area chip, there will be uneven heat dissipation and large local thermal resistance, resulting in abnormal operation of the chip. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a cooling plate with uniform heat dissipation, which can reduce thermal resistance and improve the uniformity of heat dissipation.

[0005] In order to solve the above problems, the present invention provides a cooling plate with uniform heat dissipation, and the cooling plate with uniform heat dissipation comprises:

[0006] A bottom plate, the bottom plate being formed as a flat plate;

[0007] A plurality of pin fins, the plurality of pin fins are arranged in a plurality of rows and columns and are disposed on the upper surface of the bottom plate;

[0008] A cover plate, wherein the cover plate is formed with a convex cover and a flange capable of accommodating all of the pin fins, the flange is connected to the edge of the mouth of the convex cover and protrudes outward, the cover plate is connected to the bottom plate through the flange, and a liquid inlet hole and a liquid outlet hole are formed on the cover plate;

[0009] A silicone strip, the silicone strip being connected to the lower surface of the bottom plate and being arranged around the edge of the bottom plate to form a closed pattern;

[0010] Thermally conductive silicone grease is laid in the area surrounded by the silicone strips, and the base plate can be connected to the chip through the thermally conductive silicone grease.

[0011] Furthermore, the pin fins and the base plate are formed integrally by cold forging, and the cover plate is formed by stamping.

[0012] Furthermore, the cooling plate further comprises:

[0013] A gusset plate, wherein the middle portion of the gusset plate is hollowed out, the gusset plate is sleeved with the convex cover and connected to the flange, and a mounting hole is formed on the gusset plate, and a fastener can be inserted into the mounting hole so that the lower surface of the base plate is tightly connected to the chip.

[0014] Furthermore, the cooling plate further comprises:

[0015] A separator bar, which is arranged in the middle of the bottom plate and extends along the row or column direction, and abuts between two adjacent pin wings in the width direction;

[0016] Both ends of the dividing strip in the length direction have a predetermined gap with the inner wall of the convex cover, and the liquid inlet hole and the liquid outlet hole correspond to two sides of the dividing strip in the width direction respectively.

[0017] Furthermore, the top of the dividing strip is connected to the top of the pin fin by laser welding.

[0018] Furthermore, the pin wings in two adjacent rows and two adjacent columns are staggered, and the dividing strips are distributed in a serpentine shape.

[0019] Furthermore, the dividing strip has a first notch and a second notch which are distributed sequentially and alternately, the first notch and the second notch are oriented in opposite directions and each accommodates one pin wing, the first notch abuts against the first side wall of a row or column of pin wing in the middle, and correspondingly, the second notch abuts against the second side wall of the row or column of pin wing in the middle, and the first side wall and the second side wall are arranged opposite to each other.

[0020] Furthermore, the pin fin comprises:

[0021] a first pin fin, the first pin fin corresponding to the pin fin directly below the liquid inlet and the liquid outlet;

[0022] The second needle fin is the needle fin remaining after removing the first needle fin, and the height of the second needle fin is higher than that of the first needle fin.

[0023] Furthermore, the cooling plate further comprises:

[0024] A liquid inlet joint, the liquid inlet joint is connected to the liquid inlet hole, the liquid inlet joint comprises a first connection block and a first pagoda joint, the first connection block is communicated with the liquid inlet hole, a first end of the first pagoda joint is connected to the first connection block, and a second end thereof is used to connect to a liquid inlet pipe;

[0025] A liquid outlet joint, the liquid outlet joint is connected to the liquid outlet hole, the liquid outlet joint includes a second connecting block and a second pagoda joint, the second connecting block is communicated with the liquid outlet hole, the first end of the second pagoda joint is connected to the second connecting block, and the second end thereof is used to connect to the liquid outlet pipe.

[0026] Furthermore, the base plate is connected to the flange by brazing.

[0027] Due to the above technical solution, the present invention has the following beneficial effects:

[0028] According to the cooling plate with uniform heat dissipation of the present invention, a plurality of pin fins arranged in multiple rows and columns are provided on the bottom plate. The convex cover of the cover plate forms a chamber with the bottom plate, so as to accommodate the pin fins and the coolant. The cover plate is connected to the bottom plate by a flange, and the convex cover of the cover plate forms a chamber with the bottom plate, so as to accommodate the pin fins and the coolant. The lower surface of the bottom plate forms a silicone strip with a closed pattern, and the thermal grease is laid in the area surrounded by the silicone strip, which can form a certain thickness of the thermal grease, so that the distribution of the thermal grease is relatively uniform and flat and has a predetermined thickness. The chip is buckled on the uniformly distributed thermal grease, and there is no gap between the chip and the thermal grease (especially suitable for larger chips), which can reduce thermal resistance and improve heat dissipation efficiency and heat dissipation uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 is a structural diagram of a cooling plate for uniform heat dissipation according to an embodiment of the present invention;

[0031] Figure 2 yes Figure 1 The structural diagram of the gusset plate in FIG.

[0032] Figure 3 yes Figure 1 The structural diagram of the cooling plate with uniform heat dissipation without the buckle plate;

[0033] Figure 4 yes Figure 1 A back view of the cooling plate for uniform heat dissipation;

[0034] Figure 5 is a structural diagram of a base plate and pin fins according to an embodiment of the present invention;

[0035] Figure 6 is a structural diagram of a cover plate according to an embodiment of the present invention.

[0036] Reference numerals:

[0037] 100, bottom plate; 200, cover plate; 210, convex cover; 220, flange; 231, liquid inlet hole; 232, liquid outlet hole; 311, first pagoda joint; 312, first connecting block; 321, second pagoda joint; 322, second connecting block; 400, buckle plate; 410, mounting hole; 420, hollowing; 520, first pin wing; 510, second pin wing; 600, separator strip; 700, silicone strip. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0040] Next, a cooling plate for uniform heat dissipation according to an embodiment of the present invention will be described.

[0041] like Figures 1 to 6 As shown, the cooling plate for uniform heat dissipation according to the embodiment of the present invention comprises a base plate 100, a plurality of pin fins, a cover plate 200, a silicone strip 700 and thermal conductive silicone grease.

[0042] First, the bottom plate 100 and the plurality of pin fins are described. The bottom plate 100 is formed as a flat plate. The plurality of pin fins are arranged in a plurality of rows and columns and are provided on the upper surface of the bottom plate 100 .

[0043] like Figure 5 As shown, a plurality of pin fins arranged in multiple rows and columns are provided on the bottom plate 100. The pin fins can increase the contact area with the coolant, improve the heat dissipation efficiency, and are easy to manufacture.

[0044] Next, the cover plate 200 is described. The cover plate 200 is formed with a convex cover 210 capable of accommodating all pin fins and a flange 220, the flange 220 is connected to the edge of the mouth of the convex cover 210 and protrudes outward, the cover plate 200 is connected to the bottom plate 100 through the flange 220, and the cover plate 200 is formed with a liquid inlet 231 and a liquid outlet 232.

[0045] like Figure 6 As shown, the cover plate 200 includes a convex cover 210 and a flange 220. The convex cover 210 is formed with a liquid inlet 231 for providing coolant to enter and a liquid outlet 232 for providing coolant to exit. The cover plate 200 is connected to the base plate 100 through the flange 220. The convex cover 210 of the cover plate 200 and the base plate 100 form a chamber, so as to accommodate the pin fins and the coolant.

[0046] Next, the silicone strip 700 and the thermal conductive silicone grease are described. The silicone strip 700 is connected to the lower surface of the base plate 100 and is arranged around the edge of the base plate 100 to form a closed pattern. The thermal conductive silicone grease is laid in the area surrounded by the silicone strip 700, and the base plate 100 can be connected to the chip through the thermal conductive silicone grease.

[0047] like Figure 4 As shown, the thermal conductive silicone strip 700 forms a rectangular frame, and the thermal conductive silicone grease is laid in the rectangular frame, which can make the thermal conductive silicone grease form a certain thickness, ensuring that the thermal conductive silicone grease in the rectangular frame is relatively uniform and flat. The chip is buckled on the evenly distributed thermal conductive silicone grease, and there is no gap between the chip and the thermal conductive silicone grease, which can reduce thermal resistance and improve heat dissipation efficiency. The closed figure is not limited here, and it can also be a pentagon (forming a pentagonal frame), a circle (forming a circular frame), etc.

[0048] The above cooling plate with uniform heat dissipation has a plurality of pin fins arranged in multiple rows and columns on the bottom plate 100. The convex cover 210 covered by the cover plate 200 forms a chamber with the bottom plate 100, so as to accommodate the pin fins and the coolant. The cover plate 200 is connected to the bottom plate 100 through the flange 220, and the convex cover 210 of the cover plate 200 forms a chamber with the bottom plate 100, so as to accommodate the pin fins and the coolant. The lower surface of the bottom plate 100 forms a closed pattern of silicone strips 700, and the thermal grease is laid in the area surrounded by the silicone strips 700, which can form a certain thickness of the thermal grease, so that the thermal grease is relatively evenly distributed and has a predetermined thickness. The chip is buckled on the evenly distributed thermal grease, and there is no gap between the chip and the thermal grease (especially suitable for larger chips), which can reduce thermal resistance and improve heat dissipation efficiency and heat dissipation uniformity.

[0049] In some embodiments of the present invention, the pin fins and the base plate 100 are formed integrally by cold forging, and the cover plate 200 is formed by stamping.

[0050] The pin fins and the base plate 100 are integrally formed by cold forging, which can be formed in one step, has high production efficiency, low cost, and meets the needs of large-scale operations.

[0051] The cover plate 200 is formed by stamping, which is low in cost and easy to manufacture.

[0052] In some embodiments of the present invention, the cooling plate further comprises a gusset plate 400. The middle part of the gusset plate 400 has a hollow 420, the gusset plate 400 is sleeved with a convex cover 210 and connected to the flange 220, and a mounting hole 410 is formed on the gusset plate 400, and a fastener can be inserted into the mounting hole 410, so that the lower surface of the base plate 100 is tightly connected to the chip.

[0053] like Figure 1 and Figure 2As shown, fasteners (such as bolts, rivets, etc.) pass through the mounting holes 410 of the buckle plate 400 and are connected to the periphery of the chip or the chip itself, so that the flange 220 and the base plate 100 press the chip, increase the tightness and stability of the connection with the chip, and reduce thermal resistance.

[0054] In some embodiments of the present invention, the cooling plate further includes a partition bar 600. The partition bar 600 is disposed in the middle of the bottom plate 100 and extends in the row or column direction, and abuts between two adjacent pin fins in the width direction. Both ends of the partition bar 600 in the length direction have a predetermined gap with the inner wall of the convex cover 210, and the liquid inlet hole 231 and the liquid outlet hole 232 correspond to the two sides of the partition bar 600 in the width direction.

[0055] like Figure 5 As shown, the dividing strip 600 extends along the row direction. The cooling liquid can be separated by the dividing strip (the cooling liquid cannot directly pass through the dividing strip 600 from the liquid inlet hole 231 to the liquid outlet hole 232). The cooling liquid can enter the chamber (the chamber formed by the cover plate 200 and the bottom plate 100) from the liquid inlet hole 231, flow in the area corresponding to the first direction of the width direction of the dividing strip 600, flow through the predetermined gap (the gap between the dividing strip 600 and the chamber) into the area corresponding to the second direction of the width direction of the dividing strip 600, and then flow out of the chamber from the liquid outlet hole 232, thereby increasing the flow stroke of the cooling liquid, improving the utilization rate of the cooling liquid, improving the heat dissipation efficiency, and increasing the uniformity of heat dissipation. The gap of the pin fin is narrow, that is, the width of the dividing strip 600 is low, and the number of pin fins is not reduced (the dividing strip 600 does not occupy the distribution space of the pin fins). This dividing strip 600 can increase the contact area with the cooling liquid and improve the heat dissipation efficiency. The distribution of the pin fins and the separator bar 600 may be as described below, or the separator bar 600 may be directly inserted between the pin fins of two adjacent rows or columns.

[0056] Moreover, the partition bar 600 abuts between two adjacent pin fins, which facilitates the production of the cooling plate. The bottom plate 100 and the pin fins can be formed into an integral body by cold forging, and then the partition bar 600 can be inserted into the gap between the adjacent pin fins. This structure can avoid the use of the commonly used CNC processing method, which is more complicated and costly.

[0057] Furthermore, the top of the partition bar 600 is connected to the top of the pin fin by laser welding.

[0058] That is, on the basis of the abutment between the pin fin and the partition bar 600, laser welding is added between the top of the pin fin and the partition bar 600, thereby further improving the stability of the connection between the pin fin and the partition bar 600. Moreover, this operation is simple and efficient.

[0059] In some embodiments of the present invention, two adjacent rows and two adjacent columns of pin fins are staggered, and the separator strips 600 are distributed in a serpentine shape.

[0060] like Figure 5 As shown, the staggered pin fins can increase the uniformity of heat dissipation by the coolant.

[0061] like Figure 5 As shown, the separator bar 600 is formed into a serpentine shape (with two notches in symmetrical directions), which can increase the contact area with the coolant and improve the heat dissipation efficiency. Moreover, the serpentine separator bar 600 can increase the contact area with the pin fins, avoid relative movement with the pin fins, and increase the stability of the contact with the pin fins.

[0062] It should be noted that the above are only optional examples, and the partition bar 600 may also be formed in a serpentine shape (a notch in only one direction), which should be understood to be within the scope of the present invention.

[0063] Furthermore, the dividing strip 600 has a first notch and a second notch which are distributed sequentially and alternately, the first notch and the second notch are oriented in opposite directions and each accommodates a pin wing, the first notch abuts against the first side wall of a row or column of pin wing in the middle, and correspondingly, the second notch abuts against the second side wall of the row or column of pin wing in the middle, and the first side wall and the second side wall are arranged opposite to each other.

[0064] like Figure 5 As shown, the dividing strips 600 are distributed in a serpentine shape, and are sequentially and alternately formed with a rear notch (first notch), a front notch (second notch), a rear notch (first notch), a front notch (second notch) . . . . .

[0065] The rear notch abuts against the front side wall (first side wall) of a pin wing in a row in the middle, and the front notch abuts against the rear side wall (second side wall) of a pin wing in this row.

[0066] The serpentine distribution (the first notch and the second notch that are distributed sequentially and alternately) can make the coolant distribution on both sides of the width direction of the partition bar 600 more uniform. The first notch and the second notch are distributed alternately and sequentially, each accommodating a pin fin, increasing the contact area with the pin fin, further reducing the relative movement between the partition bar 600 and the pin fin, and making the position and structure of the partition bar 600 stable.

[0067] It should be noted that the above are only optional examples, and the dividing strip 600 can also form a left recess (first recess) and a right recess (second recess), the left recess abuts against the right side wall (first side wall) of the needle wing, and the right recess abuts against the left side wall (second side wall) of the needle wing. These should all be understood to be within the scope of the present invention.

[0068] In some embodiments of the present invention, the pin fins include first pin fins 520 and second pin fins 510. The first pin fins 520 correspond to the pin fins directly below the liquid inlet 231 and the liquid outlet 232. The second pin fins 510 are the remaining pin fins after removing the first pin fins 520, and the height of the second pin fins 510 is higher than that of the first pin fins 520.

[0069] like Figure 3 As shown, the height of the first pin fin 520 at the corresponding position of the liquid inlet hole 231 and the liquid outlet hole 232 is relatively low, and the height of the second pin fin 510 at the other positions is relatively high. The lower height of the first pin fin 520 will lessen the obstruction to the coolant flowing in and out, increase the flow of the coolant flowing in and out of the chamber, and improve the heat dissipation efficiency. Moreover, the first pin fin 520 can still increase the contact area with the coolant to improve the heat dissipation efficiency.

[0070] In some embodiments of the present invention, the cooling plate further includes a liquid inlet joint and a liquid outlet joint. The liquid inlet joint is connected to the liquid inlet hole 231, and the liquid inlet joint includes a first connection block 312 and a first pagoda joint 311, the first connection block 312 is connected to the liquid inlet hole 231, the first end of the first pagoda joint 311 is connected to the first connection block 312, and the second end thereof is used to connect to the liquid inlet pipe. The liquid outlet joint is connected to the liquid outlet hole 232, and the liquid outlet joint includes a second connection block 322 and a second pagoda joint 321, the second connection block 322 is connected to the liquid outlet hole 232, the first end of the second pagoda joint 321 is connected to the second connection block 322, and the second end thereof is used to connect to the liquid outlet pipe.

[0071] like Figure 3 As shown, the coolant can enter the first pagoda joint 311 and the first connecting block 312 from the liquid inlet pipe and enter the chamber, and the coolant flows out from the chamber to the second connecting block 322 and the second pagoda joint 321 and then enters the liquid outlet pipe.

[0072] The first pagoda joint 311 is convenient for sealing connection with the liquid inlet pipe, and the second pagoda joint 321 is convenient for sealing connection with the liquid outlet pipe to avoid liquid leakage.

[0073] In some embodiments of the present invention, the base plate 100 is connected to the flange 220 by brazing.

[0074] The brazing connection has high stability, which can ensure good airtightness between the base plate 100 and the cover plate 200 and prevent leakage.

[0075] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A cooling plate with uniform heat dissipation, characterized in that: The cooling plate comprises: A bottom plate, the bottom plate being formed as a flat plate; A plurality of pin fins, the plurality of pin fins are arranged in a plurality of rows and columns and are disposed on the upper surface of the bottom plate; A cover plate, wherein the cover plate is formed with a convex cover and a flange capable of accommodating all of the pin fins, the flange is connected to the edge of the mouth of the convex cover and protrudes outward, the cover plate is connected to the bottom plate through the flange, and a liquid inlet hole and a liquid outlet hole are formed on the cover plate; A silicone strip, the silicone strip being connected to the lower surface of the bottom plate and being arranged around the edge of the bottom plate to form a closed pattern; Thermally conductive silicone grease is laid in the area surrounded by the silicone strips, and the base plate can be connected to the chip through the thermally conductive silicone grease.

2. The cooling plate for uniform heat dissipation according to claim 1, characterized in that: The pin fins and the bottom plate are formed integrally by cold forging, and the cover plate is formed by stamping.

3. The cooling plate for uniform heat dissipation according to claim 1, characterized in that: The cooling plate further comprises: A gusset plate, wherein the middle portion of the gusset plate is hollowed out, the gusset plate is sleeved with the convex cover and connected to the flange, and a mounting hole is formed on the gusset plate, and a fastener can be inserted into the mounting hole so that the lower surface of the base plate is tightly connected to the chip.

4. The cooling plate for uniform heat dissipation according to claim 1, characterized in that: The cooling plate further comprises: A separator bar, which is arranged in the middle of the bottom plate and extends along the row or column direction, and abuts between two adjacent pin wings in the width direction; Both ends of the dividing strip in the length direction have a predetermined gap with the inner wall of the convex cover, and the liquid inlet hole and the liquid outlet hole correspond to two sides of the dividing strip in the width direction respectively.

5. The cooling plate for uniform heat dissipation according to claim 4, characterized in that: The top of the partition strip is connected to the top of the pin fin by laser welding.

6. The cooling plate for uniform heat dissipation according to claim 4, characterized in that: The pin wings in two adjacent rows and two adjacent columns are staggered, and the separation strips are distributed in a serpentine shape.

7. The cooling plate for uniform heat dissipation according to claim 6, characterized in that: The dividing strip has a first notch and a second notch that are distributed sequentially and alternately, the first notch and the second notch are oriented in opposite directions and each accommodates one pin wing, the first notch abuts against the first side wall of a row or column of the pin wing in the middle, and correspondingly, the second notch abuts against the second side wall of the row or column of the pin wing in the middle, and the first side wall and the second side wall are arranged opposite to each other.

8. The cooling plate for uniform heat dissipation according to claim 1, characterized in that: The pin fin comprises: a first pin fin, the first pin fin corresponding to the pin fin directly below the liquid inlet and the liquid outlet; The second needle fin is the needle fin remaining after removing the first needle fin, and the height of the second needle fin is higher than that of the first needle fin.

9. The cooling plate for uniform heat dissipation according to claim 1, characterized in that: The cooling plate further comprises: A liquid inlet joint, the liquid inlet joint is connected to the liquid inlet hole, the liquid inlet joint comprises a first connection block and a first pagoda joint, the first connection block is communicated with the liquid inlet hole, a first end of the first pagoda joint is connected to the first connection block, and a second end thereof is used to connect to a liquid inlet pipe; A liquid outlet joint, the liquid outlet joint is connected to the liquid outlet hole, the liquid outlet joint includes a second connecting block and a second pagoda joint, the second connecting block is communicated with the liquid outlet hole, the first end of the second pagoda joint is connected to the second connecting block, and the second end thereof is used to connect to the liquid outlet pipe.

10. The cooling plate for uniform heat dissipation according to claim 1, characterized in that: The bottom plate is connected to the flange by brazing.

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