Liquid cooling device with high-precision temperature control capability and liquid cooling method thereof

Abstract

The invention relates to the technical field of liquid cooling, in particular to a liquid cooling device with high-precision temperature control capability and a liquid cooling method thereof. The liquid supply module comprises a water tank and a circulating water pump, and a semiconductor refrigerator is arranged on the outer wall of the water tank; the refrigeration module comprises an evaporator and a compression unit; according to the liquid cooling device, the compression unit is arranged in the liquid cooling device, the semiconductor cooler is arranged on the outer wall of the water tank, the refrigerating capacity of cooling liquid in the evaporator is controlled by controlling the power of the compression unit and the hot gas bypass of the compression unit, and meanwhile refrigeration or heating of the semiconductor cooler can be controlled by controlling the power polarity of the semiconductor cooler; the power is controlled by controlling the current of the semiconductor cooler, so that the temperature of the cooling liquid in the water tank is accurately controlled; high-precision temperature control can be achieved, and it is guaranteed that the precision of the liquid supply temperature meets the temperature control precision requirement of a load.

Description

Technical Field

[0001] The present invention relates to the field of liquid cooling technology, and in particular to a liquid cooling device with high-precision temperature control capability and a liquid cooling method thereof. Background Art

[0002] At present, many power devices are highly sensitive to temperature. For example, if the surface temperature of laser devices varies greatly, the performance of these devices will drop sharply, affecting the normal operation of the entire device. In order to ensure that the laser device can work effectively and sustainably, the internal components need to be cooled and dissipated.

[0003] At present, general cooling devices use liquid cooling sources to provide coolant at a certain temperature to remove the heat from the load. Conventional liquid cooling sources can usually only provide coolant of one temperature to the load at the same time. For complex lasers, the operating temperatures of different loads are different, and the required coolant temperatures are also different. This requires the cooling device to be able to provide multiple liquid supply temperatures and have high requirements for the accuracy of the liquid supply temperature.

[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Summary of the invention

[0005] The technical problem to be solved by the present invention is how to accurately control the temperature of the coolant.

[0006] The present invention adopts the following technical solution:

[0007] In a first aspect, a liquid cooling device with high-precision temperature control capability is provided, comprising: a liquid supply module 1 and a refrigeration module 2; the liquid supply module 1 comprises a water tank 10 and a circulating water pump 11, and a semiconductor refrigerator 12 is arranged on the outer wall of the water tank 10; the refrigeration module 2 comprises an evaporator 20 and a compression unit 21;

[0008] The output end of the water tank 10 is connected to the input end of the circulating water pump 11, the output end of the circulating water pump 11 is connected to one end of a pipeline flowing through a load, the other end of the pipeline flowing through the load is connected to the input end of the water tank 10, and the pipeline between the other end of the pipeline flowing through the load and the water tank 10 is arranged in the evaporator 20;

[0009] The output end of the evaporator 20 is connected to the input end of the compression unit 21, and the output end of the compression unit 21 is connected to the input end of the evaporator 20;

[0010] The circulating water pump 11 is used to transfer the coolant in the water tank 10 to the pipeline passing through the load to absorb the heat generated by the load;

[0011] The refrigerant stored in the evaporator 20 is used to absorb heat from the cooling liquid after passing through the load, and the refrigerant after absorbing heat is compressed by the compression unit 21, and the compressed refrigerant is recondensed and flows back to the evaporator 20;

[0012] The compression unit 21 and / or the semiconductor refrigerator 12 are used to adjust their own working state according to the supply liquid temperature and the target temperature of the load so that the supply liquid temperature continuously approaches the target temperature, wherein the supply liquid temperature is the temperature of the coolant in the pipeline flowing into the load.

[0013] Preferably, the liquid supply module 1 further includes a cold plate 13, a first condenser 14, a liquid storage tank 15 and a liquid supply water pump 16;

[0014] The liquid storage tank 15, the liquid supply water pump 16, the cold plate 13 and the first condenser 14 are connected in sequence along the pipeline, and the output end of the first condenser 14 is connected to the input end of the liquid storage tank 15; the cold plate 13 is arranged on one side of the semiconductor refrigerator 12;

[0015] The liquid storage tank 15 is used to store coolant, and the liquid supply water pump 16 is used to transfer the coolant in the liquid storage tank 15 to the cold plate 13. The coolant in the cold plate 13 is used to exchange heat with the semiconductor refrigerator 12 and then flow into the first condenser 14. The first condenser 14 is used to cool the coolant after absorbing heat, and the cooled coolant flows back into the liquid storage tank 15.

[0016] Preferably, the refrigeration module 2 further includes a bypass solenoid valve 22, one end of the bypass solenoid valve 22 is connected to the output end of the compression unit 21, and the other end of the bypass solenoid valve 22 is connected to the input end of the evaporator 20;

[0017] The bypass solenoid valve 22 is opened to transfer the hot gas in the compression unit 21 to the input end of the evaporator 20 so that the temperature of the refrigerant in the evaporator 20 is increased, thereby controlling the refrigeration capacity of the refrigeration module 2 .

[0018] Preferably, the refrigeration module 2 further includes a second condenser 23; the output end of the compression unit 21 is connected to the input end of the second condenser 23, and the output end of the second condenser 23 is connected to the input end of the evaporator 20;

[0019] The liquid refrigerant in the evaporator 20 is converted into gaseous refrigerant after heat exchange with the cooling liquid. The gaseous refrigerant is compressed by the compression unit 21 to become high-temperature and high-pressure refrigerant. The high-temperature and high-pressure refrigerant flows through the second condenser 23 and becomes liquid refrigerant again. The liquid refrigerant flows back to the evaporator 20 to dissipate heat for the cooling liquid after passing through the load.

[0020] Preferably, the liquid cooling device further includes an energy storage unit 3 and an emergency water pump 4;

[0021] The output end of the circulating water pump 11 is connected to the input end of the energy storage unit 3, and the output end of the energy storage unit 3 is connected to one end of the pipeline flowing through the load; one end of the emergency water pump 4 is connected to the input end of the energy storage unit 3, and the other end of the emergency water pump 4 is connected to the other end of the pipeline flowing through the load;

[0022] When the liquid supply module 1 fails, the input and output ends of the liquid supply module 1 are closed, the emergency water pump 4 is turned on, and the coolant flowing through the load is circulated and cooled through the emergency water pump 4 and the energy storage unit 3 .

[0023] Preferably, the energy storage unit 3 includes a heat exchange cold plate 30, a heat transfer fin 31, a plurality of energy storage materials 32 and a cover plate 33; the energy storage materials 32 are sequentially arranged on both sides of the heat exchange cold plate 30; the heat transfer fin 31 is arranged on the heat exchange cold plate 30 and is located between every two energy storage materials 32; the cover plate 33 covers the energy storage material 32;

[0024] The input end of the heat exchange cold plate 30 is connected to the output end of the liquid supply module 1, and the output end of the heat exchange cold plate 30 is connected to one end of a pipeline flowing through the load; the heat exchange cold plate 30 and the heat transfer fins 31 are used to transfer the heat in the coolant to the energy storage material 32;

[0025] When the supply liquid temperature is lower than or equal to a preset threshold, the energy storage unit 3 is used to store excess cold in the coolant; when the supply liquid temperature is greater than the preset threshold, the energy storage unit 3 is used to absorb heat in the coolant.

[0026] Preferably, a temperature sensor 17 is provided at the input end of the pipeline flowing through the load, and the temperature sensor 17 is used to monitor the supply liquid temperature.

[0027] In a second aspect, a liquid cooling method with high-precision temperature control capability is provided, comprising:

[0028] The circulating water pump 11 transfers the coolant in the water tank 10 to the pipeline passing through the load to absorb the heat generated by the load;

[0029] The refrigerant stored in the evaporator 20 absorbs heat from the coolant after passing through the load, and the refrigerant after absorbing heat is compressed by the compression unit 21, and the compressed refrigerant is recondensed and flows back to the evaporator 20;

[0030] The compression unit 21 and / or the semiconductor refrigerator 12 regulates its own working state according to the liquid supply temperature and the target temperature of the load so that the liquid supply temperature continuously approaches the target temperature, wherein the liquid supply temperature is the temperature of the coolant in the pipeline flowing into the load.

[0031] Preferably, the compression unit 21 and / or the semiconductor refrigerator 12 regulates its own working state according to the liquid supply temperature and the target temperature of the load so that the liquid supply temperature continuously approaches the target temperature, including:

[0032] When the liquid supply temperature is less than or equal to the target temperature -1°C, the hot gas in the compression unit 21 is bypassed to the evaporator 20, and the power polarity of the semiconductor refrigerator 12 is controlled so that the part of the semiconductor refrigerator 12 adhering to the wall of the water tank 10 becomes a hot end, so as to heat the water tank 10;

[0033] When the liquid supply temperature is greater than or equal to the target temperature + 1°C, the compression unit 21 is operated at the highest frequency, and the power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the wall portion of the water tank 10 become a cold end, so as to cool the water tank 10;

[0034] When the liquid supply temperature is between the target temperature -1°C and the target temperature +1°C, the frequency of the compression unit 21 is adjusted until the liquid supply temperature reaches between the target temperature -x°C and the target temperature +x°C, and the current frequency of the compression unit 21 is maintained, where x is greater than 0 and x is less than 1.

[0035] Preferably, the compression unit 21 and / or the semiconductor refrigerator 12 regulates its own working state according to the liquid supply temperature and the target temperature of the load so that the liquid supply temperature continuously approaches the target temperature, and further comprises:

[0036] When the liquid supply temperature is between the target temperature -x°C and the target temperature, the power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the wall portion of the water tank 10 become the hot end, and the input current of the semiconductor refrigerator 12 is adjusted according to the deviation between the liquid supply temperature and the target temperature to control the heating temperature of the semiconductor refrigerator 12 to increase the liquid supply temperature;

[0037] When the liquid supply temperature is between the target temperature and the target temperature + x°C, the power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the wall portion of the water tank 10 become the cold end, and the input current of the semiconductor refrigerator 12 is adjusted according to the deviation value between the liquid supply temperature and the target temperature to control the cooling temperature of the semiconductor refrigerator 12 and thereby reduce the liquid supply temperature.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] The present invention arranges a compression unit 21 in the liquid cooling device and a semiconductor refrigerator 12 on the outer wall of the water tank 10, and controls the cooling capacity of the coolant in the evaporator 20 by controlling the power of the compression unit 21 and its hot gas bypass. At the same time, the cooling or heating of the semiconductor refrigerator 12 can be controlled by controlling the power polarity of the semiconductor refrigerator 12, and the power can be controlled by controlling the current of the semiconductor refrigerator 12, so as to accurately control the temperature of the coolant in the water tank 10; high-precision temperature control can be achieved to ensure that the accuracy of the liquid supply temperature meets the temperature control accuracy requirements of the load. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0041] Figure 1 It is a structural schematic diagram of a liquid cooling device with high-precision temperature control capability provided by an embodiment of the present invention;

[0042] Figure 2 It is a specific structural schematic diagram of a liquid supply module provided by an embodiment of the present invention;

[0043] Figure 3 It is a schematic diagram of a structure for heat dissipation for a semiconductor refrigerator provided by an embodiment of the present invention;

[0044] Figure 4 It is a specific structural schematic diagram of a liquid cooling device with high-precision temperature control capability provided by an embodiment of the present invention;

[0045] Figure 5 is a more specific structural schematic diagram of a liquid cooling device with high-precision temperature control capability provided by an embodiment of the present invention;

[0046] Figure 6 is a structural schematic diagram of an energy storage unit provided by an embodiment of the present invention;

[0047] Figure 7 It is a flow chart of a liquid cooling method with high-precision temperature control capability provided by an embodiment of the present invention;

[0048] Figure 8 It is a schematic flow chart of a method for rapid heating and cooling provided by an embodiment of the present invention;

[0049] Fig. 9 It is a logical schematic diagram of a primary temperature control provided by an embodiment of the present invention;

[0050] Fig.10 It is a schematic flow chart of a two-stage temperature control method provided by an embodiment of the present invention;

[0051] Fig.11 It is a logical schematic diagram of a two-stage temperature control provided by an embodiment of the present invention.

[0052] In all drawings, the same reference numerals refer to the same structure, wherein:

[0053] Liquid supply module 1, water tank 10, circulating water pump 11, semiconductor refrigerator 12, cold plate 13, first condenser 14, liquid storage tank 15, liquid supply water pump 16, temperature sensor 17, heat dissipation fins 18, refrigeration module 2, evaporator 20, compression unit 21, bypass solenoid valve 22, second condenser 23, drying filter 24, solenoid valve 25, expansion valve 26, pressure sensor 27, fluorine filling port 28, energy storage unit 3, heat exchange cold plate 30, heat transfer fins 31, energy storage material 32, cover plate 33, emergency water pump 4, flow meter 5, filter 6, thermometer 7. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0055] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0056] In the description of the present invention, the terms "first" and "second" are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, the same type of nouns may be described as two independent individuals by adding "A" and "B" at the end. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the same type of individuals for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

[0057] When describing some embodiments, the expressions "coupling", "coupling" and "connection" and their derivatives may be used. For example, when describing some embodiments, the term "connection" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupling" may be used to indicate that two or more components are in direct physical or electrical contact. However, the terms "connection" or "coupling" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed herein are not necessarily limited to the contents of the present invention.

[0058] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0059] Embodiment 1:

[0060] In the prior art, when cooling many devices with relatively high temperature requirements, the temperature of the liquid cooling source cannot be controlled or the temperature control accuracy is not high, which will cause these devices to be affected by the temperature of the liquid cooling source during operation, thereby affecting their normal operation.

[0061] In order to solve the above problems, this embodiment proposes a liquid cooling device with high-precision temperature control capability, such as Figure 1 As shown, it includes: a liquid supply module 1 and a refrigeration module 2; the liquid supply module 1 includes a water tank 10 and a circulating water pump 11, and the outer wall of the water tank 10 is provided with a semiconductor refrigerator 12; the refrigeration module 2 includes an evaporator 20 and a compression unit 21; the output end of the water tank 10 is connected to the input end of the circulating water pump 11, the output end of the circulating water pump 11 is connected to one end of the pipeline flowing through the load, the other end of the pipeline flowing through the load is connected to the input end of the water tank 10, and the pipeline between the other end of the pipeline flowing through the load and the water tank 10 is arranged in the evaporator 20; the output end of the evaporator 20 is connected to the input end of the compression unit 21, and the output end of the compression unit 21 is connected to the input end of the evaporator 20.

[0062] The circulating water pump 11 is used to transfer the coolant in the water tank 10 to the pipeline flowing through the load to absorb the heat generated by the load; the refrigerant stored in the evaporator 20 is used to absorb the heat in the coolant after flowing through the load, and the refrigerant after absorbing heat is compressed by the compression unit 21, and the compressed refrigerant is recondensed and flows back to the evaporator 20; the compression unit 21 and / or the semiconductor refrigerator 12 are used to adjust their own working state according to the supply liquid temperature and the target temperature of the load, so that the supply liquid temperature continuously approaches the target temperature, wherein the supply liquid temperature is the temperature of the coolant in the pipeline flowing into the load.

[0063] The specific working process of the liquid cooling device is as follows: the circulating water pump 11 starts working, extracts the coolant in the water tank 10, and then transfers it to the pipeline flowing through the load. In this process, the coolant will absorb the heat generated by the load when it is working. The coolant that has absorbed the heat will continue to flow along the pipeline. When it flows to the section of the pipeline set in the evaporator 20 (that is, the part of the pipeline between the other end of the pipeline flowing through the load and the water tank 10 is in the evaporator 20), the refrigerant stored in the evaporator 20 begins to play a role. The refrigerant will absorb the heat in the coolant after flowing through the load to reduce the temperature of the coolant. The gaseous refrigerant after absorbing heat becomes a high-temperature and high-pressure gaseous refrigerant under the action of the compression unit 21, and then refluxes to the evaporator 20 after condensation to exchange heat with the coolant again, thereby achieving a liquid cooling effect on the load.

[0064] The temperature control principle and implementation method of the liquid cooling device are as follows:

[0065] First, key temperature parameters are obtained, including the supply temperature of the coolant output from the water tank 10 , and the target temperature required for the normal operation of the load also needs to be clearly known.

[0066] The temperature is adjusted by the compression unit 21 and / or the semiconductor refrigerator 12, in order to make the liquid supply temperature approach the target temperature continuously. Specifically, when the liquid supply temperature is higher than the target temperature, the refrigeration module 2 can cool the refrigerant after absorbing heat; at the same time, the semiconductor refrigerator 12 can also directly cool the coolant in the water tank 10 according to the situation to assist in lowering the liquid supply temperature. Conversely, when the liquid supply temperature is lower than the target temperature, the liquid supply temperature can also be raised to a suitable range close to the target temperature through corresponding adjustment mechanisms, such as appropriately reducing the cooling power of the refrigeration module 2 and heating the water tank through the semiconductor refrigerator 12.

[0067] By continuously monitoring the liquid supply temperature and the target temperature, and flexibly adjusting the working state of the compression unit 21 and the semiconductor refrigerator 12 according to the difference between the two, the liquid supply temperature can be continuously approached to the target temperature, thereby providing high-precision temperature control for devices with high temperature requirements, ensuring that the devices work normally in a suitable temperature environment. Through the above-mentioned structural design and working principle, the liquid cooling device can effectively solve the problem in the prior art that the temperature of the liquid cooling source cannot be accurately controlled when dissipating heat for devices with high temperature requirements, and ensures that the load can work normally in a suitable temperature environment. Its temperature control accuracy can reach 0.1°C, and a more specific temperature control method will be described below.

[0068] Since the semiconductor refrigerator 12 also generates heat during operation, in order to prevent the semiconductor refrigerator 12 from heating itself and affecting the temperature of the water tank 10 and preventing it from being damaged by excessive heating, in one embodiment, Figure 2 and Figure 3 As shown, the liquid supply module 1 also includes a cold plate 13, a first condenser 14, a liquid storage tank 15 and a liquid supply water pump 16; the liquid storage tank 15, the liquid supply water pump 16, the cold plate 13 and the first condenser 14 are connected in sequence along a pipeline, and the output end of the first condenser 14 is connected to the input end of the liquid storage tank 15; the cold plate 13 is arranged on one side of the semiconductor refrigerator 12.

[0069] The liquid storage tank 15 is used to store coolant, and the liquid supply water pump 16 is used to transfer the coolant in the liquid storage tank 15 to the cold plate 13. The coolant in the cold plate 13 is used to exchange heat with the semiconductor refrigerator 12 and then flow into the first condenser 14. The first condenser 14 is used to cool the coolant after absorbing heat, and the cooled coolant flows back into the liquid storage tank 15.

[0070] The liquid storage tank 15 is used as a storage container for the coolant, and a certain amount of coolant is stored therein. When the system is started, the liquid supply water pump 16 starts to work, playing the role of a power source, extracting the coolant in the liquid storage tank 15, and transmitting it to the cold plate 13 through a pipeline. When the coolant from the liquid supply water pump 16 enters the cold plate 13, the coolant in the cold plate 13 will exchange heat with the semiconductor refrigerator 12 that is generating heat. Since the semiconductor refrigerator 12 will emit heat when working, its temperature is higher than the temperature of the coolant in the cold plate 13. According to the principle of heat transfer, the heat will be transferred from the semiconductor refrigerator 12 to the coolant in the cold plate 13. Through this heat exchange, the heat of the semiconductor refrigerator 12 can be partially transferred to the coolant, thereby reducing the temperature of the semiconductor refrigerator 12 itself, reducing its influence on the temperature of the water tank 10, and also helping to prevent it from being damaged due to excessive heating.

[0071] After the coolant in the cold plate 13 absorbs the heat of the semiconductor refrigerator 12, the temperature will rise. At this time, the coolant with the increased temperature will flow into the first condenser 14 along the pipeline. The coolant after absorbing heat is cooled by its own structure and working principle (for example, through structures such as heat dissipation fins, the heat in the coolant is caused to dissipate to the surrounding environment). After the cooling operation of the first condenser 14, the temperature of the coolant will be reduced to a more appropriate level, and then the cooled coolant will flow back to the liquid storage tank 15 through the pipeline to complete a circulation of the coolant. This cycle is repeated, and the heat generated by the semiconductor refrigerator 12 is continuously taken away, so that the semiconductor refrigerator 12 is maintained to work in a relatively stable temperature environment, and the normal operation of the entire liquid cooling device is guaranteed.

[0072] In order to make the temperature of the coolant in the water tank 10 more uniform and enhance the temperature control effect of the semiconductor refrigerator 12, in one embodiment, Figure 3 As shown, heat dissipation fins 18 are provided on the inner wall of the water tank 10 , and the heat dissipation fins 18 are used to improve the heat transfer efficiency and enhance the uniformity of the coolant temperature in the water tank 10 .

[0073] The refrigerant in the evaporator 20 can not only be used to reduce the temperature of the cooling liquid after flowing through the load, but also, when the supply liquid temperature is lower than the target temperature, the temperature of the refrigerant in the evaporator 20 can be increased to increase the temperature of the cooling liquid through the refrigerant. To achieve this purpose, in one embodiment, Figure 4 As shown, the refrigeration module 2 also includes a bypass solenoid valve 22, one end of the bypass solenoid valve 22 is connected to the output end of the compression unit 21, and the other end of the bypass solenoid valve 22 is connected to the input end of the evaporator 20; by opening the bypass solenoid valve 22, the hot air in the compression unit 21 is transferred to the input end of the evaporator 20, so that the temperature of the refrigerant in the evaporator 20 is increased, thereby controlling the refrigeration capacity of the refrigeration module 2.

[0074] Under normal circumstances, the refrigerant in the evaporator 20 is used to absorb the heat in the coolant after passing through the load, thereby achieving a cooling effect on the coolant. However, when the supply temperature is lower than the target temperature, the temperature of the refrigerant in the evaporator 20 can be increased to indirectly increase the temperature of the coolant.

[0075] In order to increase the supply temperature, the bypass solenoid valve 22 is opened, and the high-temperature and high-pressure hot gas in the compression unit 21 that has been processed can be transmitted to the input end of the evaporator 20 through the passage formed by the bypass solenoid valve 22. After these hot gases enter the evaporator 20, heat exchange will occur with the original refrigerant in the evaporator 20. Since the temperature of the hot gas is relatively high, according to the principle of heat transfer, the heat of the hot gas will be transferred to the refrigerant in the evaporator 20, so that the temperature of the refrigerant in the evaporator 20 will increase. After the temperature of the refrigerant in the evaporator 20 increases, the heat exchange between it and the coolant in the pipeline flowing through the load will change. Originally, the refrigerant absorbed the heat of the coolant to cool down. Now, as the temperature of the refrigerant increases, the ability to transfer heat to the coolant will increase, thereby achieving the effect of increasing the temperature of the coolant.

[0076] At the same time, by controlling the degree of opening and closing of the bypass solenoid valve 22 and the amount of hot air generated by the compression unit 21, the amount of hot air entering the evaporator 20 can be accurately adjusted, thereby controlling the temperature increase of the refrigerant in the evaporator 20, and finally achieving effective control of the refrigeration capacity of the refrigeration module 2. For example, if the coolant temperature is only slightly increased, the bypass solenoid valve 22 can be appropriately opened to allow a small amount of hot air to enter the evaporator 20; if the coolant temperature needs to be increased significantly, the opening of the bypass solenoid valve 22 can be further increased to allow more hot air to enter the evaporator 20, so that the refrigerant temperature is increased more, thereby enhancing the heating effect of the coolant to meet different temperature adjustment requirements. It is worth noting that raising the temperature of the coolant by the refrigerant in the evaporator 20 is only a rough adjustment, and a more accurate increase in the temperature of the coolant still requires the semiconductor refrigerator 12 to complete. For specific fine-tuning methods, please refer to the following embodiments.

[0077] In order to condense the high-temperature and high-pressure gaseous refrigerant passing through the compression unit 21 and return it to the evaporator 20, in one embodiment, as shown in FIG. Figure 4 As shown, the refrigeration module 2 also includes a second condenser 23; the output end of the compression unit 21 is connected to the input end of the second condenser 23, and the output end of the second condenser 23 is connected to the input end of the evaporator 20; the liquid refrigerant in the evaporator 20 is converted into a gaseous refrigerant after heat exchange with the coolant, and the gaseous refrigerant is compressed by the compression unit 21 to become a high-temperature and high-pressure refrigerant, and the high-temperature and high-pressure refrigerant is converted into a liquid refrigerant again after flowing through the second condenser 23, and the liquid refrigerant flows back to the evaporator 20 to dissipate heat for the coolant after flowing through the load.

[0078] Among them, continue to refer to Figure 4 The gaseous refrigerant after absorbing heat is compressed by the compression unit 21 to become a high-temperature and high-pressure gaseous refrigerant, then flows through the second condenser 23 where the fan dissipates heat for the high-temperature and high-pressure refrigerant, and then passes through the drying filter 24, the solenoid valve 25 and the expansion valve 26 in sequence to become a low-temperature and low-pressure refrigerant, and then flows back to the evaporator 20 to dissipate heat for the coolant.

[0079] Pressure sensors 27 are also provided at both ends of the compression unit 21 to monitor the high and low pressures at both ends. A fluorine filling port 28 is provided at the inlet end of the compression unit 21 to replenish the refrigerant. The solenoid valve 25 is connected in series in the refrigerant pipeline to control the flow of refrigerant and protect the refrigeration module 2. In one embodiment, the compression unit 21 can be a variable frequency compressor, and the refrigeration capacity of the refrigeration module 2 can be controlled by adjusting its frequency.

[0080] When the circulating water pump 11 fails, the heat dissipation of the load will be seriously affected. Compared with the influence of the liquid supply temperature, the failure of the circulating water pump 11 indicates the shutdown of the liquid cooling device, which is more likely to affect the normal operation of the load. In order to solve the above problem, in one embodiment, Figure 5 As shown, the liquid cooling device also includes an energy storage unit 3 and an emergency water pump 4; the output end of the circulating water pump 11 is connected to the input end of the energy storage unit 3, and the output end of the energy storage unit 3 is connected to one end of the pipeline flowing through the load; one end of the emergency water pump 4 is connected to the input end of the energy storage unit 3, and the other end of the emergency water pump 4 is connected to the other end of the pipeline flowing through the load; when the liquid supply module 1 fails, the input and output ends of the liquid supply module 1 are closed, the emergency water pump 4 is turned on, and the coolant flowing through the load is circulated and cooled through the emergency water pump 4 and the energy storage unit 3.

[0081] Among them, once the circulating water pump 11 fails, the coolant in the circulating pipeline no longer flows, and the load cannot be cooled normally. At this time, it is necessary to close the input and output ends of the liquid supply module 1 (by respectively setting ball valve A and ball valve B at the input and output ends of the liquid supply module 1), and then open the emergency water pump 4. Correspondingly, a ball valve C is provided at the front end of the emergency water pump 4, and the ball valve C is used to control the circulation of the loop in which the emergency water pump 4 is located. The emergency water pump 4 will drive the coolant to circulate in the closed loop formed by the energy storage unit 3 and the pipeline flowing through the load. The temperature of the coolant is controlled by the energy storage unit 3 to ensure that the load can still be effectively cooled in an emergency situation, so as to gain maintenance time for maintenance personnel, maintain the normal working state of the load, and avoid equipment damage due to insufficient heat dissipation.

[0082] Next, the specific structure of the energy storage unit 3 is described. In one embodiment, Figure 6 As shown, the energy storage unit 3 includes a heat exchange cold plate 30, a heat transfer fin 31, a plurality of energy storage materials 32 and a cover plate 33; the energy storage materials 32 are sequentially arranged on both sides of the heat exchange cold plate 30; the heat transfer fin 31 is arranged on the heat exchange cold plate 30 and is located between every two energy storage materials 32; the cover plate 33 covers the energy storage material 32; the input end of the heat exchange cold plate 30 is connected to the output end of the liquid supply module 1, and the output end of the heat exchange cold plate 30 is connected to one end of the pipeline flowing through the load; the heat exchange cold plate 30 and the heat transfer fin 31 are used to transfer the heat in the coolant to the energy storage material 32; when the liquid supply temperature is lower than or equal to the preset threshold, the energy storage unit 3 is used to store the excess cold in the coolant; when the liquid supply temperature is greater than the preset threshold, the energy storage unit 3 is used to absorb the heat in the coolant.

[0083] First, from a structural point of view, the heat exchange cold plate 30 is a key component for heat transfer, and its input end is connected to the output end of the liquid supply module 1, so that the coolant output from the liquid supply module 1 can flow into the heat exchange cold plate 30. When the coolant flows through the heat exchange cold plate 30, since the heat exchange cold plate 30 has good thermal conductivity, the heat in the coolant begins to be transferred to the heat exchange cold plate 30. The heat transfer fins 31 provided on the heat exchange cold plate 30 further enhance the heat conduction effect. The presence of the heat transfer fins 31 increases the heat exchange area, so that the heat in the heat exchange cold plate 30 can be transferred to the energy storage material 32 more quickly and fully.

[0084] The energy storage material 32 has specific thermophysical properties and can absorb and store cold. The cover plate 33 covering the energy storage material 32 plays a protective role, preventing external factors from interfering with the energy storage material 32, ensuring that it can stably perform the function of heat storage. In one embodiment, the energy storage material 32 can be water or eutectic salt.

[0085] Under different load thermal power consumption conditions, the working mode of the energy storage unit 3 is also different. When the load thermal power consumption is lower than or equal to the preset threshold, it means that the heat generated by the load at this time is relatively small, and the temperature of the coolant after cooling by the refrigeration module 2 may be too low, and there is excess cold. At this time, the energy storage unit 3 will play its role in storing cold energy, and transfer the excess cold energy in the coolant to the energy storage material 32 for storage through components such as the heat exchange cold plate 30 and the heat transfer fins 31, so that the temperature of the coolant can be maintained at a more appropriate level, avoiding the adverse effects of the coolant temperature being too low on the entire heat dissipation system and the load.

[0086] When the load thermal power consumption is greater than the preset threshold, the large amount of heat generated by the load will cause the coolant to absorb more heat, resulting in a trend of increasing the coolant temperature. In this case, the cold previously stored in the energy storage unit 3 will come into play. Through the reverse heat transfer effect of the heat exchange cold plate 30, the heat transfer fins 31 and other components, the cold stored in the energy storage material 32 is transferred back to the coolant, thereby ensuring the stability of the coolant temperature, so that the heat dissipation device can continue to effectively dissipate heat for the load and maintain the normal operation of the load.

[0087] In one embodiment, since this embodiment is aimed at devices such as lasers that have high temperature requirements, materials with corresponding phase change temperatures can be selected as energy storage materials 32 according to the target temperatures of different devices, so as to perform emergency heat dissipation for the entire liquid cooling device.

[0088] In one embodiment, referring to Figure 5A temperature sensor 17 is provided at the input end of the pipeline flowing through the load, and the temperature sensor 17 is used to monitor the liquid supply temperature. The liquid supply module 1 also includes a flow meter 5, a filter 6 and a thermometer 7. The flow meter 5 and the filter 6 are sequentially arranged at the output end of the circulating water pump 11, and the thermometer 7 is arranged in the pipeline between the other end of the pipeline flowing through the load and the evaporator 20. The flow meter 5 and the temperature sensor 17 are used to measure the liquid supply flow rate and the liquid supply temperature respectively, the thermometer 7 can measure the return liquid temperature, and the filter 6 is used to filter the coolant.

[0089] In order to avoid the energy storage unit 3 from affecting the measured liquid supply temperature, in one embodiment, the temperature sensor 17 needs to be arranged between the energy storage unit 3 and one end of the pipeline flowing through the load. At this time, the temperature of the coolant obtained by the temperature sensor 17 is the temperature after the energy storage material 32 in the energy storage unit 3 absorbs or releases heat. By using this temperature as the liquid supply temperature, the influence of the energy storage unit 3 on the liquid supply temperature can be eliminated, and the temperature can be raised or lowered better according to the difference between the liquid supply temperature and the target temperature.

[0090] The present invention arranges a compression unit 21 in the liquid cooling device and a semiconductor refrigerator 12 on the outer wall of the water tank 10, and controls the cooling capacity of the coolant in the evaporator 20 by controlling the power of the compression unit 21 and its hot gas bypass. At the same time, the cooling or heating of the semiconductor refrigerator 12 can be controlled by controlling the power polarity of the semiconductor refrigerator 12, and the power can be controlled by controlling the current of the semiconductor refrigerator 12, so as to accurately control the temperature of the coolant in the water tank 10; high-precision temperature control can be achieved to ensure that the accuracy of the liquid supply temperature meets the temperature control accuracy requirements of the load.

[0091] Embodiment 2:

[0092] In Example 1, a liquid cooling device with high-precision temperature control capability is proposed. In this embodiment, a liquid cooling method with high-precision temperature control capability is proposed. Figure 7 As shown, including:

[0093] Step 101: The circulating water pump 11 transfers the coolant in the water tank 10 to the pipeline passing through the load to absorb the heat generated by the load.

[0094] Among them, the circulating water pump 11 serves as the power source for the circulation of the coolant in the entire liquid cooling system. After starting, the coolant will be extracted from the water tank 10. Under the action of the circulating water pump 11, the coolant in the water tank 10 is sucked from its input end, and then pushed out from the output end of the circulating water pump 11 at a certain pressure and flow rate through the operation of the impeller and other components inside the water pump, and transmitted to the pipeline flowing through the load. When the coolant flows through the load, since the load generates heat during operation, according to the principle of heat transfer, the heat will be transferred from the high-temperature load to the relatively low-temperature coolant, so that the coolant can fully absorb the heat generated by the load, and the temperature of the coolant itself will increase accordingly.

[0095] Step 102 : The refrigerant stored in the evaporator 20 is used to absorb heat from the coolant after passing through the load, and the refrigerant after absorbing heat is compressed by the compression unit 21 , and the compressed refrigerant is re-condensed and flows back into the evaporator 20 .

[0096] When the coolant that has absorbed the load heat in step 101 flows through the evaporator 20, refrigerant is stored in the evaporator 20. Since the temperature of the coolant is higher than the temperature of the refrigerant in the evaporator 20 at this time, according to the heat transfer principle, the heat in the coolant will be absorbed by the refrigerant in the evaporator 20. In this process, the temperature of the coolant will gradually decrease, and the refrigerant will change from liquid to gas due to the absorption of heat, thereby realizing the transfer of heat from the coolant to the refrigerant.

[0097] After the gaseous refrigerant flows out from the output end of the evaporator 20, it enters the input end of the compression unit 21. The compression unit 21 compresses the gaseous refrigerant after absorbing heat through a specific compression mechanism (for example, using a compressor to compress the gaseous refrigerant to reduce its volume and increase its pressure). During the compression process, the internal energy of the gaseous refrigerant increases, and the temperature also rises accordingly, turning into a high-temperature and high-pressure gaseous refrigerant.

[0098] The high-temperature and high-pressure gaseous refrigerant then flows out from the output end of the compression unit 21, and then undergoes a series of condensation processes (such as passing through components such as the condenser, using its special structural design, such as heat dissipation fins or cooling pipes, etc. to increase the heat dissipation area and improve the heat dissipation efficiency, so that the gaseous refrigerant exchanges heat with the surrounding environment, the temperature gradually decreases, and finally changes from gas to liquid), and then recondenses and flows back to the evaporator 20. In this way, the refrigerant completes a cycle of absorbing heat from the evaporator 20 to become gaseous, being compressed by the compression unit 21, and then condensing and flowing back to the evaporator 20, so as to participate in the absorption of the heat of the coolant again and continuously achieve the cooling effect on the coolant.

[0099] Step 103: The compression unit 21 and / or the semiconductor refrigerator 12 regulates its own working state according to the liquid supply temperature and the target temperature of the load, so that the liquid supply temperature continuously approaches the target temperature.

[0100] The liquid supply temperature is the temperature of the coolant in the pipeline flowing into the load.

[0101] In one embodiment, Figure 8 As shown, when the liquid supply temperature is less than or equal to the target temperature -1°C, the hot gas in the compression unit 21 is bypassed to the evaporator 20, and the power polarity of the semiconductor refrigerator 12 is controlled so that the part of the semiconductor refrigerator 12 adhering to the wall of the water tank 10 becomes a hot end, so as to heat the water tank 10; the specific measures and principles include:

[0102] The hot gas in the compression unit 21 is bypassed to the evaporator 20. Under normal circumstances, the refrigerant processed by the compression unit 21 will go through a series of processes to realize the refrigeration cycle, but at this time, in order to increase the temperature, the bypass passage is opened to allow the hot gas in the compression unit 21 to enter the evaporator 20. After these hot gases enter the evaporator 20, they will exchange heat with the refrigerant in the evaporator 20, so that the temperature of the refrigerant in the evaporator 20 increases. After the temperature of the refrigerant in the evaporator 20 increases, the heat exchange between it and the coolant in the pipeline flowing through the load will change. Originally, the refrigerant absorbed the heat of the coolant to cool down. Now, as the temperature of the refrigerant increases, its ability to transfer heat to the coolant is enhanced, thereby achieving the effect of increasing the temperature of the coolant, and then increasing the supply temperature. At the same time, the power polarity of the semiconductor refrigerator 12 is controlled so that the wall portion of the semiconductor refrigerator 12 and the water tank 10 become the hot end. The semiconductor refrigerator 12 realizes cooling or heating based on the Peltier effect of semiconductor materials. When the polarity of the power supply is changed, the working mode is changed, and the part close to the water tank 10 becomes the hot end, which releases heat to the water tank 10, so that the temperature of the coolant in the water tank 10 increases, and further increases the temperature of the supply liquid output from the water tank 10. Through the synergistic effect of these two measures, the supply liquid temperature can be increased relatively quickly and effectively, making it closer to the target temperature and meeting the temperature requirements of the load.

[0103] In one embodiment, Figure 8 As shown, when the liquid supply temperature is greater than or equal to the target temperature + 1°C, the compression unit 21 is operated at the highest frequency, and the power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the wall portion of the water tank 10 become the cold end, so as to cool the water tank 10; the specific measures and principles include:

[0104] The compression unit 21 is made to work at the highest frequency. The compression unit 21 is mainly responsible for compressing the refrigerant in the liquid cooling system to realize the refrigeration cycle. When working at the highest frequency, the compression degree of the gaseous refrigerant will be increased, so that the temperature of the refrigerant will rise more after compression, so that more heat can be released in subsequent condensation and other links, and the temperature of the coolant can be reduced more efficiently, thereby reducing the supply temperature of the liquid output from the water tank 10. At the same time, the power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the wall part of the water tank 10 become the cold end. Based on the Peltier effect, the semiconductor refrigerator 12 after changing the power polarity will absorb heat from the outer wall of the water tank 10, so that the temperature of the coolant in the water tank 10 is reduced, thereby effectively reducing the supply temperature. Through the coordinated cooperation of these two measures, the supply temperature can be quickly reduced to near the target temperature, ensuring that the load operates at an appropriate temperature.

[0105] like Figure 8 and Fig. 9 As shown, when the liquid supply temperature is between the target temperature -1°C and the target temperature +1°C, the frequency of the compression unit 21 is adjusted until the liquid supply temperature reaches between the target temperature -x°C and the target temperature +x°C, and the current frequency of the compression unit 21 is maintained, where x is greater than 0 and x is less than 1. Specific measures and principles include:

[0106] The frequency change of the compression unit 21 will affect the degree of compression of the refrigerant and the efficiency of the refrigeration cycle, and thus affect the temperature of the coolant. The supply temperature is continuously monitored and the frequency of the compression unit 21 is finely adjusted according to the difference between the supply temperature and the target temperature. For example, if the supply temperature is slightly higher than the target temperature, the frequency of the compression unit 21 can be appropriately increased to speed up the refrigeration cycle, thereby reducing the coolant temperature; conversely, if the supply temperature is slightly lower than the target temperature, the frequency of the compression unit 21 can be appropriately reduced to slow down the refrigeration cycle and increase the coolant temperature. Until the supply temperature reaches between the target temperature -x°C and the target temperature +x°C, maintaining the current frequency of the compression unit 21 at this time can stabilize the supply temperature within this more precise range, providing more precise temperature control for the load, meeting the heat dissipation requirements of loads with higher temperature requirements, and ensuring that the load operates normally under appropriate temperature conditions.

[0107] When the liquid supply temperature reaches the target temperature -x°C to the target temperature +x°C, the liquid supply temperature needs to be fine-tuned. In one embodiment, Fig.10 and Fig.11As shown, when the liquid supply temperature is between the target temperature -x°C and the target temperature, the power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the wall portion of the water tank 10 become the hot end, and the input current of the semiconductor refrigerator 12 is adjusted according to the deviation between the liquid supply temperature and the target temperature to control the heating temperature of the semiconductor refrigerator 12 to increase the liquid supply temperature; the specific operation and principle include:

[0108] The power polarity of the semiconductor refrigerator 12 is controlled so that the part of the semiconductor refrigerator 12 adhering to the wall of the water tank 10 becomes the hot end. The semiconductor refrigerator 12 works based on the Peltier effect of semiconductor materials. When the power polarity is adjusted, its working mode changes, and the part adhering to the wall of the water tank 10 begins to release heat to the outside, playing a role in heating the water tank 10. By changing its working mode, it is transformed into a heating state.

[0109] The input current of the semiconductor refrigerator 12 is finely adjusted according to the deviation value between the liquid supply temperature and the target temperature. The deviation value between the liquid supply temperature and the target temperature can accurately reflect the degree of difference between the current liquid supply temperature and the target temperature. When the deviation value is large, it means that the liquid supply temperature is much lower than the target temperature, and the liquid supply temperature needs to be increased significantly at this time. Then it is necessary to increase the input current of the semiconductor refrigerator 12 accordingly. After the input current increases, the charge movement speed inside the semiconductor refrigerator 12 is accelerated, and the heating effect based on the Peltier effect will be enhanced, so that it releases more heat to the water tank 10, so that the temperature of the coolant in the water tank 10 can be increased more quickly, thereby increasing the liquid supply temperature. On the contrary, when the deviation value is small, it means that the liquid supply temperature is already close to the target temperature, and only a small adjustment is needed. At this time, the input current of the semiconductor refrigerator 12 is appropriately reduced to reduce its heating temperature accordingly to avoid excessive heating causing the liquid supply temperature to exceed the target temperature. By dynamically adjusting the input current according to the deviation value, the heating temperature of the semiconductor refrigerator 12 can be accurately controlled, and the liquid supply temperature can be finely adjusted so that it can steadily and accurately approach the target temperature.

[0110] In one embodiment, Fig.10 and Fig.11 As shown, when the liquid supply temperature is between the target temperature and the target temperature + x°C, the power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the wall portion of the water tank 10 become the cold end, and the input current of the semiconductor refrigerator 12 is adjusted according to the deviation between the liquid supply temperature and the target temperature to control the cooling temperature of the semiconductor refrigerator 12 and reduce the liquid supply temperature. The specific operation and principle include:

[0111] The power polarity of the semiconductor refrigerator 12 is controlled so that the semiconductor refrigerator 12 and the part of the water tank 10 that is attached to the wall become the cold end. According to the Peltier effect, after the power polarity is changed, the part of the semiconductor refrigerator 12 that is attached to the water tank 10 will absorb heat from the outer wall of the water tank 10, enter the cooling mode, and start to cool the coolant in the water tank 10. This is the initial operation to reduce the temperature of the supply liquid, and the semiconductor refrigerator 12 is switched to the cooling state by adjusting the power polarity.

[0112] The input current of the semiconductor refrigerator 12 is finely adjusted according to the deviation between the liquid supply temperature and the target temperature. When the deviation between the liquid supply temperature and the target temperature is large, that is, the liquid supply temperature is much higher than the target temperature, the liquid supply temperature needs to be reduced significantly. At this time, the input current of the semiconductor refrigerator 12 should be increased. As the input current increases, the cooling effect of the semiconductor refrigerator 12 based on the Peltier effect is enhanced, and the speed at which it absorbs heat from the outer wall of the water tank 10 is accelerated, which can more quickly reduce the temperature of the coolant in the water tank 10, thereby effectively reducing the liquid supply temperature. When the deviation value is small, it indicates that the liquid supply temperature is close to the target temperature and only needs to be fine-tuned. At this time, the input current of the semiconductor refrigerator 12 is appropriately reduced to reduce its cooling temperature accordingly, so as to prevent excessive cooling from causing the liquid supply temperature to be lower than the target temperature. By flexibly adjusting the input current according to the deviation value, the cooling temperature of the semiconductor refrigerator 12 can be accurately controlled, and the precise adjustment of the liquid supply temperature can be achieved, so that it can be stabilized near the target temperature, providing a stable and suitable temperature environment for the load.

[0113] In summary, by accurately controlling the power polarity of the semiconductor refrigerator 12 when the liquid supply temperature is in different intervals and finely adjusting its input current according to the deviation between the liquid supply temperature and the target temperature, a more precise and accurate control of the liquid supply temperature can be achieved. Whether raising or lowering the liquid supply temperature, it can be made closer to the target temperature, which fully reflects the high precision and flexibility of the liquid cooling device proposed in this embodiment in temperature control, and effectively ensures that the load works normally under appropriate temperature conditions.

[0114] Regarding the specific structure of the liquid cooling device with high-precision temperature control capability, please refer to Example 1 and will not be repeated in this embodiment.

[0115] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid cooling device with high-precision temperature control capability, characterized in that: include: A liquid supply module (1) and a refrigeration module (2); the liquid supply module (1) comprises a water tank (10) and a circulating water pump (11), and the outer wall of the water tank (10) is provided with a semiconductor refrigerator (12); the refrigeration module (2) comprises an evaporator (20) and a compression unit (21); The output end of the water tank (10) is connected to the input end of the circulating water pump (11), the output end of the circulating water pump (11) is connected to one end of a pipeline flowing through a load, the other end of the pipeline flowing through the load is connected to the input end of the water tank (10), and the pipeline between the other end of the pipeline flowing through the load and the water tank (10) is arranged in the evaporator (20); The output end of the evaporator (20) is connected to the input end of the compression unit (21), and the output end of the compression unit (21) is connected to the input end of the evaporator (20); The circulating water pump (11) is used to transfer the coolant in the water tank (10) to the pipeline flowing through the load to absorb the heat generated by the load; The refrigerant stored in the evaporator (20) is used to absorb heat from the cooling liquid after passing through the load, and the refrigerant after absorbing heat is compressed by the compression unit (21), and the compressed refrigerant is recondensed and flows back into the evaporator (20); The compression unit (21) and / or the semiconductor refrigerator (12) are used to regulate their own working state according to the supply liquid temperature and the target temperature of the load, so that the supply liquid temperature continuously approaches the target temperature, wherein the supply liquid temperature is the temperature of the coolant in the pipeline flowing into the load.

2. The liquid cooling device with high-precision temperature control capability according to claim 1, characterized in that: The liquid supply module (1) also includes a cold plate (13), a first condenser (14), a liquid storage tank (15) and a liquid supply water pump (16); The liquid storage tank (15), the liquid supply water pump (16), the cold plate (13) and the first condenser (14) are connected in sequence along a pipeline, and the output end of the first condenser (14) is connected to the input end of the liquid storage tank (15); the cold plate (13) is arranged on one side of the semiconductor refrigerator (12); The liquid storage tank (15) is used to store cooling liquid, the liquid supply pump (16) is used to transfer the cooling liquid in the liquid storage tank (15) to the cold plate (13), the cooling liquid in the cold plate (13) is used to exchange heat with the semiconductor refrigerator (12) and then flow into the first condenser (14), the first condenser (14) is used to cool the cooling liquid after absorbing heat, and the cooled cooling liquid flows back into the liquid storage tank (15).

3. The liquid cooling device with high-precision temperature control capability according to claim 1, characterized in that: The refrigeration module (2) further comprises a bypass solenoid valve (22), one end of the bypass solenoid valve (22) being connected to the output end of the compression unit (21), and the other end of the bypass solenoid valve (22) being connected to the input end of the evaporator (20); The bypass solenoid valve (22) is opened to transfer the hot gas in the compression unit (21) to the input end of the evaporator (20), thereby increasing the temperature of the refrigerant in the evaporator (20), thereby controlling the refrigeration capacity of the refrigeration module (2).

4. The liquid cooling device with high-precision temperature control capability according to claim 1, characterized in that: The refrigeration module (2) further comprises a second condenser (23); the output end of the compression unit (21) is connected to the input end of the second condenser (23), and the output end of the second condenser (23) is connected to the input end of the evaporator (20); The liquid refrigerant in the evaporator (20) is converted into a gaseous refrigerant after heat exchange with the cooling liquid. The gaseous refrigerant is compressed by the compression unit (21) and becomes a high-temperature and high-pressure refrigerant. The high-temperature and high-pressure refrigerant flows through the second condenser (23) and becomes a liquid refrigerant again. The liquid refrigerant flows back into the evaporator (20) to dissipate heat for the cooling liquid after passing through the load.

5. The liquid cooling device with high-precision temperature control capability according to claim 1, characterized in that: The liquid cooling device also includes an energy storage unit (3) and an emergency water pump (4); The output end of the circulating water pump (11) is connected to the input end of the energy storage unit (3), and the output end of the energy storage unit (3) is connected to one end of a pipeline flowing through a load; one end of the emergency water pump (4) is connected to the input end of the energy storage unit (3), and the other end of the emergency water pump (4) is connected to the other end of the pipeline flowing through the load; When the liquid supply module (1) fails, the input end and the output end of the liquid supply module (1) are closed, the emergency water pump (4) is turned on, and the coolant flowing through the load is circulated and cooled through the emergency water pump (4) and the energy storage unit (3).

6. The liquid cooling device with high-precision temperature control capability according to claim 5, characterized in that: The energy storage unit (3) comprises a heat exchange cold plate (30), a heat transfer fin (31), a plurality of energy storage materials (32) and a cover plate (33); the energy storage materials (32) are sequentially arranged on both sides of the heat exchange cold plate (30); the heat transfer fin (31) is arranged on the heat exchange cold plate (30) and is located between every two energy storage materials (32); the cover plate (33) covers the energy storage material (32); The input end of the heat exchange cold plate (30) is connected to the output end of the liquid supply module (1), and the output end of the heat exchange cold plate (30) is connected to one end of a pipeline flowing through a load; the heat exchange cold plate (30) and the heat transfer fins (31) are used to transfer heat in the coolant to the energy storage material (32); When the supply liquid temperature is lower than or equal to a preset threshold, the energy storage unit (3) is used to store excess cold in the coolant; when the supply liquid temperature is greater than the preset threshold, the energy storage unit (3) is used to absorb heat in the coolant.

7. The liquid cooling device with high-precision temperature control capability according to claim 1, characterized in that: A temperature sensor (17) is provided at the input end of the pipeline flowing through the load, and the temperature sensor (17) is used to monitor the supply liquid temperature.

8. A liquid cooling method with high-precision temperature control capability, characterized in that: The method is applicable to a liquid cooling device with high-precision temperature control capability as claimed in any one of claims 1 to 7, comprising: The circulating water pump (11) transfers the coolant in the water tank (10) to the pipeline passing through the load to absorb the heat generated by the load; The refrigerant stored in the evaporator (20) absorbs heat from the cooling liquid after passing through the load, and the refrigerant after absorbing heat is compressed by the compression unit (21), and the compressed refrigerant is recondensed and flows back into the evaporator (20); The compression unit (21) and / or the semiconductor refrigerator (12) regulate their own working state according to the liquid supply temperature and the target temperature of the load so that the liquid supply temperature continuously approaches the target temperature, wherein the liquid supply temperature is the temperature of the coolant in the pipeline flowing into the load.

9. The liquid cooling method with high-precision temperature control capability according to claim 8, characterized in that: The compression unit (21) and / or the semiconductor refrigerator (12) regulates its own working state according to the liquid supply temperature and the target temperature of the load so that the liquid supply temperature continuously approaches the target temperature, including: When the liquid supply temperature is less than or equal to the target temperature -1°C, the hot gas in the compression unit (21) is bypassed to the evaporator (20), and the power polarity of the semiconductor refrigerator (12) is controlled so that the part of the semiconductor refrigerator (12) adhering to the wall of the water tank (10) becomes a hot end, so as to heat the water tank (10); When the liquid supply temperature is greater than or equal to the target temperature + 1°C, the compression unit (21) is operated at the highest frequency, and the power polarity of the semiconductor refrigerator (12) is controlled so that the semiconductor refrigerator (12) and the wall portion of the water tank (10) become a cold end, so as to cool the water tank (10); When the liquid supply temperature is between the target temperature -1°C and the target temperature +1°C, the frequency of the compression unit (21) is adjusted until the liquid supply temperature reaches between the target temperature -x°C and the target temperature +x°C, and the current frequency of the compression unit (21) is maintained, wherein x is greater than 0 and x is less than 1.

10. The liquid cooling method with high-precision temperature control capability according to claim 9, characterized in that: The compression unit (21) and / or the semiconductor refrigerator (12) regulate their own working state according to the liquid supply temperature and the target temperature of the load so that the liquid supply temperature continuously approaches the target temperature, and further comprises: When the liquid supply temperature is between the target temperature -x°C and the target temperature, the power polarity of the semiconductor refrigerator (12) is controlled so that the part of the semiconductor refrigerator (12) adhering to the wall of the water tank (10) becomes a hot end, and the input current of the semiconductor refrigerator (12) is adjusted according to the deviation value between the liquid supply temperature and the target temperature to control the heating temperature of the semiconductor refrigerator (12) so as to increase the liquid supply temperature; When the liquid supply temperature is between the target temperature and the target temperature + x°C, the power polarity of the semiconductor refrigerator (12) is controlled so that the semiconductor refrigerator (12) and the wall-attached part of the water tank (10) become the cold end, and the input current of the semiconductor refrigerator (12) is adjusted according to the deviation value between the liquid supply temperature and the target temperature to control the cooling temperature of the semiconductor refrigerator (12) and reduce the liquid supply temperature.

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