Electronic device including a cover member

Abstract

An electronic device including a clad component is provided. A housing for an electronic device includes an outer titanium portion, an inner aluminum connected to the outer titanium portion, and an intermetallic interface disposed between the outer titanium portion and the inner aluminum, the intermetallic interface having a thickness disposed between the inner aluminum and the outer titanium portion.

Description

[0001] This patent application is a divisional application of Chinese patent application No. 202410550501.0, filed on May 6, 2024, entitled "Electronic device including a covering component".

[0002] Cross-references to related applications

[0003] This application claims priority to U.S. Provisional Patent Application No. 63 / 500,512, filed May 5, 2023, entitled “Electronic Device Including Clad Components,” the entire disclosure of which is incorporated herein by reference. Technical Field

[0004] The described embodiments generally relate to materials for housings, structures, and / or electronic devices. More specifically, embodiments of the invention relate to enclosure components for housings, structures, and / or electronic devices that offer improved aesthetic finishes, reduced weight, improved machinability, and reduced environmental impact. Background Technology

[0005] Electronic devices are ubiquitous in society, taking on a variety of forms from watches to computers. These devices, including portable electronic devices such as mobile phones, tablets, and watches, come into contact with various surfaces during use. Furthermore, the use, transportation, and storage of such devices can subject them to mechanical and thermal stresses.

[0006] Components used in these devices, such as housings or enclosures, can benefit from different combinations of properties exhibiting characteristics relevant to the use of the device. Housings for portable electronic devices can have combinations of properties such as strength, appearance, toughness, abrasion resistance, weight, corrosion resistance, thermal conductivity, electromagnetic shielding, and cost to enable the device to function as needed. Some materials may offer the desired performance level relative to some properties, but may not offer the optimal performance level relative to others. Furthermore, the combination of multiple materials in complex design configurations can introduce complexity into conventional manufacturing processes, typically increasing cost and processing time. Therefore, it may be desirable to provide a device housing comprising multiple materials to achieve a desired combination of varying properties, along with an efficient process for forming these materials. Summary of the Invention

[0007] According to some aspects of this disclosure, a housing for an electronic device includes an outer titanium portion, an inner metal connected to the outer titanium portion, and an intermetallic compound disposed between the inner metal and the outer titanium portion. The inner metal may be a different metal from the outer titanium portion. The intermetallic compound may have a thickness of less than 1 µm.

[0008] In some examples, the intermetallic compound may have a thickness of less than 200 nm. In some examples, the inner metal may include aluminum. In some examples, the intermetallic compound may include Al3Ti. In some examples, the intermetallic compound may not contain discrete oxide particles.

[0009] In some examples, the intermetallic compound may comprise a continuous layer between the inner metal and the outer titanium portion. In some examples, the intermetallic compound may separate the inner metal from the outer titanium portion. In some examples, the intermetallic compound may comprise a discontinuous layer between the inner metal and the outer titanium portion. In some examples, the inner metal may contact the outer titanium portion.

[0010] According to some examples, a housing for an electronic device includes an outer titanium portion that at least partially defines a first bonding feature and an inner aluminum portion connected to the outer titanium portion, the inner aluminum portion at least partially defining the first bonding feature. A first surface of the outer titanium portion defining the first bonding feature may include a first plurality of holes having a first hole density and a first average hole depth. A second surface of the inner aluminum portion defining the first bonding feature may include a second plurality of holes having a second hole density and a second average hole depth. The second hole density may be greater than the first hole density, and the first average hole depth may be greater than the second average hole depth.

[0011] In some examples, the first pore density is approximately 8% to 45%; and the first surface has a first pore depth of 50µm to 110µm and a first pore diameter of 50µm to 110µm. In some examples, the second pore density is approximately 30% to 65%; and the second surface has a second pore depth of 25µm to 50µm.

[0012] In some examples, the housing may further include an intermetallic compound, comprising Al3Ti, disposed between the outer titanium portion and the inner aluminum portion. In some examples, the intermetallic compound may include a first layer and a second layer different from the first layer; and the intermetallic compound may have a thickness of less than 500 nm. In some examples, the intermetallic compound may include a continuous layer with a thickness of less than 200 nm. In some examples, the intermetallic compound may include a discontinuous layer with a thickness of less than 150 nm. In some examples, the intermetallic compound may be free of discrete oxide particles.

[0013] According to some examples, a housing for a portable electronic device includes a first titanium-clad sidewall portion that at least partially defines the internal volume and outer surface of the portable electronic device. The first titanium-clad sidewall portion may include a metallic outer portion and an inner portion bonded to the metallic outer portion. The metallic outer portion may include a first material having a first set of material properties, and the metallic outer portion may at least partially define a first bonding feature. The inner portion may include a second material having a second set of material properties independent of the first set of material properties, and the inner portion may at least partially define the first bonding feature. The surface of the metallic outer portion defining the first bonding feature may have a pore density of about 8% to 45%, a pore depth of 50 µm to 110 µm, and a pore diameter of 50 µm to 110 µm.

[0014] In some examples, the housing may also include a moldable material that mechanically engages the first engagement feature. In some examples, the moldable material may be at least partially disposed in the holes in the surface of the outer metal portion.

[0015] In some examples, the outer metal portion may include titanium, and the inner portion may include aluminum. In some examples, the first titanium-clad sidewall portion may also include an intermetallic compound disposed between the outer metal portion and the inner portion, and the intermetallic compound may include a continuous layer having a thickness of less than 200 nm. In some examples, the first titanium-clad sidewall portion may also include an intermetallic compound disposed between the outer metal portion and the inner portion, and the intermetallic compound may include a discontinuous layer having a thickness of less than 150 nm.

[0016] In some examples, the surface defining the inner portion of the first engagement feature may have a pore density of about 30% to 65% and a pore depth of 25µm to 50µm. Attached Figure Description

[0017] This disclosure will be readily understood from the following detailed description taken in conjunction with the accompanying drawings, in which the same reference numerals denote the same structural elements:

[0018] Figure 1 An electronic device is shown that includes a housing and casing formed using the covering material described herein.

[0019] Figure 2 A perspective view of the electronic device is shown.

[0020] Figure 3 An exploded view of the electronic device is shown.

[0021] Figure 4 An exploded view of the casing of the electronic device is shown.

[0022] Figure 5This shows a perspective view of a portion of the casing of an electronic device.

[0023] Figure 6 This shows a perspective view of a portion of the casing of an electronic device.

[0024] Figure 7 This shows a close-up perspective view of a portion of the casing of an electronic device.

[0025] Figure 8 A outline diagram of the casing of an electronic device is shown.

[0026] Figure 9 A flowchart is shown for a method of forming a coating material using roll forming.

[0027] Figure 10A and Figure 10B A microscopic cross-sectional view of the coating material is shown.

[0028] Figure 11 A flowchart is shown for a method of forming a coating material using direct metal deposition.

[0029] Figure 12 A flowchart is shown for a method of forming a coating material using nanopulse laser welding.

[0030] Figure 13A , Figure 13B , Figure 13C , Figure 13D and Figure 13E A cross-sectional view of the method of etching the coating material is shown.

[0031] Figure 13F , Figure 13G and Figure 13H It shows the way Figures 13A to 13E Microscopic cross-sectional view of the portion of the coating material etched by the method.

[0032] Figure 13I A cross-sectional view of the etched coating material is shown.

[0033] Figure 14 A flowchart is shown of a method for forming a covering component for an electronic device. Detailed Implementation

[0034] Reference will now be made in detail to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a single preferred embodiment. Rather, it is intended to cover alternatives, modifications, and equivalents that may be included within the substance and scope of the described embodiments as defined by the appended claims.

[0035] The following disclosure relates to composite (e.g., encapsulated) housings or enclosures for electronic devices, and methods of forming them. Components of a composite housing or enclosure may include: an outer or outer portion having a first set of material properties, also referred to as a shell; and an inner or inner portion having a second set of material properties independent of the first set, also referred to as a core. The outer portion may include a metallic material, such as titanium. The inner portion may include a metallic material, such as aluminum. The outer and inner portions may be welded, bonded, adhered, or otherwise joined together such that they form a housing or enclosure part and act as a composite body. In some examples, the composite body may be treated as an integral body for machining, manufacturing, assembly, or other processes. The outer and inner portions may together define a mating feature that can be mechanically engaged with a moldable material positioned at a surface of the composite component, including the outer and inner portions. The moldable material can mechanically engage the mating feature and attach or bond the composite housing to one or more components, mounts, or enclosures.

[0036] In some examples, the outer portion may include a metal that is more corrosion-resistant and stronger than the metal of the inner portion. The metal of the outer portion may also have desired decorative appearance and thermal properties. In some examples, the inner portion may include a different metal that is more environmentally friendly, has greater availability, lower density, is easier to machine, and / or easier to weld compared to the metal of the outer portion. For example, the material and / or geometry of the inner portion can be selected to achieve desired levels of strength, weight, stiffness, cost, thermal conductivity, electromagnetic transparency, machinability, carbon emissions, recycling capacity, other properties, or combinations thereof. Simultaneously, the material and / or geometry of the outer portion can be selected independently to achieve any of the aforementioned properties or desired levels of hardness, corrosion resistance, scratch resistance, decorative finish, other properties, or combinations thereof. Forming the housing of electronic devices from composite materials allows the housing to achieve desired properties of multiple materials included in the composite material.

[0037] In some examples, the composite material can be formed using a process that minimizes the thickness of the intermetallic compound formed between the outer and inner portions, thereby improving adhesion between the outer and inner portions. The selected process may further maximize the respective hardness of the outer and inner portions. In some examples, the selected process may include a roll bonding process performed at reduced temperatures, which reduces the thickness of the intermetallic compound. In some examples, the roll bonding process may include a heat treatment step that increases the hardness of the outer and inner portions without excessively increasing the thickness of the intermetallic compound. In some examples, the selected process may include a pulsed laser welding process or a direct metal deposition process.

[0038] The following will be referenced Figures 1 to 14These examples and other examples will be discussed here. However, those skilled in the art will readily understand that the detailed descriptions of these figures given herein are for illustrative purposes only and should not be construed as limiting. Furthermore, as used herein, a system, method, article, component, feature, or sub-feature including at least one of the first, second, or third options should be understood to mean a system, method, article, component, feature, or sub-feature that may include one of each listed option (e.g., only one first option, only one second option, only one third option), multiple of a single listed option (e.g., two or more first options), two options simultaneously (e.g., one first option and one second option), or combinations thereof (e.g., two first options and one second option).

[0039] The methods described herein can be used to form composite materials (also known as coating materials) that have improved adhesion and hardness and are aesthetically attractive to the surfaces of housings and / or enclosures of consumer devices. Figure 1 An example consumer product that can be manufactured using the methods described herein is shown. Figure 1 The invention includes a portable telephone 102, a tablet computer 104, a watch 106, and a portable computer 108, each of which may include a housing and / or a casing. The portable telephone 102, tablet computer 104, watch 106, and portable computer 108 are designed to withstand impacts during normal use, such as scratches, drops, abrasions, breakage, and planing, and are also designed to withstand conditions known to corrode aluminum, aluminum alloys, and titanium-aluminum composite components. The composite materials formed by the methods detailed herein improve the bonding strength, hardness, appearance, thermal properties, weight, corrosion resistance, and machinability of the components of the portable telephone 102, tablet computer 104, watch 106, and portable computer 108.

[0040] Figure 2 A perspective view of electronic device 200 is shown. Figure 2 The electronic device 200 shown is a mobile wireless communication device (e.g., a smartphone). Figure 2 The smartphone is merely a representative example of a device that can be used in conjunction with the systems and methods disclosed herein. Electronic device 200 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant (“PDA”), tablet computer, computer, mobile communication device, Global Positioning System (GPS) unit, remote control device, or any other electronic device. Electronic device 200 may be referred to as an electronic device or consumer device.

[0041] Electronic device 200 may have a housing including a border strip or frame 202 defining an outer perimeter of electronic device 200. As described herein, the border strip 202 or a portion thereof may be or may include a composite component. In some examples, the border strip 202 may include several sidewall components, such as a first sidewall component 204, a second sidewall component 206, a third sidewall component 208 (opposite to the first sidewall component 204), and a fourth sidewall component (…). Figure 2 (Not shown in the text). As described herein, the aforementioned sidewall components may be composite components or may include composite components.

[0042] In some examples, some of the sidewall components can form antenna assemblies. Figure 2 (Not shown in the image). Therefore, one or more non-metallic materials can separate the sidewall components of the frame band 202 from each other to electrically isolate the respective sidewall components. For example, a first separating material 212 separates the first sidewall component 204 from the second sidewall component 206, and a second separating material 214 separates the second sidewall component 206 from the third sidewall component 208. As a non-limiting example, the aforementioned materials may include one or more electrically inert or electrically insulating materials, such as plastics and / or resins.

[0043] Electronic device 200 may also include a display assembly 216 (shown in dashed lines) covered by a protective cover 218. The display assembly 216 may include multiple layers, each providing a unique function. The display assembly 216 may be partially covered by a bezel 220 or frame that extends along the outer edge of the protective cover 218 and partially covers the outer edge of the display assembly 216. The bezel 220 may be positioned to conceal or shield any electrical and mechanical connections between the layers of the display assembly 216 and the flexible circuit connectors. Additionally, the bezel 220 may exhibit a uniform thickness. For example, the bezel 220 may include a thickness that does not typically change in the X and Y dimensions.

[0044] In addition, such as Figure 2 As shown, the example display assembly 216 may include a notch 222, which represents a missing display assembly 216. The notch 222 may allow a vision system to provide information to the electronic device 200 for object recognition, such as facial recognition. In this respect, the electronic device 200 may include a masking layer having an opening (as shown by the dashed line) designed to hide or obscure the vision system while allowing the vision system to provide object recognition information. The protective cover 218 may be formed of a transparent material such as glass, plastic, sapphire, or similar transparent materials. In this respect, the protective cover 218 may be referred to as a transparent cover, a transparent protective cover, or (when the protective cover 218 includes glass) protective glass. Figure 2As shown, the protective cover 218 includes an opening 224, which can represent a single opening in the protective cover 218. The opening 224 allows acoustic energy (in the form of audible sound) to be transmitted to the electronic device 200, which can be transmitted via a microphone of the electronic device 200. Figure 2 (Not shown in the image) is received. Additionally, opening 224 allows acoustic energy (in the form of audible sound) to be transmitted outside the electronic device 200, which can be received by the audio module of the electronic device 200 (…). Figure 2 (Not shown in the image) is generated. According to some examples, electronic device 200 may not include buttons commonly found in electronic devices, such as a "home button".

[0045] Electronic device 200 may also include a port 226 of a connector designed to receive cable assemblies. Port 226 allows electronic device 200 to transmit (send and receive) data information and allows electronic device 200 to receive electrical energy to charge battery assemblies. Therefore, port 226 may include an end electrically coupled to the connector.

[0046] Electronic device 200 may include several openings. For example, electronic device 200 may include opening 228, which allows for the installation of an additional audio module of electronic device 200. Figure 2 (Not shown) The electronic device 200 emits acoustic energy outside of itself. The electronic device 200 may include an opening 232 that allows a microphone of the electronic device to receive acoustic energy. The electronic device 200 may include a first fastener 234 and a second fastener 236 designed to be fastened to a guide rail coupled to a protective cover 218. In this way, the first fastener 234 and the second fastener 236 are designed to couple the protective cover 218 to the frame strip 202.

[0047] Electronic device 200 may include several control inputs designed to provide commands to electronic device 200. For example, electronic device 200 may include a first control input 242 and a second control input 244. As a non-limiting example, the aforementioned control inputs may be used to adjust the amount of visual information presented on display assembly 216 or sound energy output by audio module. Controls may include one of a switch, sensor, or button designed to generate commands to processor circuitry. The control inputs may extend at least partially through openings in sidewall members. For example, second sidewall member 206 may include opening 246 that receives the first control input 242. Reference hereinafter. Figure 3 Further details of the exemplary electronic device are provided.

[0048] Figure 3 An exploded view of electronic device 300 is shown. Figure 3The illustrated electronic device 300 is a smartphone, but is merely a representative example of a device that can be used with or incorporates the systems and methods described herein. As described with respect to electronic device 200, electronic device 300 may also correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant (“PDA”), tablet computer, computer, mobile communication device, GPS unit, remote control device, and other electronic devices. In some examples, electronic device 300 may include some or all of the features described herein with respect to electronic device 200.

[0049] Electronic device 300 may have a housing including a bezel strip 302 that at least partially defines the external portion (such as the outer periphery) of electronic device 300. As described above Figure 2 The border strip 202 described herein may include several sidewall components, such as a first sidewall component 304, a second sidewall component 306, a third sidewall component 308 (opposite to the first sidewall component 304), and a fourth sidewall component 310 (opposite to the second sidewall component 306). As described herein, the aforementioned sidewall components may be composite components or may include composite components. As described herein, the border strip 302 may also include one or more non-metallic materials that separate and / or connect the sidewall components of the border strip 302 to each other. For example, a separating material 314 may separate and / or connect the second sidewall component 306 to the third sidewall component 308.

[0050] The housing including the frame band 302 may include one or more features, such as feature 322, that receive or couple to other components of the device 300. For example, the frame band 302 may include any number of features, such as holes, cavities, recesses, and other mating features, configured to receive and / or attach to one or more components of the device 300. The electronic device 300 may include internal components such as processors, memory, circuit boards, batteries, and sensors. Such components may be disposed within an internal volume at least partially defined by the frame band 302 and may be attached to the frame band 302 via an inner surface formed into, defined by, or otherwise part of the frame band, attachment features such as feature 322, threaded connectors, studs, columnar members, and / or other fixing features.

[0051] Device 300 may include internal components, such as a system-in-package (SiP) 326, which includes one or more integrated circuits, such as a processor, sensors, and memory. Device 300 may also include a battery 324 housed within an internal volume of device 300. Device 300 may also include one or more sensors, such as optical sensors or other sensors, which can sense or otherwise detect information about the environment outside the internal volume of device 300. Additional components, such as a haptic engine, may also be included in device 300. Electronic device 300 may also include a display assembly 316 similar to display assembly 216 described herein. In some examples, display assembly 316 may be received by a bezel strip 302 and / or attached to the bezel strip via one or more attachment features.

[0052] The electronic device 300 may also include a motherboard 320 that provides structural support. As described herein, the chassis 320 may comprise a rigid material such as metal, or may comprise a composite construction. The motherboard 320 may also be coupled to a bezel strip 302. Thus, the motherboard 320 provides an electrical ground path for electrically coupling components to the motherboard. The electronic device 300 may alternatively or additionally include a backplate 330 having a cladding layer and / or other attachment features, such that one or more components of the electronic device 300 may be attached to the backplate 330, for example, via soldering. The backplate 330 may form conductive pathways for connecting components of the electronic device 300. In some examples, the backplate 330 may be attached to the bezel strip 302 of the device 300 via one or more attachment features such as feature 322.

[0053] The outer surface of the electronic device 300 may also be defined by a rear cover 340 that is coupled to the bezel strip 302. In this respect, the rear cover 340 may be combined with the bezel strip 302 to form a housing or enclosure of the electronic device 300, wherein the housing or enclosure (including the bezel strip 302 and the rear cover 340) at least partially defines the internal volume. The rear cover 340 may comprise a transparent material such as glass, plastic, sapphire, or another transparent material.

[0054] An enclosure including a frame band 302 with one or more composite components can meet internal dimensional requirements defined by internal components. For example, the structure of an enclosure including a composite frame band 302 can be uniquely or primarily defined or limited by the internal components that the enclosure is designed to house. That is, because an enclosure including a composite frame band 302 can be extremely lightweight and robust, the enclosure can be shaped to house internal components in a dimensionally efficient manner, unconstrained by factors beyond component dimensions, such as the need for additional structural elements. As described herein, the first sidewall component 304, the second sidewall component 306, the third sidewall component 308, and the fourth sidewall component 310 of the frame band 302 can be formed by a variety of processes. In some examples, these forming processes can allow the enclosure and / or the frame band 302 to have specially customized detailed shapes or designs to meet one or more requirements (such as internal dimensional requirements) without the need for additional features to reinforce the structure of the enclosure. Additionally, traces of human intervention in the enclosure manufacturing process can be eliminated. In addition, other components of the electronic device 300 (such as individual internal structural components or external input components like chassis 320) may be formed of composite components or may include composite components as described herein.

[0055] While any number or variety of components of an electronic device (e.g., electronic device 300) may be formed of or may include composite components, the structure of these composite components may be, for example, a composite component including an external portion connected to an internal portion, as described herein. The structure and materials of the external and internal portions, as well as the composite component itself, can be applied not only to the specific examples discussed herein, but also to any combination of examples of any number or type. References below. Figure 4 Describe various examples of composite components.

[0056] Figure 4 Electronic devices (e.g., relative to) are shown Figures 1 to 3 An exploded view of the frame strip 402 of the housing or casing of the portable telephone 102, tablet computer 104, watch 106, portable computer 108, electronic device 200 or 300. As described herein, the frame strip 402 may include a composite component or a portion comprising one or more composite components, such as an external portion connected to an internal portion. For example, the frame strip 402 may include a first composite sidewall component 406, a second composite sidewall component 408, a third composite sidewall component 410 (opposite to the first composite sidewall component 406), and a fourth composite sidewall component 412 (opposite to the second composite sidewall component 408). In some examples, and as described herein as a non-limiting example, the first composite sidewall component 406, the second composite sidewall component 408, the third composite sidewall component 410, and the fourth composite sidewall component 412 may be separated and / or joined together by a material 414 that may include one or more electrically inert or electrically insulating materials (such as plastics and / or resins).

[0057] although Figure 4 The illustrated embodiment includes a frame strip 402 having a first composite sidewall component 406, a second composite sidewall component 408, a third composite sidewall component 410, and a fourth composite sidewall component 412 connected together. However, in some examples, as described herein, the housing or enclosure of the electronic device may include a single composite component having internal and external portions, or may be formed from a single composite component having internal and external portions. Furthermore, in some examples, the composite component may form portions of the housing or enclosure other than the sidewalls, such as the top portion, bottom portion, or any portion of the housing or enclosure. Further details of the first composite sidewall component 406, the second composite sidewall component 408, the third composite sidewall component 410, and the fourth composite sidewall component 412 are provided below.

[0058] Figure 5 A perspective view of composite component 510 is shown, which may be similar to that relative to... Figure 4 The first composite sidewall component 406, the second composite sidewall component 408, the third composite sidewall component 410, and the fourth composite sidewall component 412, or features including these composite sidewall components, are described. Composite component 510 may include an outer or external portion 522 connected to the inner or internal portion 524. In this example, the external portion 522 may at least partially define the outer surface of the housing or enclosure of the electronic device. The inner portion 524 may at least partially define the surface of the internal volume of the electronic device. Figure 5 As shown, the composite component 510 may include a plurality of features 532, 534, 536, which may serve as attachment features for other components of an electronic device, for example.

[0059] In some examples, the feature may be formed in one or both of the outer portion 522 and the inner portion 524 of the composite component 510. For example, the inner portion 524 of the composite component 510 may include a feature such as a hole 532. In some examples, the feature 532 may be a hole, recess, blind hole, or other feature formed in the inner portion 524 by a subtractive process (such as machining or etching). In some examples, the feature 532 may serve as an attachment feature for other components of an electronic device. The feature 532 may be configured to receive components of an electronic device, such as a button or input component. Although depicted as a hole 532, the feature 532 may take any desired form or shape. In some examples, the feature 532 may extend at least partially into a desired depth in the inner portion 524. Alternatively, however, the feature 532 may extend substantially entirely through the entire thickness of the inner portion 524.

[0060] In some examples, a feature may be formed in both the outer portion 522 and the inner portion 524 of the composite component 510. For example, a feature 534 may be formed in both the outer portion 522 and the inner portion 524 of the component 510, or may be defined by both the outer portion and the inner portion of the component. A feature 534 may be a hole or through-hole that at least partially passes through the outer portion 522 and the inner portion 524. Furthermore, although portions 522 and 524 are shown as having a relatively uniform thickness, in some examples, the thickness of the outer portion 522 and / or the inner portion 524 may vary at the location where a feature such as feature 534 is formed. A protruding feature (such as feature 536) may be formed in the inner portion 524, for example, by a machining process or an additive manufacturing process, and may serve as an attachment feature for other components of an electronic device. Although depicted as a protrusion defining a hole therethrough, feature 536 may include any desired shape or design.

[0061] As described herein, the internal portion 524 of the composite component 510 can be selected to possess a set of material properties required for forming features such as features 532, 534, and 536. For example, the material of the internal portion 524 can be selected to have one or a set of material properties that allow the internal portion 524 to be machinable without causing high levels of wear on machining tools, and / or to have machinability such as ease of welding. Additionally, the material of the internal portion 524 can be relatively inexpensive, so that material waste resulting from forming the features does not substantially increase production costs. The material of the internal portion 524 can be selected to be an environmentally friendly material, such as a recycled material. Furthermore, as described herein, the material of the external portion can be selected to have one or a set of material properties independent of the material properties of the internal portion 524, which allows the external portion 522 to have, for example, high levels of hardness and corrosion resistance. The material of the external portion 522 can be selected to have desired decorative appearance, thermal properties, etc.

[0062] In some examples, features formed in one or both of the outer portion 522 and the inner portion 524, such as features 532, 534, and 536, may have a primary dimension ranging from about a micrometer to up to about a millimeter or several millimeters or larger. In some cases, features such as feature 536 may have a primary dimension ranging from about 100 micrometers to about 1 millimeter. Furthermore, in some cases, features such as feature 536 may have a secondary dimension ranging from about 100 micrometers to about 1 millimeter.

[0063] In addition, such as Figure 5As shown, the outer portion 522 may have a substantially curved shape or profile that corresponds to the outer contour of the electronic device. The outer portion 522 may have any desired shape or profile. In some examples where the outer portion has a substantially curved shape or profile, the inner portion 524 may be positioned entirely behind or within the curve defining the curved profile of the outer portion 522. (Refer to below...) Figure 6 Additional details for external part 522 are provided.

[0064] Figure 6 It shows Figure 5 A perspective view of the composite component 510 of the housing. (See attached image.) Figure 6 As shown, one or more regions of the outer portion 522, such as region 544, can be removed, exposing at least some of the inner portions 524. The exposed surfaces of the inner portions 522 may be treated or otherwise processed to, for example, protect the exposed surfaces of the inner portions 522. In some examples, the outer portion 522 may comprise titanium or a titanium alloy, and the inner portion 524 may comprise aluminum. At region 544, the aluminum of the inner portion 524 is exposed to the outside, and the interface between the titanium of the outer portion 522 and the aluminum of the inner portion 524 may also be exposed.

[0065] In such examples, the interface between the materials of the two portions can form an electrical contact, and one of the materials of portions 522 and 524 is susceptible to or prone to electro-corrosion. Therefore, the area where the interface between the materials of portions 522 and 524 is exposed, such as region 544, can be processed or treated to prevent or inhibit electro-corrosion. One or more materials can be deposited over the interface between portions 522 and 524 at region 544 to prevent or inhibit electro-corrosion. Example materials may include, but are not limited to, polymeric materials, metallic materials, ceramic materials, or combinations thereof.

[0066] Alternatively, the geometry of the outer portion 522 and / or the inner portion 524 may be designed such that the interface between these portions is not exposed even when features such as feature 542 are formed in the outer portion 522. For example, the outer portion 522 may be thicker in the region 544 in which the feature is formed, so that the inner portion 524 is not exposed even when material is removed from the outer portion 524. The inner portion 524 may correspondingly thin in the region in which the outer portion 522 has increased thickness, so that the composite component 510 maintains a relatively uniform thickness.

[0067] Figure 7A perspective view of a portion of a composite component 710 is shown, which may include a pre-formed outer portion 722 connected to an inner portion 724. The composite component 710 may include a surface 726 defined by both the outer portion 722 and the inner portion 724. Although the surface 726 is depicted as including approximately equal areas defined by each portion, in some examples, one portion of the inner portion 722 or the outer portion 724 may define substantially more of the surface 726 than the other.

[0068] Surface 726 may include one or more engagement features formed thereon. For example, surface 726 may include a plurality of engagement features 732 formed on a portion of the surface defined by outer portion 722, and a plurality of engagement features 734 formed on a portion of the surface defined by inner portion 724 (e.g., surface 726 may include regions of engagement features 732 and regions of engagement features 734). As described herein, the engagement features 732, 734 may range in size from nanometer or micrometer-scale features to macroscopic features with millimeter-scale dimensions. In some examples, as described herein, the engagement features 732, 734 may have any desired shape for engaging moldable materials. For example, engagement features may include recesses, protrusions, or combinations thereof. In some examples, surface 726 may undergo various processes, such as machining, etching, deposition, etc., to form engagement features 732, 734 across regions of surface 726.

[0069] In some examples, engagement features 732, 734 may allow composite component 710 to be connected to a second component via mechanical engagement with a moldable material. For example, the moldable material may mechanically engage engagement features 732, 734 to connect component 710 to a component (such as relative to a second component). Figure 4 The component 408 shown is connected to the part described above.

[0070] In some examples, the engagement features 732, 734 may include shapes that allow moldable material to flow into or be supplied to the engagement features 732, 734 or around the engagement features. In some examples, the engagement features 732, 734 may cause the moldable material to mechanically engage the engagement features 732, 734 to retain the moldable material on the composite part 710 upon cooling, curing, hardening or otherwise solidifying.

[0071] In some examples, the joining features 732, 734 can be formed on or in the surface 726 of the composite part 710 defined by the inner portion 724 and the outer portion 722 by any number of additive or subtractive processes. The formation of the joining features 732, 734 may include subtractive processes such as machining, etching, laser-based processes, cutting, grinding, and other subtractive processes. In some examples, the joining features 732, 734 can be formed by additive processes such as deposition processes, spraying processes, 3D printing processes, and other similar additive processes. Alternatively, multiple processes may be used to form the joining features 732, 734.

[0072] Figure 8 A border strip 702 including a composite component 710 is shown, as described above. In some examples, the composite component 710 may include multiple surfaces defined by an outer portion 722 and an inner portion 724. For example, the composite component 710 may include a second surface (not shown) opposite surface 726, which is substantially similar and also includes engagement features formed thereon. Furthermore, one or more other components of the border strip 702, such as components 704 and 708, may similarly include engagement features formed on the surfaces defined by the outer and inner portions. As shown, a moldable material 714 is disposed between the composite component 710 and the components 704, 708 connected thereto. The moldable material 714 may include a polymeric material, such as epoxy or resin, and may be an electrically insulating material. The moldable material 714 mechanically engages with engagement features 732, 734 of the composite component 704 and may similarly mechanically engage with engagement features of the components 710, 708. In this way, the moldable material 714 can be used to connect the composite part 710 to the additional parts 704, 708, thereby forming the border strip 702.

[0073] In some examples, the composite component 710, including engagement features 732, 734, can be connected to the additional components 704, 708, including engagement features, via a moldable material 714 that engages with both the composite component 710 and the additional components 704, 708. In some examples, as described herein, multiple composite components can be joined to form a housing, enclosure, or frame of an electronic device. The moldable material 714 can include any desired material, and in some examples, can include an electrically insulating material or an electromagnetically transparent material. In some examples, the moldable material 714 can be used to electrically isolate the composite component 710 from the additional components 704, 708.

[0074] Figure 9 This is a flowchart of a method 900 for forming a composite material that can be used in composite components, as described herein. The composite material may also be referred to as a coating material. Figure 9In method 900, the composite material is formed by roll bonding. At step 902, various pretreatment steps are performed on the first and second raw materials. The first material may include titanium, titanium alloys, stainless steel, etc. The second material may include aluminum, etc. The pretreatment steps may be used to shape and / or purify the first and second raw materials before they are bonded together to form the composite material. Step 902 is optional and may be omitted depending on the shape and purity of the first and second materials.

[0075] In some examples, step 902 may include one or more vacuum arc remelting (VAR) processes. For example, step 902 may include two VAR processes. The VAR process can be used on the first material and can be used to improve the quality and purity of the first material.

[0076] Various processes can be used to form the first material. For example, the first material can be formed into a flat bar with desired dimensions before the first and second materials are joined. The first material can be formed into a billet by forging. Forging can be carried out at relatively high temperatures. According to one example, the first material can then be formed into a wire by rolling. In this example, multiple rolling processes can be used to form the first material into a wire and reduce the diameter of the wire. The first material can also be formed into a flat bar by stretching. Rolling to form the first material into a wire and stretching to form the first material into a flat bar can be carried out at relatively high temperatures. In some examples, guide rolls can be incorporated into the forming process of the first material to improve dimensional symmetry. In some examples, the corner radius of the flat bar can be reduced by stretching and / or peeling to reduce edge breakage.

[0077] The surface of the first material can then be prepared based on the desired finish or decorative appearance of the composite component. For example, surface preparation processes can be used to produce different finishes in the composite material. Surface preparation processes may include brushing, sandblasting, polishing, combinations thereof, or multiple thereof. Step 902 may include the same, similar, or equivalent processes performed on the second material.

[0078] At step 904, the first material and the second material are preheated. In some examples, the preheating in step 904 may include high-frequency (HF) induction heating, followed by heating in a furnace. After HF induction heating, the first material may be heated to a temperature lower than that of the second material. Similarly, after heating in a furnace, the first material may be heated to a temperature relatively lower than that of the second material. The first material can be heated to a first temperature by HF induction heating and to a second higher temperature by heating in a furnace. The first and second temperatures to which the first material is heated may be relatively lower than those of conventional processes. The second material can be heated to a first temperature by HF induction heating and to a second lower temperature by heating in a furnace. Lowering the temperature to which the first material is heated after HF induction heating and after heating in a furnace can improve the bonding strength between the first and second materials.

[0079] Step 904 can be performed in an inert environment isolated from air, containing an inert gas, and including oxygen monitoring. This prevents the formation of an α-shell (a hard and brittle oxygen-rich surface phase that typically includes microcracks, which appears when titanium and its alloys are exposed to hot air or oxygen) in the first material. Pickling and / or stripping processes can be used to remove the α-shell from the first material. Annealing processes for the first material can be minimized (e.g., by reducing the temperature or omitting the annealing process) to prevent the formation of the α-shell. This results in reduced delamination of the first and second materials when they are joined to form a composite material, and reduced edge fracture between the first and second materials in the composite material.

[0080] At step 906, the first and second materials are joined together and bonded to form a composite material. In method 900, the first and second materials can be joined by a process such as roll bonding. For example, the first and second materials can be passed under high pressure through a pair of flat rollers to bond the first and second materials to form a composite material. The roll bonding process can be followed by subsequent forming processes, such as stretching or leveling processes by passing the composite material through additional rollers or applying tension to the length of the composite material. The composite material may include an inner portion formed of the second material (e.g., aluminum, etc.) and an outer portion formed on the opposite side of the inner portion and formed of the first material (e.g., titanium, titanium alloys, stainless steel, etc.). In other words, the composite material may include the second material sandwiched in between by the first material. In some examples, the composite material may include a layer of the first material adjacent to a layer of the second material.

[0081] In step 908, the composite material undergoes a heat treatment process. In some examples, the heat treatment process may include multiple heat treatment processes, such as a first heat treatment and a second heat treatment. Performing a first heat treatment at different temperatures for different durations can affect the formation of intermetallic compounds between the first and second materials. For example, performing a first heat treatment for a long duration at a high temperature can result in the formation of two IMCs (e.g., two IMC layers, such as a first IMC layer and a second IMC layer comprising a material different from the first IMC layer) with thicknesses of approximately 300 nm and 200 nm between the first and second materials. In some examples, the first IMC layer and the second IMC layer may have different titanium and aluminum ratios. Performing a first heat treatment for a long duration at a moderate temperature can result in the formation of a single continuous IMC with a thickness of approximately 200 nm between the first and second materials. Performing a first heat treatment for a long duration at a low temperature can result in the formation of a single discontinuous IMC with a thickness of approximately 100 nm between the first and second materials. Performing a first heat treatment for a short duration at a low temperature can result in the formation of a single discontinuous IMC with a thickness of approximately 150 nm between the first and second materials. Higher temperatures and longer durations increase hardness and reduce bond strength. Lower temperatures and shorter durations reduce hardness and increase bond strength.

[0082] In one example, the first heat treatment may be T4 tempering and can be used to optimize the interface quality between the first and second materials. A second heat treatment may follow the first heat treatment; according to one embodiment, the second heat treatment may be T6 tempering. The second heat treatment may increase the strength of the first and / or second materials. Various leveling and / or forming processes may be performed before, between, and after the first and second heat treatments. For example, a roll leveling process may be performed on the composite material after the first heat treatment, and a three-point leveling process may be performed on the composite material after the second heat treatment. In some examples, the leveling process may be used to correct any warping or deformation that occurs in the composite material due to the heat treatment process.

[0083] At step 910, the composite material is shaped. In some examples, shaping may include a double-disc grinding process, a U-bending process, a forging process, a combination thereof, etc. A double-disc grinding process can remove material from the composite material, such as removing an α-shell formed in the composite material. In some examples, a double-disc grinding process may be performed to remove material from the composite material of about 10µm to about 15µm, about 5µm to about 20µm, about 0µm to about 5µm, etc. Removing the α-shell prevents edge breakage and delamination in the composite material. The U-bending and forging processes may be warm processes performed at elevated but relatively low temperatures. A U-bending process may be performed to shape the composite material into a U-shape. The U-bending process may be performed after a heat treatment process, such as after a second heat treatment. The composite material may include a second material layer between the first material layers, and each material layer may have a continuous U-shape, including corners around the U-shape. Forging processes may be used to produce various features in the composite material, such as those described above relative to... Figures 1 to 8 The features discussed.

[0084] Figure 10A and Figure 10B A microscopic cross-sectional view of composite material 1000 is shown. Composite material 1000 includes a first material 1002, a second material 1004, and an intermetallic compound 1006 between the first material 1002 and the second material 1004. Intermetallic compound 1006 may be an alloy, etc., and may include metals from the first material 1002 and the second material 1004. In some examples, the first material 1002 may include titanium, titanium alloy, stainless steel, etc. The second material 1004 may include aluminum, etc. In some examples, intermetallic compound 1006 may include Al3Ti, Ti3Al, etc. In some examples, intermetallic compound 1006 may have a gradient concentration of the first material and the second material, and the ratio of the first material to the second material may vary between particles within intermetallic compound 1006. In some examples, intermetallic compound 1006 may include TiAl adjacent to the first material 1002 and Al3Ti adjacent to the second material 1004. A continuous magnesium oxide layer may be formed in intermetallic compound 1006 between the first material 1002 and the second material 1004. The silicon concentration in the first material 1002 can be increased near the intermetallic compound 1006.

[0085] Intermetallic compound 1006 can be a continuous layer separating the first material 1002 and the second material 1004 (e.g.) Figure 10A (as shown); or discontinuous layers, such that the first material 1002 and the second material 1004 are in contact with each other (e.g. Figure 10B (As shown). In Figure 10AIn the continuous layer example, the intermetallic compound 1006 may have a relatively small thickness T1, such as less than about 1 µm, less than about 500 nm, less than about 200 nm, less than about 150 nm, less than about 100 nm, in the range of about 0.01 nm to about 100 nm, about 50 nm to about 200 nm, etc. Figure 10B In the example of the discontinuous layer, the intermetallic compound 1006 may have a relatively small thickness T2, such as less than about 1 µm, less than about 500 nm, less than about 200 nm, less than about 150 nm, less than about 100 nm, in the range of about 0.01 nm to about 100 nm, or about 50 nm to about 200 nm. Minimizing the thickness of the intermetallic compound 1006 can improve the adhesion between the first material 1002 and the second material 1004. Forming the composite material 1000 by rolling or the like can reduce the thickness of the intermetallic compound 1006 and improve the adhesion between the first material 1002 and the second material 1004. Furthermore, the intermetallic compound 1006 may be free of discrete oxide particles, which can further improve the bonding between the first material 1002 and the second material 1004.

[0086] Figure 11 This is a flowchart of a method 1100 for forming a composite material that can be used in composite components, as described herein. The composite material may also be referred to as a coating material. Figure 11 In method 1100, a composite material is formed by direct metal deposition. For example, the first material can be formed on the second material by melting a first material onto the second material. The first material may include titanium, titanium alloys, stainless steel, etc. The second material may include aluminum, etc.

[0087] At step 1102, a surface of the second material may be prepared. This may include various surface modifications, such as sandblasting, a combination of sandblasting and drilling in the surface, laser texturing (such as having line patterns or dot patterns, which may include 20 µm holes, 2.0 mm vertical holes, etc.), and combinations thereof. In an example where the surface modification includes sandblasting, the surface may have a surface roughness of about 0.96 Sa (or about 0.85 Sa to about 1.05 Sa) and a surface roughness of about 1.21 Sq. (or about 1.10 Sq. to about 1.30 Sq.). In an example where the surface modification includes laser texturing with line patterns, the surface may have a surface roughness of about 2.67 Sa (or about 2.40 Sa to about 2.90 Sa) and a surface roughness of about 3.85 Sq. (or about 3.50 Sq. to about 4.20 Sq.). In an example where surface modification includes laser texturing with a hole pattern, the surface may have a surface roughness of about 0.97 Sa (or about 0.90 Sa to about 1.10 Sa) and a surface roughness of about 2.26 Sq. (or about 2.00 Sq. to about 2.50 Sq.). Surface modification of the surface of the second material can improve the adhesion between the first and second materials and can be used to provide desired surface textures and decorative finishes.

[0088] At step 1104, a first material is deposited on the surface of a second material. In some examples, the first material may be deposited from titanium wire, titanium powder, etc., and may be deposited on a second material, which may include an aluminum substrate. Depositing the first material onto the second material via direct metal deposition can result in improved material utilization, 5-axis capabilities (e.g., the ability to produce the desired shape / profile of the first material on the second material), multiple material capabilities (e.g., the ability to deposit a series of first materials on a series of similar or dissimilar second materials), the ability to create additional features on the second material, and the ability to repair the second material. However, depositing the first material onto the second material via direct metal deposition can result in relatively poor adhesion of the first material to the second material, and can lead to warping, decorative challenges, or other deformation of the second material.

[0089] In some examples, a relatively thick intermetallic compound may be formed between the first and second materials. The intermetallic compound may include a composite metal oxide, and a heat-affected zone may be formed around the intermetallic compound (e.g., in a portion of the second material adjacent to the intermetallic compound and the first material). This may adversely affect the material properties of the composite material formed by method 1100.

[0090] In some examples, the second material may include 6000 series aluminum, and the first material may include Ti64. The composite material may include a titanium pool and Al3Ti intermetallic grains grown into an aluminum substrate. The intermetallic compound may have a thickness ranging from about 1 µm to about 2 µm. Oxides may be present in the second material, which may reduce the tensile strength of the composite material.

[0091] In some examples, the second material may include 7000 series aluminum, and the first material may include Ti64. The composite material may include a titanium pool, Al3Ti intermetallic grains grown into an aluminum substrate, and recrystallized grains of the aluminum substrate adjacent to the intermetallic compound. The intermetallic compound may have a thickness ranging from about 0.2 µm to about 0.3 µm. The composite material may be relatively oxide-free, which may increase the tensile strength of the composite material.

[0092] Figure 12 This is a flowchart of a method 1200 for forming a composite material that can be used in composite components, as described herein. The composite material may also be referred to as a coating material. Figure 12 In method 1200, a composite material is formed by nanopulse laser welding. In step 1202, a sheet of the first material can be positioned on or adjacent to a sheet of the second material. The first material may include titanium, titanium alloys, stainless steel, etc. The first material may have a thickness of up to about 0.5 mm. The second material may include aluminum, etc.

[0093] At step 1204, a nanosecond pulsed laser welding process is performed on the first material to bond the first material to the second material. Nanopulsed laser welding can produce small rivet pools at each location of the laser pulse while minimizing intermetallic compounds between the first and second materials. In some examples, nanopulsed laser welding can be used to harden the second material by attaching it to a harder first material while maintaining a desired decorative finish. The distribution of welding locations and welding density on the first and second materials can be varied to minimize warpage of the first and second materials and maximize the bond strength between them.

[0094] Figures 13A to 13E A cross-sectional view is shown of a method for etching a composite material 1300 comprising a first material 1302 and a second material 1304. Figure 13A A composite material 1300 is shown, comprising a first material 1302 bonded to a second material 1304. The first material 1302 may include titanium, titanium alloys, stainless steel, etc. The second material 1304 may include aluminum, etc. The second material 1304 may include a metallic material that is relatively easier to etch than the metallic material of the first material 1302.

[0095] exist Figure 13BIn this process, a protective layer 1306 is formed on the second material 1302. In some examples, the protective layer 1306 may include an anodized layer. The protective layer 1306 can be formed by anodizing the second material 1302 (such as by anodizing the second material 1302 with sulfuric acid). The protective layer 1306 may have a thickness in the range of about 12 µm to about 15 µm.

[0096] exist Figure 13C In this process, a first material 1302 is etched to form a hole or opening 1308. The first material 1302 can be etched in an electrolyte solution. The first material 1302 can be etched in a semi-aqueous solution. The first material 1302 can be etched in a solution including ferric chloride (e.g., FeCl3). The first material 1302 can be etched in a solution including acetic acid (CH3COOH) and sodium chloride (NaCl). In some examples, the first material 1302 can be etched in a multi-step etching process, such as using a first solution of ferric chloride and a second solution of acetic acid and sodium chloride. In some examples, the first material 1302 can be etched in a solution including ferric chloride (e.g., FeCl3), propylene glycol, and gluconate. The first material 1302 can be etched such that the hole 1308 has a pore density of about 8% to about 45% of the area of ​​the first material 1302, a pore depth in the range of about 50 µm to about 110 µm, and a pore diameter in the range of about 90 µm to about 130 µm. The second material 1304 is protected by a protective layer 1306, so that the second material 1304 is not used for etching the first material 1302.

[0097] exist Figure 13D In the process of removing the protective layer 1306, the top surface of the second material 1304 is exposed. Figure 13E In the process, a second material 1304 is etched to form a hole or opening 1310. The second material 1304 can be etched in a solution including ferric chloride (e.g., FeCl3), sulfuric acid (H2SO4), and tartaric acid (C4H6O6). The second material 1304 can be etched such that the hole 1310 has a pore density of about 20% to about 70% or about 30% to about 65% of the area of ​​the second material 1304, a pore depth in the range of about 25µm to about 50µm, and a pore diameter in the range of about 90µm to about 130µm. Therefore, the hole 1310 in the second material 1304 can have a greater pore density than the hole 1308 in the first material 1302. The hole 1308 in the first material 1302 can have a greater pore depth (e.g., a greater average pore depth) than the hole 1310 in the second material 1304. Moldable material (such as the aforementioned moldable material 714) can flow into holes 1308 and 1310 to mechanically engage holes 1308 and 1310, and couple the moldable material to a composite component including composite material 1300.

[0098] according to Figures 13A to 13D The example shown allows the formation of a protective layer on the second material 1304 to enable the etching of the first material 1302 through a more extreme process that rapidly depletes the second material without the protective layer. According to this example, a hole 1308 is formed in the first material 1302, the protective layer 1306 is removed, and the second material 1304 is exposed to a process that does not significantly affect the hole 1308 formed in the first material 1302, while a hole 1310 is formed in the second material. Thus, holes 1308 and 1310 can have substantially similar geometries and properties, but are made of different materials.

[0099] Figure 13F and Figure 13G It shows the way Figures 13A to 13E Microscopic cross-sectional view of the portion of the coating material etched by the method. Figure 13F It is through relative Figure 13C The etching process discussed is a microscopic cross-sectional view of the first material 1302 after etching the first material 1302, including the hole 1308. Figure 13G It is through relative Figure 13E The discussed etching process etches a microscopic cross-sectional view of the second material 1304, including holes 1310, after etching the second material 1304. Holes 1308 and 1310 may have similar characteristics, such as pore density, pore depth, and pore diameter. Compared to hole 1310, hole 1308 formed in the first material may have more uniform characteristics, such as more uniform pore density, pore depth, and pore diameter.

[0100] Figure 13H It shows the way Figures 13A to 13E Scanning electron microscope view of a portion of the coating material (such as a titanium portion) etched by a method. Figure 13I It shows Figure 13H A cross-sectional view of the etched coating material is shown. (See image.) Figure 13IAs shown, the first material 1302 can be etched to include both coarse and fine holes. In other words, the etching process can form holes or openings 1308 such that the diameter of the coarse hole ranges from about 1 µm to about 1000 µm, from about 5 µm to about 800 µm, or from about 20 µm to about 500 µm. The coarse hole can include a hole depth ranging from about 1 µm to about 100 µm, from about 5 µm to about 80 µm, or from about 10 µm to about 60 µm. In coarse etching, the hole 1308 may also include or define micropores within larger coarse holes on the surface. In other words, larger coarse holes 1308 may include fine holes having apertures ranging from about 1 nm to about 3000 nm, from about 25 nm to about 2500 nm, or from about 50 nm to about 2000 nm on the inner surface of the coarse hole. In some examples, the first material 1302 is etched to include fine etching. In fine etching, the etching process can form or define holes or openings 1308, such that the hole diameter is in the range of about 25 nm to about 250 nm or about 50 nm to about 100 nm. For example... Figure 13H As shown, the etched titanium surface may include a combination of coarse and fine pores.

[0101] Figure 14 This is a flowchart of a method 1400 for forming a composite component for an electronic device having engagement features on a surface, as described herein. At step 1402, the method 1400 for forming the composite component may include joining a first portion (such as an outer portion) comprising a first material having a first material property or a first set of material properties to a second portion (such as an inner portion) comprising a second material having a second material property or a second set of material properties. The method 1400 may further include forming one or more features in at least the second portion at step 1404, and processing the surface defined by the first and second portions at step 1406 to form engagement features thereon.

[0102] At step 1402, a first portion (such as an outer portion) of the composite component may be connected to a second portion (such as an inner portion), as described herein. The first portion may include a first material, while the second portion may include a second material that is selected independently. The materials of the first and second portions may include any materials described herein with respect to the inner and / or outer portions of the composite component.

[0103] In some examples, the first part can be relative to the above. Figure 9 The roller-pressing process described above is applied to the second part to form a composite material. In some examples, the first part can be connected as described above relative to... Figure 11 The direct metal deposition process described above is connected to the second part to form the composite material. In some examples, the first part can be connected as described above relative to... Figure 12The nanopulse welding process described above is used to connect the first and second parts to form a composite material. The first and second parts can be joined by chemical bonding, metallurgical bonding, mechanical bonding, and other joining methods.

[0104] At step 1404, one or more features are formed in at least a second portion of the composite component. These features may be formed according to any process or method described herein, such as additive or subtractive manufacturing processes. For example, one or more features may be formed in at least the second portion by machining, etching, deposition, molding, or other processes. In some examples, as described herein, one or more features may be formed in both the first and second portions. In some examples, the formation of one or more features in at least the second component at step 1404 may occur substantially simultaneously with the joining step at step 1402.

[0105] At step 1406, the surface defined by the first and second portions may be processed to form a joining feature on or in the surface, as described herein. For example, Figures 13A to 13E The process can be used to form holes 1308, 1310 in the first and second portions, which can form engagement features on the surfaces of the first and second portions. In some examples, the engagement features can range in size from nanoscale or microscale features to macroscale features with millimeter-scale dimensions. Furthermore, in some examples, the processing at step 1406 can form more than one engagement feature on the surface. The processing technology can include any number of additive or subtractive processes. In some examples, the engagement feature forming process can form the engagement feature on a portion of the surface defined by the inner portion, but may not form the engagement feature on that portion of the surface defined by the outer portion, or may otherwise substantially damage or degrade that portion of the surface defined by the outer portion. In some examples, the processing technology can additionally form the engagement feature on a portion of the surface defined by the outer portion, but may not form the engagement feature on that portion of the surface defined by the inner portion, or may otherwise substantially damage or degrade that portion of the surface defined by the inner portion. That is, in some examples, the process at step 1406 may form the joining feature on a portion of the surface defined by one of the inner or outer portions during a phase, and may form the joining feature on a portion of the surface defined by the other of the inner or outer portions during a second phase.

[0106] In some examples, the processing stage at step 1406 may affect only or substantially affect the material of one of the inner or outer portions. However, in some examples, that portion of the surface defined by one of the inner or outer portions may be masked or otherwise treated (e.g., using protective layer 1306) such that the processing stage affects or forms features only on the unmasked or untreated portion (e.g., the first portion 1302). In some examples, the processing may form one or more joining features on a portion of the surface defined by both the inner and outer portions. The processing at step 1406 may include one or more subtractive processing techniques, such as machining, etching, laser-based processes, cutting, grinding, and similar subtractive processes. In some examples, the processing at step 1406 may include additive processes, such as deposition processes, thermal spraying processes, 3D printing processes, and other similar additive processes. In some examples, the processing at step 1406 may include multiple processes to form one or more joining features.

[0107] In some examples, method 1400 may also include providing a moldable material, such as the moldable material 714 described herein, to the surface including the engagement feature. The moldable material may be provided in a moldable or flowable form. Method 1400 may also include hardening, curing, cooling, or otherwise solidifying the moldable material to mechanically engage the moldable material with the formed engagement feature. For example, as described herein, the moldable material may also mechanically engage with one or more other components and may be used to join these components together.

[0108] Within the limits applicable to this technology, the collection and use of data from various sources can be used to improve the delivery of inspirational or other content that may be of interest to users. This disclosure contemplates that, in some instances, such collected data may include personal information that uniquely identifies or can be used to contact or locate specific individuals. Such personal information may include demographic data, location-based data, telephone numbers, email addresses, Twitter accounts, etc. ® ID, home address, data or records related to the user's health or health level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0109] This disclosure recognizes that the use of such personal information data in the techniques of this invention can benefit users. For example, the personal information data can be used to deliver targeted content that is of interest to the user. Therefore, the use of such personal information data enables users to have planned control over the delivered content. Furthermore, this disclosure also anticipates other uses of personal information data that are beneficial to users. For example, health and fitness data can be used to provide insights into a user's overall health status or as positive feedback for individuals using technology to pursue health goals.

[0110] This disclosure assumes that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as data collection and / or use change. Personal information from users should be collected for the entity's lawful and reasonable purposes and not shared or sold outside of these lawful uses. Furthermore, such collection / sharing should be conducted only after obtaining informed consent from users. Additionally, such entities should consider taking any necessary steps to protect and safeguard access to such personal information data and ensure that others with access to such personal information data comply with their privacy policies and processes. Furthermore, such entities may be subject to third-party evaluations to demonstrate their compliance with widely accepted privacy policies and practices. Additionally, policies and practices should be adapted to the specific types of personal information data collected and / or accessed, and to applicable laws and standards, including specific considerations regarding jurisdiction. For example, in the United States, the collection or acquisition of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); while in other countries, health data may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained for different types of personal data in each country.

[0111] Regardless of the foregoing, this disclosure also contemplates implementation schemes for users to selectively prevent the use or access to personal information data. That is, this disclosure contemplates providing hardware and / or software components to prevent or block access to such personal information data. For example, with regard to advertising delivery services, the inventive technology can be configured to allow users to opt-in or opt-out at any time during or after service registration to participate in the collection of personal information data. In another example, users can choose not to provide emotion-related data for a targeted content delivery service. In yet another example, users can choose to limit the duration for which emotion-related data is retained, or to completely prohibit the development of underlying emotional states. In addition to providing "opt-in" and "opt-out" options, this disclosure also envisions providing notifications related to access to or use of personal information. For example, users can be notified when downloading an application that their personal information data will be accessed, and then reminded again just before the application accesses the personal information data.

[0112] Furthermore, the purpose of this disclosure is to manage and process personal information data to minimize the risk of unintentional or unauthorized access or use. Once data is no longer needed, this risk can be minimized by limiting data collection and deleting data. Additionally, and where applicable, including in certain health-related applications, data deidentification can be used to protect user privacy. Deidentification can be facilitated, where appropriate, by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than the address level), controlling how data is stored (e.g., aggregating data among users), and / or other methods.

[0113] Therefore, while this disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, it is also contemplated that various embodiments can be implemented without access to such personal information data. That is, various embodiments of the present invention will not be rendered inoperable due to the absence of all or part of such personal information data. For example, preferences can be inferred based on non-personal information data or a minimal amount of personal information, such as content requested by a device associated with a user, other non-personal information available to the content delivery service, or publicly available information, thereby selecting content and delivering it to the user.

[0114] For illustrative purposes, the foregoing description uses specific names to provide a thorough understanding of the described embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the described embodiments. Therefore, the foregoing description of specific embodiments described herein is presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the teachings above.

Claims

1. A housing for an electronic device, the housing comprising: External titanium portion; Internal aluminum, which is connected to the external titanium portion; and An intermetallic interface is disposed between the outer titanium portion and the inner aluminum portion, the intermetallic interface having a thickness disposed between the inner aluminum portion and the outer titanium portion, wherein the intermetallic interface comprises a continuous layer between the inner aluminum portion and the outer titanium portion.

2. The housing according to claim 1, wherein the intermetallic interface has a thickness of less than 1µm.

3. The housing according to claim 1, wherein the intermetallic interface has a thickness of less than 200 nm.

4. The housing according to claim 1, wherein the intermetallic interface comprises a high-magnesium phase.

5. The housing according to claim 1, wherein the intermetallic interface is free of discrete oxide particles.

6. The housing according to claim 1, wherein: The intermetallic interface separates the inner aluminum from the outer titanium portion.

7. The housing according to claim 1, wherein: The inner aluminum portion is in contact with the outer titanium portion.

8. A housing for an electronic device, the housing comprising: An outer titanium portion, which at least partially defines a first joining feature; and An internal aluminum portion connected to the external titanium portion, the internal aluminum portion at least partially defining a mating surface having mating features; and A non-metallic portion, which is engaged with the joining feature to connect the non-metallic portion to the inner aluminum portion, wherein the non-metallic portion includes a discontinuous layer between the inner aluminum portion and the outer titanium portion.

9. The housing according to claim 8, wherein, The non-metallic portion includes plastic.

10. The housing according to claim 8, wherein, The bonding feature includes multiple pores in the oxide layer.

11. The housing according to claim 10, wherein: The density of the plurality of pores is between approximately 30% and 65%; and The average depth of the plurality of holes is between 25µm and 50µm.

12. The housing according to claim 8, further comprising an intermetallic compound disposed between the outer titanium portion and the inner aluminum portion, the intermetallic compound comprising Al3Ti.

13. The housing according to claim 8, wherein, The joining features include etched features on the joining surface of the inner aluminum portion.

14. The housing according to claim 8, further comprising an intermetallic compound between the outer titanium portion and the inner aluminum portion, the intermetallic compound comprising a mechanical surface interlocking structure between the outer titanium portion and the inner aluminum portion.

15. The housing according to claim 14, wherein, The intermetallic compound includes a high-magnesium phase.

16. A housing for a portable electronic device, the housing comprising: A sidewall portion, the sidewall portion at least partially defining the internal volume and outer surface of the portable electronic device, and comprising: An outer titanium portion, which at least partially defines a mating surface; An internal aluminum portion is bonded to the external titanium portion, the internal aluminum portion at least partially defining the bonding surface; The bonding surface includes at least one of a plurality of etched bonding features or a plurality of holes; and A non-metallic portion, which is engaged with at least one of the plurality of etched bonding features or the plurality of holes to couple the non-metallic portion to the covered sidewall.

17. The housing of claim 16, wherein the non-metallic portion comprises a moldable material, the moldable material being disposed at least partially in at least one of the plurality of etched joint features or the plurality of holes.

18. The housing according to claim 16, wherein, The non-metallic portion includes polymers.

19. The housing according to claim 18, wherein, The polymer includes a resin.

20. The housing according to claim 16, wherein, The non-metallic portion is coupled to the mating surface via a mechanical surface interlocking structure.

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