Power converter

Abstract

The invention discloses a power converter which comprises a first shell, a circuit board, a first device and a heat conduction structure, the heat conduction structure comprises a first heat conduction sheet and a second heat conduction sheet, the first heat conduction sheet is arranged between the circuit board and the first device, and the first end of the second heat conduction sheet is connected with the first heat conduction sheet; the second heat-conducting fins extend in the direction close to the inner wall of the first shell. Through the arrangement of the first heat-conducting fin and the second heat-conducting fin, heat generated on the first device is preferentially conducted to the first heat-conducting fin, then conducted to the second heat-conducting fin through the first heat-conducting fin and diffused outwards through the second heat-conducting fin, so that the heat dissipation path can be reduced, and the heat dissipation effect is improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a power converter. Background Art

[0002] In a photovoltaic system, a power converter is usually set up to convert the direct current generated by the photovoltaic module. In practical applications, a circuit board and electronic devices are usually set up in the power converter. The main function of the circuit board is to support the electronic devices and realize the electrical interconnection between the electronic devices. However, electronic devices will generate heat when working. If the heat generated by the electronic devices cannot be transferred to the outside in time, as the operating temperature of the electronic devices increases, the life and reliability of the electronic devices will decrease, thereby affecting the overall reliability of the power converter. Summary of the invention

[0003] The embodiment of the present application provides a power converter for shortening the heat dissipation path of electronic devices and improving the heat dissipation effect.

[0004] In the first aspect, an embodiment of the present application provides a power converter, which includes: a first housing, a circuit board and a first device, the circuit board and the first device are arranged inside the first housing, and the first device is arranged on the circuit board. In addition, in order to shorten the heat dissipation path of the electronic device and improve the heat dissipation effect, the power converter also includes a heat conduction structure, the heat conduction structure includes a first heat conduction sheet and a second heat conduction sheet, the first heat conduction sheet is arranged between the circuit board and the first device, the first end of the second heat conduction sheet is connected to the first heat conduction sheet, and the second heat conduction sheet extends in a direction close to the inner wall of the first housing. Thus, by arranging the first heat conduction sheet and the second heat conduction sheet, the heat generated on the first device can be preferentially conducted to the first heat conduction sheet, and then conducted from the first heat conduction sheet to the second heat conduction sheet, diffused through the first housing of the second heat conduction sheet, and then diffused outward from the first housing, thereby generating a heat dissipation path from the first device, the first heat conduction sheet, the second heat conduction sheet to the first housing, thereby reducing the heat dissipation path and improving the heat dissipation effect. In addition, since most of the heat generated by the first device is released to the outside through the first heat conductive sheet and the second heat conductive sheet, the heat conducted to the circuit board will be relatively reduced, thereby reducing the baking of other low-temperature specification devices on the circuit board and improving the life and reliability of electronic devices.

[0005] Moreover, compared with the heat dissipation solutions of conventional devices that coat the bottom of the functional device with a thermally conductive interface material or add a metal block on top of the functional device, the heat dissipation solution provided by the present application has low cost, simple assembly, and low heat dissipation cost.

[0006] In some embodiments, the first device has a first pin. To achieve electrical connection between the circuit board and the first device, the first heat conducting sheet has a through opening, and the first pin penetrates the opening and is connected to the circuit board.

[0007] In some embodiments, the power converter further includes a welding portion, and the first pin is interconnected with the circuit board through the welding portion, and the first pin is also fixedly connected to the first heat conducting plate through the welding portion, and the first heat conducting plate is insulated from the welding portion.

[0008] Since the first device is usually provided with a plurality of signal transmission pins and / or a plurality of power supply pins. Then the first pin is provided in plurality and the plurality of first pins are spaced apart from each other. In order to enable the pin and the circuit board to be electrically connected, a plurality of openings are provided and the plurality of openings are spaced apart from each other, and the plurality of first pins correspond to the plurality of openings one by one, and the orthographic projection of the opening on the circuit board covers the orthographic projection of the corresponding first pin on the circuit board. With this arrangement, each first pin can be electrically connected to the circuit board. Moreover, each first pin can be directly connected to the first heat conductive sheet through the welding portion, so that the heat on each first pin can be timely transferred to the first heat conductive sheet, thereby improving the heat dissipation effect.

[0009] Exemplarily, the welding portion is completely or partially filled between the first pin and the first heat conducting plate, so that the heat on the first pin can be transferred to the first heat conducting plate through the welding portion, thereby transferring the heat to the first heat conducting plate in a timely manner.

[0010] In the actual preparation process, a reflow soldering process is used to electrically connect the first pin and the first pad. Based on this, the welding portion is set to solder paste. In addition, since the thickness of the steel mesh used to brush the solder paste is generally less than 0.2 mm, in order to improve the accuracy of the reflow soldering process, the thickness of the first heat conductive sheet (i.e., the thickness in the stacking direction of the circuit board and the first device) is not greater than the thickness of the steel mesh, so that after brushing the solder paste on the circuit board, the solder paste can contact the first pin through the opening, thereby realizing the soldering of the first pin and the first pad through the solder paste.

[0011] Since the first heat conducting sheet needs to be in contact with the welding part and insulated to avoid short circuit between different first pins through the first heat conducting sheet, the material of the first heat conducting sheet is set to be a heat conducting insulating material. In this way, the first heat conducting sheet is directly in contact with the welding part, and different first pins will not be short circuited through the first heat conducting sheet. Exemplarily, the heat conducting insulating material includes but is not limited to heat conducting ceramics (such as magnesium oxide ceramics) and the like.

[0012] In order to improve the efficiency of heat conduction, the second heat conducting sheet is made of the same material as the first heat conducting sheet, and the second heat conducting sheet and the first heat conducting sheet are an integrally formed structure.

[0013] In some embodiments, the first heat conducting sheet includes a heat conducting layer and an insulating layer, and the insulating layer covers the surface of the heat conducting layer and the inner wall of the opening. Exemplarily, the heat conducting layer is one or more of a metal sheet and a graphite sheet.

[0014] In some embodiments, the second heat conducting sheet and the heat conducting layer are made of the same material, and the second heat conducting sheet and the heat conducting layer are an integrally formed structure.

[0015] In specific implementation, spraying, evaporation, deposition and other processes are also used to form an insulating layer on the outer surface of the second heat conducting plate and / or the outer surface of the third heat conducting plate to further improve the overall insulation performance.

[0016] In some embodiments, the second end of the second heat conductive sheet extends to the first housing and contacts the first housing. In this way, the second heat conductive sheet is in contact with the first housing, so that the heat is directly transferred to the first housing through the second heat conductive sheet, shortening the heat dissipation path, improving the heat dissipation effect, and further reducing the baking of other components on the circuit board.

[0017] In some embodiments, the first heat conductive sheet has a plurality of sides, wherein at least one side is connected to a second heat conductive sheet. For example, if the first heat conductive sheet is rectangular, it has four sides, wherein each side is respectively connected to a second heat conductive sheet, or two opposite sides are respectively connected to a second heat conductive sheet, or two opposite sides are respectively connected to a second heat conductive sheet, and one of the other two opposite sides is connected to a second heat conductive sheet.

[0018] For example, when the first heat conducting sheet is connected to a plurality of second heat conducting sheets, the plurality of second heat conducting sheets are not in contact with each other but are arranged at intervals and connected by the first heat conducting sheet. Alternatively, the plurality of second heat conducting sheets may also be in contact with each other or arranged as an integrally formed structure.

[0019] In the present application, each second heat conducting sheet has the same thickness to improve the uniformity of heat dissipation. Alternatively, different second heat conducting sheets have different thicknesses, or some second heat conducting sheets have different thicknesses and some second heat conducting sheets have the same thickness. Exemplarily, the second heat conducting sheet may be a plate-like structure or have a concave-convex structure to improve heat dissipation.

[0020] In some embodiments, in order to improve the heat dissipation and temperature uniformity effect of the second heat conducting plate, the thickness of the second heat conducting plate is greater than the thickness of the first heat conducting plate.

[0021] In some embodiments, in order to improve the uniformity of heat dissipation, the thickness of the first heat conducting sheet is the same as the thickness of the second heat conducting sheet.

[0022] In some embodiments, the first shell is a hollow structure with a storage space inside, and a heat-conducting medium is also filled in the first shell, for example, the heat-conducting medium is made of materials such as potting glue. In this way, the heat-conducting medium is in contact with the first heat-conducting sheet and the second heat-conducting sheet, and the heat on the first heat-conducting sheet and the second heat-conducting sheet is further transferred to the first shell through the heat-conducting medium, thereby accelerating the heat dissipation. Of course, the heat-conducting medium is not filled in the first shell, and the first heat-conducting sheet and the second heat-conducting sheet are directly in contact with the air, so that the heat on the first heat-conducting sheet and the second heat-conducting sheet is transferred to the first shell through the air.

[0023] In order to achieve heat dissipation by attaching the box and further improve the heat dissipation effect, the heat conductive structure also includes a third heat conductive sheet, which is connected to the second end of the second heat conductive sheet, and the third heat conductive sheet is in contact with the inner wall of the first shell, and the third heat conductive sheet extends along the plane where the inner wall of the first shell is located. Exemplarily, the third heat conductive sheet is attached to the inner wall of the first shell through a thermal interface material. Alternatively, the third heat conductive sheet is welded to the inner wall of the first shell.

[0024] In some embodiments, in order to improve the efficiency of heat conduction, the second heat conducting plate and the third heat conducting plate are made of the same material, and the second heat conducting plate and the third heat conducting plate are an integrally formed structure.

[0025] In some embodiments, since the second heat conductive sheet extends toward the side of the first surface away from the second surface, the second heat conductive sheet has a bending angle relative to the first heat conductive sheet. Then, the plane where the second heat conductive sheet is located and the plane where the first heat conductive sheet is located have an angle facing away from the first device, and the range of the angle is (0°, 90°].

[0026] Usually, different types of electronic devices are arranged on the circuit board, and the first device in the power converter is one or more. If there are multiple first devices, the multiple first devices share a heat-conducting structure. In addition, the electronic devices on the circuit board include heating devices with higher heat generation and higher temperature specifications, such as power devices (for example, metal-oxide-semiconductor field-effect transistors (MOSFET)), etc., and also include low-temperature devices with lower heat generation and lower temperature specifications, such as control chips. Therefore, the first device is set to a heating device with higher heat generation and higher temperature specifications. Of course, in order to further improve the stability of the power converter, the first device can also be set to a low-temperature device with lower heat generation and lower temperature specifications.

[0027] In some embodiments, the power converter further includes a second device, the second device has a second pin, the second pin is connected to the circuit board, wherein the heat generated by the first device at maximum power is greater than the heat generated by the second device at maximum power. Thus, a heat-conducting structure is provided under the first device with a higher heat generation, and the heat-conducting structure is used to prevent the first device from baking the second device. In addition, no heat-conducting structure is provided under the second device with a lower heat generation, so as to reduce the use of the heat-conducting structure and reduce the cost.

[0028] In some examples, the area enclosed by the edge of the orthographic projection of the first heat conductive sheet on the circuit board covers the orthographic projections of all the first pins on the circuit board. In addition, the first heat conductive sheet also needs to have a portion protruding from the first device, so that the second heat conductive sheet is connected to the portion to achieve heat conduction. Furthermore, the area enclosed by the edge of the orthographic projection of the first heat conductive sheet on the circuit board covers the orthographic projection of the first device on the circuit board.

[0029] In the second aspect, the embodiment of the present application further provides a power device, which includes: a first device and a heat-conducting structure, the heat-conducting structure includes a first heat-conducting sheet and a second heat-conducting sheet, the first heat-conducting sheet is arranged on one side of the first device, the first end of the second heat-conducting sheet is connected to the first heat-conducting sheet, and the second heat-conducting sheet extends in a direction away from the first heat-conducting sheet. Thus, by arranging the first heat-conducting sheet and the second heat-conducting sheet, the heat generated on the first device can be preferentially transferred to the first heat-conducting sheet, and then transferred from the first heat-conducting sheet to the second heat-conducting sheet, and diffused outward through the second heat-conducting sheet, thereby reducing the heat dissipation path and improving the heat dissipation effect.

[0030] In some embodiments, the first heat conductive sheet is disposed on a side of the first device having the first pin.

[0031] In some embodiments, the power device further includes a second device, wherein the heat generated by the first device at maximum power is greater than the heat generated by the second device at maximum power. Thus, a heat-conducting structure is provided under the first device with a higher heat generation, and the heat-conducting structure is used to prevent the first device from baking the second device. Furthermore, no heat-conducting structure is provided under the second device with a lower heat generation, thereby reducing the use of the heat-conducting structure and reducing costs.

[0032] In addition, the implementation of the first device and the heat-conducting structure in the embodiments of the present application refers to the implementation of the first device and the heat-conducting structure in the above-mentioned first aspect or any embodiment of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of an application scenario of a photovoltaic system provided in an embodiment of the present application;

[0034] Figure 2A schematic cross-sectional view of a power converter provided in an embodiment of the present application;

[0035] Figure 3 A schematic diagram of a three-dimensional structure of a power converter provided in an embodiment of the present application;

[0036] Figure 4 A schematic diagram of a three-dimensional structure of a heat-conducting structure provided in an embodiment of the present application;

[0037] Figure 5a A schematic diagram of the structure of the first surface of the circuit board provided in an embodiment of the present application;

[0038] Figure 5b A schematic diagram of the structure of a first device provided in an embodiment of the present application;

[0039] Figure 5c A schematic diagram of the structure of a first heat conducting sheet provided in an embodiment of the present application;

[0040] Figure 6a and Figure 6b They are respectively a schematic diagram of a top view structure of a second heat conducting sheet provided in an embodiment of the present application;

[0041] Figure 7a and Figure 7b They are respectively another schematic diagram of a top view structure of the second heat conducting sheet provided in the embodiments of the present application;

[0042] Figure 8 A schematic diagram of a top view of the structure of a first heat conducting sheet and a first device provided in an embodiment of the present application;

[0043] Fig. 9 A schematic diagram of another cross-sectional structure of a power converter provided in an embodiment of the present application;

[0044] Fig.10 A schematic diagram of another cross-sectional structure of a power converter provided in an embodiment of the present application;

[0045] Fig.11 A schematic diagram of another cross-sectional structure of a power converter provided in an embodiment of the present application;

[0046] Fig.12 A schematic diagram of another cross-sectional structure of a power converter provided in an embodiment of the present application;

[0047] Fig.13a A schematic diagram of another cross-sectional structure of a power converter provided in an embodiment of the present application;

[0048] Fig.13b A schematic diagram of another structure of the heat-conducting structure provided in an embodiment of the present application;

[0049] Fig.14 A schematic diagram of another cross-sectional structure of a power converter provided in an embodiment of the present application;

[0050] Fig.15 A schematic diagram of another cross-sectional structure of a power converter provided in an embodiment of the present application.

[0051] Reference numerals:

[0052] 100-photovoltaic module; 200-photovoltaic optimizer; 300-inverter; 400-grid-connected transformer; 500-AC power grid; 600-load; 700-first shell; 710-circuit board; 711-first soldering pad; 712-second soldering pad; 720 / 720a / 720b-first device; 721-first pin; 730-thermal conductive structure; 731-first thermal conductive sheet; 732a / 732b / 732c / 732d-second thermal conductive sheet; 740-welding portion; 750-second device; 751-second pin; 760-thermal conductive interface material; S1-first surface; S2-second surface; KK-opening. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. The specific operating methods in the method embodiments can also be applied to device embodiments or system embodiments. It should be noted that in the description of the present application, "multiple" can be understood as "at least two". In addition, it should be understood that in the description of the present application, words such as "first" and "second" are only used to distinguish the purpose of description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order.

[0054] It should be noted that the same reference numerals in the drawings of this application represent the same or similar structures, and thus their repeated description will be omitted. The words expressing positions and directions described in this application are all explained using the drawings as examples, but they can be changed as needed, and the changes are included in the protection scope of this application. The drawings of this application are only used to illustrate the relative position relationship and do not represent the true proportion.

[0055] In order to facilitate the understanding of the technical solution provided by the embodiment of the present application, the application scenario of the solution of the present application is first described below. The power converter provided by the embodiment of the present application can be applied to a system having a circuit board and an electronic device arranged on the circuit board. Exemplarily, the system is a new energy system, a power system, a data center or an electric vehicle, etc. Among them, the new energy system is, for example, a photovoltaic system, and the power converter is, for example, an inverter, a photovoltaic optimizer and other products in the photovoltaic system. Of course, the power converter provided by the embodiment of the present application can also be applied to a power module. Alternatively, the power converter provided by the embodiment of the present application can also be applied to various terminal devices and electronic devices. Among them, the terminal device includes, for example, but is not limited to, devices such as smart phones, smart TVs, smart TV set-top boxes, smart watches, personal computers (personal computers, PCs), wearable devices, and smart broadband. Electronic devices include, for example, but are not limited to, telecommunications equipment such as wireless networks, fixed networks, servers, and devices such as chip modules and memories, which are not listed one by one here. It is understandable that the specific implementation of the power converter can be determined according to the actual application scenario, and is not limited here.

[0056] The following is a detailed description of the application of the power converter provided by the embodiment of the present application in a photovoltaic system scenario. For the working process of the power converter provided by the embodiment of the present application in other scenarios, reference can be made to the working process applied to the photovoltaic system below, and the repetitions are not discussed here.

[0057] Figure 1 Schematic diagram of application scenarios of photovoltaic systems provided in embodiments of the present application. Figure 1 , the photovoltaic system includes: a photovoltaic module 100, a photovoltaic optimizer 200 and an inverter 300, the input end of the photovoltaic optimizer 200 is connected to the photovoltaic module 100, and the output end of the photovoltaic optimizer 200 is connected to the input end of the inverter 300. In the photovoltaic system, the photovoltaic module 100 can convert sunlight into direct current through the photovoltaic effect. The photovoltaic optimizer 200 has a maximum power point tracking (MPPT) function, that is, the photovoltaic optimizer 200 can track the maximum power point of the photovoltaic module, so that the photovoltaic module 100 maintains a high output power. The direct current output by the photovoltaic module 100 is output to the inverter 300 after conversion by the photovoltaic optimizer, and the inverter 300 can convert the received direct current into alternating current or direct current and then output it. Exemplarily, the inverter 300 can convert the received direct current into alternating current to power the load 600, and the load 600 can include an AC load such as a communication base station or household appliances in an AC power grid. Alternatively, the inverter 300 may also convert the received direct current into alternating current, and the alternating current is converted by the grid-connected transformer 400 and output to the alternating current grid 500 to achieve grid connection.

[0058] It is understandable that the power converter provided in the embodiments of the present application may be an inverter and / or an optimizer.

[0059] In a specific implementation, a circuit board and an electronic device are provided in the power converter, and there are exposed pins at the bottom of the electronic device. The electronic device is electrically connected to the circuit board by brushing solder paste at the bottom of the pin and then melting the solder paste. Such electronic devices are generally referred to as surface mount devices. In practical applications, surface mount devices generate heat when working, and there must be pins and solder paste at the bottom of the surface mount device, and the thermal conductivity of the solder paste can reach tens of W / (m*K). Therefore, a large amount of heat will be conducted to the circuit board through the pins, and further diffused through the plane of the circuit board. This results in a long heat dissipation path and large thermal resistance between the surface mount device and the external environment. In addition, heat is conducted into the circuit board, and will be conducted along the horizontal direction of the circuit board, thereby baking the remaining low-temperature specification components on the circuit board. For this reason, the embodiment of the present application provides a power converter, which can not only shorten the heat dissipation path of the electronic device and improve the heat dissipation effect, but also reduce the baking of the remaining low-temperature specification components on the circuit board, and improve the life and reliability of the electronic device.

[0060] Figure 2 A schematic cross-sectional view of a power converter provided in an embodiment of the present application is shown in FIG. Figure 3 A schematic diagram of a three-dimensional structure of a power converter provided in an embodiment of the present application is shown in FIG. Figure 4 A schematic diagram of a three-dimensional structure of a heat-conducting structure provided in an embodiment of the present application, Figure 5a A schematic diagram of the structure of the first surface of the circuit board provided in an embodiment of the present application, Figure 5b A schematic diagram of the structure of a first device provided in an embodiment of the present application, Figure 5c A schematic diagram of the structure of the first heat conducting sheet provided in the embodiment of the present application. Figure 2 to Figure 5c The power converter includes: a first housing 700, a circuit board 710 and a first device 720. The first housing 700 may be a hollow structure with a storage space inside. In addition, the first housing 700 may be a rectangular parallelepiped or cylindrical shape, etc., and the embodiment of the present application does not limit the shape of the first housing 700. The first housing 700 may be made of plastic or metal, and the embodiment of the present application does not limit the material of the first housing 700.

[0061] Furthermore, the circuit board 710 is disposed inside the first housing 700, and the circuit board 710 has a first surface S1 and a second surface S2. Functional devices are fixed on the first surface S1 and / or the second surface S2 of the circuit board 710, which is equivalent to that the circuit board 710 and the functional devices are both disposed inside the first housing 700. The circuit board 710 is, for example, a printed circuit board (PCB), and the functional devices include surface mount devices (such as rectangular chip surface mount devices, cylindrical chip surface mount devices, composite chip component surface mount devices, special-shaped chip surface mount devices, etc.). The functional devices include a first device 720, which can be a surface mount device, and the first device 720 is disposed on the first surface S1 of the circuit board 710. Since the first device 720 generates heat when working, in order to improve heat dissipation, in a specific implementation, the power converter is further provided with a heat-conducting structure 730, and the heat-conducting structure 730 includes a first heat-conducting sheet 731 and second heat-conducting sheets 732a and 732b. The first heat-conducting sheet 731 is fixed between the circuit board 710 and the first device 720, and the first ends of the second heat-conducting sheets 732a and 732b are respectively connected to the first heat-conducting sheet 731, and the second heat-conducting sheets 732a and 732b extend in a direction close to the inner wall of the first shell 700, for example, the second ends of the second heat-conducting sheets 732a and 732b extend toward the side of the first surface S1 away from the second surface S2, that is, the second heat-conducting sheet is folded to the side away from the circuit board. Thus, by providing the first heat conducting sheet 731 and the second heat conducting sheet 732a, 732b, the heat generated on the first device 720 can be preferentially transferred to the first heat conducting sheet 731, and then transferred from the first heat conducting sheet 731 to the second heat conducting sheet 732a, 732b, diffused to the first housing 700 via the second heat conducting sheet 732a, 732b, and then diffused outward from the first housing 700, thereby generating a heat dissipation path from the first device 720, the first heat conducting sheet 731, the second heat conducting sheet 732a, 732b to the first housing 700, thereby reducing the heat dissipation path and improving the heat dissipation effect. In addition, since most of the heat generated by the first device 720 is released to the outside through the first heat conducting sheet 731 and the second heat conducting sheet 732a, 732b, the heat transferred to the circuit board 710 will be relatively reduced, thereby reducing the baking of other low-temperature specification devices on the circuit board 710, and improving the life and reliability of the electronic device.

[0062] It is understandable that the second heat conductive sheet 732a, 732b extends along the inner wall of the first shell 700 in the direction close to the inner wall of the first shell 700, which can be the inner wall in the side wall of the first shell 700, or can also be the inner wall in the bottom of the first shell 700.

[0063] Furthermore, the first device 720 has a first pin 721, the first surface S1 has a first pad 711, the first heat conducting sheet 731 has a through opening KK, the first pin 721 is electrically connected to the first pad 711 through a soldering portion 740, and the first pin 721 is also connected to the first heat conducting sheet 731 through the soldering portion 740, and the first heat conducting sheet 731 is insulated from the soldering portion 740. With this arrangement, the heat generated on the first device 720 can be preferentially conducted to the first heat conducting sheet 731 through the soldering portion 740 in contact with the first pin 721, and then conducted from the first heat conducting sheet 731 to the second heat conducting sheets 732a and 732b, and diffused outward through the second heat conducting sheets 732a and 732b, thereby reducing the heat dissipation path and improving the heat dissipation effect. In addition, since most of the heat generated by the first device 720 is released to the outside through the first heat conducting sheet 731 and the second heat conducting sheet 732a, 732b, the heat conducted to the circuit board 710 will be relatively reduced, thereby reducing the baking of other low-temperature specification devices on the circuit board 710, and improving the life and reliability of the electronic device. In addition, compared with the heat dissipation solution of conventional devices that coats the bottom of the functional device with a thermal interface material or adds a metal block above the functional device, the heat dissipation solution provided by the embodiment of the present application has low cost, simple assembly, and low heat dissipation cost.

[0064] Typically, different types of electronic devices are provided on the PCB, including heating devices with high heat generation and high temperature specifications, such as power devices (e.g., metal-oxide-semiconductor field-effect transistors (MOSFET)), etc., and low-temperature devices with low heat generation and low temperature specifications, such as control chips, etc. Based on this, the first device 720 can be one or more, and the first device 720 can be a heating device with high heat generation and high temperature specifications. Of course, in order to further improve the stability of the power converter, the first device 720 can also be set as a low-temperature device with low heat generation and low temperature specifications.

[0065] Typically, a functional device is provided with a plurality of signal transmission pins (i.e., I / O pins) and / or a plurality of power supply pins. Among them, the signal transmission pins are used to transmit drive signals, and the functional device can perform corresponding processing after receiving the drive signals. The power supply pins are used to transmit the power supply voltage to power the functional device. Exemplarily, the plurality of power supply pins in the functional device may include a pin that provides a high voltage (e.g., some voltage greater than the ground voltage), a pin that provides a low voltage (e.g., some voltage less than the ground voltage), and a GND pin for the ground voltage, etc., which are not limited here. Based on this, refer to Figure 2 as well as Figure 5a to Figure 5c, the first pin 721 can be multiple and the multiple first pins 721 are arranged at intervals from each other, and the multiple first pins 721 may include signal transmission pins (i.e., I / O pins) and / or power supply pins. In order to achieve the electrical connection between the multiple first pins 721 and the circuit board 710, the first pads 711 are also arranged in multiples and the multiple first pads 711 are also arranged at intervals from each other. In addition, the openings KK are also arranged in multiples and the multiple openings KK are also arranged at intervals from each other. In this way, the multiple first pins 721, the multiple first pads 711 and the multiple openings KK can correspond to each other one by one, and the orthographic projection of the openings KK on the circuit board 710 covers the orthographic projection of the corresponding first pins 721 on the circuit board 710 and the orthographic projection of the first pads 711 on the circuit board 710. In this configuration, by making each first pin 721 correspond to an opening KK, and making the orthographic projection of the opening KK on the circuit board 710 larger than the orthographic projection of the first pin 721 on the circuit board 710, each first pin 721 can be electrically connected to the first pad 711. In addition, each first pin 721 can be directly connected to the first heat conducting sheet 731 through the welding portion 740, further making the heat on each first pin 721 be timely transferred to the first heat conducting sheet 731, thereby improving the heat dissipation effect.

[0066] It is understandable that the welding portion 740 can be completely or partially filled between the first pin 721 and the first heat conducting plate 731 so that the heat on the first pin can be transferred to the first heat conducting plate 731 through the welding portion 740, thereby transferring the heat to the first heat conducting plate 731 in a timely manner.

[0067] In the actual preparation process, a reflow process can be used to electrically connect the first pin 721 and the first pad 711. Based on this, the welding portion 740 can be set to solder paste. In addition, in the reflow process, after the first heat conducting sheet 731 is fixed on the circuit board 710, solder paste is brushed on the first pad 711. Therefore, an opening KK is set on the first heat conducting sheet 731. The purpose is to enable the solder paste to pass through the opening KK and contact the first pad 711 after brushing the solder paste on the first heat conducting sheet 731, so as to achieve welding between the first pin 721 and the first pad 711. In addition, since the thickness of the steel mesh used for brushing solder paste is generally less than 0.2 mm, in order to improve the accuracy of the reflow soldering process, the thickness of the first heat conductive sheet 731 (i.e., the thickness in the stacking direction of the circuit board 710 and the first device 720) can be made no greater than the thickness of the steel mesh, so that after brushing solder paste on the circuit board 710, the solder paste can contact the first pin 721 through the opening KK, thereby realizing the soldering of the first pin 721 and the first pad 711 through the solder paste.

[0068] Typically, the first pin 721 has a columnar, spherical, or other shape, and therefore, the shape of the opening KK can be set according to the shape of the first pin 721 to meet the needs of actual application scenarios.

[0069] Since the first thermally conductive sheet 731 needs to be in contact with the welding portion 740 and insulated to avoid short-circuiting of different first pins 721 through the first thermally conductive sheet 731, the material of the first thermally conductive sheet 731 can be a thermally conductive insulating material. With this arrangement, the first thermally conductive sheet 731 can be directly in contact with the welding portion 740, and different first pins 721 will not be short-circuited through the first thermally conductive sheet 731. Exemplarily, the thermally conductive insulating material includes but is not limited to thermally conductive ceramics (such as magnesium oxide ceramics). Furthermore, in order to improve the efficiency of heat conduction, the second thermally conductive sheet can be made of the same material as the first thermally conductive sheet 731, and the second thermally conductive sheet and the first thermally conductive sheet 731 are an integrally formed structure.

[0070] Reference Figure 2 , the area enclosed by the edge of the orthographic projection of the first heat conductive sheet 731 on the circuit board 710 can cover the orthographic projection of all the first pins 721 on the circuit board 710. In addition, the first heat conductive sheet 731 also needs to have a portion protruding from the first device 720, so that the second heat conductive sheet is connected to the portion to achieve heat conduction. In addition, in actual application, the shape of the first heat conductive sheet 731 can be set according to the shape of the orthographic projection of the first device 720 on the circuit board 710. For example, if the shape of the orthographic projection of the first device 720 on the circuit board 710 is a rectangle, the shape of the first heat conductive sheet 731 can be set to a rectangle. Alternatively, the shape of the first heat conductive sheet 731 can also be determined according to the needs of actual application, which is not limited here.

[0071] In a specific implementation, the first heat conducting sheet 731 has a variety of shapes, and it can have multiple sides. Based on this, one or more sides of the first heat conducting sheet 731 can be connected to a second heat conducting sheet respectively. For example, referring to Figure 3 and Figure 4 The first heat conducting sheet 731 is in a rectangular shape and has four sides. On two opposite sides, one side is connected to the second heat conducting sheet 732a, and the other side is connected to the second heat conducting sheet 732b, so that the first heat conducting sheet 731 is connected to two second heat conducting sheets 732a and 732b, which can effectively increase the heat dissipation area of ​​the second heat conducting sheet. For example, referring to Figure 6a and Figure 6b , Figure 6a and Figure 6bThe first heat conducting sheet 731 has four sides, one of which is connected to the second heat conducting sheet 732a and the other is connected to the second heat conducting sheet 732b on two opposite sides, and one of which is connected to the second heat conducting sheet 732c on the other pair of opposite sides, so that the first heat conducting sheet 731 is connected to three second heat conducting sheets 732a to 732c, which can effectively increase the heat dissipation area of ​​the second heat conducting sheet. For example, referring to Figure 7a and Figure 7b , Figure 7a and Figure 7b The first heat conducting sheet 731 has four sides, each of which is connected to a second heat conducting sheet, so that the first heat conducting sheet 731 is connected to four second heat conducting sheets 732a to 732d, further effectively increasing the heat dissipation area of ​​the second heat conducting sheet. Figure 6a and Figure 7a As shown, the second heat conducting sheet (eg Figure 6a 732a~732c in Figure 7a 732a~732d) in the figure are not in contact with each other but are arranged at intervals. Figure 6b and Figure 7b As shown, the second heat conducting sheet (eg Figure 6a 732a~732c in Figure 7a 732a~732d) in the figure are in direct contact with each other or are arranged as an integrally formed structure.

[0072] In the present application, the thickness of each second heat conducting sheet can be made the same to improve the uniformity of heat dissipation. Of course, the thickness of different second heat conducting sheets can also be made different, or the thickness of some second heat conducting sheets can be different and the thickness of some second heat conducting sheets can be the same. Exemplarily, the second heat conducting sheet can be a plate-like structure or have a concave-convex structure to improve heat dissipation.

[0073] Furthermore, in order to improve the uniformity of heat dissipation, the thickness h1 of the first heat conducting sheet 731 , the thickness h2a of the second heat conducting sheet 732a , and the thickness h2b of the second heat conducting sheet 732b may be made the same.

[0074] Continue to refer to Figure 2Since the first shell 700 is a hollow structure with a storage space inside, the first shell 700 can also be filled with a heat-conducting medium as a whole, for example, the heat-conducting medium is made of materials such as potting glue. With this arrangement, the heat-conducting medium can be in contact with the first heat-conducting sheet 731 and the second heat-conducting sheet 732a, 732b, and the heat on the first heat-conducting sheet 731 and the second heat-conducting sheet 732a, 732b can be further transferred to the first shell 700 through the heat-conducting medium, thereby accelerating the heat dissipation. Of course, it is also possible not to fill the first shell 700 with a heat-conducting medium, but to directly make the first heat-conducting sheet 731 and the second heat-conducting sheet 732a, 732b contact with the air, so that the heat on the first heat-conducting sheet 731 and the second heat-conducting sheet 732a, 732b can also be transferred to the first shell 700 through the air.

[0075] In practical applications, since the second heat conducting sheets 732a and 732b extend toward the side of the first surface S1 away from the second surface S2, the second heat conducting sheets 732a and 732b have a bending angle relative to the first heat conducting sheet 731. Figure 2 , taking the second heat conducting sheet 732b as an example, the plane S4 where the second heat conducting sheet 732b is located and the plane S3 where the first heat conducting sheet 731 is located have an angle β=90° facing away from the first device 720, and the second heat conducting sheet 732b is arranged perpendicular to the first heat conducting sheet 731. For example, since the thickness of the second heat conducting sheet 732b is relatively small, the surface of the second heat conducting sheet 732b facing the first device 720 and the surface of the second heat conducting sheet 732b facing away from the first device 720 can be regarded as parallel, so the surface of the second heat conducting sheet 732b facing the first device 720 can be regarded as the plane S4, or the surface of the second heat conducting sheet 732b facing away from the first device 720 can be regarded as the plane S4. Similarly, the thickness of the first heat conducting sheet 731 is relatively small, and therefore the surface of the first heat conducting sheet 731 facing the first device 720 and the surface of the first heat conducting sheet 731 facing away from the first device 720 can be regarded as parallel, so that the surface of the first heat conducting sheet 731 facing the first device 720 can be regarded as plane S3, or the surface of the first heat conducting sheet 731 facing away from the first device 720 can be regarded as plane S3.

[0076] Figure 8 A schematic diagram of a top view of the structure of the first heat conducting sheet and the first device provided in an embodiment of the present application, referring to Figure 8The power converter includes: a first housing 700, a circuit board 710, a first device 720, a first heat conducting sheet 731, and second heat conducting sheets 732a and 732b. The area surrounded by the edge of the orthographic projection of the first heat conducting sheet 731 on the circuit board 710 covers the orthographic projection of the first device 720 on the circuit board 710. The rest of the contents in this embodiment may be substantially the same as those in the above-mentioned embodiment, and will not be described in detail here.

[0077] Fig. 9 Another cross-sectional structural schematic diagram of a power converter provided in an embodiment of the present application, referring to Fig. 9 The power converter includes: a first housing 700, a circuit board 710, a first device 720, a first heat conducting sheet 731, and second heat conducting sheets 732a and 732b. Taking the second heat conducting sheet 732b as an example, the angle β between the plane where the second heat conducting sheet 732b is located and the plane where the first heat conducting sheet 731 is located, which faces away from the first device 720, can satisfy 0°<β<90° (for example, β=30°, 40°, 60°), which can effectively increase the heat dissipation area of ​​the second heat conducting sheet 732b. Of course, in practical applications, the specific value of the angle β can be flexibly designed according to actual conditions, and is not limited here. In addition, the rest of the contents in this embodiment can be basically the same as those in the above-mentioned embodiment, and will not be repeated here.

[0078] Fig.10 Another cross-sectional structural schematic diagram of the power converter provided in the embodiment of the present application, referring to Fig.10 , the power converter includes: a first housing 700, a circuit board 710, a first device 720, a first heat conducting sheet 731, and second heat conducting sheets 732a and 732b. In order to improve the heat dissipation and temperature equalization effect of the second heat conducting sheets 732a and 732b, the thickness h2a of the second heat conducting sheet 732a can be greater than the thickness h1 of the first heat conducting sheet 731, and the thickness h2b of the second heat conducting sheet 732b can be greater than the thickness h1 of the first heat conducting sheet 731. And, the thickness h2a of the second heat conducting sheet 732a and the thickness h2b of the second heat conducting sheet 732b can be the same or different. Of course, in practical applications, the thickness of the second heat conducting sheet can be flexibly adjusted according to actual heat dissipation requirements. That is to say, according to actual heat dissipation requirements, the thickness of the second heat conducting sheet can also be less than the thickness of the first heat conducting sheet. In addition, the rest of the contents in this embodiment can be basically the same as the contents in the above-mentioned embodiment, and will not be repeated here.

[0079] Fig.11 Another cross-sectional structural schematic diagram of the power converter provided in the embodiment of the present application, referring to Fig.11The power converter includes: a first housing 700, a circuit board 710, a first device 720, a first heat conducting sheet 731, and second heat conducting sheets 732a and 732b. The second ends of the second heat conducting sheets 732a and 732b extend to the first housing 700 and contact the first housing 700. Thus, the second heat conducting sheets 732a and 732b are abutted against the first housing 700, so that the heat on the first electronic device is transferred from the first pin 721 to the first heat conducting sheet 731, and the heat is then transferred from the first heat conducting sheet 731 to the second heat conducting sheets 732a and 732b, and then directly transferred to the first housing 700 through the second heat conducting sheets 732a and 732b, thereby further shortening the heat dissipation path, improving the heat dissipation effect, and further reducing the baking of the remaining devices on the circuit board 710. In addition, the rest of the contents in this embodiment may be substantially the same as those in the above-mentioned embodiment, and will not be repeated here.

[0080] Fig.12 Another cross-sectional structural schematic diagram of the power converter provided in the embodiment of the present application, referring to Fig.12 , the power converter includes: a first housing 700, a circuit board 710, a first device 720, a first heat conductive sheet 731, second heat conductive sheets 732a, 732b and third heat conductive sheets 733a, 733b. Among them, the third heat conductive sheet 733a is connected to the second end of the second heat conductive sheet 732a, the third heat conductive sheets 733a, 733b are in contact with the inner wall of the first housing 700, and the third heat conductive sheets 733a, 733b extend along the plane where the inner wall of the first housing 700 is located, thereby achieving heat dissipation by attaching to the shell, and further improving the heat dissipation effect. Exemplarily, the third heat conductive sheet 733a is attached to the inner wall of the first housing 700 through a thermal interface material 760. The third heat conductive sheet 733b is connected to the second end of the second heat conductive sheet 732b, and the third heat conductive sheet 733b is attached to the inner wall of the first housing 700 through a thermal interface material 760. With this arrangement, since the thermal interface material is not only heat-conducting but also has a certain degree of adhesion, the third heat-conducting sheets 733a and 733b can be bonded to the inner wall of the first shell 700, so that the heat on the second heat-conducting sheets 732a and 732b can be conducted to the first shell 700 through the third heat-conducting sheets 733a and 733b, respectively, to achieve heat dissipation by attaching the shell to the heat sink, further improving the heat dissipation effect. Of course, the third heat-conducting sheets 733a and 733b can also be welded to the inner wall of the first shell 700. Furthermore, in order to improve the efficiency of heat conduction, the second heat-conducting sheet and the third heat-conducting sheet can be made of the same material, and the second heat-conducting sheet and the third heat-conducting sheet can be an integrally formed structure. In addition, the rest of the contents in this embodiment can be basically the same as those in the above-mentioned embodiment, and will not be repeated here.

[0081] Fig.13a This is another cross-sectional structural schematic diagram of a power converter provided in an embodiment of the present application. Fig.13bThis is another schematic diagram of a heat conduction structure provided in an embodiment of the present application. Fig.13a and Fig.13b The power converter includes: a first housing 700, a circuit board 710, a first device 720, a first heat conducting sheet 731, a second heat conducting sheet 732a, 732b and a third heat conducting sheet 733a, 733b. The first heat conducting sheet 731 includes: a metal sheet 7311 and an insulating layer 7312, and the insulating layer 7312 covers the surface of the metal sheet 7311 and the inner wall of the opening KK. That is, the body of the first heat conducting sheet 731 is the metal sheet 7311, and the insulating layer 7312 covers the outer surface of the metal sheet 7311, so that the metal sheet 7311 is insulated from the first pin 721 by the insulating layer 7312. In the actual process preparation process, the insulating layer can be formed on the outer surface of the metal sheet by spraying, evaporation, deposition and other processes. In addition, the material of the metal sheet can be a metal or alloy with isotropic thermal conductivity, and the material of the insulating layer is a material that can achieve electrical insulation. In addition, the material of the metal sheet and the material of the insulating layer also need to meet the high temperature during the reflow soldering process to ensure that the insulating layer and the metal sheet will not be damaged during the reflow soldering process and achieve a normal soldering process. In addition, the material of the insulating layer can also have a certain thermal conductivity to improve the heat dissipation effect. Further, in order to improve the efficiency of heat conduction, the second thermal conductive sheet can be made of the same material as the metal sheet, and the second thermal conductive sheet and the metal sheet are an integrally formed structure. In addition, the rest of the content in this embodiment can be basically the same as the content in the above embodiment, and will not be repeated here.

[0082] It is understandable that the first heat conducting sheet may also include a graphite sheet and an insulating layer, and the insulating layer covers the surface of the graphite sheet and the inner wall of the opening. That is, the body of the first heat conducting sheet is a graphite sheet, and the insulating layer covers the outer surface of the graphite sheet, so that the graphite sheet is insulated from the first pin through the insulating layer. Further, in order to improve the efficiency of heat conduction, the second heat conducting sheet can be made of the same material as the graphite sheet, and the second heat conducting sheet and the graphite sheet are an integrally formed structure. In addition, the graphite sheet has a higher thermal conductivity (for example, 300 to 1900 W / (m·K)) along the horizontal direction (i.e., the direction perpendicular to the stacking direction), but a lower thermal conductivity (5 to 20 W / (m·K)) in the stacking direction, which can also achieve heat dissipation while reducing the baking of other low-temperature specification devices on the circuit board.

[0083] In specific implementation, an insulating layer may be formed on the outer surface of the second heat conducting plate and / or the outer surface of the third heat conducting plate by using processes such as spraying, evaporation, and deposition to further improve the overall insulation performance.

[0084] Of course, the heat conducting layer in the first heat conducting sheet may also be configured as other achievable structures, which are not limited here.

[0085] Fig.14 Another cross-sectional structural schematic diagram of the power converter provided in the embodiment of the present application, referring to Fig.14 The power converter includes: a first housing 700, a circuit board 710, first components 720a, 720b, a first heat conducting sheet 731, and second heat conducting sheets 732a, 732b. Fig.14 Taking two first devices 720a and 720b as an example, the first devices 720a and 720b share a heat-conducting structure, so that the same heat-conducting structure can be used to solve the heat dissipation problem for multiple first devices. In other words, the first device 720 can be set to multiple, such as two, three, four or more, which is determined according to the needs of actual applications and is not limited here. In addition, the rest of the content in this embodiment can be basically the same as the content in the above embodiment, and will not be repeated here.

[0086] Fig.15 Another cross-sectional structural schematic diagram of the power converter provided in the embodiment of the present application, referring to Fig.15 , the power converter includes: a first housing 700, a circuit board 710, a first device 720, a first heat conducting sheet 731, second heat conducting sheets 732a, 732b and a second device 750. Among them, the second device 750 has a second pin 751, the first surface S1 has a second solder pad 712, and the second solder pad 712 is connected to the second pin 751, and the heat generated by the first device 720 at maximum power is greater than the heat generated by the second device 750 at maximum power. For example, the first device 720 can be a heating device with a high heat generation and a high temperature specification. The second device 750 is set as a low-temperature device with a low heat generation and a low temperature specification. Thus, a heat-conducting structure is set under the first device with a high heat generation, and the heat-conducting structure is used to prevent the first device from baking the second device. Further, the heat-conducting structure 730 is not set under the second device 750 with a low heat generation, so as to reduce the use of the heat-conducting structure 730 and reduce the cost. In addition, the rest of the contents in this embodiment may be basically the same as those in the above-mentioned embodiment, and will not be repeated here.

[0087] The embodiment of the present application also provides a power device, which includes: a first device 720 and a heat-conducting structure 730, wherein the heat-conducting structure 730 includes a first heat-conducting sheet 731 and second heat-conducting sheets 732a and 732b, wherein the first heat-conducting sheet 731 is disposed on one side of the first device 720, for example, the first heat-conducting sheet 731 is disposed on the side of the first device 720 having the first pin. The first ends of the second heat-conducting sheets 732a and 732b are respectively connected to the first heat-conducting sheet 731, and the second heat-conducting sheets 732a and 732b extend in a direction away from the first heat-conducting sheet 731. Thus, by providing the first heat-conducting sheet 731 and the second heat-conducting sheets 732a and 732b, the heat generated on the first device 720 can be preferentially transferred to the first heat-conducting sheet 731, and then transferred from the first heat-conducting sheet 731 to the second heat-conducting sheets 732a and 732b, and diffused outward through the second heat-conducting sheets 732a and 732b, thereby reducing the heat dissipation path and improving the heat dissipation effect.

[0088] In some embodiments, the power device further includes a second device, wherein the heat generated by the first device at maximum power is greater than the heat generated by the second device at maximum power. Thus, a heat-conducting structure is provided under the first device with a higher heat generation, and the heat-conducting structure is used to prevent the first device from baking the second device. Furthermore, no heat-conducting structure is provided under the second device with a lower heat generation, thereby reducing the use of the heat-conducting structure and reducing costs.

[0089] It is understandable that the remaining structures of the first device 720 and the heat-conducting structure 730 may refer to the remaining structures of the first device 720 and the heat-conducting structure 730 in any of the above embodiments, and will not be described in detail herein.

[0090] The above contents are only specific implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be covered by the protection scope of the present application.

Claims

1. A power converter, characterized in that: include: A first housing, a circuit board and a first component, wherein the circuit board and the first component are arranged inside the first housing, and the first component is arranged on the circuit board; The power converter also includes a heat-conducting structure, which includes a first heat-conducting plate and a second heat-conducting plate. The first heat-conducting plate is arranged between the circuit board and the first device, the first end of the second heat-conducting plate is connected to the first heat-conducting plate, and the second heat-conducting plate extends in a direction close to the inner wall of the first shell.

2. The power converter according to claim 1, characterized in that The first component has a first pin, the first heat conducting sheet has a penetrating opening, and the first pin penetrates through the opening and is connected to the circuit board.

3. The power converter according to claim 1 or 2, characterized in that: The power converter further includes a welding portion, through which the first pin is connected to the circuit board, and the first pin is also fixedly connected to the first heat conducting plate through the welding portion, and the first heat conducting plate is insulated from the welding portion.

4. The power converter according to claim 2 or 3, characterized in that: There are a plurality of first pins and the plurality of first pins are arranged at intervals from each other, there are a plurality of openings and the plurality of openings are arranged at intervals from each other, and the plurality of first pins correspond to the plurality of openings one by one; The orthographic projection of the opening on the circuit board covers the orthographic projection of the corresponding first pin on the circuit board.

5. The power converter according to any one of claims 1 to 4, characterized in that: The material of the first heat conductive sheet is a heat conductive insulating material.

6. The power converter according to claim 5, characterized in that The second heat conducting sheet is made of the same material as the first heat conducting sheet, and the second heat conducting sheet and the first heat conducting sheet are an integrally formed structure.

7. The power converter according to any one of claims 1 to 4, characterized in that: The first heat conducting sheet includes: a heat conducting layer and an insulating layer, wherein the insulating layer covers the surface of the heat conducting layer and the inner wall of the opening.

8. The power converter according to claim 7, characterized in that: The second heat conducting sheet and the heat conducting layer are made of the same material, and the second heat conducting sheet and the heat conducting layer are an integrally formed structure.

9. The power converter according to any one of claims 1 to 8, characterized in that: The second end of the second heat conductive sheet extends to the first shell and contacts the first shell.

10. The power converter according to any one of claims 1 to 9, characterized in that: The first heat conducting plate has a plurality of side edges; at least one side edge is connected to one of the second heat conducting plates.

11. The power converter according to any one of claims 1 to 10, characterized in that: The heat-conducting structure further includes: a third heat-conducting sheet, the third heat-conducting sheet being connected to the second end of the second heat-conducting sheet; The third heat conducting plate contacts the inner wall of the first shell, and the third heat conducting plate extends along the plane where the inner wall of the first shell is located.

12. The power converter according to claim 11, characterized in that The second heat conducting sheet is made of the same material as the third heat conducting sheet, and the second heat conducting sheet and the third heat conducting sheet are an integrally formed structure.

13. The power converter according to any one of claims 1 to 12, characterized in that: An angle is formed between the plane where the second heat conducting plate is located and the plane where the first heat conducting plate is located, facing away from the first device, and the range of the angle is (0°, 90°).

14. The power converter according to any one of claims 1 to 13, characterized in that: The thickness of the second heat conducting sheet is greater than or equal to the thickness of the first heat conducting sheet.

15. The power converter according to any one of claims 1 to 14, characterized in that: The power converter further includes: a second device having a second pin, the second pin being interconnected with the circuit board, and the heat generated by the first device at maximum power is greater than the heat generated by the second device at maximum power.

Images