Conductive gasket and electromagnetic wave shielding device using same

Abstract

Disclosed are: a conductive gasket which can be easily pressed with a small force by means of the restoring force of a bent part of a polymer film, and which can be in reliable electrical contact with an object; and an electromagnetic wave shielding device which uses the conductive gasket. The conductive gasket has a polymer film having an adhesive layer formed on the inner surface and a metal layer formed on the outer surface, the polymer film is bent on at least one side so as to surround the adhesive layer to form a bent portion, and at least a portion of the bent portion is provided with a metal layer. The adhesive layers are not adhered to each other to form an inner space surrounded by the polymer film, the adhesive layers are adhered to each other to form a support layer in a portion where the polymer film overlaps except the bent portion, and a support portion is formed by the portion where the polymer film overlaps and the support layer.

Description

Technical Field

[0001] The present invention relates to a conductive gasket, and more particularly, to a conductive gasket that is low in height and can be pressed down much with a small force and can achieve reliable electrical contact with an object. In addition, the present invention relates to a technology that can effectively dissipate heat generated by a semiconductor chip to the outside while effectively blocking the outflow and inflow of electromagnetic waves centered on the semiconductor chip. Background Art

[0002] Generally, a conductive spacer that is interposed between opposing conductive objects to electrically connect the objects should have good conductivity and excellent elastic restoring force.

[0003] Such a conductive spacer is attached to an object to shield electromagnetic waves generated from electronic components such as semiconductor chips or to electrically connect the object.

[0004] The inventor's Korean authorized patent No. 1804881 discloses a coreless elastic electrical contact terminal, which is sandwiched and contacted between objects to form an electrical path between the objects, and is characterized in that it includes: a polymer film with a metal layer bonded to the outer surface; and a support layer of elastic material, which is bonded to the inner surface of the film by curing, wherein the two side walls of the film are bent with a predetermined curvature radius, and a) a part of the space on the inner side of the bent two side walls is filled with the support layer, and the elastic force of the filled support layer is used to support the object, or b) the support layer is coated on the inner side of the bent two side walls to form an elastic sheet together with the film, and the object is supported by the restoring force of the elastic sheet.

[0005] However, since the upper surface of such an electrical contact terminal is flat as a whole, there is a disadvantage that it is difficult to greatly press a flat object with a small force.

[0006] That is, there is a limitation in providing a structure of an electrical contact terminal that has a small pressing force and is greatly pressed in the height direction to have a large pressed operation distance, and it is difficult to reliably limit the height to which the electrical contact terminal is pressed.

[0007] Furthermore, the lower surface of the electrical contact terminal is flat as a whole, so when the adhesive tape is adhered to the lower surface of the electrical contact terminal, the metal layer of the electrical contact terminal is unlikely to come into direct electrical contact with the conductive object due to the thickness of the adhesive tape.

[0008] Furthermore, when applied to a semiconductor chip mounted on a circuit board, there is a limitation in shielding a large amount of electromagnetic waves flowing in and out in a direction not covered by a polymer film of an electrical contact terminal based on the side wall of the semiconductor chip.

[0009] In addition, a metal shield having openings is used to shield a semiconductor chip mounted on a circuit board from electromagnetic waves, protect the semiconductor chip, and transfer and disperse heat generated in the semiconductor chip.

[0010] For example, Korean Patent No. 2413323 discloses a structure in which a conductive gasket is interposed between a frame and a shielding cover in order to maintain a contact state with the shielding cover, so that the shielding cover and the frame are physically and electrically connected.

[0011] However, according to this prior art, there are limitations in that the semiconductor chip and the frame perform good heat transfer and effectively shield electromagnetic waves.

[0012] In other words, there are limitations in that the conductive gasket is greatly pressed by an object with a small force and has a thin thickness as a whole, when the frame presses the semiconductor chip in the vertical direction, the pressing force is dispersed instead of being concentratedly applied only to the upper surface of the semiconductor chip, and the conductive gasket and the shielding cover are formed as one body so that they can be picked up and mounted at one time. Summary of the invention

[0013] Therefore, an object of the present invention is to provide a thin conductive spacer that can be pressed greatly with a small force.

[0014] Another object of the present invention is to provide a thin-thick conductive gasket that can easily provide direct electrical contact or reliable electrical contact with a conductive object.

[0015] Another object of the present invention is to provide a low-thickness conductive gasket that can easily form an opening that can accommodate a semiconductor chip or the like inside and can shield a large amount of electromagnetic waves that flow in or out in a horizontal direction along the semiconductor chip accommodated in the opening.

[0016] Another object of the present invention is to provide an electromagnetic wave shielding device that can be greatly pressed between objects with a small force and can elastically contact the objects with a low resistance.

[0017] Still another object of the present invention is to provide an electromagnetic wave shielding device having a structure that can easily limit the force applied to the upper surface of a semiconductor chip.

[0018] Another object of the present invention is to provide an electromagnetic wave shielding device having a structure that effectively shields electromagnetic waves generated on the side surface of a semiconductor chip or electromagnetic waves flowing into the semiconductor chip, and easily and effectively transfers heat generated by the semiconductor chip to a cooling unit.

[0019] The above-mentioned purpose is achieved by a conductive gasket, which is sandwiched between opposing objects in a pressed manner and shields electromagnetic waves or makes an electrical connection. It is characterized in that the conductive gasket has a conductive film composed of a conductive component and an elastic curable adhesive layer bonded to the conductive component by curing, wherein the conductive film is bent into a curve on both sides of the width direction of the conductive gasket so that the adhesive layer is located on the inner side, thereby forming a curved portion having an internal space extending along the length direction of the conductive gasket, except for the curved portion, in the portion where the conductive film overlaps in a relative manner, the adhesive layers are bonded to each other to form a supporting layer, and a supporting portion is formed by the overlapping portion of the conductive film and the supporting layer, the maximum height of the curved portion is higher than the maximum height of the supporting portion, and when the object presses the conductive gasket, the curved portion elastically contacts the object by the elastic restoring force of the curved portion.

[0020] Preferably, the conductive component may be a polymer film having a metal layer formed on one surface and the adhesive layer bonded to the other surface, or a conductive fiber bonded to the adhesive layer, wherein the metal layer may be formed by plating or composed of metal foil.

[0021] Preferably, the support portion may be flat, and both ends of the conductive component may be located on a lower surface of the support portion.

[0022] Preferably, a plurality of microporous spaces smaller than the internal space caused by air may be formed in the support layer, so that the support portion becomes softer.

[0023] Preferably, the cross section of the conductive gasket may be symmetrical in the width direction, and the cross section of the bent portion may be a circle or an ellipse in which the height of the middle portion in the horizontal direction is the maximum height.

[0024] Preferably, an adhesive tape may be adhered to the conductive component formed on the lower surface of the support portion, wherein the adhesive tape does not protrude beyond the lowermost portion of the bent portion, so that the conductive component on the lower surface of the bent portion can directly contact the object.

[0025] Preferably, at least one opening penetrating the conductive gasket in the thickness direction may be formed in the support portion, and the maximum height of the gasket in the bent portion may be greater than the maximum height of a semiconductor chip received in the opening and mounted on the circuit base substrate.

[0026] Preferably, conductive powder may be mixed in the support layer, so that electromagnetic waves flowing into or out of the semiconductor chip accommodated in the opening in a direction where the bent portion is not formed can be shielded by the support layer.

[0027] Preferably, the conductive component may include: a polymer film having a metal layer formed on one surface or conductive fibers bonded thereto; and a flat reinforcing sheet having one surface bonded to the other surface of the polymer film and having the adhesive layer bonded thereto on the other surface.

[0028] Preferably, at the bent portion, the adhesive layers may not be bonded to each other to form an inner space surrounded by the conductive film, or, at the bent portion, the adhesive layers may be bonded to each other and connected to the support layer.

[0029] The above-mentioned purpose is achieved by an electromagnetic wave shielding device, which surrounds a semiconductor chip installed on a circuit substrate and shields electromagnetic waves, and is characterized in that the electromagnetic wave shielding device includes: a metal shielding shell having an opening formed on the upper surface and a flange formed along the edge of the opening; and a conductive gasket attached to the upper surface of the flange, wherein the conductive gasket has a conductive film composed of a conductive component and an elastic curable adhesive layer bonded to the conductive component by curing, and the conductive film is bent into a curve on both sides of the width direction of the conductive gasket in a manner such that the adhesive layer is located on the inner side, thereby forming a conductive film having an elastic curable adhesive layer along the conductive component. A curved portion of an internal space extending in the length direction of the conductive gasket, except for the curved portion, at the portion where the conductive film overlaps in a relative manner, the adhesive layers are bonded to each other to form a supporting layer, and a supporting portion is formed by the overlapping portion of the conductive film and the supporting layer, an opening is formed in the supporting portion that passes through the conductive gasket in the thickness direction, the maximum height of the curved portion is higher than the maximum height of the supporting portion, when the object presses the conductive gasket, the elastic restoring force of the curved portion elastically contacts the object, and the surface of the semiconductor chip is exposed to the outside through the opening of the conductive gasket and the opening of the metal shielding shell.

[0030] Preferably, the opening of the metal shielding shell may correspond to the opening of the conductive pad, so that surfaces of more than two semiconductor chips are exposed to the outside.

[0031] Preferably, the conductive gasket can be installed on the inner side of the edge of the metal shielding shell, the conductive gasket can cope with welding temperature, the metal shielding shell can be welded, and the electromagnetic wave shielding device can be surface mounted based on vacuum pickup on the conductive gasket part.

[0032] According to the present invention, the height of the bent portion is greater than that of the supporting portion, so that a large pressing force can be performed with a small force.

[0033] In addition, reliable electrical contact with an object can be achieved by the elastic restoring force of the bent portion and the thickness of the adhesive tape.

[0034] In addition, the conductive powder of the support layer prevents the conductive pad from being pressed below a predetermined height and can shield a large number of electromagnetic waves flowing into and out of the side surface of the semiconductor chip accommodated in the opening of the conductive pad.

[0035] In addition, by making the force applied by an object such as a cooling unit be shared or at least prevented from being solely borne by a thin elastic conductive gasket, a metal shielding shell and a semiconductor chip that is pressed greatly with a small force, it is possible to prevent damage to the semiconductor chip and effectively shield the semiconductor chip from electromagnetic waves while quickly transferring the heat generated by the semiconductor chip to the cooling unit.

[0036] In addition, in the case where the supporting layer has conductivity, electromagnetic waves in the horizontal direction of the conductive spacer including both ends not covered by the polymer film can be shielded.

[0037] In addition, by using a thin conductive gasket that is pressed greatly with a small force and a thermoelectric component with low hardness to fill the gap created by the height difference between the shielding cover and the semiconductor chip, it is possible to effectively shield electromagnetic waves while quickly transferring the heat generated by the semiconductor chip to the cooling unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 A conductive gasket according to an embodiment of the present invention is shown.

[0039] Figure 2 is along Figure 1 A cross-sectional view taken along line 2-2'.

[0040] Figure 3 A conductive gasket according to another embodiment of the present invention is shown.

[0041] Figure 4 The conductive pad is shown attached to the circuit board.

[0042] Figure 5The electromagnetic wave shielding device according to the embodiment of the present invention is shown in an exploded view.

[0043] Figure 6 It is a cross-sectional view showing an integrated electromagnetic wave shielding device.

[0044] Figure 7 A state in which an electromagnetic wave shielding device is applied is shown.

[0045] Figure 8 A conductive gasket according to another embodiment of the present invention is shown.

[0046] Reference numerals 100: Conductive gasket 101: Bending part 102: Support 110: Conductive film 111: Interval 112: Inner Space 120: Polymer film 130: Metal layer 140: Adhesive layer 141: Microporous space 142: Support layer 150: Adhesive tape DETAILED DESCRIPTION

[0047] It should be noted that the technical terms used in the present invention are only used to illustrate specific embodiments, and are not used to limit the present invention. In addition, the technical terms used in the present invention, if not specifically defined in the present invention as having other meanings, should be interpreted as the meanings commonly understood by persons with ordinary knowledge in the technical field to which the present invention belongs, and should not be interpreted as overly broad meanings or overly narrow meanings.

[0048] The present invention is described in detail below with reference to the accompanying drawings, wherein the accompanying drawings are used to help understand the present invention, and for the sake of convenience of description, the dimensions of some structures may be ignored and slightly exaggerated.

[0049] Figure 1 FIG. 4 shows a conductive gasket according to an embodiment of the present invention. Figure 2 is along Figure 1 A cross-sectional view taken along line 2-2'.

[0050] The conductive gasket 100 has a small thickness and elastic restoring force, and is sandwiched between opposing conductive objects in a pressed manner, thereby playing a role in shielding electromagnetic waves or electrical connection.

[0051] The conductive spacer 100 is preferably able to cope with soldering temperature and can be subjected to reflow soldering using solder paste.

[0052] like Figure 1 As shown, the conductive gasket 100 is in the shape of a sheet with a width and a length much greater than its thickness, and curved portions 101 with elliptical cross-sections are formed on both sides of the conductive film 110 in the width direction, and flat supporting portions 102 are formed between the curved portions 101 .

[0053] In this embodiment, the bent portion 101 is formed on both sides of the conductive film 110 in the width direction, but the bent portion 101 may be formed on at least one side.

[0054] The height of the thickest part of the conductive spacer 100 (ie, the maximum height H of the bent portion 101 ) is 0.15 mm to 1.2 mm, preferably 0.15 mm to 0.5 mm, but is not limited thereto.

[0055] The conductive film 110 is composed of a polymer film 120 having a metal layer 130 formed on the outer surface thereof, and an adhesive layer 140 formed on the inner surface of the polymer film 120 .

[0056] In this embodiment, the polymer film 120 having the metal layer 130 formed on the outer surface is shown as an example of the conductive member, but it may have other structures.

[0057] For example, the conductive component may be a metal deposition layer or a metal plating layer formed on the polymer film 120 by metal deposition or metal plating, a metal foil formed on the polymer film 120, or a conductive fiber (woven fabric, non-woven fabric) plated with metal, and the conductive fiber may be bonded to the polymer film 120, or may be used without the polymer film 120.

[0058] Therefore, the conductive film 110 is composed of a conductive member and an adhesive layer 140 formed by bonding the conductive member and the adhesive layer 140 , and a reinforcing sheet may be interposed between the conductive member and the adhesive layer 140 .

[0059] The reinforcing sheet is bonded to the conductive member, and may be, for example, a material such as a rubber sheet or polymer film 120 having elasticity of a predetermined thickness.

[0060] The conductive film 110 is bent at both sides facing each other in the width direction so that the adhesive layer 140 is located inside, thereby forming a bent portion 101 having an internal space 112 extending in the longitudinal direction of the spacer.

[0061] In addition, in the portion where the conductive film 110 overlaps except the bent portion 101 , the adhesive layers 140 are bonded to each other to form a support layer 142 , thereby constituting the support portion 102 together with the conductive film 110 .

[0062] Alternatively, in order to prevent the adhesive layers 140 from being adhered to each other at the bent portion 101 , the adhesive layer 140 may not be formed directly on the bent portion 101 .

[0063] The metal layer 130 may be made of a material that can be reflow-soldered using solder paste. Most preferably, a metal layer formed on the polymer film 120 by plating may be used as the metal layer 130 .

[0064] For example, the adhesive layer 140 is a rubber having elasticity formed by curing liquid silicone rubber or polyurethane rubber, and the cured silicone rubber can cope with welding temperature.

[0065] The polymer film 120 may be a common polyimide (PI) film or polyester (PET) film having a mechanical strength above a predetermined level. Preferably, the thickness of the polymer film 120 is greater than the thickness of the metal layer 130, so that when the curved portion 101 having the internal space 112 is pressed, the elastic recovery is good and the damage due to external force is less. Furthermore, when the material of the polymer film 120 is polyimide, the polymer film 120 can cope with the welding temperature.

[0066] As an example, the thickness of the polymer film 120 may be 7 to 30 μm, and the thickness of the metal layer 130 may be about 2 to 15 μm. When the material of the polymer film 120 is polyimide, the soldering temperature can be coped with.

[0067] In addition to the thickness of the polymer film 120 and the metal layer 130, the elastic restoring force at the bend 101 can also be determined based on at least one of the curvature radius of the bend 101, the material, hardness and thickness of the adhesive layer 140, and the size of the bend 101 appropriately corresponds to the size of the metal shielding shell 180.

[0068] A double-sided adhesive tape (PSA) 150 may be bonded to the metal layer 130 on the lower surface of the conductive gasket 100 , so that the conductive gasket 100 can be bonded to an object through the double-sided adhesive tape 150 . The double-sided adhesive tape 150 may be conductive or electrically insulating.

[0069] Reference Figure 2 The adhesive tape 150 is bonded to the metal layer 130 on the lower surface of the conductive gasket 100 corresponding to the support portion 102 , and can extend and bond to the front of the thickest part of the bending portion 101 .

[0070] When the conductive gasket 100 is bonded to an object by the adhesive tape 150 , the adhesive tape 150 may have a thickness that allows at least a portion of the metal layer 130 on the lower surface of the bent portion 101 to directly and electrically contact the object.

[0071] In other words, if Figure 2As shown by the dotted line in the circle, since the horizontal plane of the lower surface of the bent portion 101 is lower than the horizontal plane of the lower surface of the adhesive tape 150, that is, due to the height difference Dt, when the conductive gasket 100 is not pressed, the lower surface of the bent portion 101 can be in direct electrical contact with the object, ultimately having a lower contact resistance.

[0072] exist Figure 2 In the embodiment, the support layer 142 is formed by self-adhesion of the adhesive layers 140 coated on the inner surface of the polymer film 120 during the manufacturing process, and is connected to the adhesive layer 140 formed on the inner surface of the polymer film 120 in the curved portion 101 .

[0073] As described above, in the curved portion 101 , the adhesive layers 140 are not bonded to each other and form the inner space 112 surrounded by the adhesive layers 140 , and as in this embodiment, the cross-sectional shape of the curved portion 101 may be an ellipse with a width greater than a height.

[0074] The internal space 112 can be determined according to the amount of adhesive corresponding to the adhesive layer 140 or the thickness of the support layer 142, the size of the conductive gasket 100, the manufacturing process, etc. Preferably, when the bent portion 101 formed with the internal space 112 is pressed to the same height as the support portion 102, it can be pressed with a smaller force. In other words, the force pressing the bent portion 101 in the height direction per unit area is smaller than the force pressing the support portion 102.

[0075] According to this embodiment, the height of the gasket in the curved portion 101 forming the internal space 112 is higher than the height of the gasket in the supporting portion 102. Therefore, when the conductive gasket 100 is pressed by an object, the curved portion 101 is pressed by the object first, and the pressing distance of the conductive gasket 100 can be increased eventually, thereby enabling a large press with a smaller force.

[0076] Although it may vary depending on the purpose of the conductive gasket 100 , in the present invention, since the height of the conductive gasket 100 is relatively low, preferably, the maximum height of the gasket in the bending portion 101 is 1.1 to 2 times the maximum height of the gasket in the supporting portion 102 .

[0077] When it is less than 1.1 times, the effect of the present invention is not good. When it is more than 2 times, it is difficult to form the bent portion 101 based on the maximum height of the pad in the support portion 102 and difficult to handle.

[0078] According to this structure, when the conductive gasket 100 is pressed to a predetermined height in the vertical direction by an object, since the height of the gasket in the bending portion 101 is higher than the height of the gasket in the supporting portion 102 and contact starts from the bending portion 101, the conductive gasket 100 as a whole can be greatly pressed with a small force.

[0079] Among them, when the conductive gasket 100 is pressed in the vertical direction by an object, pressing only the bent portion 101 will directly connect electrically to the object, so that electrical contact with the object can be made with a smaller force. However, when the object is pressed together with the support portion 102, it can have a lower contact resistance and can well shield electromagnetic waves.

[0080] The internal space 112 of the bent portion 101 can be formed by making the adhesive layers 140 in the bent portion 101 non-adhesive and separated from each other during the process of the conductive film 110 being bent into a curve to form the bent portion 101 and the supporting portion 102. For example, it can be determined according to the structure and manufacturing method of the mold for manufacturing the conductive gasket 100, or the amount and viscosity of the liquid adhesive, the material and thickness of the polymer film 120 and the metal layer 130, etc.

[0081] The inner space 112 formed in the process of forming the bent portion 101 may maintain the shape of the inner space 112 after the liquid adhesive is cured.

[0082] Preferably, the thickness of the support layer 142 may be formed to be greater than the sum of the thickness of the polymer film 120 and the thickness of the metal layer 130 to have appropriate elasticity.

[0083] According to this structure, due to the restoring force of the curved portion 101 forming the internal space 112 and the height higher than the supporting portion 102, the conductive gasket 100 can be easily pressed greatly with a small force, and finally can achieve reliable electrical contact with the object.

[0084] As described above, in the support part 102 , the support layer 142 formed between the polymer films 120 is formed by allowing the adhesive layers 140 to self-adhere in a mutually opposed state. Since the adhesive layers 140 are relatively adhered to each other, microvoids 141 may be formed in the process of forming the support layer 142 .

[0085] The microporous space 141 can be formed by supplying air to the support layer 142 according to the restoring force of the polymer film 120 and the metal layer 130 in the support part 102, the structure of the mold for manufacturing the conductive gasket 100, the manufacturing method, the amount and viscosity of the liquid adhesive, etc.

[0086] Preferably, a plurality of microporous spaces 141 may be formed inside the entire support layer 142 , and have a size smaller than the internal space 112 of the curved portion 101 , so that the support portion 102 may become softer due to the microporous spaces 141 .

[0087] Preferably, a plurality of powders having a diameter smaller than the thickness of the support layer 142 may be dispersed in the support layer 142 constituting the support portion 102 , and the powders may function as spacers to limit the height of the support portion 102 when pressed, or may function to increase the mechanical strength of the support portion 102 .

[0088] The powder is uniformly distributed in the adhesive layer 140 , and eventually the powder may also be uniformly dispersed in the support layer 142 formed by self-bonding the adhesive layers 140 to each other.

[0089] As the powder, at least one of metal, ceramic, carbon and polymer can be used.

[0090] Among them, in the case of metal powder, copper powder or aluminum powder can be used to shield electromagnetic waves, and metal powder having magnetism can be used to absorb electromagnetic waves.

[0091] Preferably, considering the manufacturing efficiency of the conductive gasket 100 or the force of pressing the conductive gasket 100 , the maximum diameter of the powder may be 1 / 5 to 1 / 3 of the thickness of the support layer 142 , but is not limited thereto.

[0092] The support layer 142 containing powder is manufactured by mixing powder in liquid polymer rubber and then curing it, and the resistance of the support layer 142 is lowered as the conductive gasket 100 is pressed more.

[0093] The support portion 102 may be buried with a conductive metal member, for example, in a state where the conductive metal member is placed between the adhesive layers 140 corresponding to the portion of the support portion 102 , the support layer 142 may be formed by self-adhesion to each other.

[0094] In addition, a conductive metal component may be attached to the metal layer 130 of the conductive gasket 100 corresponding to the lower surface of the support portion 102 .

[0095] For example, the metal component may be in the shape of a foil made of copper, iron or an alloy thereof with uniform thickness and a width much greater than the thickness. The conductive gasket 100 can easily maintain flatness and better shield electromagnetic waves by the metal component.

[0096] When the metal component is attached to the metal layer 130 on the lower surface of the conductive gasket 100 , the metal component may be a material that can be soldered using solder paste.

[0097] As another embodiment, on the lower surface of the conductive gasket 100 , two ends of the polymer film 120 are separated to form a gap 111 , so that a portion of the support layer 142 can be exposed to the outside through the gap 111 .

[0098] In this structure, the support layer 142 has conductivity due to the dispersion of conductive powder, and is exposed to the outside through the space 111, so that it can be electrically connected to the conductive adhesive tape 150 or a conductive object in contact therewith.

[0099] Finally, electromagnetic waves flowing in or out through both ends of the conductive gasket 100 in the length direction that are not covered by the conductive film 110 can be shielded, thereby improving the electromagnetic wave shielding performance of the conductive gasket 100 as a whole.

[0100] Figure 3 FIG. 2 shows a conductive gasket according to another embodiment of the present invention. Figure 4 The conductive pad is shown attached to the circuit board.

[0101] In this embodiment, one or more openings 105 penetrating the conductive film 110 in the thickness direction are formed in the support portion 102 , and the bent portion 101 is formed as a pair at both ends of the support portion 102 in the width direction.

[0102] Preferably, the pair of curved portions 101 may be symmetrical to maintain balance with the object.

[0103] In this example, for example, the opening 105 is formed in the support portion 102 in a quadrilateral shape corresponding to the semiconductor chip 30 , but the invention is not limited thereto and the opening 105 may be formed in a shape corresponding to electronic components or circuit boards of various shapes.

[0104] Furthermore, the heights of the plurality of semiconductor chips 30 or the circuit substrates 10 may be different from each other, and the plurality of semiconductor chips 30 may be mounted on circuit substrates different from each other.

[0105] Preferably, the maximum height of the bent portion 101 is greater than the maximum height of the semiconductor chip 30 received in the opening 105 and mounted on the circuit substrate 10 .

[0106] When an opposing object presses the conductive gasket 100 in a vertical direction, the powder contained in the support layer 142 and the support portion 102 prevent the pressed object from contacting the surface of the semiconductor chip 30 , thereby allowing the support portion 102 to mechanically protect the semiconductor chip 30 while shielding electromagnetic waves.

[0107] In this case, it is preferable that conductive powder is contained in the support layer 142 to have conductivity.

[0108] When the conductive gasket 100 of this structure is clamped by an opposing conductive object in a pressed manner, the support layer 142 is conductive, so that the electromagnetic waves flowing in or out in the horizontal direction of the semiconductor chip 30 accommodated in the opening 105 not covered by the conductive film 110 can be more shielded.

[0109] As described below, in a case where the height of the semiconductor chip 30 is higher than the maximum height of the bent portion 101 of the conductive gasket 100, or where necessary, the conductive gasket 100 may not be mounted directly on the circuit substrate, but may be mounted on a shielding shell or shielding frame soldered on the circuit substrate to surround the semiconductor chip mounted on the circuit substrate and shield electromagnetic waves.

[0110] In this case, the conductive gasket 100 mounted on the shield case or the shield frame has elasticity and makes electrical contact with the opposing conductive member covering the shield case or the shield frame.

[0111] like Figure 4 As shown, it is considered that the conductive gasket 100 of the present invention is applied in a pressed manner and sandwiched between opposing objects.

[0112] The conductive pad 100 can be mounted by soldering the lower surface portion of the bent portion 101 to the circuit substrate 10 using solder 20, or can be mounted on the circuit substrate 10 by bonding the adhesive tape 150 to the metal layer 130 of the lower surface of the conductive pad 100 corresponding to the support portion 102 excluding the opening 105 and the bent portion 101. That is, the conductive pad 100 can be attached to the circuit substrate 10 or the conductive object by soldering or adhesive tape.

[0113] Preferably, the conductive gasket 100 is provided with a space for vacuum pickup in the support portion 102 , so that surface mounting based on vacuum pickup can be performed.

[0114] Figure 5 The electromagnetic wave shielding device according to the embodiment of the present invention is shown in an exploded view. Figure 6 It is a cross-sectional view showing an integrated electromagnetic wave shielding device.

[0115] The electromagnetic wave shielding device includes a metal shielding case 180 having an opening 185 formed on an upper surface and flanges 182 and 183 formed along edges of the opening 185 , and a conductive gasket 100 attached to the flanges 182 and 183 .

[0116] The conductive gasket 100 has Figure 3 The conductive gasket 100 of the embodiment has the same structure as that of the conductive gasket 100, so the detailed description thereof is omitted.

[0117] Preferably, the electromagnetic wave shielding device can be surface mounted on an object such as a circuit board by vacuum picking up the conductive spacer 100 portion, but it can also be vacuum picked up on the flanges 182 and 183 where the conductive spacer 100 is not formed.

[0118] Preferably, the conductive gasket 100 can cope with the welding temperature, the metal shielding shell 180 can be mounted on a circuit substrate or the like by welding, and the height of the metal shielding shell 180 can be higher than the maximum height of the conductive gasket 100 .

[0119] The size of the opening 185 of the metal shield case 180 may correspond to the size of the semiconductor chip mounted on the circuit substrate, and may be smaller than or equal to the size of the opening 105 of the conductive gasket 100 , and may be formed in more than one piece.

[0120] The conductive gasket 100 is pressed greatly with a small force at a relatively thin thickness and has elastic restoring force, so that it is sandwiched by the opposing metal shielding shell 180 and the cooling unit in a pressed manner, and plays a role in shielding electromagnetic waves or making electrical connections.

[0121] The conductive spacer 100 may be soldered to the object using solder paste, or may be attached to the object by the adhesive tape 150 adhered to the conductive spacer 100 .

[0122] In the conductive gasket 100, the lower surface portion of the bent portion 101 can be mounted by soldering to the flange 182 of the metal shielding shell 180 using solder 20, and mounted to the flange 183 by bonding the adhesive tape 150 to the metal layer 130 of the lower surface of the conductive gasket 100 corresponding to the support portion 102 excluding the opening 105 and the bent portion 101.

[0123] Figure 7 A state in which an electromagnetic wave shielding device is applied is shown.

[0124] At least one semiconductor chip 30 is mounted on the circuit substrate 10 , and the integrated electromagnetic wave shielding device is mounted on the circuit substrate 10 so as to surround the semiconductor chip 30 .

[0125] In addition to a single semiconductor chip, the semiconductor chip 30 also includes a semiconductor chip mounted on a sub-circuit substrate.

[0126] The height of the upper surface of the semiconductor chip 30 is lower than the maximum height of the bent portion 101 of the conductive spacer 100 , and the thermoelectric component 300 having a thickness corresponding to the height difference is interposed between the semiconductor chip 30 and the cooling unit 40 .

[0127] The thermoelectric component 300 may be in a gel or grease state, and may be formed on the upper surface of the semiconductor chip 30 after the electromagnetic wave shielding device is soldered to the circuit substrate 10 .

[0128] According to this structure, the electromagnetic waves flowing into or out of the semiconductor chip 30 can be shielded in all directions by an integrated electromagnetic wave shielding device, thereby increasing the reliability of the electromagnetic wave shielding and allowing the heat released from the semiconductor chip 30 to be quickly transferred to the cooling unit 40 through the thinner thermoelectric components.

[0129] Among them, the conductive gasket 100 can be attached to the flange of the metal shielding shell 180 when the metal shielding shell 180 is attached to the circuit substrate 10 to form an electromagnetic wave shielding device, or the integrated electromagnetic wave shielding device can be attached to the circuit substrate 10 after the conductive gasket 100 is attached to the flange of the metal shielding shell 180 to form an integrated electromagnetic wave shielding device.

[0130] Reference Figure 7 When the cooling unit 40 presses the conductive gasket 100 in the vertical direction, the bent portion 101 first contacts the cooling unit 40 and is pressed, and then the cooling unit 40 presses the supporting portion 102 .

[0131] At this time, if powder is dispersed in the support layer 142, the powder acts as a spacer as described above, thereby preventing the cooling unit 40 from contacting and pressing the surface of the semiconductor chip 30. As a result, the support portion 102 can mechanically protect the semiconductor chip 30 while shielding electromagnetic waves.

[0132] In particular, when the powder included in the support layer 142 is a conductive powder, a large amount of electromagnetic waves flowing into or out of the semiconductor chip 30 from both ends not surrounded by the polymer film 120 in the horizontal direction can be shielded.

[0133] Figure 8 A conductive gasket according to another embodiment of the present invention is shown.

[0134] The conductive film 210 is bent on both sides so that the adhesive layer 240 is located inside to form the bent portion 201. Unlike the above-mentioned embodiment, no internal space is formed in the bent portion 201, and the internal adhesive layers 240 are bonded to each other to form a support layer 242.

[0135] Therefore, the adhesive layer 240 is bonded to each other inside both the bent portion 201 and the support portion 202 formed by the conductive film 210 , thereby forming a support layer 242 .

[0136] The support portion 202 is formed with an opening 205 that penetrates the conductive spacer 200 in the thickness direction.

[0137] According to this structure, the support portion 202 is kept at the same height. Figure 8 The boundary of the curved portion 201 is indicated by a dotted line, so that the maximum height of the curved portion 201 is the same as the maximum height of the supporting portion 202, and the height at the curved portion 201 gradually decreases toward the end, so that the cross-section is semi-elliptical.

[0138] The above description is centered on the embodiments of the present invention, but various changes or modifications can be made at the level of ordinary technicians in the technical field to which the present invention belongs. Such changes and modifications can be regarded as belonging to the present invention without departing from the scope of the present invention. The scope of rights of the present invention should be determined according to the claims described below.

Claims

1. A conductive gasket, which is sandwiched between opposing objects in a pressed manner and shields electromagnetic waves or performs electrical connection, characterized in that: The conductive gasket has a conductive film composed of a conductive component and an elastic curable adhesive layer bonded to the conductive component by curing, wherein the conductive film is bent into a curve at both sides in the width direction of the conductive gasket so that the adhesive layer is located inside, thereby forming a curved portion having an internal space extending in the length direction of the conductive gasket, In the portion where the conductive films overlap in a relative manner except for the bent portion, the adhesive layers are bonded to each other to form a support layer, and a support portion is formed by the portion where the conductive films overlap and the support layer. The maximum height of the bent portion is higher than the maximum height of the supporting portion, When the object presses the conductive pad, the bent portion elastically contacts the object due to the elastic restoring force of the bent portion.

2. The conductive gasket according to claim 1, characterized in that: The conductive component is a polymer film having a metal layer formed on one surface and the adhesive layer bonded to the other surface, or a conductive fiber bonded to the adhesive layer. The metal layer is formed by plating or consists of a metal foil.

3. The conductive gasket according to claim 1, characterized in that: The support portion is flat, and both ends of the conductive member are located on a lower surface of the support portion.

4. The conductive gasket according to claim 3, characterized in that: A plurality of microporous spaces smaller than the inner space caused by air are formed in the support layer, thereby making the support portion more flexible.

5. The conductive gasket according to claim 1, characterized in that: The cross section of the conductive pad is symmetrical in the width direction.

6. The conductive gasket according to claim 1, characterized in that: The cross-sectional shape of the curved portion is a circle or an ellipse in which the height of the middle portion in the horizontal direction is the maximum height.

7. The conductive gasket according to claim 1, characterized in that: An adhesive tape is adhered to the conductive member formed on the lower surface of the support portion. The adhesive tape does not protrude beyond the lowermost portion of the bent portion, so that the conductive component on the lower surface of the bent portion is in direct contact with the object.

8. The conductive gasket according to claim 1, characterized in that: The support portion is formed with one or more openings penetrating the conductive spacer in a thickness direction.

9. The conductive gasket according to claim 8, characterized in that: The maximum height of the spacer in the bent portion is greater than the maximum height of the semiconductor chip received in the opening and mounted on the circuit substrate.

10. The conductive gasket according to claim 8, characterized in that: Conductive powder is mixed in the support layer so that electromagnetic waves flowing into or out of the semiconductor chip accommodated in the opening in a direction where the bent portion is not formed are shielded by the support layer.

11. The conductive gasket according to claim 1, characterized in that: The conductive component comprises: A polymer film having a metal layer formed on one surface or having conductive fibers bonded thereto; and A flat reinforcing sheet has one surface bonded to the other surface of the polymer film and the other surface bonded with the adhesive layer.

12. The conductive gasket according to claim 1, characterized in that: In the bent portion, the adhesive layers are not bonded to each other to form an inner space surrounded by the conductive film. Alternatively, at the bent portion, the adhesive layers are bonded to each other and connected to the support layer.

13. An electromagnetic wave shielding device that surrounds a semiconductor chip mounted on a circuit substrate and shields electromagnetic waves, characterized in that: The electromagnetic wave shielding device comprises: a metal shielding shell having an opening formed on an upper surface and a flange formed along an edge of the opening; and A conductive gasket is attached to the upper surface of the flange, The conductive gasket has a conductive film composed of a conductive component and an elastic curable adhesive layer bonded to the conductive component by curing. The conductive film is bent into a curve at both sides of the conductive gasket in the width direction so that the adhesive layer is located inside, thereby forming a bent portion having an inner space extending in the length direction of the conductive gasket. In the portion where the conductive films overlap in a relative manner except for the bent portion, the adhesive layers are bonded to each other to form a support layer, and a support portion is formed by the portion where the conductive films overlap and the support layer. The support portion is provided with an opening penetrating the conductive pad in the thickness direction. The maximum height of the bent portion is higher than the maximum height of the supporting portion, When an object presses the conductive pad, the bent portion elastically contacts the object due to the elastic restoring force of the bent portion. The surface of the semiconductor chip is exposed to the outside through the opening of the conductive pad and the opening of the metal shielding case.

14. The electromagnetic wave shielding device according to claim 13, characterized in that: The opening of the metal shielding shell corresponds to the opening of the conductive pad, so that the surfaces of the two or more semiconductor chips are exposed to the outside.

15. The electromagnetic wave shielding device according to claim 13, characterized in that: The conductive gasket is mounted inside the edge of the metal shielding shell.

16. The electromagnetic wave shielding device according to claim 13, characterized in that: The conductive gasket can withstand soldering temperature, the metal shield case can be soldered, and the electromagnetic wave shielding device can be surface mounted by vacuum pickup at the conductive gasket portion.

17. A mounting structure of an electromagnetic wave shielding device, characterized in that: Applicable to the electromagnetic wave shielding device according to claim 13, The supporting portion of the conductive gasket is attached to the lower surface of the cooling unit by a clamping adhesive device, and the bent portion of the conductive gasket forms the electromagnetic wave shielding device by contacting the flange of the metal shielding shell mounted on the opposite circuit substrate.

18. The mounting structure of the electromagnetic wave shielding device according to claim 17, characterized in that: The surface of the semiconductor chip and the lower surface of the cooling unit are thermally coupled by sandwiching a thermoelectric component through the opening of the metal shield case and the opening of the conductive spacer.

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