Light-emitting device, preparation method thereof and light-emitting equipment

Abstract

The invention discloses a light-emitting device, a preparation method thereof and light-emitting equipment. The preparation method of the light-emitting device comprises the following steps: providing packaging glue and a packaging substrate on which a plurality of light-emitting element groups are mounted; the packaging substrate comprises a plurality of die bonding areas, and the light-emitting element groups are fixed in the die bonding areas; the surface of one side, deviating from the light-emitting element group, of the packaging substrate comprises a plurality of light-emitting pins; packaging glue is placed on the surface of the side, away from the packaging substrate, of the light-emitting element set, and the packaging glue is pressed to form a light-emitting assembly; and cutting the light-emitting component to form the light-emitting device comprising at least two light-emitting element groups. According to the technical scheme, the thrust of the light-emitting pins in the light-emitting device and the thrust of the light-emitting device can be improved, and then the mounting stability of the light-emitting device is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a light-emitting device and a preparation method thereof, and a light-emitting device. Background Art

[0002] Light Emitting Diode (LED) is a solid-state semiconductor device that can directly convert electrical energy into light energy. Due to its advantages such as long life, small size and low power consumption, LED has been widely used as a light source for various devices, such as display devices.

[0003] As display devices become thinner and lighter, the size and volume of light-emitting devices are also getting smaller and smaller. Similarly, the size of the pin pads in the light-emitting devices is also getting smaller and smaller, which will directly lead to a decrease in the pin thrust of the light-emitting device. After the light-emitting device is mounted on the substrate to be mounted, it is easy for the light-emitting device to fall off the substrate to be mounted, resulting in defects or scrapping of the entire product. Therefore, how to improve the pin thrust of the light-emitting device has become a technical problem that needs to be solved urgently. Summary of the invention

[0004] The present invention provides a light emitting device and a preparation method thereof, and a light emitting device, which can increase the thrust of a light emitting pin in the light emitting device and the thrust of the light emitting device itself, thereby improving the mounting stability of the light emitting device.

[0005] In a first aspect, the present invention provides a method for preparing a light-emitting device, comprising:

[0006] A packaging adhesive and a packaging substrate mounted with a plurality of light-emitting element groups are provided; the packaging substrate comprises a plurality of die-bonding regions, the light-emitting element groups are fixed on the die-bonding regions; a surface of the packaging substrate on one side away from the light-emitting element groups comprises a plurality of light-emitting pins;

[0007] Placing the packaging glue on a surface of the light-emitting element group that is away from the packaging substrate, and pressing the packaging glue to form a light-emitting component;

[0008] The light-emitting assembly is cut to form a light-emitting device including at least two light-emitting element groups.

[0009] Optionally, a packaging substrate having a plurality of light emitting element groups mounted thereon is provided, comprising:

[0010] Providing the packaging substrate; the packaging substrate comprises a plurality of die-bonding regions, each of the die-bonding regions comprises a plurality of positive electrode pads and negative electrode pads arranged in one-to-one correspondence with the positive electrode pads;

[0011] Providing a plurality of the light emitting element groups; each of the light emitting element groups comprises a plurality of light emitting elements, and a surface of one side of the light emitting element comprises a positive input terminal and a negative input terminal;

[0012] Each of the light emitting element groups is mounted on each of the die-bonding regions to form the packaging substrate mounted with the light emitting element groups; wherein the positive input terminal is electrically connected to the positive electrode pad, and the negative input terminal is electrically connected to the negative electrode pad.

[0013] Optionally, the packaging glue includes a black glue layer and a transparent glue layer;

[0014] Placing the packaging glue on a side surface of the light emitting element group away from the packaging substrate, and pressing the packaging glue to form a light emitting component, including:

[0015] The black glue layer is placed on a side surface of the light emitting element group away from the packaging substrate, and the transparent glue layer is located on a side surface of the black glue layer away from the packaging substrate;

[0016] Providing pressure from the transparent adhesive layer to the packaging substrate to the packaging adhesive so as to press the packaging adhesive;

[0017] The packaging substrate provided with the light emitting element group and the packaging glue is baked and cured to form the light emitting component.

[0018] Optionally, in the thickness direction of the packaging substrate, the height of the light emitting element group is h0; before the packaging glue is pressed, the thickness of the black glue layer is h11;

[0019] Among them, 0μm≤h0-h11≤10μm.

[0020] Optionally, in the light-emitting assembly, along a direction parallel to the plane where the packaging substrate is located, a minimum distance between two adjacent light-emitting element groups is d1;

[0021] Cutting the light-emitting assembly to form a light-emitting device including at least two of the light-emitting element groups comprises:

[0022] A portion of the transparent adhesive layer between two adjacent light-emitting element groups is removed to form a light-emitting element group distinguishing groove; the light-emitting element group located on one side of the light-emitting element group distinguishing groove is a first light-emitting element group, and the light-emitting element group located on the other side of the light-emitting element group distinguishing groove is a second light-emitting element group, and the width of the light-emitting element group distinguishing groove along the direction from the first light-emitting element group to the second light-emitting element group is d2; wherein 0 μm<d2≤d1;

[0023] A region including at least two of the light emitting element groups is cut out from the light emitting component to form the light emitting device; and a groove for distinguishing the light emitting element groups is provided between two adjacent light emitting element groups in the light emitting device.

[0024] Optionally, in the thickness direction of the packaging substrate, the thickness of the transparent adhesive layer is h2;

[0025] Among them, h2≥0.5μm.

[0026] Optionally, cutting the light-emitting assembly to form a light-emitting device including at least two of the light-emitting element groups comprises:

[0027] The light-emitting assembly is cut to form a light-emitting device including M light-emitting element groups; wherein M=2n, and n is a positive integer.

[0028] Optionally, the light-emitting device includes four light-emitting element groups, and a surface of the light-emitting device on one side facing away from the light-emitting element groups includes eight light-emitting pins.

[0029] In a second aspect, the present invention provides a light-emitting device, which is manufactured by the method for manufacturing the light-emitting device described in the first aspect.

[0030] In a third aspect, the present invention further provides a light-emitting device, comprising: a circuit board and the light-emitting device according to the second aspect;

[0031] The light-emitting device is mounted on the circuit board; one side surface of the circuit board includes a pin pad group arranged in one-to-one correspondence with each of the light-emitting devices, each pin pad in the pin pad group is arranged in one-to-one correspondence with each light-emitting pin in the light-emitting device, and each pin pad is electrically connected to each light-emitting pin in one-to-one correspondence.

[0032] The technical solution provided by the present invention provides packaging glue and a packaging substrate with multiple light-emitting element groups mounted thereon, places the packaging glue on a side surface of the light-emitting element group away from the packaging substrate, and presses the packaging glue to form a light-emitting component, wherein the packaging glue is bonded to the packaging substrate and the light-emitting element group to improve the bonding firmness and stability between the light-emitting element group and the packaging substrate, the packaging glue and the packaging substrate, and the packaging glue and the light-emitting element group, and then cuts the light-emitting component to form a light-emitting device including at least two light-emitting element groups, so that the light-emitting device has a larger size and more light-emitting pins, which can improve the thrust of the light-emitting pins and the thrust of the light-emitting device itself, thereby improving the mounting stability of the light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A flow chart of a method for preparing a light-emitting device provided by an embodiment of the present invention;

[0034] Figure 2 A schematic diagram of a process structure for preparing a light-emitting device provided by an embodiment of the present invention;

[0035] Figure 3 A schematic diagram of a top view of a packaging substrate provided by an embodiment of the present invention;

[0036] Figure 4 A preparation flow chart of a package substrate including a light-emitting element group provided in an embodiment of the present invention;

[0037] Figure 5 A schematic diagram of a top view of a packaging substrate including a light-emitting element group provided in an embodiment of the present invention;

[0038] Figure 6 A flow chart of preparing a light-emitting component provided by an embodiment of the present invention;

[0039] Figure 7 A schematic diagram of the structure of a process for preparing a light-emitting component provided by an embodiment of the present invention;

[0040] Figure 8 A schematic diagram of the structure of a packaging substrate and packaging adhesive mounted with a light-emitting element group provided in an embodiment of the present invention;

[0041] Fig. 9 A flow chart of cutting a light-emitting component provided by an embodiment of the present invention;

[0042] Fig.10 A schematic structural diagram of a process of cutting a light-emitting component to form a light-emitting device provided by an embodiment of the present invention;

[0043] Fig.11 A schematic structural diagram of a light-emitting component with a portion of a transparent adhesive layer removed provided by an embodiment of the present invention;

[0044] Fig.12 A schematic structural diagram of another light-emitting component provided by an embodiment of the present invention with part of the transparent adhesive layer removed;

[0045] Fig.13 A schematic diagram of the back side of a light emitting device provided by an embodiment of the present invention;

[0046] Fig.14 A schematic top view of the structure of a circuit board in a light-emitting device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0047] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0048] Figure 1 A flowchart of a method for preparing a light-emitting device provided in an embodiment of the present invention, Figure 2 A schematic diagram of a process structure for preparing a light-emitting device according to an embodiment of the present invention is shown in FIG. Figure 1 As shown, the preparation method of the light-emitting device includes:

[0049] S101, providing packaging glue and a packaging substrate with multiple light-emitting element groups mounted thereon.

[0050] in, Figure 3 A schematic diagram of a top view of a packaging substrate provided by an embodiment of the present invention is shown in FIG. Figure 3 As shown, the package substrate 10 includes a plurality of die-bonding regions 11. Figure 2 and Figure 3 The surface of the package substrate 10 close to the light emitting element group 20 is a first surface 101, and the surface of the package substrate 10 away from the light emitting element group 20 is a second surface 102. The solid crystal region 11 is located on the first surface 101, and the light emitting element group 20 is fixed to the solid crystal region 11. The solid crystal region 11 may include a plurality of pads so that the light emitting element group 20 is electrically connected to the pads and then attached to the package substrate 10. The surface of the package substrate 10 away from the light emitting element group 20 includes a plurality of light emitting pins 12, and the light emitting pins 12 can be electrically connected to the electrical signal pads in other modules to transmit the electrical signals required for operation to the light emitting element group 20 through the light emitting pins 12 and the package substrate 10.

[0051] Specifically, the packaging substrate 10 includes metal materials such as aluminum and copper or ceramic materials such as aluminum oxide (Al2O3) and aluminum nitride (AlN). The light-emitting element group 20 may include three light-emitting elements, namely a red light-emitting element, a blue light-emitting element and a green light-emitting element. The light-emitting element includes a light-emitting diode, and may also be other, which can be set according to actual needs. The process of providing a packaging substrate 10 with multiple light-emitting element groups 20 mounted thereon can refer to the following description. First, a packaging substrate 10 without a light-emitting element group 20 is provided, and then each light-emitting element group 20 is mounted on each die-bonding area 11 to form a packaging substrate 10 with multiple light-emitting element groups 20 mounted thereon. The packaging glue 30 includes a colloid such as epoxy resin, and the size of the packaging glue 30 is consistent with the size of the packaging substrate 10.

[0052] S102, placing a packaging adhesive on a surface of the light-emitting element group that is away from the packaging substrate, and pressing the packaging adhesive to form a light-emitting component.

[0053] Specifically, a vacuum pressing machine can be used to provide pressure to the side of the packaging glue 30 away from the packaging substrate 10 to apply pressure to the packaging glue 30 so that the packaging glue 30 fits tightly with the packaging substrate 10 and the light-emitting element group 20, thereby improving the reliability of the fitting between the packaging glue 30 and the packaging substrate 10 and the light-emitting element group 20 to form a light-emitting component.

[0054] S103, cutting the light-emitting assembly to form a light-emitting device including at least two light-emitting element groups.

[0055] It is understandable that the light emitting device in the prior art includes only one light emitting element group, which makes the light emitting device smaller in size. When mounted on an external circuit board, the contact area is smaller, so the pin thrust is also smaller, making it easy to fall off.

[0056] Specifically, refer to Figure 2 and Figure 3 , the light emitting element group 20 and the packaging glue 30 are Figure 3 After the package substrate 10 is bonded, cutting can be performed in the non-crystal-bonding area between two adjacent crystal-bonding areas 11 to cut out a light-emitting device including at least two light-emitting element groups 20. By forming a light-emitting device including more than two light-emitting element groups 20, the overall size of the light-emitting device is increased, and the number of light-emitting pins on the side away from the light-emitting element group 20 in the light-emitting device is increased, thereby increasing the thrust of the light-emitting pins and the overall thrust of the light-emitting device.

[0057] The technical solution of the present invention provides packaging glue and a packaging substrate with multiple light-emitting element groups mounted thereon, places the packaging glue on a side surface of the light-emitting element group away from the packaging substrate, and presses the packaging glue to form a light-emitting component, wherein the packaging glue is bonded to the packaging substrate and the light-emitting element group to improve the bonding firmness and stability between the light-emitting element group and the packaging substrate, the packaging glue and the packaging substrate, and the packaging glue and the light-emitting element group, and then cuts the light-emitting component to form a light-emitting device including at least two light-emitting element groups, so that the light-emitting device has a larger size and more light-emitting pins, which can increase the thrust of the light-emitting pins and the thrust of the light-emitting device itself, thereby improving the mounting stability of the light-emitting device.

[0058] In an optional embodiment, Figure 4 A preparation flow chart of a package substrate including a light-emitting element group provided in an embodiment of the present invention, Figure 5 A schematic diagram of a top view of a packaging substrate including a light-emitting element group provided in an embodiment of the present invention, such as Figure 4 As shown, a packaging substrate with multiple light-emitting element groups mounted thereon is provided, comprising:

[0059] S111. Provide a packaging substrate.

[0060] The packaging substrate includes a plurality of die-bonding regions, and each die-bonding region includes a plurality of positive electrode pads and negative electrode pads that are arranged in one-to-one correspondence with the positive electrode pads.

[0061] For details, please refer to Figure 3The package substrate 10 includes a plurality of die-bonding regions 11, and the die-bonding regions 11 include positive electrode pads 111 and negative electrode pads 112. The number of positive electrode pads 111 and negative electrode pads 112 is the same, and can be set according to the number of light-emitting elements in the light-emitting element group 20. In an optional embodiment, the light-emitting element group 20 includes three light-emitting elements, so the die-bonding region 11 may include three pairs of pad groups arranged in pairs, and each pair of pad groups is composed of a positive electrode pad 111 and a negative electrode pad 112, so that the light-emitting element group 20 can be electrically connected to the pad groups in the die-bonding region 11 one by one in the subsequent process, thereby improving mounting reliability.

[0062] S112, providing a plurality of light emitting element groups.

[0063] Each light emitting element group includes a plurality of light emitting elements, and one side surface of the light emitting element includes a positive input terminal and a negative input terminal.

[0064] Specifically, the light-emitting element group may include three light-emitting elements that emit light beams of different colors, for example, the light-emitting element group includes a first light-emitting element that emits a blue light beam, a second light-emitting element that emits a green light beam, and a third light-emitting element that emits a red light beam. A corresponding number of light-emitting element groups can be provided according to the number of solid crystal areas set in the packaging substrate. In an optional embodiment, the number of solid crystal areas set in the packaging substrate is m, and m light-emitting element groups need to be provided. A positive electrical signal can be provided to the positive input terminal of the light-emitting element, and a negative electrical signal can be provided to the negative input terminal of the light-emitting element to drive the light-emitting element to emit light.

[0065] S113, mounting each light emitting element group on each die bonding area to form a package substrate mounted with the light emitting element group.

[0066] The positive input terminal is electrically connected to the positive pad, and the negative input terminal is electrically connected to the negative pad.

[0067] Specifically, solder paste can be coated on the positive pad and the negative pad in the die bonding area, and then the positive input terminal and the negative input terminal in the light-emitting element group are aligned and contacted with the positive pad and the negative pad respectively using a placement machine or other equipment. Then, the packaging substrate provided with the light-emitting element group is placed as a whole in a reflow oven, and the temperature is gradually increased to melt the solder paste, and after cooling, the solder paste is allowed to form stable solder joints, so as to improve the mounting reliability and firmness between the light-emitting element group and the packaging substrate, and prevent the light-emitting element group from falling off during the subsequent preparation process.

[0068] The technical solution of the embodiment of the present invention provides a packaging substrate including multiple die-bonding areas, each die-bonding area includes multiple positive electrode pads and negative electrode pads arranged one-to-one with the positive electrode pads, and then provides multiple light-emitting element groups, and one side surface of each light-emitting element in the light-emitting element group includes a positive input terminal and a negative input terminal. In this way, the positive electrode input terminal can be electrically connected to the positive electrode pad correspondingly, and the negative electrode input terminal can be electrically connected to the negative electrode pad correspondingly through materials such as solder paste, so that each light-emitting element group can be mounted at each die-bonding area, thereby forming a packaging substrate with a light-emitting element group mounted thereon, thereby improving the mounting stability and reliability of the light-emitting element group and the packaging substrate.

[0069] In an optional embodiment, the embodiment of the present invention describes a case where a light-emitting component is formed when the packaging glue includes a black glue layer and a transparent glue layer. Figure 6 A flow chart of preparing a light emitting component provided by an embodiment of the present invention, Figure 7 A schematic diagram of a process structure for preparing a light-emitting component provided by an embodiment of the present invention is shown in FIG. Figure 6 As shown, a packaging glue is placed on a surface of the light emitting element group facing away from the packaging substrate, and the packaging glue is pressed to form a light emitting component, including:

[0070] S121, placing a black glue layer on a surface of the light emitting element group facing away from the packaging substrate, and a transparent glue layer on a surface of the black glue layer facing away from the packaging substrate.

[0071] Among them, reference Figure 7 The encapsulation glue 30 includes a black glue layer 31 and a transparent glue layer 32. 0.2% to 0.5% of a black agent can be added to the transparent epoxy resin material to form the black glue layer 31, and the black agent includes a blackening material such as carbon powder. The transparent glue layer 32 includes a transparent epoxy resin material.

[0072] Specifically, if the encapsulation glue is composed of a black glue layer, after the subsequent lamination step, there may be residual black glue on the surface of part of the light-emitting element group 20 that is away from the packaging substrate 10, affecting the light-emitting effect of the light-emitting element. By setting the transparent glue layer 32 on the surface of the black glue layer 31 that is away from the packaging substrate 10, after the encapsulation glue 30 and the light-emitting element group 20 are subsequently pressed together, the black glue layer 31 can be flush with the light-emitting element group 20, or the surface of the black glue layer 31 that is away from the packaging substrate 10 is lower than the surface of the light-emitting element group 20 that is away from the packaging substrate 10. The transparent glue layer 32 can cover the surface and part of the side of the light-emitting element group 20 to ensure the light-emitting efficiency of the light-emitting element group 20. After the subsequent lamination, the black glue layer 31 is located in the area where the light-emitting element group 20 is not set. When the light-emitting element group 20 emits light, the black glue layer 31 displays matte black, which can improve the display contrast of the subsequent light-emitting device.

[0073] S122, providing pressure from the transparent adhesive layer to the packaging substrate to the packaging adhesive to press the packaging adhesive.

[0074] Specifically, the packaging glue can be pressed by a vacuum press, and the pressing environment conditions are related to the thickness of the packaging glue and the thickness of the light-emitting element group, and can be set according to actual needs. In an exemplary embodiment, the thickness of the light-emitting element group is 90 μm, the thickness of the black glue layer 31 is 80 μm, and the thickness of the transparent glue layer 32 is 220 μm. The pressing environment includes: a temperature range of 70°C to 80°C, a pressure range of 0.8Mpa to 1.5Mpa, and a pressing time range of 4 minutes to 8 minutes.

[0075] It is understandable that, since the packaging glue has a certain hardness, it is necessary to provide a high-temperature pressing environment to melt the packaging glue at high temperature so that the packaging glue can fit tightly with the packaging substrate 10. At the same time, under the action of the pressure provided by the vacuum machine, the light-emitting element group 20 can pierce the black glue layer 31, so that the black glue layer 31 flows between two adjacent light-emitting element groups 20, preventing the black glue layer 31 from covering the light-emitting surface of the light-emitting element group 20, thereby improving the light-emitting effect of the light-emitting element group 20.

[0076] S123, baking and curing the packaging substrate provided with the light-emitting element group and the packaging glue to form a light-emitting component.

[0077] Specifically, the pressed light-emitting element group and the package substrate can be placed in a curing box for curing to improve the reliability and firmness of the bonding between the packaging glue and the light-emitting element group and the package substrate, and improve the overall stability of the light-emitting component. The curing environment in the curing box is related to parameters such as the material of the packaging glue. In an exemplary embodiment, the baking temperature in the curing box ranges from 100°C to 130°C, and the baking time ranges from 90 minutes to 120 minutes. It can also be other, which is not specifically limited here.

[0078] The technical solution of the embodiment of the present invention is to place a black glue layer on the side surface of the light-emitting element group away from the packaging substrate, and a transparent glue layer on the side surface of the black glue layer away from the packaging substrate, so that after providing pressure from the transparent glue layer to the packaging substrate, the light-emitting element group can pierce the black glue layer in the packaging glue, so that the black glue layer is located in the area between two adjacent light-emitting element groups, thereby preventing the black glue layer from covering the light-emitting surface of the light-emitting element group and affecting the light-emitting effect of the light-emitting element group. Thereafter, the packaging substrate provided with the light-emitting element group and the packaging glue is baked and cured to fix the packaging glue, thereby improving the tightness and reliability of the fitting of the packaging glue with the light-emitting element group and the packaging substrate, and improving the overall firmness and stability of the light-emitting component.

[0079] Based on the above embodiment, the thickness of the black glue layer is described in the embodiment of the present invention. Figure 8A schematic diagram of the structure of a packaging substrate and packaging adhesive mounted with a light-emitting element group provided in an embodiment of the present invention, as shown in FIG. Figure 8 As shown, in the thickness direction Z of the packaging substrate 10 , the height of the light emitting element group 20 is h0; before the packaging glue 30 is pressed, the thickness of the black glue layer 31 is h11; wherein 0μm≤h0-h11≤10μm.

[0080] Specifically, by setting the height h0 of the light-emitting element group 20 to be greater than or equal to the thickness h11 of the black glue layer 31, it can be ensured that the light-emitting element group 20 can completely pierce the black glue layer 31 during the pressing process, so as to prevent the black glue layer 31 from remaining on the surface of the light-emitting element group 20 and affecting the light-emitting effect of the light-emitting element group 20. If the difference between the height h0 of the light-emitting element group 20 and the thickness h11 of the black glue layer 31 is greater than 10 μm, the thickness of the black glue layer 31 is relatively thin. When the light-emitting element group 20 includes a first light-emitting element that emits a blue light beam, the side of the first light-emitting element may be sapphire, which can reflect the light beam. When the thickness of the black glue layer 31 is relatively thin, the black glue layer 31 cannot completely wrap the side of the first light-emitting element. When the first light-emitting element emits a light beam, the sapphire on the side of the first light-emitting element can emit the light beam in a direction parallel to the plane where the package substrate 10 is located, affecting the light-emitting efficiency of the first light-emitting element. Therefore, the difference between the height h0 of the light emitting element group 20 and the thickness h11 of the black gel layer 31 is set to be between 0 μm and 10 μm, so as to ensure the light extraction efficiency of the light emitting element group 20 .

[0081] Based on the above embodiment, the embodiment of the present invention describes the case where a light emitting assembly is cut to form a light emitting device including at least two light emitting element groups. Fig. 9 A flow chart of cutting a light emitting component provided by an embodiment of the present invention, Fig.10 A schematic diagram of a process structure of cutting a light-emitting component to form a light-emitting device provided by an embodiment of the present invention, such as Fig. 9 As shown, the light emitting assembly is cut to form a light emitting device including at least two light emitting element groups, including:

[0082] S131, removing a portion of the transparent adhesive layer between two adjacent light emitting element groups to form a groove for distinguishing the light emitting element groups.

[0083] in, Fig.11 A schematic diagram of a light emitting component provided by an embodiment of the present invention in which a portion of the transparent adhesive layer is removed, referring to Fig.10 and Fig.11, in the light-emitting component, along the direction parallel to the plane where the package substrate 10 is located, the minimum spacing between two adjacent light-emitting element groups 20 is d1. The light-emitting element group 20 located on one side of the light-emitting element group distinguishing groove 33 is the first light-emitting element group, and the light-emitting element group located on the other side of the light-emitting element group distinguishing groove 33 is the second light-emitting element group. Along the direction from the first light-emitting element group to the second light-emitting element group, the width of the light-emitting element group distinguishing groove 33 is d2; wherein, 0μm<d2≤d1.

[0084] Specifically, since the light-emitting device mounted on some products only includes one light-emitting element group 20, after the light-emitting device including only one light-emitting element group 20 is attached to the circuit board, there is a gap between two adjacent light-emitting devices or light-emitting element groups 20. In order to meet this design requirement, by removing part of the transparent adhesive layer 32 between two adjacent light-emitting element groups 20, a groove 33 for distinguishing the light-emitting element groups is formed in the part where the transparent adhesive layer 32 is removed, so as to correspond to the gap in the product design, thereby improving the applicability and practicality of the light-emitting device.

[0085] S132, cutting out a region including at least two light-emitting element groups from the light-emitting component to form a light-emitting device.

[0086] Wherein, a light emitting element group distinguishing groove is included between two adjacent light emitting element groups in the light emitting device.

[0087] Specifically, refer to Fig.11 , the light emitting assembly can be cut along the cutting line BB' to cut out a light emitting device including two light emitting element groups 20. Alternatively, referring to Fig.12 The light emitting element group distinguishing groove 33 includes a first light emitting element group distinguishing groove 331 extending along a first direction Y, and a second light emitting element group distinguishing groove 332 extending along a second direction X, the second direction X is parallel to the row arrangement direction of the light emitting element group 20, the first direction Y is parallel to the column arrangement direction of the light emitting element group 20, the overlapping area of ​​the first light emitting element group distinguishing groove 331 and the second light emitting element group distinguishing groove 332 is the cross center 50, the four light emitting element groups 20 located around the cross center 50 and the light emitting element group distinguishing grooves (331 and 332) located between the four light emitting element groups 20 constitute a light emitting device, and cutting is performed along the cutting line C-C' to cut out a light emitting device including four light emitting element groups 20, so that the light emitting device as a whole has a larger area, the thrust of the light emitting pins in the light emitting device is increased, and the assembly stability of the light emitting device is improved.

[0088] The technical solution of the embodiment of the present invention is to remove part of the transparent adhesive layer located between two adjacent light-emitting element groups to form a light-emitting element group distinguishing groove, and then cut out an area including at least two light-emitting element groups from the light-emitting component to form a light-emitting device, and in the formed light-emitting device, a light-emitting element group distinguishing groove is included between two adjacent light-emitting element groups, so that the light-emitting device can adapt to the gap in the product design, thereby improving the applicability and practicality of the light-emitting device.

[0089] Optional, continue to refer to Figure 8 , in the thickness direction Z of the packaging substrate 10 , the thickness of the transparent adhesive layer 32 is h2; wherein h2 ≥ 0.5 μm.

[0090] Specifically, if the thickness h2 of the transparent adhesive layer 32 is less than 0.5 μm, when the pressing force is provided to the packaging adhesive, it cannot be guaranteed that the light-emitting element group 20 can pierce the black adhesive layer 31, thereby causing the black adhesive layer 31 to remain on the side of the light-emitting element group 20 away from the packaging substrate 10, thereby affecting the light-emitting effect of the light-emitting element group 20. Therefore, by setting the thickness h2 of the transparent adhesive layer 32 to be greater than or equal to 0.5 μm, the black adhesive layer 31 is not left on the side of the light-emitting element group 20 away from the packaging substrate 10, thereby ensuring the light-emitting effect of the light-emitting element group 20. In addition, on the basis that the thickness h2 of the transparent adhesive layer 32 is greater than or equal to 0.5 μm, the thickness of the transparent adhesive layer 32 can be set according to actual needs. When the designed product requires a light-emitting device of a greater height, the thickness h2 of the transparent adhesive layer 32 can be appropriately increased. In an exemplary embodiment, the thickness h2 of the transparent adhesive layer 32 is 220 μm.

[0091] In an optional embodiment, cutting the light-emitting assembly to form a light-emitting device including at least two light-emitting element groups includes: cutting the light-emitting assembly to form a light-emitting device including M light-emitting element groups; wherein M=2n, and n is a positive integer.

[0092] Specifically, since existing display modules are mostly rectangular, the area in the display module where the light-emitting device is set is also rectangular. Therefore, by setting the number of light-emitting element groups in the light-emitting device to an even number, the light-emitting device can match the light-emitting device setting area in the display module, thereby improving assembly simplicity and reliability.

[0093] Optionally, the light-emitting device includes four light-emitting element groups, and a surface of the light-emitting device on one side facing away from the light-emitting element groups includes eight light-emitting pins.

[0094] Specifically, Fig.13 A schematic diagram of the back side of a light emitting device provided by an embodiment of the present invention, referring to Fig.12 and Fig.13 , Fig.13 The light emitting device 40, and Fig.12The light emitting device including four light emitting element groups 20 cut out along the cutting line CC' corresponds to: Fig.12 FIG. 4 shows a front plan view of a light emitting device or a light emitting component. Fig.13 What is shown is the back structure diagram of the light-emitting device, that is, the side of the packaging substrate in the light-emitting device away from the light-emitting element group, which is provided with 8 light-emitting pins. Compared with the light-emitting device including only one light-emitting element group, the light-emitting device with four light-emitting element groups has more light-emitting pins, and the contact area with the circuit board in the display module is increased. The pin thrust is increased by 6 to 8 times, which can improve the subsequent mounting stability and reliability of the light-emitting device, and at the same time improve the mounting efficiency, which is increased by more than 4 times.

[0095] Based on the same inventive concept, the present invention also provides a light-emitting device, which is prepared by the preparation method of the light-emitting device provided by the above embodiment of the present invention, and has the same beneficial effects as the preparation method. The similarities can be referred to the above description and will not be repeated here.

[0096] Based on the same inventive concept, an embodiment of the present invention further provides a light emitting device, Fig.14 A schematic diagram of a top view of a circuit board in a light emitting device provided in an embodiment of the present invention, with reference to Figure 12-14 One side surface of the circuit board 60 includes a pin pad group 61 arranged in one-to-one correspondence with each light-emitting device 40, and each pin pad 610 in the pin pad group 61 is arranged in one-to-one correspondence with each light-emitting pin 12 in the light-emitting device 40. The side of the light-emitting device 40 provided with the light-emitting pin 12 is soldered and mounted on the circuit board 60, so that each pin pad 610 is electrically connected to each light-emitting pin 12 in one-to-one correspondence to form a light-emitting device.

[0097] Specifically, since the light-emitting device in the light-emitting equipment includes an overall structure composed of multiple light-emitting element groups, after the light-emitting device is bonded to the circuit board, the pin thrust of the light-emitting device is increased, thereby avoiding problems such as the light-emitting device falling off the circuit board, improving the bonding stability between the light-emitting device and the circuit board, and thereby improving the preparation reliability of the light-emitting device.

[0098] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A method for preparing a light-emitting device, characterized in that: include: Providing packaging glue and a packaging substrate with multiple light-emitting element groups mounted thereon; The packaging substrate comprises a plurality of die-bonding regions, and the light-emitting element group is fixed on the die-bonding regions; The surface of the packaging substrate on one side away from the light-emitting element group includes a plurality of light-emitting pins; Placing the packaging glue on a surface of the light-emitting element group that is away from the packaging substrate, and pressing the packaging glue to form a light-emitting component; The light-emitting assembly is cut to form a light-emitting device including at least two light-emitting element groups.

2. The method for preparing a light emitting device according to claim 1, characterized in that: A package substrate having a plurality of light emitting element groups mounted thereon is provided, comprising: Providing the packaging substrate; the packaging substrate comprises a plurality of die-bonding regions, each of the die-bonding regions comprises a plurality of positive electrode pads and negative electrode pads arranged in one-to-one correspondence with the positive electrode pads; Providing a plurality of the light emitting element groups; each of the light emitting element groups comprises a plurality of light emitting elements, and a surface of one side of the light emitting element comprises a positive input terminal and a negative input terminal; Each of the light emitting element groups is mounted on each of the die-bonding regions to form the packaging substrate mounted with the light emitting element groups; wherein the positive input terminal is electrically connected to the positive electrode pad, and the negative input terminal is electrically connected to the negative electrode pad.

3. The method for preparing a light emitting device according to claim 1, characterized in that: The packaging glue comprises a black glue layer and a transparent glue layer; Placing the packaging glue on a side surface of the light emitting element group away from the packaging substrate, and pressing the packaging glue to form a light emitting component, including: The black glue layer is placed on a side surface of the light emitting element group away from the packaging substrate, and the transparent glue layer is located on a side surface of the black glue layer away from the packaging substrate; Providing pressure from the transparent adhesive layer to the packaging substrate to the packaging adhesive so as to press the packaging adhesive; The packaging substrate provided with the light emitting element group and the packaging glue is baked and cured to form the light emitting component.

4. The method for preparing a light emitting device according to claim 3, characterized in that: In the thickness direction of the packaging substrate, the height of the light-emitting element group is h0; before the packaging glue is pressed, the thickness of the black glue layer is h11; Among them, 0μm≤h0-h11≤10μm.

5. The method for preparing a light emitting device according to claim 3, characterized in that: In the light-emitting assembly, along a direction parallel to the plane where the package substrate is located, the minimum distance between two adjacent light-emitting element groups is d1; Cutting the light-emitting assembly to form a light-emitting device including at least two of the light-emitting element groups comprises: A portion of the transparent adhesive layer between two adjacent light-emitting element groups is removed to form a light-emitting element group distinguishing groove; the light-emitting element group located on one side of the light-emitting element group distinguishing groove is a first light-emitting element group, and the light-emitting element group located on the other side of the light-emitting element group distinguishing groove is a second light-emitting element group, and the width of the light-emitting element group distinguishing groove along the direction from the first light-emitting element group to the second light-emitting element group is d2; wherein 0 μm<d2≤d1; A region including at least two of the light emitting element groups is cut out from the light emitting component to form the light emitting device; and a groove for distinguishing the light emitting element groups is provided between two adjacent light emitting element groups in the light emitting device.

6. The method for preparing a light emitting device according to claim 3, characterized in that: In the thickness direction of the packaging substrate, the thickness of the transparent adhesive layer is h2; Among them, h2≥0.5μm.

7. The method for preparing a light emitting device according to claim 1, characterized in that: Cutting the light-emitting assembly to form a light-emitting device including at least two of the light-emitting element groups comprises: The light-emitting assembly is cut to form a light-emitting device including M light-emitting element groups; wherein M=2n, and n is a positive integer.

8. The method for preparing a light emitting device according to claim 7, characterized in that: The light emitting device comprises four light emitting element groups, and a surface of the light emitting device on one side away from the light emitting element groups comprises eight light emitting pins.

9. A light emitting device, characterized in that: The light-emitting device is prepared by the preparation method of the light-emitting device according to any one of claims 1 to 8.

10. A light emitting device, characterized in that: include: A circuit board and a light emitting device as claimed in claim 9; The light-emitting device is mounted on the circuit board; one side surface of the circuit board includes a pin pad group arranged in one-to-one correspondence with each of the light-emitting devices, each pin pad in the pin pad group is arranged in one-to-one correspondence with each light-emitting pin in the light-emitting device, and each pin pad is electrically connected to each light-emitting pin in one-to-one correspondence.

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