Novel attaching and pre-fixing structure

Abstract

The invention relates to the related technical field of semiconductor display, in particular to a novel laminating and pre-fixing structure which comprises a base, a fixing plate is fixedly connected to the upper surface of the base, a CG is connected to the upper surface of the fixing plate, and a laminating mechanism is arranged above the CG. According to the novel attaching and pre-fixing structure, through the arrangement of the attaching mechanisms, when the novel attaching and pre-fixing structure is used, the attaching mechanisms are uniquely designed, for example, the pre-fixing positions are changed at four corners outside a display area, poor Mura caused by traditional middle pre-fixing is effectively avoided, the product yield is remarkably improved, meanwhile, due to the four-point layout of the floating suction nozzle and the precise construction of all parts, the product quality is improved, and the product quality is improved. Due to the symmetrical adsorption holes, connecting structures and the like, adsorption is more stable, stress distribution is more uniform, compatibility is higher, the mechanism can adapt to products of various sizes, production efficiency and stability are greatly improved, cost is reduced, and therefore the mechanism surpasses a traditional mechanism in multiple aspects.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor display, and in particular to a novel bonding pre-solidification structure. Background Art

[0002] In the field of semiconductor display technology, silicon-based OLED technology has developed rapidly and occupies a key position in the high-end display market. The manufacturing of silicon-based OLED display chips involves many complex and precise processes, among which the CG (CoverGlass) bonding process is one of the core links. This process is designed to provide physical protection for key film layers such as OLED, TFE, CF, etc. inside the chip, and effectively isolate interference from external factors such as water and oxygen to ensure stable and reliable operation and long service life of the display device. Traditionally, OCR glue is mainly used for the bonding operation of silicon-based OLED and CG. This method has laid the foundation for the industry in long-term practice. Therefore, a new bonding pre-fixed structure is particularly needed.

[0003] However, in the existing bonding and pre-fixing structure, in order to prevent the flow of glue and cause CG displacement during the CG bonding process, UV pre-curing is often performed on the local OCR glue below the pre-fixing hole. However, in this process, the flow of glue can easily cause CG displacement, resulting in frequent Mura defects at the pre-fixing points, which greatly reduces the product yield. Once the pre-fixing process is lacking, the CG deviation problem almost reduces the product qualification rate to zero. Summary of the invention

[0004] The purpose of the present invention is to provide a novel bonding pre-fixing structure to solve the existing bonding pre-fixing structure proposed in the above background technology. In the CG bonding process, in order to prevent the flow of glue causing CG displacement, UV pre-curing is often performed on the local OCR glue below the pre-fixing hole. However, in this process, the flow of glue can easily cause CG displacement, resulting in frequent Mura defects at the pre-fixing point, which greatly reduces the product yield. Once the pre-fixing process is lacking, the CG deviation problem almost makes the product qualification rate return to zero.

[0005] To achieve the above object, the present invention provides the following technical solutions: a novel bonding pre-fixing structure, comprising a base, a fixing plate fixedly connected to the upper surface of the base, a connector snap-connected to the upper surface of the fixing plate, a silicon-based OLED fixedly connected to the upper surface of the connector, glue applied to the upper part of the silicon-based OLED, CG bonded to the upper part of the glue, and a bonding mechanism provided on the upper part of the CG;

[0006] The bonding mechanism includes a first suction nozzle piece, a bonding block, a second suction nozzle piece, surrounding suction holes, a middle suction hole, a U-shaped pre-fixed hole, a connecting base, a connecting block, an air intake valve interface and a connecting column. The upper surface of the CG is bonded with the first suction nozzle piece, the upper surface of the first suction nozzle piece is fixedly connected with the bonding block, the lower surface of the bonding block is fixedly connected with the second suction nozzle piece, the surface of the second suction nozzle piece is penetrated with surrounding suction holes, the central axis position of the bonding block is penetrated with the middle suction hole, the surface of the bonding block is provided with a U-shaped pre-fixed hole, one side surface of the bonding block is fixedly connected with the connecting base, one side surface of the connecting base is fixedly connected with the connecting block, one side surface of the connecting base is fixedly connected with the air intake valve interface, and one side surface of the connecting base is fixedly connected with the connecting column.

[0007] Preferably, a notch is provided on the upper surface of the fixing plate, and the connector is slidably connected to the fixing plate through the notch.

[0008] Preferably, the first suction nozzle pieces are provided with two groups symmetrically with the middle suction hole as the central axis, and the second suction nozzle pieces are provided with two groups symmetrically with the middle suction hole as the central axis.

[0009] Preferably, a group of the surrounding adsorption holes is provided on the surface of each group of the first suction nozzle piece and the second suction nozzle piece, and a group of the middle adsorption holes is provided on the central axis of the bonding block.

[0010] Preferably, four groups of the U-shaped pre-fixed holes are symmetrically arranged about the central axis of the fitting block, and the inner surfaces of the U-shaped pre-fixed holes are fixedly connected with pre-fixed lamps.

[0011] Preferably, the connection blocks are symmetrically arranged in four groups about the central axis of the connection base, and the connection base is fixedly connected to the fitting block through the connection blocks.

[0012] Preferably, the air intake valve interface is symmetrically arranged in two groups on the two side surfaces of the connection base, and each group is provided with two, and the CG is fitted and connected to the fitting block through the surrounding adsorption holes and the middle adsorption hole.

[0013] Preferably, the silicon-based OLED is fixedly connected to the fixing plate via a connector, and the bonding block is fixedly connected to the connecting column via a connecting base.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the novel bonding pre-fixing structure, through the setting of the bonding mechanism, when in use, the CG glass to be bonded is accurately placed in the corresponding area above the floating suction nozzle, and the vacuum adsorption system is started. The middle hole of the suction nozzle piece and the vacuum hole in the middle of the floating structure work together to generate a strong and uniform suction force, quickly and firmly adsorb the CG glass, and the four-side holes tightly adsorb the suction nozzle piece to eliminate the risk of loosening or displacement of the suction nozzle piece, and comprehensively guarantee the position accuracy and stability of the CG glass in the pre-fixing and subsequent bonding processes, creating conditions for high-precision bonding, activating the pre-curing lamp board, and 8 lamp beads release UV light of specific wavelength and intensity. The light is accurately guided to the pre-fixing holes at the four corners of the suction nozzle piece through the optimized U-shaped groove, and UV pre-curing is efficiently and evenly performed on the OCR glue below the pre-fixing holes. The plane of the suction nozzle piece strictly blocks excess light to prevent light scattering or mis-irradiation from causing abnormal curing of glue or damage to other components, ensuring that the boundary of the pre-curing area is clear and the effect is stable, effectively suppressing the flow of glue and the displacement trend of CG, strengthening the stability of the early structure of bonding, and after completing the pre-curing, in the high-precision motion control Under the control of the control system, the floating nozzle that absorbs the CG glass can accurately and smoothly align with the silicon-based OLED. The entire bonding process relies on the stable pre-fixing effect in the early stage and precise equipment control to maintain the ideal position and posture of the CG glass to achieve seamless and precise bonding. Immediately after bonding, optical inspection, electrical performance testing and other multi-faceted means are used to comprehensively inspect the product quality, quickly identify potential defects such as bonding gap, display uniformity, and electrical connection stability, and flexibly adjust subsequent process parameters or implement product screening based on the inspection results to ensure product quality consistency and reliability, and improve overall production efficiency and yield rate. This setting innovatively changes the pre-fixing position to the four corners of the display area for pre-fixing, eliminating the Mura problem of the pre-fixing point from the source. Traditional middle pre-fixing is prone to such problems and causes product defects. The new structure greatly reduces the occurrence rate of pre-fixing Mura in the display area, greatly improves the overall product yield, and reduces the loss and cost waste caused by quality problems. In addition, the floating nozzle structure is enlarged and changed to a four-point layout. With the adjustment of the 8 lamp beads on the pre-curing lamp board and the optimized design of the nozzle piece, it can be compatible with the four-corner pre-fixing requirements of products of various sizes and models. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a side view structural schematic diagram of the present invention;

[0016] Figure 2 It is a schematic diagram of the structure of the laminating mechanism of the present invention;

[0017] Figure 3 This is a schematic diagram of the base structure of the laminating mechanism of the present invention;

[0018] Figure 4 It is a schematic diagram of the bonding pre-fixing structure of the bonding mechanism of the present invention;

[0019] Figure 5It is a schematic diagram of the traditional bonding and pre-consolidation structure of the present invention.

[0020] In the figure: 1. base; 2. fixing plate; 3. connector; 4. silicon-based OLED; 5. glue; 6. CG; 7. bonding mechanism; 701. first suction nozzle piece; 702. bonding block; 703. second suction nozzle piece; 704. surrounding suction holes; 705. middle suction hole; 706. U-shaped pre-fixed hole; 707. connecting base; 708. connecting block; 709. suction valve interface; 710. connecting column. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1-5 The present invention provides a technical solution: a novel bonding pre-fixed structure, comprising a base 1, a fixing plate 2 is fixedly connected to the upper surface of the base 1, a connector 3 is snap-connected to the upper surface of the fixing plate 2, a silicon-based OLED 4 is fixedly connected to the upper surface of the connector 3, glue 5 is applied above the silicon-based OLED 4, CG6 is bonded above the glue 5, and a bonding mechanism 7 is provided above the CG6;

[0023] The bonding mechanism 7 includes a first suction nozzle piece 701, a bonding block 702, a second suction nozzle piece 703, surrounding suction holes 704, a middle suction hole 705, a U-shaped pre-fixed hole 706, a connecting base 707, a connecting block 708, an air intake valve interface 709 and a connecting column 710. The upper surface of CG6 is bonded with the first suction nozzle piece 701, the upper surface of the first suction nozzle piece 701 is fixedly connected with the bonding block 702, the lower surface of the bonding block 702 is fixedly connected with the second suction nozzle piece 703, the surface of the second suction nozzle piece 703 is penetrated with surrounding suction holes 704, the central axis position of the bonding block 702 is penetrated with the middle suction hole 705, the surface of the bonding block 702 is provided with a U-shaped pre-fixed hole 706, and one side surface of the bonding block 702 A connecting base 707 is fixedly connected to the surface, a connecting block 708 is fixedly connected to one side surface of the connecting base 707, an air intake valve interface 709 is fixedly connected to one side surface of the connecting base 707, and a connecting column 710 is fixedly connected to one side surface of the connecting base 707. Through the arrangement of the first suction nozzle piece 701, the bonding block 702, the second suction nozzle piece 703, the surrounding adsorption holes 704, the middle adsorption hole 705, the U-shaped pre-fixed hole 706, the connecting base 707, the connecting block 708, the air intake valve interface 709 and the connecting column 710, when in use, the CG6 to be bonded is placed in a specific working area so that the upper surface of the CG6 is accurately bonded to the first suction nozzle piece 701, which lays the foundation for subsequent operations. This process requires ensuring that the two The tight fit and accurate position provide solid support for the subsequent adsorption and pre-consolidation process, preventing errors in subsequent processes due to initial positioning deviation. The first suction nozzle piece 701 is tightly fixedly connected to the bonding block 702, which plays a key hub role. The second suction nozzle piece 703 below it generates suction through the surrounding adsorption holes 704, firmly adsorbs itself, and prevents loosening or displacement during complex operations. At the same time, the middle adsorption hole 705 at the central axis position of the bonding block 702 plays a core adsorption function, which implements a strong and uniform suction effect on CG6, ensuring that CG6 remains in a stable position throughout the entire workflow, effectively resisting external interference factors, and ensuring high-precision operation requirements. The surface of the bonding block 702 is carefully designed The U-shaped pre-fixing hole 706 constructs a precise optical path channel for the pre-curing process. When the pre-curing process starts, the light is accurately transmitted to the target area through the U-shaped pre-fixing hole 706, and the glue at the corresponding position below CG6 is accurately pre-cured. During this process, the connecting base 707, the connecting block 708, the suction valve interface 709 and the connecting column 710 fixedly connected to one side of the bonding block 702 work together. The suction valve interface 709 accurately adjusts the adsorption strength and stability. The connecting base 707, the connecting block 708 and the connecting column 710 structurally stabilize the overall device, ensure the stable operation of the light transmission and adsorption system, ensure that the pre-curing effect is uniform and reliable, improve the stability of the structure in the early stage of bonding, and lay a solid foundation for the final high-quality bonding.

[0024] Furthermore, a slot is provided on the upper surface of the fixing plate 2, and the connector 3 is slidingly connected to the fixing plate 2 through the slot. Through the arrangement of the fixing plate 2 and the connector 3, when in use, the silicon-based OLED is fixedly connected through the slot provided on the upper part of the fixing plate 2, which is beneficial for the subsequent bonding of the CG6 and ensures the normal operation of the entire device.

[0025] Furthermore, two groups of first suction nozzle pieces 701 are symmetrically arranged with the middle suction hole 705 as the central axis, and two groups of second suction nozzle pieces 703 are symmetrically arranged with the middle suction hole 705 as the central axis. Through the arrangement of the first suction nozzle piece 701 and the second suction nozzle piece 703, when in use, this layout constructs a balanced adsorption force field. When adsorbing CG6, the two groups of suction nozzle pieces work together to evenly apply suction in multiple directions, effectively offsetting external interference forces such as air flow fluctuations and slight vibrations, preventing CG6 from tilting and shifting, laying a solid foundation for high-precision bonding and pre-fixing, avoiding bonding defects, unbalanced glue distribution and poor pre-fixing due to uneven adsorption, improving product quality reliability, and for production compatibility, the advantages are fully demonstrated when adapting to CG6 of different sizes and shapes. When handling large-sized CG6, two sets of suction nozzles expand the adsorption range, enhance the overall adsorption force, and ensure stable adsorption; when dealing with small-sized or irregular-shaped CG6, precise adaptation is achieved by adjusting the suction force distribution and working status of the two sets of suction nozzles. There is no need to replace the suction nozzles or complex equipment debugging, which improves production efficiency, reduces costs, and enhances the company's ability to respond to diversified market product demands.

[0026] Furthermore, a group of surrounding adsorption holes 704 are provided on the surface of each group of the first suction nozzle piece 701 and the second suction nozzle piece 703, and a group of middle adsorption holes 705 are provided on the central axis of the bonding block 702. Through the provision of the surrounding adsorption holes 704 and the middle adsorption holes 705, when in use, the specific provision of the surrounding adsorption holes 704 and the middle adsorption holes 705 is extremely advantageous. A group of surrounding adsorption holes 704 is provided in each group of suction nozzle pieces to form a multi-directional adsorption system. When adsorbing CG6, the suction nozzle pieces are tightly and firmly fixed from the periphery, the rigidity of the overall structure is enhanced, the interference of external forces during the process is resisted, the relative positions of the components are maintained stable, the accuracy of pre-fixation and bonding is ensured, and the multi-group distribution improves the adsorption redundancy. If a part is affected by impurities or wear, the remaining adsorption holes can still maintain the basic adsorption. Attachment, ensure the continuity and reliability of the process, improve the stability and fault tolerance of equipment operation, reduce the risk of failure and maintenance frequency, ensure efficient and stable production, and a group of middle adsorption holes 705 are set on the central axis of the bonding block to provide a concentrated and precise suction core for CG6. This layout is in line with the shape characteristics of CG6, ensuring that the adsorption force acts vertically and evenly on the center, avoiding the hidden dangers of uneven stress and displacement caused by eccentric adsorption, and ensuring close and uniform contact between the bonding surfaces. It cooperates with the adsorption holes on the surrounding areas to build a primary and secondary, coordinated and efficient adsorption structure, optimize the adsorption efficiency, and improve the adaptability to CG6 of different thicknesses and materials. While meeting the requirements of stable adsorption, it creates ideal conditions for high-quality pre-solidification and bonding, effectively improving product yield and process stability, and meeting the stringent requirements of high-precision semiconductor display production.

[0027] Furthermore, four groups of U-shaped pre-fixing holes 706 are symmetrically arranged with respect to the central axis of the bonding block 702, and a pre-fixing lamp is fixedly connected to the inner surface of the U-shaped pre-fixing hole 706. Through the arrangement of the U-shaped pre-fixing hole 706, when in use, the U-shaped pre-fixing hole 706 has the advantage of symmetrically arranging four groups of pre-fixing lamps with respect to the central axis and connecting them. In terms of pre-fixing uniformity, the four groups are arranged at the four corners of CG6 to construct a symmetrical light field. When the pre-fixing lamp is illuminated, the light is accurately guided to the glue area through the U-shaped pre-fixing hole, so that the glue is heated and cured uniformly and synchronously, avoiding stress imbalance and bonding defects caused by local curing differences, ensuring that the bonding surface of CG6 and silicon-based OLED4 is stable and flat, and improving product quality consistency and Reliability, reduce the internal stress caused by uneven curing, reduce display unevenness, stratification and other undesirable phenomena, enhance the stability of display performance, from the perspective of production efficiency, multiple sets of pre-fixed holes and lamps work together to improve the curing speed. Compared with a single point or a small amount of pre-fixed structure, it can handle the curing of glue at four corners at the same time, greatly shorten the pre-fixed time, reduce the overall process beat, and increase the output per unit time. The symmetrical setting simplifies the optical path design and equipment debugging, reduces the complexity of the equipment and manufacturing costs, and is convenient for on-site operation and maintenance. It improves the overall efficiency of equipment operation and production benefits, meets the large-scale and high-efficiency production needs of the semiconductor display industry, and enhances the company's market competitiveness and cost control capabilities.

[0028] Furthermore, four groups of connecting blocks 708 are symmetrically arranged with respect to the central axis of the connecting base 707. The connecting base 707 is fixedly connected to the bonding block 702 through the connecting blocks 708. Through the setting of the connecting blocks 708, when in use, this symmetrical layout constructs a stable supporting structure. The four groups of connecting blocks stabilize the bonding block 702 from multiple directions, evenly disperse the stress, and effectively resist the complex stress caused by external forces on CG6 during pre-fixation and bonding, prevent the bonding block 702 from displacement and deformation, ensure the relative position accuracy of the internal adsorption holes and the pre-fixation holes, ensure that the adsorption and pre-fixation are accurate and reliable, improve the product bonding accuracy and yield, enhance the long-term operation stability of the equipment, and reduce the maintenance cost and the risk of production interruption caused by equipment failure.

[0029] Furthermore, two groups of suction valve interfaces 709 are symmetrically arranged on the two side surfaces of the connecting base 707, and each group is provided with two. CG6 is connected to the bonding block 702 through the surrounding adsorption holes 704 and the middle adsorption hole 705. Through the setting of the suction valve interface 709, when in use, multiple groups of suction valve interfaces are symmetrically distributed on both sides of the connecting base 707 to construct an efficient and balanced negative pressure adsorption system. Each group of two interfaces improves the adsorption force redundancy and stability. If any interface fails or the suction fluctuates, the remaining interfaces maintain stable suction to ensure that CG6 is firmly adsorbed and prevent CG6 from being displaced or falling off due to insufficient suction during the process, thereby improving production continuity and product quality stability, reducing the defective rate caused by adsorption problems, and reducing production costs.

[0030] Furthermore, the silicon-based OLED 4 is fixedly connected to the fixing plate 2 through the connector 3, and the bonding block 702 is fixedly connected to the connecting column 710 through the connecting base 707. From the perspective of structural stability, the connector 3 provides a reliable installation fulcrum for the silicon-based OLED 4, resists external force impact and vibration, maintains position accuracy, ensures stable electrical connection, prevents signal transmission interference and interruption, improves display performance reliability, reduces display failures and electrical damage risks caused by loose connections, extends service life, and ensures stable operation in complex processes. The fixing method of the bonding block 702 enhances its positioning accuracy and stability. The connecting base 707 and the connecting column 710 cooperate to limit the freedom of the bonding block 702, ensuring that the adsorption and pre-fixed holes are accurately aligned with CG6 and the silicon-based OLED 4, ensuring close fitting and uniform glue curing, improving product fitting quality and yield, avoiding fitting deviation, glue overflow or poor curing due to displacement of the bonding block, enhancing process stability and repeatability, optimizing production processes, reducing scrap rates and costs, and improving production efficiency and economic benefits, laying a solid foundation for high-precision and high-quality production of semiconductor display manufacturing.

[0031] Working principle: When in use, place the CG glass to be bonded precisely in the corresponding area above the floating suction nozzle, start the vacuum adsorption system, and generate strong and uniform suction through the synergistic effect of the middle hole of the suction nozzle piece and the vacuum hole in the middle of the floating structure, so as to quickly and firmly adsorb the CG glass. The four-side holes tightly adsorb the suction nozzle piece to eliminate the risk of loosening or displacement of the suction nozzle piece, and comprehensively guarantee the position accuracy and stability of the CG glass in the pre-solidification and subsequent bonding process, creating conditions for high-precision bonding, activating the pre-curing light board, and 8 lamp beads release UV light of specific wavelength and intensity. The light is precisely guided to the pre-solidification holes at the four corners of the suction nozzle piece through the optimized U-shaped groove, and UV pre-curing is efficiently and evenly performed on the OCR glue below the pre-solidification holes. The plane of the suction nozzle piece strictly blocks excess light to prevent light scattering or mis-irradiation from causing abnormal curing of glue or damage to other components, ensuring clear boundaries of the pre-curing area and stable effects, effectively suppressing the flow of glue and the displacement trend of CG, and strengthening the stability of the early structural structure of bonding. After the pre-curing is completed, the floating suction nozzle piece that adsorbs the CG glass is controlled by a high-precision motion control system. The nozzle is precisely and steadily aligned with the silicon-based OLED. The entire process of bonding relies on the stable pre-fixing effect in the early stage and precise equipment control to maintain the ideal position and posture of the CG glass to achieve seamless and precise bonding. Immediately after bonding, optical inspection, electrical performance testing and other multi-faceted means are used to comprehensively inspect the product quality, quickly identify potential defects such as bonding gap, display uniformity, and electrical connection stability, and flexibly adjust subsequent process parameters or implement product screening based on the inspection results to ensure product quality consistency and reliability, and improve overall production efficiency and yield rate. This setting innovatively changes the pre-fixing position to the four corners of the display area for pre-fixing, eliminating the Mura problem at the pre-fixing point from the source. Traditional intermediate pre-fixing is prone to such problems and causes product defects. The new structure greatly reduces the occurrence rate of pre-fixing Mura in the display area, greatly improves the overall product yield, and reduces the loss and cost waste caused by quality problems. The floating nozzle structure is enlarged and changed to a four-point layout. With the adjustment of the 8 lamp beads on the pre-curing lamp board and the optimized design of the nozzle piece, it can be compatible with the four-corner pre-fixing requirements of products of various sizes and models.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel bonding pre-consolidation structure, comprising a base (1), characterized in that: The upper surface of the base (1) is fixedly connected to a fixing plate (2), the upper surface of the fixing plate (2) is snap-connected to a connector (3), the upper surface of the connector (3) is fixedly connected to a silicon-based OLED (4), glue (5) is applied above the silicon-based OLED (4), a CG (6) is attached above the glue (5), and an attachment mechanism (7) is provided above the CG (6); The laminating mechanism (7) comprises a first suction nozzle piece (701), a laminating block (702), a second suction nozzle piece (703), surrounding suction holes (704), a middle suction hole (705), a U-shaped pre-fixing hole (706), a connecting base (707), a connecting block (708), an air intake valve interface (709) and a connecting column (710); the upper surface of the CG (6) is laminating with the first suction nozzle piece (701); the upper surface of the first suction nozzle piece (701) is fixedly connected to the laminating block (702); the lower surface of the laminating block (702) is fixedly connected to the second suction nozzle piece (703); The surfaces of the two suction nozzle pieces (703) are penetrated by suction holes (704) on all sides, the central axis of the bonding block (702) is penetrated by a middle suction hole (705), the surface of the bonding block (702) is provided with a U-shaped pre-fixed hole (706), one side surface of the bonding block (702) is fixedly connected to a connecting base (707), one side surface of the connecting base (707) is fixedly connected to a connecting block (708), one side surface of the connecting base (707) is fixedly connected to an air intake valve interface (709), and one side surface of the connecting base (707) is fixedly connected to a connecting column (710).

2. A novel bonding pre-consolidation structure according to claim 1, characterized in that: The upper surface of the fixing plate (2) is provided with a notch, and the connector (3) is slidably connected to the fixing plate (2) via the notch.

3. A novel bonding pre-consolidation structure according to claim 1, characterized in that: The first suction nozzle piece (701) is symmetrically arranged in two groups with the middle suction hole (705) as the central axis, and the second suction nozzle piece (703) is symmetrically arranged in two groups with the middle suction hole (705) as the central axis.

4. A novel bonding pre-consolidation structure according to claim 1, characterized in that: A group of the peripheral suction holes (704) is provided on the surface of each group of the first suction nozzle piece (701) and the second suction nozzle piece (703), and a group of the middle suction holes (705) is provided on the central axis of the bonding block (702).

5. The novel bonding pre-consolidation structure according to claim 1 is characterized in that: Four groups of the U-shaped pre-fixing holes (706) are symmetrically arranged around the central axis of the fitting block (702), and the inner surfaces of the U-shaped pre-fixing holes (706) are fixedly connected with pre-fixing lamps.

6. The novel bonding pre-consolidation structure according to claim 1 is characterized in that: The connection blocks (708) are symmetrically arranged in four groups with respect to the central axis of the connection base (707), and the connection base (707) is fixedly connected to the fitting block (702) via the connection blocks (708).

7. The novel bonding pre-consolidation structure according to claim 1 is characterized in that: The air intake valve interface (709) is symmetrically arranged in two groups on the two side surfaces of the connection base (707), with two valves in each group. The CG (6) is connected to the bonding block (702) through the surrounding adsorption holes (704) and the middle adsorption hole (705).

8. The novel bonding pre-consolidation structure according to claim 1 is characterized in that: The silicon-based OLED (4) is fixedly connected to the fixing plate (2) via a connector (3), and the bonding block (702) is fixedly connected to the connecting column (710) via a connecting base (707).

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