Drive device and air conditioner

Abstract

A drive device (200) for converting power supplied from a power source to power for driving a motor, the drive device (200) being provided with: a substrate (1) provided with a wiring pattern including lands (11a, 11b) formed of a metal foil; a heat-generating component (2) provided with pins (21a, 21b) for connection, the pins (21a, 21b) being attached to the substrate (1) by being welded to the lands (11a, 11b); electronic components (13, 14) electrically connected to the heat generating component (2) via a wiring pattern; a metal frame body (3) surrounding the substrate (1); and heat dissipation members (4a, 4b) for releasing heat emitted by the heat generation member (2), the heat dissipation members (4a, 4b) being in contact with the housing (3), the lands (11a, 11b), and the pins (21a, 21b).

Description

Technical Field

[0001] The present disclosure relates to a driving device for driving a motor and an air conditioning device including the driving device. Background Art

[0002] In electronic substrates such as circuit substrates constituting a driving device for driving a motor, it is necessary to prevent foreign objects such as water, dust, dirt, and small animals from adhering to the electronic substrate and causing a short circuit on the electronic substrate due to a tracking phenomenon. Hereinafter, the electronic substrate will be referred to as a "substrate". In addition, in a driving device for a compressor motor of an air-conditioning device, when a slightly flammable refrigerant is used, it is necessary to prevent the refrigerant from leaking to the periphery of the substrate. Therefore, in the driving device for a compressor motor of an air-conditioning device, a structure is adopted in which a substrate is provided in a closed structure. The driving device having a structure in which a substrate is provided in a closed structure makes it difficult for the heat from the substrate to be released outside the closed structure, and thus the cooling performance of the electronic components mounted on the substrate is reduced.

[0003] Patent document 1 discloses the following structure: in a power module including a substrate, an electronic component arranged on the substrate, and a power module, a heat-dissipating metal plate and a metal cover are closely attached to the power module from the side opposite to the substrate via a thermally conductive insulating material. The power module disclosed in Patent document 1 includes a housing that covers the substrate from the side of the substrate opposite to the side on which the power module is mounted, and the housing and the metal cover form a sealed structure.

[0004] The power module disclosed in Patent Document 1 conducts the heat generated by the heat generating component to the metal cover through the heat conductive insulating material and the heat dissipating metal plate, and releases the heat in the metal cover, thereby cooling the heat generating component. The power module disclosed in Patent Document 1 forms a sealed structure of the drive device through the cooling structure as described above, and improves the heat dissipation effect of the electronic component that becomes high temperature, such as the power module, without using a heat sink.

[0005] Patent Document 1: International Publication No. 2016 / 147345

[0006] When a substrate is housed in a sealed structure as in the power module disclosed in Patent Document 1, there is a problem in balancing the heat dissipation of the heat-generating components that have reached a high temperature and the heat dissipation of other electronic components disposed on the substrate. That is, there is no measure to improve the heat dissipation effect for electronic components other than the heat-generating components that can release the generated heat from the metal cover. Therefore, in the power module disclosed in Patent Document 1, the heat of the electronic components other than the heat-generating components is trapped in the frame. Summary of the invention

[0007] The present disclosure has been made in view of the above circumstances, and an object of the present disclosure is to provide a driving device that improves the heat dissipation effect of heat generated by electronic components other than heat generating components disposed in a housing forming a sealed structure.

[0008] In order to solve the above-mentioned problems and achieve the purpose, the driving device involved in the present disclosure converts the power supplied from the power supply into the power for driving the motor, wherein the driving device comprises: a substrate having a wiring pattern including a joint portion formed by a metal foil; a heat generating component having a terminal portion for connection, the terminal portion being welded to the joint portion and mounted on the substrate; an electronic component being electrically connected to the heat generating component through the wiring pattern; a metal frame surrounding the substrate; and a heat dissipating component that releases the heat generated by the heat generating component. The heat dissipating component is in contact with the frame, the terminal portion, and the joint portion.

[0009] The driving device according to the present disclosure has an effect of improving the heat dissipation effect of heat generated by electronic components other than heat-generating components arranged in a housing forming a sealed structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a diagram showing the structure of the drive device according to the first embodiment.

[0011] Figure 2 This is a cross-sectional view schematically showing a state where a heat generating component is mounted on a substrate of the driving device according to the first embodiment.

[0012] Figure 3 This is a cross-sectional view schematically showing a state in which a heat generating component is mounted on a substrate of a driving device according to the second embodiment.

[0013] Figure 4 This is a cross-sectional view schematically showing a state in which a heat generating component is mounted on a substrate of a driving device according to a modified example of the second embodiment.

[0014] Figure 5 This is a cross-sectional view schematically showing a state in which a heat generating component is mounted on a substrate of a driving device according to a third embodiment.

[0015] Figure 6 It is a diagram showing the configuration of an air-conditioning apparatus according to Embodiment 4.

[0016] Figure 7 It is a perspective view of an outdoor unit of an air-conditioning apparatus according to Embodiment 4.

[0017] Figure 8 It is a perspective view of an outdoor unit of an air-conditioning apparatus according to a modification of the fourth embodiment. DETAILED DESCRIPTION

[0018] Hereinafter, a driving device and an air conditioning device according to the embodiment will be described in detail with reference to the drawings.

[0019] Implementation Method 1

[0020] Figure 1 1 is a diagram showing the structure of a drive device according to Embodiment 1. A drive device 200 according to Embodiment 1 is connected to a power source 100 and a motor 101. The drive device 200 is supplied with power from the power source 100. The drive device 200 has the functions of a converter and an inverter and a function of controlling them, converts the power supplied from the power source 100 into power suitable for motor driving, and outputs driving power to the motor 101. In addition, the function of controlling the converter and the inverter is realized by a well-known microcontroller.

[0021] The driving device 200 includes a substrate 1 on which a wiring pattern is formed. The wiring pattern is a conductor wiring mainly made of metal foil such as copper foil, and is provided on the surface and inside of a plate formed of an insulator. An electronic circuit is formed by soldering connecting terminals of electronic components including a heat generating component 2 to a joint formed on the substrate 1. The electronic components mounted on the substrate 1 are, for example, a noise filter, a smoothing capacitor, a sensor for detecting current and voltage, a microcontroller, and a peripheral circuit.

[0022] If the terminal of the electronic component is a wire, the bonding portion of the substrate 1 is a pad to which the terminal is soldered. If the terminal of the electronic component is a lead, the bonding portion of the substrate 1 is a land to which the terminal is soldered.

[0023] When the motor 101 is driven, each component mounted on the substrate 1 generates heat due to its own internal loss, etc. In particular, the heat generated by the loss associated with switching or conduction of the semiconductor element during power conversion, the heat generated by the loss of the resistance of the reactor, and the heat generated by the ripple current flowing through the smoothing capacitor are large.

[0024] The drive device 200 has a metal frame 3, which prevents foreign objects such as water, dust, dirt and small animals from adhering to the substrate 1 and causing a short circuit due to the track phenomenon. The substrate 1 is arranged in a closed structure formed by the frame 3. In addition, when it is necessary to pass electrical wiring and communication lines inside and outside the closed structure, holes for these lines to pass through are provided in the frame 3. When holes are provided in the frame 3, water, dust, dirt and small animals may invade from the gap between the hole and the wire, but the risk of invasion can be reduced by reducing the gap between the hole and the wire. In addition, the airtightness in the closed structure can be improved by plugging the gap between the hole and the wire with a sealing material or a caulking material. Although in Figure 1In the embodiment, the motor 101 is provided inside the frame 3 , but the motor 101 may be provided outside the frame 3 .

[0025] Figure 2 2 is a cross-sectional view schematically showing a state where a heat generating component is mounted on a substrate of a driving device according to Embodiment 1. Figure 2 , the motor 101 is omitted. The substrate 1 is spaced apart from the surface 31 of the frame 3 by the legs 15a and 15b, and components can be mounted on both surfaces of the substrate 1. The substrate 1 includes: a first surface 1f, on which the electronic components 13 and 14 are arranged; and a second surface 1s, which is the surface opposite to the first surface 1f, on which the heat generating component 2 is arranged.

[0026] exist Figure 2 In FIG. 1 , an example is shown in which the heat generating component 2 is a representative power device. Figure 2 , an example of a DIP (Dual Inline Package) type power module is shown, but the package of the power device is not limited to DIP. The power device refers to a collection of semiconductor elements that rectify the current supplied from the power source 100 or convert the rectified power into driving power for the motor 101. The power device has the functions of a well-known inverter and converter, and is used by arranging multiple discrete semiconductor elements or by accommodating multiple semiconductor elements in a power module package.

[0027] Furthermore, a composite module that integrates the converter function of rectifying the power output by the power supply 100 and the inverter function of converting the power into driving power for the motor 101 into one package is also known. The concept of power devices also includes discrete semiconductor elements, power modules and composite modules.

[0028] The heat generating component 2 is thermally connected to the frame 3 by abutting against the surface 31 of the frame 3, and the heat of the heat generating component 2 is released along the frame 3. The frame 3 has the function of releasing the heat of the heat generating component 2, and the heat is conducted to the entire metal constituting the frame 3. Since the heat dissipation area is increased, the heat dissipation effect is high.

[0029] The substrate 1 has connection pads 11a and 11b constituting a part of a wiring pattern formed by a metal foil. The connection pad 11a as a joint portion is formed on the surface of the first surface 1f and the second surface 1s of the substrate 1, and a part of the surface of the first surface 1f and a part of the surface of the second surface 1s are connected by a through hole 12a penetrating the substrate 1. Similarly, the connection pad 11b as a joint portion is formed on the surface of the first surface 1f and the second surface 1s of the substrate 1, and a part of the surface of the first surface 1f and a part of the surface of the second surface 1s are connected by a through hole 12b penetrating the substrate 1. In the heat generating component 2, pins 21a and 21b corresponding to the terminal portion are respectively penetrated through the through holes 12a and 12b of the substrate 1 and welded to the connection pads 11a and 11b, and fixed to the substrate 1 by the joint. In addition, in the case where the heat generating component 2 is an inductor or a capacitor, the wire corresponding to the terminal portion is welded to the pad of the substrate 1 as a joint portion.

[0030] The electronic components 13 and 14 are respectively arranged on the surface of the first surface 1f of the substrate 1, and are soldered to the unillustrated solder pads formed on the first surface 1f of the substrate 1. The unillustrated solder pads to which the electronic components 13 and 14 are respectively soldered are connected to the connection pads 11a and 11b. Therefore, the electronic components 13 and 14 are electrically connected to the heat generating component 2 via the wiring pattern.

[0031] The heat generating component 2 performs electrical exchange such as transmission of electrical signals with the electronic components 13 and 14 mounted on the substrate 1 via the metal foil on the substrate 1 electrically connected to the connection pads 11a and 11b. In addition, the heat generating component 2 performs electrical exchange such as supply / reception of power and transmission of electrical signals with other substrates via the wiring pattern and terminals or connectors formed using the metal foil on the substrate 1.

[0032] Although in Figure 2 In the figure, an example in which the heat generating component 2 is a DIP type module is shown, but in the case where the heat generating component 2 is a SOP (Small Outline Package) type device having gull wing type pins 21a and 21b, the pins 21a and 21b are soldered to the pads formed on the first surface 1f of the substrate 1, and are fixed to the substrate 1 by soldering the pins 21a and 21b to the pads.

[0033] The driving device 200 according to the first embodiment makes the heat dissipation components 4a and 4b contact the connection pads 11a and 11b as the joint part, the pins 21a and 21b as the terminal part, and the frame 3 to efficiently release the heat from the heat generating component 2. The heat dissipation components 4a and 4b are known heat sinks with electrical insulation, gels with high heat dissipation, or colloids with high heat dissipation (jell). The heat dissipation components 4a and 4b have insulation, thereby ensuring the insulation between the frame 3 with heat dissipation function and the pins 21a and 21b.

[0034] In the driving device 200 according to the first embodiment, in addition to direct heat conduction from the heat generating component 2 to the frame 3, heat is also conducted from the pins 21a and 21b of the heat generating component 2 to the frame 3 via the heat dissipating components 4a and 4b. Furthermore, the heat transferred from the pins 21a and 21b of the heat generating component 2 to the connection pads 11a and 11b can also be conducted to the frame 3 via the heat dissipating components 4a and 4b. Therefore, the driving device 200 according to the first embodiment can efficiently release the heat generated by the heat generating component 2. In addition, the driving device 200 according to the first embodiment can efficiently release the heat generated by the electronic components 13 and 14 electrically connected to the heat generating component 2 via the connection pads 11a and 11b and the wiring pattern of the substrate 1 in addition to the heat generating component 2. Thus, the heat generated by the heat generating component 2 and the electronic components 13 and 14 mounted on the substrate 1 arranged in the frame 3 forming a sealed structure can be released via the connection pads 11a and 11b, the heat dissipating components 4a and 4b and the metal frame 3.

[0035] like Figure 2 As shown, if the pins 21a, 21b of the heat-generating component 2 are configured to be embedded in the heat-dissipating components 4a, 4b for fixation, then when the substrate 1 is conveyed or when power is turned on, even if vibration occurs in the substrate 1 or the frame 3, the vibration of the pins of the heat-generating component 2 can be attenuated by the heat-dissipating components 4a, 4b, thereby preventing the pins 21a, 21b from being damaged.

[0036] As described above, in the driving device 200 having the substrate 1 in the sealed structure surrounded by the metal frame 3, by making the heat dissipation components 4a and 4b in thermal contact with the terminal portion of the heat-generating component 2, the joint portion of the substrate 1, and the frame 3, not only the heat dissipation of the heat-generating component 2 is improved, but also the heat generated by the electronic components 13 and 14 other than the heat-generating component 2 can be released through the connection pads 11a and 11b as the joint portion, the heat dissipation components 4a and 4b, and the frame 3. Therefore, the driving device 200 involved in the first embodiment has the following effects: while adopting the sealed structure that can prevent the track phenomenon caused by the attachment of foreign matter such as water, dust, dirt, and small animals to the substrate 1, it can also prevent the failure of the electronic components 13 and 14 caused by heat, which is a problem in the sealed structure.

[0037] Implementation Method 2

[0038] Figure 3 2 is a cross-sectional view schematically showing a state in which a heat generating component is mounted on a substrate of a driving device according to Embodiment 2. The driving device 200 according to Embodiment 2 includes a heat dissipation component 4c disposed between the heat generating component 2 and the frame 3. That is, in the driving device 200 according to Embodiment 2, a heat dissipation component 4c is sandwiched between the heat generating component 2 and the frame 3. The heat dissipation component 4c transfers heat from the heat generating component 2 to the frame 3. Therefore, the heat generating component 2 is thermally connected to the frame 3 via the heat dissipation component 4c.

[0039] The heat dissipation component 4c is a known heat sink, a gel with high heat dissipation, or a colloid with high heat dissipation, which has electrical insulation properties, similarly to the heat dissipation components 4a and 4b shown in Embodiment 1. In Embodiment 2, the heat dissipation component 4c formed as one component is arranged around the pins 21a and 21b of the heat-generating component 2 and in the portion between the heat-generating component 2 and the frame 3, but the heat dissipation component 4c may be constituted by using a plurality of different components in such a manner that heat is dissipated around the pins 21a and 21b of the heat-generating component 2 by a gel or colloid with high softness and a heat sink is arranged in the portion between the heat-generating component 2 and the frame 3.

[0040] By making the heat-generating component 2 and the frame 3 in thermal contact via the heat-dissipating component 4c, it is possible to fill the tiny gap generated when the heat-generating component 2 and the frame 3 are in contact. Therefore, the driving device 200 involved in the second embodiment prevents the increase of thermal resistance due to the gap between the heat-generating component 2 and the frame 3, further improves the thermal conductivity from the heat-generating component 2 to the frame 3, and further improves the heat dissipation effect of the heat-generating component 2.

[0041] As described above, by sandwiching the heat dissipation component 4c between the heat dissipation component 2 and the frame 3, the heat generated by the heat dissipation component 2 of the substrate 1 installed in the frame 3 forming a closed structure can be released through the connection pads 11a, 11b, the heat dissipation component 4c and the metal frame 3. That is, by sandwiching the heat dissipation component 4c between the heat dissipation component 2 and the frame 3, the heat dissipation effect of the heat generated by the heat dissipation component 2 can be further improved. In addition, similarly to the driving device 200 involved in the first embodiment, in addition to the heat dissipation component 2, the heat generated by the electronic components 13 and 14 on the substrate 1 electrically connected to the heat dissipation component 2 via the connection pads 11a, 11b and the wiring pattern on the substrate 1 can also be efficiently released.

[0042] Figure 4This is a cross-sectional view schematically showing a state where a heat generating component is mounted on a substrate of a drive device according to a modification of Embodiment 2. In a drive device 200 according to the modification of Embodiment 2, heat transfer grease 5 is interposed between the heat generating component 2 and the frame 3 instead of the heat dissipating component 4c.

[0043] The driving device 200 according to the modification of the second embodiment is assembled after the heat transfer grease 5 is applied to the heat generating component 2 or the frame 3 , thereby bringing the heat generating component 2 and the frame 3 into thermal contact with each other via the heat transfer grease 5 .

[0044] As the thermally conductive grease 5 , for example, a known grease based on modified silicon having a small viscosity change from room temperature to high temperature and mixed with particles of a metal or metal oxide having high thermal conductivity can be used.

[0045] By making the heat-generating component 2 and the frame 3 in thermal contact via the thermally conductive grease 5, it is possible to fill the tiny gap generated when the heat-generating component 2 and the frame 3 are in contact. Therefore, the increase in thermal resistance due to the gap between the heat-generating component 2 and the frame 3 is prevented, the thermal conductivity from the heat-generating component 2 to the frame 3 is further improved, and the heat dissipation effect of the heat-generating component 2 is further improved.

[0046] As described above, by sandwiching the thermally conductive grease 5 between the heat generating component 2 and the frame 3, the heat dissipation effect of the heat generated by the heat generating component 2 is further improved. As a result, the heat generated by the heat generating component 2 of the substrate 1 arranged in the frame 3 forming a closed structure can be released through the connection pads 11a, 11b, the heat dissipating components 4a, 4b, the thermally conductive grease 5 and the metal frame 3. Similar to the driving device 200 involved in the first embodiment, in addition to the heat generating component 2, the electronic components 13 and 14 on the substrate 1 electrically connected to the heat generating component 2 via the connection pads 11a, 11b and the wiring pattern on the substrate 1 can also be efficiently dissipated.

[0047] Implementation 3

[0048] Figure 5 2 is a cross-sectional view schematically showing a state in which a heat generating component is mounted on a substrate of a driving device according to Embodiment 3. The driving device 200 according to Embodiment 3 has a heat generating component 2 mounted on a first surface 1f of a substrate 1. That is, in the driving device 200 according to Embodiment 3, the heat generating component 2 and the electronic components 13 and 14 are mounted on the same surface of the substrate 1.

[0049] In the third embodiment, the heat generated by the heat generating component 2 is transferred to the frame 3 via the pins 21a, 21b and the heat dissipating components 4a, 4b. Furthermore, the heat transferred from the pins 21a, 21b of the heat generating component 2 to the connection pads 11a, 11b can also be transferred to the frame 3 via the heat dissipating components 4a, 4b, thereby efficiently releasing the heat from the heat generating component 2. In addition, in addition to the heat generating component 2, the electronic components 13, 14 on the substrate 1 electrically connected to the heat generating component 2 via the connection pads 11a, 11b can also be efficiently dissipated. Although in Figure 5 In the embodiment, the heat dissipating components 4a and 4b are formed separately, but they may be one component.

[0050] The driving device 200 according to the third embodiment can release the heat generated by the heat generating component 2 and the electronic components 13 and 14 mounted on the substrate 1 arranged in the frame 3 forming a closed structure through the connection pads 11a and 11b, the heat dissipating components 4a and 4b, and the metal frame 3. In addition, the component mounting surface of the heat generating component 2 and the electronic components 13 and 14 can be unified, thereby improving the efficiency of the component mounting operation.

[0051] Implementation 4

[0052] Figure 6 1 is a diagram showing the structure of an air conditioning device according to Embodiment 4. The air conditioning device 300 according to Embodiment 4 includes an indoor unit 150 and an outdoor unit 110. The indoor unit 150 includes an indoor heat exchanger 124. The outdoor unit 110 includes a fan motor 102, a compressor 111, a fan 112, an outdoor heat exchanger 123, a four-way valve 121, an expansion device 122, and a drive device 200. The compressor 111 is composed of a motor 101 and a compression element (not shown) connected to the motor 101. Any of the drive devices 200 described in Embodiments 1 to 3 is applied to the drive device 200.

[0053] Figure 7 1 is a perspective view of an outdoor unit of an air-conditioning apparatus according to Embodiment 4. Figure 7 In FIG. 1 , the internal structure of the outdoor unit 110 is visualized by not showing one side of the outdoor unit 110. Figure 7 In the specification, the components of the outdoor unit 110 include an outdoor heat exchanger 123, a fan 112 for exchanging heat between the outdoor heat exchanger 123 and the external air, a substrate 1 of a drive device 200, a heat-generating component 2 mounted on the substrate 1, other electronic components 13 and 14 mounted on the substrate 1, and a compressor 111, while the description of electrical wiring and refrigerant piping in the outdoor unit 110 is omitted.

[0054] In addition, a metal frame 3 constituting a closed structure is formed by a frame metal plate 3a of the outdoor unit 110 and a partition 3b that partitions the interior of the outdoor unit 110 into a fan chamber 131 and a machine chamber 132, and a drive device 200 is provided on the side of the machine chamber 132. However, the frame 3 has a minimum number of holes for passing electric and gas wiring, communication lines, piping, etc. inside and outside the outdoor unit 110. The partition 3b constitutes a surface 31 of the frame 3 that is thermally connected to the heat generating component 2.

[0055] The fan 112 for exchanging heat with the outside air generates wind in the fan chamber 131 by rotating. Figure 7 In the outdoor unit 110 shown, the partition 3b faces the fan chamber 131 and is located on the side of the heat-generating component 2 opposite to the surface opposite to the surface of the substrate 1, so that the wind generated by the rotation of the fan 112 blows onto the partition 3b, and the heat of the heat-generating component 2 is released through the partition 3b by the wind.

[0056] With such a configuration, the heat of the heat generating member 2 can be effectively released using the wind generated by the rotation of the fan 112 .

[0057] The driving device 200 receives power supply from the power source 100 , outputs driving power to the motor 101 of the compressor 111 , and drives the motor 101 , thereby compressing the refrigerant in the connected compression element.

[0058] Generally speaking, the output of the motor 101 of the compressor 111 is greater than the output of the fan motor 102. Therefore, in cooling the power devices for driving the motor 101 and the fan motor 102, it is preferred to set the power device of the motor 101 driving the compressor 111 as the heat generating component 2 of the driving device 200. However, the heat generating component 2 of the driving device 200 may be the power device for driving the fan motor 102, or may be both the power device for driving the motor 101 and the power device for driving the fan motor 102. By setting at least one of the power device for driving the motor 101 and the power device for driving the fan motor 102 as the heat generating component 2, the heat dissipation effect of the heat generating component 2 and the electronic components 13 and 14 can be obtained.

[0059] Figure 6 The air conditioning device 300 shown in the figure sequentially connects a compressor 111, a four-way valve 121, an outdoor heat exchanger 123, an expansion device 122, an indoor heat exchanger 124, a four-way valve 121, and a compressor 111 through a refrigerant pipe to form a refrigeration cycle 120. The drive device 200, the compressor 111, the four-way valve 121, the outdoor heat exchanger 123, and the expansion device 122 are provided in the outdoor unit 110 of the air conditioning device 300, and the indoor heat exchanger 124 is provided in the indoor unit 150 of the air conditioning device 300.

[0060] Next, the operation of the air conditioner 300 will be described by taking the cooling operation as an example. In addition, although the description is omitted here, the heating operation can also be realized by the refrigeration cycle 120. In the cooling operation, the flow path is switched by the four-way valve 121 so that the refrigerant discharged from the compressor 111 is directed to the outdoor heat exchanger 123, and the refrigerant flowing out of the indoor heat exchanger 124 is directed to the compressor 111.

[0061] The compression element of the compressor 111 compresses the refrigerant by the control performed by the driving device 200, thereby discharging a high-temperature and high-pressure refrigerant from the compressor 111. The high-temperature and high-pressure refrigerant discharged from the compressor 111 flows into the outdoor heat exchanger 123 via the four-way valve 121, and performs heat exchange with the external air in the outdoor heat exchanger 123 to dissipate heat. The refrigerant flowing out of the outdoor heat exchanger 123 is expanded and decompressed by the expansion device 122, and becomes a low-temperature and low-pressure gas-liquid two-phase refrigerant, which flows into the indoor heat exchanger 124, evaporates by heat exchange with the air in the air-conditioned space, and flows out of the indoor heat exchanger 124 as a low-temperature and low-pressure gas refrigerant. The gas refrigerant flowing out of the indoor heat exchanger 124 is sucked into the compressor 111 via the four-way valve 121 and compressed again. During the cooling operation, the above actions are repeated in the refrigeration cycle 120. In addition, in order to be able to control the refrigerant more finely, it is also possible to configure that the indoor unit 150 is also equipped with an expansion device in addition to the outdoor unit 110.

[0062] exist Figure 6 2 shows an example in which the driving device 200 according to any one of Embodiments 1 to 3 is applied to an air conditioner 300, but the present invention is not limited thereto. The driving device 200 may be generally applied to a heat pump device, a refrigeration device, or other refrigeration cycle devices in addition to the air conditioner 300.

[0063] Figure 8 FIG. 1 is a perspective view of an outdoor unit of an air-conditioning apparatus according to a modification of Embodiment 4. Figure 7 Similarly, in Figure 8 In the figure, the internal structure of the outdoor unit 110 is visualized by not showing one side of the outdoor unit 110. If the machine room 132 as a whole is a sealed structure that seals the base plate 1 as in the outdoor unit 110 according to Embodiment 4, the size of the sealed structure becomes too large relative to the size of the base plate 1. Therefore, as in the air conditioning device according to the modified example, by providing a metal shell 3c that surrounds only the base plate 1, the sealing effect can be further improved.

[0064] like Figure 8As shown in the figure, the base plate 1 is covered from six directions by the frame metal plate 3a, the partition plate 3b, and the metal shell 3c of the outdoor unit 110, so that a closed structure narrower than the outdoor unit 110 involved in Embodiment 4 can be constructed. However, the metal shell 3c is provided with a minimum hole for passing the electric wiring and the communication line inside and outside the closed structure. By forming a closed structure with the metal shell 3c, the effect of preventing foreign matter such as water, dust, dirt and small animals from adhering to the base plate 1 can be further improved.

[0065] As described above, when the driving device 200 involved in embodiments 1 to 3 is applied to the air-conditioning device 300, the heat of the heat-generating component 2 and the electronic components 13 and 14 of the driving device 200 can be released from the frame metal plate 3a and the partition 3b of the outdoor unit 110 of the air-conditioning device 300, and the area in contact with the external air by the frame metal plate 3a is large. In addition, the wind generated by the rotation of the fan 112 blows onto the partition 3b, so that the heat can be released efficiently.

[0066] The configuration described in the above embodiment is an example of the content of the present invention, and may be combined with other known techniques, or a part of the configuration may be omitted or modified within a scope not departing from the gist of the present invention.

[0067] Description of Reference Numerals

[0068] 1...substrate; 1f...first surface; 1s...second surface; 2...heat generating component; 3...frame; 3a...frame metal plate; 3b...partition; 3c...metal shell; 4a, 4b, 4c...heat dissipating component; 5...thermal grease; 11a, 11b...connecting plate; 12a, 12b...through hole; 13, 14...electronic component; 15a, 15b...leg; 21a, 21b...pin; 31...surface; 100...power supply; 101...motor; 102...fan motor; 110...outdoor unit; 111...compressor; 112...fan; 120...refrigeration cycle; 121...four-way valve; 122...expansion device; 123...outdoor heat exchanger; 124...indoor heat exchanger; 131...fan room; 132...machine room; 150...indoor unit; 200...driving device; 300...air conditioning device.

Claims

1. A driving device that converts electric power supplied from a power source into electric power for driving a motor, wherein: The driving device comprises: A substrate having a wiring pattern including a bonding portion formed of a metal foil; A heat generating component having a terminal portion for connection, wherein the terminal portion is welded to the joint portion and mounted on the substrate; an electronic component electrically connected to the heat generating component through the wiring pattern; a metal frame surrounding the substrate; and A heat dissipation component releases the heat generated by the heat generating component, The heat dissipation member is in contact with the frame, the terminal portion, and the joining portion.

2. The driving device according to claim 1, wherein: The heat generating component is thermally connected to the frame.

3. The driving device according to claim 2, wherein: The heat dissipation component is interposed between the heat generating component and the frame.

4. The driving device according to claim 2, wherein: A thermally conductive grease is provided between the heat generating component and the frame.

5. The driving device according to claim 1, wherein: The heat generating component is a power device that converts the electric power supplied from the power source into the motor driving power.

6. An air conditioning device comprising the driving device according to any one of claims 1 to 5, wherein: The air conditioner includes an outdoor unit having a compressor having a motor as a driving source for compressing a refrigerant in a refrigeration cycle, a fan motor, and an outdoor fan driven by the fan motor. The driving device outputs the motor driving power to at least one of the motor and the fan motor.

7. The air conditioning device according to claim 6, wherein: The outdoor unit includes a partition that divides the space inside the housing into a fan room where the outdoor fan is installed and a machine room where the compressor is installed. The driving device is disposed in the machine room, and the heat generating component is in contact with the partition plate.

8. The air conditioning device according to claim 7, wherein: A metal casing is provided inside the machine room and surrounds the substrate.

Images