Electronic device

Abstract

An electronic device at least comprises a back plate (100), a back shell assembly (200) and a heat dissipation structure (400). The back plate (100) is provided with a front surface (110) and a back surface (120), and the front surface (110) of the back plate (100) is used for installing a display panel; the rear shell assembly (200) is connected with the back plate (100), the rear shell assembly (200) and the back surface (120) of the back plate (100) are encircled to form a mounting cavity (130), and an air inlet hole (210) and a heat dissipation hole (220) are formed in the rear shell assembly (200); the heat dissipation structure (400) is located in the installation cavity (130), the heat dissipation structure (400) is provided with an air inlet, the air inlet is communicated with the air inlet hole (210) through the isolation piece (440), the heat dissipation structure (400) is used for sucking air in the external environment into the installation cavity (130) through the air inlet hole (210) and the isolation piece (440) in sequence and discharging the air into the external environment through the heat dissipation hole (220), flowing of heat dissipation airflow can be guided, and the heat dissipation effect is improved.

Description

electronic devices Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] The chips of existing smart interactive tablets usually use a heat sink to dissipate heat, so that the chips can operate at a normal temperature and avoid overheating damage.

[0003] However, there is usually a gap between the air inlet of the current chip heat sink and the air inlet hole on the shell, which causes the high-temperature air discharged from the chip heat sink to flow into the chip heat sink again through the gap between the air inlet and the air inlet hole, thereby causing the heat dissipation airflow to be turbulent and affecting the heat dissipation effect of the heat sink on the chip.

[0004] Summary of the Invention

[0005] The purpose of this application is to provide an electronic device that can guide the flow of heat dissipation airflow and improve the heat dissipation effect.

[0006] To achieve the above-mentioned objectives, the present application provides an electronic device, which includes at least a back panel, a rear shell assembly and a heat dissipation structure; the back panel has a front side and a back side, and the front side of the back panel is used to install a display panel; the rear shell assembly is connected to the back panel, and the rear shell assembly and the back side of the back panel form an installation cavity, and the rear shell assembly is provided with an air inlet and a heat dissipation hole; the heat dissipation structure is located in the installation cavity, and the heat dissipation structure has an air inlet, and the air inlet is connected to the air inlet through an isolation member, and the heat dissipation structure is used to suck air from the external environment into the installation cavity through the air inlet and the isolation member in turn, and discharge it to the external environment through the heat dissipation hole.

[0007] It can be seen from this that the technical solution provided by this application is that the air inlet of the heat dissipation structure is connected to the air inlet hole of the rear housing assembly through the isolation member. In this way, the heat dissipation structure can draw air from the external environment into the installation cavity through the air inlet hole and the isolation member in sequence for heat exchange. The isolation member blocks the high-temperature air after heat exchange and allows it to be discharged only through the heat dissipation hole, thereby guiding the airflow in a directional manner within the installation cavity, preventing the hot air after heat dissipation from flowing into the heat dissipation structure again through the gap between the air inlet and the air inlet hole, thereby improving the heat dissipation effect.

[0008] At the same time, because the air inlet is connected to the air inlet hole through the spacer, the spacer can also absorb some of the vibrations generated by the operation of the heat dissipation structure, reducing the noise generated by the resonance of the rear housing assembly. In addition, the spacer can also isolate the heat from the heat sink, reducing the heat transfer from the heat sink to the rear housing assembly, thereby avoiding the risk of burns to users caused by high-temperature areas on the rear housing assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] FIG1 is an isometric diagram of an electronic device according to an embodiment of the present application;

[0011] FIG2 is a schematic structural diagram of an electronic device after removing a rear housing assembly according to an embodiment of the present application;

[0012] FIG3 is a schematic half-section diagram of a partial structure of an electronic device according to an embodiment of the present application;

[0013] FIG4 is a schematic diagram of a half-section structure of an integrated board and a heat dissipation structure assembled in accordance with an embodiment of the present application;

[0014] FIG5 is a schematic diagram of the arrangement of air inlet holes and heat dissipation holes in an embodiment provided by the present application;

[0015] FIG6 is a schematic diagram of the arrangement of air inlet holes and heat dissipation holes in another embodiment provided by the present application;

[0016] FIG7 is a schematic structural diagram of an electronic device after removing a cover plate according to an embodiment of the present application;

[0017] FIG8 is a schematic structural diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings. Terms such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end" used in this application to express spatial relative positions are used to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings for the purpose of ease of explanation. Terms of spatial relative position may be intended to include different orientations of the device in use or work other than the orientation shown in the figures. For example, if the device in the figure is turned over, the unit described as being "below" or "below" other units or features will be "above" other units or features. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein are interpreted accordingly.

[0019] Furthermore, the terms "installed," "disposed," "provided with," "connected," "slidingly connected," "fixed," and "socketed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0020] Smart interactive tablets usually include two components: a motherboard and a PC module. The motherboard, as the core component of the smart interactive tablet, is responsible for connecting and managing the various modules of the entire system. The PC module, as a pluggable modular component in the smart interactive tablet, can increase or expand the functions and performance of the tablet according to user needs.

[0021] The motherboard of existing smart interactive tablets is built into the back shell of the tablet, while the PC module is located outside the back shell and plugs into the motherboard via an exposed connector. This approach requires separate housings for the PC module and motherboard, as well as separate heat sinks for heat dissipation. This results in a complex structure and high manufacturing costs. Furthermore, the PC module's connection to the motherboard via the connector is unstable and can become detached during movement, resulting in poor reliability.

[0022] If the PC module is also built into the large rear case, the entire rear case must be removed for maintenance or expansion, making this operation inconvenient. Furthermore, dust easily accumulates on the fan of the chip heat sink in existing PC modules, affecting fan speed and generating noise. In humid weather, the combination of moisture and dust in the air can be corrosive, affecting PC performance and even damaging PC components.

[0023] In addition, the air inlet of the chip heat sink of the PC module in the existing smart interactive tablet is usually set at a distance from the air inlet hole, which means that the high-temperature air discharged from the chip heat sink will flow into the chip heat sink again through the gap between the air inlet and the air inlet hole, thereby causing the heat dissipation airflow to be turbulent and affecting the heat dissipation effect of the heat sink on the chip.

[0024] Therefore, how to improve the structure of electronic equipment, thereby increasing the connection reliability between the PC module and the motherboard, and reducing production costs has become an urgent issue to be solved in this field.

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described in this application are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of this application.

[0026] To address the above issues, the present application provides an electronic device that may be a device with integrated computing and display functions. The device receives user input commands, performs corresponding data processing and calculations, and then sends the data to a display panel for display. The electronic device may include, but is not limited to, smart interactive tablets, smart televisions, handheld terminals, and all-in-one computers.

[0027] Specifically, please refer to Figures 1 to 3. In a feasible embodiment, the electronic device may include at least a back panel 100 and a rear shell assembly 200. The back panel 100 serves as the basic carrier of the electronic device, and it supports and protects other components of the electronic device. In this embodiment, the back panel 100 generally has a front side 110 and a back side 120 that are arranged back to back. The front side 110 has a receiving cavity with an opening, and the receiving cavity is used to install a display panel, and the display panel is used to display the picture. It should be pointed out that when the electronic device is in use, the side opposite to the user is the front side 110 of the back panel 100, and the other side is the back side 120 of the back panel 100.

[0028] The rear housing assembly 200 serves as a protective cover for the electronic components of the electronic device. It covers the electronic components to protect them and prevent them from being exposed, thereby improving the aesthetics of the electronic device. Specifically, the rear housing assembly 200 is connected to the back panel 100, and the rear housing assembly 200 and the back surface 120 of the back panel 100 surround a mounting cavity 130, which accommodates the electronic components. The electronic components may include an integrated board 300, audio components, and a power supply, etc., which are not specifically limited in this application.

[0029] To ensure heat dissipation for the electronic components within the mounting cavity 130, in one achievable embodiment, as shown in Figures 3 and 4, the electronic device may further include a heat dissipation structure 400. Accordingly, the rear housing assembly 200 should be provided with an air inlet 210 and a heat dissipation hole 220, which are in communication with the mounting cavity 130. The heat dissipation structure 400 is located within the mounting cavity 130 and has an air inlet that is in communication with the air inlet 210. Thus, the heat dissipation structure 400 draws air from the external environment into the mounting cavity 130 through the air inlet 210 and the air inlet, and discharges the air to the external environment through the heat dissipation hole 220. In other words, the heat dissipation structure 400 can form a directional airflow that passes through the air inlet 210, the air inlet, the mounting cavity 130, and the heat dissipation hole 220 (see the arrow directions shown in Figure 3), thereby dissipating heat from the electronic components within the mounting cavity 130.

[0030] Furthermore, the heat dissipation structure 400 may also include an isolator 440. The air inlet is connected to the air inlet hole 210 through the isolator 440. In this way, the isolator 440 can seal the gap between the air inlet and the air inlet hole 210. In this way, the heat dissipation structure 400 can draw air from the external environment into the installation cavity 130 through the air inlet hole 210 and the isolator 440 in turn for heat exchange, and under the blocking effect of the isolator 440, the high-temperature air after heat exchange can only be discharged through the heat dissipation hole 220, thereby guiding the airflow to flow in a directional manner in the installation cavity 130, avoiding the hot air after heat dissipation from flowing into the heat dissipation structure 400 again through the gap between the air inlet and the air inlet hole 210, thereby improving the heat dissipation effect. At the same time, the isolator 440 located between the air inlet and the air inlet hole 210 can also absorb part of the vibration generated by the operation of the heat dissipation structure 400, reducing the noise generated by the resonance of the rear shell assembly 200. In addition, the isolation member 440 can also isolate the heat on the heat dissipation structure 400 and reduce the heat transfer to the rear shell assembly 200, thereby avoiding the risk of burns to users caused by the presence of high-temperature areas on the rear shell assembly 200.

[0031] In one achievable embodiment, referring again to FIG. 2 and FIG. 3 , the electronic device may further include an integrated board 300. The integrated board 300 may include a mainboard 310 and a PC module 320. The mainboard 310 is connected to the back surface 120 of the backplane 100, and the PC module 320 is built into the mainboard 310. In practical applications, the PC module 320 may include chips, memory modules, expansion cards (such as graphics cards, sound cards, network cards), storage modules, etc., wherein the chips, memory sockets, expansion sockets, and hard disk sockets are fabricated onto the mainboard 310 through a patch process. Then, the memory sticks, hard disks, etc. are plugged into the mainboard 310 through corresponding sockets, thereby enabling the PC module 320 to be built into the mainboard 310.

[0032] It is worth mentioning that by installing both the PC module 320 and the motherboard 310 within the mounting cavity 130 formed by the rear housing assembly 200 and the back panel 100, the PC module 320 and the motherboard 310 are protected by the same rear housing assembly 200, saving one housing structure, simplifying the structure, and reducing production costs. Furthermore, only one rear housing assembly 200 needs to be installed during assembly, simplifying the assembly operation. Furthermore, the PC module 320 is built into the motherboard 310. Compared to the existing method where the PC module 320 is plugged into the motherboard 310 via a connector outside the rear housing assembly 200, the connection is more stable, thereby improving the reliability of the electronic device.

[0033] It should be noted that since the above-mentioned PC module 320 and motherboard 310 are both located in the installation cavity 130, only one heat dissipation structure 400 is provided in the installation cavity 130 to achieve common heat dissipation of the motherboard 310 and the PC module 320, further reducing manufacturing costs.

[0034] In practical applications, the heat dissipation structure 400 can include a connector. The connector can also be first connected to the motherboard 310 via a patch, and then the heat dissipation structure 400 itself can be attached to the motherboard 310 by assembly with the connector, facilitating installation. Both the air inlet 210 and the heat dissipation holes 220 can be grid meshes. This ensures ventilation while preventing foreign matter from entering the mounting cavity 130 and damaging the PC module 320 and motherboard 310, thereby protecting the PC module 320 and motherboard 310.

[0035] Regarding the specific structure of the heat dissipation structure 400, in one feasible embodiment, the heat dissipation structure 400 may include a heat sink 410 and a fan assembly 420. The heat sink 410 may be constructed as an annular structure, wherein the cross-section of the annular structure may be circular, square or other polygonal, etc., which is not specifically limited in this application. The air inlet of the above-mentioned heat dissipation structure 400 is formed at the top of the heat sink 410, the top of the heat sink 410 is arranged around the air inlet hole 210, and the top of the heat sink 410 is in contact with the rear shell assembly 200, so that the air entering through the air inlet hole 210 first enters the area surrounded by the heat sink 410, and then passes through the heat sink 410 to flow to the outside of the heat dissipation structure 400, thereby fully dissipating the heat of the heat sink 410. At the same time, the above structure can also prevent the hot air in the installation cavity 130 from re-entering the heat sink 410 through the gap between the top of the heat sink 410 and the rear shell assembly 200, affecting the heat dissipation effect. The bottom of the heat sink 410 contacts the chip on the mainboard 310 through the base 430 , so that the chip transfers heat to the heat sink 410 through the base 430 for heat dissipation.

[0036] In practical applications, heat sink 410 can be formed by a plurality of fins arranged in a circular array, with adjacent fins spaced apart to form a ventilation duct. Thus, when air from the external environment enters the area surrounded by heat sink 410, it can be discharged to the exterior of heat dissipation structure 400 through the ventilation duct between the adjacent fins. During the discharge process, the air contacts the fins to achieve heat exchange, thereby achieving a heat dissipation effect. Furthermore, heat sink 410 and base 430 can be integrally formed, and thermal grease can be applied between base 430 and the chip to ensure effective heat transfer between the chip, heat sink 410, and base 430.

[0037] In this embodiment, the fan assembly 420 is configured to generate airflow through rotation. The fan assembly 420 is connected to the base 430 and is located within the area surrounded by the heat sink 410. The fan assembly 420 is configured to draw air from the external environment through the air inlet 210 and discharge it into the installation cavity 130 through the heat sink 410. In actual applications, the fan assembly 420 may include a motor and fan blades. The specific structure of the fan assembly 420 can refer to the prior art and will not be described in detail here.

[0038] Correspondingly, the isolation member 440 is constructed as an annular structure. The isolation member 440 is arranged around the top of the heat sink 410. The top of the heat sink 410 contacts the rear shell assembly 200 through the isolation member 440, thereby sealing the gap between the top of the heat sink 410 and the rear shell assembly 200, further preventing the hot air in the installation cavity 130 from entering the heat sink 410 again through the gap between the top of the heat sink 410 and the rear shell assembly 200, affecting the heat dissipation effect.

[0039] In this embodiment, the isolator 440 should also be made of an elastic material. In this way, when the fan assembly 420 is running, the isolator 440 can absorb part of the vibration generated by the operation of the fan assembly 420, reducing the noise generated by the resonance of the rear shell assembly 200. In addition, the isolator 440 is located between the fan assembly 420 and the rear shell assembly 200. When the rear shell assembly 200 is connected to the back plate 100, the rear shell assembly 200 can squeeze the isolator 440, so that the isolator 440 exerts an extrusion force on the integrated board 300 toward the back plate 100, thereby pressing the integrated board 300 to prevent the integrated board 300 from shaking during operation, further improving the stability of the integrated board 300.

[0040] In this embodiment, the spacer 440 may also have heat insulation properties, isolating the heat from the heat sink 410 and reducing the heat transfer from the heat sink 410 to the rear housing assembly 200, thereby preventing the presence of high-temperature areas on the rear housing assembly 200 that could cause burns to the user. In actual applications, the spacer 440 may be made of EVA, polyurethane foam, TPP foam, etc.

[0041] Regarding the specific structure and positional relationship of the heat dissipation holes 220 and the air inlet holes 210 , this application provides two specific embodiments for reference.

[0042] In the first embodiment, as shown in FIG5 , there may be two heat dissipation holes 220 , which are spaced apart, and the air inlet 210 is located between the two heat dissipation holes 220 , so that the airflow entering the installation cavity 130 through the air inlet 210 diffuses toward the two heat dissipation holes 220 and flows out from the two heat dissipation holes 220 , thereby dispersing the airflow after heat exchange and avoiding the airflow after heat exchange from being concentrated and discharged from a single heat dissipation hole 220 , which causes excessive heat concentration and affects the user experience.

[0043] Furthermore, the two heat dissipation holes 220 can be spaced apart along the length direction of the mainboard 310. In this way, the airflow from the air inlet 210 to the two heat dissipation holes 220 in the installation cavity 130 can also fully remove the heat on the mainboard 310, further improving the heat dissipation effect.

[0044] In a second embodiment, as shown in FIG6 , the heat dissipation hole 220 can have a single ring-shaped heat dissipation hole 220. The heat dissipation hole 220 is arranged around the air inlet hole 210, so that the airflow entering the mounting cavity 130 through the air inlet hole 210 is diffused in all directions and flows out through the heat dissipation hole 220. This structure allows the airflow entering the mounting cavity 130 through the air inlet hole 210 to be diffused 360° in all directions, flowing through every part of the mainboard 310 without blind spots, thereby fully removing heat from the mainboard 310.

[0045] It should be noted that the structure and positional relationship between the heat dissipation holes 220 and the air inlet holes 210 are merely exemplary descriptions, but are not limited thereto.

[0046] In one feasible embodiment, as shown in FIG5 , the rear housing assembly 200 is connected to a dust screen 500, which covers the air inlet 210. Thus, when the fan assembly 420 draws air from the external environment through the air inlet 210, dust carried in the air can be blocked by the dust screen 500, preventing dust from entering the mounting cavity 130 and damaging the integrated board 300, thereby increasing the service life of the integrated board 300.

[0047] In this embodiment, the dustproof net 500 may be located on a side of the rear housing assembly 200 away from the integrated board 300 , that is, the dustproof net 500 is located on the outer side of the rear housing assembly 200 .

[0048] Of course, the dustproof net 500 can also be located on the side of the rear shell assembly 200 close to the integrated board 300, that is, the dustproof net 500 is located on the inner side of the rear shell assembly 200. In this way, it can not only play a dust-proof role, but also the dustproof net 500 is located on the inner side of the rear shell assembly 200. The dustproof net 500 can be pressed between the isolation piece 440 and the rear shell assembly 200, thereby preventing the dustproof net 500 from falling off accidentally.

[0049] In this embodiment, the dust screen 500 can be first attached to the rear housing assembly 200 using double-sided tape, and then the rear housing assembly 200 is connected to the back plate 100, so that the dust screen 500 is pressed and fixed by the spacer 440 and the rear housing assembly 200. In actual applications, the dust screen 500 can include, but is not limited to, fine mesh materials such as permeable foam (open-pore foam) and non-woven fabric.

[0050] In an achievable embodiment, the rear housing assembly 200 may only include a rear shell 230 . The rear shell 230 is connected to the back plate 100 , and the air inlet 210 and the heat dissipation holes 220 are opened on the rear shell 230 .

[0051] However, considering that the mounting cavity 130 formed by the rear housing assembly 200 and the back panel 100 is not only installed with the integrated board 300, but also with components such as audio components and a power supply, if the rear housing assembly 200 is composed only of the rear shell 230, then the volume of the rear shell 230 needs to be sufficiently large. However, this also means that the user needs to remove the entire rear shell 230 from the back panel 100 during subsequent maintenance and expansion, which is extremely cumbersome. In order to solve the above problems, this application also proposes two specific embodiments of the rear housing assembly 200 for reference.

[0052] In the first embodiment, referring to Figures 1, 5, and 7, the rear housing assembly 200 may include a rear shell 230 and a cover plate 240. The rear shell 230 is connected to the back panel 100 and is provided with a maintenance hole 231. The orthographic projection of the maintenance hole 231 on the back surface 120 of the back panel 100 at least partially overlaps with the orthographic projection of the integrated board 300 on the back surface 120 of the back panel 100. The cover plate 240 is detachably connected to the rear shell 230 and covers the maintenance hole 231. In this way, when the integrated board 300 needs maintenance or expansion, the user can first detach the cover plate 240 from the rear shell 230, exposing the integrated board 300 through the maintenance hole 231, so that the user can directly maintain or expand the integrated board 300 through the maintenance hole 231. Compared with the method of disassembling the entire rear shell 230 in the above embodiment, it is obvious that the cover plate 240 required to be disassembled in this embodiment is smaller in size and more convenient to disassemble.

[0053] In practical applications, the cover plate 240 and the rear housing 230 can be connected by screws, or alternatively, by snap-fit ​​connections, which are not specifically limited in this application. For example, in the case of the cover plate 240 and the rear housing 230 being connected by screws, since the cover plate 240 is relatively small, it is typically only necessary to secure the cover plate 240 with screws at its four corners. When performing maintenance or expansion on the integrated board 300, the user only needs to remove four screws, making assembly and disassembly convenient.

[0054] In the second embodiment, as shown in FIG8 , the rear shell assembly 200 can be composed of a rear shell 230 and a cover plate 240 arranged in parallel. The rear shell 230 is connected to the back plate 100, and the cover plate 240 is detachably connected to the back plate 100 and the rear shell 230, respectively. Moreover, the orthographic projection of the cover plate 240 on the back surface 120 of the back plate 100 at least partially overlaps with the orthographic projection of the integrated board 300 on the back surface 120 of the back plate 100. In other words, the user only needs to remove the cover plate 240 to expose the integrated board 300, thereby performing maintenance and expansion on the integrated board 300, without having to disassemble both the rear shell assembly 200 (rear shell 230 and back plate 100), making disassembly and assembly convenient.

[0055] To facilitate understanding of the connection relationship between the back panel 100, the rear shell 230 and the cover plate 240 in the above embodiment, taking the example that the rear shell 230 and the cover plate 240 are both roughly rectangular plates, three sides of the rear shell 230 can be connected to the back panel 100, one side of the cover plate 240 is connected to the remaining side of the rear shell 230, and the remaining three sides of the cover plate 240 are connected to the back panel 100.

[0056] It should be pointed out that since in the above two embodiments, the cover plate 240 in the rear shell assembly 200 is arranged corresponding to the integrated board 300, the air inlet holes 210 and the heat dissipation holes 220 on the rear shell assembly 200 should be opened on the cover plate 240, so that the air inlet holes 210 and the heat dissipation holes 220 correspond to the integrated board 300, so that the air flow flowing in through the air inlet holes 210 and flowing out from the heat dissipation holes 220 can effectively dissipate heat for the integrated board 300.

[0057] Moreover, since the air inlet 210 is provided on the cover 240, the dust net 500 covering the air inlet 210 is also connected to the cover 240. Thus, when the user needs to clean the dust net 500, the user only needs to remove the cover 240 to clean the dust net 500, which also facilitates the cleaning operation of the dust net 500.

[0058] Based on the same inventive concept, the present application also provides a rear shell assembly 200. The rear shell assembly 200 is used in an electronic device and is surrounded by the back panel 100 in the electronic device to form an installation cavity 130 for accommodating the integrated board 300. The rear shell assembly 200 may include a rear shell 230 and a cover plate 240. The rear shell 230 is connected to the back panel 100, and a maintenance hole 231 is provided on the rear shell 230. The orthographic projection of the maintenance hole 231 on the back surface 120 of the back panel 100 at least partially overlaps with the orthographic projection of the integrated board 300 on the back surface 120 of the back panel 100. The cover plate 240 is detachably connected to the rear shell 230, and the cover plate 240 covers the maintenance hole 231.

[0059] Furthermore, the cover plate 240 is provided with an air inlet 210 and a heat dissipation hole 220. A heat dissipation structure 400 is also installed in the mounting cavity 130. The heat dissipation structure 400 has an air inlet that communicates with the air inlet 210. The heat dissipation structure 400 is used to draw air from the external environment into the mounting cavity 130 through the air inlet 210 and exhaust it into the external environment through the heat dissipation hole 220.

[0060] Regarding the specific structures of the rear shell assembly 200 , the integrated board 300 and the heat dissipation structure 400 , reference may be made to the contents in the above-mentioned embodiments, and this application will not elaborate on them here.

[0061] As can be seen from the technical solution provided by this application, the PC module and motherboard in the electronic device are both installed in the installation cavity formed by the rear shell assembly and the back plate. In other words, the PC module and motherboard are protected by the same rear shell assembly, saving one housing structure, simplifying the structure, and reducing production costs. Furthermore, only one rear shell assembly needs to be installed during assembly, simplifying the assembly operation. Furthermore, the PC module is built into the motherboard. Compared with the existing method of connecting the PC module to the motherboard through a connector outside the rear shell assembly, the connection is more stable, improving the reliability of the electronic device.

[0062] Furthermore, the top of the heat sink contacts the rear shell assembly through the isolator, thereby sealing the gap between the top of the heat sink and the rear shell assembly, further preventing the hot air in the installation cavity from re-entering the heat sink through the gap between the top of the heat sink and the rear shell assembly, thereby improving the heat dissipation effect. At the same time, the isolator can also absorb some of the vibrations generated by the operation of the fan assembly and reduce the noise generated by the resonance of the rear shell assembly. In addition, the isolator exerts an extrusion force on the integrated board toward the back panel, thereby pressing the integrated board to prevent the integrated board from shaking during operation, further improving the reliability of the use of the integrated board. In addition, the isolator can also isolate the heat on the heat sink and reduce the heat transfer from the heat sink to the rear shell assembly, thereby avoiding the risk of burns to users caused by the presence of high-temperature areas on the rear shell assembly.

[0063] Furthermore, the cover is detachably connected to the rear housing and covers the maintenance hole. When the integrated board requires maintenance or expansion, the cover can be removed from the rear housing, exposing the integrated board through the maintenance hole, allowing the user to directly maintain and expand the integrated board. Compared to disassembling the entire rear housing, this embodiment requires less volume to disassemble, making disassembly more convenient and facilitating maintenance and expansion operations.

[0064] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: The electronic device at least comprises a back plate, a rear housing assembly and a heat dissipation structure; The back plate has a front side and a back side, and the front side of the back plate is used for mounting a display panel; The rear shell assembly is connected to the back plate, and the rear shell assembly and the back side of the back plate surround to form a mounting cavity, and the rear shell assembly is provided with air inlet holes and heat dissipation holes; The heat dissipation structure is located in the installation cavity, and the heat dissipation structure has an air inlet, which is connected to the air inlet hole through an isolating member. The heat dissipation structure is used to suck air from the external environment into the installation cavity through the air inlet hole and the isolating member in sequence, and discharge it to the external environment through the heat dissipation hole.

2. The electronic device according to claim 1, characterized in that: The electronic device also includes an integrated board; The integrated board is located in the installation cavity, and comprises a main board and a PC module. The main board is connected to the back side of the back board, and the PC module is built into the main board.

3. The electronic device according to claim 2, characterized in that: The heat dissipation structure includes a heat sink and a fan assembly; The heat sink is constructed as an annular structure, the air inlet is formed at the top of the heat sink, the bottom of the heat sink contacts the chip on the mainboard through the base, the top of the heat sink is arranged around the air inlet, and the top of the heat sink contacts the rear housing assembly through the isolation member; The fan assembly is connected to the base and is located in an area surrounded by the heat sink. The fan assembly is used to absorb air from the external environment through the air inlet hole and discharge it into the installation cavity through the heat sink.

4. The electronic device according to claim 3, characterized in that: The rear shell assembly is connected with a dustproof net, and the dustproof net covers the air inlet hole.

5. The electronic device according to claim 4, characterized in that: The dustproof net is located at a side of the rear shell component close to the integrated board, and the dustproof net is located between the isolation piece and the rear shell component.

6. The electronic device according to claim 4, characterized in that: The rear housing assembly includes a rear housing; The rear shell is connected to the back plate, and the air inlet holes and the heat dissipation holes are arranged on the rear shell.

7. The electronic device according to claim 4, characterized in that: The rear housing assembly comprises a rear housing and a cover plate; The rear shell is connected to the back plate, a maintenance hole is provided on the rear shell, and the orthographic projection of the maintenance hole on the back side of the back plate at least partially overlaps with the orthographic projection of the integrated board on the back side of the back plate; The cover plate is detachably connected to the rear housing, and the cover plate covers the maintenance hole.

8. The electronic device according to claim 4, characterized in that: The rear housing assembly comprises a rear housing and a cover plate; The rear housing is connected to the back plate; The cover plate is detachably connected to the back plate and the rear housing, respectively, and the orthographic projection of the cover plate on the back side of the back plate at least partially overlaps with the orthographic projection of the integrated board on the back side of the back plate.

9. The electronic device according to claim 7 or 8, characterized in that: The air inlet holes and the heat dissipation holes are arranged on the cover plate.

10. The electronic device according to claim 1, characterized in that: There are two heat dissipation holes, one between the air inlet and the two heat dissipation holes.

11. The electronic device according to claim 1, characterized in that: The heat dissipation hole is one and is arranged around the air inlet hole.

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