Ultrasound probe, ultrasound imaging system and method of manufacture

Abstract

The application discloses an ultrasonic probe, an ultrasonic imaging system and a preparation method. The ultrasonic probe comprises a transducer assembly, and the transducer assembly comprises a matching layer, a piezoelectric layer having opposite first and second surfaces, the second surface of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array, a flexible circuit board comprising an insulating substrate and a plurality of conductive parts, the insulating substrate being connected to the first surface of the piezoelectric layer, the plurality of conductive parts being arranged on the side of the insulating substrate facing the piezoelectric layer, a backing connected to the side of the insulating substrate away from the piezoelectric layer, a conductive adhesive used for bonding the insulating substrate and the piezoelectric layer, the conductive adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array elements and the conductive parts, and a containing structure used for containing the conductive particles and limiting the movement of the conductive particles, the first surface of each array element being provided with the containing structure, so that the first surface of each array element is conducted with one conductive part, and the conduction rate of the array elements is improved.

Description

Technical Field

[0001] This invention relates to the field of medical device technology, and in particular to an ultrasound probe, an ultrasound imaging system, and a method for manufacturing them. Background Technology

[0002] In medical ultrasound imaging systems, ultrasound probes are used to emit ultrasound waves and receive echoes containing information about human tissue. When an array element fails to connect, it can lead to a decrease in the quality of the scanned image.

[0003] Area array probes have thousands of array elements and an extremely small area, making the electrical connection between the transducer elements and the flexible circuit board extremely difficult and challenging to achieve a high conductivity. Summary of the Invention

[0004] In view of this, the present invention proposes an ultrasonic probe, an ultrasonic imaging system, and a method for its preparation.

[0005] A first aspect of the present invention provides an ultrasonic probe including a transducer assembly, the transducer assembly comprising:

[0006] Matching layer;

[0007] A piezoelectric layer having opposing first and second sides, the second side of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array;

[0008] A flexible circuit board includes an insulating substrate and a plurality of conductive portions, wherein the insulating substrate is connected to a first side of the piezoelectric layer, and the plurality of conductive portions are disposed on the side of the insulating substrate facing the piezoelectric layer;

[0009] Backing, connected to the side of the insulating substrate opposite to the piezoelectric layer;

[0010] A conductive adhesive is used to bond the insulating substrate and the piezoelectric layer. The conductive adhesive includes a plurality of conductive particles, which are used to enable the array elements and the conductive parts to conduct electricity.

[0011] A receiving structure is provided for receiving the conductive particles and restricting their movement. The first surface of each array element is provided with the receiving structure so that the first surface of each array element is connected to one of the conductive parts.

[0012] A second aspect of the present invention provides an ultrasonic probe including a transducer assembly, the transducer assembly comprising:

[0013] Matching layer;

[0014] A piezoelectric layer having opposing first and second sides, the second side of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array;

[0015] At least one conductive material layer is connected to the first surface of the piezoelectric layer and is in communication with the plurality of array elements;

[0016] A flexible circuit board includes an insulating substrate and a plurality of conductive portions. The insulating substrate is connected to the side of the conductive material layer facing away from the piezoelectric layer. The plurality of conductive portions are disposed on the side of the insulating substrate facing the piezoelectric layer. The conductive material layer has a plurality of conductive regions, each of which corresponds to one array element and one conductive portion.

[0017] Backing, connected to the side of the insulating substrate opposite to the piezoelectric layer;

[0018] A conductive adhesive is used to bond the insulating substrate and the piezoelectric layer. The conductive adhesive includes a plurality of conductive particles, which are used to enable the array elements and the conductive parts to conduct electricity.

[0019] A receiving structure is provided for receiving the conductive particles and restricting their movement. Each conductive region of the conductive material layer is provided with the receiving structure so that the first face of each array element is connected to a conductive part.

[0020] A third aspect of the present invention provides an ultrasonic probe including a transducer assembly, the transducer assembly comprising:

[0021] Matching layer;

[0022] A piezoelectric layer having opposing first and second sides, the second side of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array;

[0023] A flexible circuit board includes an insulating substrate and a plurality of conductive portions, wherein the insulating substrate is connected to a first side of the piezoelectric layer, and the plurality of conductive portions are disposed on the side of the insulating substrate facing the piezoelectric layer;

[0024] Backing, connected to the side of the insulating substrate opposite to the piezoelectric layer;

[0025] A conductive adhesive is used to bond the insulating substrate and the piezoelectric layer. The conductive adhesive includes a plurality of conductive particles, which are used to enable the array elements and the conductive parts to conduct electricity.

[0026] A receiving structure is provided for receiving the conductive particles and restricting their movement. Each conductive part is provided with the receiving structure so that the first face of each array element is connected to one of the conductive parts.

[0027] A fourth aspect of the present invention provides a method for manufacturing an ultrasonic probe, comprising:

[0028] The accommodating structure is formed by cutting the first face of each array element;

[0029] The conductive adhesive containing the conductive particles is repeatedly applied and smoothed to allow the conductive particles to be embedded in the accommodating structure until the conductive particles are distributed on the first surface of all the array elements.

[0030] By aligning and pressing the flexible circuit board at the location identification point, the pressed piezoelectric layer and the flexible circuit board are transferred to a preset temperature position for curing, thus completing the bonding.

[0031] A fifth aspect of the present invention provides an ultrasound imaging system, comprising a host, a display, and the aforementioned ultrasound probe, wherein the display and the ultrasound probe are both electrically connected to the host, the ultrasound probe is used to send ultrasound waves to an object and receive ultrasound echoes, the host is used to process the ultrasound echoes and generate an ultrasound image, and the display is used to display the ultrasound image.

[0032] As can be seen from the above technical solution, the ultrasonic probe proposed in this invention utilizes the characteristic that conductive particles can batch process electrical connections with narrower spacing, which can effectively improve the conductivity effect, so as to realize the conduction between the first surface of multiple array elements and multiple conductive parts respectively. Through the setting of the accommodating structure, the conductive particles can be stabilized on the first surface of the array element, so that the conductive particles are evenly distributed, so that the first surface of each array element corresponds to one conductive part and conducts, thereby improving the conductivity of the array element. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0034] Figure 1 This is an exploded schematic diagram of the ultrasonic probe proposed in the embodiments of this application.

[0035] Figure 2 This is a schematic diagram of a transducer assembly in an embodiment of this application, in which a flexible circuit board and a piezoelectric layer are bonded together using conductive adhesive.

[0036] Figure 3 This is a schematic diagram of the conductive particles confined within the accommodating structure after the piezoelectric layer is repeatedly coated with conductive adhesive, as described in an embodiment of this application.

[0037] Figure 4 This is a schematic diagram of the structure in which the flexible circuit board and the piezoelectric layer are connected by conductive particles according to an embodiment of this application. The accommodating structure is disposed on the first surface of the array element of the piezoelectric layer.

[0038] Figure 5 This is a schematic diagram of a structure in which a conductive material layer is provided between a flexible circuit board and a piezoelectric layer according to an embodiment of this application. The accommodating structure is disposed on the conductive material layer.

[0039] Figure 6 This is a schematic diagram of the structure in which the flexible circuit board and the piezoelectric layer are connected by conductive particles according to an embodiment of this application. The accommodating structure is disposed on the conductive part of the flexible circuit board.

[0040] Figure 7 This is a schematic diagram of the first surface of an array element with a groove according to an embodiment of this application.

[0041] Figure 8 This is a schematic diagram of the first side of an array element with blind holes according to an embodiment of this application.

[0042] Figure 9 This is a structural block diagram of the ultrasound imaging system proposed in the embodiments of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 100. Ultrasonic probe; 10. Transducer assembly; 11. Matching layer; 12. Piezoelectric layer; 12a. Array element; 121. First surface; 1211. Bonding area; 122. Second surface; 13. Flexible circuit board; 131. Insulating substrate; 132. Conductive part; 14. Backing; 15. Conductive adhesive; 151. Conductive particles; 16. Receptacle structure; 161. Groove; 1611. First sidewall; 1612. Second sidewall; 162. Blind hole; 17. Conductive material layer; 171. Conductive area; 20. Housing; 30. Lens; 1000. Ultrasonic imaging system; 200. Main unit; 300. Display. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0047] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0048] Please see Figures 1-3 As shown in the figure, this application provides an ultrasonic probe 100, including a transducer assembly 10. The transducer assembly 10 includes a matching layer 11, a piezoelectric layer 12, a flexible circuit board 13, a backing 14, conductive adhesive 15, and a housing structure 16. The piezoelectric layer 12 has a first surface 121 and a second surface 122 facing each other. The second surface 122 of the piezoelectric layer 12 is connected to the matching layer 11. The piezoelectric layer 12 includes a plurality of array elements 12a arranged in an array. The flexible circuit board 13 includes an insulating substrate 131 and a plurality of conductive portions 132. The conductive portions 132 may be pads disposed on the insulating substrate 131. The insulating substrate 131 is connected to the first surface 121 of the piezoelectric layer 12. The plurality of conductive portions 132 are disposed on the side of the insulating substrate 131 facing the piezoelectric layer 12. The backing 14... A conductive adhesive 15 is attached to the side of the insulating substrate 131 facing away from the piezoelectric layer 12. The conductive adhesive 15 is used to bond the insulating substrate 131 and the piezoelectric layer 12. The conductive adhesive 15 includes a plurality of conductive particles 151. The conductive particles 151 are used to make the array element 12a and the conductive part 132 conduct. The accommodating structure 16 is used to accommodate the conductive particles 151 and restrict the movement of the conductive particles 151. The first surface 121 of each array element 12a is provided with the accommodating structure 16 so that the first surface 121 of each array element 12a corresponds to a conductive part 132 for conduction.

[0049] The ultrasonic probe 100 of this embodiment utilizes the characteristic of conductive particles 151 to batch process electrical connections with narrower spacing, which can effectively improve the conductivity and achieve conductivity between the first surfaces 121 of multiple array elements 12a and multiple conductive parts 132. Since the distribution of conductive particles 151 cannot be uniformly controlled during the electrical connection process, non-conductivity or parallel connection may occur, requiring extremely high flatness of the bonding surface. Therefore, this embodiment uses the accommodating structure 16 to firmly fix the conductive particles 151 on the first surfaces 121 of the array elements 12a, achieving limiting of the conductive particles 151, making the conductive particles 151 uniformly distributed, reducing the flatness requirement of the array elements 12a, and enhancing the bonding strength, so that the first surface 121 of each array element 12a corresponds to one conductive part 132 for conductivity, improving the conductivity of the array elements 12a, thereby improving the conductivity between the array elements 12a and the flexible circuit board 13.

[0050] In practical applications, the piezoelectric layer 12 may include thousands of array elements 12a arranged in an array to form a planar array probe. Planar array probes can provide 4D imaging, offering significant advantages in ultrasonic imaging. However, the number of array elements in a planar array probe is tens of times that of a conventional probe, and the element size is also very small, only a fraction of the size of elements in a conventional probe (linear array probe). Therefore, extremely high requirements are placed on the interconnection technology of the array elements, which is one of the current challenges in the industry. In this embodiment, the arrangement of the accommodating structure 16 enables the limiting of the conductive particles 151, resulting in a uniform distribution of the conductive particles 151, improving the conductivity of the array elements 12a, and thus enhancing the conductivity between the array elements 12a and the flexible circuit board 13.

[0051] In one implementation, the first surface 121 can be the positive electrode surface of the piezoelectric layer 12, and the second surface 122 can be the negative electrode surface of the piezoelectric layer 12. That is, the negative electrode surface of the piezoelectric layer 12 is connected to the matching layer 11, and the positive electrode surface of the piezoelectric layer 12 is connected to the insulating substrate 131.

[0052] In another implementation, the first surface 121 can also be the negative electrode surface of the piezoelectric layer 12, and the second surface 122 can be the positive electrode surface of the piezoelectric layer 12. That is, the positive electrode surface of the piezoelectric layer 12 is connected to the matching layer 11, and the negative electrode surface of the piezoelectric layer 12 is connected to the insulating substrate 131.

[0053] In some embodiments, such as Figure 1 As shown, the ultrasonic probe 100 also includes a housing 20 that encloses a receiving space. The transducer assembly 10 is connected to the housing 20, and at least a portion of the transducer assembly 10 is received within the receiving space. Exemplarily, the matching layer 11, the piezoelectric layer 12, the flexible circuit board 13, and the backing 14 are all received within the receiving space.

[0054] In some embodiments, such as Figure 1 As shown, the ultrasonic probe 100 also includes a lens 30, which is connected to the housing 20 or the transducer assembly 10. The lens 30 is disposed on the side of the transducer assembly 10 facing the object to be scanned. In the working state, the lens 30 is located between the transducer assembly 10 and the object to be scanned.

[0055] When the ultrasound probe 100 is in use, the ultrasound waves emitted by the transducer assembly 10 pass through the lens 30 to reach the object to be scanned. Due to the effect of the lens 30, the distance between the transducer assembly 10 and the object to be scanned is raised, so that the ultrasound waves can be focused on the surface of the object to be scanned, thus achieving the requirement of imaging the superficial tissue.

[0056] In some embodiments, such as Figure 2 and Figure 3As shown, each array element 12a has a first surface 121 with a bonding region 1211 opposite to the conductive part 132, and each array element 12a has a receiving structure 16 at least in the bonding region 1211. In this embodiment, in order to ensure that the first surface 121 of the array element 12a can be connected to the conductive part 132, a receiving structure 16 is provided at least in the bonding region 1211 opposite to the conductive part 132. Optionally, the bonding region 1211 can be the central region of the first surface 121 of the array element 12a, so that at least the central region of the array element 12a can be connected to the conductive part 132.

[0057] Of course, the area where the accommodating structure 16 is set can also cover all areas of the first surface 121 of the array element 12a or other areas, so as to stabilize the conductive particles 151 and enable the array element 12a to conduct to the conductive part 132.

[0058] In some embodiments, the conductive particles 151 are spherical. In this embodiment, the conductive particles 151 can be anisotropic conductive particles, i.e., gold-plated resin microspheres, which can effectively improve conductivity. The anisotropic conductive particles are a composite material composed of polymer particles as the core and a metal coating as the shell, possessing unidirectional conductivity, meaning they conduct electricity only in the Z-axis direction, i.e., the direction perpendicular to the first surface 121 of the array element 12a; the X and Y-axis directions, i.e., the two directions parallel to and perpendicular to the first surface 121 of the array element 12a, do not conduct electricity. Compared to traditional lead-tin soldering, anisotropic conductive particles can batch process electrical connections with narrower pitches.

[0059] In an optional embodiment, the conductive adhesive 15 can be prepared by mixing a suitable base adhesive with the conductive particles 151, which has wide applicability, high bonding strength, and good reliability. Since the particle distribution cannot be uniformly controlled, non-conductivity or parallel connection may easily occur, and the flatness requirement of the bonding surface is high. Therefore, in this embodiment, the accommodating structure 16 is used to limit the conductive particles 151 to ensure the conduction between the array element 12a and the conductive part 132.

[0060] Of course, in other embodiments, the conductive adhesive 15 can also be anisotropic conductive adhesive film, and the conductivity and bonding strength can be further enhanced by the limiting effect of the accommodating structure 16.

[0061] As one implementation method, such as Figures 2-4As shown, the accommodating structure 16 includes a groove 161 formed on the first surface 121 of the array element 12a. The groove 161 not only accommodates the conductive particles 151, preventing them from detaching from the first surface 121 of the array element 12a, thus facilitating the conduction between the array element 12a and the conductive part 132, but also simplifies fabrication, provides precise positioning, and ensures good consistency, significantly reducing the difficulty of bonding the conductive particles 151. Furthermore, the groove 161 increases the bonding surface area, thereby increasing the pull-out force of the bonding structure, i.e., enhancing the bonding strength.

[0062] In an optional embodiment, the number of grooves 161 on the first surface 121 of each array element 12a can be multiple, and the multiple grooves 161 can be arranged in an array to increase the arrangement area of ​​the grooves 161, thereby accommodating more conductive particles 151 and improving the conductivity of the array element 12a and the conductive part 132.

[0063] In alternative embodiments, such as Figure 7 As shown, each array element 12a has two grooves 161 on its first surface 121, and the two grooves 161 are arranged in a crisscross pattern. In this embodiment, the arrangement of the two grooves 161 is simple and easy to process, and at the same time, it can cover the first surface 121 of the array element 12a from two directions to improve the conductivity between the array element 12a and the conductive part 132.

[0064] In an optional embodiment, the two grooves 161 are orthogonally arranged to form a cross-shaped structure, which is simple in structure, easy to process, and reduces processing costs. Of course, the included angle between the two grooves 161 can also be less than or greater than 90°.

[0065] Understandably, in other embodiments, the number of grooves 161 is not limited to two, but can also be one, three or even more. The arrangement of multiple grooves 161 is not limited to a cross arrangement, but can also be multiple rows of grooves 161 arranged along the front-back direction of array element 12a, multiple columns of grooves 161 arranged along the left-right direction of array element 12a, or multiple rows of grooves 161 and multiple columns of grooves 161 arranged in a cross arrangement, etc.

[0066] Of course, the groove 161 can also be tilted or bent to extend, such as forming a regular or irregular shape like an S-shape or a Z-shape, which can limit the conductive particles 151.

[0067] In some embodiments, the depth of the groove 161 in a first direction is less than the diameter of the conductive particle 151, and the first direction is perpendicular to the first surface 121 of the array element 12a. In this embodiment, the first direction is also the height direction of the array element 12a. The depth of the groove 161 is set to be less than the diameter of the conductive particle 151 so that the conductive particle 151 can be exposed on the first surface 121 of the array element 12a, thereby facilitating contact and conduction with the conductive part 132.

[0068] In some embodiments, the depth of the groove 161 in the first direction is 1μm-20μm. In this embodiment, if the depth of the groove 161 is less than 1μm, too little of the conductive particle 151 will be embedded in the groove 161, which will affect the limiting effect on the conductive particle 151, making it easy for the conductive particle 151 to slide out of the groove 161. If the depth of the groove 161 is greater than 20μm, too little of the conductive particle 151 will be exposed on the first surface 121 of the array element 12a, which will affect the contact and conduction with the conductive part 132. Therefore, limiting the depth of the groove 161 in the first direction to the range of 1μm-20μm can both ensure that the conductive particle 151 can be confined within the groove 161 to prevent movement and avoid affecting the contact and conduction between the conductive particle 151 and the conductive part 132.

[0069] For example, the depth of the groove 161 in the first direction can be 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm or 20μm, etc.

[0070] In some embodiments, the depth of the groove 161 in the first direction is 30%-80% of the diameter of the conductive particle 151. In this embodiment, if the depth of the groove 161 is less than 30% of the diameter of the conductive particle 151, too little of the conductive particle 151 will be embedded in the groove 161, which will affect the limiting effect on the conductive particle 151 and make it easy for the conductive particle 151 to slide out of the groove 161. If the depth of the groove 161 is greater than 80% of the diameter of the conductive particle 151, too little of the conductive particle 151 will be exposed on the first surface 121 of the array element 12a, which will affect the contact and conduction with the conductive part 132. Therefore, limiting the depth of the groove 161 in the first direction to within the range of 30%-80% of the diameter of the conductive particle 151 can both ensure that the conductive particle 151 is confined within the groove 161 to prevent movement and avoid affecting the contact and conduction between the conductive particle 151 and the conductive part 132.

[0071] For example, the depth of the groove 161 in the first direction can be 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, or 80% of the diameter of the conductive particle 151.

[0072] In some embodiments, the groove 161 has a second direction and a third direction parallel to the first surface 121 of the array element 12a. The groove 161 extends along the second direction, and the width of the groove 161 in the third direction is 2μm-30μm. The second direction and the third direction are perpendicular to each other. Specifically, as shown... Figure 7 As shown, the groove 161 includes a first sidewall 1611 and a second sidewall 1612 disposed opposite each other in the third direction. The width of the groove 161 in the third direction, that is, the distance between the first sidewall 1611 and the second sidewall 1612, is 2μm-30μm. In this embodiment, if the width of the groove 161 is less than 2μm, it is difficult for the conductive particles 151 to enter the groove 161. If the width of the groove 161 is greater than 30μm, there will be a large gap between the conductive particles 151 and the inner wall of the groove 161, which will affect the limiting effect of the conductive particles 151. Therefore, the width of the groove 161 is limited to the range of 2μm-30μm to ensure that the conductive particles 151 can be confined within the groove 161, thereby ensuring the conduction between the array element 12a and the conductive part 132.

[0073] For example, the width of the groove 161 in the third direction can be 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, 21μm, 22μm, 23μm, 24μm, 25μm, 26μm, 27μm, 28μm, 29μm or 30μm, etc.

[0074] Among them, such as Figure 7 As shown, the second direction is the extension direction of the groove 161, and the third direction is the width direction of the groove 161. When the groove 161 extends along the front-back direction of the array element 12a, the second direction is the front-back direction, and the third direction is the left-right direction. When the groove 161 extends along the left-right direction of the array element 12a, the second direction is the left-right direction, and the third direction is the front-back direction.

[0075] For example, when there are two grooves 161 and the two grooves 161 are orthogonally arranged, one groove 161 extends in the front-back direction and its width in the left-right direction is 2μm-30μm, and the other groove 161 extends in the left-right direction and its width in the front-back direction is 2μm-30μm.

[0076] In some embodiments, the groove 161 has a second direction and a third direction parallel to the first surface 121 of the array element 12a. The groove 161 extends along the second direction, and the width of the groove 161 in the third direction is 50%-150% of the diameter of the conductive particle 151. The second direction and the third direction are arranged perpendicular to each other. Specifically, as shown... Figure 7 As shown, the groove 161 includes a first sidewall 1611 and a second sidewall 1612 disposed opposite to each other in the third direction. The width of the groove 161 in the third direction, that is, the distance between the first sidewall 1611 and the second sidewall 1612, is 50%-150% of the diameter of the conductive particle 151. In this embodiment, if the width of the groove 161 is less than 50% of the diameter of the conductive particle 151, the conductive particle 151 will have difficulty entering the groove 161. If the width of the groove 161 is greater than 150% of the diameter of the conductive particle 151, a large gap will be left between the conductive particle 151 and the inner wall of the groove 161, thereby affecting the limiting effect of the conductive particle 151. Therefore, the width of the groove 161 is limited to the range of 50%-150% of the diameter of the conductive particle 151 to ensure that the conductive particle 151 can be confined within the groove 161, thereby ensuring the conduction between the array element 12a and the conductive part 132.

[0077] For example, the width of the groove 161 in the third direction can be adjusted based on the diameter of the conductive particle 151, and can be 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95%, 100%, 110%, 120%, 130%, 140%, or 150% of the diameter of the conductive particle 151.

[0078] For example, when there are two grooves 161 and the two grooves 161 are orthogonally arranged, one groove 161 extends in the front-back direction and its width in the left-right direction is 50%-150% of the diameter of the conductive particle 151, and the other groove 161 extends in the left-right direction and its width in the front-back direction is 50%-150% of the diameter of the conductive particle 151.

[0079] Of course, the accommodating structure 16 is not limited to the form of the groove 161, and can also be other structures capable of confining the conductive particles 151. For example, as another embodiment, such as Figure 8 As shown, the accommodating structure 16 includes a blind hole 162 formed on the first surface 121 of the array element 12a. The blind hole 162 can also accommodate the conductive particles 151, thereby preventing the conductive particles 151 from detaching from the first surface 121 of the array element 12a, which facilitates the conduction between the array element 12a and the conductive part 132 through the conductive particles 151.

[0080] In an optional embodiment, the number of blind holes 162 on the first surface 121 of each array element 12a can be multiple. The multiple blind holes 162 can be arranged in an array to increase the arrangement area of ​​the blind holes 162, thereby accommodating more conductive particles 151 and improving the conductivity of the array element 12a and the conductive part 132.

[0081] In some embodiments, the depth of the blind hole 162 in the first direction is less than the diameter of the conductive particle 151.

[0082] In some embodiments, the depth of the blind hole 162 in the first direction is 1 μm-20 μm.

[0083] In some embodiments, the depth of the blind hole 162 in the first direction is 30%-80% of the diameter of the conductive particle 151.

[0084] Understandably, the depth setting of the blind hole 162 in the first direction is the same as the depth setting of the groove 161 in the first direction. For details, please refer to the depth setting of the groove 161 in the above embodiment, which will not be repeated here.

[0085] It should be noted that the accommodating structure 16 can be a groove 161 or a blind hole 162 directly opened on the array element 12a, or it can be indirectly connected to the array element 12a through a fixing structure. For example, a base made of conductive material is fixed on the first surface 121 of the array element 12a, and grooves or blind holes are opened on the base to accommodate conductive particles 151.

[0086] Please see Figure 5 As shown in the embodiments of this application, an ultrasonic probe 100 is also proposed, including a transducer assembly 10. The transducer assembly 10 includes a matching layer 11, a piezoelectric layer 12, at least one conductive material layer 17, a flexible circuit board 13, a backing 14, conductive adhesive 15, and a housing structure 16. The piezoelectric layer 12 has a first surface 121 and a second surface 122 facing each other. The second surface 122 of the piezoelectric layer 12 is connected to the matching layer 11. The piezoelectric layer 12 includes a plurality of array elements 12a arranged in an array. At least one conductive material layer 17 is connected to the first surface 121 of the piezoelectric layer 12 and is conductive to the plurality of array elements 12a. The flexible circuit board 13 includes an insulating substrate 131 and a plurality of conductive portions 132. The insulating substrate 131 is connected to the side of the conductive material layer 17 facing away from the piezoelectric layer 12. The plurality of conductive portions 132 are disposed on the side of the insulating substrate 131 facing the piezoelectric layer 12. The conductive material layer 17 has a plurality of conductive regions 171. Each conductive region 171 corresponds to an array element 12a and a conductive part 132; the backing 14 is connected to the side of the insulating substrate 131 facing away from the piezoelectric layer 12; the conductive adhesive 15 is used to bond the insulating substrate 131 and the piezoelectric layer 12, and the conductive adhesive 15 includes a plurality of conductive particles 151, which are used to conduct electricity between the array element 12a and the conductive part 132; the accommodating structure 16 is used to accommodate the conductive particles 151 and restrict the movement of the conductive particles 151, and each conductive region 171 of the conductive material layer 17 is provided with the accommodating structure 16 so that the first surface 121 of each array element 12a corresponds to a conductive part 132 for conduction.

[0087] In this embodiment, the ultrasonic probe 100 utilizes the characteristic of conductive particles 151 to batch process electrical connections with narrower spacing, which can effectively improve the conductivity and enable the first surface 121 of multiple array elements 12a to be connected to multiple conductive parts 132 respectively. The conductive particles 151 can be fixed in the conductive area 171 of the conductive material layer 17 by the arrangement of the accommodating structure 16, so that the conductive particles 151 are evenly distributed, so that the first surface 121 of each array element 12a is connected to a conductive part 132 through the conductive material layer 17, thereby improving the conductivity of the array element 12a.

[0088] In some embodiments, the conductive material layer 17 may be made of copper foil or other conductive materials. The conductive material layer 17 may be a conductive layer provided to improve the performance of the ultrasonic probe 100 or to add other functions. By placing the accommodating structure 16 on the conductive material layer 17, the performance of the ultrasonic probe 100 is not affected, and the conductive particles 151 can be limited, thereby improving the conductivity of the array element 12a.

[0089] Understandably, the only difference between the accommodating structure 16 in the ultrasound probe of this embodiment and the accommodating structure 16 in the ultrasound probe of the above embodiment is the location of the accommodating structure 16. The specific structure of the accommodating structure 16 is consistent with the accommodating structure 16 in the above embodiment. For details, please refer to the specific setting of the accommodating structure 16 in the above embodiment, which will not be repeated here.

[0090] Please see Figure 6 As shown in the embodiment of this application, an ultrasonic probe 100 is also proposed, including a transducer assembly 10, which includes a matching layer 11, a piezoelectric layer 12, a flexible circuit board 13, a backing 14, a conductive adhesive 15, and a housing structure 16. The piezoelectric layer 12 has a first surface 121 and a second surface 122 facing each other. The second surface 122 of the piezoelectric layer 12 is connected to the matching layer 11. The piezoelectric layer 12 includes a plurality of array elements 12a arranged in an array. The flexible circuit board 13 includes an insulating substrate 131 and a plurality of conductive portions 132. The insulating substrate 131 is connected to the first surface 121 of the piezoelectric layer 12. The plurality of conductive portions 132 are disposed on the side of the insulating substrate 131 facing the piezoelectric layer 12. The backing 14 is connected to the side of the insulating substrate 131 facing away from the piezoelectric layer 12. The conductive adhesive 15 is used to bond the insulating substrate 131 and the piezoelectric layer 12. The conductive adhesive 15 includes a plurality of conductive particles 151. The conductive particles 151 are used to conduct electricity between the array elements 12a and the conductive portions 132. The accommodating structure 16 is used to accommodate the conductive particles 151 and restrict the movement of the conductive particles 151. Each conductive portion 132 is provided with the accommodating structure 16 so that the first surface 121 of each array element 12a corresponds to one conductive portion 132 for conduction.

[0091] The ultrasonic probe 100 of this application embodiment utilizes the characteristic of conductive particles 151 to batch process electrical connections with narrower spacing, which can effectively improve the conductivity effect, so as to realize the conduction between the first surface 121 of multiple array elements 12a and multiple conductive parts 132 respectively. By setting the accommodating structure 16, the conductive particles 151 can be fixed in the conductive parts 132, so that the conductive particles 151 are evenly distributed, so that the first surface 121 of each array element 12a corresponds to one conductive part 132 for conduction, thereby improving the conductivity of the array element 12a.

[0092] Understandably, the only difference between the accommodating structure 16 in the ultrasound probe of this embodiment and the accommodating structure 16 in the ultrasound probe of the above embodiment is the location of the accommodating structure 16. The specific structure of the accommodating structure 16 is consistent with the accommodating structure 16 in the above embodiment. For details, please refer to the specific setting of the accommodating structure 16 in the above embodiment, which will not be repeated here.

[0093] This application also proposes a method for preparing an ultrasonic probe 100, comprising:

[0094] A receiving structure 16 is formed by cutting the first surface 121 of each array element 12a. The receiving structure 16 can be a groove 161. The cutting position can be the central area of ​​the first surface 121 of the array element 12a. Grooves are cut in both the front-back direction and the left-right direction. The width of the groove 161 can be controlled by the blade thickness and can be greater than or equal to the diameter of the conductive particle 151. The depth of the groove 161 can be controlled by the cutting depth and can be less than the diameter of the conductive particle 151.

[0095] The conductive adhesive 15 containing conductive particles 151 is repeatedly applied and smoothed with a scraper to allow the conductive particles 151 to sink into the receiving structure 16 until conductive particles 151 are distributed on the first surface 121 of all array elements 12a. Through repeated application, the randomly distributed conductive particles 151 will gradually be stuck in the receiving structure 16, thereby ensuring that there are enough evenly distributed conductive particles 151 directly below the conductive part 132 of the flexible circuit board 13.

[0096] By aligning and pressing the flexible circuit board 13 at the positioning identification point, the pressed piezoelectric layer 12 and the flexible circuit board 13 are transferred to a preset temperature position for curing, thus completing the bonding. Pressing the flexible circuit board 13 allows the conductive portion 132 of the flexible circuit board 13 to first contact the conductive particles 151 confined in the accommodating structure 16, thereby achieving conductivity. Simultaneously, since the conductive particles 151 are confined within the accommodating structure 16 and have a small lateral distribution, they do not cause conduction in the X and Y axes, thus only achieving conduction in the Z axis. The very few conductive particles 151 distributed between the array elements 12a are non-conductive due to the insulating substrate 131 of the flexible circuit board 13 directly above them, and therefore do not have a negative impact.

[0097] The preparation method proposed in this application embodiment is simple, easy to process, and reduces production costs. The ultrasonic probe 100 obtained is equipped with a accommodating structure 16, which is used to accommodate conductive particles 151 and restrict the movement of conductive particles 151, so that the conductive particles 151 are evenly distributed, so that the first surface 121 of each array element 12a corresponds to a conductive part 132 for conduction, thereby improving the conductivity of the array element 12a.

[0098] Please see Figure 9 As shown in the figure, this application also proposes an ultrasound imaging system 1000, including a host 200, a display 300, and an ultrasound probe 100 of any of the above embodiments. The display 300 and the ultrasound probe 100 are both electrically connected to the host 200. The ultrasound probe 100 is used to send ultrasound waves to the object being operated on and to receive ultrasound echoes. The ultrasound probe 100 is connected to the host 200 through wires. The host 200 is used to process the ultrasound echoes and generate ultrasound images. The display 300 is used to display the ultrasound images.

[0099] The structure and function of the ultrasound probe 100 in the ultrasound imaging system 1000 proposed in this application embodiment are the same as those in the above embodiments. For details, please refer to the description of the above embodiments. This embodiment will not repeat the description.

[0100] Without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples.

[0101] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An ultrasonic probe, comprising a transducer assembly, characterized in that, The transducer assembly includes: Matching layer; A piezoelectric layer having opposing first and second sides, the second side of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array; A flexible circuit board includes an insulating substrate and a plurality of conductive portions, wherein the insulating substrate is connected to a first side of the piezoelectric layer, and the plurality of conductive portions are disposed on the side of the insulating substrate facing the piezoelectric layer; Backing, connected to the side of the insulating substrate opposite to the piezoelectric layer; A conductive adhesive is used to bond the insulating substrate and the piezoelectric layer. The conductive adhesive includes a plurality of conductive particles, which are used to enable the array elements and the conductive parts to conduct electricity. A receiving structure is provided for receiving the conductive particles and restricting their movement. The first surface of each array element is provided with the receiving structure so that the first surface of each array element is connected to one of the conductive parts.

2. The ultrasonic probe as described in claim 1, characterized in that, Each of the array elements has a first surface with a bonding region opposite to the conductive portion, and each of the array elements has at least the accommodating structure in the bonding region.

3. The ultrasonic probe as described in claim 1, characterized in that, The conductive particles are spherical, and the accommodating structure includes a groove or blind hole formed on the first surface of the array element.

4. The ultrasonic probe as described in claim 3, characterized in that, The number of grooves or blind holes on the first surface of each array element is multiple, and the multiple grooves or blind holes are arranged in an array.

5. The ultrasonic probe as described in claim 3, characterized in that, The number of grooves on the first surface of each array element is two, and the two grooves are arranged in a cross pattern.

6. The ultrasonic probe as described in claim 5, characterized in that, The two grooves are arranged orthogonally.

7. The ultrasonic probe as described in claim 3, characterized in that, The depth of the groove or the blind hole in a first direction is less than the diameter of the conductive particle, and the first direction is perpendicular to the first surface of the array element.

8. The ultrasonic probe as described in claim 7, characterized in that, The depth of the groove or the blind hole in the first direction is 1μm-20μm.

9. The ultrasonic probe as described in claim 7, characterized in that, The depth of the groove or the blind hole in the first direction is 30%-80% of the diameter of the conductive particle.

10. The ultrasonic probe as described in claim 3, characterized in that, The groove has a second direction and a third direction parallel to the first surface of the array element. The groove extends along the second direction and has a width of 2μm-30μm in the third direction. The second direction and the third direction are perpendicular to each other.

11. The ultrasonic probe as described in claim 3, characterized in that, The groove has a second direction and a third direction parallel to the first surface of the array element. The groove extends along the second direction, and the width of the groove in the third direction is 50%-150% of the diameter of the conductive particle. The second direction and the third direction are arranged perpendicular to each other.

12. An ultrasonic probe, comprising a transducer assembly, characterized in that, The transducer assembly includes: Matching layer; A piezoelectric layer having opposing first and second sides, the second side of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array; At least one conductive material layer is connected to the first surface of the piezoelectric layer and is in communication with the plurality of array elements; A flexible circuit board includes an insulating substrate and a plurality of conductive portions. The insulating substrate is connected to the side of the conductive material layer facing away from the piezoelectric layer. The plurality of conductive portions are disposed on the side of the insulating substrate facing the piezoelectric layer. The conductive material layer has a plurality of conductive regions, each of which corresponds to one array element and one conductive portion. Backing, connected to the side of the insulating substrate opposite to the piezoelectric layer; A conductive adhesive is used to bond the insulating substrate and the piezoelectric layer. The conductive adhesive includes a plurality of conductive particles, which are used to enable the array elements and the conductive parts to conduct electricity. A receiving structure is provided for receiving the conductive particles and restricting their movement. Each conductive region of the conductive material layer is provided with the receiving structure so that the first face of each array element is connected to a conductive part.

13. An ultrasonic probe, comprising a transducer assembly, characterized in that, The transducer assembly includes: Matching layer; A piezoelectric layer having opposing first and second sides, the second side of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array; A flexible circuit board includes an insulating substrate and a plurality of conductive portions, wherein the insulating substrate is connected to a first side of the piezoelectric layer, and the plurality of conductive portions are disposed on the side of the insulating substrate facing the piezoelectric layer; Backing, connected to the side of the insulating substrate opposite to the piezoelectric layer; A conductive adhesive is used to bond the insulating substrate and the piezoelectric layer. The conductive adhesive includes a plurality of conductive particles, which are used to enable the array elements and the conductive parts to conduct electricity. A receiving structure is provided for receiving the conductive particles and restricting their movement. Each conductive part is provided with the receiving structure so that the first face of each array element is connected to one of the conductive parts.

14. A method for preparing an ultrasonic probe as described in any one of claims 1-11, characterized in that, include: The accommodating structure is formed by cutting the first face of each array element; The conductive adhesive containing the conductive particles is repeatedly applied and smoothed to allow the conductive particles to be embedded in the accommodating structure until the conductive particles are distributed on the first surface of all the array elements. By aligning and pressing the flexible circuit board at the location identification point, the pressed piezoelectric layer and the flexible circuit board are transferred to a preset temperature position for curing, thus completing the bonding.

15. An ultrasound imaging system, characterized in that, The device includes a host computer, a display, and an ultrasound probe as described in any one of claims 1-13, wherein the display and the ultrasound probe are both electrically connected to the host computer, the ultrasound probe is used to send ultrasound waves to the object being operated on and to receive ultrasound echoes, the host computer is used to process the ultrasound echoes and generate ultrasound images, and the display is used to display the ultrasound images.

Images