Silicon wafer open washing device for semiconductor production

Abstract

The invention discloses a silicon wafer open washing device for semiconductor production, and relates to the technical field of semiconductor production. The silicon wafer open washing device for semiconductor production comprises an ultrasonic cleaning box, and the top of the ultrasonic cleaning box is fixedly connected with a drying mechanism. According to the silicon wafer open washing device for semiconductor production, through the arrangement of the drying mechanism, when a carrying box inclines and a silicon wafer slides onto a groove-shaped soft plate from the carrying box through an inclined block, a second motor is started, the second motor drives a fourth rotating shaft to rotate, the fourth rotating shaft drives a second gear to rotate, the second gear drives the groove-shaped soft plate to slide in a groove-shaped sliding rail, and in the sliding process, the silicon wafer can slide in the groove-shaped sliding rail; when the silicon wafers pass through the separation plate, the separation plate flatly spreads the stacked silicon wafers, so that the drying area can be increased, the drying speed is higher, the working efficiency of the device is improved, meanwhile, the silicon wafers can be dried more uniformly after being flatly spread, and the working quality of the device is improved.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor production, in particular to a silicon wafer flat washing device for semiconductor production. Background Art

[0002] Semiconductor refers to materials with electrical conductivity between conductors and insulators at room temperature. We usually call materials with poor electrical conductivity, such as coal, artificial crystals, amber, ceramics, etc., insulators, and metals with good electrical conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., conductors. We can simply call materials between conductors and insulators semiconductors. Silicon chips, also known as wafers, are processed from silicon ingots. Millions of transistors can be etched on silicon chips through special processes, and are widely used in the manufacture of integrated circuits. The cited patent number is CN216606403U, which discloses a silicon wafer flat washing device for semiconductor production; The existing semiconductor silicon wafers are not cleaned sufficiently, and workers need to take them out of the cleaning device for drying after cleaning, which is troublesome and time-consuming. Therefore, it is necessary to invent a semiconductor production silicon wafer cleaning device that can clean sufficiently and automatically dry after cleaning. Summary of the invention

[0003] In view of the deficiencies of the prior art, the present invention provides a silicon wafer flat cleaning device for semiconductor production to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a silicon wafer flat washing device for semiconductor production, comprising an ultrasonic cleaning box, a drying mechanism is fixedly connected to the top of the ultrasonic cleaning box, a rotating block 1 is fixedly connected to the top of the drying mechanism, a box door is rotatably connected to the inner side of the rotating block 1, a handle is fixedly connected to the top of the box door, a lifting mechanism is provided inside the ultrasonic cleaning box, a stirring mechanism is fixedly connected to the inside of the lifting mechanism, when the lifting mechanism transports the carrier box to the top of the through pipe, the baffle plate presses the baffle rod in the lifting mechanism downward, thereby tilting the carrier box, and after the carrier box is tilted, the silicon wafers inside the carrier box will slide into the drying mechanism through the inclined block; Preferably, the drying mechanism comprises a through pipe, a rotating block three is fixedly connected to the top of the through pipe, a baffle is fixedly connected to the side of the rotating block three, an inclined block is fixedly connected to the outside of the through pipe, a baffle two is fixedly connected to the side of the inclined block, a groove-shaped soft plate is provided at the bottom of the inclined block, a groove-shaped slide rail is slidably connected to the bottom of the groove-shaped soft plate, a drying box is fixedly connected to the bottom of the groove-shaped slide rail, a baffle one is fixedly connected to the inner side of the drying box, a drying device is provided at the top of the baffle one, a separation plate is fixedly connected to the inner side of the baffle one, two baffles are provided, and four baffles are provided for the drying device. The top of the second is fixedly connected with a motor 2, the output end of the motor 2 is fixedly connected with a rotating shaft 4, the end of the rotating shaft 4 away from the motor 2 is fixedly connected with a gear 2, the side of the gear 2 is meshed with the side of the grooved slide rail, when the silicon wafer slides onto the grooved soft plate through the inclined block, the motor 2 drives the grooved soft plate to slide in the grooved slide rail, and during the sliding process, each time the separation plate passes through the separation plate, the separation plate will spread out the stacked silicon wafers, which can increase the drying area, make the drying speed faster, and improve the working efficiency of the device. At the same time, after spreading, the silicon wafers can be dried more evenly, thereby improving the working quality of the device.

[0005] Preferably, the stirring mechanism includes motor 1, the output end of motor 1 is fixedly connected to shaft 3, the end of shaft 3 away from motor 1 is fixedly connected to stirring rod, a cleaning box is provided at the bottom of motor 1, the top of cleaning box is fixedly connected to top cover, the side of cleaning box is fixedly connected to straight slide rail, the inner side of straight slide rail is slidably connected to arc door, the top of arc door is fixedly connected to pull ring, silicon wafer is placed in the cleaning box, motor 1 drives stirring rod to rotate, stirring rod is circular, during stirring process, the squeezing damage to silicon wafer can be greatly reduced, any position of silicon wafer can be ultrasonically cleaned by stirring, and when transferring silicon wafer, all silicon wafers in the cleaning box can be cleaned out by rotating stirring rod, which greatly improves the quality of ultrasonic cleaning and the working efficiency and quality of the device, after cleaning, the arc door can be opened by pull ring, which is convenient for subsequent transportation and processing of silicon wafer.

[0006] Preferably, the lifting mechanism includes a handle, a rotating rod 1 is fixedly connected to the side of the handle, an end of the rotating rod 1 away from the handle is fixedly connected to a rotating shaft 1, the outer side of the rotating shaft 1 is fixedly connected to a gear 1, the bottom of the gear 1 is meshed with a ring gear plate, the end of the rotating shaft 1 away from the rotating rod is fixedly connected to a rotating rod 2, the end of the rotating shaft 1 close to the rotating rod 2 is rotatably connected to a fixed block, the end of the rotating rod 2 away from the rotating shaft 1 is rotatably connected to a rotating rod 3, the end of the rotating rod 3 away from the rotating rod 2 is fixedly connected to a lifting platform, the top of the lifting platform is fixedly connected to a spring, the top of the spring is fixedly connected to a loading box, the outer side of the loading box is fixedly connected to a blocking rod, the interior of the loading box is fixedly connected to a rotating shaft 2, the outer side of the rotating shaft 2 is rotatably connected to a rotating block 2, four fixed blocks are provided, and four springs are provided. After the ultrasonic cleaning of the silicon wafer is completed, hold the handle and rotate the rotating rod one. The rotating rod one drives the gear one and the rotating rod three to rotate. The rotation of the gear one will drive the annular gear plate to rotate, so that the three rotating rods three will rotate accordingly, realizing the lifting function of the lifting platform. At the same time, since the bottom of the carrier box is arranged as a filter plate structure, the water in the carrier box will flow out during the rising process to avoid entering the subsequent mechanism. At the same time, one side of the carrier box is arranged as an upward inclined surface. When the carrier box is laid flat, the silicon wafer can be prevented from falling out. When the carrier box is tilted, the silicon wafer can slide out of the carrier box conveniently. Four springs are arranged at the bottom of the carrier box to facilitate the subsequent transmission of the silicon wafer. In this way, the direct transfer of the silicon wafer can be realized, which is convenient for subsequent work. Workers do not need to manually take out the cleaned silicon wafers, which improves work efficiency and reduces the work content of workers.

[0007] The present invention provides a silicon wafer flat washing device for semiconductor production. It has the following beneficial effects: 1. The semiconductor production silicon wafer flat washing device places the silicon wafer in the cleaning box through the setting of the stirring mechanism. The motor drives the stirring rod to rotate. The stirring rod is set in a circular shape. During the stirring process, the extrusion damage to the silicon wafer can be greatly reduced. Through stirring, any position of the silicon wafer can be ultrasonically cleaned, and when the silicon wafer is transferred, the silicon wafer in the cleaning box can be completely cleaned out by rotating the stirring rod, which greatly improves the quality of ultrasonic cleaning and improves the working efficiency and quality of the device. After the cleaning is completed, the arc door can be opened by the pull ring to facilitate the subsequent transportation and processing of the silicon wafer.

[0008] 2. The silicon wafer flat washing device for semiconductor production is provided with a lifting mechanism. After the ultrasonic cleaning of the silicon wafer is completed, hold the handle and rotate the rotating rod one. The rotating rod one drives the gear one and the rotating rod three to rotate. The rotation of the gear one will drive the annular gear plate to rotate, so that the three rotating rods three will rotate accordingly, thereby realizing the lifting function of the lifting platform. At the same time, since the bottom of the carrier box is provided with a filter plate structure, the water in the carrier box will flow out during the rising process to avoid entering the subsequent mechanism. At the same time, one side of the carrier box is provided with an upward inclined surface. When the carrier box is placed flat, the silicon wafer can be prevented from falling out. When the carrier box is tilted, the silicon wafer can slide out of the carrier box conveniently. Four springs are provided at the bottom of the carrier box to facilitate the subsequent transmission of the silicon wafer. In this way, the direct transfer of the silicon wafer can be realized, which is convenient for subsequent work. Workers do not need to manually take out the cleaned silicon wafers, thereby improving work efficiency and reducing the work content of workers.

[0009] 3. The semiconductor production silicon wafer flat washing device, through the setting of baffles and inclined blocks, when the lifting mechanism transports the carrier box to the top of the through pipe, the baffle will press the baffle rod in the lifting mechanism downward, thereby tilting the carrier box. After the carrier box is tilted, the silicon wafers inside it will slide through the inclined blocks into the drying mechanism.

[0010] 4. The semiconductor production silicon wafer flat washing device, through the setting of the drying mechanism, when the silicon wafer slides onto the grooved soft plate through the inclined block, the second motor drives the grooved soft plate to slide in the grooved slide rail. During the sliding process, every time it passes through the separation plate, the separation plate will spread out the stacked silicon wafers, which can increase the drying area, make the drying speed faster, and improve the working efficiency of the device. At the same time, after spreading, the silicon wafers can be dried more evenly, which improves the working quality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the overall internal structure of the present invention; Figure 3 It is a schematic diagram of the overall structure of the lifting mechanism of the present invention; Figure 4 For the present invention Figure 3 A magnified view of middle; Figure 5 This is a front structural schematic diagram of the lifting mechanism of the present invention; Figure 6 This is a schematic diagram of the stirring mechanism structure of the present invention; Figure 7 This is a schematic diagram of the drying mechanism structure of the present invention; Figure 8 It is a schematic diagram of the internal structure of the drying mechanism of the present invention.

[0012] In the figure: 1, ultrasonic cleaning box; 2, rotating block 1; 3, box door; 4, handle; 5, drying mechanism; 501, through pipe; 502, inclined block; 503, grooved soft board; 504, drying box; 505, stopper 1; 506, drying device; 507, rotating block 3; 508, baffle; 509, motor 2; 510, rotating shaft 4; 511, gear 2; 512, stopper 2; 513, grooved slide rail; 514, separation plate; 6, stirring mechanism; 601, motor 1; 602, rotating block Axis three; 603, top cover; 604, stirring rod; 605, cleaning box; 606, curved door; 607, straight slide rail; 608, pull ring; 7, lifting mechanism; 701, handle; 702, turning rod one; 703, rotating shaft one; 704, gear one; 705, fixing block; 706, loading box; 707, turning rod two; 708, turning rod three; 709, ring gear plate; 710, lifting platform; 711, turning block two; 712, rotating shaft two; 713, spring; 714, stop rod. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0014] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0015] See also Figure 1-8 The present invention provides a technical solution: a silicon wafer flat washing device for semiconductor production, comprising an ultrasonic cleaning box 1, a drying mechanism 5 is fixedly connected to the top of the ultrasonic cleaning box 1, a rotating block 2 is fixedly connected to the top of the drying mechanism 5, a box door 3 is rotatably connected to the inner side of the rotating block 2, a handle 4 is fixedly connected to the top of the box door 3, a lifting mechanism 7 is provided inside the ultrasonic cleaning box 1, a stirring mechanism 6 is fixedly connected to the inside of the lifting mechanism 7, when the lifting mechanism 7 transports the carrier box 706 to the top of the through pipe 501, the baffle 508 presses the baffle rod 714 in the lifting mechanism 7 downward, thereby tilting the carrier box 706, and after the carrier box 706 is tilted, the silicon wafers inside it will slide into the drying mechanism 5 through the inclined block 502.

[0016] The drying mechanism 5 includes a through pipe 501, a rotating block 3 507 is fixedly connected to the top of the through pipe 501, a baffle 508 is fixedly connected to the side of the rotating block 3 507, an inclined block 502 is fixedly connected to the outside of the through pipe 501, a baffle 2 512 is fixedly connected to the side of the inclined block 502, a groove-shaped soft plate 503 is provided at the bottom of the inclined block 502, a groove-shaped slide rail 513 is slidably connected to the bottom of the groove-shaped soft plate 503, a drying box 504 is fixedly connected to the bottom of the groove-shaped slide rail 513, a baffle 1 505 is fixedly connected to the inner side of the drying box 504, a drying device 506 is provided at the top of the baffle 1 505, a separation plate 514 is fixedly connected to the inner side of the baffle 1 505, two baffles 1 505 are provided, and four drying devices 506 are provided, a motor 2 509 is fixedly connected to the top of the baffle 2 512, and the output of the motor 2 509 The output end is fixedly connected with a rotating shaft four 510, and the end of the rotating shaft four 510 away from the motor two 509 is fixedly connected with a gear two 511, and the side of the gear two 511 is meshed with the side of the grooved slide rail 513. When the silicon wafer slides onto the grooved soft board 503 through the inclined block 502, the material of the grooved soft board 503 is a PVC board, and the motor two 509 drives the rotating shaft four 510 to rotate, and the rotating shaft four 510 drives the gear two 511 to rotate, and the gear two 511 drives the grooved soft board 503 to slide in the grooved slide rail 513. During the sliding process, whenever passing through the separation plate 514, the separation plate 514 will spread the stacked silicon wafers flat, which can increase the drying area, make the drying speed faster, and improve the working efficiency of the device. At the same time, after spreading, the silicon wafers can be dried more evenly, thereby improving the working quality of the device.

[0017] The stirring mechanism 6 includes a motor 1 601, the output end of the motor 1 601 is fixedly connected to a rotating shaft 3 602, the end of the rotating shaft 3 602 away from the motor 1 601 is fixedly connected to a stirring rod 604, a cleaning box 605 is provided at the bottom of the motor 1 601, a top cover 603 is fixedly connected to the top of the cleaning box 605, a straight slide rail 607 is fixedly connected to the side of the cleaning box 605, an arc door 606 is slidably connected to the inner side of the straight slide rail 607, a pull ring 608 is fixedly connected to the top of the arc door 606, a silicon wafer is placed in the cleaning box 605, the motor 1 601 drives the rotating shaft 3 602 to rotate, and the rotating shaft 3 602 drives the stirring rod 604 to rotate. The stirring rod 604 is set to be circular. During the stirring process, the squeezing damage to the silicon wafer can be greatly reduced. Through stirring, any position of the silicon wafer can be ultrasonically cleaned, and when the silicon wafer is transferred, the silicon wafer in the cleaning box 605 can be completely cleaned out by rotating the stirring rod 604, which greatly improves the quality of ultrasonic cleaning and improves the working efficiency and quality of the device. After the cleaning is completed, the arc door 606 can be pulled in the straight slide rail 607 through the pull ring 608, so as to open the cleaning box 605, which is convenient for the subsequent transportation and processing of the silicon wafer.

[0018] The lifting mechanism 7 includes a handle 701, a rotating rod 1 702 is fixedly connected to the side of the handle 701, a rotating shaft 1 703 is fixedly connected to the end of the rotating rod 1 702 away from the handle 701, a gear 1 704 is fixedly connected to the outer side of the rotating shaft 1 703, a ring gear plate 709 is meshed with the bottom of the gear 1 704, a rotating rod 2 707 is fixedly connected to the end of the rotating shaft 1 703 away from the rotating rod 1 702, a fixed block 705 is rotatably connected to the end of the rotating shaft 1 703 close to the rotating rod 2 707, and the end of the rotating rod 2 707 away from the rotating shaft 1 703 is rotatably connected to the fixed block 705. The rotating rod 708 is rotatably connected to the rotating rod 3 708, and the end of the rotating rod 3 708 away from the rotating rod 2 707 is fixedly connected to the lifting platform 710, and the top of the lifting platform 710 is fixedly connected to the spring 713, and the top of the spring 713 is fixedly connected to the object box 706, and the outer side of the object box 706 is fixedly connected to the blocking rod 714, and the inside of the object box 706 is fixedly connected to the rotating shaft 2 712, and the outer side of the rotating shaft 2 712 is rotatably connected to the rotating block 2 711, and the fixed block 705 is provided with four, and the spring 713 is provided with four. After the ultrasonic cleaning is completed, the silicon wafer is held The handle 701 rotates the rotating rod 1 702, the rotating rod 1 702 drives the gear 1 704 and the rotating shaft 1 703 to rotate, the rotating shaft 1 703 drives the rotating rod 2 707 to rotate, the rotating rod 2 707 drives the rotating rod 3 708 to rotate, the rotation of the gear 1 704 drives the annular gear plate 709 to rotate, so that the three gears 1 704 rotate accordingly, thereby driving the rotating rod 3 708 to rotate accordingly, realizing the lifting function of the lifting platform 710, and at the same time, because the bottom of the carrying box 706 is set as a filter plate structure, the water in the carrying box 706 will flow out during the rising process. When the carrier box 706 is tilted, the silicon wafer can slide out of the carrier box 706 conveniently. Four springs 713 are arranged at the bottom of the carrier box 706 to facilitate the subsequent transmission of the silicon wafer. In this way, the direct transfer of the silicon wafer can be realized, which is convenient for subsequent work. Workers do not need to manually take out the cleaned silicon wafers, which improves work efficiency and reduces the work content of workers.

[0019] When in use, the silicon wafer is placed in the cleaning box 605, the motor 1 601 is started to drive the rotating shaft 3 602 to rotate, and the rotating shaft 3 602 drives the stirring rod 604 to rotate. The stirring rod 604 is set to be circular, which can greatly reduce the extrusion damage to the silicon wafer during the stirring process. Through stirring, any position of the silicon wafer can be ultrasonically cleaned, and when the silicon wafer is transferred, the silicon wafer in the cleaning box 605 can be completely cleaned out by rotating the stirring rod 604, which greatly improves the quality of ultrasonic cleaning and improves the working efficiency and quality of the device. After the cleaning is completed, the arc door 606 can be pulled in the straight slide rail 607 through the pull ring 608 to open the cleaning box 605. , which is convenient for the subsequent transportation and processing of the silicon wafers. After the ultrasonic cleaning of the silicon wafers is completed, hold the handle 701 and rotate the rotating rod 1 702. The rotating rod 1 702 drives the gear 1 704 and the rotating shaft 1 703 to rotate. The rotating shaft 1 703 drives the rotating rod 2 707 to rotate. The rotating rod 2 707 drives the rotating rod 3 708 to rotate. The rotation of the gear 1 704 drives the annular gear plate 709 to rotate, so that the three gears 1 704 rotate accordingly, thereby driving the rotating rod 3 708 to rotate accordingly, realizing the lifting function of the lifting platform 710. At the same time, since the bottom of the carrier box 706 is set as a filter plate structure, the water in the carrier box 706 will flow out during the rising process to avoid entering the subsequent mechanism. At the same time, the carrier box 7 When the carrier box 706 is placed flat, the silicon wafers can be prevented from falling out. When the carrier box 706 is tilted, the silicon wafers can slide out of the carrier box 706. Four springs 713 are arranged at the bottom of the carrier box 706 to facilitate the subsequent transmission of the silicon wafers. In this way, the direct transfer of the silicon wafers can be achieved, which is convenient for subsequent work. Workers do not need to manually take out the cleaned silicon wafers, which improves work efficiency and reduces the work content of workers. When the lifting mechanism 7 transports the carrier box 706 to the top of the through pipe 501, the baffle plate 508 presses the baffle rod 714 in the lifting mechanism 7 downward, thereby tilting the carrier box 706. The carrier box 706 tilts After being tilted, the silicon wafer inside it will slide into the drying mechanism 5 through the inclined block 502. When the silicon wafer slides onto the grooved soft board 503 through the inclined block 502, the material of the grooved soft board 503 is a PVC board, and the motor 2 509 shaft 4 510 rotates, and the shaft 4 510 drives the gear 2 511 to rotate, and the gear 2 511 drives the grooved soft board 503 to slide in the grooved slide rail 513. During the sliding process, every time it passes through the separation plate 514, the separation plate 514 will spread the stacked silicon wafers flat, which can increase the drying area, make the drying speed faster, and improve the working efficiency of the device. At the same time, after spreading, the silicon wafers can be dried more evenly, which improves the working quality of the device.

[0020] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A silicon wafer flat cleaning device for semiconductor production, comprising an ultrasonic cleaning box (1), characterized in that: The top of the ultrasonic cleaning box (1) is fixedly connected to a drying mechanism (5), the top of the drying mechanism (5) is fixedly connected to a rotating block (2), the inner side of the rotating block (2) is rotatably connected to a box door (3), the top of the box door (3) is fixedly connected to a handle (4), and a lifting mechanism (7) is provided inside the ultrasonic cleaning box (1), and a stirring mechanism (6) is fixedly connected inside the lifting mechanism (7); The drying mechanism (5) comprises a through pipe (501), a rotating block three (507) is fixedly connected to the top of the through pipe (501), a baffle plate (508) is fixedly connected to the side of the rotating block three (507), an inclined block (502) is fixedly connected to the outside of the through pipe (501), a baffle plate two (512) is fixedly connected to the side of the inclined block (502), a groove-shaped soft plate (503) is provided at the bottom of the inclined block (502), a groove-shaped slide rail (513) is slidably connected to the bottom of the groove-shaped soft plate (503), a drying box (504) is fixedly connected to the bottom of the groove-shaped slide rail (513), a baffle plate one (505) is fixedly connected to the inside of the drying box (504), a drying device (506) is provided at the top of the baffle plate one (505), and a separation plate (514) is fixedly connected to the inside of the baffle plate one (505); The lifting mechanism (7) comprises a handle (701), a rotating rod (702) being fixedly connected to a side surface of the handle (701), a rotating shaft (703) being fixedly connected to an end of the rotating rod (702) away from the handle (701), a gear (704) being fixedly connected to the outer side of the rotating shaft (703), and a ring gear plate (709) being meshed with the bottom of the gear (704); One end of the rotating shaft 1 (703) away from the rotating rod 1 (702) is fixedly connected to the rotating rod 2 (707); one end of the rotating shaft 1 (703) close to the rotating rod 2 (707) is rotatably connected to the fixed block (705); one end of the rotating rod 2 (707) away from the rotating shaft 1 (703) is rotatably connected to the rotating rod 3 (708); one end of the rotating rod 3 (708) away from the rotating rod 2 (707) is fixedly connected to the lifting platform (710); the top of the lifting platform (710) is fixedly connected to the spring (713); the top of the spring (713) is fixedly connected to the object box (706); the outer side of the object box (706) is fixedly connected to the blocking rod (714); the interior of the object box (706) is fixedly connected to the rotating shaft 2 (712); the outer side of the rotating shaft 2 (712) is rotatably connected to the rotating block 2 (711); The top of the second stopper (512) is fixedly connected to the second motor (509), the output end of the second motor (509) is fixedly connected to the fourth shaft (510), the end of the fourth shaft (510) away from the second motor (509) is fixedly connected to the second gear (511), and the side surface of the second gear (511) is meshed with the side surface of the grooved slide rail (513); The stirring mechanism (6) comprises a motor 1 (601), the output end of the motor 1 (601) being fixedly connected to a rotating shaft 3 (602), an end of the rotating shaft 3 (602) away from the motor 1 (601) being fixedly connected to a stirring rod (604), a cleaning box (605) being provided at the bottom of the motor 1 (601), and a top cover (603) being fixedly connected to the top of the cleaning box (605).

2. The semiconductor production silicon wafer flat cleaning device according to claim 1, characterized in that: The first stopper (505) is provided with two, and the drying device (506) is provided with four.

3. The semiconductor wafer flat cleaning device according to claim 1, characterized in that: There are four fixing blocks (705) and four springs (713).

4. The semiconductor production silicon wafer flat cleaning device according to claim 1, characterized in that: A straight slide rail (607) is fixedly connected to the side of the cleaning box (605), a curved door (606) is slidably connected to the inner side of the straight slide rail (607), and a pull ring (608) is fixedly connected to the top of the curved door (606).

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