Low-resistance high-temperature superconducting strip joint welding method and device

Abstract

The invention discloses a low-resistance high-temperature superconducting tape connector welding method and device. The method comprises the steps that a first high-temperature superconducting tape and a second high-temperature superconducting tape are obtained; beveling the welding joint of the first high-temperature superconducting tape and the welding joint of the second high-temperature superconducting tape at a preset beveling angle to obtain a first to-be-welded high-temperature superconducting tape and a second to-be-welded high-temperature superconducting tape; the method comprises the following steps: uniformly smearing tin-lead alloy solder on the surface of a copper layer which needs to be attached when a first high-temperature superconducting strip welding joint to be welded and a second high-temperature superconducting strip welding joint to be welded are welded, and attaching the first high-temperature superconducting strip to be welded and the second high-temperature superconducting strip to be welded after the tin-lead alloy solder is smeared; the attaching area serves as a welding area; and preset pressure is applied to the welding area, the temperature of the welding area is adjusted to be the preset temperature and maintained for the preset duration, the preset pressure is removed after the preset duration, the welding area is cooled to the room temperature, and welding of the high-temperature superconducting strip is completed.

Description

Technical Field

[0001] The invention relates to the technical field of superconducting tape welding, and in particular to a low-resistance high-temperature superconducting tape joint welding method and device. Background Art

[0002] In scenarios such as long-distance superconducting cable power transmission and large superconducting magnets, relatively short superconducting tapes need to be connected for use, which can improve the utilization rate of superconducting short tapes while reducing equipment manufacturing costs. At present, superconducting tape joints mostly use tin-lead alloy (SnPb) solder to directly braze copper-encapsulated superconducting tapes. This type of connection joint has the advantages of simple operation and low cost. However, the welding resistance in the connection joint is inevitable. The size of the joint resistance is mainly determined by many factors such as solder type, welding length, welding pressure and welding angle. Changes in any factor during the welding process may have a significant impact on the resistance of the joint. Higher joint resistance will generate a large amount of Joule heat loss, cause local heating, increase the burden on the refrigeration system, reduce the working performance of the superconducting equipment, and in severe cases, cause superconductor quenching in the equipment. At present, when welding superconducting tapes, the method of directly welding two superconducting tapes to be welded is mostly used. Although this direct welding method is simple and fast, it may form large stress concentration and defects at the weld, thereby affecting the resistance and overall performance of the joint. Therefore, how to improve the welding process to reduce the resistance of the interface after welding is an urgent problem to be solved. Summary of the invention

[0003] The embodiments of the present invention provide a low-resistance high-temperature superconducting tape joint welding method and device, which can effectively solve the problem of excessive resistance at the welded joint caused by direct welding of high-temperature superconducting tapes in the prior art, and effectively reduce the resistance of the joint formed after welding two sections of high-temperature superconducting tapes.

[0004] An embodiment of the present invention provides a low-resistance high-temperature superconducting tape joint welding method, comprising:

[0005] Obtaining a first high temperature superconducting tape and a second high temperature superconducting tape;

[0006] Beveling the welded joint of the first high-temperature superconducting tape and the welded joint of the second high-temperature superconducting tape at a preset beveling angle to obtain a first high-temperature superconducting tape to be welded and a second high-temperature superconducting tape to be welded;

[0007] Uniformly applying tin-lead alloy solder to the surface of the copper layer to be bonded when welding the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded, and bonding the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded after the tin-lead alloy solder is applied, and using the bonding area as the welding area;

[0008] Apply a preset pressure to the welding area, adjust the temperature of the welding area to a preset temperature and maintain it for a preset time, remove the preset pressure after the preset time to cool the welding area to room temperature, and complete the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0009] Furthermore, after obtaining the first high temperature superconducting tape and the second high temperature superconducting tape, the method further includes:

[0010] The surface copper layers of the first high temperature superconducting tape and the second high temperature superconducting tape were polished with sandpaper, and the surfaces of the first high temperature superconducting tape and the second high temperature superconducting tape were wiped with alcohol after polishing.

[0011] Furthermore, the tin-lead alloy solder consists of 63 percent tin and 37 percent lead.

[0012] Furthermore, the preset bevel angle is greater than or equal to 30° and the preset bevel angle is less than or equal to 90°.

[0013] Furthermore, the step of uniformly applying the tin-lead alloy solder to the surface of the copper layer to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded include:

[0014] The tin-lead alloy solder is evenly applied in a preset length on the surface of the copper layer to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded are welded; wherein the preset length is greater than or equal to 30 mm and the preset length is less than or equal to 50 mm.

[0015] Furthermore, the preset pressure is greater than or equal to 4 MPa and the preset pressure is less than or equal to 6 MPa.

[0016] Furthermore, the preset temperature is greater than or equal to 183 degrees Celsius and the preset temperature is less than or equal to 200 degrees Celsius.

[0017] Furthermore, the preset duration is greater than or equal to 2 minutes and the preset duration is less than or equal to 5 minutes.

[0018] Based on the above method embodiment, the present invention provides a corresponding device embodiment;

[0019] An embodiment of the present invention provides a low-resistance high-temperature superconducting tape joint welding device, including: a welding material acquisition module, a beveling processing module, a solder adding module and a welding module;

[0020] The welding material acquisition module is used to obtain the first high-temperature superconducting tape and the second high-temperature superconducting tape;

[0021] The beveling processing module is used to bevel the welding joint of the first high-temperature superconducting tape and the welding joint of the second high-temperature superconducting tape at a preset beveling angle to obtain the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded;

[0022] The solder adding module is used to evenly apply the tin-lead alloy solder to the surface of the copper layer that needs to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded are welded, and after the tin-lead alloy solder is applied, the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are bonded, and the bonding area is used as the welding area;

[0023] The welding module is used to apply a preset pressure to the welding area, adjust the temperature of the welding area to a preset temperature and maintain it for a preset time, remove the preset pressure after the preset time to cool the welding area to room temperature, and complete the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0024] Furthermore, it also includes a pre-processing module;

[0025] The pretreatment module is used to grind the surface copper layers of the first high-temperature superconducting tape and the second high-temperature superconducting tape with sandpaper, and wipe the surfaces of the first high-temperature superconducting tape and the second high-temperature superconducting tape with alcohol after grinding.

[0026] The following beneficial effects are achieved by implementing the present invention:

[0027] The present invention provides a low-resistance high-temperature superconducting tape joint welding method and device. The method obtains a first high-temperature superconducting tape and a second high-temperature superconducting tape, and then bevels the welding joint of the first high-temperature superconducting tape and the welding joint of the second high-temperature superconducting tape at a preset bevel angle to obtain a first high-temperature superconducting tape to be welded and a second high-temperature superconducting tape to be welded. By beveling the welding joint of the first high-temperature superconducting tape and the welding joint of the second high-temperature superconducting tape, the contact area between the welding joint of the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded is increased compared with the contact area during direct welding, thereby making the welding area after beveling have lower resistance than the welding area during direct welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The present invention is a schematic flow chart of a low-resistance high-temperature superconducting tape joint welding method provided by one embodiment of the present invention.

[0029] Figure 2 It is a schematic diagram of an oblique cut provided by an embodiment of the present invention.

[0030] Figure 3 It is a welding schematic diagram provided by an embodiment of the present invention.

[0031] Figure 4 It is a structural schematic diagram of a low-resistance high-temperature superconducting tape joint welding device provided by one embodiment of the present invention.

[0032] The accompanying drawings are described as follows:

[0033] 1. First high-temperature superconducting tape; 2. Second high-temperature superconducting tape; 3. Bevel angle; 4. Welding length; 5. Solder; 6. Superconducting layer; 7. Copper layer; 8. Silver layer; 9. Base layer. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0037] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0038] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0039] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0040] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0041] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0042] like Figure 1 As shown, a low-resistance high-temperature superconducting tape joint welding method provided by an embodiment of the present invention comprises:

[0043] Step S1: obtaining a first high temperature superconducting tape and a second high temperature superconducting tape;

[0044] Step S2: beveling the welded joint of the first high-temperature superconducting tape and the welded joint of the second high-temperature superconducting tape at a preset beveling angle to obtain a first high-temperature superconducting tape to be welded and a second high-temperature superconducting tape to be welded;

[0045] Step S3: evenly applying tin-lead alloy solder on the surface of the copper layer that needs to be bonded when welding the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded, and bonding the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded after the tin-lead alloy solder is applied, and using the bonding area as the welding area;

[0046] Step S4: applying a preset pressure to the welding area, adjusting the temperature of the welding area to a preset temperature and maintaining it for a preset time, removing the preset pressure after the preset time to cool the welding area to room temperature, and completing the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0047] For step S1, first obtain two high temperature superconducting tapes to be welded, namely a first high temperature superconducting tape and a second high temperature superconducting tape. For the first high temperature superconducting tape or the second high temperature superconducting tape, the structure from the outside to the inside is a copper layer, a superconducting layer, a silver layer and a substrate layer.

[0048] In a preferred embodiment, after obtaining the first high-temperature superconducting tape and the second high-temperature superconducting tape, it also includes: using sandpaper to polish the surface copper layer of the first high-temperature superconducting tape and the second high-temperature superconducting tape, and using alcohol to wipe the surface of the first high-temperature superconducting tape and the second high-temperature superconducting tape after polishing.

[0049] Specifically, after obtaining the first high-temperature superconducting tape and the second high-temperature superconducting tape, the surface of the first high-temperature superconducting tape and the surface of the second high-temperature superconducting tape need to be pretreated. This is mainly done by using sandpaper to polish the copper layer on the surface of the first high-temperature superconducting tape adjacent to the superconducting layer manually or by a robotic arm, and by using sandpaper to polish the copper layer on the surface of the second high-temperature superconducting tape adjacent to the superconducting layer. After polishing, the surface of the first high-temperature superconducting tape after polishing and the surface of the second high-temperature superconducting tape after polishing are wiped with alcohol cotton cloth manually or by a robotic arm. By polishing and wiping the surface of the high-temperature superconducting tape with alcohol cotton cloth, oxides and oil stains attached to the surface of the high-temperature superconducting tape can be effectively removed before welding, so as to avoid the oxides and oil stains attached to the surface of the high-temperature superconducting tape from affecting the quality of the welding process.

[0050] For step S2, Figure 2 As shown, the welding joint where the first high-temperature superconducting tape needs to be welded to the second high-temperature superconducting tape is beveled at a preset bevel angle, and the welding joint where the second high-temperature superconducting tape needs to be welded to the first high-temperature superconducting tape is beveled at a preset bevel angle, so as to obtain the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded with beveled weld joints.

[0051] In a preferred embodiment, the preset bevel angle is greater than or equal to 30° and the preset bevel angle is less than or equal to 90°.

[0052] Specifically, beveling the first high-temperature superconducting tape and the second high-temperature superconducting tape can improve the mechanical properties of the welded joint of the first high-temperature superconducting tape and the second high-temperature superconducting tape. Considering that the reduction of the bevel angle will intensify the current flow in the cutting area, thereby increasing the resistance of the welded joint. In the present invention, the selection range of the bevel angle is [30°, 90°]. When the bevel angle is greater than or equal to 30 degrees, the resistance of the superconducting tape welded joint can reach the nano-ohm level. Preferably, after beveling, it is necessary to wipe the beveled surface and surface of the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded with an alcohol cotton cloth manually or by a robotic arm to remove the material residue and dust generated during beveling, so as to avoid the material residue and dust generated during beveling affecting the quality of the welding process.

[0053] For step S3, tin-lead alloy solder is evenly applied on the surface of the copper layer that needs to be bonded when welding the first high-temperature superconducting tape welding joint and the second high-temperature superconducting tape welding joint to be welded, and after the tin-lead alloy solder is applied, the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are bonded, and the bonding area is used as the welding area.

[0054] In a preferred embodiment, the tin-lead alloy solder consists of 63 percent tin and 37 percent lead.

[0055] Specifically, the tin-lead alloy solder used in the present invention is Sn63Pb37 solder, that is, a solder composed of 63% tin and 37% lead. The melting point of Sn63Pb37 solder is 183°C.

[0056] In a preferred embodiment, the step of evenly applying the tin-lead alloy solder on the surface of the copper layer that needs to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded comprises: evenly applying the tin-lead alloy solder in a preset length on the surface of the copper layer that needs to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded; wherein the preset length is greater than or equal to 30 mm and the preset length is less than or equal to 50 mm.

[0057] Specifically, Figure 3 As shown, the Sn63Pb37 solder is evenly applied to the surface of the copper layer adjacent to the superconducting layer where the first high-temperature superconducting tape and the second high-temperature superconducting tape need to be attached. The application area length (preset length) of the Sn63Pb37 solder is in the range of [30mm, 50mm]. The application area length of the solder is the welding length, and the area corresponding to the welding length is the welding area.

[0058] It should be noted that the value of this welding length range can achieve the resistance value of the superconducting tape welding joint to reach the nano-ohm level, and can avoid complicated welding process. The selection basis of this welding length is that the increase of welding length can significantly reduce the resistance value of the joint. However, as the welding length continues to increase, the joint resistance decreases slowly and eventually tends to a stable value. This is because the current flow in the joint is mainly concentrated at the two ends of the tape. Therefore, the effect of continuing to increase the welding length on the joint resistance is weakened. At this time, continuing to increase the welding length has little effect on reducing the joint resistance. Instead, it makes the welding process more complicated, increases the probability of cold welding, affects the quality of the joint, and even damages the superconducting tape and causes the tape's current carrying capacity to decline.

[0059] After the tin-lead alloy solder is applied, the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are bonded together. When bonding, the edges of the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded need to be aligned, that is, the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are aligned as shown in the figure. Figure 3 The "face-to-face" alignment shown. The area of ​​the joint is the soldering area where Sn63Pb37 solder is applied.

[0060] For step S4, the aligned and bonded first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are placed on a welding table, a preset pressure is applied to the welding area through the welding table, the temperature of the welding area is adjusted to a preset temperature and maintained for a preset time, and after the preset time, the preset pressure is removed to cool the welding area to room temperature, thereby completing the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0061] In a preferred embodiment, the preset pressure is greater than or equal to 4 MPa and the preset pressure is less than or equal to 6 MPa.

[0062] In a preferred embodiment, the preset temperature is greater than or equal to 183 degrees Celsius and the preset temperature is less than or equal to 200 degrees Celsius.

[0063] In a preferred embodiment, the preset duration is greater than or equal to 2 minutes and the preset duration is less than or equal to 5 minutes.

[0064] Specifically, the aligned and bonded first high-temperature superconducting tape and the second high-temperature superconducting tape to be welded are placed on a welding table, and a pressure of 4 to 6 MPa is applied to the welding area through the welding table. This welding pressure can reduce the thickness of the solder layer and improve the wetting ability of the solder to the tape, thereby obtaining a lower joint resistance and avoiding mechanical damage to the tape caused by excessive welding pressure. The temperature of the welding area is adjusted to 183 to 200°C and maintained for 2 to 5 minutes. This welding temperature and time can ensure that the solder fully melts and wets the superconducting tape without damaging the superconducting layer of the tape. After removing the pressure, it is placed under natural conditions to cool to room temperature, and the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape is completed.

[0065] For example, two copper-encapsulated, 12 mm wide high-temperature superconducting tapes are selected as the first high-temperature superconducting tape and the second high-temperature superconducting tape, respectively. The surface copper layer of the first high-temperature superconducting tape and the second high-temperature superconducting tape is polished with sandpaper, the polishing length is 30 mm, and the surface of the first high-temperature superconducting tape and the second high-temperature superconducting tape is wiped with alcohol after polishing. The first high-temperature superconducting tape and the second high-temperature superconducting tape are respectively polished with sandpaper, and the surface copper layer of the first high-temperature superconducting tape and the second high-temperature superconducting tape are polished with sandpaper, and the polishing length is 30 mm. After polishing, the surface of the first high-temperature superconducting tape and the second high-temperature superconducting tape are wiped with alcohol. Figure 2 Cutting is performed by the method shown in the figure, with a bevel angle of 30°, and wiped with alcohol after bevel cutting. The Sn63Pb37 solder is evenly applied to the copper layer surface where the first high-temperature superconducting tape and the second high-temperature superconducting tape need to be bonded. The length of the solder coating area is 30 mm, which is the welding length. The first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are realized as follows Figure 3 The joints were aligned and fitted in a face-to-face manner as shown, placed on a welding table, and subjected to a pressure of 6 MPa, maintained at 183 °C for 2 min, and then the pressure was removed and allowed to cool to room temperature under natural conditions. Finally, the joint welding was completed, and the resistance value of the joint at 77 K reached the nano-ohm level (1.5×10 -9 Ω), the joint shear strength can reach 50MPa.

[0066] By implementing the low-resistance high-temperature superconducting tape joint welding method, the following beneficial effects are achieved:

[0067] 1. The welding method of the present invention is based on the "face-to-face" lap joint welding method of high-temperature superconducting tapes. It adopts the optimized welding parameter configuration and can stably obtain low-resistance joints. The joint resistance value at 77K reaches the nano-ohm level, which is 10 times higher than that of existing joint welding technology. -8 Ohm, the joint resistance obtained using the proposed welding method is 10 times lower than that of the prior art.

[0068] 2. The welding method of the present invention requires simple operation, low welding temperature, short welding time, has no effect on the superconducting properties of the high-temperature superconducting tape, and the critical current of the tape does not change before and after welding.

[0069] 3. The superconducting tape joint obtained by the inventive welding method has excellent mechanical properties. The optimized welding angle and welding length are used to improve the current-carrying characteristics of the joint under stress and strain. Therefore, this type of welded joint has higher mechanical strength, and the joint shear strength is greater than 30MPa.

[0070] Based on the above method embodiment, the present invention provides a corresponding device embodiment.

[0071] like Figure 4 As shown, an embodiment of the present invention provides a low-resistance high-temperature superconducting tape joint welding device, comprising: a welding material acquisition module, a beveling processing module, a solder adding module and a welding module;

[0072] The welding material acquisition module is used to obtain the first high-temperature superconducting tape and the second high-temperature superconducting tape;

[0073] The beveling processing module is used to bevel the welding joint of the first high-temperature superconducting tape and the welding joint of the second high-temperature superconducting tape at a preset beveling angle to obtain the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded;

[0074] The solder adding module is used to evenly apply the tin-lead alloy solder to the surface of the copper layer that needs to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded are welded, and after the tin-lead alloy solder is applied, the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are bonded, and the bonding area is used as the welding area;

[0075] The welding module is used to apply a preset pressure to the welding area, adjust the temperature of the welding area to a preset temperature and maintain it for a preset time, remove the preset pressure after the preset time to cool the welding area to room temperature, and complete the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape.

[0076] In a preferred embodiment, it also includes a pre-processing module;

[0077] The pretreatment module is used to grind the surface copper layers of the first high-temperature superconducting tape and the second high-temperature superconducting tape with sandpaper, and wipe the surfaces of the first high-temperature superconducting tape and the second high-temperature superconducting tape with alcohol after grinding.

[0078] It should be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the accompanying drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art may understand and implement it without paying any creative effort.

[0079] Those skilled in the art can clearly understand that for the sake of convenience and brevity, the specific working process of the device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0080] The terminal device may be a computing device such as a desktop computer, a notebook, a PDA, a cloud server, etc. The terminal device may include, but is not limited to, a processor and a memory.

[0081] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the terminal device, and uses various interfaces and lines to connect various parts of the entire terminal device.

[0082] The memory can be used to store the computer program, and the processor realizes various functions of the terminal device by running or executing the computer program stored in the memory and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required for a function, etc.; the data storage area can store data created according to the use of the mobile phone, etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0083] The storage medium is a computer-readable storage medium, and the computer program is stored in the computer-readable storage medium. When the computer program is executed by the processor, the steps of each of the above-mentioned method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, USB flash drive, mobile hard disk, magnetic disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium.

[0084] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A low resistance high temperature superconducting tape joint welding method, characterized in that: include: Obtaining a first high temperature superconducting tape and a second high temperature superconducting tape; Beveling the welded joint of the first high-temperature superconducting tape and the welded joint of the second high-temperature superconducting tape at a preset beveling angle to obtain a first high-temperature superconducting tape to be welded and a second high-temperature superconducting tape to be welded; Uniformly applying tin-lead alloy solder to the surface of the copper layer to be bonded when welding the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded, and bonding the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded after the tin-lead alloy solder is applied, and using the bonding area as the welding area; Apply a preset pressure to the welding area, adjust the temperature of the welding area to a preset temperature and maintain it for a preset time, remove the preset pressure after the preset time to cool the welding area to room temperature, and complete the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape.

2. A low resistance high temperature superconducting tape joint welding method as claimed in claim 1, characterized in that: After obtaining the first high temperature superconducting tape and the second high temperature superconducting tape, the method further includes: The surface copper layers of the first high temperature superconducting tape and the second high temperature superconducting tape were polished with sandpaper, and the surfaces of the first high temperature superconducting tape and the second high temperature superconducting tape were wiped with alcohol after polishing.

3. A low resistance high temperature superconducting tape joint welding method as claimed in claim 1, characterized in that: The tin-lead alloy solder consists of 63 percent tin and 37 percent lead.

4. A low resistance high temperature superconducting tape joint welding method as claimed in claim 1, characterized in that: The preset bevel angle is greater than or equal to 30° and the preset bevel angle is less than or equal to 90°.

5. A low resistance high temperature superconducting tape joint welding method as claimed in claim 1, characterized in that: The method of uniformly applying the tin-lead alloy solder to the surface of the copper layer to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded include: The tin-lead alloy solder is evenly applied in a preset length on the surface of the copper layer to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded are welded; wherein the preset length is greater than or equal to 30 mm and the preset length is less than or equal to 50 mm.

6. A low resistance high temperature superconducting tape joint welding method as claimed in claim 1, characterized in that: The preset pressure is greater than or equal to 4 MPa and the preset pressure is less than or equal to 6 MPa.

7. A low resistance high temperature superconducting tape joint welding method as claimed in claim 1, characterized in that: The preset temperature is greater than or equal to 183 degrees Celsius and the preset temperature is less than or equal to 200 degrees Celsius.

8. A low resistance high temperature superconducting tape joint welding method as claimed in claim 1, characterized in that: The preset duration is greater than or equal to 2 minutes and the preset duration is less than or equal to 5 minutes.

9. A low resistance high temperature superconducting tape joint welding device, characterized in that: include: A welding material acquisition module, a beveling processing module, a solder adding module and a welding module; The welding material acquisition module is used to obtain the first high-temperature superconducting tape and the second high-temperature superconducting tape; The beveling processing module is used to bevel the welding joint of the first high-temperature superconducting tape and the welding joint of the second high-temperature superconducting tape at a preset beveling angle to obtain the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded; The solder adding module is used to evenly apply the tin-lead alloy solder to the surface of the copper layer that needs to be bonded when the first high-temperature superconducting tape welding joint to be welded and the second high-temperature superconducting tape welding joint to be welded are welded, and after the tin-lead alloy solder is applied, the first high-temperature superconducting tape to be welded and the second high-temperature superconducting tape to be welded are bonded, and the bonding area is used as the welding area; The welding module is used to apply a preset pressure to the welding area, adjust the temperature of the welding area to a preset temperature and maintain it for a preset time, remove the preset pressure after the preset time to cool the welding area to room temperature, and complete the welding of the first high-temperature superconducting tape and the second high-temperature superconducting tape.

10. A low resistance high temperature superconducting tape joint welding device as claimed in claim 9, characterized in that: It also includes a pre-processing module; The pretreatment module is used to grind the surface copper layers of the first high-temperature superconducting tape and the second high-temperature superconducting tape with sandpaper, and wipe the surfaces of the first high-temperature superconducting tape and the second high-temperature superconducting tape with alcohol after grinding.

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