Plane processing device and method with inclination detection and compensation capability

Abstract

The invention discloses a plane machining device and method with inclination detection and compensation capacity. The device comprises a workpiece clamping and posture adjusting mechanism, an in-situ measuring and machining mechanism, a single-axis motion platform, a working base table and an auxiliary system. The workpiece clamping and posture adjusting mechanism is responsible for fixing the workpiece, turning over the workpiece and adjusting the inclination angle theta of the workpiece. And the in-situ measuring and processing mechanism adopts a contourgraph to synchronously measure the workpiece and the reference platform, realizes comprehensive scanning of a to-be-processed surface of the workpiece through cooperative operation of the workpiece clamping and posture adjusting mechanism and the single-axis motion platform, and performs processing based on a generated processing program. In the machining process, the device adopts an arc interpolation technology to machine a workpiece. And the auxiliary system is responsible for cleaning and recycling chippings generated in the machining process. According to the equipment disclosed by the invention, through different configuration modes of the subsystems, diversified in-situ measurement and processing methods with inclination detection and compensation capabilities can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical parts precision machining, and in particular to a plane machining device and method with tilt detection and compensation capabilities, which are suitable for precision machining of various mechanical parts, including but not limited to key parts such as valve flaps. Background Art

[0002] In the process of finishing mechanical parts, it is crucial to ensure machining accuracy and efficiency. At present, the finishing technology of mechanical parts mainly faces two major challenges: the problem of integrated machining and measurement and the problem of metal sealing for machining accuracy. The problem of integrated machining and measurement refers to the need to effectively match the corresponding mating surface when precisely adjusting mechanical parts, while the traditional machining method is mostly single-sided grinding, which has the problems of secondary clamping error and low efficiency. Implementing closed-loop machining with "integrated machining and measurement" is a key means to ensure the adjustment accuracy of the mating surfaces on both sides of mechanical parts. Regarding the problem of metal sealing for machining accuracy, since the sealing surface may no longer be symmetrical due to force deformation, wear and erosion during use, if the original theoretical split-face symmetry machining is still used, it is difficult to achieve matching sealing between parts and mating parts, which is easy to cause internal leakage. In addition, the sealing effect of mechanical parts may also be affected by factors such as deformation, thrust and pressure, and guidance and constraint during opening and closing. Therefore, designing a plane machining device and method with tilt detection and compensation capabilities is of great value and significance for improving the machining quality and sealing performance of mechanical parts. Summary of the invention

[0003] The purpose of the present invention is to provide a plane processing device and method with tilt detection and compensation capabilities. The processing device is equipped with a double-sided laser profiler to realize online measurement, and simultaneously measures the workpiece and the reference reference platform, and eliminates axis jump with the reference reference platform as the reference. The processing device processes the workpiece to eliminate the processing surface / subsurface damage to the maximum extent, and ensures the stability, precision, and reliability of the processing device.

[0004] To achieve the above objectives, the present invention provides the following technical solutions: a plane processing device and method with tilt detection and compensation capabilities, including a workpiece clamping and posture adjustment device, an in-situ measurement and processing device, a single-axis motion platform, a work base, and an auxiliary system.

[0005] The workpiece clamping and posture adjustment device is composed of a workpiece clamping device, a cradle and a turntable, and is used to fix the workpiece, and can also turn over the workpiece to be processed surface and adjust the inclination angle θ of the workpiece.

[0006] The in-situ measurement and processing device includes an in-situ measurement device, a processing device, a motion platform and a reference base platform; the in-situ measurement device drives the motion platform to perform high-precision measurement of the workpiece and the reference motion platform, and through the coordinated work of the workpiece clamping and posture adjustment device and the single-axis motion platform, a comprehensive scan of the workpiece surface to be processed is achieved and a processing program is generated, and then the processing device processes the workpiece by circular interpolation.

[0007] The single-axis motion platform includes a linear slide for adjusting the position change of the workpiece clamping and posture adjustment device in the in-situ measurement and processing device.

[0008] The work base is a platform for fixing the workpiece clamping and posture adjustment device, the in-situ measurement and processing device, the single-axis motion platform and the auxiliary system, and is used to carry the entire plane processing device.

[0009] The auxiliary system is used to purify the debris generated by the recycling process.

[0010] Furthermore, the workpiece clamping and posture adjustment device includes a workpiece clamping device, a cradle R and a turntable C; the cradle R is installed directly above the single-axis motion platform, the turntable C is installed above the cradle, and the workpiece clamping device is installed above the turntable C. The turntable C flips the workpiece and adjusts the inclination angle of the workpiece in combination with the cradle R, and then moves to a fixed position for processing.

[0011] Furthermore, the workpiece clamping device includes two zero-point chucks, a pull pin and a workpiece fixing. The clamping chassis is installed above the turntable C. Two zero-point chucks are installed above the clamping chassis and are connected to the workpiece fixing using a pull pin. During operation, the workpiece is hoisted from above on the workpiece fixing, and then the workpiece fixing is connected to the clamping chassis using the pull pin.

[0012] Furthermore, the in-situ measurement and processing device includes an in-situ measurement device, a processing device, a motion platform and a reference reference platform; the in-situ measurement and processing device uses a profiler to simultaneously perform high-precision measurements on the workpiece and the reference reference platform, and through the coordinated work of the workpiece clamping and posture adjustment device and the single-axis motion platform, a comprehensive scan of the workpiece surface to be processed is achieved and processing instructions are generated, and then the processing device processes the workpiece.

[0013] Furthermore, the in-situ measuring device includes a turntable P, a Z1-axis linear slide and a profilometer. The turntable P is installed above the reference datum platform side, the Z1-axis linear slide is installed on the turntable P, and the profilometer is installed above the linear slide through an adapter plate. The workpiece and the reference datum platform are measured at the same time. The turntable P and the Z1-axis linear slide are used to perform circular scanning of the workpiece, which can cover a wide range of workpiece contour measurement.

[0014] Furthermore, the processing device includes an air floating platform, a processing spindle, a tool, a Z2-axis linear slide and a Y-axis linear slide. The Y-axis linear slide is horizontally installed above the Z2-axis linear slide, and the air floating platform is installed above the Y-axis linear slide through an adapter plate. The air floating platform is connected to the processing spindle, and the tool is installed above the processing spindle. The data of the reference reference platform and the workpiece are measured by a profiler. Based on the data of the reference reference platform, the Z2-axis linear slide and the Y-axis linear slide are moved so that the tool reaches the surface of the workpiece to be processed for processing.

[0015] Furthermore, the profiler is fixed on the reference datum platform through a turntable P and a Z1-axis linear slide. The profiler collects two sets of geometric shape data by scanning the reference datum platform and the workpiece plane. The first scan data of the reference datum platform is used as a reference standard to calculate the geometric shape difference between the two planes for evaluating and comparing the geometric shape difference between the two planes. The Z1-axis linear slide is moved up and down to adapt to different workpiece sizes, and the workpiece surface to be processed is measured by rotating the turntable P. In order to eliminate the axial runout caused by movement, when the profiler moves in the plane and scans, if the geometric shape data value of the reference datum platform is measured to increase, the measurement data of the workpiece plane is adjusted accordingly to reduce its value to compensate for the increase in the reference datum platform data; conversely, if the geometric shape data value of the reference datum platform is reduced, the measurement data of the workpiece plane is adjusted accordingly to increase its value to compensate for the decrease in the reference datum platform data. In this way, the data of the reference datum platform is used as the measurement reference, and the axial runout error caused by movement of the profiler during plane scanning can be effectively eliminated.

[0016] Furthermore, in the design of the motion platform, in order to improve the rigidity of the process system of the processing equipment, a high-rotational precision turntable is adopted to ensure smooth movement. The transmission systems of each axis are driven by a servo motor with a high-precision ball screw. Hydrostatic guide rails are used in the XYZ directions, and a fully closed-loop control circuit is formed by a linear grating with nanometer resolution. The guide rails adopt a block structure, which has more reasonable processability and sufficient rigidity, and can achieve high processing accuracy, thereby maintaining high linear motion accuracy and high rigidity.

[0017] like Figure 7 As shown, a method for realizing a plane processing device with tilt detection and compensation capabilities is based on the plane processing device. When the in-situ measuring device and the processing device in the device are separate mechanisms, the workpiece follows the movement of the single-axis motion platform, and the workpiece moves back and forth between the measuring device and the processing device to complete the measurement and processing operations. The method specifically includes the following steps: Step 1, hoisting the workpiece (5) onto the workpiece clamping and posture adjustment device (1); Step 2: adjusting the inclination angle of the surface to be processed of the workpiece (5) by means of the cradle R (102) so that the surface to be processed of the workpiece (5) remains substantially parallel to the reference datum platform (204); Step 3, the workpiece clamping and posture adjustment device (1) moves with the single-axis motion platform (3) to the position of the measuring device (201), the profiler (201-4) moves on the Z1 linear axis so that the scanning range of the profiler (201-4) can cover the contour of the workpiece (5), the turntable P (201-1) drives the Z1 axis linear slide (201-2) and the profiler (201-4) to rotate together, and the profiler (201-4) measures the plane data of the reference reference platform (204) and the contour of the entire workpiece (5); Step 4: Analyze and process the data measured by the profiler (201-4) to obtain the plane data m of the profile of the workpiece (5) after eliminating the axial runout. 2_workpiece , the measuring device (201) is based on m 2_workpiece Generate the surface shape of the workpiece (5) to be processed, and the measuring device (201) generates a processing instruction; Step 5: After the processing instruction is generated, the turntable C (103) rotates to flip the surface of the workpiece (5) to be processed, and the workpiece clamping and posture adjustment device (1) moves to the position of the processing device (202) together with the single-axis motion platform (3), and the Z2 axis (202-1) and the Y-axis linear slide (202-2) cooperate to adjust the position of the tool (202-5), and the tool (202-5) processes the workpiece (5) according to the processing program; Step 6: measuring the plane data of the workpiece (5) and the reference datum platform (204) again by using the profilometer (201-4); Step 7: The whole process is repeated until the processing requirements are met.

[0018] The specific implementation of eliminating axial runout is as follows: The data of the reference platform (204) measured for the first time is recorded as m 1_basis , and then the data of the reference platform (204) measured by the profiler is recorded as f (p i ); The contour data of the workpiece (5) measured for the first time is recorded as m 1_workpiece , and then the contour data of the workpiece (5) measured by the contour meter is recorded as g (p i ); Since the profiler will cause axial runout during movement, the plane data of the reference platform and the plane data of the workpiece contour obtained by measurement will have runout errors. 1_basis and f (p i ) is recorded ase s_basis , m 1_workpiece and g (p i ) is recorded as e s_workpiece ; The plane data of the reference datum platform and the workpiece contour data obtained by the profiler are taken as the reference data. Theoretically, the second measurement is m 1_basis and f (p i ) should be equal to m 1_workpiece and g (p i ) keep the runout error consistent, and use e s_basis compensate g (p i ) can obtain the workpiece contour data after eliminating axial runout.

[0019] Further, such as Fig.11 As shown, a method for realizing a plane processing device with tilt detection and compensation capabilities is based on the plane processing device. When the in-situ measurement device and the processing device in the device are an integrated mechanism, the structure is simple and clear, and specifically includes the following steps: Step 1, hoisting the workpiece (5) onto the workpiece clamping and posture adjustment device (1); Step 2: adjusting the inclination angle of the surface to be processed of the workpiece (5) by means of the cradle R (102) so that the surface to be processed of the workpiece (5) remains substantially parallel to the reference datum platform (204); Step 3, the profiler (201-4) moves on the Z1-axis linear slide (201-2) so that the scanning range of the profiler (201-4) can cover the contour of the workpiece (5), the turntable P (201-1) drives the Z1-axis linear slide (201-2) and the profiler (201-4) to rotate together, and the profiler (201-4) measures the plane data of the reference reference platform (204) and the contour of the entire workpiece (5); Step 4: Analyze and process the data measured by the profiler (201-4) to obtain the plane data m of the profile of the workpiece (5) after eliminating the axial runout. 2_workpiece , the measuring device (201) is based on m 2_workpiece Generate the surface shape of the workpiece (5) to be processed, and the measuring device (201) generates a processing instruction; Step 5: After the processing instruction is generated, the processing device (202) moves and adjusts the position of the tool (202-5) on the Z1-axis linear slide (201-2), and the tool (202-5) processes the workpiece (5) according to the processing program; Step 6: measuring the plane data of the workpiece (5) and the reference datum platform (204) again by using the profilometer (201-4); Step 7: The whole process is repeated until the processing requirements are met.

[0020] Compared with the prior art, the present invention has the following beneficial effects: The present invention uses the working base as the installation reference, measures the sealing surface of the workpiece and measures the reference reference platform at the same time, which can eliminate the deformation error of the measuring arm caused by gravity factors; the present invention designs multiple protection functions such as mechanical limit protection, fastening device design, measurement path protection, sensor measurement monitoring alarm protection, system zero path protection, power-off protection, and system restart protection; the processing equipment of the present invention all adopts anti-radiation protection treatment, and the relevant core components adopt a new boron carbide composite material as a radiation-proof shell; in the measurement and processing method of the present invention, a profiler is used to synchronously measure the workpiece and the reference reference platform, eliminate axis jump and generate processing instructions for processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a diagram of the overall structure of the system of the present invention.

[0022] Figure 2 It is a schematic diagram of the working structure of the device of the first embodiment of the present invention.

[0023] Figure 3 Schematic diagram of a workpiece clamping and posture adjustment device according to a first embodiment of the present invention.

[0024] Figure 4 Schematic diagram of a workpiece fixing device according to a first embodiment of the present invention.

[0025] Figure 5 It is a schematic diagram of a method for eliminating shaft jump when measuring a workpiece according to the first embodiment of the present invention.

[0026] Figure 6 It is a schematic diagram of an on-site measurement and processing device according to a first embodiment of the present invention.

[0027] Figure 7 Schematic diagram of the working process of the first embodiment of the present invention.

[0028] Figure 8 It is a schematic diagram of the working structure of the device of the second embodiment of the present invention.

[0029] Fig. 9 Schematic diagram of a method for eliminating shaft jump when measuring a workpiece according to a second embodiment of the present invention.

[0030] Fig.10 Schematic diagram of an on-site measurement and processing device according to a second embodiment of the present invention.

[0031] Fig.11 Schematic diagram of the working process of the second embodiment of the present invention. DETAILED DESCRIPTION

[0032] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0033] The embodiments of the present invention relate to a processing device and method with tilt detection and compensation capabilities, which can be used for in-situ measurement and processing of workpieces.

[0034] [1] First Embodiment In the figure: 1. workpiece clamping and posture adjustment device; 101. workpiece clamping device; 102. cradle R; 103. turntable C; 101-1. clamping chassis; 101-2. zero-point chuck; 101-3. rivet; 101-4. workpiece fixing piece; 2. in-situ measurement and processing device; 201. in-situ measurement system; 202. processing device; 203. motion platform; 204. reference datum platform; 205. slip ring; 201-1. turntable P; 201-2. Z1-axis linear slide; 201-3. adapter plate; 201-4. profiler; 202-1. Z2-axis linear slide; 202-2. Y-axis linear slide; 202-3. air floating platform; 202-4. processing spindle; 202-5. tool; 3. single-axis motion platform; 4. working base; 5. workpiece.

[0035] The following is a first embodiment of the present invention and combined with the accompanying drawings to further describe the technical solution of the present invention; like Figure 1 , Figure 2 As shown, a plane processing device with tilt detection and compensation capabilities comprises a working base (4) and a single-axis motion platform (3) installed on the upper part of the working base (4), a workpiece clamping and posture adjustment device (1) is installed on the upper part of the single-axis motion platform (3), and an in-situ measurement and processing device (2) is a split structure installed on two columns of the working base (4), wherein the in-situ measurement device (201) is installed on the inner side of one column, and the processing device (202) is installed on the inner side of the other column. The entire plane processing device is a mobile processing structure integrating measurement and processing.

[0036] As an improved specific implementation method, the processing device in the split structure includes 7-axis motion, and all motion systems include multiple sets of limit switches to ensure that the detection system cannot contact the workpiece under any circumstances, thereby protecting the workpiece from accidental damage by the processing machine.

[0037] like Figure 2 , Figure 3As shown, the workpiece clamping and posture adjustment device (1) comprises a workpiece clamping device (101), a cradle R (102) and a turntable C (103); the cradle R (102) is installed directly above the single-axis motion platform (3), the turntable C (103) for rotating the workpiece is installed above the cradle R (102), the workpiece clamping device (101) is installed above the turntable C (103), the turntable C (103) rotates and turns the workpiece (5) and adjusts the vertical tilt angle of the workpiece (5) in combination with the cradle R (102) before moving to a fixed position for processing.

[0038] like Figure 4 As shown, the workpiece clamping device (101) comprises two zero-point chucks (101-2), a rivet (101-3) and a workpiece fixing member (101-4); the bottom surface of the clamping chassis (101-1) is mounted above the turntable C (103); the inner bottom surface of the clamping chassis (101-1) is provided with two through holes, which are respectively used to install the two zero-point chucks (101-2); corresponding to the positions of the two through holes of the clamping chassis (101-1), the inner bottom surface of the workpiece fixing member (101-4) is also provided with two through holes; the two rivets (101-3) are respectively connected to the two zero-point chucks (101-2) after passing through the two through holes of the inner bottom surface of the workpiece fixing member (101-4).

[0039] The workpiece fixing piece (101-4) and the clamping chassis (101-1) are U-shaped; two outer side surfaces of the workpiece fixing piece (101-4) are provided with protrusions of a clamping groove; and the inner side surface of the U-shaped clamping chassis (101-1) is provided with a clamping groove matching the protrusion.

[0040] During operation, the workpiece (5) is hoisted from above, the protrusion on the workpiece fixing member (101-4) is mounted in the slot of the clamping chassis (101-1) to complete the hoisting, and then the bottom surface of the workpiece fixing member (101-4) is connected to the bottom surface of the clamping chassis (101-1) through the rivet (101-3) and the zero point chuck (101-2).

[0041] like Figure 5As shown, the profiler (201-4) collects two sets of plane data by scanning the reference reference platform (204) and the workpiece (5) plane. The first scan data of the reference reference platform (204) is used as the reference standard data to calculate the difference between the two planes (the reference reference platform and the workpiece plane). The Z1 axis linear slide (201-2) moves up and down to adapt to different sizes of the workpiece (5), and the turntable P (201-1) is rotated to measure the workpiece (5) to-be-processed surface. In order to eliminate axial runout caused by movement, when the profiler (201-4) moves in the plane and scans, if the data of the reference reference platform (204) increases, the measurement data of the workpiece (5) plane is reduced accordingly; conversely, if the data of the reference reference platform (204) decreases, the measurement data of the workpiece (5) plane is increased accordingly. In this way, the data of the reference reference platform (204) is used as the measurement reference, and the axial runout error caused by movement of the profiler (201-4) during the plane scanning process can be effectively eliminated.

[0042] like Figure 3 , 4 As shown in , 6, the on-site measurement and processing device (2) comprises an on-site measurement device (201), a processing device (202), a motion platform (203) and a reference base platform (204). The single-axis motion platform (3) drives the workpiece clamping and posture adjustment device (101) to move the workpiece (5) to the on-site measurement device (201), and the on-site measurement and processing device (2) uses a profiler (201-4) to simultaneously perform high-precision measurement on the workpiece (5) and the reference base platform (204). After the measurement is completed, the single-axis motion platform (3) drives the workpiece clamping and posture adjustment device (101) to move the workpiece (5) to the processing device (202) to process the workpiece (5). Through the coordinated work of the workpiece clamping and posture adjustment device (101) and the single-axis motion platform (3), a comprehensive scan of the workpiece (5) to be processed is achieved, and after a processing instruction is generated, the processing device (202) processes the workpiece (5).

[0043] like Figure 6As shown, the in-situ measurement device (201) comprises a turntable P (201-1), a Z1-axis linear slide (201-2) and a profiler (201-4); one side of the turntable P (201-1) is mounted above the inner side of a reference datum platform (204); the Z1-axis linear slide (201-2) is mounted on the other side of the turntable P (201-1); and the profiler (201-4) is mounted above the Z1 linear slide (201-2) via an adapter plate (201-3). The profiler (201-4) measures the workpiece (5) and the reference datum platform (204) simultaneously. The turntable P (201-1) can drive the Z1 axis linear slide (201-2) to rotate perpendicularly to the reference datum platform (204). The profiler (201-4) can move vertically up and down along the Z1 axis linear slide (201-2). Therefore, the turntable P (201-1) and the Z1 axis linear slide (201-2) can be used to perform a circular scan of the workpiece (5), thereby measuring the profile of the workpiece (5).

[0044] like Figure 6 As shown, the processing device (202) includes an air-floating platform (202-3), a processing spindle (202-4), a tool (202-5), a Z2-axis linear slide (202-1) and a Y-axis linear slide (202-2), one side of the Z2-axis linear slide (202-1) is installed on the inner side of the column, the Y-axis linear slide (202-2) is installed horizontally above the other side of the Z2-axis linear slide (202-1), and the air-floating platform (202-3) is installed on the Y-axis linear slide (202 -2), the air-floating platform (202-3) is connected to the machining spindle (202-4), the tool (202-5) is installed above the machining spindle (202-4), the data of the reference reference platform (204) and the workpiece (5) are measured by the profiler (201-4), and the Z2-axis linear slide (202-1) and the Y-axis linear slide (202-2) are moved based on the data of the reference reference platform (204) so ​​that the tool reaches the surface to be machined of the workpiece (5) for machining; In the design of the present invention, it is recommended that the reference base platform and the working base be made of marble material, and the flatness is strictly controlled to reduce the amplitude of data changes of the profilometer (201-4) during the scanning process, thereby ensuring the accuracy and stability of the measurement results; [2] Second Embodiment Regarding a processing device and method with tilt detection and compensation capabilities according to a second embodiment of the present invention, the differences from the first embodiment are described.

[0045] like Figure 8As shown, a processing device with tilt detection and compensation capabilities according to a second embodiment of the present invention comprises a workpiece clamping and posture adjustment device (101) installed on a work base (4), and an in-situ measurement and processing device (2) installed on the side of the workpiece clamping and posture adjustment device (101); the in-situ measurement and processing device (2) comprises a profiler (201-4), a Z1-axis linear slide (201-2), a processing device (202), a turntable C (103), a slip ring (205) and a reference datum platform (204); the turntable P (201-1) is installed on the reference datum platform (204) and converges the wire harness through the slip ring (205); the Z1-axis linear slide (201-2) The processing device (202) and the profiler (201-4) are respectively installed on both sides of the Z1-axis linear slide (201-2) and rotate together with the Z1-axis linear slide (201-2). The second embodiment and the first embodiment have the same structure in the two parts of the workpiece clamping and posture adjustment device (101) and the processing device (202). The in-situ measurement and processing device (2) of the first embodiment is a split structure, and the workpiece needs to be turned over for processing after the measurement is completed. The in-situ measurement and processing device (2) of the second embodiment is an integrated structure, and can be processed without turning over after the measurement is completed.

[0046] like Fig. 9As shown, the profiler (201-4) is fixed on the Z1-axis linear slide (201-2), and the profiler (201-4) moves on the Z1-axis linear slide (201-2) to adapt to different workpiece sizes. The rotation of the turntable C (103) drives the profiler (201-4) to rotate around the axis of the workpiece (5) to be measured, and scans the workpiece (5) to be measured surface and the reference reference platform (204) at the same time, and collects two sets of geometric shape data. The first scanning data of the reference reference platform (204) is used as a reference standard to calculate the geometric shape difference between the two planes, which is used to evaluate and compare the geometric shape difference between the two planes. In order to eliminate the axial runout caused by movement, when the profiler (201-4) moves in the plane and performs scanning, if the measured geometric shape data value of the reference reference platform (204) increases, the measured data of the plane of the workpiece (5) is adjusted accordingly to reduce its value to compensate for the increase of the data of the reference reference platform (204); conversely, if the geometric shape data value of the reference reference platform (204) decreases, the measured data of the plane of the workpiece (5) is adjusted accordingly to increase its value to compensate for the decrease of the data of the reference reference platform (204). In this way, the data of the reference reference platform (204) is used as the measurement reference, and the axial runout error caused by the movement of the profiler (201-4) during the plane scanning process can be effectively eliminated; after the measurement is completed, a processing instruction is generated, and the rotation of the turntable C (103) drives the processing device (202) to rotate around the axis of the workpiece (5) to be measured to process the surface to be processed of the workpiece (5).

[0047] like Fig.10 As shown, the in-situ measuring device (201) is installed on the lower side of the Z1-axis linear slide (201-2), the processing device (202) is installed on the lower side of the Z1-axis linear slide (201-2), the Z1-axis linear slide (201-2) is installed above the turntable P (201-1), the in-situ measuring device (201) and the processing device (202) follow the Z1-axis linear slide (201-2) and rotate with the turntable P (201-1), the in-situ measuring device and the processing device (202) are for same-side measurement and processing, when working, the in-situ measuring device (201) rotates and scans to obtain information of the reference reference platform (204) and the surface to be processed of the workpiece (5), generates a processing instruction, and then the cradle R (102) compensates for the tilt angle of the workpiece (5), the in-situ measuring device (201) stops working, and the processing device (202) processes the surface to be processed of the workpiece (5) through linear interpolation.

[0048] The auxiliary system equipped in the present invention has cooling and purification functions, can effectively recycle the debris generated during the processing, realize self-cleaning, ensure that there is no residual pollutants, and effectively prevent the pollution and cleaning problems of the processing fluid. The auxiliary system uses a self-priming spray method to cool and purify in a closed space, and directly sprays the cooling mixed oil mist onto the processing head and the workpiece through positive pressure. At the same time, the debris generated by the processing is sucked into the purification system under the action of negative pressure and purified through filtration.

[0049] The above-described embodiments are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A plane processing device with tilt detection and compensation capabilities, comprising a workpiece clamping and posture adjustment device (1), an in-situ measurement and processing device (2), a single-axis motion platform (3), a work base (4) and an auxiliary system, characterized in that: A single-axis motion platform (3) is mounted on the upper part of a working platform (4), a workpiece clamping and posture adjustment device (1) is mounted on the upper part of the single-axis motion platform (3), and an in-situ measurement and processing device (2) is a split structure and is mounted on two columns of the working platform (4), wherein the in-situ measurement device (201) is mounted on the inner side of one column, and the processing device (202) is mounted on the inner side of another column; The workpiece clamping and posture adjustment device (1) comprises a workpiece clamping device (101), a cradle R (102) and a turntable C (103); the cradle R (102) is installed directly above the single-axis motion platform (3); a turntable C (103) for rotating the workpiece is installed above the cradle R (102); the workpiece clamping device (101) is installed above the turntable C (103); the turntable C (103) rotates and turns the workpiece (5) and adjusts the vertical tilt angle of the workpiece (5) in combination with the cradle R (102) before moving to a fixed position for processing; The on-site measurement and processing device (2) comprises an on-site measurement device (201), a processing device (202), a motion platform (203) and a reference base platform (204); The single-axis motion platform (3) drives the workpiece clamping and posture adjustment device (101) to move the workpiece (5) to the in-situ measurement device (201), and the in-situ measurement and processing device (2) uses a profilometer (201-4) to simultaneously perform high-precision measurement on the workpiece (5) and the reference datum platform (204); after the measurement, the single-axis motion platform (3) drives the workpiece clamping and posture adjustment device (101) to move the workpiece (5) to the processing device (202) to process the workpiece (5); through the coordinated operation of the workpiece clamping and posture adjustment device (101) and the single-axis motion platform (3), a comprehensive scan of the surface to be processed of the workpiece (5) is achieved, and after a processing instruction is generated, the processing device (202) processes the workpiece (5); The auxiliary system is used to purify the debris generated by the recycling process.

2. A plane processing device with tilt detection and compensation capabilities according to claim 1, characterized in that: The workpiece clamping device (101) comprises two zero-point chucks (101-2), a rivet (101-3) and a workpiece fixing member (101-4); the bottom surface of the clamping chassis (101-1) is mounted above the turntable C (103); the inner bottom surface of the clamping chassis (101-1) is provided with two through holes, which are respectively used to install the two zero-point chucks (101-2); corresponding to the positions of the two through holes of the clamping chassis (101-1), the inner bottom surface of the workpiece fixing member (101-4) is also provided with two through holes; the two rivets (101-3) are respectively connected to the two zero-point chucks (101-2) after passing through the two through holes of the inner bottom surface of the workpiece fixing member (101-4); The workpiece fixing piece (101-4) and the clamping chassis (101-1) are U-shaped; two outer side surfaces of the workpiece fixing piece (101-4) are provided with protrusions of a clamping groove; and the inner side surface of the U-shaped clamping chassis (101-1) is provided with a clamping groove matching the protrusion; During operation, the workpiece (5) is hoisted from above, the protrusion on the workpiece fixing member (101-4) is installed in the clamping groove of the clamping chassis (101-1) to complete the hoisting, and then the bottom surface of the workpiece fixing member (101-4) is connected to the bottom surface of the clamping chassis (101-1) through the rivet (101-3) and the zero point chuck (101-2).

3. A plane processing device with tilt detection and compensation capabilities according to claim 1, characterized in that: The in-situ measuring device (201) comprises a turntable P (201-1), a Z1 axis linear slide (201-2) and a profiler (201-4); one side of the turntable P (201-1) is mounted on the upper inner side of a reference datum platform (204); the Z1 axis linear slide (201-2) is mounted on the other side of the turntable P (201-1); and the profiler (201-4) is mounted on the upper side of the Z1 linear slide (201-2) via an adapter plate (201-3); the profiler (201-4) The workpiece (5) and the reference datum platform (204) are measured simultaneously, the turntable P (201-1) can drive the Z1 axis linear slide (201-2) to rotate perpendicularly to the reference datum platform (204), and the profiler (201-4) can move vertically up and down along the Z1 axis linear slide (201-2), so that the turntable P (201-1) and the Z1 axis linear slide (201-2) can be used to perform a circular scan of the workpiece (5), thereby performing a profile measurement of the workpiece (5).

4. A plane processing device with tilt detection and compensation capabilities according to claim 1, characterized in that: The processing device (202) comprises an air-floating platform (202-3), a processing spindle (202-4), a tool (202-5), a Z2-axis linear slide (202-1) and a Y-axis linear slide (202-2), one side of the Z2-axis linear slide (202-1) is installed on the inner side of the column, the Y-axis linear slide (202-2) is installed horizontally above the other side of the Z2-axis linear slide (202-1), and the air-floating platform (202-3) is installed on the Y-axis linear slide (202- 2), an air-floating platform (202-3) is connected to a machining spindle (202-4), a tool (202-5) is installed above the machining spindle (202-4), and data of a reference datum platform (204) and a workpiece (5) are measured by a profiler (201-4). Based on the data of the reference datum platform (204), a Z2-axis linear slide (202-1) and a Y-axis linear slide (202-2) are moved so that the tool reaches the surface to be machined of the workpiece (5) for machining.

5. The method for implementing a plane processing device with tilt detection and compensation capabilities according to claim 1, characterized in that: When the in-situ measuring device and the processing device are separate mechanisms, the workpiece follows the movement of the single-axis motion platform, and the workpiece moves back and forth between the measuring device and the processing device to complete the measurement and processing operations, which specifically includes the following steps: Step 1, hoisting the workpiece (5) onto the workpiece clamping and posture adjustment device (1); Step 2: adjusting the inclination angle of the surface to be processed of the workpiece (5) by means of the cradle R (102) so that the surface to be processed of the workpiece (5) remains substantially parallel to the reference datum platform (204); Step 3, the workpiece clamping and posture adjustment device (1) moves with the single-axis motion platform (3) to the position of the measuring device (201), the profiler (201-4) moves on the Z1 linear axis so that the scanning range of the profiler (201-4) can cover the contour of the workpiece (5), the turntable P (201-1) drives the Z1 axis linear slide (201-2) and the profiler (201-4) to rotate together, and the profiler (201-4) measures the plane data of the reference reference platform (204) and the contour of the entire workpiece (5); Step 4: Analyze and process the data measured by the profiler (201-4) to obtain the plane data m of the profile of the workpiece (5) after eliminating the axial runout. 2_workpiece , the measuring device (201) is based on m 2_workpiece Generate the surface shape of the workpiece (5) to be processed, and the measuring device (201) generates a processing instruction; Step 5: After the processing instruction is generated, the turntable C (103) rotates to flip the surface of the workpiece (5) to be processed, and the workpiece clamping and posture adjustment device (1) moves to the position of the processing device (202) together with the single-axis motion platform (3), and the Z2 axis (202-1) and the Y-axis linear slide (202-2) cooperate to adjust the position of the tool (202-5), and the tool (202-5) processes the workpiece (5) according to the processing program; Step 6: measuring the plane data of the workpiece (5) and the reference datum platform (204) again by using the profilometer (201-4); Step 7: The whole process is repeated until the processing requirements are met.

6. A plane processing device with tilt detection and compensation capabilities, characterized in that: It comprises a workpiece clamping and posture adjustment device (101) installed on a work base (4), and an on-site measurement and processing device (2) installed on the side of the workpiece clamping and posture adjustment device (101); the on-site measurement and processing device (2) comprises a profiler (201-4), a Z1-axis linear slide (201-2), a processing device (202), a turntable C (103), a slip ring (205) and a reference datum platform (204); the turntable P (201-1) is installed on the reference datum platform (204) and converges the wire harness through the slip ring (205); the Z1-axis linear slide (201-2) is a single-axis motion and remains parallel to the reference datum platform (204) and is fixed on the turntable C (103); the processing device (202) and the profiler (201-4) are respectively installed on both sides of the Z1-axis linear slide (201-2) and rotate together with the Z1-axis linear slide (201-2); The profiler (201-4) is fixed on the Z1-axis linear slide (201-2). The profiler (201-4) moves on the Z1-axis linear slide (201-2) to adapt to different workpiece sizes. The rotation of the turntable C (103) drives the profiler (201-4) to rotate around the axis of the workpiece (5) for one circle, and simultaneously scans the surface to be measured of the workpiece (5) and the reference datum platform (204), and collects two sets of geometric shape data. After the measurement is completed, a processing instruction is generated, and the rotation of the turntable C (103) drives the processing device (202) to rotate around the axis of the workpiece (5) to process the surface to be processed of the workpiece (5); The in-situ measuring device (201) and the processing device (202) are both installed on the lower side of the Z1-axis linear slide (201-2), and the Z1-axis linear slide (201-2) is installed above the turntable P (201-1). The in-situ measuring device (201) and the processing device (202) rotate along with the Z1-axis linear slide (201-2) and the turntable P (201-1). The in-situ measuring device (201) and the processing device (202) perform measurement and processing on the same side. When working, the in-situ measuring device (201) rotates and scans to obtain information on the reference reference platform (204) and the surface to be processed of the workpiece (5). After generating a processing instruction, the cradle R (102) compensates for the tilt angle of the workpiece (5), and the in-situ measuring device (201) stops working. The processing device (202) processes the surface to be processed of the workpiece (5) through linear interpolation.

7. The method for implementing a plane processing device with tilt detection and compensation capabilities according to claim 6, characterized in that: When the in-situ measuring device is integrated with the processing device, the specific steps include: Step 1, hoisting the workpiece (5) onto the workpiece clamping and posture adjustment device (1); Step 2: adjusting the inclination angle of the surface to be processed of the workpiece (5) by means of the cradle R (102) so that the surface to be processed of the workpiece (5) remains substantially parallel to the reference datum platform (204); Step 3, the profiler (201-4) moves on the Z1-axis linear slide (201-2) so that the scanning range of the profiler (201-4) can cover the contour of the workpiece (5), the turntable P (201-1) drives the Z1-axis linear slide (201-2) and the profiler (201-4) to rotate together, and the profiler (201-4) measures the plane data of the reference reference platform (204) and the contour of the entire workpiece (5); Step 4: Analyze and process the data measured by the profiler (201-4) to obtain the plane data m of the profile of the workpiece (5) after eliminating the axial runout. 2_workpiece , the measuring device (201) is based on m 2_workpiece Generate the surface shape of the workpiece (5) to be processed, and the measuring device (201) generates a processing instruction; Step 5: After the processing instruction is generated, the processing device (202) moves and adjusts the position of the tool (202-5) on the Z1-axis linear slide (201-2), and the tool (202-5) processes the workpiece (5) according to the processing program; Step 6: measuring the plane data of the workpiece (5) and the reference datum platform (204) again by using the profilometer (201-4); Step 7: The whole process is repeated until the processing requirements are met.

8. A method for implementing a plane processing device with tilt detection and compensation capabilities according to claim 5 or 7, characterized in that: The elimination of the axial runout is specifically achieved as follows: The data of the reference platform (204) measured for the first time is recorded as m 1_basis , and then the data of the reference platform (204) measured by the profiler is recorded as f (p i ); The contour data of the workpiece (5) measured for the first time is recorded as m 1_workpiece , and then the contour data of the workpiece (5) measured by the contour meter is recorded as g (p i ); m 1_basis and f (p i ) is recorded as e s_basis , m 1_workpiece and g (p i ) is recorded as e s _workpiece ; The plane data of the reference reference platform (204) and the workpiece contour data obtained by the contour meter are measured for the first time as the reference data; during the second measurement, m 1_basis and f (p i ) should be, m 1_workpiece and g (p i ) keep the runout error consistent, and use e s_basis compensate g (p i ) That is, the workpiece contour data after eliminating axial runout can be obtained.

Images