A planar machining device and method with tilt detection and compensation capabilities

Abstract

The present invention discloses a planar machining device and method with tilt detection and compensation capabilities. The device includes: a workpiece clamping and attitude adjustment mechanism, an in-situ measurement and machining mechanism, a single-axis motion platform, a working base, and an auxiliary system. The workpiece clamping and attitude adjustment mechanism is responsible for fixing the workpiece and can flip the workpiece and adjust the tilt angle θ of the workpiece. The in-situ measurement and machining mechanism uses a profiler to synchronously measure the workpiece and the reference datum platform. Through the coordinated operation of the workpiece clamping and attitude adjustment mechanism and the single-axis motion platform, a comprehensive scan of the workpiece surface to be machined is achieved, and machining is performed based on the generated machining program. During the machining process, the device uses circular interpolation technology to machine the workpiece. The auxiliary system is responsible for cleaning and recycling the debris generated during the machining process. The equipment disclosed in the present invention can implement diversified in-situ measurement and machining methods with tilt detection and compensation capabilities through different configuration methods of the subsystems.

Description

Technical Field

[0001] The present invention relates to the technical field of precision machining of mechanical parts, and specifically to a planar machining device and method with tilt detection and compensation capabilities. It is applicable to the precision machining of various mechanical parts, including but not limited to key components such as valve discs. Background Art

[0002] In the process of precision machining of mechanical parts, ensuring machining accuracy and efficiency is crucial. Currently, the precision machining technology of mechanical parts mainly faces two major challenges: the problem of integrated machining and measurement, and the problem of preparing metal seals for machining accuracy. The problem of integrated machining and measurement refers to the need to effectively match with the corresponding mating surfaces when precisely adjusting mechanical parts. However, traditional machining methods are mostly single-sided grinding machining, which has problems such as secondary clamping errors and low efficiency. Implementing closed-loop machining of "integrated machining and measurement" is the key means to ensure the adjustment accuracy of the bilateral mating surfaces of mechanical parts. Regarding the problem of preparing metal seals for machining accuracy, since the part may undergo force deformation, wear, and erosion during use, resulting in the sealing surface no longer being symmetrical. If the original theoretical split surface symmetry machining and adjustment are still used, it is difficult to achieve the matching seal between the part and the mating part, and internal leakage is likely to occur. In addition, the sealing effect of mechanical parts may also be affected by factors such as deformation, thrust and pressure, and guidance and restraint during opening and closing. Therefore, designing a planar machining device and method with tilt detection and compensation capabilities has important value and significance for improving the machining quality and sealing performance of mechanical parts. Summary of the Invention

[0003] The purpose of the present invention is to provide a planar machining device and method with tilt detection and compensation capabilities. The machining device is equipped with bilateral laser profilometers for on-line measurement, and at the same time measures the workpiece and the reference datum platform. Taking the reference datum platform as the reference to eliminate axis jump, the machining device processes the workpiece to maximize the elimination of machining surface / subsurface damage, and ensures the stability, precision, and reliability performance of the machining device.

[0004] To achieve the above purpose, the present invention provides the following technical solution: A planar machining device and method with tilt detection and compensation capabilities, including a workpiece clamping and attitude adjustment device, an in-situ measurement and machining device, a single-axis motion platform, a working base, and an auxiliary system.

[0005] The workpiece clamping and attitude adjustment device is composed of a workpiece clamping device, a cradle, and a turntable, which is used to fix the workpiece, and can also flip the workpiece's surface to be machined and adjust the tilt angle θ of the workpiece.

[0006] The in-situ measurement and machining device includes an in-situ measurement device, a machining device, a motion platform, and a reference datum platform. The in-situ measurement device drives the motion platform to perform high-precision measurements on the workpiece and the reference motion platform. Through the collaborative work of the workpiece clamping and attitude adjustment device and the single-axis motion platform, a comprehensive scan of the workpiece surface to be machined is achieved, and after generating a machining program, the machining device processes the workpiece by means of circular interpolation.

[0007] The single-axis motion platform includes a linear slide for adjusting the position transformation of the workpiece clamping and attitude adjustment device in the in-situ measurement and machining device.

[0008] The working base is a platform for fixing the workpiece clamping and attitude adjustment device, the in-situ measurement and machining device, the single-axis motion platform, and the auxiliary system, and is used to carry the entire planar machining device.

[0009] The auxiliary system is used for purifying and recycling the debris generated during machining.

[0010] Furthermore, the workpiece clamping and attitude adjustment device includes a workpiece clamping device, a cradle R, and a turntable C. The cradle R is installed directly above the single-axis motion platform, the turntable C is installed above the cradle, and the workpiece clamping device is installed above the turntable C. The turntable C flips the workpiece and adjusts the tilt angle of the workpiece in combination with the cradle R, and then moves to a fixed position for machining.

[0011] Furthermore, the workpiece clamping device includes two zero-point chucks, a pull stud, and a workpiece fixing member. The clamping chassis is installed above the turntable C, and two zero-point chucks are installed above the clamping chassis. The pull stud is used to connect with the workpiece fixing member. During operation, the workpiece is hoisted from above onto the workpiece fixing member, and then the workpiece fixing member is connected to the clamping chassis through the pull stud.

[0012] Furthermore, the in-situ measurement and machining device includes an in-situ measurement device, a machining device, a motion platform, and a reference datum platform. The in-situ measurement and machining device uses a profiler to simultaneously perform high-precision measurements on the workpiece and the reference datum platform. Through the collaborative work of the workpiece clamping and attitude adjustment device and the single-axis motion platform, a comprehensive scan of the workpiece surface to be machined is achieved, and after generating a machining instruction, the machining device processes the workpiece.

[0013] Furthermore, the in-situ measurement device includes a turntable P, a Z1-axis linear slide, and a profiler. The turntable P is installed on the side above the reference datum platform, the Z1-axis linear slide is installed on the turntable P, and the profiler is installed above the linear slide through an adapter plate to simultaneously measure the workpiece and the reference datum platform. The turntable P and the Z1-axis linear slide are used for circumferential scanning of the workpiece, which can cover a large range of workpiece contour measurements.

[0014] Furthermore, the processing device includes an air-floating platform, a processing spindle, a tool, a Z2-axis linear slide, and a Y-axis linear slide. The Y-axis linear slide is horizontally installed above the Z2-axis linear slide. The air-floating platform is installed above the Y-axis linear slide through an adapter plate. The air-floating platform is connected to the processing spindle. The tool is installed above the processing spindle. The data of the reference datum platform and the workpiece measured by the profilometer are used as a reference. The Z2-axis linear slide and the Y-axis linear slide move so that the tool reaches the surface of the workpiece to be processed for processing.

[0015] Furthermore, the profilometer is fixed on the reference datum platform through a turntable P and a Z1-axis linear slide. The profilometer scans the reference datum platform and the workpiece plane to collect two sets of geometric shape data. Taking the first scan data of the reference datum platform as a reference standard, the geometric shape difference between the two planes is calculated to evaluate and compare the geometric shape differences between the two planes. The Z1-axis linear slide moves up and down to adapt to different workpiece sizes, and the turntable P rotates to measure the surface of the workpiece to be processed. To eliminate the axial runout caused by movement, when the profilometer moves and scans within the plane, if the numerical value of the geometric shape data of the reference datum platform increases, the measurement data of the workpiece plane is adjusted accordingly to decrease its numerical value to compensate for the increase in the reference datum platform data; conversely, if the numerical value of the geometric shape data of the reference datum platform decreases, the measurement data of the workpiece plane is adjusted accordingly to increase its numerical value to compensate for the decrease in the reference datum platform data. In this way, taking the data of the reference datum platform as the measurement reference, the axial runout error generated by the movement of the profilometer during the plane scanning process can be effectively eliminated.

[0016] Furthermore, in terms of the design of the motion platform, to improve the rigidity of the processing device process system, a turntable with high rotational accuracy and motion stability is adopted. The drive systems of each axis are driven by servo motors with high-precision ball screws. Hydrostatic guides are used in the XYZ directions, and a full-closed control loop is formed by linear gratings with nanometer-level resolution. The guide rails adopt a split-block structure, with more reasonable processability, sufficient rigidity, and the ability to achieve high machining accuracy, thus maintaining high linear motion accuracy and high rigidity.

[0017] As Figure 7 shown, a method for realizing a planar processing device with tilt detection and compensation capabilities, based on the planar processing device, when the in-situ measurement device and the processing device in the device are a split mechanism, the workpiece moves with a single-axis motion platform, and the workpiece moves back and forth between the measurement device and the processing device to complete the measurement and processing operations. The specific steps are as follows:

[0018] Step 1: Lift the workpiece (5) and install it on the workpiece clamping and attitude adjustment device (1);

[0019] Step 2: Adjust the inclination angle of the surface of the workpiece (5) to be machined through the cradle R (102) so that the surface of the workpiece (5) to be machined is kept substantially parallel to the reference datum platform (204).

[0020] Step 3: The workpiece clamping and attitude adjustment device (1) moves to the position where the measuring device (201) is located together with the single-axis motion platform (3). The profilometer (201-4) moves on the Z1 linear axis so that the scanning range of the profilometer (201-4) can cover the contour of the workpiece (5). The rotary table P (201-1) drives the Z1-axis linear slide (201-2) to rotate together with the profilometer (201-4), and the profilometer (201-4) measures the planar data of the reference datum platform (204) and the entire contour of the workpiece (5).

[0021] Step 4: Analyze and process the data measured by the profilometer (201-4) to obtain the planar data m of the contour of the workpiece (5) after eliminating the axial runout 2_workpiece , and the measuring device (201) generates the surface shape of the surface of the workpiece (5) to be machined according to m 2_workpiece and generates a machining instruction.

[0022] Step 5: After generating the machining instruction, the rotary table C (103) rotates to flip the surface of the workpiece (5) to be machined. The workpiece clamping and attitude adjustment device (1) moves to the position where the machining device (202) is located together with the single-axis motion platform (3). The Z2 axis (202-1) and the Y-axis linear slide (202-2) cooperate to adjust the position of the cutting tool (202-5), and the cutting tool (202-5) machines the workpiece (5) according to the machining program.

[0023] Step 6: Measure the planar data of the workpiece (5) and the reference datum platform (204) again through the profilometer (201-4).

[0024] Step 7: Continuously repeat the whole process until the machining requirements are met.

[0025] The specific implementation of eliminating the axial runout is as follows:

[0026] The data of the reference datum platform (204) measured for the first time is denoted as m 1_basis , and the data of the reference datum platform (204) measured by the profilometer afterwards is denoted as f (p i ); the contour data of the workpiece (5) measured for the first time is denoted as m 1_workpiece , and the contour data of the workpiece (5) measured by the profilometer afterwards is denoted as g (p i ).

[0027] During the movement of the profilometer, axial runout will occur, resulting in runout errors in both the planar data of the reference datum platform and the planar data of the workpiece contour measured, m 1_basis and f (p i ) The runout error between them is denoted as e s_basis , m 1_workpiece and g (p i ) The runout error between them is denoted as e s_workpiece ;

[0028] Take the planar data of the reference datum platform and the first measurement data of the workpiece contour data measured by the profilometer as the reference data. Theoretically, during the second measurement, m 1_basis and f (p i ) The runout error between them should be consistent with the runout error between m 1_workpiece and g (p i ). Use e s_basis to compensate g (p i ) to obtain the workpiece contour data after eliminating the axial runout.

[0029] Furthermore, as Figure 11 shown, a method for realizing a planar machining device with tilt detection and compensation capabilities. Based on the planar machining device, when the in-situ measuring device and the machining device in the device are an integrated mechanism, the structure is simple and clear, and specifically includes the following steps:

[0030] Step 1: Hoist the workpiece (5) onto the workpiece clamping and attitude adjustment device (1);

[0031] Step 2: Adjust the tilt angle of the machining surface of the workpiece (5) through the cradle R (102) so that the machining surface of the workpiece (5) is kept substantially parallel to the reference datum platform (204);

[0032] Step 3: The profilometer (201-4) moves on the Z1-axis linear slide (201-2) so that the scanning range of the profilometer (201-4) can cover the contour of the workpiece (5). The turntable P (201-1) drives the Z1-axis linear slide (201-2) and the profilometer (201-4) to rotate together, and the profilometer (201-4) measures the planar data of the reference datum platform (204) and the entire contour of the workpiece (5);

[0033] Step 4: Analyze and process the data measured by the profilometer (201-4) to obtain the planar data of the contour of the workpiece (5) after eliminating the axial runout m2_workpiece The measuring device (201) generates the surface shape of the surface of the workpiece (5) to be machined according to m 2_workpiece and generates a machining instruction;

[0034] Step 5: After generating the machining instruction, the machining device (202) moves on the Z1-axis linear slide (201-2) to adjust the position of the cutting tool (202-5), and the cutting tool (202-5) machines the workpiece (5) according to the machining program;

[0035] Step 6: Measure the plane data of the workpiece (5) and the reference datum platform (204) again through the profiler (201-4);

[0036] Step 7: The whole process is continuously repeated until the machining requirements are met.

[0037] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0038] The present invention takes the working base as the installation reference, measures the reference datum platform while measuring the sealing surface of the workpiece, and can eliminate the deformation error caused by the gravity factor of the measuring arm; the present invention designs multiple protection functions such as mechanical limit protection, fastening device design, measuring path protection, sensor measurement monitoring and alarm protection, system zeroing path protection, power-off protection, and system restart protection; the processing equipment of the present invention all adopts anti-radiation protection treatment, and the relevant core components adopt a new type of boron carbide composite material as the anti-radiation shell; in the measurement and processing method of the present invention, the profiler is used to synchronously measure the workpiece and the reference datum platform, eliminate the axial jump and generate a machining instruction for machining. Description of the Drawings

[0039] Figure 1 It is the overall system composition diagram of the present invention.

[0040] Figure 2 It is the schematic diagram of the working structure composition of the device in the first embodiment of the present invention.

[0041] Figure 3 It is the schematic diagram of the workpiece clamping and attitude adjustment device in the first embodiment of the present invention.

[0042] Figure 4 It is the schematic diagram of the workpiece fixing device in the first embodiment of the present invention.

[0043] Figure 5 It is the schematic diagram of the method for eliminating axial jump when measuring the workpiece in the first embodiment of the present invention.

[0044] Figure 6 It is the schematic diagram of the in-situ measurement and processing device in the first embodiment of the present invention.

[0045] Figure 7Schematic diagram of the working process of the first embodiment of the present invention.

[0046] Figure 8 Schematic diagram of the device working structure composition of the second embodiment of the present invention.

[0047] Figure 9 Schematic diagram of the method for eliminating shaft jump during workpiece measurement in the second embodiment of the present invention.

[0048] Figure 10 Schematic diagram of the in-situ measurement and processing device of the second embodiment of the present invention.

[0049] Figure 11 Schematic diagram of the working process of the second embodiment of the present invention. Detailed implementation manners

[0050] The present invention will be specifically described below with reference to the drawings and embodiments.

[0051] The embodiments of the present invention relate to a processing device and method with tilt detection and compensation capabilities, which can be used for in-situ measurement and processing of workpieces.

[0052] [1] First embodiment

[0053] In the figure: 1, workpiece clamping and attitude adjustment device; 101, workpiece clamping device; 102, cradle R; 103, turntable C; 101-1, clamping chassis; 101-2 zero-point chuck; 101-3, pull stud; 101-4, workpiece fixing part; 2, in-situ measurement and processing device; 201, in-situ measurement system; 202, processing device; 203, moving platform; 204, reference benchmark platform; 205, slip ring; 201-1, turntable P; 201-2, Z1-axis linear slide; 201-3, adapter plate; 201-4, profiler; 202-1, Z2-axis linear slide; 202-2, Y-axis linear slide; 202-3, air-bearing platform; 202-4, processing spindle; 202-5, cutting tool; 3, single-axis moving platform; 4, working base; 5, workpiece.

[0054] The following is the first embodiment of the present invention and in combination with the drawings, the technical solution of the present invention will be further described;

[0055] As Figure 1 、 Figure 2As shown in the figure, a planar processing device with tilt detection and compensation capabilities includes a working base (4) and a single-axis moving platform (3) installed on the upper part of the working base (4). A workpiece clamping and attitude adjustment device (1) is installed on the upper part of the single-axis moving platform (3). The in-situ measurement and processing device (2) is a split structure and is respectively installed on two columns of the working base (4), where the in-situ measurement device (201) is installed on the inner side of one column, and the processing device (202) is installed on the inner side of the other column. The entire planar processing device is an integrated measurement and processing mobile processing structure.

[0056] As a specific implementation of an improvement, the processing device in the split structure includes a 7-axis movement. Multiple groups of limit switches are included in all motion systems to ensure that the detection system cannot contact the workpiece under any circumstances, thereby protecting the workpiece from accidental damage by the special processing machine.

[0057] As Figure 2 , Figure 3 shown in the figure, the workpiece clamping and attitude adjustment device (1) includes a workpiece clamping device (101), a cradle R (102), and a turntable C (103); the cradle R (102) is installed directly above the single-axis moving platform (3), the turntable C (103) for workpiece rotation is installed above the cradle R (102), and the workpiece clamping device (101) is installed above the turntable C (103). The turntable C (103) rotates and flips the workpiece (5) and adjusts the vertical tilt angle of the workpiece (5) in combination with the cradle R (102), and then moves it to a fixed position for processing.

[0058] As Figure 4 shown in the figure, the workpiece clamping device (101) includes two zero-point chucks (101-2), a pull stud (101-3), and a workpiece fixing member (101-4). The bottom surface of the clamping chassis (101-1) is installed above the turntable C (103), and two through holes are provided on the inner bottom surface of the clamping chassis (101-1) for installing two zero-point chucks (101-2) respectively; corresponding to the positions of the two through holes of the clamping chassis (101-1), two through holes are also provided on the inner bottom surface of the workpiece fixing member (101-4). The two pull studs (101-3) pass through the two through holes on the inner bottom surface of the workpiece fixing member (101-4) and are respectively connected to the two zero-point chucks (101-2).

[0059] The workpiece fixing member (101-4) and the clamping chassis (101-1) are U-shaped; protrusions with card slots are provided on the two outer side surfaces of the workpiece fixing member (101-4); card slots matching the protrusions are provided on the U-shaped inner side surface of the clamping chassis (101-1).

[0060] During operation, the workpiece (5) is lifted from above. The protrusions on the workpiece fixture (101-4) are installed into the card slots of the clamping chassis (101-1) to complete the lifting. Then, the bottom surface of the workpiece fixture (101-4) is connected to the bottom surface of the clamping chassis (101-1) through the pull stud (101-3) and the zero-point chuck (101-2).

[0061] As Figure 5 shown, the profiler (201-4) collects two sets of plane data by scanning the reference datum platform (204) and the plane of the workpiece (5). Taking the first scan data of the reference datum platform (204) as the reference standard data, the difference between the two planes (the reference datum platform and the workpiece plane) is calculated. The Z1-axis linear slide (201-2) moves up and down to adapt to different sizes of the workpiece (5), and the turntable P (201-1) rotates to measure the surface to be machined of the workpiece (5). To eliminate the axial runout caused by the movement, when the profiler (201-4) moves and scans within the plane, if the data of the reference datum platform (204) increases, the measurement data of the workpiece (5) plane is correspondingly decreased; conversely, if the data of the reference datum platform (204) decreases, the measurement data of the workpiece (5) plane is correspondingly increased. In this way, taking the data of the reference datum platform (204) as the measurement reference, the axial runout error generated by the movement during the plane scanning of the profiler (201-4) can be effectively eliminated.

[0062] As Figure 3 、 4 As shown in Figures 6, the in-situ measurement and machining device (2) includes an in-situ measurement device (201), a machining device (202), a motion platform (203) and a reference datum platform (204). The single-axis motion platform (3) drives the workpiece clamping and attitude adjustment device (101) to move the workpiece (5) to the in-situ measurement device (201). The in-situ measurement and machining device (2) uses the profiler (201-4) to perform high-precision measurements on both the workpiece (5) and the reference datum platform (204) simultaneously. After the measurement is completed, the single-axis motion platform (3) drives the workpiece clamping and attitude adjustment device (101) to move the workpiece (5) to the machining device (202) to machine the workpiece (5). Through the coordinated work of the workpiece clamping and attitude adjustment device (101) and the single-axis motion platform (3), a comprehensive scan of the surface to be machined of the workpiece (5) is realized and a machining instruction is generated, and then the machining device (202) machines the workpiece (5).

[0063] As Figure 6As shown in the figure, the in-situ measuring device (201) includes a turntable P (201-1), a Z1-axis linear slide (201-2), and a profiler (201-4). One side of the turntable P (201-1) is installed above the inner side of the reference datum platform (204). The Z1-axis linear slide (201-2) is installed on the other side of the turntable P (201-1). The profiler (201-4) is installed above the Z1 linear slide (201-2) through an adapter plate (201-3). The profiler (201-4) measures the workpiece (5) and the reference datum platform (204) simultaneously. The turntable P (201-1) can drive the Z1-axis linear slide (201-2) to rotate perpendicular to the reference datum platform (204). The profiler (201-4) can move vertically up and down along the Z1 linear slide (201-2). Therefore, the turntable P (201-1) and the Z1-axis linear slide (201-2) can be used for circumferential scanning of the workpiece (5), so as to perform profile measurement of the workpiece (5).

[0064] As Figure 6 shown in the figure, the machining device (202) includes an air-bearing platform (202-3), a machining spindle (202-4), a tool (202-5), a Z2-axis linear slide (202-1), and a Y-axis linear slide (202-2). One side of the Z2-axis linear slide (202-1) is installed on the inner side of the column. The Y-axis linear slide (202-2) is horizontally installed above the other side of the Z2-axis linear slide (202-1). The air-bearing platform (202-3) is installed above the Y-axis linear slide (202-2). The air-bearing platform (202-3) is connected to the machining spindle (202-4). The tool (202-5) is installed above the machining spindle (202-4). Based on the data of the reference datum platform (204) and the workpiece (5) measured by the profiler (201-4), with the data of the reference datum platform (204) as the reference, the Z2-axis linear slide (202-1) and the Y-axis linear slide (202-2) move so that the tool reaches the surface to be machined of the workpiece (5) for machining;

[0065] In the design of the present invention, it is recommended to use marble materials for the reference datum platform and the working base, and strictly control the flatness to reduce the amplitude of data change during the scanning process of the profiler (201-4), and ensure the accuracy and stability of the measurement results;

[0066] [2] Second Embodiment

[0067] Regarding a machining device and method with tilt detection and compensation capabilities according to the second embodiment of the present invention, the differences from the first embodiment will be described.

[0068] As Figure 8As shown, a processing device with tilt detection and compensation capabilities according to the second embodiment of the present invention includes a workpiece clamping and attitude adjustment device (101) installed on a working base (4), and an in-situ measurement and processing device (2) installed on the side of the workpiece clamping and attitude adjustment device (101); the in-situ measurement and processing device (2) includes a profiler (201-4), a Z1-axis linear slide (201-2), a processing device (202), a turntable C (103), a slip ring (205), and a reference datum platform (204); a turntable P (201-1) is installed on the reference datum platform (204) and converges the wire harness through the slip ring (205), the Z1-axis linear slide (201-2) is a single-axis movement and is parallel to the reference datum platform (204) and fixed on the turntable C (103), the processing device (202) and the profiler (201-4) are respectively installed on both sides of the Z1-axis linear slide (201-2) and rotate together with the Z1-axis linear slide (201-2); the second embodiment and the first embodiment have the same structure in two parts, namely the workpiece clamping and attitude adjustment device (101) and the processing device (202); the in-situ measurement and processing device (2) of the first embodiment is a split structure, and the workpiece needs to be flipped for processing after measurement; the in-situ measurement and processing device (2) of the second embodiment is an integrated structure, and processing can be carried out without flipping after measurement.

[0069] As Figure 9As shown, the profilometer (201-4) is fixed on the Z1-axis linear slide (201-2). The profilometer (201-4) moves on the Z1-axis linear slide (201-2) to adapt to different workpiece sizes. The rotation of the turntable C (103) drives the profilometer (201-4) to rotate one circle around the axis of the workpiece to be measured (5) while scanning the surface to be measured of the workpiece (5) and the reference datum platform (204), and two sets of geometric shape data are collected. Taking the first scan data of the reference datum platform (204) as the reference standard, the geometric shape difference between the two planes is calculated to evaluate and compare the geometric shape differences between the two planes. To eliminate the axial runout caused by movement, when the profilometer (201-4) moves and scans in the plane, if the numerical value of the geometric shape data of the reference datum platform (204) increases, the measurement data of the plane of the workpiece (5) is adjusted accordingly to make its numerical value decrease to compensate for the increase in the data of the reference datum platform (204); conversely, if the numerical value of the geometric shape data of the reference datum platform (204) decreases, the measurement data of the plane of the workpiece (5) is adjusted accordingly to make its numerical value increase to compensate for the decrease in the data of the reference datum platform (204). In this way, taking the data of the reference datum platform (204) as the measurement reference, the axial runout error generated by movement during the plane scan of the profilometer (201-4) can be effectively eliminated; after the measurement is completed, a machining instruction is generated, and the rotation of the turntable C (103) drives the machining device (202) to rotate around the axis of the workpiece to be measured (5) to machine the surface to be machined of the workpiece (5).

[0070] As Figure 10 As shown, the in-situ measurement device (201) is installed on the lower side of the Z1-axis linear slide (201-2), and the machining device (202) is installed on the lower side of the Z1-axis linear slide (201-2). The Z1-axis linear slide (201-2) is installed above the turntable P (201-1). The in-situ measurement device (201) and the machining device (202) follow the Z1-axis linear slide (201-2) and rotate with the turntable P (201-1). The in-situ measurement and the machining device (202) are for in-situ measurement and machining on the same side. During operation, the in-situ measurement device (201) rotates and scans to obtain the information of the reference datum platform (204) and the surface to be machined of the workpiece (5). After generating the machining instruction, the cradle R (102) compensates for the tilt angle of the workpiece (5), the in-situ measurement device (201) stops working, and the machining device (202) machines the surface to be machined of the workpiece (5) through linear interpolation.

[0071] The auxiliary system equipped with the present invention has cooling and purification functions, can effectively recover the chips generated during the processing, achieve self-cleaning, ensure no pollutant residues, and effectively prevent the pollution and cleaning problems of the processing fluid. The auxiliary system uses a self-aspirating spray method for cooling and purification in a closed space, directly sprays the cooling mixed oil mist onto the processing head and the workpiece through positive pressure. At the same time, the chips generated during the processing are sucked into the purification system under the action of negative pressure and are purified through filtration.

[0072] The above-described embodiments are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A planar processing device with tilt detection and compensation capabilities, comprising a workpiece clamping and attitude adjustment device (1), an in-situ measurement and processing device (2), a single-axis motion platform (3), a working base (4), and an auxiliary system, characterized in that: The single-axis motion platform (3) is installed on the upper part of the working base (4), the workpiece clamping and attitude adjustment device (1) is installed on the upper part of the single-axis motion platform (3), and the in-situ measurement and processing device (2) is of a split structure and is respectively installed on two columns of the working base (4). Among them, the in-situ measurement device (201) is installed on the inner side of one column, and the processing device (202) is installed on the inner side of the other column; The workpiece clamping and attitude adjustment device (1) includes a workpiece clamping device (101), a cradle R (102), and a turntable C (103); the cradle R (102) is installed directly above the single-axis motion platform (3), the turntable C (103) for workpiece rotation is installed above the cradle R (102), and the workpiece clamping device (101) is installed above the turntable C (103). The turntable C (103) rotates and flips the workpiece (5) and adjusts the vertical tilt angle of the workpiece (5) in combination with the cradle R (102), and then moves it to a fixed position for processing; The in-situ measurement and processing device (2) includes an in-situ measurement device (201), a processing device (202), a motion platform (203), and a reference datum platform (204); The single-axis motion platform (3) drives the workpiece clamping and attitude adjustment device (1) to move the workpiece (5) to the in-situ measurement device (201). The in-situ measurement and processing device (2) uses a profiler (201-4) to simultaneously perform high-precision measurements on the workpiece (5) and the reference datum platform (204); after the measurement is completed, the single-axis motion platform (3) drives the workpiece clamping and attitude adjustment device (1) to move the workpiece (5) to the processing device (202) to process the workpiece (5); through the coordinated work of the workpiece clamping and attitude adjustment device (1) and the single-axis motion platform (3), a full scan of the surface to be processed of the workpiece (5) is realized, and after generating a processing instruction, the processing device (202) processes the workpiece (5); The auxiliary system is used for purifying and recycling the debris generated during processing.

2. The planar machining device with tilt detection and compensation capabilities according to claim 1, characterized in that, The workpiece clamping device (101) includes two zero-point chucks (101-2), two pull studs (101-3), and a workpiece fixing member (101-4). The bottom surface of the clamping chassis (101-1) is installed above the turntable C (103). Two through holes are provided on the inner bottom surface of the clamping chassis (101-1) for installing two zero-point chucks (101-2) respectively; corresponding to the positions of the two through holes of the clamping chassis (101-1), two through holes are also provided on the inner bottom surface of the workpiece fixing member (101-4). The two pull studs (101-3) pass through the two through holes on the inner bottom surface of the workpiece fixing member (101-4) and are respectively connected to the two zero-point chucks (101-2); The workpiece fixture (101-4) and the clamping chassis (101-1) are U-shaped; the two outer sides of the workpiece fixture (101-4) are provided with raised grooves; the inner side of the U-shaped clamping chassis (101-1) is provided with grooves matching the raised grooves. During operation, the workpiece (5) is hoisted from above. The raised part on the workpiece fixture (101-4) is installed into the groove of the clamping chassis (101-1) to complete the hoisting. Then, the bottom surface of the workpiece fixture (101-4) and the bottom surface of the clamping chassis (101-1) are connected together by a pull stud (101-3) and a zero-point chuck (101-2).

3. A planar machining device with tilt detection and compensation capabilities according to claim 1, characterized in that, The in-position measuring device (201) includes a turntable P (201-1), a Z1-axis linear slide (201-2), and a profiler (201-4). One side of the turntable P (201-1) is installed above the inner side of the reference datum platform (204). The Z1-axis linear slide (201-2) is installed on the other side of the turntable P (201-1). The profiler (201-4) is installed above the Z1 linear slide (201-2) through an adapter plate (201-3). The profiler (201-4) measures the workpiece (5) and the reference datum platform (204) simultaneously. The turntable P (201-1) can drive the Z1-axis linear slide (201-2) to rotate perpendicular to the reference datum platform (204), and the profiler (201-4) can move vertically up and down along the Z1 linear slide (201-2). Therefore, the turntable P (201-1) and the Z1-axis linear slide (201-2) can be used to perform a circumferential scan of the workpiece (5), thereby performing the contour measurement of the workpiece (5).

4. A planar machining device with tilt detection and compensation capabilities according to claim 1, characterized in that, The machining device (202) includes an air-bearing platform (202-3), a machining spindle (202-4), a cutting tool (202-5), a Z2-axis linear slide (202-1), and a Y-axis linear slide (202-2). One side of the Z2-axis linear slide (202-1) is installed on the inner side of the column. The Y-axis linear slide (202-2) is horizontally installed above the other side of the Z2-axis linear slide (202-1). The air-bearing platform (202-3) is installed above the Y-axis linear slide (202-2). The air-bearing platform (202-3) is connected to the machining spindle (202-4). The cutting tool (202-5) is installed above the machining spindle (202-4). Based on the data of the reference datum platform (204) and the workpiece (5) measured by the profiler (201-4), with the data of the reference datum platform (204) as the reference, the Z2-axis linear slide (202-1) and the Y-axis linear slide (202-2) move so that the cutting tool reaches the surface to be machined of the workpiece (5) for machining.

5. The implementation method of a planar machining device with tilt detection and compensation capabilities according to claim 1, characterized in that, When the in-position measuring device and the machining device are split mechanisms, the workpiece moves with a single-axis moving platform, and the workpiece moves back and forth between the measuring device and the machining device to complete the measuring and machining operations. The specific steps are as follows: Step 1: Hoist the workpiece (5) onto the workpiece clamping and attitude adjustment device (1). Step 2: Adjust the inclination angle of the surface of the workpiece (5) to be machined by the cradle R (102) so that the surface of the workpiece (5) to be machined is kept substantially parallel to the reference datum platform (204). Step 3: The workpiece clamping and attitude adjustment device (1) moves to the position where the measuring device (201) is located together with the single-axis moving platform (3). The profiler (201-4) moves on the Z1 linear axis so that the scanning range of the profiler (201-4) can cover the contour of the workpiece (5). The rotary table P (201-1) drives the Z1-axis linear slide (201-2) to rotate together with the profiler (201-4), and the profiler (201-4) measures the plane data of the reference datum platform (204) and the entire contour of the workpiece (5). Step 4: Analyze and process the data measured by the profilometer (201-4) to obtain the planar data m of the profile of the workpiece (5) after eliminating the axial runout. 2_workpiece , and the measuring device (201) generates the surface shape of the surface to be machined of the workpiece (5) according to m 2_workpiece and generates a machining instruction. Step 5: After generating the machining instruction, the rotary table C (103) rotates to flip the surface of the workpiece (5) to be machined. The workpiece clamping and attitude adjustment device (1) moves to the position where the machining device (202) is located together with the single-axis moving platform (3). The Z2-axis linear slide (202-1) and the Y-axis linear slide (202-2) cooperate to adjust the position of the tool (202-5), and the tool (202-5) machines the workpiece (5) according to the machining program. Step 6: Measure the plane data of the workpiece (5) and the reference datum platform (204) again by the profiler (201-4). Step 7: The whole process is continuously repeated until the machining requirements are met.

6. A planar machining device with tilt detection and compensation capabilities, characterized in that, It includes a workpiece clamping and attitude adjustment device (1) installed on the working base (4), and an in-situ measurement and machining device (2) installed on the side of the workpiece clamping and attitude adjustment device (1); the in-situ measurement and machining device (2) includes a profiler (201-4), a Z1-axis linear slide (201-2), a machining device (202), a rotary table C (103), a slip ring (205) and a reference datum platform (204); the rotary table P (201-1) is installed on the reference datum platform (204) and converges the wire harness through the slip ring (205). The Z1-axis linear slide (201-2) moves in a single axis, is parallel to the reference datum platform (204) and is fixed on the rotary table C (103). The machining device (202) and the profiler (201-4) are respectively installed on both sides of the Z1-axis linear slide (201-2) and rotate together with the Z1-axis linear slide (201-2). The profiler (201-4) is fixed on the Z1-axis linear slide (201-2). The profiler (201-4) moves on the Z1-axis linear slide (201-2) to adapt to different workpiece sizes. By the rotation of the rotary table C (103), the profiler (201-4) rotates around the axis of the workpiece (5) for one circle while scanning the surface to be measured of the workpiece (5) and the reference datum platform (204), and collects two sets of geometric shape data. After the measurement, a machining instruction is generated, and by the rotation of the rotary table C (103), the machining device (202) rotates around the axis of the workpiece (5) to be measured to machine the surface of the workpiece (5) to be machined. The in-situ measurement device (201) and the machining device (202) are both installed on both sides of the Z1-axis linear slide (201-2). The Z1-axis linear slide (201-2) is installed above the rotary table P (201-1). The in-situ measurement device (201) and the machining device (202) rotate with the Z1-axis linear slide (201-2) along with the rotary table P (201-1). The in-situ measurement device (201) and the machining device (202) perform measurement and machining on the same side. During operation, the in-situ measurement device (201) rotates and scans to obtain the information of the reference datum platform (204) and the surface to be machined of the workpiece (5). After generating the machining instruction, the cradle R (102) compensates for the tilt angle of the workpiece (5). The in-situ measurement device (201) stops working, and the machining device (202) machines the surface to be machined of the workpiece (5) through linear interpolation.

7. The implementation method of a planar machining device with tilt detection and compensation capabilities according to claim 6, characterized in that, When the in-situ measurement device and the machining device are integrated, the specific steps are as follows: Step 1: Lift and install the workpiece (5) on the workpiece clamping and attitude adjustment device (1); Step 2: Adjust the tilt angle of the surface to be machined of the workpiece (5) through the cradle R (102) so that the surface to be machined of the workpiece (5) is kept basically parallel to the reference datum platform (204); Step 3: The profiler (201-4) moves on the Z1-axis linear slide (201-2) so that the scanning range of the profiler (201-4) can cover the contour of the workpiece (5). The rotary table P (201-1) drives the Z1-axis linear slide (201-2) and the profiler (201-4) to rotate together. The profiler (201-4) measures the plane data of the reference datum platform (204) and the entire contour of the workpiece (5); Step 4: Analyze and process the data measured by the profilometer (201-4) to obtain the planar data m of the contour of the workpiece (5) after eliminating the axial runout. 2_workpiece , and the measuring device (201) generates the surface shape of the surface to be machined of the workpiece (5) according to m 2_workpiece and generates a machining instruction. Step 5: After generating the machining instruction, the machining device (202) moves on the Z1-axis linear slide (201-2) to adjust the position of the tool (202-5). The tool (202-5) machines the workpiece (5) according to the machining program; Step 6: Measure the plane data of the workpiece (5) and the reference datum platform (204) again through the profiler (201-4); Step 7: The whole process is repeated continuously until the machining requirements are met.

8. A method for implementing a planar machining device with tilt detection and compensation capabilities according to claim 5 or 7, characterized in that, The elimination of the axial runout is specifically realized as follows: The data of the reference datum platform (204) measured for the first time is denoted as m 1_basis , and the data of the reference datum platform (204) measured by the profilometer afterwards is denoted as f(p i ); the profile data of the workpiece (5) measured for the first time is denoted as m 1_workpiece , and the profile data of the workpiece (5) measured by the profilometer afterwards is denoted as g(p i ); m 1_basis The beating error between f(p i ) is denoted as e s_basis , m 1_workpiece The beating error between g(p i ) is denoted as e s_workpiece ; The planar data of the reference datum platform (204) measured by the profilometer and the first measurement data of the workpiece contour data are used as the reference data; during the second measurement, m 1_basis The runout error between f(p i ) and m 1_workpiece The runout error between g(p i ) is kept consistent. By compensating g(p s_basis ) with e i the workpiece contour data after eliminating the axial runout can be obtained.

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