A multi-station processing machine for silicon carbide ingot shaping

Abstract

The present application relates to a kind of silicon carbide crystal ingot shaping multi-station processing machine tool, and it is related to numerical control machine tool technical field.The main body bed, large turret, workpiece turret, end face grinding module, external circle grinding module, positioning surface processing module, table washing and blowing module, crystal direction determination module and workpiece transmission module are included;Large turret is installed in the center of main body bed, and four workpiece turrets are evenly distributed on large turret, and end face grinding module, external circle grinding module, positioning surface processing module and table washing and blowing module are distributed along four stations around large turret of main body bed;The auxiliary work platform is fixedly connected to the side surface of main body bed, and the crystal direction determination module and workpiece transmission module are installed on the auxiliary work platform.The present application is synchronously worked with each station connection cycle, and multiple workpieces can be processed simultaneously in multiple stations, and workpiece is automatically fed and discharged, which greatly improves the production efficiency of silicon carbide crystal ingot and the quality of processing work.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of numerical control machine tools, in particular to a silicon carbide crystal ingot shaping multi-station machining machine tool. BACKGROUND

[0002] The processing efficiency of silicon carbide crystal ingots into finished crystal ingots that can be used to manufacture wafers is poor, which is a long-standing problem for wafer manufacturers.

[0003] The outdated traditional process currently has no industry standard, and there are large differences in the processes between different manufacturers. At present, silicon carbide crystal ingots involve at least multiple independent processes, including crystal direction measurement, end face grinding, cylindrical grinding, positioning edge grinding, etc. Each processing step requires a separate device, and the crystal ingot needs to be pasted to a fixing device and then peeled off from the fixing device. The process is complicated, and the process that requires a large amount of manual operation greatly limits the yield, greatly increases the labor cost and time cost, and the error caused by multiple clamping of workpieces is also great, resulting in a high rate of defective products. In addition, various space-intensive equipment occupies a large amount of space.

[0004] With the increasing demand for silicon carbide crystal ingots in the third-generation semiconductor industry, the global demand for silicon carbide is growing at an alarming rate. Therefore, there is an urgent need to design an automatic, high-integration, high-efficiency, and high-precision silicon carbide crystal ingot processing equipment. SUMMARY

[0005] To solve at least one of the technical problems in the background art, the present application provides a silicon carbide crystal ingot shaping multi-station machining machine tool, which integrates multiple functional modules and can realize crystal direction measurement of the outer circle and end face of the silicon carbide crystal ingot workpiece, end face grinding, cylindrical grinding, positioning edge grinding, workpiece reversing processing, automatic washing and blowing of the workpiece, and automatic feeding and unloading of the workpiece, achieving automatic processing of silicon carbide crystal ingot workpiece materials and dry-in and dry-out.

[0006] To achieve the above purpose, the present application provides a silicon carbide crystal ingot shaping multi-station machining machine tool, which comprises a main bed, a large turntable, a workpiece turntable, an end face grinding module, a cylindrical grinding module, a positioning surface processing module, a table washing and blowing module, a crystal direction measurement module, and a workpiece transmission module. The large turntable is installed at the center of the main bed, and four workpiece turntables are evenly distributed on the large turntable. The main bed is distributed with an end face grinding module, a cylindrical grinding module, a positioning surface processing module, and a table washing and blowing module around the large turntable along the four stations. The main bed is fixedly connected with an auxiliary work platform on the side surface, and the auxiliary work platform is provided with a crystal direction measurement module and a workpiece transmission module.

[0007] Further, the large rotary table is internally provided with a rotary table structure, a servo motor is arranged inside to drive the rotation, four workpiece rotary tables are arranged on the four workstations of the large rotary table, each workpiece rotary table can be independently servo-controlled, the large rotary table and the four workpiece rotary tables form a multi-station planetary motion, and the large rotary table drives the four workpiece rotary tables to circularly index in the functional modules.

[0008] Further, each workpiece rotary table comprises a vacuum chuck and a table adjusting mechanism, the vacuum chuck is used for adsorbing the workpiece thereon, and the table adjusting mechanism is provided with three table adjusting mechanisms which are arranged on the bottom of the vacuum chuck in the circumferential direction and are used for adjusting the pitch angle of the vacuum chuck table and the horizontal plane.

[0009] Further, the auxiliary work platform is further provided with a workpiece buffer washing and blowing module, a blank workpiece tray and a finished workpiece tray.

[0010] Further, the grinding wheel of the end face grinding module is horizontally installed, the end face grinding horizontal X-axis motion table and the end face grinding vertical Z-axis motion table are combined to drive the end face grinding wheel frame to grind the end face of the silicon carbide crystal ingot.

[0011] Further, the grinding wheel of the external circle grinding module is vertically installed, the external circle grinding horizontal X-axis motion table and the external circle grinding vertical Z-axis motion table are combined to drive the external circle grinding wheel frame to grind the external circle surface of the silicon carbide crystal ingot.

[0012] Further, the positioning surface processing module is combined with the positioning surface processing horizontal X-axis motion table, the positioning surface processing longitudinal Y-axis motion table and the positioning surface processing vertical Z-axis motion table to drive the positioning surface grinding wheel frame to process the Notch of the silicon carbide crystal.

[0013] Further, the orientation instrument horizontal lifting motion module drives the orientation instrument swing seat, the orientation instrument swing seat drives the X-ray crystal orientation instrument to swing, and the orientation instrument horizontal lifting motion module and the orientation instrument swing seat are combined to measure the crystal orientation of the external circle surface and the top end face of the silicon carbide crystal workpiece.

[0014] Further, the workpiece transmission module realizes workpiece conveying and carrying through the mechanical hand clamping workpiece feeding and discharging, face turning and direction turning.

[0015] Further, the cleaning table of the workpiece buffer washing and blowing module is provided with a lifting protective shell to perform closed cleaning and drying on the workpiece.

[0016] The application has the following beneficial effects:

[0017] The present application provides a silicon carbide ingot shaping multi-station processing machine tool, which can realize one-time clamping of multiple silicon carbide ingot workpieces to complete the outer circle and end face crystal direction measurement, end face grinding, outer circle grinding, positioning edge grinding, automatic workpiece washing and blowing and feeding and discharging, realize the automatic dry-in and dry-out of silicon carbide ingot workpiece processing materials. High automation greatly improves the processing efficiency of silicon carbide ingots, avoids processing errors caused by multiple clamping of silicon carbide ingots, greatly improves the part processing precision, reduces the labor cost, greatly saves the space occupied by multiple devices and environmental pollution, and is suitable for large-scale semiconductor silicon carbide ingot processing production line equipment application. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a three-dimensional schematic diagram of the present application Figure 1 ;

[0019] Figure 2 is a three-dimensional schematic diagram of the present application Figure 2 ;

[0020] Figure 3 is a schematic diagram of the planar layout of the present application.

[0021] In the figure: 1-main body bed, 2-large rotary table, 3-workpiece rotary table, 4-vacuum chuck, 5-table adjustment mechanism, 6-end face grinding module, 7-outer circle grinding module, 8-positioning surface processing module, 9-table washing module, 10-assistant work platform, 11-crystal direction measurement module, 12-orientation instrument swing seat, 13-X-ray crystal orientation instrument, 14-workpiece transmission module, 15-workpiece buffer washing module, 16-rough workpiece tray, 17-finished workpiece tray, 18-workpiece. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0025] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0026] In addition, the terms "mount", "set", "provided with", "connected", "connected", "sleeved" should be broadly understood. For example, it can be a fixed connection, a detachable connection, or a monolithic structure; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] To achieve the above-mentioned purpose, as Figures 1-3As shown, the present application provides a silicon carbide ingot shaping multi-station processing machine tool, comprising: a main bed 1, a large rotary table 2, a workpiece rotary table 3, an end face grinding module 6, an outer circle grinding module 7, a positioning surface processing module 8, a table washing and blowing module 9, a crystal direction measuring module 11 and a workpiece transmission module 14; wherein the large rotary table 2 is installed at the center of the main bed 1, four workpiece rotary tables 3 are uniformly distributed on the large rotary table 2, and the main bed 1 is distributed with the end face grinding module 6, the outer circle grinding module 7, the positioning surface processing module 8 and the table washing and blowing module 9 along the four stations around the large rotary table 2; the main bed 1 is fixedly connected with an auxiliary work platform 10 on the side, and the crystal direction measuring module 11 and the workpiece transmission module 14 are installed on the auxiliary work platform 10.

[0028] The above modules of the present application work synchronously and cooperatively with the connection and circulation of each station, can synchronously process multiple workpieces in multiple stations, and can complete X-ray crystal orientation measurement, position automatic adjustment, outer circle, end face, positioning edge processing and workpiece cleaning at one time for multiple silicon carbide ingot workpieces clamped once.

[0029] Further optimization, the large rotary table 2 is internally rotary table structure, internally provided with a servo motor driving it to rotate around the center of the main bed 1, four workpiece rotary tables 3 are installed on the four stations uniformly distributed on the end face of the large rotary table 2, each workpiece rotary table 3 can be independently servo-controlled to operate, the large rotary table 2 and the four workpiece rotary tables 3 constitute a multi-station planetary motion, and the large rotary table 2 rotates to drive the four workpiece rotary tables 3 to circularly index between the functional modules.

[0030] Further optimization, each workpiece rotary table 3 comprises a vacuum chuck 4 and a table adjusting mechanism 5, the vacuum chuck 4 is used for adsorbing the workpiece 18 thereon, the table adjusting mechanism 5 is provided with three, circumferentially arranged at the bottom of the vacuum chuck 4, servo-controlled to finely adjust the pose of the vacuum chuck 4, and change the pitch angle of the workpiece rotary table surface and the horizontal plane.

[0031] Further optimization, the auxiliary work platform 10 is further provided with a workpiece buffer washing and blowing module 15, a blank workpiece tray 16 and a finished workpiece tray 17. The cleaning table of the workpiece buffer washing and blowing module 15 is provided with a lifting protective shell, and the workpiece is closed, washed and dried.

[0032] Further optimization, the grinding wheel grinding electric spindle of the end face grinding module 6 is installed horizontally, driven by the combination of the end face grinding horizontal X-axis motion table and the end face grinding vertical Z-axis motion table, and driven to drive the end face grinding wheel frame to grind the end face of the silicon carbide ingot in the station.

[0033] Further optimization, the grinding wheel of the outer circle grinding module 7 is installed vertically on the electric spindle, and the outer circle grinding horizontal X-axis motion table and the outer circle grinding vertical Z-axis motion table are combined to drive the outer circle grinding wheel frame to grind the outer circle surface of the silicon carbide crystal ingot in the working position.

[0034] Further optimization, the positioning surface processing module 8 is combined with the positioning surface processing horizontal X-axis motion table, the positioning surface processing horizontal longitudinal Y-axis motion table and the positioning surface processing vertical Z-axis motion table to drive the positioning surface grinding wheel frame to process the positioning edge (Notch) of the silicon carbide crystal in the working position.

[0035] Further optimization, the horizontal motion module of the table washing and blowing module 9 drives the table cleaning head to clean and dry the table of the workpiece turntable in the working position.

[0036] Further optimization, the orientation instrument horizontal lifting motion module of the crystal direction measuring module 11 drives the orientation instrument swing seat to move up and down, and the orientation instrument swing seat drives the X-ray crystal orientation instrument installed on the orientation instrument swing seat to swing, so that the crystal direction of the outer circle surface and the top end surface of the silicon carbide crystal workpiece in the working position is measured through the combined motion of the orientation instrument horizontal lifting motion module and the orientation instrument swing seat.

[0037] Further optimization, the workpiece conveying module 14 realizes the conveying and carrying of the workpiece through the mechanical hand clamping workpiece feeding and unloading, surface turning and direction turning.

[0038] The working process of the present application is as follows:

[0039] The workpiece clamping jaw of the mechanical hand in the workpiece conveying module 14 takes out the workpiece 18 to be processed from the blank workpiece tray 16 and places it on the workpiece cleaning table in the workpiece buffer washing and blowing module 15, and the periphery protection is raised to close and clean and dry the workpiece 18; after the washing and blowing process is completed, the periphery protection is lowered, and the workpiece conveying module 14 places the workpiece 18 on the workpiece turntable 3 in the working position corresponding to the table washing and blowing module 9, and the vacuum suction cup 4 thereon firmly adsorbs the workpiece 18; thereafter, the orientation instrument horizontal lifting motion module in the crystal direction measuring module 11 drives the orientation instrument swing seat 12 to rise, the X-ray crystal orientation instrument 13 is driven to swing by the orientation instrument swing seat 12, and the crystal direction of the outer circle surface and the top end surface of the workpiece 18 in the working position is measured through the combined motion thereof; then, the workpiece turntable 3 in the working position corresponding to the table washing and blowing module 9 drives the vacuum suction cup 4 inside to rotate the table and adjusts the workpiece turntable 3 table and the horizontal plane to the corresponding angle through the table adjusting mechanism 5 according to the measured crystal direction values of the outer circle and the end surface, and after the posture of the workpiece 18 is adjusted, the parts in the crystal direction measuring module 11 retreat to the initial position.

[0040] Subsequently, the large rotary table 2 is index-rotated to the position of the end face grinding module 6, and the end face grinding wheel frame is driven through the combined high-precision servo feed motion of the end face grinding horizontal X-axis motion table and the end face grinding vertical Z-axis motion table, so that the end face of the workpiece 18 at the position is ground. After the process is completed, the end face grinding wheel frame is retracted.

[0041] Next, the large rotary table 2 is index-rotated to the position of the cylindrical grinding module 7, and the cylindrical grinding wheel frame is driven through the combined high-precision servo feed motion of the cylindrical grinding horizontal X-axis motion table and the cylindrical grinding vertical Z-axis motion table, so that the cylindrical surface of the workpiece 18 at the position is ground. After the process is completed, the cylindrical grinding wheel frame is retracted.

[0042] Subsequently, the large rotary table 2 is index-rotated to the position of the positioning surface processing module 8, and the positioning surface grinding wheel frame is driven through the combined high-precision servo feed motion of the positioning surface processing horizontal X-axis motion table, the positioning surface processing horizontal longitudinal Y-axis motion table and the positioning surface processing vertical Z-axis motion table, so that the positioning edge Notch of the workpiece 18 at the position is processed. After the process is completed, the positioning surface grinding wheel frame is retracted.

[0043] Next, the large rotary table 2 is index-rotated to the position of the table washing and blowing module 9, the workpiece 18 is clamped by the workpiece clamping jaw of the manipulator in the workpiece transmission module 14, and the workpiece 18 is reversed and turned over again, and then the workpiece 18 is placed in the position again. The workpiece 18 is firmly adsorbed by the vacuum chuck 4, the large rotary table 2 is index-rotated to the position of the end face grinding module 6 again, and the other end face of the workpiece 18 is ground. After the process is completed, the end face grinding wheel frame is retracted. After the end face grinding process of the workpiece 18 is completed, the vacuum chuck 4 is loosened, the workpiece transmission module 14 clamps and takes out the workpiece 18 at the position, the large rotary table 2 continues to rotate and operate, the workpiece rotary table 3 at the empty load position is index-rotated to the position of the table washing and blowing module 9, the table washing and blowing head is driven to the cleaning position by the table cleaning horizontal motion module, the empty load worktable at the position is cleaned and dried, and after the washing and drying are completed, the table washing and blowing head is retracted. One processing process is completed.

[0044] The workpiece transmission module 14 transmits the processed workpiece 18 to the workpiece buffer washing and blowing module 15, and the workpiece 18 is cleaned and dried through the above process. After the cleaning and drying process is completed, the workpiece transmission module 14 transmits the processed workpiece 18 to the finished workpiece tray 17 for storage. Thus, a cycle process of automatic phase measurement processing of the silicon carbide crystal ingot from a blank to a finished product is formed.

[0045] In the present application, other processes are synchronized when each functional module operates, the large rotary table 2 rotates to convey four workpiece rotary tables 3, each functional module has a continuous position input, and the cycle completes the respective operation process. The processes of the functional modules are sequentially cycled and connected, the processing rhythm is compact, multiple workpieces can be processed synchronously, and the automatic feeding and discharging of the silicon carbide crystal ingot shaping process is efficiently realized.

[0046] The above merely illustrates the preferred embodiments of the present application, but is not intended to limit the technical scope of the present application, and any slight modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application shall still fall within the technical scope of the present application.

Claims

1. A multi-station processing machine for silicon carbide ingot shaping, characterized by, include: The main bed (1), large rotary table (2), workpiece rotary table (3), end face grinding module (6), external cylindrical grinding module (7), positioning surface machining module (8), table washing and blowing module (9), crystal orientation determination module (11), and workpiece transfer module (14) are provided. The large rotary table (2) is installed at the center of the main bed (1). Four workpiece rotary tables (3) are evenly distributed on the large rotary table (2). The end face grinding module (6), external cylindrical grinding module (7), positioning surface machining module (8), and table washing and blowing module (9) are distributed around the large rotary table (2) along four workstations. An auxiliary work platform (10) is fixedly connected to the side of the main bed (1). The crystal orientation determination module (11) and workpiece transfer module (14) are installed on the auxiliary work platform (10). The large turntable (2) has a turntable structure inside and is equipped with a servo motor to drive rotation. Four workpiece turntables (3) are installed on four workstations evenly distributed on the end face of the large turntable (2). Each workpiece turntable (3) can be independently controlled by a servo motor. The large turntable (2) and the four workpiece turntables (3) constitute a multi-station planetary motion. The rotation of the large turntable (2) drives the four workpiece turntables (3) to cyclically index and move between each functional module. Each workpiece turntable (3) includes a vacuum suction cup (4) and a table adjustment mechanism (5). The vacuum suction cup (4) is used to adsorb the workpiece (18). There are three table adjustment mechanisms (5) arranged around the bottom of the vacuum suction cup (4) along the circumference of the workpiece turntable (3) to adjust the pitch angle between the table surface of the vacuum suction cup (4) and the horizontal plane. The auxiliary work platform (10) is also equipped with a workpiece buffer washing and blowing module (15), a blank workpiece tray (16), and a finished workpiece tray (17). The orientation measurement module (11) uses a horizontal lifting motion module to drive the orientation swing seat, which in turn drives the X-ray crystal orientation instrument to swing. Through the combined motion of the orientation horizontal lifting motion module and the orientation swing seat, the crystal orientation of the outer circular surface and the top end face of the silicon carbide crystal workpiece at the workstation is measured.

2. A multi-station silicon carbide ingot shaping machine according to claim 1, wherein The grinding wheel electric spindle of the end face grinding module (6) is horizontally mounted. Through the combination of the horizontal X-axis motion table and the vertical Z-axis motion table of the end face grinding, the grinding wheel frame is driven to grind the end face of the silicon carbide ingot at the station.

3. A multi-station silicon carbide ingot shaping machine according to claim 1, wherein The grinding wheel electric spindle of the external cylindrical grinding module (7) is vertically installed. Through the combination of the external cylindrical grinding horizontal X-axis motion table and the external cylindrical grinding vertical Z-axis motion table, the grinding wheel frame is driven to grind the outer cylindrical surface of the silicon carbide ingot at the station.

4. A multi-station silicon carbide ingot shaping machine according to claim 1, wherein The positioning surface processing module (8) drives the positioning surface grinding wheel frame to process the silicon carbide crystal positioning edge at the workstation by combining the positioning surface processing horizontal X-axis motion table, the positioning surface plus horizontal longitudinal Y-axis motion table, and the positioning surface processing vertical Z-axis motion table with high precision servo feed motion.

5. A multi-station silicon carbide ingot shaping machine according to claim 1, wherein The workpiece transfer module (14) uses a robotic arm to hold the workpiece for loading, unloading, flipping and turning, thereby realizing the conveying and handling of the workpiece.

6. A multi-station silicon carbide ingot shaping machine according to claim 1, wherein The cleaning table of the workpiece buffer and blowing module (15) is equipped with a lifting protective cover shell, and the workpiece is closed, cleaned and dried.

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