Double-force-control automatic compensation method and double-force-control grinding and polishing integrated equipment

Abstract

The invention discloses a double-force-control automatic compensation method and double-force-control grinding and polishing integrated device.According to the technical scheme, the double-force-control automatic compensation method comprises the steps that workpiece surface crystal orientation data are obtained through a diffraction pattern, and a crystal orientation distribution matrix is generated through denoising and clustering analysis; dividing a crystal orientation region and associating the friction coefficient, hardness and other mechanical properties; based on the material removal rate distribution matrix, a gradient algorithm is adopted to correct grinding tracks and cutting parameters of all areas, and a compensation track matrix is generated; and double-force-control feedback of normal force and tangential force is combined, the abrasive particle contact force and the feeding rate are dynamically adjusted, and a closed-loop compensation strategy is formed. Through crystal orientation partition optimization and double-force-control dynamic compensation, the problem that compensation is insufficient in the grinding process of the glass crystal is solved, and high-precision and self-adaptive surface machining is achieved.

Description

Technical Field

[0001] The invention relates to the field of glass workpiece processing, and in particular to a double-force-controlled automatic compensation method and a double-force-controlled grinding and polishing integrated device. Background Art

[0002] In precision machining equipment, force control compensation is to detect changes in machining force and adjust the feed path or pressure of the machine tool or grinding head in real time, thereby improving machining consistency and reducing surface damage. The traditional single force control method usually relies on a single sensor to adjust feed compensation, while dual force control introduces independent compensation control in multiple axes to more accurately control the amount of material removal and adapt to glass crystal workpieces of different shapes. The introduction of dual force control solves some problems that are difficult to handle with traditional single-axis force control, such as complex curved surfaces and uneven mechanical properties in different areas, making the machining consistency of the workpiece higher, especially in the case of four-station collaborative machining, the need for compensation is more critical. However, precisely because of the complexity of dual force control, there are still some deep-seated technical defects in the existing technology implementation.

[0003] In the processing of glass crystal, the material removal rate (MRR) is an important factor affecting the compensation strategy. In theory, the compensation strategy should be highly matched with the material removal model to ensure the processing accuracy. However, due to the heterogeneity of glass crystal materials and the large changes in mechanical properties of different crystal directions, the material removal rate model relied on by the existing dual-force control compensation method is often based on ideal experimental data, and lacks dynamic correction for complex morphology and material inhomogeneity. As a result, the removal rate fluctuates in different areas of the same workpiece, resulting in a mismatch between the compensation result and the actual processing volume, which is easy to cause local over- or under-processing, or because the material removal characteristics of each workpiece may be different due to simultaneous processing of four stations, and the existing compensation method is difficult to independently correct the removal error of each station during calculation, resulting in increased inhomogeneity among the four stations. Therefore, it is necessary to propose a new dual-force control automatic compensation method and dual-force control grinding and polishing integrated equipment to solve the problem of insufficient compensation during the grinding process. Summary of the invention

[0004] The main purpose of the present invention is to propose a dual-force-controlled automatic compensation method and a dual-force-controlled grinding and polishing integrated device, aiming to solve the above technical problems.

[0005] To achieve the above-mentioned purpose, the present invention proposes a dual-force control automatic compensation method, which is applied to a dual-force control grinding and polishing integrated device for grinding a glass crystal workpiece, comprising the following steps: Step S1, obtaining crystal orientation information of multiple positions on the surface of a glass crystal workpiece, and processing the crystal orientation data using a cluster analysis method according to the collected crystal orientation information, dividing the surface area into multiple crystal orientation areas and generating a crystal orientation distribution matrix containing crystal orientation types, crystal orientation angles, and corresponding physical performance data of different areas; Step S2, according to the crystal orientation information in the crystal orientation distribution matrix, the cutting mechanical characteristics of different crystal orientation regions are analyzed, the corresponding friction coefficient, hardness and elastic modulus are calculated, and the contact process between the abrasive grains and the glass crystal surface at different crystal orientations is simulated by combining the finite element method or the discrete element method, and the material removal rate distribution matrix is ​​obtained through the local removal rate difference; Step S3, based on the material removal rate distribution matrix, calculate the removal error gradient and correct the grinding trajectory of each crystal direction area, calculate and adjust the feed rate and cutting depth of each crystal direction area through the trajectory correction algorithm, and obtain the compensation trajectory matrix; Step S4: for each crystal direction region, according to the feed rate and cutting depth corresponding to the compensation trajectory matrix, dynamically calculate the required normal force and tangential force and adjust the contact force between the abrasive grains and the glass crystal surface in real time to obtain the dual force control adjustment parameters; Step S5: Based on the compensation trajectory matrix and the dual force control adjustment parameters, the data fed back by the sensor are compared, the processing parameters are dynamically corrected, the normal force and the tangential force are adjusted, and the final compensation strategy is obtained.

[0006] Optionally, the step S1 further includes: Selecting a plurality of measurement points at different positions on the surface of the glass crystal workpiece, and obtaining the crystal direction angle, crystal direction orientation, and related lattice constants at each measurement point through a diffraction spectrum to form a first crystal direction data set; Preprocessing the first original crystal direction data, using a Kalman filter algorithm or a median filter algorithm to remove noise caused by measurement error or environmental interference, standardizing the data, converting the data of each crystal direction into a unified format, and obtaining a second crystal direction data set; A K-means clustering algorithm or a spectral clustering algorithm is used to perform cluster analysis on the second crystal direction data, the surface area of ​​the glass crystal workpiece is divided into a plurality of crystal direction areas, and the crystal direction data of the areas where the cosine similarity between the crystal phase angles is higher than a preset threshold are classified into one category according to the similarity of the crystal direction angles, so as to obtain a third crystal direction data set; For each crystal direction region of the third crystal direction data set, the statistical distribution of the crystal direction types and crystal direction angles of all points in the region is calculated, and the mechanical properties of hardness, elastic modulus, plasticity index and friction coefficient of each region are calculated in combination with the physical properties of the glass crystal and the known mechanical data, and a physical property matrix of each crystal phase region is generated; The physical property matrices of all crystal orientation regions are merged to obtain a crystal orientation distribution matrix including the crystal orientation types, crystal orientation angles and corresponding physical performance data of different regions.

[0007] Optionally, the physical property matrices of all crystal orientation regions are merged to obtain a crystal orientation distribution matrix including crystal orientation types, crystal orientation angles and corresponding physical property data of different regions, including: The crystal orientation distribution matrix is ​​visualized using heat maps or three-dimensional visualization technology to obtain the final crystal phase distribution matrix.

[0008] Optionally, step S2 includes: According to the crystal orientation angle and position data recorded in the crystal orientation distribution matrix, the physical property data of friction coefficient, hardness, elastic modulus and plasticity index of each crystal orientation area are directly extracted. Combined with the actual physical properties of the glass crystal material, the contact state between the abrasive grains and the glass crystal surface is analyzed. Through the contact between the abrasive grains and different crystal orientation areas during the grinding process, the removal ability differences of each crystal orientation area are analyzed to obtain the removal rate information of each area. According to the removal rate information of each crystal direction area and combined with the actual processing feedback data, the material removal rate of each area is calculated, and a material removal rate distribution matrix is ​​generated that reflects the difference in removal capacity in different areas of the entire workpiece surface.

[0009] Optionally, the material removal rate of each region is calculated based on the removal rate information of each crystal direction region in combination with actual processing feedback data, and a material removal rate distribution matrix reflecting the removal capacity differences in different regions on the entire workpiece surface is generated, including: Based on the generated material removal rate distribution matrix, the grinding trajectory of each crystal direction area is corrected to ensure that the feed rate and cutting depth in each crystal direction area are optimized, and the feed rate and cutting depth of each crystal direction area are dynamically adjusted to obtain the adjustment result of the material removal rate distribution matrix; Based on the adjustment results of the material removal rate distribution matrix, the normal force and tangential force applied during the grinding process are corrected in real time through real-time sensor feedback. The sensor feedback data is compared with the compensation trajectory, and the distribution of normal force and tangential force is dynamically optimized to generate an optimized material removal rate distribution matrix.

[0010] Optionally, step S3 includes: For each crystal direction region in the material removal rate distribution matrix, the local removal error of the region is calculated, and the material removal rate error is calculated using a difference method or a gradient descent method to obtain a removal error gradient for each region; Combined with removing the error gradient, an adaptive adjustment algorithm or a particle swarm optimization algorithm is used to calculate the adjustment values ​​of the feed rate and cutting depth of each crystal direction area, adjust the feed rate and cutting depth, and calculate the compensation trajectory matrix based on the adjustment results.

[0011] Optionally, step S4 includes: According to the feed rate and cutting depth in the compensation trajectory matrix, the normal force and tangential force required for each crystal direction area are calculated using the force sensor feedback data, and the normal force and tangential force that need to be adjusted are obtained using the real-time feedback adjustment algorithm; Based on the adjusted normal force and tangential force, combined with real-time sensor data, the dual force control adjustment parameters of each crystal direction area are calculated through a feedback control algorithm.

[0012] Optionally, step S5 includes: Obtain the processing status data of each crystal direction area of ​​the glass crystal workpiece during the processing process, collect the normal force and tangential force data fed back by the sensor, compare them with the compensation trajectory matrix, calculate the difference between the actual removal rate and the expected removal rate of each crystal direction area, and obtain the removal error of each crystal direction area; According to the removed error, the normal force and tangential force after the correction compensation strategy are obtained, and then the feed rate and cutting depth adjustment value of each crystal direction area are calculated to obtain the corrected feed rate and cutting depth; All corrected normal and tangential forces as well as the corrected feed rate and cutting depth are integrated to generate the final compensation strategy based on the real-time adjustment of normal force, tangential force, feed rate and cutting depth.

[0013] The present invention also proposes a dual-force-controlled grinding and polishing integrated device, which adopts the dual-force-controlled automatic compensation method, and the dual-force-controlled grinding and polishing integrated device includes a base, a four-axis and five-axis cradle, a fixture, a connecting column, a liquid spray system and a grinding head assembly; The four-axis five-axis cradle is fixedly arranged on the base; The jig is fixed on the four-axis and five-axis cradle; The connecting column is arranged at the side end of the four-axis five-axis cradle and fixed on the base; The movable grinding head assembly is fixedly connected to an end of the connecting column away from the base and is arranged at a position directly above the fixture; The liquid spraying systems are respectively arranged at positions adjacent to the grinding head assembly and the four-axis and five-axis cradle.

[0014] In a possible implementation manner, the grinding head assembly further includes a rotating member; The rotating part includes a casting swing arm, a grinding head housing and a driving system; A plurality of grinding head assemblies are equidistantly arranged on the surface of the grinding head box; One end of the grinding head housing is rotatably connected to the casting swing arm, and the other end is connected to the driving system.

[0015] The technical solution of the present invention effectively solves the limitations of the traditional single force control method in dealing with the heterogeneity of glass crystal materials, changes in mechanical properties of different crystal directions, and complex surface processing by proposing a dual force control automatic compensation method. Traditional methods usually rely on a single sensor for compensation, which easily leads to inconsistent processing, especially in four-station collaborative processing. Due to the large fluctuations in removal rate, the compensation results often cannot match the actual processing volume, resulting in excessive or insufficient local processing. However, this solution introduces dual force control technology, which not only performs independent compensation control in multiple axes, but also combines the crystal direction distribution matrix and the material removal rate distribution matrix, so that the system can dynamically adjust the feed rate and cutting depth according to the differences in removal capabilities in different regions, and achieve precise control of material removal. In particular, through real-time feedback and dynamic correction, not only the compensation effect in four-station collaborative processing is optimized, but also the problems of removal rate fluctuations and local processing unevenness are solved, which significantly improves the processing consistency and surface accuracy, and meets the precision processing requirements of glass crystal workpieces. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 This is a flow chart of an embodiment of a dual force control automatic compensation method of the present invention; Figure 2 This is a flow chart of an embodiment of a dual force control automatic compensation method of the present invention; Figure 3 This is a structural schematic diagram of an embodiment of a dual-force-controlled grinding and polishing integrated device of the present invention; Figure 4 It is a partial enlarged view of an embodiment of a dual-force-controlled grinding and polishing integrated device of the present invention; Figure 5 This is a structural schematic diagram of an embodiment of a dual-force-controlled grinding and polishing integrated device of the present invention; Figure 6 This is a schematic structural diagram of a rotating part of an embodiment of a dual-force-controlled grinding and polishing integrated device according to the present invention.

[0018] Description of Figure Numbers: 100, base; 200, four-axis and five-axis cradle; 300, fixture; 400, connecting column; 500, spray system; 600, grinding head assembly; 700, shell; 610, rotating part; 611, casting swing arm; 612, grinding head box; 613, driving system.

[0019] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0022] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, "and / or" in the full text includes three solutions. Taking A and / or B as an example, it includes technical solution A, technical solution B, and technical solution that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, which must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0023] Embodiment 1: This embodiment effectively solves the limitations of the traditional single force control method in dealing with the heterogeneity of glass crystal materials, changes in mechanical properties of different crystal directions, and complex surface processing by proposing a dual force control automatic compensation method. Traditional methods usually rely on a single sensor for compensation, which easily leads to inconsistent processing, especially in four-station collaborative processing. Due to the large fluctuations in removal rate, the compensation results often cannot match the actual processing volume, resulting in local over- or under-processing. However, this solution introduces dual force control technology, which not only performs independent compensation control in multiple axes, but also combines the crystal direction distribution matrix and the material removal rate distribution matrix, so that the system can dynamically adjust the feed rate and cutting depth according to the differences in removal capabilities in different regions, and achieve precise control of material removal. In particular, through real-time feedback and dynamic correction, not only the compensation effect in four-station collaborative processing is optimized, but also the problems of removal rate fluctuations and local processing unevenness are solved, which significantly improves processing consistency and surface accuracy, and meets the precision processing requirements of glass crystal workpieces.

[0024] In the embodiment of the present invention, Figure 1 As shown, a dual-force control automatic compensation method is applied to a dual-force control grinding and polishing integrated device for grinding a glass crystal workpiece, comprising the following steps: Step S1, obtaining crystal orientation information of multiple positions on the surface of a glass crystal workpiece, and processing the crystal orientation data using a cluster analysis method according to the collected crystal orientation information, dividing the surface area into multiple crystal orientation areas and generating a crystal orientation distribution matrix containing crystal orientation types, crystal orientation angles, and corresponding physical performance data of different areas; Step S2, according to the crystal orientation information in the crystal orientation distribution matrix, the cutting mechanical characteristics of different crystal orientation regions are analyzed, the corresponding friction coefficient, hardness and elastic modulus are calculated, and the contact process between the abrasive grains and the glass crystal surface at different crystal orientations is simulated by combining the finite element method or the discrete element method, and the material removal rate distribution matrix is ​​obtained through the local removal rate difference; Step S3, based on the material removal rate distribution matrix, calculate the removal error gradient and correct the grinding trajectory of each crystal direction area, calculate and adjust the feed rate and cutting depth of each crystal direction area through the trajectory correction algorithm, and obtain the compensation trajectory matrix; Step S4: for each crystal direction region, according to the feed rate and cutting depth corresponding to the compensation trajectory matrix, dynamically calculate the required normal force and tangential force and adjust the contact force between the abrasive grains and the glass crystal surface in real time to obtain the dual force control adjustment parameters; Step S5: Based on the compensation trajectory matrix and the dual force control adjustment parameters, the data fed back by the sensor are compared, the processing parameters are dynamically corrected, the normal force and the tangential force are adjusted, and the final compensation strategy is obtained; Further, combined with Figure 2 , the step S1 further comprises: Selecting a plurality of measurement points at different positions on the surface of the glass crystal workpiece, and obtaining the crystal direction angle, crystal direction orientation, and related lattice constants at each measurement point through a diffraction spectrum to form a first crystal direction data set; Preprocessing the first original crystal direction data, using a Kalman filter algorithm or a median filter algorithm to remove noise caused by measurement error or environmental interference, standardizing the data, converting the data of each crystal direction into a unified format, and obtaining a second crystal direction data set; A K-means clustering algorithm or a spectral clustering algorithm is used to perform cluster analysis on the second crystal direction data, the surface area of ​​the glass crystal workpiece is divided into a plurality of crystal direction areas, and the crystal direction data of the areas where the cosine similarity between the crystal phase angles is higher than a preset threshold are classified into one category according to the similarity of the crystal direction angles, so as to obtain a third crystal direction data set; It should be noted here that when the cosine similarity between the crystal orientation angles is higher than a certain value, the preset threshold may be 0.95, or when the angle difference is less than a certain value (eg 5°), the crystal orientations of the two regions are considered to be similar and should be classified into one category.

[0025] Further, for each crystal direction region of the third crystal direction data set, the statistical distribution of the crystal direction types and crystal direction angles of all points in the region is calculated, and the mechanical properties of hardness, elastic modulus, plasticity index and friction coefficient of each region are calculated in combination with the physical properties of the glass crystal and known mechanical data, and a physical property matrix of each crystal phase region is generated; The physical property matrices of all crystal orientation regions are merged to obtain a crystal orientation distribution matrix including the crystal orientation types, crystal orientation angles and corresponding physical performance data of different regions.

[0026] It should be noted that multiple representative measurement points are selected on the workpiece surface, and each measurement point represents a local area with different crystal orientations. The selection of these points is crucial to ensure the representativeness of the crystal orientation data, because in the processing of non-homogeneous materials such as glass crystals, the change of crystal orientation at different positions on the surface will affect the material removal rate. Then, the crystal orientation angle, crystal orientation and related lattice constants of each measurement point are obtained through diffraction instruments or X-ray diffraction. These data directly affect the subsequent cutting mechanical properties and the simulation accuracy of material removal.

[0027] It should be added that the crystal angle, crystal orientation and lattice constant are parameters closely related to the microstructure of the material. They directly affect the material removal efficiency, surface quality and precision during the processing. The crystal angle refers to the angle between a certain crystal plane or crystal direction in the crystal and the reference coordinate system (such as the processing plane or the direction of movement of the equipment). In glass processing, if the glass material has a microcrystalline structure (such as some special glass or crystallized glass), the arrangement direction of its grains will affect the anisotropic behavior of the material. For example: the difference in hardness or toughness of different crystal directions may lead to uneven material removal rate during polishing, and the pressure needs to be dynamically adjusted through the dual force control system to compensate for the change in local resistance; the crystal angle deviation may cause the deviation of the polishing trajectory, and it is necessary to combine the multi-axis positioning function of the equipment (such as the multi-axis adjustment of the polishing wheel of the disc polisher) to achieve accurate path planning.

[0028] Crystal orientation refers to the arrangement of the main crystal axis of the microcrystal relative to the processing direction. If the grain orientation is concentrated (such as directional crystallization), macroscopic anisotropy may be formed. If the grain orientation is consistent with the direction of tool movement, it may reduce cutting resistance; if it is perpendicular, it may cause local stress concentration or subsurface damage.

[0029] The lattice constant is a basic parameter of the crystal structure, which refers to the side length of the unit cell (such as the length, width and height of the cubic crystal system). For glass with a microcrystalline structure, the uniformity of the lattice constant affects (material removal mechanism: small differences in lattice constants may lead to local hardness changes, and layered processing is required through the multi-stage grinding head configuration of the equipment (such as a combination of rough polishing and fine polishing)) and surface integrity (lattice mismatch areas are prone to sub-surface damage, and the adaptive compensation function of the dual force control system (such as automatic adjustment of the grinding head feed) is required to reduce the risk of cracks).

[0030] Furthermore, in order to ensure the accuracy of the crystal phase data, the collected first crystal phase data set is first denoised. Use the Kalman filter algorithm or the median filter algorithm (these two algorithms are widely used in the field of signal processing and are commonly used technical means by personnel in this field, so this article will not go into details) to eliminate the noise caused by measurement errors or environmental interference. The filtered data is more reliable and can effectively remove high-frequency noise and other uncertain factors. All the original data (that is, the first crystal phase data set) are standardized, and the data of each crystal direction is converted into a unified format to obtain the second crystal direction data set, so that the subsequent clustering analysis and physical property calculations are more consistent and simple.

[0031] Furthermore, the second crystal orientation data set is analyzed using a K-means clustering algorithm or a spectral clustering algorithm. These clustering algorithms divide the surface area into multiple crystal orientation regions by the similarity of the crystal orientation angles. Points with similar crystal orientation angles are divided into the same region to ensure that similar crystal orientation regions are concentrated together to avoid errors caused by mixing dissimilar crystal orientation data. In this way, the surface of the glass crystal workpiece will be divided into multiple crystal orientation regions, and the crystal orientation angles and mechanical properties in each region will tend to be consistent, and a third crystal orientation data set will be obtained, which is convenient for subsequent material removal rate calculation and compensation adjustment.

[0032] Furthermore, for each crystal direction region in the third crystal direction data set, the statistical distribution of the crystal direction types and crystal direction angles of all points in the region is calculated, and combined with the actual physical properties of the glass crystal (such as hardness, elastic modulus, etc.), the specific statistical method is preferably as follows: For each area , statistical frequency distribution of crystal orientation types: ; in is the number of points in the region whose crystal orientation type is [hkl], is the total number of points in the area, and many different types of points together constitute the area.

[0033] Through the angle distribution histogram, the crystal orientation angle is divided into intervals (such as every 10° is an interval), the percentage of points in each interval is counted, and the angle distribution is fitted using kernel density estimation: ; Where K is the Gaussian kernel function, h is the bandwidth, is the target angle for which the probability density needs to be calculated, The actual measured angle of the i-th point, where N is the total number of data points.

[0034] Furthermore, the mechanical properties such as friction coefficient, hardness, elastic modulus, and plasticity index of each region are calculated, and the physical property matrix is ​​obtained by combining the statistical distribution of the crystal orientation type and crystal orientation angle of all points in the region.

[0035] The physical property matrices of each crystal orientation region are merged to obtain a complete crystal orientation distribution matrix including the crystal orientation types, crystal orientation angles and corresponding physical performance data of different regions.

[0036] Furthermore, the physical property matrices of all crystal orientation regions are merged to obtain a crystal orientation distribution matrix including the crystal orientation types, crystal orientation angles and corresponding physical performance data of different regions, including: The crystal orientation distribution matrix is ​​visualized using heat maps or three-dimensional visualization technology to help further identify possible high stress areas or low removal rate areas, thereby providing a basis for subsequent processing compensation and obtaining the final crystal phase distribution matrix.

[0037] Through the above steps, from measuring crystal orientation information to generating crystal orientation distribution matrix, the whole process provides detailed crystal orientation data support for the dual force control automatic compensation method. Through accurate cluster analysis, denoising processing and physical property calculation, it provides a data basis for subsequent material removal rate calculation, compensation trajectory correction and dual force control adjustment. This not only solves the challenges brought by heterogeneity and complex shapes in glass crystal processing, but also provides an effective compensation solution for the unevenness problem in four-station collaborative processing. Through visualization processing, it further identifies possible high stress areas or low removal rate areas, thereby providing a basis for subsequent processing compensation, which not only improves the overall processing accuracy and consistency, but also ensures high-quality surface treatment results.

[0038] Furthermore, the step S2 comprises: According to the crystal orientation angle and position data recorded in the crystal orientation distribution matrix, the physical property data of friction coefficient, hardness, elastic modulus and plasticity index of each crystal orientation area are directly extracted. Combined with the actual physical properties of the glass crystal material, the contact state between the abrasive grains and the glass crystal surface is analyzed. Through the contact between the abrasive grains and different crystal orientation areas during the grinding process, the removal ability differences of each crystal orientation area are analyzed to obtain the removal rate information of each area. According to the removal rate information of each crystal direction area and combined with the actual processing feedback data, the material removal rate of each area is calculated, and a material removal rate distribution matrix is ​​generated that reflects the difference in removal capacity in different areas of the entire workpiece surface.

[0039] It should be noted that the contact state between the abrasive and the glass crystal surface is analyzed by using the parameters of the physical property data of the friction coefficient, hardness, elastic modulus, and plasticity index extracted for each crystal direction area. For example, in the high hardness area, the contact area between the abrasive and the material is small, and the removal rate is relatively low; while in the low hardness area, the removal rate is high. Combining experimental measurements and processing feedback data, the material removal rate of each area is calculated, and a material removal rate distribution matrix is ​​generated. This matrix is ​​used to characterize the differences in removal capabilities of various areas on the workpiece surface and provide a basis for grinding compensation.

[0040] Furthermore, the material removal rate of each region is calculated based on the removal rate information of each crystal direction region in combination with actual processing feedback data, and a material removal rate distribution matrix reflecting the removal capacity differences of different regions on the entire workpiece surface is generated, including: Based on the generated material removal rate distribution matrix, the grinding trajectory of each crystal direction area is corrected to ensure that the feed rate and cutting depth in each crystal direction area are optimized, and the feed rate and cutting depth of each crystal direction area are dynamically adjusted to obtain the adjustment result of the material removal rate distribution matrix; Based on the adjustment results of the material removal rate distribution matrix, the normal force and tangential force applied during the grinding process are corrected in real time through real-time sensor feedback. The sensor feedback data is compared with the compensation trajectory, and the distribution of normal force and tangential force is dynamically optimized to generate an optimized material removal rate distribution matrix.

[0041] It should be noted that based on the material removal rate distribution matrix, the removal error of each crystal direction region is first calculated to analyze which regions have a material removal rate lower or higher than the target value. For regions with lower removal rates, the feed rate or cutting depth needs to be appropriately increased to increase the material removal amount; for regions with higher removal rates, the feed rate or cutting depth needs to be reduced to prevent over-processing. For example, if the removal rate of a certain region is 20% lower than the average value, the cutting depth can be increased by 5%-10% to compensate. After adjusting the feed rate and cutting depth, an optimized removal rate distribution matrix is ​​formed, so that the removal amount of each region is more uniform. In the actual machining process, the contact state of the abrasive particles will be affected by the microstructure of the workpiece surface, resulting in a possible deviation between the removal rate and the calculated value. Therefore, during the grinding process, a force sensor is required to monitor the normal force and tangential force in real time and compare them with the compensation trajectory. If the removal rate of a certain region is still lower than the target value, the system will further increase the cutting depth or feed rate of the region; otherwise, the corresponding parameters will be reduced. The optimized material removal rate distribution matrix obtained by this real-time optimization strategy can ensure that the final removal rate is uniform and improve the machining accuracy.

[0042] Furthermore, the step S3 includes: For each crystal direction region in the material removal rate distribution matrix, the local removal error of the region is calculated, and the material removal rate error is calculated using a difference method or a gradient descent method to obtain a removal error gradient for each region; Combined with removing the error gradient, an adaptive adjustment algorithm or a particle swarm optimization algorithm is used to calculate the adjustment values ​​of the feed rate and cutting depth of each crystal direction area, the feed rate and cutting depth are adjusted, and a compensation trajectory matrix is ​​calculated according to the adjustment results; The step S4 comprises: According to the feed rate and cutting depth in the compensation trajectory matrix, the normal force and tangential force required for each crystal direction area are calculated using the force sensor feedback data, and the normal force and tangential force that need to be adjusted are obtained using the real-time feedback adjustment algorithm; Based on the adjusted normal force and tangential force, combined with real-time sensor data, the dual force control adjustment parameters of each crystal direction area are calculated through a feedback control algorithm.

[0043] It should be noted that during the processing, due to the differences in physical properties of different crystal orientation regions, the removal rate will be different in each region. In order to compensate for the removal error, it is necessary to calculate the removal error gradient, that is, to analyze the changing trend of the removal error in different regions. The difference method or gradient descent method can be used to calculate the error. For example, by comparing the removal rates of adjacent regions, it is determined which regions need additional adjustment. During the calculation process, if the removal error of a certain region is greater than the set threshold (such as ±5%), compensation is required. Then, according to the removal error gradient, the feed rate and cutting depth adjustment value of each crystal orientation region are calculated using an adaptive adjustment algorithm or a particle swarm optimization algorithm. For example, if the removal error of a certain region is +10% (too much removal), the feed rate can be appropriately reduced by 5%; if the removal error is -10% (insufficient removal), the feed rate is increased by 5%-10%. In this way, by accurately adjusting the feed rate and cutting depth of each region, the compensation trajectory matrix is ​​calculated to make the material removal more uniform and ensure that the surface quality meets the requirements.

[0044] Furthermore, during the grinding process, dual force control (normal force and tangential force) is an important factor affecting the removal rate. According to the feed rate and cutting depth in the compensation trajectory matrix, the force sensor is used to monitor the current normal force and tangential force in real time and calculate the required correction value. For example, in the high hardness area, the normal force needs to be increased to increase the contact pressure, thereby improving the removal rate; in the low hardness area, the normal force is appropriately reduced to prevent excessive removal. A real-time feedback adjustment algorithm, such as fuzzy control or PID (Proportion Integration Differentiation) control, is used to dynamically adjust the normal force and tangential force according to the sensor feedback data to make the grinding process more stable. After adjusting the normal force and tangential force, it is necessary to calculate the dual force control adjustment parameters, that is, to determine the force control strategy for different crystal orientation areas. For example, for the high hardness area, the normal force range can be set to 8N-12N, while the low hardness area can be set to 5N-8N. Through this dynamic adjustment strategy, the material removal rate in different areas can be ensured to be more uniform, improving the overall processing quality.

[0045] Furthermore, the step S5 comprises: Obtain the processing status data of each crystal direction area of ​​the glass crystal workpiece during the processing process, collect the normal force and tangential force data fed back by the sensor, compare them with the compensation trajectory matrix, calculate the difference between the actual removal rate and the expected removal rate of each crystal direction area, and obtain the removal error of each crystal direction area; According to the removed error, the normal force and tangential force after the correction compensation strategy are obtained, and then the feed rate and cutting depth adjustment value of each crystal direction area are calculated to obtain the corrected feed rate and cutting depth; All corrected normal and tangential forces as well as the corrected feed rate and cutting depth are integrated to generate the final compensation strategy based on the real-time adjustment of normal force, tangential force, feed rate and cutting depth.

[0046] It should be noted that during the grinding process, sensors are used to collect processing status data of each crystal region, including information such as normal force, tangential force, feed rate and cutting depth. The actual removal rate is compared with the theoretical removal rate to calculate the removal error. For example, if the actual removal rate of a certain area is 5% lower than the expected value, the processing parameters need to be adjusted to improve the removal rate. According to the removal error, the corrected normal force and tangential force are calculated, and the feed rate and cutting depth are adjusted accordingly so that the removal amount meets the target value. All corrected normal forces, tangential forces, feed rates and cutting depths are integrated to form the final compensation strategy. This strategy dynamically adjusts the processing parameters to improve the surface processing uniformity of the glass crystal workpiece and ensure that the final processing accuracy meets the set requirements. For example, during the entire processing process, the range of normal force and tangential force is adjusted in real time within ±10% to ensure a stable removal rate. Through this compensation strategy, the processing capability of the integrated grinding and polishing equipment can be improved, so that the surface finish and precision of the glass crystal workpiece meet the requirements of high-end manufacturing, ensuring the high precision, high efficiency and high consistency of the glass crystal workpiece grinding process, and improving the overall processing quality.

[0047] Embodiment 2: This technical solution provides a dual-force-controlled grinding and polishing integrated device, which, combined with a dual-force-controlled automatic compensation method, can accurately control the normal force and tangential force during the grinding process, improve the accuracy and consistency of surface processing of glass crystal workpieces, and is especially suitable for workpieces with complex shapes and inhomogeneities. The working process of the equipment ensures that the material removal amount matches the expectation through real-time feedback and dynamic adjustment of the processing parameters of each crystal direction area, thereby achieving a high-precision and high-consistency polishing effect.

[0048] Reference Figure 3 , Figure 4 and Figure 5A dual-force-controlled grinding and polishing integrated device adopts the dual-force-controlled automatic compensation method, the dual-force-controlled grinding and polishing integrated device comprises a base 100, a four-axis five-axis cradle 200, a fixture 300, a connecting column 400, a liquid spraying system 500 and a grinding head assembly 600; the four-axis five-axis cradle 200 is fixedly arranged on the base 100; the fixture 300 is fixed on the four-axis five-axis cradle 200; the connecting column 400 is arranged at the side end of the four-axis five-axis cradle 200 and is fixed on the base 100; the movable grinding head assembly 600 is fixedly connected to the connecting column 4 00 is located at one end away from the base 100 and is located directly above the fixture 300; the spray system 500 is respectively arranged at positions adjacent to the grinding head assembly 600 and the four-axis five-axis cradle 200; the grinding head assembly 600 also includes a rotating part 610; the rotating part 610 includes a casting swing arm 611, a grinding head box 612 and a driving system 613; a number of grinding head assemblies 600 are equidistantly arranged on the surface of the grinding head box 612; one end of the grinding head box 612 is rotatably connected to the casting swing arm 611, and the other end is connected to the driving system 613.

[0049] It should be noted that the four-axis five-axis cradle 200 is preferably composed of four axes and five axes, and can provide flexible movement in multiple directions and angles. It is fixed on the base 100, and adjusts the position and angle of the glass crystal workpiece during processing to ensure that the workpiece surface maintains the optimal contact angle with the grinding head assembly 600. Through multi-axis control, the cradle can adjust the posture of the workpiece in multiple dimensions, so that precise processing can be performed on complex surfaces. The spray system 500 is located adjacent to the grinding head assembly 600 and the four-axis five-axis cradle 200, and is responsible for providing lubrication for the workpiece and the grinding head during processing, reducing heat accumulation and abrasive wear, and improving processing results and surface finish.

[0050] It should also be noted that the fixture 300 is a large category of tools for carpentry, ironwork, fitter, machinery, electric control and other handicrafts, mainly as a tool to assist in controlling position or action. The fixture 300 can be divided into three categories: process assembly fixtures, project test fixtures and circuit board test fixtures. In this embodiment, the fixture 300 is used as a tool to assist in controlling the glass workpiece, so that it is fixed and cannot move, thereby facilitating processing.

[0051] Furthermore, the grinding head assembly 600 is the core component of the equipment, which is used to perform the actual grinding task. The grinding head assembly 600 is rotated by the rotating member 610 to ensure that the force is evenly applied to each crystal direction area. The design of the grinding head assembly 600 allows flexible adjustment at different stations to adapt to glass crystal workpieces with different shapes and surface requirements.

[0052] As a more preferred embodiment, refer to Figure 6 The grinding head box 612 is a rectangular parallelepiped, and a plurality of grinding head assemblies 600 are equidistantly arranged on two adjacent faces (not side faces) of the horizontally placed rectangular parallelepiped. The casting swing arm 611 connects one end of the grinding head box 612 to the rotating shaft of the equipment, so that the grinding head box 612 can rotate according to the requirements of the workpiece, ensuring that the grinding head maintains symmetrical and uniform contact during operation.

[0053] Furthermore, the dual-force-controlled grinding and polishing integrated device also includes a shell 700, which wraps the dual-force-controlled grinding and polishing integrated device composed of a base 100, a four-axis and five-axis cradle 200, a fixture 300, a connecting column 400, a liquid spray system 500 and a grinding head assembly 600.

[0054] The working process is as follows: First, when the equipment is started, the glass crystal workpiece on the fixture 300 is fixed and accurately positioned by the four-axis five-axis cradle 200, so that the contact area between the workpiece surface and the grinding head assembly 600 meets the processing requirements. At this time, instruments such as the diffraction spectrum or scanning electron microscope on the equipment measure multiple positions on the workpiece surface to obtain crystal direction information, including crystal direction angle, crystal direction orientation, and corresponding lattice constants. These data are recorded through the data acquisition card and the computing system to form a crystal direction distribution matrix. Then, by analyzing the crystal direction information in the crystal direction distribution matrix, the equipment begins to perform physical property analysis on each crystal direction area. Based on the material removal rate distribution matrix, the equipment will calculate the removal error gradient of each crystal direction area, and correct the grinding trajectory of each area through the trajectory correction algorithm, adjust the feed rate and cutting depth of each area to make it conform to the optimized compensation trajectory matrix, and by adjusting the moving path of the four-axis and five-axis cradle 200 and the angle of the fixture 300, the equipment will adjust the feed rate and cutting depth in real time according to the hardness and elastic modulus of each crystal direction area to ensure that the removal amount of each area is consistent with the expected target. Then, under the action of the grinding head assembly 600, the device provides the required normal force and tangential force through the rotating part 610 and the driving system 613. Each grinding head assembly 600 can adjust the normal force and tangential force in real time according to the preset compensation trajectory and dual force control adjustment parameters, thereby controlling the contact force between the abrasive and the glass crystal surface to ensure that the contact force is within a reasonable range. Through force sensors and displacement sensors, the device will continuously collect feedback data during the actual processing process. These sensor data are transmitted to the control system of the device in real time, and compared with the target data in the compensation trajectory matrix to calculate and remove errors. According to the error data, the device adjusts the normal force, tangential force and contact force through a real-time feedback adjustment algorithm to ensure the uniformity of the material removal process. Finally, based on the dual force control adjustment parameters and sensor feedback data, the device will generate a final compensation strategy. This strategy comprehensively considers parameters such as feed rate, cutting depth, normal force and tangential force in different crystal orientation regions, and optimizes the entire processing process through a closed-loop control system.

[0055] Specifically, the equipment adjusts the processing path and pressure of each crystal direction area in real time through the precise control of the four-axis five-axis cradle 200 and the fixture 300, ensuring that the material removal amount of each crystal direction area is consistent with expectations and that the accuracy of the processed surface meets the target requirements.

[0056] By combining the dual force control automatic compensation method, the dual force control grinding and polishing integrated equipment realizes high-precision processing of glass crystal workpieces. In the specific process, from the acquisition of crystal direction information to the calculation of physical properties, to the generation of removal rate distribution matrix and dynamic compensation adjustment, each step is supported by precise technical means. Through the dual force control adjustment system, the equipment can realize real-time optimization of normal force and tangential force, thereby ensuring the consistency of removal amount and surface quality in each crystal direction area. In addition, the equipment is particularly suitable for four-station collaborative processing, and can solve the problems of complex shapes, non-homogeneity and removal unevenness that are difficult to handle with traditional single force control methods. In the end, the equipment can dynamically correct the removal error of each station when multiple stations are processing at the same time, thereby improving the overall processing accuracy and consistency.

[0057] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A dual-force control automatic compensation method, applied to dual-force control grinding and polishing integrated equipment for grinding glass crystal workpieces, characterized in that: The steps include: Step S1, obtaining crystal orientation information of multiple positions on the surface of a glass crystal workpiece, and processing the crystal orientation data using a cluster analysis method according to the collected crystal orientation information, dividing the surface area into multiple crystal orientation areas and generating a crystal orientation distribution matrix containing crystal orientation types, crystal orientation angles, and corresponding physical performance data of different areas; Step S2, according to the crystal orientation information in the crystal orientation distribution matrix, the cutting mechanical characteristics of different crystal orientation regions are analyzed, the corresponding friction coefficient, hardness and elastic modulus are calculated, and the contact process between the abrasive grains and the glass crystal surface at different crystal orientations is simulated by combining the finite element method or the discrete element method, and the material removal rate distribution matrix is ​​obtained through the local removal rate difference; Step S3, based on the material removal rate distribution matrix, calculate the removal error gradient and correct the grinding trajectory of each crystal direction area, calculate and adjust the feed rate and cutting depth of each crystal direction area through the trajectory correction algorithm, and obtain the compensation trajectory matrix; Step S4: for each crystal direction region, according to the feed rate and cutting depth corresponding to the compensation trajectory matrix, dynamically calculate the required normal force and tangential force and adjust the contact force between the abrasive grains and the glass crystal surface in real time to obtain the dual force control adjustment parameters; Step S5: Based on the compensation trajectory matrix and the dual force control adjustment parameters, the data fed back by the sensor are compared, the processing parameters are dynamically corrected, the normal force and the tangential force are adjusted, and the final compensation strategy is obtained.

2. The dual force control automatic compensation method according to claim 1, characterized in that: The step S1 further comprises: Selecting a plurality of measurement points at different positions on the surface of the glass crystal workpiece, and obtaining the crystal direction angle, crystal direction orientation, and related lattice constants at each measurement point through a diffraction spectrum to form a first crystal direction data set; Preprocessing the first original crystal direction data, using a Kalman filter algorithm or a median filter algorithm to remove noise caused by measurement error or environmental interference, standardizing the data, converting the data of each crystal direction into a unified format, and obtaining a second crystal direction data set; A K-means clustering algorithm or a spectral clustering algorithm is used to perform cluster analysis on the second crystal direction data, the surface area of ​​the glass crystal workpiece is divided into a plurality of crystal direction areas, and the crystal direction data of the areas where the cosine similarity between the crystal phase angles is higher than a preset threshold are classified into one category according to the similarity of the crystal direction angles, so as to obtain a third crystal direction data set; For each crystal direction region of the third crystal direction data set, the statistical distribution of the crystal direction types and crystal direction angles of all points in the region is calculated, and the mechanical properties of hardness, elastic modulus, plasticity index and friction coefficient of each region are calculated in combination with the physical properties of the glass crystal and the known mechanical data, and a physical property matrix of each crystal phase region is generated; The physical property matrices of all crystal orientation regions are merged to obtain a crystal orientation distribution matrix including the crystal orientation types, crystal orientation angles and corresponding physical performance data of different regions.

3. The dual force control automatic compensation method according to claim 2, characterized in that: The physical property matrices of all crystal orientation regions are combined to obtain a crystal orientation distribution matrix including crystal orientation types, crystal orientation angles and corresponding physical performance data of different regions, including: The crystal orientation distribution matrix is ​​visualized using heat maps or three-dimensional visualization technology to obtain the final crystal phase distribution matrix.

4. The dual force control automatic compensation method according to claim 1, characterized in that: The step S2 comprises: According to the crystal orientation angle and position data recorded in the crystal orientation distribution matrix, the physical property data of friction coefficient, hardness, elastic modulus and plasticity index of each crystal orientation area are directly extracted. Combined with the actual physical properties of the glass crystal material, the contact state between the abrasive grains and the glass crystal surface is analyzed. Through the contact between the abrasive grains and different crystal orientation areas during the grinding process, the removal ability differences of each crystal orientation area are analyzed to obtain the removal rate information of each area. According to the removal rate information of each crystal direction area and combined with the actual processing feedback data, the material removal rate of each area is calculated, and a material removal rate distribution matrix is ​​generated that reflects the difference in removal capacity in different areas of the entire workpiece surface.

5. The dual force control automatic compensation method according to claim 4, characterized in that: The material removal rate of each region is calculated based on the removal rate information of each crystal direction region in combination with the actual processing feedback data, and a material removal rate distribution matrix reflecting the removal capacity differences of different regions on the entire workpiece surface is generated, including: Based on the generated material removal rate distribution matrix, the grinding trajectory of each crystal direction area is corrected to ensure that the feed rate and cutting depth in each crystal direction area are optimized, and the feed rate and cutting depth of each crystal direction area are dynamically adjusted to obtain the adjustment result of the material removal rate distribution matrix; Based on the adjustment results of the material removal rate distribution matrix, the normal force and tangential force applied during the grinding process are corrected in real time through real-time sensor feedback. The sensor feedback data is compared with the compensation trajectory, and the distribution of normal force and tangential force is dynamically optimized to generate an optimized material removal rate distribution matrix.

6. The dual force control automatic compensation method according to claim 1, characterized in that: The step S3 comprises: For each crystal direction region in the material removal rate distribution matrix, the local removal error of the region is calculated, and the material removal rate error is calculated using a difference method or a gradient descent method to obtain a removal error gradient for each region; Combined with removing the error gradient, an adaptive adjustment algorithm or a particle swarm optimization algorithm is used to calculate the adjustment values ​​of the feed rate and cutting depth of each crystal direction area, adjust the feed rate and cutting depth, and calculate the compensation trajectory matrix based on the adjustment results.

7. The dual force control automatic compensation method according to claim 1, characterized in that: The step S4 comprises: According to the feed rate and cutting depth in the compensation trajectory matrix, the normal force and tangential force required for each crystal direction area are calculated using the force sensor feedback data, and the normal force and tangential force that need to be adjusted are obtained using the real-time feedback adjustment algorithm; Based on the adjusted normal force and tangential force, combined with real-time sensor data, the dual force control adjustment parameters of each crystal direction area are calculated through a feedback control algorithm.

8. The dual force control automatic compensation method according to claim 7, characterized in that: The step S5 comprises: Obtain the processing status data of each crystal direction area of ​​the glass crystal workpiece during the processing process, collect the normal force and tangential force data fed back by the sensor, compare them with the compensation trajectory matrix, calculate the difference between the actual removal rate and the expected removal rate of each crystal direction area, and obtain the removal error of each crystal direction area; According to the removed error, the normal force and tangential force after the correction compensation strategy are obtained, and then the feed rate and cutting depth adjustment value of each crystal direction area are calculated to obtain the corrected feed rate and cutting depth; All corrected normal and tangential forces as well as the corrected feed rate and cutting depth are integrated to generate the final compensation strategy based on the real-time adjustment of normal force, tangential force, feed rate and cutting depth.

9. A dual-force-controlled grinding and polishing integrated device, using the dual-force-controlled automatic compensation method according to any one of claims 1 to 8, characterized in that: The dual-force-controlled grinding and polishing integrated equipment includes a base, a four-axis and five-axis cradle, a fixture, a connecting column, a liquid spray system and a grinding head assembly; The four-axis five-axis cradle is fixedly arranged on the base; The jig is fixed on the four-axis and five-axis cradle; The connecting column is arranged at the side end of the four-axis five-axis cradle and fixed on the base; The movable grinding head assembly is fixedly connected to an end of the connecting column away from the base and is arranged at a position directly above the fixture; The liquid spraying systems are respectively arranged at positions adjacent to the grinding head assembly and the four-axis and five-axis cradle.

10. The dual-force-controlled grinding and polishing integrated equipment according to claim 9, characterized in that: The grinding head assembly also includes a rotating member; The rotating part includes a casting swing arm, a grinding head housing and a driving system; A plurality of grinding head assemblies are equidistantly arranged on the surface of the grinding head box; One end of the grinding head housing is rotatably connected to the casting swing arm, and the other end is connected to the driving system.

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