Photovoltaic module backboard separating device

Abstract

The invention discloses a photovoltaic module back plate separation device. The photovoltaic module back plate separation device comprises a transmission mechanism and a stripping mechanism. According to the photovoltaic module backboard separation device, the overall transmission assembly is used for transmitting the whole photovoltaic module, the silicon wafer structure transmission assembly is used for transmitting a silicon wafer structure, the backboard transmission assembly is used for transmitting a backboard, and the heat knife stripping assembly is used for cutting an adhesive layer. The photovoltaic module is integrally separated into a back plate and a silicon wafer structure, the back plate and the silicon wafer structure of the photovoltaic module can be completely and completely separated, key materials are efficiently and accurately recycled, convenience is provided for subsequent recycling and sorting of the key materials of the photovoltaic module, the cost of the subsequent process is reduced, and the production efficiency is improved. And meanwhile, due to the hot cutting efficiency, the back plate stripping speed is greatly improved, and the defects that the photovoltaic module is not thoroughly separated and the separated back plates are fragmented and mixed in the traditional process are overcome.

Description

Technical Field

[0001] The invention relates to the field of photovoltaic panel recycling and decomposition, in particular to a photovoltaic module back panel separation device. Background Art

[0002] With the development of photovoltaic power generation, the service life of photovoltaics is gradually expiring, and many damaged photovoltaic modules have entered the recycling period. At present, the main way to process photovoltaics after recycling in the market is to remove the backplane by milling and peel off the glass with rollers to obtain silicon wafers. This process is less effective when removing the backplane, and the backplane will remain on the silicon wafer, which brings great trouble and high cost to the subsequent extraction of silicon wafer elements. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a photovoltaic module backboard separation device.

[0004] The technical solution adopted by the present invention to solve the technical problem is: construct a photovoltaic module backplane separation device, the photovoltaic module includes a backplane, a glue layer and a silicon wafer structure, the backplane is connected to the silicon wafer structure through the glue layer, and the photovoltaic module backplane separation device includes a transmission mechanism and a peeling mechanism;

[0005] The transmission mechanism includes an overall transmission component, a silicon wafer structure transmission component and a backplane transmission component, wherein the overall transmission component is used to transmit the photovoltaic component as a whole, the silicon wafer structure transmission component is used to transmit the silicon wafer structure, and the backplane transmission component is used to transmit the backplane;

[0006] The stripping mechanism is connected to the transmission mechanism and is located between the overall transmission component and the silicon wafer structure transmission component. The stripping mechanism includes a hot knife stripping component, which is used to cut the adhesive layer to separate the photovoltaic component as a whole into the backplane and the silicon wafer structure.

[0007] In some embodiments, the integrated transmission assembly includes an integrated transmission support frame, an integrated transmission line connected to the integrated transmission support frame, and an integrated centering device connected to the integrated transmission support frame.

[0008] In some embodiments, the integral centering device includes an integral centering member connected to the integral transmission support frame and a centering cylinder connected to the integral transmission support frame;

[0009] The centering cylinder is arranged in cooperation with the integral centering member to ensure the centering of the overall input of the photovoltaic assembly;

[0010] An integral centering adjustment hole is provided on the integral centering piece.

[0011] In some embodiments, the silicon wafer structure transmission component includes a silicon wafer structure support frame and a silicon wafer structure transmission line connected to the silicon wafer structure support frame;

[0012] The silicon wafer structure transmission line is arranged flush with the overall transmission line.

[0013] In some embodiments, the backplane transmission assembly includes a backplane transmission support frame connected to the silicon wafer structure support frame, a backplane transmission line connected to the backplane transmission support frame, a backplane centering device connected to the backplane transmission support frame, and a backplane pressing roller device connected to the backplane transmission support frame;

[0014] The backplane transmission line is arranged obliquely relative to the silicon wafer structure transmission line, the backplane centering device is used to realize the centering of the backplane, and the backplane pressing roller device is used to position and press the backplane.

[0015] In some embodiments, the transmission mechanism further includes a transmission transmission assembly, the transmission transmission assembly including a transmission transmission support frame, a transmission driver connected to the transmission transmission support frame, and a transmission transmission member connected to an output end of the transmission driver;

[0016] The two ends of the transmission and drive support frame are respectively connected to the overall transmission support frame and the silicon wafer structure support frame;

[0017] The transmission transmission member is simultaneously transmission-connected to the overall transmission line, the silicon wafer structure transmission line and the backplane transmission line.

[0018] In some embodiments, the stripping mechanism includes a stripping support frame, a plurality of support roller assemblies, and a plurality of pressing roller assemblies;

[0019] The stripping support frame is connected to the transmission drive support frame;

[0020] Each of the support roller assemblies comprises a support roller member movably connected to the stripping support frame and a support roller linkage member connected to the support roller member;

[0021] Each of the pressing roller assemblies comprises a pressing roller member, a pressing connecting member, a pressing abutting member, a pressing fixing member, a pressing guiding member and an elastic member;

[0022] The pressing roller member and the pressing abutment member are commonly connected to the pressing connecting member, the pressing connecting member is movably connected to the pressing guide member, the pressing fixing member is fixedly connected to the stripping support frame, the pressing guide member is connected to the pressing fixing member, the elastic member is sleeved on the outside of the pressing guide member, and the first end of the elastic member is connected to the pressing connecting member, and the second end of the elastic member is connected to the pressing fixing member.

[0023] In some embodiments, the hot knife stripping assembly includes a stripping positioning member connected to the stripping support frame, a stripping connecting frame connected to the stripping positioning member, a blade holder connected to the stripping connecting frame, a knife connected to the blade holder, an electric heating wire installed in the blade holder, and a pressing block;

[0024] The pressing block is connected to the cutter and the blade holder respectively, and the upper end surface of the pressing block is inclined relative to the horizontal plane of the blade holder.

[0025] In some embodiments, the stripping mechanism further includes a stripping guide assembly, wherein the stripping guide assembly includes an upper guide plate, a lower guide plate, a silicon wafer structure guide plate, and a clamping retainer;

[0026] The upper guide plate and the lower guide plate are both connected to the stripping support frame, and the upper guide plate and the lower guide plate are both inclined relative to the horizontal plane of the stripping support frame, and a receiving space for the separated backing plate to pass through is formed between the upper guide plate and the lower guide plate, and the receiving space is correspondingly arranged to the upper end surface of the pressing block;

[0027] The silicon wafer structure guide plate is arranged in parallel with the stripping support frame, and the silicon wafer structure guide plate is used to provide a guide for the separated silicon wafer structure;

[0028] The pressing and fixing member is connected to the stripping support frame, the pressing and fixing member is arranged corresponding to the accommodating space, and the pressing and fixing member is used to press on the separated back plate.

[0029] In some embodiments, the stripping mechanism further includes a stripping transmission assembly, wherein the stripping transmission assembly includes a stripping transmission driver connected to the stripping support frame and a stripping transmission member connected to an output end of the stripping transmission driver;

[0030] The stripping transmission member is simultaneously transmission-connected with a plurality of the supporting roller linkage members.

[0031] The implementation of the present invention has the following beneficial effects: the photovoltaic module backplane separation device utilizes an integral transmission component to transmit the photovoltaic module as a whole, utilizes a silicon wafer structure transmission component to transmit the silicon wafer structure, utilizes a backplane transmission component to transmit the backplane, and utilizes a hot knife stripping component to cut the adhesive layer to separate the photovoltaic module as a whole into a backplane and a silicon wafer structure, and can completely and fully separate the backplane and the silicon wafer structure of the photovoltaic module, thereby achieving efficient and accurate recovery of key materials, providing convenience for subsequent recovery and sorting of key materials of the photovoltaic module, and reducing the cost of subsequent processes. At the same time, the efficiency of hot cutting greatly improves the speed of backplane stripping, avoiding the defects of incomplete separation of photovoltaic modules and fragmented and mixed separation of backplanes in traditional processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solution of the present invention, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work. In the drawings:

[0033] Figure 1 It is a schematic diagram of the overall structure of the photovoltaic module back plate separation device of the present invention;

[0034] Figure 2 yes Figure 1 The enlarged schematic diagram of point A in the middle;

[0035] Figure 3 It is a structural schematic diagram of the peeling mechanism of the present invention;

[0036] Figure 4 yes Figure 3 The enlarged schematic diagram of point B in the middle;

[0037] Figure 5 It is a schematic diagram of the internal structure of the peeling mechanism of the present invention. DETAILED DESCRIPTION

[0038] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the device or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0039] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0040] Reference Figures 1 to 5 , is a photovoltaic module backplane separation device in some embodiments of the present invention, the photovoltaic module includes a backplane, a glue layer and a silicon wafer structure, and the backplane is connected to the silicon wafer structure through the glue layer. Specifically, the photovoltaic module is a crystalline silicon photovoltaic module, the glue layer is an EVA glue layer, the silicon wafer structure is a structure composed of tempered glass, conductive copper strips, and battery cells, the backplane is a TPT backplane, and the TPT backplane is connected to the silicon wafer structure through the EVA glue layer.

[0041] like Figure 1 As shown, the photovoltaic module backplane separation device includes a transmission mechanism 1 and a stripping mechanism 2. The transmission mechanism 1 includes an overall transmission component 11, a silicon wafer structure transmission component 12 and a backplane transmission component 13. The overall transmission component 11 is used to transmit the photovoltaic module as a whole, the silicon wafer structure transmission component 12 is used to transmit the silicon wafer structure, and the backplane transmission component 13 is used to transmit the backplane. The stripping mechanism 2 is connected to the transmission mechanism 1 and is located between the overall transmission component 11 and the silicon wafer structure transmission component 12. The stripping mechanism 2 includes a hot knife stripping component 21, which is used to cut the glue layer to separate the photovoltaic module as a whole into the backplane and the silicon wafer structure.

[0042] It can be understood that the photovoltaic module backplane separation device utilizes the overall transmission component 11 to transmit the photovoltaic module as a whole, utilizes the silicon wafer structure transmission component 12 to transmit the silicon wafer structure, utilizes the backplane transmission component 13 to transmit the backplane, and utilizes the hot knife stripping component 21 to cut the adhesive layer to separate the photovoltaic module as a whole into the backplane and the silicon wafer structure. The backplane and the silicon wafer structure of the photovoltaic module can be completely and completely separated, and the efficient and accurate recovery of key materials is achieved, which provides convenience for the subsequent recovery and sorting of key materials of the photovoltaic module, and reduces the cost of subsequent processes. At the same time, the efficiency of hot cutting greatly improves the speed of backplane stripping, avoiding the defects of incomplete separation of photovoltaic modules and fragmented and mixed separation of backplanes in traditional processes.

[0043] like Figure 1 As shown, the integral transmission assembly 11 includes an integral transmission support frame 111, an integral transmission line 112 connected to the integral transmission support frame 111, and an integral centering device 113 connected to the integral transmission support frame 111. The integral centering device 113 includes an integral centering piece 1131 connected to the integral transmission support frame 111 and a centering cylinder 1132 connected to the integral transmission support frame 111. The centering cylinder 1132 is arranged in cooperation with the integral centering piece 1131 to ensure the centering of the overall input of the photovoltaic assembly. An integral centering adjustment hole 1133 is provided on the integral centering piece 1131. In this embodiment, the number of the integral centering pieces 1131 is three, and the centering cylinder 1132 cooperates with one of the integral centering pieces 1131.

[0044] It can be understood that the overall transmission line 112 can be used to transmit the photovoltaic module as a whole before separation, and the overall centering adjustment hole 1133 can be set according to the width of the photovoltaic module as a whole. The centering cylinder 1132 further ensures that the overall centering device 113 is positioned and centered for the photovoltaic module as a whole. The overall centering device 113 can realize the centering positioning of the photovoltaic module as a whole in the width direction, and ensure the centering positioning of the photovoltaic module as a whole on the overall transmission line 112. The overall transmission line 112 can also be provided with a laser sensor for detecting whether there is a photovoltaic module on the overall transmission line 112, or whether the photovoltaic module has been transmitted out of the overall transmission line 112.

[0045] Furthermore, the silicon wafer structure transmission component 12 includes a silicon wafer structure support frame 121 and a silicon wafer structure transmission line 122 connected to the silicon wafer structure support frame 121, and the silicon wafer structure transmission line 122 is arranged flush with the overall transmission line 112. The silicon wafer structure transmission line 122 is specifically used to transmit the separated silicon wafer structure. Among them, the height of the overall transmission line 112 and the silicon wafer structure transmission line 122 from the ground is preferably 1018mm.

[0046] The backplane transmission assembly 13 includes a backplane transmission support frame 131 connected to the silicon wafer structure support frame 121, a backplane transmission line 132 connected to the backplane transmission support frame 131, a backplane centering device 133 connected to the backplane transmission support frame 131, and a backplane pressing roller device 134 connected to the backplane transmission support frame 131. The backplane transmission line 132 is tilted relative to the silicon wafer structure transmission line 122, the backplane centering device 133 is used to realize the centering of the backplane, and the backplane pressing roller device 134 is used to position and press the backplane. The tilt angle of the backplane transmission line 132 relative to the silicon wafer structure transmission line 122 is preferably 15 degrees. The backplane transmission line 132 is docked with the backplane separated by the peeling mechanism 2, so that the transmission process of the backplane is smoother.

[0047] like Figure 1 and Figure 2 As shown, the transmission mechanism 1 also includes a transmission transmission assembly 14, which includes a transmission transmission support frame 141, a transmission driver 142 connected to the transmission transmission support frame 141, and a transmission transmission member 143 connected to the output end of the transmission driver 142. The two ends of the transmission transmission support frame 141 are respectively connected to the overall transmission support frame 111 and the silicon wafer structure support frame 121, and the transmission transmission member 143 is simultaneously connected to the overall transmission line 112, the silicon wafer structure transmission line 122, and the backplane transmission line 132. The transmission driver 142 can be a speed regulating motor, and the transmission transmission member 143 can be a chain. The speed regulating motor can be connected to the overall transmission line 112, the silicon wafer structure transmission line 122, and the backplane transmission line 132 through the chain, so that the overall transmission line 112, the silicon wafer structure transmission line 122, and the backplane transmission line 132 are fully synchronously transmitted.

[0048] like Figures 3 to 5 As shown, the stripping mechanism 2 includes a stripping support frame 22, a plurality of support roller assemblies 23, and a plurality of pressing roller assemblies 24. The stripping support frame 22 is connected to the transmission drive support frame 141, and each support roller assembly 23 includes a support roller member 231 movably connected to the stripping support frame 22 and a support roller linkage 232 connected to the support roller member 231. The support roller member 231 and the support roller linkage 232 can be fixedly connected, and the support roller member 231 can drive the photovoltaic assembly as a whole before separation into the hot knife stripping assembly 21, or drive the back plate and silicon wafer structure after separation into the subsequent mechanism.

[0049] Furthermore, each pressing roller assembly 24 includes a pressing roller member 241, a pressing connecting member 242, a pressing abutting member 243, a pressing fixing member 244, a pressing guide member 245, and an elastic member 246. The pressing roller member 241 and the pressing abutting member 243 are connected to the pressing connecting member 242, the pressing connecting member 242 is movably connected to the pressing guide member 245, the pressing fixing member 244 is fixedly connected to the stripping support frame 22, the pressing guide member 245 is connected to the pressing fixing member 244, the elastic member 246 is sleeved on the outside of the pressing guide member 245, and the first end of the elastic member 246 is connected to the pressing connecting member 242, and the second end of the elastic member 246 is connected to the pressing fixing member 244.

[0050] It can be understood that the pressing connecting member 242 can be connected to the pressing roller member 241 through a bearing, and the pressing abutment member 243 can be connected to the pressing connecting member 242 through a bolt. The pressing roller member 241 and the pressing abutment member 243 cooperate with the supporting roller member 231 to form a compression on the photovoltaic module, ensure the friction between the photovoltaic module and the supporting roller member 231, and flatten the photovoltaic module at the same time, so that the separation position of the hot knife stripping assembly 21 is more accurate. In this embodiment, the pressing abutment member 243 is made of a spring sheet, the pressing roller member 241 is connected to the middle of the pressing connecting member 242, and the two pressing abutment members 243 are separately arranged on both sides of the pressing roller member 241. The spring sheet structure is used on both sides of the pressing roller member 241 to compress the photovoltaic module, which can avoid the defects of small contact area and limited flattening effect due to the possible presence of a glue layer on the edge of the photovoltaic module.

[0051] In addition, the upper portion of the pressing guide member 245 can be threadedly connected to the pressing fixing member 244, and the lower portion of the pressing guide member 245 is inserted into the pressing connecting member 242. The elastic member 246 can be a spring. The setting of the elastic member 246 can make the pressing roller assembly 24 adaptively adjusted according to the thickness of different photovoltaic modules, ensuring that the pressing abutment member 243 and the pressing roller member 241 can press against the photovoltaic module.

[0052] like Figure 5As shown, the hot knife stripping assembly 21 includes a stripping positioning member 211 connected to the stripping support frame 22, a stripping connection frame 212 connected to the stripping positioning member 211, a blade frame 213 connected to the stripping connection frame 212, a cutter 214 connected to the blade frame 213, an electric heating wire installed in the blade frame 213, and a pressing block 215. The pressing block 215 is connected to the cutter 214 and the blade frame 213 respectively, and the upper end surface of the pressing block 215 is inclined relative to the horizontal plane of the blade frame 213. Specifically, the cutter 214 can be fixed to the blade frame 213 by bolts and the pressing block 215 at the same time, and the cutter 214 can be replaced from the side, and the stripping positioning member 211 can be adjusted relative to the stripping support frame 22. Adjusting the position of the stripping positioning member 211 also adjusts the height and angle of the blade frame 213 and the cutter 214, so as to facilitate the alignment of the cutting edge of the cutter 214 with the adhesive layer between the back plate and the silicon wafer structure. When the electric heating wire is powered on, it generates heat to heat the blade holder 213 first, and then transfers the heat to the cutter 214. Finally, the edge temperature of the cutter 214 can reach 100°C, which can soften the adhesive layer without melting it. At this time, the softened adhesive layer is cut to separate the back plate and the silicon wafer structure. The cross-sectional shape of the pressing block 215 is triangular, and its upper end face is inclined relative to the horizontal plane of the blade holder 213. After the back plate and the silicon wafer structure are separated, the back plate can enter the subsequent accommodation space along the upper end face of the pressing block 215.

[0053] In addition, the stripping mechanism 2 also includes a stripping guide assembly 25, which includes an upper guide plate 251, a lower guide plate 252, a silicon wafer structure guide plate 253 and a clamping fixture 254. The upper guide plate 251 and the lower guide plate 252 are both connected to the stripping support frame 22, and the upper guide plate 251 and the lower guide plate 252 are both inclined relative to the horizontal plane of the stripping support frame 22. An accommodating space for the separated back plate to pass through is formed between the upper guide plate 251 and the lower guide plate 252, and the accommodating space is arranged corresponding to the upper end surface of the pressing block 215. The silicon wafer structure guide plate 253 is arranged parallel to the stripping support frame 22, and the silicon wafer structure guide plate 253 is used to provide a guiding effect for the separated silicon wafer structure. The clamping fixture 254 is connected to the stripping support frame 22, and the clamping fixture 254 is arranged corresponding to the accommodating space, and the clamping fixture 254 is used to press on the separated back plate. It can be understood that the accommodation space formed between the upper guide plate 251 and the lower guide plate 252 can allow the separated backplane to pass through, thereby providing a guiding effect for the separated backplane and facilitating the docking of the separated backplane with the backplane transmission line 132. The separated silicon wafer structure moves along the lower end surface of the silicon wafer structure guide plate 253, and a space for the silicon wafer structure to pass through is formed between the silicon wafer structure guide plate 253 and the supporting roller member 231. In addition, the clamping retaining member 254 is specifically used to cooperate with one of the supporting roller members 231 to position and clamp the separated backplane.

[0054] like Figure 3 As shown, the peeling mechanism 2 also includes a peeling transmission assembly 26, which includes a peeling transmission driver 261 connected to the peeling support frame 22 and a peeling transmission member 262 connected to the output end of the peeling transmission driver 261, and the peeling transmission member 262 is simultaneously connected to multiple supporting roller linkages 232. The peeling transmission driver 261 can be a speed-adjustable motor, and the peeling transmission member 262 can be a chain. The speed-adjustable motor can be connected to multiple supporting roller linkages 232 through the chain to achieve fully synchronous transmission.

[0055] It can be understood that the above embodiments only express the preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, which all belong to the protection scope of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should belong to the scope covered by the claims of the present invention.

Claims

1. A photovoltaic module backplane separation device, the photovoltaic module comprising a backplane, an adhesive layer and a silicon wafer structure, the backplane is connected to the silicon wafer structure through the adhesive layer, characterized in that: The photovoltaic module backboard separation device comprises a transmission mechanism (1) and a peeling mechanism (2); The transmission mechanism (1) comprises an overall transmission component (11), a silicon wafer structure transmission component (12) and a backplane transmission component (13); the overall transmission component (11) is used to transmit the photovoltaic component as a whole, the silicon wafer structure transmission component (12) is used to transmit the silicon wafer structure, and the backplane transmission component (13) is used to transmit the backplane; The stripping mechanism (2) is connected to the transmission mechanism (1) and is located between the overall transmission component (11) and the silicon wafer structure transmission component (12). The stripping mechanism (2) comprises a hot knife stripping component (21). The hot knife stripping component (21) is used to cut the adhesive layer to separate the photovoltaic component as a whole into the backplane and the silicon wafer structure.

2. The photovoltaic module back plate separation device according to claim 1, characterized in that: The integrated transmission assembly (11) comprises an integrated transmission support frame (111), an integrated transmission line (112) connected to the integrated transmission support frame (111), and an integrated centering device (113) connected to the integrated transmission support frame (111).

3. The photovoltaic module back plate separation device according to claim 2, characterized in that: The integral centering device (113) comprises an integral centering piece (1131) connected to the integral transmission support frame (111) and a centering cylinder (1132) connected to the integral transmission support frame (111); The centering cylinder (1132) is arranged in cooperation with the integral centering member (1131) to ensure the centering of the integral input of the photovoltaic assembly; An integral centering adjustment hole (1133) is provided on the integral centering member (1131).

4. The photovoltaic module back plate separation device according to claim 2, characterized in that: The silicon wafer structure transmission component (12) comprises a silicon wafer structure support frame (121) and a silicon wafer structure transmission line (122) connected to the silicon wafer structure support frame (121); The silicon chip structure transmission line (122) is arranged flush with the overall transmission line (112).

5. The photovoltaic module back plate separation device according to claim 4, characterized in that: The backplane transmission component (13) comprises a backplane transmission support frame (131) connected to the silicon wafer structure support frame (121), a backplane transmission line (132) connected to the backplane transmission support frame (131), a backplane centering device (133) connected to the backplane transmission support frame (131), and a backplane pressing roller device (134) connected to the backplane transmission support frame (131); The backplane transmission line (132) is arranged obliquely relative to the silicon wafer structure transmission line (122); the backplane centering device (133) is used to realize the centering of the backplane; and the backplane pressing roller device (134) is used to position and press the backplane.

6. The photovoltaic module back plate separation device according to claim 5, characterized in that: The transmission mechanism (1) further comprises a transmission drive assembly (14), wherein the transmission drive assembly (14) comprises a transmission drive support frame (141), a transmission driver (142) connected to the transmission drive support frame (141), and a transmission drive member (143) connected to an output end of the transmission driver (142); Two ends of the transmission and drive support frame (141) are respectively connected to the overall transmission support frame (111) and the silicon wafer structure support frame (121); The transmission transmission member (143) is simultaneously transmission-connected to the overall transmission line (112), the silicon wafer structure transmission line (122) and the backplane transmission line (132).

7. The photovoltaic module back plate separation device according to claim 6, characterized in that: The stripping mechanism (2) comprises a stripping support frame (22), a plurality of supporting roller assemblies (23) and a plurality of pressing roller assemblies (24); The stripping support frame (22) is connected to the transmission drive support frame (141); Each of the supporting roller assemblies (23) comprises a supporting roller member (231) movably connected to the peeling support frame (22) and a supporting roller linkage member (232) connected to the supporting roller member (231); Each of the pressing roller assemblies (24) comprises a pressing roller member (241), a pressing connecting member (242), a pressing abutting member (243), a pressing fixing member (244), a pressing guiding member (245) and an elastic member (246); The pressing roller member (241) and the pressing abutment member (243) are commonly connected to the pressing connecting member (242), the pressing connecting member (242) is movably connected to the pressing guide member (245), the pressing fixing member (244) is fixedly connected to the stripping support frame (22), the pressing guide member (245) is connected to the pressing fixing member (244), the elastic member (246) is sleeved on the outside of the pressing guide member (245), and the first end of the elastic member (246) is connected to the pressing connecting member (242), and the second end of the elastic member (246) is connected to the pressing fixing member (244).

8. The photovoltaic module back plate separation device according to claim 7, characterized in that: The hot knife stripping assembly (21) comprises a stripping positioning member (211) connected to the stripping support frame (22), a stripping connecting frame (212) connected to the stripping positioning member (211), a blade frame (213) connected to the stripping connecting frame (212), a knife (214) connected to the blade frame (213), an electric heating wire installed in the blade frame (213), and a pressing block (215); The pressing block (215) is respectively connected to the cutter (214) and the blade holder (213), and the upper end surface of the pressing block (215) is arranged to be inclined relative to the horizontal plane of the blade holder (213).

9. The photovoltaic module back plate separation device according to claim 8, characterized in that: The stripping mechanism (2) further comprises a stripping guide assembly (25), wherein the stripping guide assembly (25) comprises an upper guide plate (251), a lower guide plate (252), a silicon wafer structure guide plate (253) and a pressing and fixing member (254); The upper guide plate (251) and the lower guide plate (252) are both connected to the stripping support frame (22), and the upper guide plate (251) and the lower guide plate (252) are both arranged to be inclined relative to the horizontal plane of the stripping support frame (22), and a receiving space for the separated backing plate to pass through is formed between the upper guide plate (251) and the lower guide plate (252), and the receiving space is arranged corresponding to the upper end surface of the pressing block (215); The silicon wafer structure guide plate (253) is arranged in parallel with the stripping support frame (22), and the silicon wafer structure guide plate (253) is used to provide a guide for the separated silicon wafer structure; The pressing and fixing member (254) is connected to the stripping support frame (22), the pressing and fixing member (254) is arranged corresponding to the accommodating space, and the pressing and fixing member (254) is used to press on the back plate after separation.

10. The photovoltaic module back plate separation device according to claim 9, characterized in that: The stripping mechanism (2) further comprises a stripping transmission assembly (26), wherein the stripping transmission assembly (26) comprises a stripping transmission driver (261) connected to the stripping support frame (22) and a stripping transmission member (262) connected to the output end of the stripping transmission driver (261); The stripping transmission member (262) is simultaneously transmission-connected to a plurality of the supporting roller linkage members (232).

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