Support structure, method of manufacturing thereof, and electronic device

Abstract

This application provides a support structure, its manufacturing method, and an electronic device. The support structure includes a first composite layer and a first thermally conductive layer. The first composite layer is attached to at least one side of the first thermally conductive layer, and the first composite layer and the first thermally conductive layer are thermally connected. The first composite layer includes a first adhesive body and a first fiber disposed within the first adhesive body. The hardness of the first fiber is higher than that of the first adhesive body, and the thermal conductivity of the first fiber is higher than that of the first adhesive body. The overall density of the first composite layer is less than that of the metal material, thus achieving weight reduction of the support structure. The first fiber has high strength, thus improving the overall strength of the first composite layer to ensure the strength performance of the support structure. The first thermally conductive layer is disposed on one side of the first composite layer, which can improve the overall heat absorption capacity of the support structure, thereby accelerating the dissipation of heat in the connection area of ​​the support structure and connected heat-generating modules such as display modules.

Description

Technical Field

[0001] This application belongs to the field of display device technology, and more specifically, relates to a support structure, a method of manufacturing the same, and an electronic device thereof. Background Technology

[0002] With continuous technological advancements, the need for weight reduction in electronic devices such as smartphones and tablets is becoming increasingly urgent. The display module is a crucial component in electronic devices, featuring a high-strength support structure on one side. This support structure, connected to the display module, plays a vital role in supporting it. However, this high-strength support structure struggles to simultaneously achieve both weight reduction and heat dissipation—two critical performance parameters. Summary of the Invention

[0003] The purpose of this application is to provide a support structure, its manufacturing method, and an electronic device to solve the technical problem in the prior art that high-strength support structures are difficult to simultaneously achieve weight reduction and heat dissipation.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0005] Firstly, a support structure is provided, comprising:

[0006] First heat-conducting layer;

[0007] A first composite layer, along the thickness direction of the first thermally conductive layer, is adhered to at least one side of the first thermally conductive layer and is thermally connected to the first thermally conductive layer; wherein...

[0008] The first composite layer includes a first adhesive body and a first fiber disposed within the first adhesive body. The hardness of the first fiber is higher than that of the first adhesive body, and the thermal conductivity of the first fiber is higher than that of the first adhesive body.

[0009] In some embodiments, the thermally conductive layer is a first thermally conductive layer, and the supporting structure further includes a second composite layer. The first composite layer and the second composite layer are respectively disposed on opposite sides of the first thermally conductive layer. The first thermally conductive layer is sealed between the first composite layer and the second composite layer and is thermally connected to the second composite layer.

[0010] The second composite layer includes a second adhesive body and a second fiber disposed within the second adhesive body. The hardness of the second fiber is higher than that of the second adhesive body, and the thermal conductivity of the second fiber is higher than that of the second adhesive body.

[0011] In some embodiments, the edge of the second adhesive body is sealed to the edge of the first adhesive body so that the first thermally conductive layer is sealed between the first composite layer and the second composite layer.

[0012] In some embodiments, the first thermally conductive layer is provided with a plurality of first through holes, and the first composite layer is provided with a first protrusion corresponding to the position of each first through hole, the first protrusion passing through the first through hole and connected to the second composite layer; and / or

[0013] The second composite layer has a second protrusion at the position corresponding to each of the first through holes, and the second protrusion passes through the first through hole and is connected to the first composite layer.

[0014] In some embodiments, the first fiber includes at least one of carbon fiber, metal fiber and carbon nanotubes;

[0015] And / or, the second fiber includes at least one of carbon fiber, metal fiber and carbon nanotube.

[0016] In some embodiments, the length of the first fiber extends along a first direction, the length of the second fiber extends along a second direction, and the first direction and the second direction are set at an angle.

[0017] In some embodiments, the support structure further includes:

[0018] The third composite layer is stacked on the side of the second composite layer away from the first composite layer. The third composite layer includes a third adhesive body and a third fiber disposed within the third adhesive body. The hardness of the third fiber is higher than that of the third adhesive body of the third composite layer, and the thermal conductivity of the third fiber is higher than that of the third adhesive body.

[0019] The second thermally conductive layer is sealed between the third composite layer and the second composite layer, and is thermally connected to both the third composite layer and the second composite layer.

[0020] In some embodiments, the length direction of the second fiber is set at an angle to the length directions of the first fiber and the third fiber, respectively.

[0021] In some embodiments, the first fiber and the third fiber are arranged parallel to each other in their length directions.

[0022] In some embodiments, the elastic modulus of the second fiber is higher than that of the first fiber and the third fiber.

[0023] In some embodiments, the elastic modulus of the first fiber is equal to the elastic modulus of the third fiber.

[0024] In some embodiments, the support structure is an axisymmetric structure.

[0025] In some embodiments, a conductive layer is provided on the side of the first composite layer opposite to the first thermally conductive layer, and the conductive layer is used to connect to a grounding structure.

[0026] In some embodiments, the thickness of the conductive layer is less than 10 μm; preferably, the thickness of the conductive layer is less than 5 μm; and / or, the maximum surface resistance of the conductive layer is less than 2 Ω; preferably, the maximum surface resistance of the conductive layer is less than 1 Ω; and / or, the adhesion of the conductive layer to the first composite layer is greater than or equal to 4B.

[0027] In some embodiments, the thickness of the support structure is 0.1 mm to 1 mm; preferably, the thickness of the support structure is 0.1 mm to 0.15 mm; and / or,

[0028] The elastic modulus of the supporting structure is greater than or equal to 70 GPa; and / or,

[0029] The tensile strength of the supporting structure is greater than or equal to 700 MPa; and / or,

[0030] The elongation at break of the support structure is greater than or equal to 1%.

[0031] In some embodiments, the thickness of the first thermally conductive layer is 5 μm to 100 μm, preferably 12 μm to 30 μm; and / or,

[0032] Along the direction perpendicular to the thickness of the first thermally conductive layer, the thermal conductivity of the first thermally conductive layer is greater than or equal to 1400 W / (m*K).

[0033] Secondly, a method for manufacturing a support structure is provided, for manufacturing the aforementioned support structure, the manufacturing method comprising:

[0034] The first fiber is immersed in the first adhesive to obtain the first composite layer to be cured.

[0035] The first composite layer to be cured is stacked on at least one side surface of the first thermally conductive layer along the thickness direction to obtain a first stacked structure.

[0036] The first laminated structure is pressed together using a preset pressure to cure the first composite layer and attach it to the first thermally conductive layer to obtain the support structure.

[0037] Thirdly, a method for manufacturing a support structure is provided, for manufacturing the aforementioned support structure, the manufacturing method comprising:

[0038] The first fiber is arranged in a first preset direction and immersed in the first adhesive to obtain a first composite layer to be cured.

[0039] The second fiber is arranged in a second preset direction and immersed in the second adhesive to obtain a second composite layer to be cured.

[0040] The first composite layer to be cured is stacked on one side surface of the first thermally conductive layer along the thickness direction, and the second composite layer to be cured is stacked on the opposite side surface of the first thermally conductive layer along the thickness direction to obtain a second stacked structure.

[0041] The second laminated structure is pressed together using a preset pressure to cure the first composite layer and the second composite layer and attach them to the first thermally conductive layer to obtain the support structure.

[0042] In some embodiments, in the step of obtaining the second laminated structure, the length direction of the first fiber and the length direction of the second fiber are set at an angle, wherein the length direction of the first fiber is the first preset direction and the length direction of the second fiber is the second preset direction.

[0043] Fourthly, a method for manufacturing a support structure is provided, for manufacturing the aforementioned support structure, the manufacturing method comprising:

[0044] The first fiber is arranged in a first preset direction and immersed in the first adhesive to obtain a first composite layer to be cured.

[0045] The second fiber is arranged in a second preset direction and immersed in the second adhesive to obtain a second composite layer to be cured.

[0046] The third fiber is arranged in a third preset direction and immersed in the third adhesive to obtain the third composite layer to be cured;

[0047] The first composite layer to be cured is stacked on one side surface of the first thermally conductive layer along the thickness direction, the second composite layer to be cured is stacked on the opposite side surface of the first thermally conductive layer along the thickness direction, the second thermally conductive layer is stacked on the surface of the second composite layer away from the first thermally conductive layer, and the third composite layer is stacked on the surface of the second thermally conductive layer away from the second composite layer to obtain a third stacked structure.

[0048] The third composite structure is pressed together using a preset pressure to cure the first composite layer, the second composite layer, and the third composite layer and respectively attach them to the first thermally conductive layer and the second thermally conductive layer to obtain the support structure.

[0049] In some embodiments, in the step of obtaining the third laminated structure, the length direction of the second fiber is set at an angle to the length directions of the first fiber and the third fiber, respectively, wherein the length direction of the first fiber is the first preset direction, the length direction of the second fiber is the second preset direction, and the length direction of the third fiber is the third preset direction.

[0050] In some embodiments, in the step of obtaining the third laminated structure, the length direction of the first fiber is made parallel to the length direction of the third fiber.

[0051] Fifthly, an electronic device is provided, including a display module and the aforementioned support structure, wherein the support structure is connected to the display module to support the display module.

[0052] The beneficial effects of the support structure provided in this application are as follows: The support structure includes a first composite layer and a thermally conductive layer. The overall density of the first composite layer is less than that of the metal material, thus achieving weight reduction of the support structure. In addition, a first fiber is provided within the first composite layer. The first fiber has high strength, which improves the overall strength of the first composite layer to ensure the strength performance of the support structure, thereby ensuring the support structure's support effect on the display module and other related module structures. Furthermore, the first fiber has a high thermal conductivity, which improves the thermal conductivity of the first composite layer, helping to improve the heat dissipation effect of the display module and other related modules connected to the support structure and reducing heat accumulation in the display module and other related modules. A thermally conductive layer is provided on one side of the first composite layer, which improves the overall heat absorption capacity of the support structure, thereby accelerating the dissipation of heat in the connection area of ​​the support structure and the connected display module and other heat-generating modules. Through the above configuration, the first composite layer has high strength and low density, which helps to ensure the strength of the support structure and reduce its weight. In addition, both the first composite layer and the thermally conductive layer have high heat dissipation performance, which helps to ensure the heat dissipation performance of the support structure and helps to reduce heat accumulation in the display module and other related modules. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 A schematic diagram of a support structure provided in an embodiment of this application;

[0055] Figure 2 A schematic diagram of a support structure provided in another embodiment of this application;

[0056] Figure 3 for Figure 2 The diagram shows a top view of the supporting structure.

[0057] Figure 4 for Figure 2 A partially enlarged schematic diagram of the heat-conducting layer of the support structure shown;

[0058] Figure 5 This is a partially enlarged schematic diagram of the support structure provided in yet another embodiment of this application;

[0059] Figure 6 for Figure 5 A schematic diagram of the second composite layer of the support structure shown;

[0060] Figure 7 for Figure 5 A schematic diagram of the first composite layer of the supporting structure shown;

[0061] Figure 8 A schematic diagram of a support structure provided in another embodiment of this application;

[0062] Figure 9 A schematic diagram of the support structure provided in another embodiment of this application;

[0063] Figure 10 This is a schematic diagram of the conductive layer provided in an embodiment of this application.

[0064] The following are the labeling elements in the figure:

[0065] 1. First composite layer; 11. First protrusion; 12. First fiber; 2. First thermally conductive layer; 21. First through hole; 3. Second composite layer; 31. Second protrusion; 32. Second fiber; 4. Second thermally conductive layer; 5. Third composite layer; 51. Third fiber; 6. Conductive layer; 61. First layer; 62. Second layer; 63. Third layer. Detailed Implementation

[0066] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0067] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0068] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0070] In today's era of rapid technological advancement, mobile phones, tablets, and other electronic devices have become indispensable tools in people's daily lives and work. As consumers' demands for the portability and user experience of electronic devices continue to rise, the need for weight reduction in electronic devices is becoming increasingly strong.

[0071] In the structure of electronic devices, the display module is a key component for realizing information visualization, and the support structure located on one side of the display module also plays a crucial role. Connected to the display module, the support structure's main function is to provide stable support, ensuring the display module maintains the correct position and orientation within the electronic device, thereby guaranteeing its normal operation.

[0072] As a component providing stable support for the display module, the support structure needs to possess high strength. In related technologies, the support structures of electronic device display modules are mostly made of metal materials. Metal materials have good strength and rigidity, providing reliable support for the display module. However, the high density of metal materials makes it difficult for electronic devices using metal support structures to meet the current growing demand for weight reduction. Excessively heavy electronic devices not only cause inconvenience for users in carrying and operating them, but may also affect the product's competitiveness in the market.

[0073] To address the issue of the excessive weight of metal support structures, some related technologies have begun to utilize low-density, high-strength polymer materials. The relatively low density of polymer materials effectively reduces the weight of electronic devices, thus meeting the weight reduction requirements to some extent. However, while polymer-based support structures excel in weight reduction, they exhibit relatively poor thermal conductivity.

[0074] Display modules generate heat during operation, and good heat dissipation is crucial for ensuring their normal operation and extending their lifespan. Due to the insufficient thermal conductivity of the polymer material support structure, the heat generated by the display module is difficult to dissipate effectively. Heat accumulates at the connection area between the polymer material support structure and the display module, resulting in a high temperature in this area. Excessive temperature can not only affect the display effect but also accelerate the aging of the display module and surrounding components, reducing the overall performance and reliability of the electronic device.

[0075] In summary, the current support structure of display modules faces the dilemma of balancing weight reduction and heat dissipation in practical applications.

[0076] Based on this, embodiments of this application provide a support structure, a manufacturing method thereof, and an electronic device. The support structure includes a first composite layer and a first thermally conductive layer. Along the thickness direction of the first thermally conductive layer, the first composite layer is attached to at least one side of the first thermally conductive layer. The first composite layer and the first thermally conductive layer are thermally connected. The first composite layer includes a first adhesive body and a first fiber disposed within the first adhesive body. The hardness of the first fiber is higher than the hardness of the first adhesive body, and the thermal conductivity of the first fiber is higher than the thermal conductivity of the first adhesive body.

[0077] The support structure provided in this embodiment includes a first composite layer and a thermally conductive layer. The density of the first adhesive matrix is ​​less than that of metal; therefore, the overall density of the first composite layer is less than that of the metal material, thus achieving weight reduction in the support structure. Furthermore, a first fiber with high strength is disposed within the first composite layer, thereby improving the overall strength of the first composite layer and ensuring the strength performance of the support structure. This guarantees the support structure's effective support for the display module and other related module structures. Additionally, the first fiber has a high thermal conductivity, enhancing the thermal conductivity of the first composite layer and contributing to improved thermal conductivity of the display module connected to the support structure. The heat dissipation effect of the display module and related modules is improved, reducing the accumulation of heat in the display module and related modules. A heat-conducting layer is set on one side of the first composite layer, which can improve the overall heat absorption capacity of the support structure, thereby accelerating the dissipation of heat in the connection area of ​​the support structure and the heat-generating modules such as the display module connected to it. Through the above settings, the first composite layer has high strength and low density, which helps to ensure the strength of the support structure and reduce its weight. In addition, both the first composite layer and the heat-conducting layer have high heat dissipation performance, which helps to ensure the heat dissipation performance of the support structure and helps to reduce the accumulation of heat in the display module and related modules.

[0078] Reference Figure 1This application embodiment first provides a support structure, including a first composite layer 1 and a first thermally conductive layer 2. Along the thickness direction of the first thermally conductive layer 2, the first composite layer 1 is attached to at least one side of the first thermally conductive layer 2, and the first composite layer 1 and the first thermally conductive layer 2 are thermally connected. The first composite layer 1 includes a first adhesive body and a first fiber 12 disposed in the first adhesive body. The hardness of the first fiber 12 is higher than the hardness of the first adhesive body, and the thermal conductivity of the first fiber 12 is higher than the thermal conductivity of the first adhesive body.

[0079] It should be noted that the first thermally conductive layer 2 can be made of a high thermal conductivity material. When the first composite layer 1 is connected to a heat-generating module such as a display module of an electronic device, it can quickly absorb heat from the first composite layer 1 for heat dissipation. When the first thermally conductive layer 2 is connected to a heat-generating module such as a display module, it can quickly absorb heat from the heat-generating module and quickly transfer the heat to the first composite layer 1 for heat dissipation. The first thermally conductive layer 2 can be made of non-metallic materials, such as graphene, graphite, carbon nanotubes, etc., or it can be made of metallic materials, such as aluminum, aluminum alloys, copper-based alloys, etc.

[0080] It should be noted that thermally conductive connection refers to establishing a channel between two or more objects using specific methods and materials to efficiently transfer heat, enabling heat to be transferred from the high-temperature end to the low-temperature end, thereby meeting the heat dissipation, heat equalization, or thermal management requirements in different scenarios. The first composite layer 1 and the first thermally conductive layer 2 are thermally connected, allowing heat to be transferred between the first composite layer 1 and the first thermally conductive layer 2, so that heat can be dissipated from heat-generating modules such as display modules.

[0081] It should be noted that hardness refers to the ability of a material surface to resist localized deformation, especially plastic deformation, indentation, or scratches. Hardness reflects the wear resistance and resistance to localized damage of a material surface. The hardness of the first fiber 12 and the first adhesive matrix can be determined using specific hardness testing methods. Commonly used hardness testing methods include Brinell hardness, Rockwell hardness, and Vickers hardness. For example, in the Brinell hardness test, a steel ball or cemented carbide ball of a certain diameter is pressed into the sample surface with a specified test force. After a specified holding time, the test force is removed, and the diameter of the indentation on the sample surface is measured to calculate the hardness value. Generally speaking, for the same material, both hardness and strength characterize the material's ability to resist external forces. To a certain extent, hardness and strength are positively correlated. Generally, the higher the strength of a material, the greater its hardness tends to be. This is because factors such as the bonding force between atoms and the crystal structure within the material have a significant impact on both hardness and strength. When the bonding force between atoms within the material is strong and the crystal structure is stable, the material can withstand greater external forces without plastic deformation (high strength) and can also resist the indentation or scratching of its surface by other objects (high hardness). Thus, the hardness of the first fiber 12 is higher than that of the first adhesive body, which can also be understood as the strength of the first fiber 12 being higher than that of the first adhesive body.

[0082] It should be noted that thermal conductivity is an important physical quantity for measuring the thermal conductivity of a material. Specifically, it refers to the amount of heat transferred through a 1 square meter area in 1 second under steady-state heat transfer conditions, given a temperature difference of 1 K (or 1 °C) between the two surfaces of a 1 m thick material. The magnitude of thermal conductivity reflects the material's ability to conduct heat; a higher thermal conductivity indicates that the material conducts heat more easily and quickly, while a lower thermal conductivity generally indicates better thermal insulation performance. The thermal conductivity of the first fiber 12 is higher than that of the first adhesive matrix, which indicates that the first fiber 12 has a greater ability to conduct heat than the first adhesive matrix. Methods for determining thermal conductivity can be broadly categorized into two types. One is the steady-state method: under steady-state conditions, when the internal temperature distribution of the material does not change with time, the thermal conductivity is calculated by measuring the temperature distribution and heat flow rate of the material under steady-state heat flow, and then using Fourier's law of thermal conductivity. For example, for materials with cylindrical shapes or suitable for cylindrical specimens, the material to be tested can be made into a cylinder, heated in the inner cylinder and cooled in the outer cylinder, allowing heat to be steadily transferred radially. The thermal conductivity of the material is calculated by measuring parameters such as the temperature and heat flow rate of the inner and outer cylinders. The other method is the unsteady-state method: by applying a heat flow or temperature that varies with time to the material, the internal temperature response of the material is measured over time, and the thermal conductivity is inferred from the unsteady-state theory of heat conduction. This method offers relatively short measurement times and is suitable for measuring materials with low thermal conductivity and in applications requiring high measurement efficiency. For example, a thin metal wire (hot wire) can be used as a heating source, uniformly embedded in the material being tested. At a certain moment, a constant heating power is applied to the hot wire, causing the temperature of the material surrounding it to rise over time. By measuring the temperature change of the hot wire over time and using a mathematical model established based on heat conduction theory, the thermal conductivity of the material can be calculated. The thermal conductivity of the first thermally conductive layer can be higher than that of the first composite layer.

[0083] It should be noted that the strength of the first fiber 12 is higher than that of the first adhesive body, and the thermal conductivity of the first fiber 12 is higher than that of the first adhesive body. Thus, the first fiber 12 can be a high-strength, high-thermal-conductivity fiber. For example, the first fiber 12 can be carbon fiber, metal fiber, carbon nanotube, etc. The arrangement direction of the first fiber 12 in the first composite layer 1 can be random or ordered. When the first composite layer 1 is connected to a heat-generating module such as a display module of an electronic device, the first adhesive body and the first fiber 12 of the first composite layer 1 can absorb the heat of the heat-generating module such as the display module, and the heat absorbed by the first composite layer 1 can be transferred to the first thermally conductive layer 2 for heat dissipation. When the first thermally conductive layer 2 is connected to a heat-generating module such as a display module, the first thermally conductive layer 2 can absorb the heat of the heat-generating module such as the display module, and the heat absorbed by the first thermally conductive layer 2 can be transferred to the first adhesive body and the first fiber 12 of the first composite layer 1 for heat dissipation.

[0084] It should be noted that the first adhesive body of the first composite layer 1 can be cured by a first adhesive. The first adhesive can be a thermosetting adhesive. For example, the thermosetting adhesive can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the first adhesive can also be a light-curing adhesive. For example, the light-curing adhesive can be acrylic ester adhesive, ultraviolet light curing adhesive, etc.; in addition, the first adhesive can also be a moisture-curing adhesive. For example, the moisture-curing adhesive can be cyanoacrylate adhesive, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0085] The support structure provided in this embodiment includes a first composite layer 1 and a first thermally conductive layer 2. It is understood that the density of the first adhesive matrix is ​​less than the density of metal; therefore, the overall density of the first composite layer 1 can be less than the density of the metal material, thus achieving weight reduction in the support structure. Furthermore, a first fiber 12 is provided within the first composite layer 1. The first fiber 12 has high strength, which improves the overall strength of the first composite layer 1, ensuring the strength performance of the support structure and thus guaranteeing its support effect on the display module and other related module structures. Additionally, the first fiber 12 has a high thermal conductivity, which improves the thermal conductivity of the first composite layer 1, contributing to enhanced support. The heat dissipation effect of the connected display module and other related modules is improved, reducing the accumulation of heat in the display module and other related modules. The first thermal conductive layer 2 is set on one side of the first composite layer 1, which can improve the overall heat absorption capacity of the support structure, so as to accelerate the heat dissipation in the connection area of ​​the support structure and the connected display module and other heat-generating modules. Through the above settings, the first composite layer 1 has high strength and low density, which helps to ensure the strength of the support structure and reduce the weight of the support structure. In addition, both the first composite layer 1 and the first thermal conductive layer 2 have high heat dissipation performance, which helps to ensure the heat dissipation performance of the support structure and helps to reduce the accumulation of heat in the display module and other related modules.

[0086] Reference Figure 2 and Figure 3 In some embodiments, the support structure further includes a second composite layer 3. The first composite layer 1 and the second composite layer 3 are respectively disposed on opposite sides of the first thermally conductive layer 2. The first thermally conductive layer 2 is sealed between the first composite layer 1 and the second composite layer 3. The first thermally conductive layer 2 and the second composite layer 3 are sealed together. The second composite layer 3 includes a second adhesive body and a second fiber 32 disposed within the second adhesive body. The hardness of the second fiber 32 is higher than the hardness of the second adhesive body, and the thermal conductivity of the second fiber 32 is higher than the thermal conductivity of the second adhesive body.

[0087] It should be noted that the second adhesive body of the second composite layer 3 can be cured by the second adhesive. The second adhesive can be a thermosetting adhesive, for example, epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the second adhesive can also be a light-curing adhesive, for example, acrylic ester adhesive, ultraviolet light curing adhesive, etc.; in addition, the second adhesive can also be a moisture-curing adhesive, for example, cyanoacrylate adhesive, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0088] It should be noted that the hardness of the second fiber 32 is higher than that of the second adhesive body, and the hardness of a material is positively correlated with its strength. Therefore, the strength of the second fiber 32 is higher than that of the second adhesive body. Furthermore, the thermal conductivity of the second fiber 32 is higher than that of the second adhesive body of the second composite layer 3. Therefore, the second fiber 32 can be a high-strength, high-thermal-conductivity fiber. For example, the second fiber 32 can be carbon fiber, metal fiber, carbon nanotubes, etc. The materials of the first fiber 12 and the second fiber 32 can be the same or different. When the first composite layer 1 is connected to a heat-generating module such as a display module of an electronic device, the first adhesive body and the first fiber 12 of the first composite layer 1 can absorb the heat from the heat-generating module. The heat absorbed by the first composite layer 1 can be transferred to the second composite layer 3 for heat dissipation through the first thermally conductive layer 2. When the second composite layer 3 is connected to a heat-generating module such as a display module, the second adhesive body and the second fiber 32 can absorb the heat from the heat-generating module. The heat absorbed by the second composite layer 3 can be transferred to the first adhesive body and the first fiber 12 for heat dissipation through the first thermally conductive layer 2. The thermal conductivity of the first thermally conductive layer 2 can be higher than that of the second composite layer.

[0089] A first composite layer 1 and a second composite layer 3 are respectively provided on both sides of the first thermally conductive layer 2. Both the first composite layer 1 and the second composite layer 3 can support the first thermally conductive layer 2, thereby enhancing the overall strength of the support structure and ensuring the stability of the support structure for the display module. In addition, the first composite layer 1 and the second composite layer 3 can seal the first thermally conductive layer 2, reducing the exposure of the first thermally conductive layer 2 and thus reducing the possibility of the first thermally conductive layer 2 breaking, thereby improving the quality of the support structure.

[0090] In some embodiments, the first thermally conductive layer 2 may be a graphite layer.

[0091] Understandably, compared to metal materials, graphite has a lower density and is lighter in weight for the same volume. Therefore, setting the first thermally conductive layer 2 as a graphite layer can reduce the weight of the support structure and help achieve a lightweight design. In addition, graphite has a high thermal conductivity, which can quickly absorb heat, thus ensuring the heat dissipation capacity of the support structure. Encapsulating the first thermally conductive layer 2 with the first composite layer 1 and the second composite layer 3 can reduce the probability of damage or cracking of the first thermally conductive layer 2, thus ensuring the strength of the support structure and ensuring the stability of the support structure for supporting the display module and other related module structures.

[0092] In some embodiments, the edge of the second adhesive body is sealed to the edge of the first adhesive body, so that the first thermally conductive layer 2 is sealed between the first composite layer 1 and the second composite layer 3. Sealing the edge of the second adhesive body to the edge of the first adhesive body encapsulates the entire first thermally conductive layer between the first composite layer 1 and the second composite layer 3, preventing the edge of the first thermally conductive layer 2 from being exposed to the environment. This reduces the possibility of the first thermally conductive layer 2 breaking, thereby improving the quality of the support structure.

[0093] In some embodiments, the first composite layer 1 and the second composite layer 3 are the same size, that is, the peripheral surfaces of the first composite layer 1 and the second composite layer 3 are aligned.

[0094] Reference Figure 3 In some embodiments, the distance between the edge of the first thermally conductive layer 2 and the edges of the first composite layer 1 and the second composite layer 3 is L1, where L1 ≥ 1 mm. Setting the distance between the edge of the first thermally conductive layer 2 and the edges of the first composite layer 1 and the second composite layer 3 to not less than 1 mm can ensure the connection area between the first composite layer 1 and the second composite layer 3, thereby ensuring the connection strength between the first composite layer 1 and the second composite layer 3 and reducing the risk of separation between the first composite layer 1 and the second composite layer 3.

[0095] Reference Figures 4 to 7 In some embodiments, the first thermally conductive layer 2 is provided with a plurality of first through holes 21, and the first composite layer 1 is provided with a first protrusion 11 corresponding to the position of each first through hole 21. The first protrusion 11 passes through the first through hole 21 and is connected to the second composite layer 3. By providing the first through hole 21 in the first thermally conductive layer 2 and providing the first protrusion 11 in the first composite layer 1, the first protrusion 11 can be disposed within the first through hole 21, and the end of the first protrusion 11 can be connected to the second composite layer 3. This can increase the connection range between the first composite layer 1 and the second composite layer 3, enhance the bonding strength between the first composite layer 1 and the second composite layer 3, and reduce the risk of separation between the first composite layer 1 and the second composite layer 3. This can reduce the risk of cracking of the first thermally conductive layer 2 and help ensure the overall strength of the support structure.

[0096] In some embodiments, the second composite layer 3 is provided with a second protrusion 31 corresponding to the position of each first through hole 21, and the second protrusion 31 passes through the first through hole 21 and is connected to the first composite layer 1.

[0097] A first through hole 21 is provided in the first thermally conductive layer 2, and a second protrusion 31 is provided in the second composite layer 3. The second protrusion 31 can be disposed in the first through hole 21, and the end of the second protrusion 31 can be connected to the first composite layer 1. This can increase the connection range between the first composite layer 1 and the second composite layer 3, enhance the bonding strength between the first composite layer 1 and the second composite layer 3, and reduce the risk of separation between the first composite layer 1 and the second composite layer 3. This can reduce the risk of cracking of the first thermally conductive layer 2 and help ensure the overall strength of the support structure.

[0098] In some embodiments, the first composite layer 1 is provided with a first protrusion 11, and the second composite layer 3 is provided with a second protrusion 31. The lengths of the first protrusion 11 and the second protrusion 31 are both less than the thickness of the first thermally conductive layer 2, that is, the lengths of the first protrusion 11 and the second protrusion 31 are both less than the length of the first through hole 21. Thus, the first protrusion 11 disposed in the first through hole 21 can be connected to the corresponding second protrusion 31 disposed in the first through hole 21 to realize the connection between the first composite layer 1 and the second composite layer 3.

[0099] In some embodiments, the first protrusion 11 can fill the first through hole 21, that is, the periphery of the first protrusion 11 can be connected to the hole wall of the first through hole 21. This can increase the connection area between the first composite layer 1 and the first thermally conductive layer 2, reduce the risk of cracking of the first thermally conductive layer 2, and help improve the strength of the support structure.

[0100] In some embodiments, the second protrusion 31 can be filled in the first through hole 21, that is, the periphery of the second protrusion 31 can be connected to the hole wall of the first through hole 21. This can increase the connection area between the second composite layer 3 and the first thermal conductive layer 2, reduce the risk of cracking of the first thermal conductive layer, and help improve the strength of the support structure.

[0101] In some embodiments, the cross-sectional shape of the first through hole 21 can be a circle, an ellipse, a rectangle, a polygon, or an irregular shape. The first heat-conducting layer 2 can be provided with multiple first through holes 21. The shapes of the multiple first through holes 21 can be the same or different. Alternatively, some of the first through holes 21 can have the same shape, while others have different shapes.

[0102] In some embodiments, the cross-sectional shape of the first through hole 21 can be circular, and the diameter D1 of the first through hole 21 can be not less than 1 mm, that is, D1 ≥ 1 mm. This facilitates the forming of the first through hole 21 on the first thermally conductive layer 2. In addition, the cross-sectional dimensions of the first protrusion 11 and the second protrusion 31 can be appropriately increased, which helps to improve the strength of the first protrusion 11 and the second protrusion 31, thereby improving the bonding stability of the first composite layer 1 and the second composite layer 3. For example, D1 can be 1 mm, 1.1 mm, 1.2 mm, 1.31 mm, 2.12 mm, etc.

[0103] In some embodiments, the first fiber 12 includes at least one of carbon fiber, metal fiber, and carbon nanotube.

[0104] Carbon fiber refers to high-strength, high-modulus fibers with a carbon content of over 90%. It possesses extremely high tensile strength, sometimes exceeding that of steel of the same mass; its density is low, typically between 1.5 and 2.0 g / cm³. 3 Compared to metal materials, carbon fiber is lighter; in addition, carbon fiber has better thermal conductivity, with its thermal conductivity in the fiber direction exceeding that of copper, reaching up to 700 W / (m*K). Therefore, the inclusion of carbon fiber in the first fiber 12 ensures the thermal conductivity of the first fiber 12, thereby ensuring the thermal conductivity of the supporting structure. Furthermore, it also ensures the strength of the first fiber 12, thereby ensuring the overall strength of the supporting structure.

[0105] Metal fibers are fibrous materials with a high aspect ratio (length to diameter) made of metal. Common metal fiber materials include stainless steel, copper, aluminum, and nickel. Through specific processing techniques, metals can be made into filaments or fibers, with diameters typically ranging from a few micrometers to tens of micrometers. Metal fibers possess high strength and modulus, can withstand large tensile and external forces, and are not easily deformed or broken, making them suitable for enhancing the mechanical properties of composite materials. Furthermore, metals have excellent thermal conductivity, a characteristic also possessed by metal fibers, enabling rapid heat transfer and aiding in heat dissipation and thermal management. Therefore, the inclusion of metal fibers in the first fiber 12 ensures its thermal conductivity, thereby guaranteeing the thermal conductivity of the supporting structure. Additionally, it ensures the strength of the first fiber 12, thus guaranteeing the overall strength of the supporting structure.

[0106] Carbon nanotubes are tubular nanomaterials composed of carbon atoms, with a structure similar to a seamless, hollow tube formed by rolling up graphene sheets. Based on the number of wall layers, they can be divided into single-walled carbon nanotubes and multi-walled carbon nanotubes. Single-walled carbon nanotubes are formed by rolling up a single layer of graphene sheet, with a diameter typically around 1 nm; multi-walled carbon nanotubes are formed by coaxially rolling up multiple layers of graphene sheets, with a diameter generally between several nanometers and tens of nanometers. Carbon nanotubes possess extremely high strength and modulus, as well as high thermal conductivity. Therefore, including carbon nanotubes in the first fiber ensures the thermal conductivity of the first fiber 12, thereby ensuring the thermal conductivity of the supporting structure. Furthermore, it also ensures the strength of the first fiber 12, thus guaranteeing the overall strength of the supporting structure.

[0107] For example, in some embodiments, all the first fibers 12 in the first composite layer 1 may be carbon fibers; in other embodiments, all the first fibers 12 in the first composite layer 1 may be metal fibers; in still other embodiments, all the first fibers 12 in the first composite layer 1 may be carbon nanotubes; in some other embodiments, a portion of the first fibers 12 in the first composite layer 1 may be carbon fibers, a portion of the first fibers 12 may be metal fibers, and the remaining portion of the first fibers 12 may be carbon nanotubes.

[0108] In other embodiments, the second fiber 32 includes at least one of carbon fiber, metal fiber, and carbon nanotube. The inclusion of at least one of carbon fiber, metal fiber, and carbon nanotube in the second fiber 32 ensures the thermal conductivity of the second fiber 32, thereby ensuring the thermal conductivity of the support structure. Furthermore, it also ensures the strength of the second fiber 32, thereby ensuring the overall strength of the support structure.

[0109] In some embodiments, all the second fibers 32 in the second composite layer 3 may be carbon fibers; in other embodiments, all the second fibers 32 in the second composite layer 3 may be metal fibers; in still other embodiments, all the second fibers 32 in the second composite layer 3 may be carbon nanotubes; in some other embodiments, a portion of the second fibers 32 in the second composite layer 3 may be carbon fibers, a portion of the second fibers 32 may be metal fibers, and the remaining portion of the second fibers 32 may be carbon nanotubes.

[0110] In some embodiments, the first composite layer 1 includes a plurality of first fibers 12, all of which extend along a first direction, and the second composite layer 3 includes a plurality of second fibers 32, all of which extend along a second direction, with the first and second directions arranged at an angle.

[0111] It should be noted that the first direction and the second direction are set at an angle. The first direction and the second direction can be perpendicular, that is, the angle between the first direction and the second direction can be a right angle. Alternatively, the first direction and the second direction can be non-perpendicular, that is, the angle between the first direction and the second direction can be an acute angle or an obtuse angle. For example, in some embodiments, the first direction can be the Y-axis direction shown in the figure, the second direction can be the X-axis direction shown in the figure, and the first composite layer 1 and the second composite layer 3 are stacked along the Z-axis direction shown in the figure.

[0112] Extending the length of all the first fibers 12 in the first composite layer 1 along the first direction can fully utilize the high strength and high modulus characteristics of the first fibers 12 in their length direction, giving the first composite layer 1 good tensile, compressive, and bending strength in the first direction, thereby enhancing the strength of the support structure in the first direction. In addition, compared with the disordered arrangement design, this embodiment arranges all the first fibers 12 in an orderly manner, making the performance of the first composite layer 1 relatively stable and predictable, which facilitates structural design and performance optimization. Furthermore, by precisely controlling the arrangement direction and density of the first fibers 12, the performance of the support structure can be precisely controlled to meet the needs of different application scenarios. Similarly, extending the length of all the second fibers 32 in the second composite layer 3 along the second direction is done in the same way. Setting the first direction and the second direction at an angle, that is, setting the length directions of the first fibers 12 and the second fibers 32 at an angle, the combination of the first fibers 12 and the second fibers 32 can form a mesh structure. In this way, the strength of the support structure in all directions can be improved, thereby improving the support effect on display modules and other related module structures.

[0113] In some embodiments, the first direction and the second direction are arranged perpendicularly, that is, the length directions of the first fiber and the second fiber are arranged perpendicularly. In this way, the first fiber and the second fiber can enable the support structure to have high strength and high modulus characteristics in two perpendicular directions, thereby ensuring the overall strength of the support structure.

[0114] In some embodiments, the density of the first fiber 12 in the first composite layer 1 is the same as the density of the second fiber 32 in the second composite layer 3. It is understood that the overall strength of the first composite layer 1 is related to the density of the first fiber 12, and the overall strength of the second composite layer 3 is related to the density of the second fiber 32. Making the density of the first fiber 12 in the first composite layer 1 and the density of the second fiber 32 in the second composite layer 3 the same can make the first composite layer 1 and the second composite layer 3 have similar strengths. This can reduce the problem of uneven stress inside the support structure caused by the strength difference between the first composite layer 1 and the second composite layer 3, thereby reducing the probability of the support structure warping.

[0115] Reference Figure 8In some embodiments, the support structure further includes a third composite layer 5 and a second thermally conductive layer 4. The third composite layer 5 is stacked on the side of the second composite layer 3 away from the first composite layer 1. The third composite layer 5 includes a third adhesive body and a third fiber 51 disposed within the third adhesive body. The hardness of the third fiber 51 is higher than that of the third adhesive body, and the thermal conductivity of the third fiber 51 is higher than that of the third adhesive body. The second thermally conductive layer 4 is sealed between the third composite layer 5 and the second composite layer 3, and the second thermally conductive layer 4 is thermally connected to the third composite layer 5 and the second composite layer 3 respectively.

[0116] It should be noted that the thermal conductivity of the second thermally conductive layer 4 can be higher than that of the first composite layer 1, the second composite layer 3, and the third composite layer 5. The second thermally conductive layer 4 can be made of non-metallic materials, such as graphene, graphite, and carbon nanotubes, or it can be made of metallic materials, such as aluminum, aluminum alloys, and copper-based alloys.

[0117] It should be noted that the third adhesive body of the third composite layer 5 can be cured by a third adhesive. The third adhesive can be a thermosetting adhesive, for example, epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the third adhesive can also be a light-curing adhesive, for example, acrylic ester adhesive, ultraviolet light curing adhesive, etc.; in addition, the third adhesive can also be a moisture-curing adhesive, for example, cyanoacrylate adhesive, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0118] It should be noted that the hardness of the third fiber 51 is higher than that of the third adhesive body, and the hardness of a material is positively correlated with its strength. Therefore, the strength of the third fiber 51 is higher than that of the third adhesive body, and the thermal conductivity of the third fiber 51 is higher than that of the third adhesive body of the third composite layer 5. The third fiber 51 can be a high-strength, high-thermal-conductivity fiber. For example, the third fiber 51 can be carbon fiber, metal fiber, carbon nanotube, etc. The materials of the first fiber 12, the second fiber 32, and the third fiber 51 can be the same or different. When the first composite layer 1 is connected to a heat-generating module such as a display module of an electronic device, the first adhesive body and the first fiber 12 can absorb the heat from the heat-generating module such as the display module. The heat absorbed by the first composite layer 1 can be transferred to the third composite layer 5 for heat dissipation through the first thermally conductive layer 2, the second composite layer 3, and the second thermally conductive layer 4 in sequence. When the third composite layer 5 is connected to a heat-generating module such as a display module, the third adhesive body and the third fiber 51 can absorb the heat from the heat-generating module such as the display module. The heat absorbed by the third composite layer 5 can be transferred to the first adhesive body and the first fiber 12 for heat dissipation through the second thermally conductive layer 4, the second composite layer 3, and the first thermally conductive layer 2 in sequence.

[0119] The third composite layer 5 enhances the strength of the support structure, thereby reducing deformation and ensuring effective support for the display module and other related modules. A second heat-conducting layer 4 is placed between the third composite layer 5 and the second composite layer 3. This second heat-conducting layer 4 quickly absorbs heat, promoting heat transfer and improving the heat dissipation performance of the support structure. Encapsulating the second heat-conducting layer 4 with the third composite layer 5 and the second composite layer 3 reduces the risk of cracking or damage, thus ensuring the integrity of the support structure.

[0120] In some embodiments, a plurality of third fibers 51 are disposed within the third composite layer 5. The third fibers 51 include at least one of carbon fiber, metal fiber, and carbon nanotube. The inclusion of at least one of carbon fiber, metal fiber, and carbon nanotube in the third fibers 51 ensures the thermal conductivity of the third fibers 51, thereby ensuring the thermal conductivity of the support structure. In addition, it also ensures the strength of the third fibers 51, thereby ensuring the overall strength of the support structure.

[0121] In some embodiments, a plurality of third fibers 51 are disposed in the third composite layer 5, and the length direction of the second fiber 32 in the second composite layer 3 is arranged at an angle to the length direction of the first fiber 12 and the third fiber 51, respectively.

[0122] The length direction of the second fiber 32 in the second composite layer 3 is set at an angle to the length direction of the first fiber 12 and the third fiber 51, respectively. The second fiber 32 and the first fiber 12, as well as the second fiber 32 and the third fiber 51, can be combined to form a mesh structure. In this way, the strength of the support structure in all directions can be improved, thereby improving the support effect on the display module and other related module structures.

[0123] In some embodiments, the first fiber 12 and the third fiber 51 are arranged parallel to each other in their length directions. The third composite layer 5 and the first composite layer 1 are located on both sides of the second composite layer 3, respectively. By arranging the first fiber 12 and the third fiber 51 in their length directions parallel to each other, and ensuring that the fiber arrangement directions on both sides of the second composite layer 3 are the same, the forces on both sides of the second composite layer 3 are balanced, which can reduce the internal stress of the support structure and thus reduce the warping of the support structure.

[0124] In some embodiments, all the third fibers 51 in the third composite layer 5 extend along the first direction, all the first fibers 12 in the first composite layer 1 extend along the first direction, and the second fibers 32 extend along the second direction, with the first and second directions being perpendicular to each other.

[0125] All the third fibers 51 in the third composite layer 5 extend along the first direction, and all the first fibers 12 in the first composite layer 1 extend along the first direction. That is, the length direction of the third fibers 51 is parallel to the length direction of the first fibers 12. The first and second directions are perpendicular, that is, the length direction of the second fibers 32 is perpendicular to the length directions of the first fibers 12 and the third fibers 51, respectively. The internal stress of the support structure is balanced, which can reduce the probability of the support structure warping.

[0126] In some embodiments, the density of the third fiber 51 in the third composite layer 5 is the same as the density of the first fiber 12 in the first composite layer 1. It is understood that the overall strength of the third composite layer 5 is related to the density of the third fiber 51, and the overall strength of the first composite layer 1 is related to the density of the first fiber 12. Making the density of the first fiber 12 in the first composite layer 1 and the density of the third fiber 51 in the third composite layer 5 the same can make the first composite layer 1 and the third composite layer 5 have similar strengths. This can reduce the problem of uneven stress inside the support structure caused by the strength difference between the first composite layer 1 and the third composite layer 5, thereby reducing the probability of the support structure warping.

[0127] In some embodiments, the elastic modulus of the second fiber 32 is greater than that of the first fiber 12 and the third fiber 51.

[0128] The elastic modulus is the ratio of stress to strain in a material during the elastic deformation stage, and it is an important indicator of a material's resistance to elastic deformation. Setting the elastic modulus of the second fiber 32 to be greater than that of the first fiber 12 and the third fiber 51 can improve the overall strength of the support structure, thereby reducing the deformation of the support structure under stress. When the support structure absorbs heat and heats up, it can reduce the deformation of the support structure, allowing the support structure to maintain precise dimensions and shape. In addition, the support structure is prone to fatigue during use, and using the second fiber 32 with a higher elastic modulus can better resist this fatigue damage.

[0129] In some embodiments, the elastic modulus of the third fiber 51 is equal to that of the first fiber 12. In this embodiment, the third composite layer 5 and the first composite layer 1 are located on both sides of the second composite layer 3, so that the elastic modulus of the adhesive layers on both sides of the second composite layer 3 is the same, and the forces on both sides of the second composite layer 3 are balanced, which can reduce the internal stress of the support structure and thus reduce the warping of the support structure.

[0130] In some embodiments, the first composite layer 1, the second composite layer 3, and the third composite layer 5 are each cured from carbon fiber prepreg. The carbon fiber prepreg can be of type T700, T800, M40, or other carbon fiber prepregs with equivalent strength. In some embodiments, the first composite layer 1 and the third composite layer 5 can use T700 carbon fiber prepreg, and the second composite layer 3 can use T800 or M40 carbon fiber prepreg. After the carbon fiber prepreg is cured, a carbon fiber reinforced polymer (CFRP) composite material can be obtained, in which the first composite layer 1, the second composite layer 3, and the third composite layer 5 are all CFRP.

[0131] In some embodiments, the second thermally conductive layer 4 may be a graphite layer.

[0132] Understandably, compared to metal materials, graphite has a lower density and is lighter in weight for the same volume. Therefore, setting the second heat-conducting layer 4 as a graphite layer can reduce the weight of the support structure and help achieve a lightweight design. In addition, graphite has a high thermal conductivity, which can quickly absorb heat, thus ensuring the heat dissipation capacity of the support structure. Encapsulating the second heat-conducting layer 4 with the second composite layer 3 and the third composite layer 5 can reduce the probability of damage or cracking of the second heat-conducting layer 4, thus ensuring the strength of the support structure and ensuring the stability of the support structure for supporting the display module and other related module structures.

[0133] In some embodiments, the structure of the second heat-conducting layer 4 can be the same as that of the first heat-conducting layer 2. For example, the second heat-conducting layer 4 can be provided with a second through hole, and the second composite layer 3 can be provided with a third protrusion. The second protrusion is disposed within the second through hole and connected to the third composite layer 5. By providing a second through hole in the second heat-conducting layer 4 and a third protrusion in the second composite layer 3, the third protrusion can be disposed within the second through hole, and the end of the second protrusion can be connected to the third composite layer 5. This can increase the connection range between the third composite layer 5 and the second composite layer 3, enhance the bonding strength between the third composite layer 5 and the second composite layer 3, and reduce the risk of separation between the third composite layer 5 and the second composite layer 3. This can reduce the risk of cracking in the second heat-conducting layer 4 and help ensure the overall strength of the support structure.

[0134] In some embodiments, the third composite layer 5 is provided with a fourth protrusion, which is disposed in the second through hole and connected to the third composite layer.

[0135] A second through hole is provided in the second heat-conducting layer 4, and a fourth protrusion is provided in the third composite layer 5. The fourth protrusion can be provided in the second through hole, and the end of the third protrusion can be connected to the second composite layer 3. This can increase the connection range between the third composite layer 5 and the second composite layer 3, enhance the bonding strength between the third composite layer 5 and the second composite layer 3, and reduce the risk of separation between the third composite layer 5 and the second composite layer 3. This can reduce the risk of cracking of the first heat-conducting layer and help ensure the overall strength of the support structure.

[0136] In some embodiments, the second composite layer 3 is provided with a third protrusion, and the third composite layer 5 is provided with a fourth protrusion. The lengths of the third and fourth protrusions are both less than the thickness of the second thermally conductive layer 4, that is, the lengths of the third and fourth protrusions are both less than the length of the second through hole. In this way, the third protrusion disposed in the second through hole can be connected with the corresponding fourth protrusion disposed in the second through hole to realize the connection between the third composite layer 5 and the second composite layer 3.

[0137] In some embodiments, the third protrusion can fill the second through hole, that is, the periphery of the third protrusion can be connected to the hole wall of the second through hole. This can increase the connection area between the second composite layer 3 and the second thermal conductive layer 4, reduce the risk of cracking of the second thermal conductive layer 4, and help improve the strength of the support structure.

[0138] In some embodiments, the fourth protrusion can fill the second through hole, that is, the periphery of the fourth protrusion can be connected to the hole wall of the second through hole. This can increase the connection area between the third composite layer 5 and the second thermal conductive layer 4, reduce the risk of cracking of the second thermal conductive layer 4, and help improve the strength of the support structure.

[0139] In some embodiments, the cross-sectional shape of the second through hole can be a circle, ellipse, rectangle, polygon, or an irregular shape. The second heat-conducting layer 4 can be provided with multiple second through holes. The shapes of the multiple second through holes can be the same or different. Alternatively, some of the second through holes can have the same shape, while others have different shapes.

[0140] In some embodiments, the cross-sectional shape of the second through hole can be circular, and the diameter D2 of the second through hole can be not less than 1 mm, that is, D2 ≥ 1 mm. This facilitates the formation of the second through hole on the second thermally conductive layer 4. In addition, the cross-sectional dimensions of the third and fourth protrusions can be appropriately increased, which helps to improve the strength of the third and fourth protrusions, thereby improving the bonding stability of the third composite layer 5 and the second composite layer 3. For example, D2 can be 1 mm, 1.1 mm, 1.2 mm, 1.31 mm, 2.12 mm, etc.

[0141] In some embodiments, the diameters of the first through hole 21 and the second through hole can be the same, while in other embodiments, the diameters of the first through hole 21 and the second through hole can be different.

[0142] In some embodiments, the third composite layer 5 and the second composite layer 3 are the same size, that is, the peripheral surfaces of the third composite layer 5 and the second composite layer 3 are aligned.

[0143] In some embodiments, the distance between the edge of the second thermally conductive layer 4 and the edges of the third composite layer 5 and the second composite layer 3 is L2, where L2 ≥ 1 mm. Setting the distance between the edge of the second thermally conductive layer 4 and the edges of the third composite layer 5 and the second composite layer 3 to not less than 1 mm can ensure the connection area between the third composite layer 5 and the second composite layer 3, thereby ensuring the connection strength between the third composite layer 5 and the second composite layer 3 and reducing the risk of separation between the third composite layer 5 and the second composite layer 3.

[0144] In some embodiments, the second thermally conductive layer 4 and the first thermally conductive layer 2 may have the same dimensions, while in other embodiments, the first thermally conductive layer 2 and the second thermally conductive layer 4 may have different dimensions.

[0145] In some embodiments, the thickness of the second thermal conductive layer 4 can be 5μm to 100μm. Setting the thickness of the second thermal conductive layer 4 to not less than 5μm can give the second thermal conductive layer 4 a certain strength, thereby reducing the risk of the second thermal conductive layer 4 breaking. Setting the thickness of the second thermal conductive layer 4 to not more than 100μm can reduce the space occupied by the second thermal conductive layer 4, thus reducing the size of the support structure and the space occupied by the support structure in the electronic device. In addition, it can also achieve the goal of balancing heat dissipation and thin and light performance.

[0146] In some embodiments, the thickness of the second thermally conductive layer 4 can be 12μm to 30μm. For example, the thickness of the second thermally conductive layer 4 can be 12μm, 14μm, 18μm, 20μm, 21μm, 22μm, 24μm, 26μm, 27μm, 28μm, or 30μm.

[0147] In some embodiments, the thickness of the second thermally conductive layer 4 may be equal to the thickness of the first thermally conductive layer; in other embodiments, the thickness of the second thermally conductive layer 4 may be unequal to the thickness of the first thermally conductive layer.

[0148] In some embodiments, the thermal conductivity of the second thermally conductive layer 4 is not less than 1400 W / (m*K) along the direction parallel to the second thermally conductive layer 4, that is, along the plane direction parallel to the X-axis and Y-axis shown in the figure.

[0149] In some embodiments, the support structure is an axisymmetric structure.

[0150] It should be noted that an axisymmetric structure refers to an object or structure that is symmetrically distributed with respect to a certain straight line (called the axis of symmetry or central axis), such that when folded along the axis of symmetry, the parts on both sides of the axis of symmetry can completely overlap. For the support structure in the embodiments of this application, its cross-section can be symmetrical about its central axis.

[0151] By setting the support structure as an axisymmetric structure, the stress can be distributed more evenly when the support structure is subjected to external forces, reducing the occurrence of stress concentration. This gives the support structure better stability and load-bearing capacity. In addition, it can balance the stress inside the support structure and reduce warping caused by asymmetrical stress distribution in each layer.

[0152] For example, the third composite layer 5 and the first composite layer 1 can be symmetrically arranged about the central axis of the support structure itself, and the second heat-conducting layer 4 and the first heat-conducting layer 2 of the support structure can be symmetrically arranged about the central axis of the support structure itself.

[0153] Reference Figure 9 In some embodiments, a conductive layer 6 is provided on the side of the first composite layer 1 opposite to the second composite layer 3, and the conductive layer 6 is used to connect to the grounding structure.

[0154] It should be noted that the conductive layer 6 can cover the entire side of the first composite layer 1 facing away from the second composite layer 3, or it can be disposed on a portion of the side of the first composite layer 1 facing away from the second composite layer 3. When the support structure includes the first composite layer 1 and the second composite layer 3, the second composite layer 3 can be used to connect to the display module. When the support structure includes the first composite layer 1, the second composite layer 3, and the third composite layer 5, the third composite layer 5 can be used to connect to the display module. That is, the conductive layer 6 can be disposed on the side of the support structure facing away from the display module.

[0155] A conductive layer 6 is provided on the side of the first composite layer 1 that is away from the second composite layer 3. The conductive layer 6 can be connected to the grounding structure, thereby enabling the display module to be grounded or enabling the electronic device as a whole to be grounded, which helps to improve the safety of the electronic device.

[0156] In some embodiments, the conductive layer 6 can be a multilayer structure. For example, the conductive layer 6 may include a first layer 61, a second layer 62, and a third layer 63 stacked sequentially. The first layer 61 can be connected to the first composite layer 1. The first layer 61 is a nickel layer, so that the first layer 61 can be stably attached to the first composite layer 1, and the conductive layer 6 as a whole can be stably attached to the first composite layer 1. The second layer 62 can be a silver layer or a copper layer, so as to reduce the overall resistance of the conductive layer 6. The third layer 63 can be a nickel layer, and the third layer 63 can cover the second layer 62, thereby reducing the contact between the second layer 62 and the air, reducing the oxidation of the second layer 62, and playing an antioxidant protection role for the second layer 62. The first layer 61, the second layer 62, and the third layer 63 can be arranged in parallel, so as to further reduce the overall resistance of the conductive layer 6. In this embodiment, the conductive layer 6 can be formed on the first composite layer 1 by electroplating, sputtering or other methods. For example, the conductive layer 6 can be formed on the side of the first composite layer 1 opposite to the second composite layer 3 by physical vapor deposition (PVD).

[0157] In some embodiments, the conductive layer 6 may also be a conductive adhesive layer containing nano-metal particles such as nano-silver particles and nano-nickel particles. It should be noted that the adhesive of the conductive adhesive layer may be cured by glue. The glue may be a thermosetting glue. For example, the thermosetting glue may be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.; the glue may also be a light-curing glue. For example, the light-curing glue may be acrylic glue, ultraviolet light curing glue, etc.; in addition, the glue may also be a moisture-curing glue. For example, the moisture-curing glue may be cyanoacrylate glue, PUR (polyurethane reactive, moisture-curing reactive polyurethane hot melt adhesive), etc.

[0158] In some embodiments, the maximum surface resistance of the conductive layer is less than 2Ω.

[0159] It should be noted that the resistance value of conductive layer 6 will be different when connected in different directions. For example, when the width of conductive layer 6 is less than its length, the resistance value generated by connecting conductive layer 6 along the width direction is less than the resistance value generated by connecting conductive layer 6 along the length direction. That is, the resistance value generated by conductive layer 6 is related to the connection method, and the greater the connection distance, the greater the resistance value generated by conductive layer 6. Therefore, when the conductive layer is connected along the diagonal direction of conductive layer 6, the resistance value generated is greater.

[0160] By making the maximum surface resistance of conductive layer 6 less than 2Ω, interference current can flow through conductive layer 6 to the grounding structure, thereby reducing the interference of current to the display module.

[0161] In some embodiments, the maximum surface resistance of the conductive layer 6 is less than 1 Ω. This further reduces current interference to the display module.

[0162] In some embodiments, the thickness of the conductive layer 6 can be less than 10 μm. Setting the thickness of the conductive layer 6 to less than 10 μm can reduce the impact of the conductive layer on the overall structure of the support structure, thereby ensuring the heat dissipation performance of the support structure.

[0163] In some embodiments, the thickness of the conductive layer 6 can be less than 5 μm. This can further reduce the impact of the conductive layer on the overall structure of the support structure, thereby ensuring the heat dissipation performance of the support structure.

[0164] For example, the thickness of the conductive layer 6 can be 3μm, 3.2μm, 3.4μm, 3.6μm, 3.8μm, 4μm, 4.2μm, 4.4μm, 4.6μm, 4.8μm, or 5μm.

[0165] In some embodiments, the adhesion of the conductive layer 6 is not less than 4B.

[0166] It's important to note that adhesion is a measure of the strength of the bond between a coating, ink, film, or other material and the surface of an object to which it adheres. It originates from the internationally recognized cross-cut adhesion test standard. The cross-cut adhesion test is a common method for evaluating coating adhesion. During the test, a sharp tool is used to cut 10x10 small squares (each square typically has a side length of 1mm or 2mm) into the coating surface, forming a grid pattern of 100 squares. Then, a special adhesive tape (such as 3M 600 tape) is firmly adhered to the cut grid, and the tape is quickly and evenly peeled off. The degree of coating peeling off within the square areas is observed to determine the adhesion level. Adhesion ratings are divided into five levels, from 0B to 5B, with higher levels indicating better adhesion, as detailed below:

[0167] 5B: The coating on the 100 small squares cut off did not peel off at all.

[0168] 4B: In 100 small squares, no more than 5% of the squares show coating peeling.

[0169] 3B: Coating peeling occurs in 5% to 15% of the squares.

[0170] 2B: The proportion of squares with peeling coating reaches 15% to 35%.

[0171] 1B: The percentage of squares with peeling coating is between 35% and 65%.

[0172] 0B: Over 65% of the squares show coating peeling, and in some cases, the entire coating has almost completely peeled off.

[0173] Setting the adhesion of conductive layer 6 to no less than 4B can ensure the bonding stability between conductive layer 6 and the first composite layer 1, thereby ensuring the grounding effect of the module structure.

[0174] In some embodiments, the overall thickness of the support structure ranges from 0.1 mm to 1 mm. Setting the overall thickness of the support structure to not less than 0.1 mm allows the support structure to have a certain thickness, thereby ensuring the overall strength of the support structure. Setting the overall thickness of the support structure to not more than 1 mm limits the thickness of the support structure, thereby reducing the space occupied by the support structure within the electronic device.

[0175] In some embodiments, the overall thickness of the support structure ranges from 0.1 mm to 0.15 mm. Setting the overall thickness of the support structure to no more than 0.15 mm can further reduce the space occupied by the support structure within the electronic device.

[0176] For example, the overall thickness of the support structure can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, or 0.15mm.

[0177] In some embodiments, the overall elastic modulus of the support structure is greater than or equal to 70 GPa.

[0178] The elastic modulus is the ratio of stress to strain acting on a material during its elastic deformation phase. It characterizes the rigidity or hardness of a material. A higher elastic modulus means that the material undergoes less elastic deformation under the same stress, making it less prone to elastic deformation and thus more "hard" and "rigid." Conversely, a lower elastic modulus makes the material more prone to elastic deformation under stress, making it relatively "soft."

[0179] Setting the elastic modulus of the support structure to be greater than or equal to 70 GPa can give the support structure a certain degree of rigidity, enabling it to stably support the display module. In addition, it can also give the support structure a certain degree of flexibility, allowing it to deform to reduce the impact of the impact on the display module when subjected to collisions or impacts.

[0180] In some embodiments, the tensile strength of the support structure is greater than or equal to 700 MPa.

[0181] Tensile strength refers to the maximum tensile stress that a material can withstand before it breaks under tension. It characterizes the material's ability to resist tensile failure and is determined through a tensile test. In a tensile test, an axial tensile force is applied to a material specimen of standard shape and size, causing it to gradually elongate until it breaks. During this process, the tensile force will continuously increase, and the elongation of the specimen will also change accordingly. When the tensile force reaches its maximum value, the stress corresponding to this point is the tensile strength of the material.

[0182] Setting the tensile strength of the support structure to be greater than or equal to 700 MPa can prevent the support structure from breaking when subjected to large tensile forces, and allow the material to maintain the integrity of the structure under large loads.

[0183] In some embodiments, the elongation at break of the support structure is greater than or equal to 1%.

[0184] Elongation at break refers to the percentage increase in length of the gauge length of a material before it breaks under tension, relative to the original gauge length. Simply put, it's the extent to which a material can be stretched before it breaks, and it's an important indicator of a material's plasticity. Elongation at break directly reflects the quality of a material's plasticity. Materials with good plasticity have high elongation at break, meaning they can undergo significant deformation under stress without immediately breaking. This allows them to be molded into various shapes through plastic deformation during processing, such as rolling, forging, and stretching, to produce plates, pipes, and wires. Furthermore, during use, materials with good plasticity can absorb more energy, exhibiting better resistance to impacts or overloads, and are less prone to sudden brittle fracture, thus improving the material's safety and reliability.

[0185] Setting the fracture elongation rate of the support structure to be greater than or equal to 1% allows the support structure to have a certain plastic deformation capacity before tensile fracture. That is, the support structure is not completely brittle and can undergo a certain degree of plastic deformation when subjected to tensile force. It can absorb and disperse energy through its own deformation to reduce the probability of brittle fracture, thus helping to improve the support stability of the support structure.

[0186] In some embodiments, the thickness of the first thermally conductive layer 2 can be 5μm to 100μm. Setting the thickness of the first thermally conductive layer 2 to not less than 5μm can give the first thermally conductive layer 2 a certain strength, thereby reducing the risk of breakage. Setting the thickness of the first thermally conductive layer 2 to not more than 100μm can reduce the space occupied by the first thermally conductive layer 2, thus reducing the size of the support structure and the space occupied by the support structure in the electronic device. In addition, it can also achieve a balance between heat dissipation and thinness performance requirements.

[0187] In some embodiments, the thickness of the first thermally conductive layer 2 can be 12μm to 30μm. Setting the thickness of the first thermally conductive layer 2 to not less than 12μm can give the first thermally conductive layer 2 a certain strength, thereby further reducing the risk of the first thermally conductive layer 2 breaking; setting the thickness of the first thermally conductive layer 2 to not more than 30μm can further reduce the space occupied by the first thermally conductive layer 2, thus reducing the size of the support structure, and consequently reducing the space occupied by the support structure within the electronic device.

[0188] For example, the thickness of the first thermally conductive layer 2 can be 12μm, 14μm, 18μm, 20μm, 21μm, 22μm, 24μm, 26μm, 27μm, 28μm, or 30μm.

[0189] In some embodiments, the thickness of the second thermally conductive layer 4 can be 5μm to 100μm, and in some embodiments, the thickness of the second thermally conductive layer 4 can be 12μm to 30μm. For example, the thickness of the second thermally conductive layer 4 can be 12μm, 14μm, 18μm, 20μm, 21μm, 22μm, 24μm, 26μm, 27μm, 28μm, or 30μm.

[0190] In some embodiments, the thickness of the second thermally conductive layer 4 may be the same as the thickness of the first thermally conductive layer 2; in other embodiments, the thickness of the second thermally conductive layer 4 may be different from the thickness of the first thermally conductive layer 2.

[0191] In some embodiments, the thermal conductivity of the first thermally conductive layer 2 is greater than or equal to 1400 W / (m*k) along the direction perpendicular to the thickness of the first thermally conductive layer 2, that is, along the plane parallel to the X-axis and Y-axis shown in the figure. Setting the thermal conductivity of the first thermally conductive layer 2 to be greater than or equal to 1400 W / (m*k) allows the first thermally conductive layer 2 to have a high heat dissipation capacity, thereby reducing the accumulation of heat in the connection area between the display module and the support structure. In addition, for some miniaturized electronic devices with limited space, using a first thermally conductive layer 2 with a high thermal conductivity can achieve good heat dissipation effect in a small heat dissipation space, which is conducive to the miniaturization and lightweight design of electronic devices.

[0192] In some embodiments, the thermal conductivity of the second thermally conductive layer 4 is greater than or equal to 1400 W / (m*K) along a direction perpendicular to the thickness of the second thermally conductive layer 4, that is, along a plane parallel to the X-axis and Y-axis shown in the figure. Setting the thermal conductivity of the second thermally conductive layer 4 to be greater than or equal to 1400 W / (m*K) allows the second thermally conductive layer 4 to have a higher heat dissipation capacity, thereby reducing the accumulation of heat in the connection area between the display module and the support structure. In addition, for some miniaturized electronic devices with limited space, using a first thermally conductive layer 2 with a high thermal conductivity can achieve a good heat dissipation effect in a small heat dissipation space, which is conducive to the miniaturization and lightweight design of electronic devices.

[0193] In some embodiments, the thermal conductivity of the first thermally conductive layer 2 may be the same as that of the second thermally conductive layer 4.

[0194] In some embodiments, the support structure may further include a fourth composite layer, a third thermally conductive layer, etc., wherein the fourth composite layer may be disposed on the side of the third composite layer 5 away from the second composite layer 3, the third thermally conductive layer may be sandwiched between the fourth composite layer and the third composite layer 5, the connection method between the fourth composite layer and the third composite layer 5 may be the same as the connection method between the third composite layer 5 and the second composite layer 3, and the structure of the third thermally conductive layer may be the same as the structure of the second thermally conductive layer 4; in other embodiments, the support structure may have a greater number of composite layers and thermally conductive layers.

[0195] This application also provides a method for manufacturing a support structure, used to manufacture the support structure in any of the above embodiments, comprising the following steps:

[0196] The first fiber 12 is immersed in the first adhesive to obtain the first composite layer 1 to be cured;

[0197] The first composite layer 1 to be cured is stacked on at least one side surface of the first thermally conductive layer 2 along the thickness direction to obtain a first laminated structure.

[0198] The first laminated structure is pressed together using a preset pressure to cure the first composite layer 1 and attach it to the first thermally conductive layer 2 to obtain a support structure.

[0199] In this embodiment, pressing the first composite layer 1 and the first thermally conductive layer 2 together using a preset pressure can increase the pressure between the first composite layer 1 and the first thermally conductive layer 2, thereby improving the bonding degree between the first composite layer 1 and the first thermally conductive layer 2 and ensuring the stability of the support structure.

[0200] In some embodiments, when pressing the first laminated structure with a preset pressure, the temperature can be raised to a preset temperature and maintained for a preset time.

[0201] It should be noted that in this embodiment of the application, the temperature is raised to a preset temperature to cure the first composite layer 1. The first adhesive of the first composite layer 1 can be a thermosetting adhesive. For example, the thermosetting adhesive can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.

[0202] During the pressing process, the temperature is raised to the preset temperature, that is, the first composite layer 1 is heated and cured by hot pressing to form a support structure, which can reduce the difficulty of forming the support structure.

[0203] The preset temperature can be 80℃~180℃; for example, the preset temperature can be 80℃, 90℃, 100℃, 110℃, 120℃, 130℃, 140℃, 150℃, 160℃, 170℃, or 180℃.

[0204] In some embodiments, the preset time can be 10 min to 30 min. For example, the preset time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0205] In some embodiments, the preset pressure can be 0.5MPa to 6MPa. For example, the preset pressure can be 0.5MPa, 1MPa, 1.5MPa, 2MPa, 2.5MPa, 3MPa, 3.5MPa, 4MPa, 4.5MPa, 5MPa, 5.5MPa, or 6MPa.

[0206] In any of the above embodiments, the first composite layer 1 to be cured can be carbon fiber prepreg.

[0207] In some embodiments, after hot pressing, the edges of the support structure can be trimmed to adjust the shape of the support structure.

[0208] In some embodiments, after hot pressing, a conductive layer 6 can be formed on the side of the first composite layer 1 opposite to the first thermally conductive layer to obtain a support structure with the conductive layer 6.

[0209] In some embodiments, the conductive layer 6 can be formed by physical vapor deposition (PVD) sputtering or by coating. For example, when forming the conductive layer 6 by coating, a resin material containing nano-silver particles and nano-nickel particles can be coated onto the side of the first composite layer 1 opposite to the second composite layer 3. The coating thickness is less than 10 μm. Then, the coating is baked at a temperature in the range of 80°C to 150°C. For example, the baking temperature can be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, or 150°C, and the baking time can be 10 min to 30 min. For example, the baking time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0210] In some embodiments, after the conductive layer 6 is formed, the support structure can be cut using a laser to trim the shape of the support structure.

[0211] This application also provides a method for manufacturing a support structure, used to manufacture the support structure in any of the above embodiments, comprising the following steps:

[0212] The first fiber 12 is arranged in a first preset direction and immersed in the first adhesive to obtain the first composite layer 1 to be cured.

[0213] The second fiber 32 is arranged in a second preset direction and immersed in the second adhesive to obtain the second composite layer 3 to be cured.

[0214] The first composite layer 1 to be cured is stacked on one side surface of the first thermally conductive layer 2 along the thickness direction, and the second composite layer 3 to be cured is stacked on the opposite side surface of the first thermally conductive layer 2 along the thickness direction to obtain the second stacked structure.

[0215] The second laminated structure is pressed together using a preset pressure to cure the first composite layer 1 and the second composite layer 3 and attach them to the first thermally conductive layer 2 to obtain a support structure.

[0216] It should be noted that in some embodiments, the first preset direction and the second preset direction can be set in parallel, while in other embodiments, the first preset direction and the second preset direction can be set at an angle.

[0217] In this embodiment, using a preset pressure to press the second laminated structure together increases the pressure between the first composite layer 1, the first thermally conductive layer 2, and the second composite layer 3, thereby improving the bonding strength of the first composite layer 1, the first thermally conductive layer 2, and the second composite layer 3, ensuring the stability of the support structure. Before the first composite layer 1 and the second composite layer 3 are cured, the first fiber 12 is arranged in a first preset direction, and the second fiber 32 is arranged in a second preset direction. This ensures that the first fiber 12 and the second fiber 32 of the formed support structure are arranged in the first preset direction, thus reducing the difficulty of arranging the first fiber 12 and the second fiber 32 and helping to reduce the difficulty of forming the support structure. In addition, arranging the first fiber 12 in the first preset direction and the second fiber 32 in the second preset direction allows the first fiber 12 and the second fiber 32 to be arranged in an orderly manner. This makes the performance of the first composite layer 1 and the second composite layer 3 relatively stable and predictable, facilitating structural design and performance optimization. Furthermore, by precisely controlling the arrangement direction and density of the first fiber 12 and the second fiber 32, the performance of the support structure can be precisely controlled to meet the needs of different application scenarios.

[0218] In some embodiments, in the step of obtaining the second laminated structure, the length direction of the first fiber 12 and the length direction of the second fiber 32 are set at an angle, wherein the length direction of the first fiber 12 is a first preset direction and the length direction of the second fiber 32 is a second preset direction.

[0219] The first preset direction and the second preset direction are set at an angle, that is, the length directions of the first fiber 12 and the second fiber 32 are set at an angle. The combination of the first fiber 12 and the second fiber 32 can form a mesh structure, which can improve the strength of the support structure in all directions, thereby improving the support effect on the display module and other related module structures.

[0220] In some embodiments, the first preset direction may be the first direction in any of the above embodiments, and the second preset direction may be the same as the second direction in any of the above embodiments.

[0221] In some embodiments, when pressing the second laminated structure with a preset pressure, the temperature can be raised to a preset temperature and maintained for a preset time.

[0222] It should be noted that in this embodiment of the application, the temperature is raised to a preset temperature to cure the first composite layer 1 and the second composite layer. The first adhesive and the second adhesive can be thermosetting adhesives. For example, thermosetting adhesives can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.

[0223] During the pressing process, the temperature is raised to the preset temperature, that is, the first composite layer 1 and the second composite layer are heated and solidified by hot pressing to form a support structure, which can reduce the difficulty of forming the support structure.

[0224] The preset temperature can be 80℃~180℃; for example, the preset temperature can be 80℃, 90℃, 100℃, 110℃, 120℃, 130℃, 140℃, 150℃, 160℃, 170℃, or 180℃.

[0225] In some embodiments, the preset time can be 10 min to 30 min. For example, the preset time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0226] In some embodiments, the preset pressure can be 0.5MPa to 6MPa. For example, the preset pressure can be 0.5MPa, 1MPa, 1.5MPa, 2MPa, 2.5MPa, 3MPa, 3.5MPa, 4MPa, 4.5MPa, 5MPa, 5.5MPa, or 6MPa.

[0227] In any of the above embodiments, the first composite layer 1 and the second composite layer to be cured can be carbon fiber prepreg.

[0228] In some embodiments, after hot pressing, the edges of the support structure can be trimmed to adjust the shape of the support structure.

[0229] In some embodiments, after hot pressing, a conductive layer 6 can be formed on the side of the first composite layer 1 opposite to the second composite layer 3 to obtain a support structure with the conductive layer 6.

[0230] In some embodiments, the conductive layer 6 can be formed by physical vapor deposition (PVD) sputtering or by coating. For example, when forming the conductive layer 6 by coating, a resin material containing nano-silver particles and nano-nickel particles can be coated onto the side of the first composite layer 1 opposite to the second composite layer 3. The coating thickness is less than 10 μm. Then, the coating is baked at a temperature in the range of 80°C to 150°C. For example, the baking temperature can be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, or 150°C, and the baking time can be 10 min to 30 min. For example, the baking time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0231] In some embodiments, after the conductive layer 6 is formed, the support structure can be cut using a laser to trim the shape of the support structure.

[0232] This application also provides a method for manufacturing a support structure, used to manufacture the support structure in any of the above embodiments, comprising the following steps:

[0233] The first fiber 12 is arranged in a first preset direction and immersed in the first adhesive to obtain the first composite layer 1 to be cured.

[0234] The second fiber 32 is arranged in a second preset direction and immersed in the second adhesive to obtain the second composite layer 3 to be cured.

[0235] The third fiber 51 is arranged in a third preset direction and immersed in the third adhesive to obtain the third composite layer 5 to be cured;

[0236] The first composite layer 1 to be cured is stacked on one side surface of the first thermally conductive layer 2 along the thickness direction, the second composite layer 3 to be cured is stacked on the opposite side surface of the first thermally conductive layer 2 along the thickness direction, the second thermally conductive layer 4 is stacked on the surface of the second composite layer 3 away from the first thermally conductive layer 2, and the third composite layer 5 is stacked on the surface of the second thermally conductive layer 4 away from the second composite layer 3 to obtain a third stacked structure.

[0237] The third layer structure is pressed together using a preset pressure to cure the first composite layer 1, the second composite layer 3 and the third composite layer 5 and respectively attach them to the first thermally conductive layer 2 and the second thermally conductive layer 4 to obtain the support structure.

[0238] It should be noted that in some embodiments, the first preset direction, the second preset direction, and the third preset direction can be parallel, or two of them can be parallel and the other can be set at an angle, or they can be set at an angle to each other.

[0239] In this embodiment, using a preset pressure to press the third laminated structure together can increase the pressure between the first composite layer 1, the first thermally conductive layer 2, the second composite layer 3, the second thermally conductive layer 4, and the third composite layer 5, thereby improving the bonding strength of these layers and ensuring the stability of the support structure. Before the first composite layer 1, the second composite layer 3, and the third composite layer 5 are cured, the first fiber 12 is arranged in a first preset direction, the second fiber 32 is arranged in a second preset direction, and the third fiber 51 is arranged in a third preset direction. This ensures that the first fiber 12, the second fiber 32, and the third fiber 51 of the formed support structure are arranged in the first preset direction, the second fiber 32, and the third fiber 51, respectively. This reduces the difficulty of arranging the first fiber 12, the second fiber 32, and the third fiber 51, and helps to reduce the molding difficulty of the support structure. Furthermore, By arranging the first fiber 12 in a first preset direction, the second fiber 32 in a second preset direction, and the third fiber 51 in a third preset direction, the first fiber 12, the second fiber 32, and the third fiber 51 can be arranged in an orderly manner. This makes the performance of the first composite layer 1, the second composite layer 3, and the third composite layer 5 relatively stable and predictable, which facilitates structural design and performance optimization. Furthermore, by precisely controlling the arrangement direction and density of the first fiber 12, the second fiber 32, and the third fiber 51, the performance of the supporting structure can be precisely controlled to meet the needs of different application scenarios.

[0240] In some embodiments, in the step of obtaining the third laminated structure, the length direction of the second fiber 32 is set at an angle to the length directions of the first fiber 12 and the third fiber 51, respectively, wherein the length direction of the first fiber 12 is a first preset direction, the length direction of the second fiber 32 is a second preset direction, and the length direction of the third fiber 51 is a third preset direction.

[0241] The length direction of the second fiber 32 is set at an angle to the length directions of the first fiber 12 and the third fiber 51, respectively. The second fiber 32 can be combined with the first fiber 12 and the third fiber 51 to form a mesh structure. In this way, the strength of the support structure in all directions can be improved, thereby improving the support effect on the display module and other related module structures.

[0242] In some embodiments, in the step of obtaining the second laminated structure, the length direction of the first fiber 12 is made parallel to the length direction of the third fiber 51.

[0243] The third composite layer 5 and the first composite layer 1 are located on both sides of the second composite layer 3. The length directions of the first fiber 12 and the third fiber 51 are arranged parallel. The fiber arrangement directions on both sides of the second composite layer 3 are the same. In this way, the forces on both sides of the second composite layer 3 are balanced, which can reduce the internal stress of the support structure and thus reduce the warping of the support structure.

[0244] Thus, the first preset direction and the third preset direction can be the first direction in any of the above embodiments, and the second preset direction can be the second direction in any of the above embodiments.

[0245] In some embodiments, when pressing the third laminated structure with a preset pressure, the temperature can be raised to a preset temperature and maintained for a preset time.

[0246] It should be noted that in this embodiment of the application, the temperature is raised to a preset temperature to cure the first composite layer 1, the second composite layer 3 and the third composite layer 5. The first adhesive, the second adhesive and the third adhesive can be thermosetting adhesives. For example, thermosetting adhesives can be epoxy resin, polyester resin, vinyl ester, bismaleimide, thermosetting polyimide, cyanate ester, etc.

[0247] During the pressing process, the temperature is raised to the preset temperature, that is, the first composite layer 1, the second composite layer 3 and the third composite layer 5 are heated and cured by hot pressing to form a support structure, which can reduce the difficulty of forming the support structure.

[0248] The preset temperature can be 80℃~180℃; for example, the preset temperature can be 80℃, 90℃, 100℃, 110℃, 120℃, 130℃, 140℃, 150℃, 160℃, 170℃, or 180℃.

[0249] In some embodiments, the preset time can be 10 min to 30 min. For example, the preset time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0250] In some embodiments, the preset pressure can be 0.5MPa to 6MPa. For example, the preset pressure can be 0.5MPa, 1MPa, 1.5MPa, 2MPa, 2.5MPa, 3MPa, 3.5MPa, 4MPa, 4.5MPa, 5MPa, 5.5MPa, or 6MPa.

[0251] In any of the above embodiments, the first composite layer 1, the second composite layer 3, and the third composite layer 5 to be cured can be carbon fiber prepreg.

[0252] In some embodiments, after hot pressing, the edges of the support structure can be trimmed to adjust the shape of the support structure.

[0253] In some embodiments, after hot pressing, a conductive layer 6 can be formed on the side of the first composite layer 1 opposite to the second composite layer 3 to obtain a support structure with the conductive layer 6.

[0254] In some embodiments, the conductive layer 6 can be formed by physical vapor deposition (PVD) sputtering or by coating. For example, when forming the conductive layer 6 by coating, a resin material containing nano-silver particles and nano-nickel particles can be coated onto the side of the first composite layer 1 opposite to the second composite layer 3. The coating thickness is less than 10 μm. Then, the coating is baked at a temperature in the range of 80°C to 150°C. For example, the baking temperature can be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C, 140°C, or 150°C, and the baking time can be 10 min to 30 min. For example, the baking time can be 10 min, 15 min, 20 min, 25 min, or 30 min.

[0255] In some embodiments, after the conductive layer 6 is formed, the support structure can be cut using a laser to trim the shape of the support structure.

[0256] This application also provides an electronic device, including a display module and a support structure as described in any of the above embodiments. The support structure is connected to the display module to support it. Because the support structure has high strength, it can stably support the display module, helping to improve the performance stability of the electronic device. Because the support structure can effectively absorb and transfer the heat generated by the display module, heat is less likely to accumulate at the connection point with the support structure, thus reducing the risk of overheating of the display module and helping to ensure its performance. Because the support structure has a small mass, it can reduce the weight of the electronic device.

[0257] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A support structure, characterized in that, include: First heat-conducting layer; A first composite layer, along the thickness direction of the first thermally conductive layer, is adhered to at least one side of the first thermally conductive layer and is thermally connected to the first thermally conductive layer; wherein... The first composite layer includes a first adhesive body and a first fiber disposed within the first adhesive body. The hardness of the first fiber is higher than that of the first adhesive body, the thermal conductivity of the first fiber is higher than that of the first adhesive body, and the thermal conductivity of the first thermally conductive layer is higher than that of the first composite layer.

2. The support structure as described in claim 1, characterized in that, The support structure further includes a second composite layer. The first composite layer and the second composite layer are respectively disposed on opposite sides of the first thermally conductive layer. The first thermally conductive layer is sealed between the first composite layer and the second composite layer and is thermally connected to the second composite layer. The second composite layer includes a second adhesive body and a second fiber disposed within the second adhesive body. The hardness of the second fiber is higher than that of the second adhesive body, and the thermal conductivity of the second fiber is higher than that of the second adhesive body.

3. The support structure as described in claim 2, characterized in that, The edge of the second adhesive body is sealed to the edge of the first adhesive body, so that the first thermally conductive layer is sealed between the first composite layer and the second composite layer.

4. The support structure as described in claim 2, characterized in that, The first thermally conductive layer is provided with a plurality of first through holes, and the first composite layer is provided with a first protrusion corresponding to the position of each first through hole. The first protrusion passes through the first through hole and is connected to the second composite layer; and / or, The second composite layer has a second protrusion at the position corresponding to each of the first through holes, and the second protrusion passes through the first through hole and is connected to the first composite layer.

5. The support structure as described in claim 2, characterized in that, The first fiber includes at least one of carbon fiber, metal fiber and carbon nanotube; And / or, the second fiber includes at least one of carbon fiber, metal fiber and carbon nanotube.

6. The support structure as described in claim 2, characterized in that, The length of the first fiber extends along a first direction, and the length of the second fiber extends along a second direction, with the first direction and the second direction forming an angle.

7. The support structure as described in claim 2, characterized in that, The support structure also includes: The third composite layer is stacked on the side of the second composite layer away from the first composite layer. The third composite layer includes a third adhesive body and a third fiber disposed within the third adhesive body. The hardness of the third fiber is higher than that of the third adhesive body of the third composite layer, and the thermal conductivity of the third fiber is higher than that of the third adhesive body. The second thermally conductive layer is sealed between the third composite layer and the second composite layer, and is thermally connected to both the third composite layer and the second composite layer.

8. The support structure as described in claim 7, characterized in that, The length direction of the second fiber is set at an angle to the length directions of the first fiber and the third fiber, respectively.

9. The support structure as described in claim 7, characterized in that, The first fiber and the third fiber are arranged parallel to each other in their length directions.

10. The support structure as described in claim 7, characterized in that, The elastic modulus of the second fiber is higher than that of the first fiber and the third fiber.

11. The support structure as described in claim 10, characterized in that, The elastic modulus of the first fiber is equal to that of the third fiber.

12. The support structure as described in any one of claims 1-11, characterized in that, The supporting structure is an axisymmetric structure; And / or, a conductive layer is provided on the side of the first composite layer opposite to the first thermally conductive layer, and the conductive layer is used to connect to the grounding structure; And / or, the thickness of the support structure is 0.1mm to 1mm; and / or, the elastic modulus of the support structure is greater than or equal to 70GPa; and / or, the tensile strength of the support structure is greater than or equal to 700MPa; And / or, the elongation at break of the support structure is greater than or equal to 1%; And / or, the thickness of the first thermally conductive layer is 5μm~100μm; And / or, along a direction perpendicular to the thickness of the first thermally conductive layer, the thermal conductivity of the first thermally conductive layer is greater than or equal to 1400 W / (m²). k).

13. The support structure as described in claim 12, characterized in that, The thickness of the support structure is 0.1mm to 0.15mm.

14. The support structure as described in claim 12, characterized in that, A conductive layer is provided on the side of the first composite layer opposite to the first thermally conductive layer, and the thickness of the conductive layer is less than 10 μm.

15. The support structure as described in claim 12, characterized in that, A conductive layer is provided on the side of the first composite layer opposite to the first thermally conductive layer, and the thickness of the conductive layer is less than 5 μm; and / or, the maximum surface resistance of the conductive layer is less than 2 Ω.

16. The support structure as described in claim 12, characterized in that, A conductive layer is provided on the side of the first composite layer away from the first thermally conductive layer, and the maximum surface resistance of the conductive layer is less than 1Ω; and / or, the adhesion of the conductive layer to the first composite layer is greater than or equal to 4B.

17. The support structure as described in claim 12, characterized in that, The thickness of the first thermally conductive layer is 12μm~30μm.

18. A method for manufacturing a support structure, characterized in that, The manufacturing method for manufacturing the support structure as described in any one of claims 1-17 includes: The first fiber is immersed in the first adhesive to obtain the first composite layer to be cured. The first composite layer to be cured is stacked on at least one side surface of the first thermally conductive layer along the thickness direction to obtain a first stacked structure. The first laminated structure is pressed together using a preset pressure to cure the first composite layer and attach it to the first thermally conductive layer to obtain the support structure.

19. A method for manufacturing a support structure, characterized in that, The manufacturing method for manufacturing the support structure as described in any one of claims 1-17 includes: The first fiber is arranged in a first preset direction and immersed in the first adhesive to obtain a first composite layer to be cured. The second fiber is arranged in a second preset direction and immersed in the second adhesive to obtain a second composite layer to be cured. The first composite layer to be cured is stacked on one side surface of the first thermally conductive layer along the thickness direction, and the second composite layer to be cured is stacked on the opposite side surface of the first thermally conductive layer along the thickness direction to obtain a second stacked structure. The second laminated structure is pressed together using a preset pressure to cure the first composite layer and the second composite layer and attach them to the first thermally conductive layer to obtain the support structure.

20. The method for manufacturing the support structure as described in claim 19, characterized in that, In the step of obtaining the second laminated structure, the length direction of the first fiber and the length direction of the second fiber are set at an angle, wherein the length direction of the first fiber is the first preset direction and the length direction of the second fiber is the second preset direction.

21. A method for manufacturing a support structure, characterized in that, The manufacturing method for manufacturing the support structure as described in any one of claims 1-17 includes: The first fiber is arranged in a first preset direction and immersed in the first adhesive to obtain a first composite layer to be cured. The second fiber is arranged in a second preset direction and immersed in the second adhesive to obtain a second composite layer to be cured. The third fiber is arranged in a third preset direction and immersed in the third adhesive to obtain the third composite layer to be cured; The first composite layer to be cured is stacked on one side surface of the first thermally conductive layer along the thickness direction, the second composite layer to be cured is stacked on the opposite side surface of the first thermally conductive layer along the thickness direction, the second thermally conductive layer is stacked on the surface of the second composite layer away from the first thermally conductive layer, and the third composite layer is stacked on the surface of the second thermally conductive layer away from the second composite layer to obtain a third stacked structure. The third composite structure is pressed together using a preset pressure to cure the first composite layer, the second composite layer, and the third composite layer and respectively attach them to the first thermally conductive layer and the second thermally conductive layer to obtain the support structure.

22. The method for manufacturing the support structure as described in claim 21, characterized in that, In the step of obtaining the third laminated structure, the length direction of the second fiber is set at an angle to the length directions of the first fiber and the third fiber, respectively, wherein the length direction of the first fiber is the first preset direction, the length direction of the second fiber is the second preset direction, and the length direction of the third fiber is the third preset direction.

23. The method for manufacturing the support structure as described in claim 21, characterized in that, In the step of obtaining the third laminated structure, the length direction of the first fiber is made parallel to the length direction of the third fiber.

24. An electronic device, comprising a display module, characterized in that, It also includes a support structure as described in any one of claims 1-17, the support structure being connected to the display module to support the display module.

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