Three-dimensional cobalt-platinum microstructure preparation system and method based on electroplating principle

Abstract

The invention discloses a three-dimensional cobalt-platinum microstructure preparation system and method based on an electroplating principle, and relates to the technical field of cobalt-platinum microstructure preparation, and the three-dimensional cobalt-platinum microstructure preparation system comprises a working platform device, an electrochemical deposition device, a control device and a deposition pressure device; the control device generates the path instruction according to an image to be prepared and transmits the path instruction to the working platform device; the working platform device moves according to the path instruction, so that electrolyte of the electrochemical deposition device is sprayed to a corresponding position for deposition, and a preparation image is generated; and the deposition pressure device provides adjustable pressure parameters for the electrochemical deposition device. According to the invention, the viscosity of the electrolyte is increased by using gelatin, so that the pressure control is converted from negative pressure to positive pressure, the hysteresis of gas action is reduced, the extrusion process is more uniform and stable, and the deposition quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cobalt-platinum microstructure preparation, and more specifically to a three-dimensional cobalt-platinum microstructure preparation system and method based on the electroplating principle. Background Art

[0002] In recent years, with the rapid development of micro-electromechanical systems (MEMS), the integration of magnetic materials in miniaturized, high-performance components has become increasingly important. In particular, in the fields of biomedicine, telecommunications, and data storage, there is a growing demand for micro-magnets with complex three-dimensional geometries and high-precision dimensional control. However, existing methods for preparing micro-magnets have several limitations: powder-based methods: although they can form complex shapes, they lack the precision required for micro-scale applications; physical vapor deposition (PVD): they can produce high-quality magnetic films, but their equipment is expensive, the deposition rate is low, and the shape is difficult to control; traditional electrochemical deposition: they usually rely on liquid electrolytes, which makes them unsuitable for deposition in any direction in three-dimensional space, and they are prone to leakage and difficult to control; photoresist-assisted electrochemical deposition: although it is easy to form magnetic arrays, it is impossible to manufacture shapes with inconsistent upper and lower cross-sections, which increases costs and process time, and also has limitations for the preparation of flexible magnets; ultrasonic-assisted LECD and electrolyte column LECD: although they improve the deposition speed and pattern complexity, they are not efficient enough in dealing with complex multivariable parameter optimization problems; application of machine learning: although they have shown significant potential in other fields of materials science, the application of these technologies in the electrochemical deposition of magnetic materials has not been fully explored; the above existing technologies fail to fully meet the requirements of micro-magnet manufacturing for high precision, controllability, and cost-effectiveness. Especially in the manufacture of three-dimensional cobalt-platinum microstructures, traditional electrochemical deposition methods often lead to inconsistent deposition layer thickness and magnetic properties, affecting the performance of the final product. Therefore, how to improve the consistency of the deposition layer thickness and magnetic properties of the cobalt-platinum microstructure is an urgent problem to be solved by technicians in this field. Summary of the invention

[0003] In view of this, the present invention provides a system and method for preparing a three-dimensional cobalt-platinum microstructure based on the electroplating principle, which overcomes the above-mentioned defects.

[0004] In order to achieve the above object, the present invention adopts the following technical solution:

[0005] A three-dimensional cobalt-platinum microstructure preparation system based on the electroplating principle comprises: a working platform device, an electrochemical deposition device, a control device and a deposition pressure device; the control device generates a path instruction according to an image to be prepared, and transmits it to the working platform device; the working platform device moves according to the path instruction, so that the electrolyte of the electrochemical deposition device is sprayed to a corresponding position for deposition to generate a preparation image; the deposition pressure device provides an adjustable pressure parameter for the electrochemical deposition device.

[0006] Optionally, the electrochemical deposition device includes an anode, a cathode and an electrolyte container; the anode is a graphite electrode, fixed on the electrolyte container and fixedly connected to a power source via a wire, and the cathode is an ITO conductive glass electrode, fixed on the working platform device; the electrolyte container contains electrolyte.

[0007] Optionally, the electrolyte is a conductive colloid.

[0008] Optionally, the deposition pressure device includes an air compression unit and a pressure control unit; the air compression unit provides positive pressure for the electrochemical deposition device; the pressure control unit is used to control the positive pressure provided by the air compression unit to be within a preset standard range.

[0009] Optionally, the working platform device includes a displacement platform and a displacement control unit, and the displacement control unit controls the displacement platform to move according to the path instruction.

[0010] The displacement platform includes an XY direction displacement platform and a Z direction displacement platform; the XY direction displacement platform and the Z direction displacement platform are both installed on a frame, the XY direction displacement platform is used to carry the cathode; the Z direction displacement platform is fixedly connected to the electrolyte container.

[0011] Optionally, the displacement control unit includes a first control subunit and a second control subunit, the first control subunit includes a displacement driver for controlling the movement of the XY direction translation stage; the second control subunit includes the fixedly connected displacement driver and reducer for controlling the movement of the Z direction translation stage.

[0012] A method for preparing a three-dimensional cobalt-platinum microstructure based on the electroplating principle, the specific steps are:

[0013] Build a 3D cobalt-platinum microstructure printing system and set relevant parameters;

[0014] Acquire an image to be prepared, and perform image edge recognition on the image to be prepared;

[0015] generating a preparation path according to the identified image edges, and generating path instructions according to the preparation path;

[0016] The 3D cobalt-platinum microstructure printing system generates a preparation image according to the path instructions.

[0017] Optionally, the specific steps of image edge recognition are:

[0018] Converting the image to be prepared into a grayscale image;

[0019] Image edge recognition is performed on the grayscale image based on an edge detection algorithm.

[0020] Optionally, the step of obtaining the path instruction is:

[0021] Converting the image edge into edge coordinate values, and arranging the edge coordinate values ​​to generate a first preparation path;

[0022] Parallel-shifting the first preparation path to generate a second preparation path;

[0023] The path instruction is generated based on the first preparation path and the second preparation path.

[0024] It can be seen from the above technical solutions that the present invention provides a system and method for preparing a three-dimensional cobalt-platinum microstructure based on the electroplating principle, which has the following beneficial effects compared with the prior art:

[0025] 1. By using gelatin to increase the viscosity of the electrolyte, the pressure control is changed from negative pressure to positive pressure. This method not only overcomes the problem of easy leakage of traditional liquid electrolytes, but also reduces the difficulty of pressure control, improves the stability and controllability of the deposition process, and can also make the conductive colloid used as the electrolyte stably stored in the syringe, and provide a buffer under the action of positive pressure, reduce the hysteresis of gas action, ensure a more uniform and stable extrusion process, and improve the deposition quality.

[0026] 2. For the Z-axis that requires high precision and low-speed movement, a stepper motor and a reducer are used to drive the ball screw module to ensure smooth operation and precise position control of the Z-axis during the deposition process. For the X-axis and Y-axis, a simpler motor direct drive method is used, which not only meets basic needs but also simplifies the control system design. This mechanical displacement control strategy enhances the stability and reliability of the entire system and helps to achieve high-quality microstructure preparation.

[0027] 3. The present invention can precisely control deposition parameters, allowing the manufacture of complex shapes and high aspect ratio structures, greatly expanding the design freedom of manufacturable magnetic microstructures, and successfully realizing the molding of magnetic materials with a thickness of 100μm~300μm. It is suitable for a variety of application scenarios, such as being able to provide miniaturized, high-performance components with complex geometric features for fields such as biomedicine, telecommunications and data storage. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0029] Figure 1 A schematic diagram of the system structure provided by the present invention;

[0030] Figure 2 A schematic diagram of the nozzle structure provided by the present invention;

[0031] FIG3 (a) is a schematic diagram of the change of electrolyte concentration provided by the present invention; FIG3 (b) is a schematic diagram of the cathode current density distribution provided by the present invention; FIG3 (c) is a schematic diagram of the change of the total deposition thickness provided by the present invention;

[0032] FIG4 (a) is a schematic diagram of the deposition thickness variation at a concentration of 0.5 M provided by the present invention; FIG4 (b) is a schematic diagram of the deposition thickness variation at a concentration of 1.0 M provided by the present invention; FIG4 (c) is a schematic diagram of the deposition thickness variation at a concentration of 1.5 M provided by the present invention;

[0033] Figure 5 A schematic diagram of the method provided by the present invention;

[0034] In the figure, 1 is the anode; 2 is the electrolyte container; 3 is the conductive colloid; 4 is the cathode; 5 is the XY direction translation stage; 6 is the Z direction translation stage; A is the nozzle, and 7 is the meniscus. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] On the one hand, this embodiment discloses a three-dimensional cobalt-platinum microstructure preparation system based on the electroplating principle, which is a new method for preparing a three-dimensional microstructure of a cobalt-platinum (Co-Pt) permanent magnet using a local electrochemical deposition (LECD) technique, which controls the deposition process by using an electrolyte and a micronozzle, such as Figure 1As shown, it includes: a working platform device, an electrochemical deposition device, a control device and a deposition pressure device; the control device generates a path instruction according to the image to be prepared, and transmits it to the working platform device; the working platform device moves according to the path instruction, so that the electrolyte of the electrochemical deposition device is sprayed to the corresponding position for deposition to generate a preparation image; the deposition pressure device provides adjustable pressure parameters for the electrochemical deposition device, and communication between each device is achieved through the pyserial serial communication method.

[0037] In one embodiment, the electrochemical deposition device includes an anode 1, a cathode 4 and an electrolyte container 2; the anode 1 is a graphite electrode, fixed on the electrolyte container 2, and fixedly connected to a power source through a wire, and the cathode 4 is an ITO conductive glass electrode, and fixed on a working platform device; the electrolyte container 2 contains electrolyte.

[0038] Furthermore, for the cobalt-platinum alloy magnetic structure, a graphite electrode and an ITO conductive glass electrode are used as the anode 1 and cathode 4, respectively, and the electrolyte solution contains cobalt and platinum ions specially formulated for the deposition process. Graphite electrode (i.e., carbon electrode) is one of the most commonly used electrode materials in electrochemistry. Its advantages are: (1) Compared with other available anodes, such as gold wire and platinum wire, carbon electrode is very cheap; (2) Carbon electrode oxidizes slowly, so it has a wide potential window range, especially in the positive potential direction; (3) Carbon electrode can undergo a variety of surface chemical reactions, especially on the graphite surface, surface chemical modification can be carried out, thereby changing the surface activity of the electrode; (4) Different electron transfer kinetics and adsorption behaviors on the carbon electrode surface can be used to study certain special electrode processes.

[0039] Indium Tin Oxide (ITO) is an n-type wide bandgap semiconductor, which is widely used in electrochemistry. It has high conductivity (10-5 Ω·cm), high optical transparency (about 85%), good physical and chemical properties, and strong adhesion to glass substrates. The ITO conductive glass electrode (i.e., indium tin oxide electrode) needs to be pretreated. In this embodiment, the ITO conductive glass electrode is pretreated using a solvent cleaning method, which is the best activation method for ITO. The purpose of activation is achieved by cleaning the contaminants that block the active sites. The solvent cleaning method can not only effectively clean the surface, but also does not change the surface roughness of the electrode, the surface electronic properties, the surface chemistry, and the surface microstructure, and does not cause the reduction of the oxide and the destruction of the microstructure.

[0040] In one embodiment, the power supply uses an adjustable regulated DC power supply, the electrochemical deposition part uses a 100 cc dispensing syringe as the electrolyte container 2, and the matching needle is used as the nozzle A of 3D electrochemical deposition, and its structure is as follows: Figure 2 As shown, the lower end thereof adopts a meniscus 7 structure to uniformly extrude the conductive colloid 3 .

[0041] In this embodiment, in the electrochemical deposition device, an adjustable DC regulated power supply, a conductor, an anode 1, a cathode 4 and an electrolyte form a complete circuit, wherein the graphite electrode as the anode 1 and the ITO conductive glass electrode as the cathode 4 are electronic conductors, and their conduction mechanism is the directional movement of free electrons; and the electrolyte between the anode 1 and the cathode 4 is an ion conductor, and its conduction mechanism includes electrode reaction and directional movement of ions.

[0042] In one embodiment, the electrolyte is a conductive colloid 3 .

[0043] Furthermore, this embodiment proposes a method of using a conductive colloid 3 instead of a solution as an electrolyte to provide metal ions. The conductive colloid 3 is a special form of electrolyte between liquid and solid, usually composed of a polymer matrix and a liquid electrolyte, wherein the polymer matrix serves as a skeleton supporting the gel membrane and should have good thermodynamic properties, solvent compatibility and chemical stability. The metal salt solution serves as a source of metal ions to provide the metal ions required for electrochemical deposition, and the conductive salt is used to increase the conductivity of the solution.

[0044] In one embodiment, the deposition pressure device includes an air compression unit and a pressure control unit; the air compression unit provides positive pressure for the electrochemical deposition device; the pressure control unit is used to control the positive pressure provided by the air compression unit within a preset standard range.

[0045] Furthermore, the pressure control unit is an important auxiliary module of the electrochemical deposition part. Since negative pressure control is difficult, the balance between surface tension and gravity pressure drop is regulated by adjusting the viscosity of the electrolyte, thereby improving the adaptability to the size of the nozzle A.

[0046] The pressure control unit uses a dispensing machine in conjunction with an air compressor to achieve positive pressure regulation, and the conductive colloid 3 is squeezed out of the syringe to the cathode 4 through positive pressure to form a loop. The key to the pressure control unit is to form a stable and reliable connection. If the pressure is too high, the conductive colloid 3 is easily squeezed out too much and the molding accuracy is affected. If the pressure is too low, the loop is easily disconnected, resulting in deposition failure.

[0047] The gelatin used in the conductive colloid 3 in this embodiment has a pH range of 5.5-7, which is alkaline gelatin. The isoelectric point of alkaline gelatin is 3.7-5.0, and the pH of the electrolyte solution is slightly greater than 5. At this time, the gelatin particles tend to be negatively charged, and the dissociated polymer collagen and the metal ions to be discharged become a complex. On the one hand, the discharge of metal ions from this polymer complex is hindered, thereby enhancing the polarization effect of the cathode 4; on the other hand, the colloid forms an adsorbent film on the surface of the cathode 4, reducing the surface energy of the cathode 4, which is conducive to the generation of new crystal nuclei.

[0048] Furthermore, the conductivity experiment and the viscosity experiment of the conductive colloid 3 proved that the method can produce effective deposition.

[0049] In one embodiment, the pressure control unit uses a dispensing machine pressure controller, which can realize manual and automatic modes. The manual mode is used for manual adjustment to determine the air pressure parameters during the processing process at the initial stage, and the automatic mode cooperates with the host computer to realize automatic processing. The automatic mode can be timed from 0.01 s to 99.99 s. The air source input is provided by a small air compressor, which can input an air pressure of 0.7 MPa.

[0050] In one embodiment, the working platform device includes a displacement platform and a displacement control unit, and the displacement control unit controls the displacement platform to move according to the path instruction.

[0051] In one embodiment, the displacement platform includes an XY direction displacement platform 5 and a Z direction displacement platform 6; both the XY direction displacement platform 5 and the Z direction displacement platform 6 are installed on the frame, the XY direction displacement platform 5 is used to carry the cathode 4; the Z direction displacement platform 6 is fixedly connected to the electrolyte container 2.

[0052] In one embodiment, the displacement control unit includes a first control subunit and a second control subunit. The first control subunit includes a displacement driver for controlling the movement of the XY direction displacement stage 5; the second control subunit includes a fixedly connected displacement driver and a reducer for controlling the movement of the Z direction displacement stage 6.

[0053] Furthermore, the main body of the working platform device uses the fused deposition modeling 3D printer as a template, and a displacement system is used to realize the three-axis movement of the molding part to achieve manufacturing on a three-dimensional scale. The displacement part is mainly divided into two small parts, one is the displacement platform, and the other is the displacement control unit.

[0054] The main body of the displacement platform is composed of a three-axis ball screw module, which is connected and fixed to the frame using a CNC custom-made hard aluminum connecting plate. Considering that the process requires the syringe to be connected to the power supply to realize the electrochemical deposition process, its movement should be minimized to ensure the stability of the circuit connection, so the X and Y axes are connected to achieve planar movement, and the Z axis is fixed alone to bear the vertical movement; to achieve the movement of the XYZ spatial position, the ball screw module is driven by a stepper motor. Using a stepper motor drive module, it can have two modes of coarse adjustment and fine adjustment, realizing the functions of rapid movement on a large scale and fine positioning on a small scale. Among them, the XY two-axis connection combination realizes planar movement, and the Z axis is connected to the frame alone to realize vertical movement, thus forming a complete set of mechanical displacement modules.

[0055] The displacement control unit is mainly composed of a displacement driver, namely an Arduino microcontroller and a host computer. By operating the host computer, manual coarse and fine adjustments can be achieved, the initial origin can be determined, and a certain path can be walked according to the program to deposit various shapes.

[0056] In one embodiment, the preparation system can be assembled in the form of a laboratory bench, wherein the laboratory bench structure is composed of a frame support and other parts fixed on the frame. The frame is composed of 2040 aluminum profiles and 2020 aluminum profiles. The total length of the frame is 260 mm, the total width is 230 mm, and the total height is 265 mm. It is fixed with 2020 angle codes and L-shaped angle irons. The straightness and regularity of the frame is the benchmark for the subsequent molding process to meet the parallelism, so this is one of the key steps in the installation of the main part of the laboratory bench. In order to facilitate further leveling and meet certain vibration isolation requirements, 4 20 mm×20 mm×22 mm rubber foot pads are installed at the bottom of the frame and fixed with screws. Finally, in order to meet the requirements of dust prevention and installation and fixing of control panels, switching power supplies, etc., transparent acrylic plates are customized and installed around and on the top of the main body of the laboratory bench. Finally, the path planning program was designed and written by the python program to complete the construction of the test bench.

[0057] On the other hand, this embodiment discloses a method for preparing a three-dimensional cobalt-platinum microstructure based on the electroplating principle, such as Figure 5 As shown, the specific steps are:

[0058] Step 1: Build a 3D cobalt-platinum microstructure printing system and set relevant parameters;

[0059] Step 2: Obtain the image to be prepared, and perform image edge recognition on the image to be prepared;

[0060] Step 3: Generate a preparation path according to the identified image edge, and generate a path instruction according to the preparation path;

[0061] Step 4: The 3D cobalt-platinum microstructure printing system generates a preparation image according to the path instructions.

[0062] Furthermore, after careful selection and preparation of electrolyte composition, combined with comprehensive theoretical derivation of the thermodynamics and kinetics of the electrochemical deposition process, and rigorous simulation and experimental verification, a 3D cobalt platinum microstructure printing system and its parameter range were established. The printing process of the 3D cobalt platinum microstructure printing system ultimately forms a predetermined magnetic pattern, involving a series of key steps, including graphic edge recognition, edge path generation, internal path generation, controller recognizable code generation, and the actual implementation of the electromechanical system.

[0063] Furthermore, relevant parameters are obtained through simulation experiments. For example, the electrochemical deposition rate is mainly determined by the current density, which is affected by different electrochemical steps, different electrode polarization methods, and the interaction of various factors. By using COMSOL Multiphysics to simulate the electrochemical process for quantitative analysis, the influence of various factors is found to guide subsequent experiments.

[0064] (1) Effect of average current density on electrodeposition: The effect of average current density on electrodeposition was simulated using COMSOL Multiphysics. The initial electrolyte concentration was set to 0.5 mol / L. Under the applied electric field, the change in ion concentration near the cathode 4 interface was observed within 5 seconds. The final deposition thickness was about 6.62 nm, and the deposition rate was about 1.3 nm / s, showing a relatively uniform thickness distribution. The simulation data are shown in Figures 3(a) to 3(c).

[0065] (2) Effect of electrolyte concentration on electrodeposition: By simulating the effect of different electrolyte concentrations (0.5 mol / L, 1 mol / L, 1.5 mol / L) on the deposition thickness at a constant current density, it was found that a higher electrolyte concentration slightly reduced the deposition thickness but improved the uniformity. The simulation data are shown in Figures 4(a) to 4(c).

[0066] Through simulation, we know that the current density has a greater impact on the deposition thickness, but less impact on the thickness uniformity. The electrolyte concentration has a smaller impact on the thickness, but a greater impact on the thickness uniformity. Therefore, in order to obtain a higher deposition rate with better surface quality, a higher current density and a higher electrolyte concentration can be used. Finally, the current density is converted into a deposition voltage, and 10 V~20 V is selected as the subsequent deposition voltage range.

[0067] In one embodiment, the specific steps of image edge recognition are:

[0068] Convert the image to be prepared into a grayscale image;

[0069] Image edge recognition is performed on grayscale images based on edge detection algorithms.

[0070] In one embodiment, the steps of obtaining the path instruction are:

[0071] Converting the image edge into edge coordinate values, and arranging the edge coordinate values ​​to generate a first preparation path;

[0072] Parallel shifting is performed on the first preparation path to generate a second preparation path;

[0073] A path instruction is generated based on the first preparation path and the second preparation path.

[0074] Further, first, the input image is converted into a grayscale image to simplify the data and improve the efficiency of subsequent edge detection. The Canny algorithm is then used to identify and depict the edges in the image. After the edge detection is completed, the program converts the detected edge pixels into coordinate values. These coordinates are then sorted and used to form closed shapes. Next, the parallel function of the Shapely library is used to offset the path and generate an internal path, which is necessary to create complex patterns. After the path planning is completed, an accurate G code for printing complex patterns is generated. This approach ensures that the generated G code accurately represents the complex pattern required for printing. It uses the Shapely library in Python to perform path planning.

[0075] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0076] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A three-dimensional cobalt-platinum microstructure preparation system based on electroplating principle, characterized in that: include: Working platform device, electrochemical deposition device, control device and deposition pressure device; The control device generates a path instruction according to the image to be prepared, and transmits it to the work platform device; The working platform device moves according to the path instruction, so that the electrolyte of the electrochemical deposition device is sprayed to the corresponding position for deposition, thereby generating a preparation image; and the deposition pressure device provides adjustable pressure parameters for the electrochemical deposition device.

2. A three-dimensional cobalt-platinum microstructure preparation system based on electroplating principle according to claim 1, characterized in that: The electrochemical deposition device comprises an anode (1), a cathode (4) and an electrolyte container (2); the anode (1) is a graphite electrode, fixed on the electrolyte container (2) and fixedly connected to a power source via a wire; the cathode (4) is an ITO conductive glass electrode, fixed on the working platform device; the electrolyte container (2) contains electrolyte.

3. A three-dimensional cobalt-platinum microstructure preparation system based on electroplating principle according to claim 2, characterized in that: The electrolyte is a conductive colloid (3).

4. A three-dimensional cobalt-platinum microstructure preparation system based on electroplating principle according to claim 1, characterized in that: The deposition pressure device comprises an air compression unit and a pressure control unit; the air compression unit provides positive pressure for the electrochemical deposition device; the pressure control unit is used to control the positive pressure provided by the air compression unit to be within a preset standard range.

5. A three-dimensional cobalt-platinum microstructure preparation system based on electroplating principle according to claim 2, characterized in that: The working platform device includes a displacement platform and a displacement control unit, and the displacement control unit controls the displacement platform to move according to the path instruction.

6. A three-dimensional cobalt-platinum microstructure preparation system based on electroplating principle according to claim 5, characterized in that: The displacement platform comprises an XY-direction displacement platform (5) and a Z-direction displacement platform (6); the XY-direction displacement platform (5) and the Z-direction displacement platform (6) are both mounted on a frame, the XY-direction displacement platform (5) is used to carry the cathode (4); the Z-direction displacement platform (6) is fixedly connected to the electrolyte container (2).

7. A three-dimensional cobalt-platinum microstructure preparation system based on electroplating principle according to claim 6, characterized in that: The displacement control unit comprises a first control subunit and a second control subunit, the first control subunit comprising a displacement driver for controlling the movement of the XY direction displacement stage (5); the second control subunit comprising the displacement driver and a reducer fixedly connected, for controlling the movement of the Z direction displacement stage (6).

8. A method for preparing a three-dimensional cobalt-platinum microstructure based on the electroplating principle, characterized in that: The specific steps are: Build a 3D cobalt-platinum microstructure printing system and set relevant parameters; Acquire an image to be prepared, and perform image edge recognition on the image to be prepared; generating a preparation path according to the identified image edges, and generating path instructions according to the preparation path; The 3D cobalt-platinum microstructure printing system generates a preparation image according to the path instructions.

9. The method for preparing a three-dimensional cobalt-platinum microstructure based on the electroplating principle according to claim 8, characterized in that: The specific steps of image edge recognition are: Converting the image to be prepared into a grayscale image; Image edge recognition is performed on the grayscale image based on an edge detection algorithm.

10. The method for preparing a three-dimensional cobalt-platinum microstructure based on the electroplating principle according to claim 8, characterized in that: The steps of obtaining the path instruction are as follows: Converting the image edge into edge coordinate values, and arranging the edge coordinate values ​​to generate a first preparation path; Parallel-shifting the first preparation path to generate a second preparation path; The path instruction is generated based on the first preparation path and the second preparation path.

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