A cold head bottom-mounted low-temperature vibration damping system for an ion trap

Abstract

A cold head down-mounted low-temperature vibration damping system for an ion trap according to the present invention belongs to the field of ultra-low temperature ion trap quantum computing. It includes: an optical table, a support plate, a refrigerator, and a vacuum chamber. The vacuum chamber includes a low-temperature chamber and a coupling chamber; the optical table is connected to the ground through a first vibration damping structure, and the refrigerator is connected to the ground through a second vibration damping structure. On the one hand, the present invention reduces the vibration of the refrigerator by means of a bellows, and at the same time supports and dampens the vibration of the refrigerator body and the optical table. In addition, by superimposing the vibration damping for heat transfer, effective thermal vibration damping can be achieved, so as to meet the requirements of ion trap quantum computing.

Description

Technical Field

[0001] The present invention relates to the field of ultra-low temperature ion trap quantum computing, and specifically to a cryogenic vibration damping system with a cold head placed below for an ion trap. Background Art

[0002] In the field of quantum computing, ion trap technology based on trapped ions and superconducting quantum computing technology are two mainstream technical paths for realizing quantum computing. Ion trap technology uses ions cooled to the ground state as qubits, and manipulates and reads qubits through lasers.

[0003] In order to improve the trapping stability of ions and extend the coherence time of qubits, it is often necessary to place the ion trap in an ultra-high vacuum chamber. To further reduce the collision of gas molecules with the trapped ions, ultra-low temperature technology is usually used to cool the ion trap to the liquid helium temperature range, such as cooling to 4K. In the liquid helium temperature range, the residual gas molecules can be reduced, the vacuum degree can be improved, and the collision of gas molecules with the trapped ions can be reduced. At the same time, the heating of the ion crystal can be reduced, the duration of the ion crystal can be increased, and the coherence time of the qubit can be extended.

[0004] To reach the liquid helium temperature range, commonly used cryogenic coolers such as GM cryocoolers or pulse tube cryocoolers are used to provide cooling capacity, but the above cryogenic coolers all inevitably generate vibrations. The basic logic gate operations of qubits on an ion-type quantum computer are mainly realized through lasers or microwaves. The above lasers manipulate the ion trap chip through the window outside the cryogenic cavity. Although the vibration of the cold head of a commercially available cryogenic cooler such as a pulse tube cryocooler can reach 5-10 microns, the above vibration will still affect the above logic gate operations.

[0005] In response to the above vibrations, some existing technologies, such as trying to flexibly thermally connect the cold head and the cold plate through copper braids, will have problems such as cooling capacity loss and high cost. For example, Chinese Patent CN115069326A discloses a low-temperature and low-vibration system for an ion trap, and its secondary cold head uses copper braids for heat transfer, but its primary cold head still has problems of vibration transmission, and it has high cost, complex structure, and general system reliability.

[0006] Some other technologies use helium as a cold source for refrigeration. On the one hand, it still generates large vibrations, and on the other hand, there will be a large loss of helium during the refrigeration process, resulting in high costs.

[0007] Therefore, there is an urgent need for a cryogenic vibration damping system applied to an ion trap to solve the above problems. Summary of the Invention

[0008] The present invention is proposed to alleviate or solve at least one aspect or at least one point of the above problems.

[0009] A cryogenic vibration damping system with a lower-mounted cold head for an ion trap according to the present invention includes: an optical platform, a support plate, a refrigerator, and a vacuum chamber. The vacuum chamber includes a cryogenic chamber and a coupling chamber. The optical platform is connected to the ground through a first vibration damping structure, and the refrigerator is connected to the ground through a second vibration damping structure.

[0010] The optical platform is formed with an installation opening, and the vacuum chamber is fixed above the installation opening of the optical platform.

[0011] The support plate is formed with a support opening, the refrigerator is fixed on the support plate, and the first-stage cold head and the second-stage cold head of the refrigerator pass through the support opening and are arranged downward. The first-stage cold head and the second-stage cold head are located in the vacuum chamber.

[0012] The coupling chamber includes a vibration damping bellows. One end of the bellows is connected to the cryogenic chamber, and the other end is connected to the refrigerator.

[0013] A first-stage cold plate and a second-stage cold plate are arranged in the cryogenic chamber.

[0014] The first-stage cold head is thermally coupled to the first-stage cold plate through a first thermal connection structure, and the second-stage cold head is thermally coupled to the second-stage cold plate through a second thermal connection structure.

[0015] The first thermal connection structure includes a first heat conduction block, a first installation block, a second heat conduction block, and a first groove. The first installation block is fixed on one side of the first heat conduction block. The other side of the first heat conduction block is formed with first fins, and one side of the second heat conduction block is formed with a first heat transfer groove that cooperates with the first fins. The first installation block is placed in the first groove, and a first gap is formed between the outer peripheral edge of the first installation block and the inner peripheral edge of the first groove.

[0016] Preferably, the first groove is opened on the first-stage cold plate or on a first intermediate heat transfer member fixedly connected to the first-stage cold plate. The second heat conduction block is thermally connected to the first-stage cold head.

[0017] Preferably, when the first fins cooperate with the first heat transfer groove, the top end of the first fins has a first preset distance from the bottom end of the first heat transfer groove.

[0018] Preferably, the first heat conduction block includes a left heat conduction block and a right heat conduction block, the first installation block includes a left installation block and a right installation block, and the first groove includes a left groove and a right groove. Both the left heat conduction block and the right heat conduction block are in a ring structure, and there is a left-right gap between them.

[0019] Preferably, the second thermal connection structure includes a third heat conduction block, a second installation block, a fourth heat conduction block, and a second groove. The second installation block is fixed on one side of the third heat conduction block. The other side of the third heat conduction block is formed with second fins, and one side of the fourth heat conduction block is formed with a second heat transfer groove that cooperates with the second fins. The second installation block is placed in the second groove, and a second gap is formed between the outer peripheral edge of the second installation block and the inner peripheral edge of the second groove.

[0020] Preferably, the second groove is formed on the secondary cold plate or on a second intermediate heat transfer member fixedly connected to the secondary cold plate; the fourth heat conducting block is thermally connected to the secondary cold head.

[0021] Preferably, when the second fin is engaged with the second heat transfer groove, a second preset distance is provided between the top end of the second fin and the bottom end of the second heat transfer groove.

[0022] Preferably, the low-temperature cavity further includes: a primary cold shield thermally connected to the primary cold plate, and a secondary cold shield thermally connected to the secondary cold plate; the secondary cold shield is located inside the primary cold shield.

[0023] Preferably, a plurality of laser windows are formed on the side surface of the low-temperature cavity.

[0024] Preferably, an objective lens observation window is formed on the bottom surface of the low-temperature cavity.

[0025] The low-temperature vibration damping system of the present invention, on the one hand, reduces the vibration of the refrigerator through the bellows, and at the same time supports and dampens the refrigerator body and the optical platform. In addition, by superimposing the vibration damping of heat transfer, effective thermal vibration damping can be achieved, so as to meet the requirements of ion trap quantum computing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a perspective schematic view of a cold head down-mounted low-temperature vibration damping system for an ion trap according to an exemplary embodiment of the present invention.

[0027] Figure 2 is a front view schematic view of a cold head down-mounted low-temperature vibration damping system for an ion trap according to an exemplary embodiment of the present invention.

[0028] Figure 3 is a side view schematic view of a cold head down-mounted low-temperature vibration damping system for an ion trap according to an exemplary embodiment of the present invention.

[0029] Figure 4 is a top view schematic view of a cold head down-mounted low-temperature vibration damping system for an ion trap according to an exemplary embodiment of the present invention.

[0030] Figure 5 is Figure 4 a sectional view taken along line A-A of

[0031] Figure 6 is Figure 5 an enlarged view of portion I of

[0032] Figure 7 is Figure 6 an enlarged view of portion II of

[0033] Figure 8 is Figure 6 an enlarged view of portion III of

[0034] Figure 9 A perspective three-dimensional schematic diagram of another view of the cold head downward-mounted cryogenic vibration damping system for an ion trap according to an exemplary embodiment of the present invention.

[0035] Figure 10 A perspective three-dimensional schematic diagram (in a separated state) of the first thermal connection structure according to an exemplary embodiment of the present invention.

[0036] Figure 11 A perspective three-dimensional schematic diagram (in a separated state) of the second thermal connection structure according to an exemplary embodiment of the present invention.

[0037] Figure 12 A perspective three-dimensional schematic diagram of the cold head downward-mounted cryogenic vibration damping system for an ion trap according to an exemplary embodiment of the present invention (mainly showing the first thermal connection structure and the second thermal connection structure inside the system).

[0038] Figure 13 is Figure 12 an enlarged schematic diagram at IV of

[0039] Figure 14 A front view schematic diagram of the cold head downward-mounted cryogenic vibration damping system for an ion trap according to an exemplary embodiment of the present invention (mainly showing the first thermal connection structure and the second thermal connection structure inside the system).

[0040] Figure 15 is Figure 14 an enlarged schematic diagram at V of

[0041] Figure 16 A perspective three-dimensional schematic diagram of another view of the cold head downward-mounted cryogenic vibration damping system for an ion trap according to an exemplary embodiment of the present invention.

[0042] Wherein: 10 - optical platform, 11 - first damping structure, 12 - first support structure, 13 - installation opening, 14 - support plate, 15 - second damping structure, 16 - second support structure, 17 - support opening; 20 - refrigerator, 21 - first - stage cold head, 22 - second - stage cold head, 23 - first groove, 24 - second groove, 25 - connecting flange; 30 - cryogenic cavity, 31 - upper cavity, 32 - lower cavity, 33 - window, 34 - vacuum tube, 35 - cable connector, 36 - third flange, 37 - fourth flange, 38 - fifth flange, 39 - objective lens window; 40 - coupling cavity, 41 - first flange, 42 - second flange, 43 - bellows; 50 - first thermal connection structure, 51 - left heat - conducting block, 52 - right heat - conducting block, 53 - left mounting block, 54 - right mounting block, 55 - left fin, 56 - right fin, 57 - left - right gap, 58 - second heat - conducting block, 59 - first heat - transfer groove; 60 - second thermal connection structure, 61 - third heat - conducting block, 62 - second fin, 63 - second mounting block, 64 - fourth heat - conducting block, 65 - second heat - transfer groove; 71 - first - stage cold plate, 72 - second - stage cold plate, 73 - ion trap chip, 74 - first - stage cold shield, 75 - second - stage cold shield. Detailed implementation mode

[0043] The following description of the embodiments of the present invention with reference to the drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation of the present invention. In the present invention, the same reference numerals represent the same or similar components.

[0044] The features described herein can be implemented in different forms and should not be construed as limited to the examples described herein. On the contrary, the examples provided herein are only to illustrate some of the many feasible ways of implementing the methods, devices, and / or systems described herein, which will be apparent after understanding the disclosure of the present invention.

[0045] Although terms such as "first", "second", and "third" may be used herein to describe various members, components, regions, layers, or parts, these members, components, regions, layers, or parts should not be limited by these terms. On the contrary, these terms are only used to distinguish one member, component, region, layer, or part from another member, component, region, layer, or part.

[0046] In the specification, when an element (such as a layer, region, or substrate) is described as "on" another element, "connected to" or "bonded to" another element, the element can be directly "on" another element, directly "connected to" or "bonded to" another element, or there may be one or more other elements therebetween. On the contrary, when an element is described as "directly on" another element, "directly connected to" or "directly bonded to" another element, there may be no other elements therebetween.

[0047] The terms used herein are for describing various examples only and are not intended to limit the disclosure. Unless the context clearly indicates otherwise, the singular forms are also intended to include the plural forms. The terms "comprising", "including" and "having" specify the presence of the described features, quantities, operations, components, elements and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements and / or combinations thereof.

[0048] To enable those skilled in the art to use the content of the present invention, the following exemplary embodiments may be given in combination with specific application scenarios, parameters of specific systems, devices and components, and specific connection methods hereinafter. However, for those skilled in the art, these embodiments are only examples, and the general principles defined herein can be applied to other embodiments and application scenarios without departing from the spirit and scope of the present invention.

[0049] According to an exemplary embodiment of the present invention: as Figures 1 - 16 shown, a cryogenic vibration damping system for an ion trap, which may also be referred to as a cold head bottom-mounted cryogenic vibration damping system for an ion trap. It includes: an optical platform 10, a refrigerator 20, and a vacuum chamber. The vacuum chamber includes a cryogenic chamber 30 and a coupling chamber 40.

[0050] As Figures 1 - 3 、 Figure 12 shown, the optical platform 10 is connected to the ground through a first support structure 12, and a first vibration damping structure 11 is further provided between the optical platform 10 and the first support structure 12. The refrigerator 20 is placed on a support plate 14. The support plate 14 is connected to the ground through a second support structure 16, and a second vibration damping structure 15 is further provided between the support plate 14 and the second support structure 16. The first vibration damping structure 11 and the second vibration damping structure 15 can be rubber rings.

[0051] According to an exemplary embodiment of the present invention: as Figures 1 - 3 、 Figure 5 、 Figure 6 、 Figure 9 and Figure 16 shown, the optical platform 10 is formed with an installation opening 13, and the vacuum chamber is fixed above the installation opening 13 of the optical platform 10. Schematically, it is fixed on the optical platform 10 through an installation flange.

[0052] The support plate 14 is formed with a support opening 17. The refrigerator 20 is fixed on the support plate 14. The primary cold head 21 and the secondary cold head 22 of the refrigerator 20 pass through the support opening 17 and are arranged downward. The primary cold head 21 and the secondary cold head 22 are located in the vacuum chamber. The coupling chamber 40 includes a vibration damping bellows 43. One end of the bellows 43 is connected to the cryogenic chamber 30, and the other end is connected to the refrigerator 20.

[0053] The low-temperature chamber 30 includes an upper chamber 31 and a lower chamber 32. The upper chamber 31 and the lower chamber 32 are connected together by a fourth flange 37 and a fifth flange 38. Schematically, the lower chamber 32 is an octahedron structure, and each side is provided with a viewing window 33. The optical instrument is placed on the optical platform 10, and the laser instrument can control the ion trap chip 73 through the viewing window 33. The bottom surface of the lower chamber 32 is also provided with an objective window 39, through which the state of the ion trap chip 73 can be observed, and a CCD camera can be used to observe the state therein. The upper chamber 31 is also a polyhedron structure, and its side includes connectors such as a cable connector 35 and a vacuum tube 34. The cable connector 35 is used to introduce cable lines and control lines, and the vacuum tube 34 is used to maintain the vacuum degree of the vacuum chamber.

[0054] According to an exemplary embodiment of the present invention: as Figures 1 - 3 , Figure 5 and Figure 6 shown, the coupling chamber 40 includes a damping bellows 43. One end of the bellows 43 is connected to the low-temperature chamber 30, and the other end is connected to the refrigerator 20; the low-temperature chamber 30 and the coupling chamber 40 are vacuum-sealed and connected through a third flange 36 and a second flange 42. The coupling chamber 40 and the refrigerator 20 are vacuum-sealed and connected through a first flange 41 and a connecting flange 25. The bellows 43 can be formed by corrugations made of hydraulically formed stainless steel. Other types of vibration damping can replace the above-mentioned bellows 43, such as edge-welded bellows 43 or elastomeric sleeves with vibration damping effects.

[0055] According to an exemplary embodiment of the present invention: as Figure 1 , Figures 5 - 8 and Figures 10 - 13 shown, the refrigerator 20 includes a first-stage cold head 21 and a second-stage cold head 22 arranged downward, and the first-stage cold head 21 and the second-stage cold head 22 are located inside the low-temperature chamber 30. The refrigerator 20 is preferably a GM refrigerator 20 or a pulse tube refrigerator 20.

[0056] A first-stage cold plate 71 and a second-stage cold plate 72 are arranged inside the low-temperature chamber 30; the first-stage cold plate 71 is connected to a first-stage cold shield 74, and the second-stage cold plate 72 is connected to a second-stage cold shield 75. Exemplarily, the first-stage cold shield 74 can be a 35K cold shield, and the second-stage cold shield 75 can be a 4K cold shield. Thus, a suitable working temperature is provided for the ion trap chip 73. Both the first-stage cold shield 74 and the second-stage cold shield 75 are arranged inside the low-temperature chamber 30, and the second-stage cold shield 75 is arranged inside the first-stage cold shield 74. The first-stage cold shield 74 and the second-stage cold shield 75 can be fixed to the low-temperature chamber 30 by means of struts (not shown) and the like.

[0057] The first-stage cold head 21 is thermally coupled to the first-stage cold plate 71 through a first thermal connection structure 50, and the second-stage cold head 22 is thermally coupled to the second-stage cold plate 72 through a second thermal connection structure 60;

[0058] According to an exemplary embodiment of the present invention: as Figures 5 - 8 , Figures 10 - 16 shown, the first heat connection structure 50 includes a first heat conducting block, a first mounting block, a second heat conducting block 58 and a first groove 23; the first mounting block is fixed on one side of the first heat conducting block, a first fin is formed on the other side of the first heat conducting block, and a first heat transfer groove 59 matching with the first fin is formed on one side of the second heat conducting block 58; the first mounting block is placed in the first groove 23, and a first gap is formed between the outer peripheral edge of the first mounting block and the inner peripheral edge of the first groove 23. The first groove 23 is opened on the primary cold plate 71 or on a first intermediate heat transfer member (not shown) fixedly connected to the primary cold plate 71; the second heat conducting block 58 is in heat connection with the primary cold head 21, and schematically, the two are fixedly connected together.

[0059] As Figures 5 - 8 , Figures 10 - 16 shown, through the above arrangement, when the primary cold head 21 vibrates in the horizontal direction, due to the existence of the first gap, the transmission of vibration can be at least slowed down. Optionally, a first buffer member is arranged in the first gap, and the first buffer member can be a rubber ring or a liquid thermal conductive adhesive in a viscous state. The distance of the first gap can be selected according to the horizontal vibration amplitude of the cold head of the refrigerator 20, for example, it can be 1-3 times the maximum vibration amplitude of the cold head of the refrigerator 20.

[0060] As Figures 6 - 10 , Figure 13 and Figure 15 shown, preferably, the present invention can also provide vibration damping in the vertical direction. When the first fin cooperates with the first heat transfer groove 59, there is a first preset distance between the top end of the first fin and the bottom end of the first heat transfer groove 59, and there is a first preset distance between the bottom end of the first fin and the top end of the first heat transfer groove 59; thus, the transmission of vibration in the vertical direction can be slowed down. The first preset distance can be selected according to the vertical vibration amplitude of the cold head of the refrigerator 20, for example, it can be 1-3 times the maximum vibration amplitude of the cold head of the refrigerator 20. An optional solution is that the width of the first fin is smaller than the width of the first heat transfer groove 59, so as to further prevent the transmission of vibration. However, with the above arrangement, an undesired reduction in the heat transfer effect may occur. Considering vibration and heat transfer comprehensively, it is still an optional solution.

[0061] According to an exemplary embodiment of the present invention: as Figures 5 - 8 , Figures 10 - 13 shown, the surface of one side of the first heat conducting block is in a fitting state with the surface of the primary cold plate 71 or the first groove 23 of the first intermediate heat transfer member. Through the above arrangement, on the one hand, heat transfer can be ensured, and on the other hand, relatively stable sliding can occur between the two.

[0062] According to an exemplary embodiment of the present invention: as Figures 5 - 8, Figures 10 - 13 As shown, the first heat conducting block includes a left heat conducting block 51 and a right heat conducting block 52. The first mounting block includes a left mounting block 53 and a right mounting block 54. The first groove 23 includes a left groove and a right groove. The first fin includes a left fin 55 and a right fin 56. Both the left heat conducting block 51 and the right heat conducting block 52 are in an annular structure, and there is a left - right gap 57 between them. With the above - mentioned arrangement of the first heat conducting block, the left heat conducting block 51 and the right heat conducting block 52 do not affect each other, so interference will not occur.

[0063] As Figures 5 - 8 , Figures 10 - 16 shown, exemplarily, the second heat conducting block 58 is in a cylindrical structure, and first heat transfer grooves 59 are arrayed on the cylindrical structure. The left fins 55 are arrayed on the left heat conducting block 51, and the right fins 56 are arrayed on the right heat conducting block 52. Both the left mounting block 53 and the right mounting block 54 are in a cylindrical structure, and the left groove and the right groove are also cylindrical grooves.

[0064] According to an exemplary embodiment of the present invention: As Figures 5 - 8 , Figures 10 - 13 shown, the second heat connection structure 60 includes a third heat conducting block 61, a second mounting block 63, a fourth heat conducting block 64 and a second groove 24. The second mounting block 63 is fixed on one side of the third heat conducting block 61. A second fin 62 is formed on the other side of the third heat conducting block 61. A second heat transfer groove 65 that cooperates with the second fin 62 is formed on one side of the fourth heat conducting block 64. The second mounting block 63 is placed in the second groove 24, and a second gap is formed between the outer peripheral edge of the second mounting block and the inner peripheral edge of the second groove 24. The distance of the second gap can be selected according to the horizontal vibration amplitude of the cold head of the refrigerator 20. For example, it can be 1 - 3 times the maximum vibration amplitude of the cold head of the refrigerator 20.

[0065] According to an exemplary embodiment of the present invention: As Figures 5 - 8 , Figures 10 - 13 shown, the second groove 24 is opened on the secondary cold plate 72 or on a second intermediate heat transfer member (not shown) fixedly connected to the secondary cold plate 72. The fourth heat conducting block 64 is thermally connected to the secondary cold head 22, such as being fixedly attached together with their surfaces in contact. The surface on one side of the third heat conducting block 61 is in a state of being in contact with the surface of the secondary cold plate 72 or the second groove 24 of the second intermediate heat transfer member. This contact state can, on the one hand, ensure heat transfer, and on the other hand, enable the two to slide relatively smoothly.

[0066] With the above settings, when the secondary cold head 22 vibrates in the horizontal direction, due to the existence of the second gap, the transmission of vibration can be at least slowed down. Optionally, a second buffer member is provided in the second gap, and the second buffer member can be a rubber ring or a liquid thermal conductive adhesive in a viscous state. The distance of the second gap can be selected according to the horizontal vibration amplitude of the cold head of the refrigerator 20, for example, it can be 1-3 times the maximum horizontal vibration amplitude of the cold head of the refrigerator 20.

[0067] Such as Figure 6 , Figure 7 , Figure 8 , Figure 13 and Figure 15 As shown in

[0068] , preferably, the present invention can also provide vibration damping in the vertical direction. In the vertical direction, when the second fin 62 cooperates with the second heat transfer groove 65, there is a second preset distance between the top end of the second fin 62 and the bottom end of the second heat transfer groove 65; there is a second preset distance between the bottom end of the second fin 62 and the top end of the second heat transfer groove 65; thereby, the transmission of vibration in the vertical direction can be slowed down. The second preset distance can be selected according to the vertical vibration amplitude of the cold head of the refrigerator 20, for example, it can be 1-3 times the maximum vibration amplitude of the cold head of the refrigerator 20. An optional solution is that the width of the second fin 62 is smaller than the width of the second heat transfer groove 65, thereby further preventing the transmission of vibration. However, the above settings may lead to an undesired reduction in the heat transfer effect. Considering vibration and heat transfer comprehensively, it is still an optional solution.

[0069] With the above settings, when the secondary cold head 22 vibrates in the vertical direction, due to the existence of the second preset distance, the transmission of vibration can be at least slowed down. Figures 5 - 8 , Figures 10 - 16 As shown in

[0070] The low-temperature vibration damping system of the present invention, on the one hand, reduces the vibration of the refrigerator 20 through the bellows 43, and at the same time supports and dampens the vibration of the body of the refrigerator 20 and the optical platform 10. In addition, by superimposing the vibration damping for heat transfer, effective thermal vibration damping can be achieved, so as to meet the requirements of ion trap quantum computing.

[0071] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes and combinations of elements can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cold head-down low-temperature vibration reduction system for an ion trap, characterized in that: include: An optical platform, a support plate, a refrigerator and a vacuum chamber, wherein the vacuum chamber includes a low-temperature chamber and a coupling chamber; The optical platform is connected to the ground through a first vibration reduction structure, and the refrigerator is connected to the ground through a second vibration reduction structure; The optical platform is formed with a mounting opening, and the vacuum chamber is fixed above the mounting opening of the optical platform; The support plate is formed with a support opening, the refrigerator is fixed on the support plate, the primary cold head and the secondary cold head of the refrigerator are arranged downward through the support opening, and the primary cold head and the secondary cold head are located in the vacuum chamber; The coupling cavity includes a vibration-damping bellows, one end of which is connected to the low-temperature cavity and the other end is connected to the refrigerator; A primary cold plate and a secondary cold plate are arranged in the low temperature chamber; The primary cold head is thermally coupled to the primary cold plate via a first thermal connection structure, and the secondary cold head is thermally coupled to the secondary cold plate via a second thermal connection structure; The first thermal connection structure includes a first heat-conducting block, a first mounting block, a second heat-conducting block and a first groove; the first mounting block is fixed on one side of the first heat-conducting block, a first fin is formed on the other side of the first heat-conducting block, and a first heat transfer groove matching the first fin is formed on one side of the second heat-conducting block; the first mounting block is placed in the first groove, and a first gap is formed between the outer periphery of the first mounting block and the inner periphery of the first groove.

2. The low temperature vibration reduction system according to claim 1, characterized in that: The first groove is arranged on the primary cold plate or on the first intermediate heat transfer member fixedly connected to the primary cold plate; the second heat conduction block is thermally connected to the primary cold head.

3. The low temperature vibration reduction system according to claim 2, characterized in that: When the first fin cooperates with the first heat transfer groove, a top end of the first fin and a bottom end of the first heat transfer groove have a first preset distance.

4. The low temperature vibration reduction system according to claim 3, characterized in that: The first heat conductive block includes a left heat conductive block and a right heat conductive block, the first mounting block includes a left mounting block and a right mounting block, and the first groove includes a left groove and a right groove; the left heat conductive block and the right heat conductive block are both annular structures with left and right gaps therebetween.

5. The low temperature vibration reduction system according to claim 1, characterized in that: The second thermal connection structure includes a third heat-conducting block, a second mounting block, a fourth heat-conducting block and a second groove; the second mounting block is fixed to one side of the third heat-conducting block, a second fin is formed on the other side of the third heat-conducting block, and a second heat transfer groove matching the second fin is formed on one side of the fourth heat-conducting block; the second mounting block is placed in the second groove, and a second gap is formed between the outer periphery of the second mounting block and the inner periphery of the second groove.

6. The low temperature vibration reduction system according to claim 5, characterized in that: The second groove is arranged on the secondary cold plate or on the second intermediate heat transfer member fixedly connected to the secondary cold plate; the fourth heat conduction block is thermally connected to the secondary cold head.

7. The low temperature vibration reduction system according to claim 6, characterized in that: When the second fin is matched with the second heat transfer groove, a second preset distance exists between the top end of the second fin and the bottom end of the second heat transfer groove.

8. The low temperature vibration reduction system according to claim 1, characterized in that: The low temperature chamber also includes: a primary cold screen thermally connected to the primary cold plate, and a secondary cold screen thermally connected to the secondary cold plate; the secondary cold screen is located inside the primary cold screen.

9. The low temperature vibration reduction system according to claim 1, characterized in that: A plurality of laser viewing windows are provided on the side of the cryogenic chamber.

10. The low temperature vibration reduction system according to claim 1, characterized in that: An objective lens observation window is provided on the bottom surface of the low temperature chamber.

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