A cold head mounted low temperature vibration reduction system for ion trap

Abstract

The present invention discloses a cold head mounted low temperature vibration reduction system for an ion trap, which belongs to the field of ultra-low temperature ion trap quantum computing. The system comprises an optical platform, a refrigerator and a vacuum chamber, wherein the vacuum chamber comprises a low temperature chamber and a coupling chamber; the optical platform is connected to the ground via a first vibration reduction structure, and the refrigerator is connected to the ground via a second vibration reduction structure. On the one hand, the present invention reduces the vibration of the refrigerator by means of a bellows, while supporting and reducing the vibration of the refrigerator body and the optical platform. In addition, superimposing the vibration reduction for heat transfer can effectively achieve thermal vibration reduction, thereby meeting the requirements of ion trap quantum computing.

Description

Technical Field

[0001] The invention relates to the field of ultra-low temperature ion trap quantum computing, and in particular to a cold head mounted low temperature vibration reduction system for an ion trap. Background Art

[0002] In the field of quantum computing, ion trap technology based on trapped ions and superconducting quantum computing technology are the two mainstream technical paths to achieve quantum computing. Ion trap technology uses ions cooled to the ground state as quantum bits, and uses lasers to manipulate and read quantum bits.

[0003] In order to improve the trapped stability of ions and extend the coherence time of quantum bits, it is often necessary to place the ion trap in an ultra-high vacuum chamber. In order to further reduce the collision of gas molecules with trapped ions, ultra-low temperature technology is usually used to cool the ion trap to the liquid helium temperature range, such as cooling to 4K. In the liquid helium temperature range, the residual gas molecules can be reduced, the vacuum degree can be improved, and the collision of gas molecules with trapped ions can be reduced. At the same time, the heating of the ion crystal can be reduced, the duration of the ion crystal can be increased, and the coherence time of the quantum bit can be extended.

[0004] In order to reach the liquid helium temperature range, commonly used refrigerators such as GM refrigerators or pulse tube refrigerators provide cooling capacity, but the above refrigerators inevitably produce vibrations. The basic logic gate operation of quantum bits on ion-type quantum computers is mainly achieved through lasers or microwaves. The above laser controls the ion trap chip through the window outside the cryogenic cavity. Although the vibration of the cold head of current commercial refrigerators such as pulse tube refrigerators can reach 5-10 microns, the above vibration will still affect the above logic gate operation.

[0005] In view of the above vibration, some existing technologies, such as attempting to use copper braids to make a flexible thermal connection between the cold head and the cold plate, will have problems such as cooling capacity loss and high cost. For example, Chinese patent CN115069326A discloses a low-temperature and low-vibration system for an ion trap, in which the secondary cold head uses copper braids for heat transfer, but the primary cold head still has the problem of vibration transfer, and its cost is high, the structure is complex, and the system reliability is average.

[0006] There are other technologies that use helium as a cold source for refrigeration. On the one hand, it still produces large vibrations, and on the other hand, a large amount of helium is lost during the refrigeration process, which is very costly.

[0007] Therefore, there is an urgent need for a low-temperature vibration reduction system applied to an ion trap to solve the above problems. Summary of the invention

[0008] The present invention is proposed to alleviate or solve at least one aspect or at least one point of the above problems.

[0009] A cold head mounted low temperature vibration reduction system for an ion trap of the present invention comprises: an optical platform, a refrigerator and a vacuum chamber, wherein the vacuum chamber comprises a low temperature chamber and a coupling chamber; the optical platform is connected to the ground via a first vibration reduction structure, and the refrigerator is connected to the ground via a second vibration reduction structure;

[0010] The optical platform is formed with a mounting opening, the refrigerator is located below the optical platform, and the low-temperature cavity is fixed above the optical platform;

[0011] The coupling cavity is arranged through the installation opening, and the coupling cavity includes a vibration-damping bellows, one end of the bellows is connected to the low-temperature cavity, and the other end is connected to the refrigerator;

[0012] The refrigerator comprises a primary cold head and a secondary cold head arranged upward, and the primary cold head and the secondary cold head are located in the vacuum chamber;

[0013] A primary cold plate and a secondary cold plate are arranged in the low temperature chamber;

[0014] The primary cold head is thermally coupled to the primary cold plate via a first thermal connection structure, and the secondary cold head is thermally coupled to the secondary cold plate via a second thermal connection structure;

[0015] The first thermal connection structure includes a first heat-conducting block, a first mounting block, a second heat-conducting block and a first groove; the first mounting block is fixed on one side of the first heat-conducting block, a first fin is formed on the other side of the first heat-conducting block, and a first heat transfer groove matching the first fin is formed on one side of the second heat-conducting block; the first mounting block can be placed in the first groove, and a first gap is formed between the outer periphery of the first mounting block and the inner periphery of the first groove.

[0016] Preferably, the first groove is provided on the primary cold head or on the first intermediate heat transfer member fixedly connected to the primary cold head; and the second heat conduction block is thermally connected to the primary cold plate.

[0017] Preferably, when the first fin cooperates with the first heat transfer groove, a top end of the first fin and a bottom end of the first heat transfer groove have a first preset distance.

[0018] Preferably, the first heat conductive block includes a left heat conductive block and a right heat conductive block, the first mounting block includes a left mounting block and a right mounting block, and the first groove includes a left groove and a right groove; the first heat conductive block and the second heat conductive block are both annular structures with left and right gaps therebetween.

[0019] Preferably, the second thermal connection structure includes a third heat-conducting block, a second mounting block, a fourth heat-conducting block and a second groove; the second mounting block is fixed to one side of the third heat-conducting block, a second fin is formed on the other side of the third heat-conducting block, and a second heat transfer groove matching the second fin is formed on one side of the fourth heat-conducting block; the second mounting block can be placed in the second groove, and a second gap is formed between the outer periphery of the second mounting block and the inner periphery of the second groove.

[0020] Preferably, the second groove is provided on the secondary cold head or on the second intermediate heat transfer member fixedly connected to the secondary cold head; and the fourth heat conduction block is thermally connected to the secondary cold plate.

[0021] Preferably, when the second fin cooperates with the second heat transfer groove, a second preset distance exists between the top end of the second fin and the bottom end of the second heat transfer groove.

[0022] Preferably, the low-temperature chamber further includes: a primary cold screen thermally connected to the primary cold plate, and a secondary cold screen thermally connected to the secondary cold plate; the secondary cold screen is located inside the primary cold screen.

[0023] Preferably, a plurality of laser viewing windows are provided on the side of the cryogenic chamber.

[0024] Preferably, an objective lens observation window is provided on the top surface of the low temperature chamber.

[0025] The low temperature vibration reduction system of the present invention reduces the vibration of the refrigerator by means of bellows, and supports and reduces the vibration of the refrigerator body and the optical platform. In addition, the vibration reduction of heat transfer can be superimposed to effectively achieve thermal vibration reduction, so that it meets the requirements of ion trap quantum computing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a three-dimensional schematic diagram of a cold head mounted low temperature vibration reduction system for an ion trap according to an exemplary embodiment of the present invention.

[0027] Figure 2 It is a front schematic diagram of a cold head mounted low temperature vibration reduction system for an ion trap according to an exemplary embodiment of the present invention.

[0028] Figure 3 A schematic side view of a cold head mounted cryogenic vibration reduction system for an ion trap according to an exemplary embodiment of the present invention.

[0029] Figure 4 It is a schematic top view of a cold head mounted low temperature vibration reduction system for an ion trap according to an exemplary embodiment of the present invention.

[0030] Figure 5 for Figure 4 AA section diagram of .

[0031] Figure 6 for Figure 5 An enlarged schematic diagram of point I.

[0032] Figure 7 for Figure 6 Enlarged schematic diagram of point II.

[0033] Figure 8 for Figure 6 An enlarged schematic diagram of point III.

[0034] Fig. 9 It is a three-dimensional schematic diagram from another perspective of a cold head mounted low temperature vibration reduction system for an ion trap according to an exemplary embodiment of the present invention.

[0035] Fig.10 It is a perspective schematic diagram of a first thermal connection structure (in a separated state) according to an exemplary embodiment of the present invention.

[0036] Fig.11 1 is a perspective schematic diagram of a second thermal connection structure (in a separated state) according to an exemplary embodiment of the present invention.

[0037] Fig.12 It is a three-dimensional schematic diagram of a cold head mounted low temperature vibration reduction system for an ion trap according to an exemplary embodiment of the present invention (mainly showing the first thermal connection structure and the second thermal connection structure inside the system).

[0038] Fig.13 for Fig.12 Enlarged schematic diagram of IV.

[0039] Fig.14 It is a front schematic diagram of a cold head mounted low temperature vibration reduction system for an ion trap according to an exemplary embodiment of the present invention (mainly showing the first thermal connection structure and the second thermal connection structure inside the system).

[0040] Fig.15 for Fig.14 Enlarged schematic diagram of V.

[0041] Wherein: 10-optical platform, 11-first vibration reduction structure, 12-first support structure, 13-installation opening, 14-support plate, 15-second vibration reduction structure, 16-second support structure; 20-refrigerator, 21-first cold head, 22-second cold head, 23-first groove, 24-second groove, 25-connecting flange; 30-low temperature cavity, 31-upper cavity, 32-lower cavity, 33-window, 34-vacuum tube, 35-cable connector, 36-third flange, 37-fourth flange, 38-fifth flange, 39-objective window; 40-coupling cavity, 41-first A flange, 42-a second flange, 43-a bellows; 50-a first thermal connection structure, 51-a left heat conducting block, 52-a right heat conducting block, 53-a left mounting block, 54-a right mounting block, 55-a left fin, 56-a right fin, 57-a left and right gap, 58-a second heat conducting block, 59-a first heat transfer groove; 60-a second thermal connection structure, 61-a third heat conducting block, 62-a second fin, 63-a second mounting block, 64-a fourth heat conducting block, 65-a second heat transfer groove; 71-a primary cold plate, 72-a secondary cold plate, 73-an ion trap chip, 74-a primary cold screen, 75-a secondary cold screen. DETAILED DESCRIPTION

[0042] The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention, and should not be construed as a limitation of the present invention. In the present invention, the same reference numerals represent the same or similar components.

[0043] The features described herein can be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided to illustrate only some of the many possible ways to implement the methods, devices, and / or systems described herein, which will be clear after understanding the disclosure of the present invention.

[0044] Although terms such as "first", "second", and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions should not be limited by these terms. Instead, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion.

[0045] In the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, or “coupled to” another element, the element may be directly “on”, “connected to”, or “coupled to” another element, or one or more other elements may be present therebetween. Conversely, when an element is described as being “directly on”, “directly connected to”, or “directly coupled to” another element, there may be no other elements present therebetween.

[0046] The terms used herein are only used to describe various examples and are not intended to limit the disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "comprise", "include" and "have" indicate the presence of the described features, quantities, operations, components, elements and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements and / or combinations thereof.

[0047] In order to enable those skilled in the art to use the contents of the present invention, the following exemplary embodiments may be provided in combination with specific application scenarios, specific systems, parameters of devices and components, and specific connection methods. However, for those skilled in the art, these embodiments are only examples, and the general principles defined herein may be applied to other embodiments and application scenarios without departing from the spirit and scope of the present invention.

[0048] According to an exemplary embodiment of the present invention: Figure 1-Figure 15As shown, a low temperature vibration reduction system for an ion trap, which can also be called a cold head mounted low temperature vibration reduction system for an ion trap, comprises: an optical platform 10 , a refrigerator 20 and a vacuum chamber, wherein the vacuum chamber comprises a low temperature chamber 30 and a coupling chamber 40 .

[0049] like Figure 1-Figure 3 and Fig.12 As shown, the optical platform 10 is connected to the ground through the first support structure 12, and a first vibration reduction structure 11 is further provided between the optical platform 10 and the first support structure 12. The refrigerator 20 is placed on the support plate 14, and the support plate 14 is connected to the ground through the second support structure 16, and a second vibration reduction structure 15 is further provided between the support plate 14 and the second support structure 16. The first vibration reduction structure 11 and the second vibration reduction structure 15 can be rubber rings.

[0050] According to an exemplary embodiment of the present invention: Figure 1-Figure 3 , Figure 5 and Figure 6 As shown, the optical platform 10 is formed with an installation opening 13, the refrigerator 20 is located below the optical platform 10, and the low-temperature chamber 30 is fixed above the optical platform 10. The low-temperature chamber 30 includes an upper cavity 31 and a lower cavity 32, and the upper cavity 31 and the lower cavity 32 are connected together through a fourth flange 37 and a fifth flange 38. Schematically, the upper cavity 31 is an octahedral structure, and each side is provided with a window 33. The optical instrument is placed on the optical platform 10, and the laser instrument can control the ion trap chip 73 through the window 33. The top surface of the upper cavity 31 is also provided with an objective lens window, which is used to observe the state of the ion trap chip 73, and a CCD camera can be used to observe the state therein. The lower cavity 32 is also a polyhedral structure, and its side includes connectors such as a cable connector 35 and a vacuum tube 34. The cable connector 35 is used to introduce cable lines and control lines, and the vacuum tube 34 is used to maintain the vacuum degree of the vacuum chamber.

[0051] According to an exemplary embodiment of the present invention: Figure 1-Figure 3 , Figure 5 and Figure 6 As shown, the coupling cavity 40 is arranged through the installation opening 13, and the coupling cavity 40 includes a vibration-damping bellows 43, one end of the bellows 43 is connected to the low-temperature cavity 30, and the other end is connected to the refrigerator 20; the low-temperature cavity 30 and the coupling cavity 40 are vacuum-sealed and connected through the third flange 36 and the second flange 42. The coupling cavity 40 and the refrigerator 20 are vacuum-sealed and connected through the first flange 41 and the connecting flange 25. The bellows 43 can be formed by corrugations made of hydraulically formed stainless steel. Other types of vibration damping can replace the above-mentioned bellows 43, such as a bellows 43 with welded edges or an elastomeric sleeve with vibration reduction effect.

[0052] According to an exemplary embodiment of the present invention: Figure 2 , Figure 5-Figure 8 and Figure 10-13 As shown, the refrigerator 20 includes a primary cold head 21 and a secondary cold head 22 disposed upward, and the primary cold head 21 and the secondary cold head 22 are located in the low temperature chamber 30. The refrigerator 20 may preferably be a GM refrigerator or a pulse tube refrigerator.

[0053] A primary cold plate 71 and a secondary cold plate 72 are arranged in the low temperature chamber 30; the primary cold plate 71 is connected to the primary cold shield 74, and the secondary cold plate 72 is connected to the secondary cold shield 75. Exemplarily, the primary cold shield 74 can be a 35K cold shield, and the secondary cold shield 75 can be a 4K cold shield. This provides a suitable working temperature for the ion trap chip 73. The primary cold shield 74 and the secondary cold shield 75 are both arranged inside the low temperature chamber 30, and the secondary cold shield 75 is arranged inside the primary cold shield 74. The primary cold shield 74 and the secondary cold shield 75 can be fixed to the low temperature chamber 30 by means of a support rod (not shown) or the like.

[0054] The primary cold head 21 is thermally coupled to the primary cold plate 71 via a first thermal connection structure 50, and the secondary cold head 22 is thermally coupled to the secondary cold plate 72 via a second thermal connection structure 60;

[0055] According to an exemplary embodiment of the present invention: Figure 5-Figure 8 , Figure 10-15 As shown, the first thermal connection structure 50 includes a first heat conducting block, a first mounting block, a second heat conducting block 58 and a first groove 23; the first mounting block is fixed on one side of the first heat conducting block, a first fin is formed on the other side of the first heat conducting block, and a first heat transfer groove 59 matching with the first fin is formed on one side of the second heat conducting block 58; the first mounting block can be placed in the first groove 23, and a first gap is formed between the outer periphery of the first mounting block and the inner periphery of the first groove 23. The first groove 23 is provided on the primary cold head 21 or on the first intermediate heat transfer member (not shown) fixedly connected to the primary cold head 21; the second heat conducting block 58 is thermally connected to the primary cold plate 71.

[0056] like Figure 5-Figure 8 , Figure 10-15 As shown, through the above arrangement, when the first-stage cold head 21 vibrates in the horizontal direction, the presence of the first gap can at least slow down the transmission of the vibration. Optionally, the first gap is provided with a first buffer, which can be a rubber ring or a viscous liquid thermal conductive glue. The distance of the first gap can be selected according to the horizontal vibration amplitude of the cold head of the refrigerator 20, such as 1-3 times the maximum vibration amplitude of the cold head of the refrigerator 20.

[0057] like Figure 6 , Figure 7 , Figure 8 , Fig.13 and Fig.15As shown, preferably, the present invention can also provide vibration reduction in the vertical direction. When the first fin cooperates with the first heat transfer groove 59, the top end of the first fin and the bottom end of the first heat transfer groove 59 have a first preset distance, and the bottom end of the first fin and the top end of the first heat transfer groove 59 have a first preset distance; thereby, the vibration transmission in the vertical direction can be slowed down. The first preset distance can be selected according to the vertical vibration amplitude, such as it can be 1-3 times the maximum vibration amplitude of the cold head of the refrigerator 20. An optional solution is that the width of the first fin is smaller than the width of the first heat transfer groove 59, thereby further preventing the transmission of vibration, but the above setting may lead to an undesirable reduction in the heat transfer effect. Considering vibration and heat transfer comprehensively, it is still an optional solution.

[0058] According to an exemplary embodiment of the present invention: Figure 5-Figure 8 , Figure 10-13 As shown, the surface of one side of the first heat conducting block is in contact with the surface of the first cold head 21 or the first intermediate heat transfer member where the first groove 23 is located. Through the above arrangement, heat transfer can be ensured on the one hand, and relatively stable sliding can be achieved between the two on the other hand.

[0059] According to an exemplary embodiment of the present invention: Figure 5-Figure 8 , Figure 10-13 As shown, the first heat conducting block includes a left heat conducting block 51 and a right heat conducting block 52, the first mounting block includes a left mounting block 53 and a right mounting block 54, the first groove 23 includes a left groove and a right groove, and the first fin includes a left fin 55 and a right fin 56; the left heat conducting block 51 and the right heat conducting block 52 are both annular structures, and there is a left and right gap 57 between them. The above-mentioned arrangement of the first heat conducting block makes the left heat conducting block 51 and the right heat conducting block 52 not affect each other, so that no interference occurs.

[0060] like Figure 5-Figure 8 , Figure 10-15 As shown, illustratively, the second heat conducting block 58 is a cylindrical structure, and the cylindrical structure is arrayed with a first heat transfer groove 59. The left fin 55 is arrayed on the left heat conducting block 51, and the right fin 56 is arrayed on the right heat conducting block 52. The left mounting block 53 and the right mounting block 54 are both cylindrical structures, and the left groove and the right groove are also cylindrical grooves.

[0061] According to an exemplary embodiment of the present invention: Figure 5-Figure 8 , Figure 10-13As shown, the second thermal connection structure 60 includes a third heat conducting block 61, a second mounting block 63, a fourth heat conducting block 64 and a second groove 24; the second mounting block 63 is fixed to one side of the third heat conducting block 61, a second fin 62 is formed on the other side of the third heat conducting block 61, and a second heat transfer groove 65 matching with the second fin 62 is formed on one side of the fourth heat conducting block 64; the second mounting block 63 can be placed in the second groove 24, and a second gap is formed between the outer periphery of the two mounting blocks and the inner periphery of the second groove 24. The distance of the second gap can be selected according to the horizontal vibration amplitude of the cold head of the refrigerator 20, such as 1-3 times the maximum vibration amplitude of the cold head of the refrigerator 20.

[0062] According to an exemplary embodiment of the present invention: Figure 5-Figure 8 , Figure 10-13 As shown, the second groove 24 is provided on the secondary cold head 22 or on the second intermediate heat transfer member (not shown) fixedly connected to the secondary cold head 22; the third heat conducting block 61 is thermally connected to the secondary cold plate 72. The surface of one side of the third heat conducting block 61 is in a fitting state with the surface of the secondary cold head 22 or the second intermediate heat transfer member where the second groove 24 is located. The above-mentioned fitting state can ensure heat transfer on the one hand, and can make the two slide relatively smoothly on the other hand.

[0063] Through the above arrangement, when the secondary cold head 22 vibrates in the horizontal direction, the second gap can at least slow down the transmission of vibration due to the presence of the second gap. Optionally, the first gap is provided with a second buffer, which can be a rubber ring or a viscous liquid thermal conductive glue. The distance of the second gap can be selected according to the horizontal vibration amplitude of the cold head of the refrigerator 20, such as 1-3 times the maximum horizontal vibration amplitude of the cold head of the refrigerator 20.

[0064] like Figure 6 , Figure 7 , Figure 8 , Fig.13 and Fig.15 As shown, preferably, the present invention can also provide vibration reduction in the vertical direction. In the vertical direction, when the second fin 62 cooperates with the second heat transfer groove 65, the top end of the second fin 62 and the bottom end of the second heat transfer groove 65 have a second preset distance; the bottom end of the second fin 62 and the top end of the second heat transfer groove 65 have a first preset distance; thereby, the vibration transmission in the vertical direction can be slowed down. The second preset distance can be selected according to the vertical vibration amplitude of the cold head of the refrigerator 20, such as 1-3 times the maximum vibration amplitude of the cold head of the refrigerator 20. An optional solution is that the width of the second fin 62 is smaller than the width of the second heat transfer groove 65, thereby further preventing the transmission of vibration, but the above setting may lead to an undesirable reduction in the heat transfer effect. Considering vibration and heat transfer comprehensively, it is still an optional solution.

[0065] Through the above arrangement, when the secondary cold head 22 vibrates in the vertical direction, the transmission of the vibration can at least be slowed down due to the existence of the second preset distance.

[0066] like Figure 5-Figure 8 , Figure 10-15 As shown, the fourth heat conducting block 64 is a cylindrical structure, and the cylindrical structure is arrayed with second heat transfer grooves 65. The third heat conducting block 61 is also a cylindrical structure, and the second fins 62 are arrayed thereon, and the second mounting block 63 is also a cylindrical structure.

[0067] The low temperature vibration reduction system of the present invention reduces the vibration of the refrigerator 20 by means of the bellows 43, and supports and reduces the vibration of the refrigerator 20 body and the optical platform 10. In addition, the superposition of the vibration reduction for heat transfer can effectively achieve thermal vibration reduction, so that it meets the requirements of ion trap quantum computing.

[0068] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes may be made to the embodiments and combinations of elements may be made without departing from the principles and spirit of the invention, the scope of the invention being defined by the appended claims and their equivalents.

Claims

1. A cold head mounted low temperature vibration reduction system for an ion trap, characterized in that: include: Optical platform, refrigerator and vacuum chamber, the vacuum chamber includes a low temperature chamber and a coupling chamber; The optical platform is connected to the ground through a first vibration reduction structure, and the refrigerator is connected to the ground through a second vibration reduction structure; The optical platform is formed with a mounting opening, the refrigerator is located below the optical platform, and the low-temperature cavity is fixed above the optical platform; The coupling cavity is arranged through the installation opening, and the coupling cavity includes a vibration-damping bellows, one end of the bellows is connected to the low-temperature cavity, and the other end is connected to the refrigerator; The refrigerator comprises a primary cold head and a secondary cold head arranged upward, and the primary cold head and the secondary cold head are located in the vacuum chamber; A primary cold plate and a secondary cold plate are arranged in the low temperature chamber; The primary cold head is thermally coupled to the primary cold plate via a first thermal connection structure, and the secondary cold head is thermally coupled to the secondary cold plate via a second thermal connection structure; The first thermal connection structure includes a first heat-conducting block, a first mounting block, a second heat-conducting block and a first groove; the first mounting block is fixed on one side of the first heat-conducting block, a first fin is formed on the other side of the first heat-conducting block, and a first heat transfer groove matching the first fin is formed on one side of the second heat-conducting block; the first mounting block is placed in the first groove, and a first gap is formed between the outer periphery of the first mounting block and the inner periphery of the first groove.

2. The low temperature vibration reduction system according to claim 1, characterized in that: The first groove is arranged on the first-stage cold head or on the first intermediate heat transfer member fixedly connected to the first-stage cold head; the second heat conduction block is thermally connected to the first-stage cold plate.

3. The low temperature vibration reduction system according to claim 2, characterized in that: When the first fin cooperates with the first heat transfer groove, a top end of the first fin and a bottom end of the first heat transfer groove have a first preset distance.

4. The low temperature vibration reduction system according to claim 3, characterized in that: The first heat conductive block includes a left heat conductive block and a right heat conductive block, the first mounting block includes a left mounting block and a right mounting block, and the first groove includes a left groove and a right groove; the left heat conductive block and the right heat conductive block are both annular structures with left and right gaps therebetween.

5. The low temperature vibration reduction system according to claim 1, characterized in that: The second thermal connection structure includes a third heat-conducting block, a second mounting block, a fourth heat-conducting block and a second groove; the second mounting block is fixed to one side of the third heat-conducting block, a second fin is formed on the other side of the third heat-conducting block, and a second heat transfer groove matching the second fin is formed on one side of the fourth heat-conducting block; the second mounting block is placed in the second groove, and a second gap is formed between the outer periphery of the second mounting block and the inner periphery of the second groove.

6. The low temperature vibration reduction system according to claim 5, characterized in that: The second groove is arranged on the secondary cold head or on the second intermediate heat transfer member fixedly connected to the secondary cold head; the fourth heat conduction block is thermally connected to the secondary cold plate.

7. The low temperature vibration reduction system according to claim 6, characterized in that: When the second fin is matched with the second heat transfer groove, a second preset distance exists between the top end of the second fin and the bottom end of the second heat transfer groove.

8. The low temperature vibration reduction system according to claim 1, characterized in that: The low temperature chamber also includes: a primary cold screen thermally connected to the primary cold plate, and a secondary cold screen thermally connected to the secondary cold plate; the secondary cold screen is located inside the primary cold screen.

9. The low temperature vibration reduction system according to claim 1, characterized in that: A plurality of laser viewing windows are provided on the side of the cryogenic chamber.

10. The low temperature vibration reduction system according to claim 1, characterized in that: An objective lens observation window is provided on the top surface of the low-temperature chamber.

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