Substrate processing apparatus and substrate processing method

Abstract

The invention discloses a substrate processing apparatus and a substrate processing method. Specifically disclosed is an apparatus for processing a substrate, the apparatus comprising: a body providing a processing space; a supply line for supplying a drying fluid that removes the processing fluid on the substrate supported in the processing space; a discharge line for discharging the atmosphere of the processing space; and a fluid circulation unit connected to the discharge line and the supply line, in which the fluid circulation unit includes: a separator for separating a treatment fluid and a drying fluid from a mixed fluid in which the treatment fluid discharged from the processing space and the drying fluid are mixed; and a liquid reuse line connected to the separator and used for extracting the treatment fluid separated from the separator from the separator.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0142720 filed in the Korean Intellectual Property Office on October 24, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The invention relates to a substrate processing device and a substrate processing method. Background Art

[0004] In order to manufacture semiconductor devices, a desired pattern is formed on a substrate (such as a wafer) through various processes such as photography, etching, ashing, ion implantation, and thin film deposition. Various processing solutions and processing gases are used in each process, and particles and process by-products are generated during the process. Cleaning processes are performed before and after each process to remove these particles and process by-products from the substrate.

[0005] A typical cleaning process includes liquid treatment of the substrate with chemicals and rinse liquids. The substrate is then dried to remove the chemicals and rinse liquids remaining on the substrate. An example of a drying process is a spin drying process, in which the substrate is spun at high speed to remove any residual rinse liquid on the substrate. However, the spin drying method may damage the pattern formed on the substrate.

[0006] Recently, a supercritical drying process has been adopted, in which a residual rinse liquid on a substrate is replaced with an organic solvent having a low surface tension (such as isopropyl alcohol (IPA)), the organic solvent is supplied to the substrate, and then the substrate is supplied with a supercritical drying gas (e.g., carbon dioxide) to remove the residual organic solvent from the substrate. In the supercritical drying process, a drying gas is supplied to a process chamber having an internal seal, and the drying gas is heated and pressurized. Both the temperature and pressure of the drying gas rise above a critical point, and the drying gas undergoes a phase change to reach a supercritical state.

[0007] A supercritical phase change drying gas is supplied to the substrate to remove any residual organic solvent on the substrate. The organic solvent removed from the substrate is suspended in the space within the process chamber and is discharged to the outside of the process chamber when the space within the process chamber is exhausted. Since the organic solvent suspended in the process chamber may re-contaminate the substrate, it is required to reduce the concentration of the organic solvent in the process chamber.

[0008] Typically, in order to reduce the concentration of organic solvents in the process chamber, a drying gas is continuously supplied into the process chamber. However, this method has very high drying gas consumption. Summary of the invention

[0009] The present invention is directed to providing a substrate processing apparatus and a substrate processing method capable of minimizing the amount of a processing solution and a drying fluid consumed and discarded during a process of processing a substrate.

[0010] The present invention is also directed to providing a substrate processing apparatus and a substrate processing method capable of minimizing the amount of unused treating solution and drying fluid supplied to a substrate in a process of processing the substrate.

[0011] The present invention is also directed to providing a substrate processing device and a substrate processing method capable of effectively separating a processing solution and a drying fluid from a mixed fluid of the processing solution and the drying fluid.

[0012] The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood from the following description by those of ordinary skill in the art.

[0013] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a body providing a processing space; a supply line for supplying a drying fluid for removing a processing fluid on a substrate supported in the processing space; an exhaust line for exhausting an atmosphere in the processing space; and a fluid circulation unit connected to the exhaust line and the supply line, wherein the fluid circulation unit comprises: a separator for separating a processing fluid and a drying fluid from a mixed fluid in which the processing fluid and the drying fluid discharged from the processing space are mixed; and a liquid reuse line connected to the separator and for extracting the processing fluid separated from the separator from the separator.

[0014] According to an exemplary embodiment, the apparatus may further include: a liquid processing chamber for supplying the processing fluid to the substrate, wherein the liquid reusing line is connected to the liquid processing chamber.

[0015] According to an exemplary embodiment, the fluid circulation unit may include: a first circulation line connected to the exhaust line and the separator; and a second circulation line connected to the separator and the supply line, and a cross-sectional area of ​​a separation space provided by the separator is larger than a cross-sectional area of ​​the first circulation line.

[0016] According to the exemplary embodiment, the separator may include: a separation case providing a separation space; and a cooling unit disposed in the separation case.

[0017] According to an exemplary embodiment, a cooling air flow or cooling water may flow in the cooling unit.

[0018] According to an exemplary embodiment, an orifice may be installed in the first circulation line to maintain a constant pressure difference between the front end and the rear end.

[0019] According to an exemplary embodiment, the first circulation line may be connected to the discharge line at an upstream of a discharge valve installed on the discharge line.

[0020] According to an exemplary embodiment, a fluid pressurizer for extracting and pressurizing the drying fluid separated from the mixed fluid in the separation space may be installed in the second circulation line.

[0021] According to an exemplary embodiment, a heater may be installed in the supply line to heat the drying fluid supplied to the processing space, and the second circulation line may be connected to the supply line at an upstream of the heater.

[0022] According to an exemplary embodiment, the supply line may include: a first supply line for supplying a drying fluid to a first area of ​​a processing space; and a second supply line for supplying a drying fluid to a second area of ​​the processing space at a position different from the first area of ​​the processing space, and the second circulation line may be branched to be connected to the first supply line and the second supply line, respectively.

[0023] Another exemplary embodiment of the present invention provides a method for processing a substrate, the method comprising: a liquid processing operation, which supplies a processing solution to the substrate and processes the substrate in a liquid processing chamber; and a drying operation, which removes the processing solution remaining on the substrate by supplying a drying fluid to the substrate in a drying chamber, wherein the drying operation comprises discharging a mixed fluid including a drying fluid and a processing solution from a processing space provided by the drying chamber, and separating the drying fluid and the processing solution included in the discharged mixed fluid, and supplying at least a portion of the processing solution separated from the mixed fluid to the liquid processing chamber.

[0024] According to an exemplary embodiment, at least a portion of the drying fluid separated from the mixed fluid may be supplied back into the processing space.

[0025] According to an exemplary embodiment, the drying operation may include: a pressurizing operation, which supplies a drying fluid to a processing space provided by a drying chamber to increase the pressure of the processing space to a set pressure; a flowing operation, which, after the pressurizing operation, causes the drying fluid supplied to the processing space to flow and removes a processing solution supplied to the substrate; and a decompressing operation, which, after the flowing operation, reduces the pressure of the processing space, and during the flowing operation, at least a portion of the drying fluid separated from the mixed fluid is supplied back to the processing space.

[0026] According to an exemplary embodiment, at least a portion of the drying fluid separated from the mixed fluid may be pressurized by a fluid intensifier and supplied back into the processing space.

[0027] According to an exemplary embodiment, the drying operation may include: a pressurizing operation, which supplies a drying fluid to a processing space provided by a drying chamber to increase the pressure of the processing space to a set pressure; a flowing operation, which, after the pressurizing operation, causes the drying fluid supplied to the processing space to flow and removes a processing solution supplied to the substrate; a decompression operation, which, after the flowing operation, reduces the pressure of the processing space, and at least a portion of the drying fluid separated from the mixed fluid may be supplied to a supply line, which supplies the drying fluid to the processing space during the decompression operation.

[0028] According to an exemplary embodiment, the mixed fluid discharged from the processing space is introduced into a fluid circulation unit, which is connected to a discharge line that discharges the processing space and a supply line that supplies the drying fluid to the processing space, and the fluid circulation unit can decompress and cool the mixed fluid to separate the drying fluid and the processing solution.

[0029] According to an exemplary embodiment, the fluid circulation unit decompresses the mixed fluid by allowing the mixed fluid to flow from a circulation line having a first cross-sectional area to a separation space of a separation housing having a second cross-sectional area greater than the first cross-sectional area, and cools the mixed fluid by cooling the separation space.

[0030] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a plurality of liquid processing chambers for liquid processing a substrate by supplying a processing solution to the substrate; and a drying chamber for removing the processing solution supplied to the substrate from any one of the plurality of liquid processing chambers, wherein the drying chamber comprises: a body providing a processing space; a supply line for supplying a drying fluid for removing the processing solution on the substrate supported in the processing space; an exhaust line for exhausting the atmosphere of the processing space; and a fluid circulation unit connected to the processing space. The discharge line and the supply line are connected, and the fluid circulation unit includes: a separator for separating a treatment solution and a drying fluid from a mixed fluid in which the treatment solution and the drying fluid discharged from the processing space are mixed, the separator includes: a separation shell, the separation shell provides a separation space; and a cooling unit, the cooling unit is arranged on the outside of the separation shell; and a liquid reuse line, the liquid reuse line is connected to the separator and is used to extract the separated treatment solution from the separator and supply the extracted treatment solution to any one of a plurality of liquid processing chambers, and the liquid reuse line is connected to the lower part of the separation shell.

[0031] According to an exemplary embodiment, the fluid circulation unit may further include: a first circulation line connected to the exhaust line and the separator; a second circulation line connected to the separator and the supply line, and connected to the upper part of the separation shell; an orifice installed in the first circulation line and maintaining a constant pressure difference between the front end and the rear end; a fluid booster installed in the second circulation line and used to extract a dry fluid separated from the mixed fluid in the separation space and pressurize the dry fluid; and a filter installed downstream of the fluid booster in the second circulation line.

[0032] According to an exemplary embodiment, a heater is installed in the supply line to heat the drying fluid supplied to the processing space, and the second circulation line may be connected to the supply line at an upstream of the heater.

[0033] According to the exemplary embodiments of the present invention, the amount of processing solution and drying fluid consumed and discarded during a process of processing a substrate may be minimized.

[0034] Furthermore, according to the exemplary embodiments of the present invention, the amount of unused treating solution and drying fluid supplied to a substrate during a process of processing the substrate may be minimized.

[0035] Further, according to the exemplary embodiment of the present invention, the treating solution and the drying fluid may be effectively separated from the mixed fluid of the treating solution and the drying fluid.

[0036] The effects of the present invention are not limited to the above-mentioned effects, and unmentioned effects will be clearly understood from the specification and the accompanying drawings by those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a top plan view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0038] Figure 2 is a schematic diagram showing a Figure 1 Schematic diagram of the liquid processing chamber.

[0039] Figure 3 is a schematic diagram showing a Figure 1 Schematic diagram of the drying chamber.

[0040] Figure 4 It is shown Figure 3 Schematic diagram of the structure of the separator.

[0041] Figure 5 is a flowchart illustrating a substrate processing method according to an exemplary embodiment of the present invention.

[0042] Figure 6 It is shown in Figure 5 A diagram showing examples of process space pressure changes during pressurization operation, flow operation, and depressurization operation.

[0043] Figure 7 It shows execution Figure 6 Figure Schematic diagram of a pressurized operating drying chamber.

[0044] Figure 8 It shows execution Figure 6 Figure Schematic diagram of a flow-operated drying chamber.

[0045] Fig. 9 To show execution Figure 6 Figure Schematic diagram of the reduced pressure operated drying chamber.

[0046] Fig.10 It is shown in Figure 5 Graphs of different examples of process space pressure changes during pressurization operation, flow operation, and depressurization operation.

[0047] Fig.11 and Fig.12 Yes Execution Fig.10 Figure Schematic diagram of a flow-operated drying chamber.

[0048] Fig.13 is a schematic diagram illustrating a separator according to another exemplary embodiment of the present invention.

[0049] Fig.14 is a schematic diagram illustrating a drying chamber according to another exemplary embodiment of the present invention.

[0050] Fig.15 is a schematic diagram illustrating a drying chamber according to another exemplary embodiment of the present invention.

[0051] The various features and advantages of the non-limiting exemplary embodiments of the present specification will become more apparent after detailed description in conjunction with the accompanying drawings. The drawings are for reference only and should not be interpreted as limiting the scope of the claims. Unless explicitly stated, the drawings should not be considered to be drawn to scale. For the sake of clarity, the various dimensions in the drawings may be exaggerated. DETAILED DESCRIPTION

[0052] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that the disclosure is thorough and the scope is fully conveyed to those skilled in the art. Many specific details (such as examples of specific components, devices and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be adopted, and example embodiments can be embodied in many different forms, and specific details should not be construed as limiting the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures and well-known technologies are not described in detail.

[0053] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a, an" and "the" may be intended to include plural forms. The terms "comprises, comprising", "including" and "having" are inclusive, and therefore specifically refer to the presence of the feature, integer, step, operation, element and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an order of execution, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be adopted.

[0054] When an element or layer is referred to as being "on another element or layer," "engaged to another element or layer," "connected to another element or layer," or "coupled to another element or layer," the element or layer may be directly on, directly engaged to, connected to, or coupled to another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on another element or layer," "directly engaged to," "directly connected to," or "directly coupled to," there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted similarly (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0055] Although the terms "first", "second", "third", etc. can be used to describe different elements, components, regions, layers and / or sections in this article, unless otherwise specified, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer and / or section. When used in this article, unless the context clearly indicates, terms such as "first", "second" and other numerical items do not imply order or sequence. Therefore, without departing from the teaching of the example embodiment, the first element, the first component, the first area, the first layer or the first section discussed below can be referred to as the second element, the second component, the second area, the second layer or the second section.

[0056] For ease of description, spatially relative terms (e.g., "inside," "outside," "below," "below," "below," "above," and "above," etc.) may be used herein to describe the relationship of one element or feature shown in the drawings to another (or other) element or feature. Spatially relative terms may be intended to cover different orientations of the device in use or operation in addition to the orientations described in the drawings. For example, if the device in the figure is turned over, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" may cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0057] When the terms "same" or "same" are used in the description of the exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0058] When the term "about" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in conjunction with geometric shapes, it should be understood that the exactness of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments belong. It should be further understood that terms, including those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0060] Figure 1 is a top plan view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0061] Reference Figure 1 , the substrate processing device includes an index module 10, a processing module 20 and a controller 30. When viewed from above, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction X, and when viewed from above, a direction perpendicular to the first direction X is referred to as a second direction Y, and a direction perpendicular to both the first direction X and the second direction Y is referred to as a third direction Z.

[0062] The index module 10 transfers the substrate W from the container C containing the substrate W therein to the process module 20, and contains the substrate processed in the process module 20 into the container C. The longitudinal direction of the index module 10 is arranged along the second direction Y. The index module 10 includes a loading port 12 and an index frame 14. The loading port 12 is located at an opposite side of the process module 20 based on the index frame 14. The container C containing the substrate W therein is placed in the loading port 12. A plurality of loading ports 12 may be provided, and the plurality of loading ports 12 may be placed along the second direction Y.

[0063] A sealed container such as a Front Open Unified Pod (FOUP) may be used as the container C. The container C may be placed on the load port 12 by a transfer device (not shown) such as an overhead conveyor, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0064] The index robot 120 is provided to the index frame 14. A guide rail 124 whose longitudinal direction is provided in the second direction Y is provided in the index frame 14, and the index robot 120 may be provided to be movable on the guide rail 124. The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable in the forward and backward directions, rotatable around the third direction Z, and movable along the third direction Z. A plurality of hands 122 may be provided at intervals in the vertical direction, and the hands 122 may be moved forward and backward independently of each other.

[0065] The controller 30 can control the substrate processing device. The controller 30 may include: a process controller, which is composed of a microprocessor (computer) that performs control of the substrate processing device; a user interface, which is composed of a keyboard in which the operator performs command input operations, etc. to manage the substrate processing device; a display, which is used to visualize and display the operating status of the substrate processing device, etc.; and a storage unit, which stores a control program for executing a process performed in the substrate processing device under the control of the process controller, or stores a program for executing a process in each component according to various data and processing conditions (i.e., a processing scheme). Further, the user interface and the storage unit may be connected to the process controller. The processing scheme may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk (such as a CD-ROM or a DVD), or a semiconductor memory (such as a flash memory).

[0066] The controller 30 may control the substrate processing apparatus to perform a substrate processing method described below.

[0067] The process module 20 includes a buffer unit 200, a transfer chamber 300, a liquid treatment chamber 400, and a drying chamber 500. The buffer unit 200 provides a space in which the substrate W loaded into the process module 20 and the substrate W unloaded from the process module 20 temporarily stay. The liquid treatment chamber 400 performs a liquid treatment process of treating the substrate W with liquid by supplying liquid onto the substrate W. The drying chamber 500 performs a drying process of removing liquid remaining on the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200, the liquid treatment chamber 400, and the drying chamber 500.

[0068] The longitudinal direction of the transfer chamber 300 may be disposed in the first direction X. The buffer unit 200 may be disposed between the index module 10 and the transfer chamber 300. The liquid processing chamber 400 and the drying chamber 500 may be disposed on a side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be disposed along the second direction Y. The drying chamber 500 and the transfer chamber 300 may be disposed along the second direction Y. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0069] According to an example, the liquid processing chamber 400 is disposed on both sides of the transfer chamber 300, and the drying chamber 500 is disposed on both sides of the transfer chamber 300, and the liquid processing chamber 400 may be disposed closer to the buffer unit 200 than the drying chamber 500. At one side of the transfer chamber 300, the liquid processing chamber 400 may be disposed in an arrangement of A×B (each of A and B is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. Further, at one side of the transfer chamber 300, the drying chamber 500 may be disposed in the number of C×D (each of C and D is a natural number of 1 or greater than 1) in the first direction X and the third direction Z. Different from the above, only the liquid processing chamber 400 may be disposed on one side of the transfer chamber 300, and only the drying chamber 500 may be disposed on the other side of the transfer chamber 300.

[0070] The transfer chamber 300 includes a transfer robot 320. A guide rail 324 whose longitudinal direction is provided in the first direction X may be provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 324. The transfer robot 320 includes a hand 322 on which the substrate W is placed, and the hand 322 may be provided to be movable in the forward and backward directions, rotatable around the third direction Z, and movable along the third direction Z. A plurality of hands 322 may be provided to be spaced apart in the vertical direction, and the plurality of hands 322 may be moved forward and backward independently of each other.

[0071] The buffer unit 200 includes a plurality of buffer zones 220 on which the substrate W is placed. The buffer zones 220 may be arranged to be spaced apart from each other along the third direction Z. The front and rear of the buffer unit 200 are open. The front is a surface facing the index module 10, and the rear is a surface facing the transfer chamber 300. The index robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

[0072] Figure 2 is a schematic diagram showing a Figure 1 Schematic diagram of the liquid processing chamber. Figure 2The liquid processing chamber 400 includes a housing 410 , a cup 420 , a supporting unit 440 , a liquid supply unit 460 , and a lifting unit 480 .

[0073] The housing 410 may have an inner space for processing the substrate W. The housing 410 may have a substantially parallelepiped shape. For example, the housing 410 may have a cubic shape. In addition, the housing 410 may have an opening (not shown) through which the substrate W is loaded or unloaded. In addition, the housing 410 may be equipped with a door (not shown) that selectively opens and closes the opening.

[0074] The cup 420 may have a barrel shape with an open top. The cup 420 has a processing space, and the substrate W may be liquid-processed in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid supply unit 460 supplies liquid to the substrate W supported on the support unit 440. Various types of processing solutions may be provided, and the various types of processing solutions may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0075] According to an example, the cup 420 includes a plurality of collection containers 422, 424, and 426. Each of the collection containers 422, 424, and 426 has a collection space for collecting liquid for processing a substrate. Each of the collection containers 422, 424, and 426 is disposed in an annular shape around the support unit 440. When a liquid treatment process is performed, a treatment solution sputtered by the rotation of the substrate W enters the collection space through inlets 422a, 424a, and 426a of the collection containers 422, 424, and 426, respectively. According to an example, the cup 420 includes a first collection container 422, a second collection container 424, and a third collection container 426. The first collection container 422 is disposed around the support unit 440, the second collection container 424 is disposed around the first collection container 422, and the third collection container 426 is disposed around the second collection container 424. The second inlet 424a introducing liquid into the second collection container 424 may be located above the first inlet 422a introducing liquid into the first collection container 422, and the third inlet 426a introducing liquid into the third collection container 426 may be located above the second inlet 424a.

[0076] The support unit 440 includes a support plate 442 and a drive shaft 444. The top surface of the support plate 442 may be set to a substantially circular shape and may have a diameter larger than the diameter of the substrate W. In the central portion of the support plate 442, a support pin 442a is provided to support the rear surface of the substrate W, and the support pin 442a is provided with an upper end protruding from the support plate 442 so that the substrate W is spaced a certain distance from the support plate 442. A chuck pin 442b is provided to the edge of the support plate 442. The chuck pin 442b is provided to protrude upward from the support plate 442 and support the lateral portion of the substrate W so that when the substrate W rotates, the substrate W will not be separated from the support unit 440. The drive shaft 444 driven by the driver 446 is connected to the center of the bottom surface of the substrate W and rotates the support plate 442 relative to the central axis of the support plate.

[0077] In one example, the liquid supply unit 460 may include a nozzle 462. The nozzle 462 may deliver a treatment fluid to the substrate W. The treatment fluid may be a treatment solution. The treatment solution may be a chemical substance, a rinse liquid, or an organic solvent. The chemical substance may be a chemical substance having a strong acid or strong base property. In addition, the rinse liquid may be pure. In addition, the organic solvent may be isopropyl alcohol (IPA). In addition, the liquid supply unit 460 may include a plurality of nozzles 462, each of which may supply a different type of treatment liquid. For example, one of the nozzles 462 may supply a chemical substance, another of the nozzles 462 may supply a rinse liquid, and another of the nozzles 462 may supply an organic solvent. Further, the controller 30 may control the liquid supply unit 460 to supply an organic solvent to the substrate W from another of the nozzles 462 after supplying a rinse liquid from the other one of the nozzles 462. Therefore, the rinse liquid supplied to the substrate W may be replaced with an organic solvent having a low surface tension.

[0078] The lifting unit 480 moves the cup 420 in the vertical direction. The relative height between the cup 420 and the substrate W is changed by the vertical movement of the cup 420. Accordingly, since the collection containers 422, 424, and 426 for collecting the processing solution are changed according to the type of liquid supplied to the substrate W, the liquid can be separated and collected. Different from the description, the cup 420 may be fixedly installed, and the lifting unit 480 may move the support unit 440 in the vertical direction.

[0079] Figure 3 is a schematic diagram showing a Figure 1 Schematic diagram of the drying chamber. Figure 3, a drying chamber 500 according to an exemplary embodiment of the present invention may include a body 510 , a support member 520 , a fluid supply unit 530 , a fluid discharge unit 540 , a fluid circulation unit 550 , and a driver 560 .

[0080] The body 510 may provide a processing space 513 for processing a substrate W. The body 510 may include a first body 511 and a second body 512. The first body 511 and the second body 512 may be manufactured in a shape that may be combined with each other to define the processing space 513. The first body 511 may be an upper body, and the second body 512 may be a lower body. Either the first body 511 or the second body 512 may be moved to open the processing space 513 or to close the processing space 513.

[0081] For example, the first body 511 may be fixed, and the second body 512 may be moved in the up and down directions by a driver 560 that moves by receiving power from a cylinder or a motor. The second body 512 may move in a direction close to the first body 511 to close the processing space 513. Alternatively, the second body 512 may move in a direction away from the first body 511 to open the processing space 513.

[0082] Further, the first body 511 may be provided with a first supply port 514. The first supply port 514 may be a port formed by machining the first body 511. Alternatively, the first supply port 514 may be a port separately manufactured in a tubular shape and installed in a hole formed in the first body 511. The first supply port 514 may supply a drying fluid SCF (supercritical fluid) to a central area of ​​a top surface of a substrate W placed on a support member 520 to be described later.

[0083] In addition, the second body 512 may be provided with a second supply port 515 and a discharge port 516. The second supply port 515 and the second discharge port 516 may be ports formed by machining the second body 512. Alternatively, the second supply port 515 and the discharge port 516 may be ports separately manufactured into a tubular shape and installed in a hole formed in the second body 512. The second supply port 515 may supply the drying fluid SCF to the lower area of ​​the processing space 513. The discharge port 516 may discharge the drying fluid SCF supplied to the processing space 513 and the processing fluid IPA removed from the substrate W.

[0084] The heater 517 may be provided in the body 510. The heater 517 may be provided in the body 510 to increase the temperature of the processing space 513. The heater 517 may increase the temperature of the processing space 513 to a temperature at which the drying fluid SCF may maintain supercriticality. The heater 517 may be installed in both the first body 511 and the second body 512, or in either one of the first body 511 and the second body 512. Figure 3 An example is shown in which the heater 517 is buried in the second body 512. The heater 517 may be modified in various ways to any known heater capable of increasing the temperature of the processing space 513, such as a resistance coil.

[0085] The support member 520 may support the substrate W in the processing space 513. The support member 520 may be mounted on the bottom surface of the first body 511, and may be configured to support an edge region of the substrate W. For example, one end of the support member 520 may be mounted on the bottom surface of the first body 511, and the support member 520 may include a fixing portion extending in the up-down direction, and a supporting portion extending horizontally from the fixing portion. The fixing portion and the supporting portion may be provided as one body, or the fixing portion and the supporting portion may be provided as separate bodies and coupled together.

[0086] Although the above example shows that the support member 520 is installed on the bottom surface of the first body 511 , the support member 520 may be provided in the form of being installed on the second body 512 instead of the support member 520 .

[0087] The fluid supply unit 530 may supply the dry fluid SCF to the processing space 513. The dry fluid SCF supplied to the processing space 513 by the fluid supply unit 530 may be carbon dioxide gas. The dry fluid SCF supplied to the processing space 513 by the fluid supply unit 530 may be supplied to the processing space 513 in a supercritical state, or may be supplied to the processing space 513 and transformed from a gaseous state to a supercritical state.

[0088] The fluid supply unit 530 may include a fluid supply source 531 , a main supply line 532 , a first supply line 533 , a second supply line 534 , a first supply valve 535 , a second supply valve 536 , and a line heater 537 .

[0089] The fluid supply source 531 can store and supply the dry fluid SCF. The fluid supply source 531 can be composed of a tank for storing the dry fluid SCF, a flow control device for extracting the dry fluid SCF from the tank at a supply flow rate set per unit time, and the like.

[0090] The main supply line 532 may be connected to the fluid supply source 531, and may be branched into a first supply line 533 and a second supply line 534. The first supply line 533 may supply the drying fluid SCF to an upper region (an example of a first region) of the processing space 513 via the first supply port 514. The second supply line 534 may supply the drying fluid SCF to a lower region (an example of a second region) of the processing space 513 via the second supply port 515.

[0091] The first supply valve 535 may be an automatic valve (open / close valve), which may be installed in the first supply line 533, and may select whether to supply the drying fluid SCF to the first supply port 514 according to the opening or closing of the first supply valve 535. In addition, the first supply line 533 may have a line heater 537 installed in the first supply line 533 to increase the temperature of the drying fluid SCF flowing in the first supply line 533, and the line heater 537 may increase the temperature of the drying fluid SCF to help the drying fluid SCF to be transformed into a supercritical state or to be maintained in a supercritical state. In addition, the line heater 537 may be installed in the first supply pipe 533, but may also be installed downstream of the first supply valve 535.

[0092] The second supply valve 536 may be an automatic valve, which is installed in the second supply line 534 , and may select whether to supply the drying fluid SCF to the second supply port 515 according to opening or closing of the second supply valve 536 .

[0093] In the above example, the first supply valve 535 and the second supply valve 536 are shown as automatic valves, but not limited to, the first supply valve 535 and the second supply valve 536 may be provided as flow regulating valves capable of regulating the supply flow rate of the drying fluid SCF.

[0094] The fluid discharge unit 540 can discharge the atmosphere of the processing space 513. The fluid discharge unit 540 may include a discharge line 541 and a discharge valve 542. The discharge line 541 may be connected to a pressure reduction device such as a pump (not shown). The discharge valve 542 may be an automatic valve (open / close valve). The discharge valve 542 is installed in the discharge line 541 and may be installed downstream of a point where the discharge line 541 is connected to a first circulation line 551 described later. According to the opening and closing of the discharge valve 542, the atmosphere in the processing space 513 may be selectively discharged.

[0095] The pressure in the processing space 513 may vary according to the supply flow rate per unit time of the drying fluid SCF supplied by the fluid supply unit 530 and the discharge flow rate per unit time of the fluid discharge unit 540. In addition, the degree to which the liquid phase of the processing fluid IPA removed from the substrate W is dissolved in the drying fluid SCF may affect the pressure in the processing space 513. For example, when the amount of the processing fluid IPA dissolved in the drying fluid SCF increases, the pressure in the processing space 513 may increase to a certain amount.

[0096] Hereinafter, the present invention will be described based on a case where the processing fluid IPA removed from the substrate W via the drying fluid SCF is an organic solvent such as isopropyl alcohol.

[0097] The fluid circulation unit 550 may circulate a mixed fluid in which the drying fluid SCF supplied by the fluid supply unit 530 and the processing fluid IPA removed from the substrate W are mixed. The fluid circulation unit 550 may separate the drying fluid SCF and the processing fluid IPA from the mixed fluid.

[0098] The drying fluid SCF separated from the mixed fluid may be supplied back into the first supply line 533. At least a portion of the treatment fluid IPA separated from the mixed fluid may be supplied back into the liquid treatment chamber 400.

[0099] The fluid circulation unit 550 may include a first circulation line 551 , a second circulation line 552 , a first circulation valve 553 , a second circulation valve 554 , a separator 555 , a fluid booster 556 , a filter 557 , an orifice 558 , and a liquid reuse line 559 .

[0100] The first circulation line 551 may be connected to the fluid discharge unit 540. For example, the first circulation line 551 may be connected to the discharge line 541 and the separator 555 described later. The first circulation line 551 may be connected to the discharge line 541, but may also be connected to the discharge line 541 at the upstream of the discharge valve 542.

[0101] The second circulation line 552 may be connected to the fluid supply line 530. For example, the second circulation line 552 may be connected to the first supply line 533 and the separator 555 described later. The second circulation line 552 may be connected to the first supply line 533, but may also be connected to a point downstream of the first supply valve 535 and upstream of the line heater 537. Therefore, the drying fluid SCF supplied back into the first supply line 533 via the second circulation line 552 may be reheated via the line heater 537 and supplied to the processing space 513.

[0102] The first circulation valve 553 may be an automatic valve (open / close valve) and may be installed in the first circulation line 551. The second circulation valve 554 may be an automatic valve (open / close valve) and may be installed in the second circulation line 552. Alternatively, the first circulation valve 553 and the second circulation valve 554 may be provided as flow regulating valves.

[0103] Figure 4 It is shown Figure 3 Schematic diagram of the structure of the separator.

[0104] Reference Figure 3 and Figure 4 , the separator 555 may be configured to separate the drying fluid SCF and the processing fluid IPA from the mixed fluid circulated by the fluid circulation unit 550 .

[0105] More specifically, the separator 555 may include a separation housing 555a providing a decompression separation space 555b on the inside, and a cooling unit 555c provided outside the separation housing 555a.

[0106] The cooling airflow may flow in the cooling unit 555c. The cooling airflow flowing in the cooling unit 555c may reduce the temperature of the separation space 555b provided by the separation housing 555a. In addition, the first circulation line 551 described above may be provided with an orifice 558 at the downstream of the first circulation valve 553. When the orifice 558 is provided, the pressure difference generated by the mixed fluid at the front and rear ends of the orifice 558 may remain relatively constant. For example, the pressure of the mixed fluid at the front end of the orifice 558 may be greater than the pressure of the mixed fluid at the rear end of the orifice 558.

[0107] The pressure of the mixed fluid after passing through the rear end of the orifice 558 is relatively low. The mixed fluid with reduced pressure can undergo adiabatic expansion when introduced into the separation space 555b of the separation housing 555a. More specifically, when the mixed fluid enters the separation space 555b with a relatively large cross-sectional area from the flow channel in the first circulation line 551 with a relatively small cross-sectional area and adiabatically expands, the pressure of the mixed fluid can be reduced and the temperature can be reduced.

[0108] At this time, since the drying fluid SCF (which may be carbon dioxide contained in the mixed fluid) becomes less soluble in the treatment fluid IPA (which may be isopropyl alcohol), the drying fluid SCF and the treatment fluid IPA are separated very quickly in the separation space 555b. Further, since the density of the drying fluid SCF is less than that of the treatment fluid IPA, in the separation space 555b, the drying fluid SCF is collected in the upper region of the separation space 555b, and the treatment fluid IPA is collected in the lower region of the separation space 555b.

[0109] The drying fluid SCF collected in the upper area of ​​the separation space 555b can be delivered to the first supply line 533 via the second circulation pipeline 552 connected to the upper part of the separation shell 555a, and the processing fluid IPA collected in the lower area of ​​the separation space 555b can be delivered to the above-mentioned liquid processing chamber 400 via the liquid recycling pipeline 559 connected to the lower part of the separation shell 555a.

[0110] Reference Figure 3 , the fluid circulation unit 550 of the present invention may further include a fluid booster 556. The fluid booster 556 may increase the flow rate of the dry fluid SCF when the dry fluid SCF separated in the separation space 555b is extracted from the separation space 555b. The fluid booster 556 may be a gas booster. As previously described, the dry fluid SCF must be delivered to the substrate W in a supercritical state. Further, in order to minimize the generation of particles within the pipeline through which the dry fluid SCF flows, the state of the dry fluid SCF must be maintained in a supercritical state or a state similar to the supercritical state (i.e., a state suitable for performing a treatment process on the substrate W).

[0111] As described above, when the mixed fluid is decompressed / cooled in the separator 555, the dry fluid SCF is also decompressed / cooled. Therefore, the dry fluid SCF may not be able to maintain a supercritical state. Therefore, in the present invention, a fluid booster 556 may be installed in the second circulation line 552 to increase the pressure of the dry fluid SCF that has been reduced in the separator 555 to a pressure suitable for maintaining a supercritical state (e.g., about 150 bar).

[0112] The filter 557 may be installed in the second circulation line 552, but may also be installed downstream of the fluid booster 556. The filter 557 may be configured as a particle filter to filter particles generated during the process of separating the drying fluid SCF and the treatment fluid IPA from the mixed fluid or when the drying fluid SCF flows along the pipeline. The filter 557 may also include a chemical filter capable of removing the treatment fluid IPA material that may be partially contained in the drying fluid SCF.

[0113] The liquid reuse line 559 is connected to the lower part of the separation housing 555a and can extract and recover the treatment fluid IPA separated in the separation space 555b of the separation housing 555a. The treatment fluid IPA extracted from the separator 555 by the liquid reuse line 559 can be supplied back to the liquid processing chamber 400.

[0114] In this case, the liquid reuse line 559 may be directly connected to the liquid processing chamber 400, or may be indirectly connected via a liquid supply tank that supplies the processing liquid to the liquid processing chamber 400. In summary, it should be understood that the supply of the separated processing fluid IPA to the liquid processing chamber 400 through the liquid reuse line 559 includes the direct supply of the processing fluid IPA to the liquid processing chamber 400, or the indirect supply of the processing fluid IPA through another configuration.

[0115] Further, as described above, the substrate processing apparatus may include a plurality of liquid processing chambers 400, and the liquid reuse line 559 may be configured to supply the separated treatment fluid IPA to any one selected from the plurality of liquid processing chambers 400. The liquid processing chamber 400 may also mix the reused treatment fluid IPA introduced through the liquid reuse line 559 and the unused treatment fluid IPA, and supply the mixed fluid to the substrate W. Alternatively, in the liquid processing chamber 400, the reused treatment fluid IPA may be used as an early treatment fluid supplied to the substrate W, and the unused treatment fluid IPA may be used as a late treatment fluid.

[0116] Figure 5 is a flowchart illustrating a substrate processing method according to an exemplary embodiment of the present invention, and Figure 6 It is shown in Figure 5 A diagram showing examples of process space pressure changes during pressurization operation, flow operation, and depressurization operation.

[0117] Reference Figure 5 and Figure 6 , a substrate processing method according to an exemplary embodiment of the present invention may include: after performing a liquid processing operation of supplying a processing fluid IPA to a substrate W in a liquid processing chamber 400 to process the substrate W, performing a drying operation S10 of supplying a drying fluid SCF to the substrate W in a drying chamber 500 and removing the processing fluid IPA remaining on the substrate W.

[0118] The drying operation S10 according to the exemplary embodiment of the present invention may include a pressurizing operation S11 , a flowing operation S12 , and a depressurizing operation S13 .

[0119] exist Figures 7 to 9 as well as Fig.11 and Fig.12 In the diagram, open valves are shown in white and closed valves are shown in black.

[0120] Figure 7 It shows execution Figure 6 Figure Schematic diagram of the reduced pressure operated drying chamber.

[0121] Reference Figures 5 to 7, the pressurizing operation S11 may be an operation of increasing the pressure in the processing space 513 to a set pressure P. In the pressurizing operation S11, the second supply port 515 may supply the dry fluid SCF to increase the pressure in the processing space 513 to the set pressure P, for example, a pressure equal to or greater than a threshold pressure at which the dry fluid SCF phase changes to a supercritical state. The set pressure may be 150 Bar.

[0122] Figure 8 It shows execution Figure 6 Figure Schematic diagram of a flow-operated drying chamber.

[0123] Reference Figure 5 , Figure 6 and Figure 8 , the flow operation S12 may be an operation of flowing the drying fluid SCF supplied to the processing space 513 to remove any residual processing fluid IPA on the substrate W while the pressure in the processing space 513 is maintained at the set pressure P (i.e., matching the supply flow rate per unit time with the exhaust flow rate). In the flow operation S12, the first supply port 514 may supply the drying fluid SCF. In addition, in the flow operation S12, the fluid circulation unit 550 may exhaust the atmosphere of the processing space 513 via the exhaust line 541.

[0124] The dry fluid SCF separated from the mixed fluid via the fluid circulation unit 550 may be resupplied to the first supply line 533. That is, at least a portion of the dry fluid SCF supplied to the processing space 513 may be the reused dry fluid SCF, and another portion may be the unused dry fluid SCF supplied from the fluid supply source 531. Therefore, the consumption of the dry fluid SCF may be minimized.

[0125] Furthermore, the reused dry fluid SCF may be pressurized and heated while passing through the fluid booster 556 and the line heater 537 , and supplied to the processing space 513 in a supercritical state or in a state just before being transformed into a supercritical state.

[0126] Fig. 9 To show execution Figure 6 Figure Schematic diagram of the reduced pressure operated drying chamber.

[0127] Reference Figure 5 , Figure 6 and Fig. 9 The decompression operation S13 may include reducing the pressure in the processing space 513. In the decompression operation S13, the pressure in the processing space 513 may be reduced from the set pressure P to a normal pressure without circulating the mixed fluid in the fluid circulation unit 550.

[0128] like Fig. 9As shown, in the decompression operation S13, some of the processing fluid IPA can be discarded via the exhaust pipeline 514 instead of being reused, but since most of the processing fluid IPA is removed from the substrate W in the flow operation S12 and separated via the separator 555, the amount of processing solution IPA discarded in the decompression operation S13 can be very small.

[0129] Fig.10 It is shown in Figure 5 Graphs of different examples of process space pressure changes during pressurization operation, flow operation and depressurization operation, Fig.11 and Fig.12 Yes Execution Fig.10 A schematic diagram of a flow-operated drying chamber, and Fig.13 is a schematic diagram illustrating a separator according to another exemplary embodiment of the present invention.

[0130] In the above example, the present invention has been described based on the case where the pressure of the processing space 513 is maintained at the set pressure P as an example, but the present invention is not limited thereto. Fig.10 As shown, in the flow operation S12, the pressure in the processing space 513 may pulsate between a first set pressure P1 and a second set pressure P2 lower than the first set pressure. Both the first set pressure P1 and the second set pressure P2 may be pressures higher than the threshold pressure.

[0131] When the pressure of the processing space 513 is reduced from the first set pressure P1 to the second set pressure P2, the first circulation valve 553 may be opened, and the first and second supply valves 535 and 536 , the second circulation valve 554 , and the exhaust valve 542 may be closed.

[0132] When the pressure of the processing space 513 is pressurized from the second set pressure P2 to the first set pressure P1, the second circulation valve 554 and the first supply valve 535 may be opened, and the second supply valve 536, the first circulation valve 553, and the exhaust valve 542 may be closed.

[0133] In the example, the present invention has been described based on the case where the separator 555 is an air-cooled separator having a cooling unit 555c through which cooling air flows as an example, but the present invention is not limited thereto. Fig.13 As shown, a separator 575 according to another exemplary embodiment includes a cooling unit 575c disposed in a separation housing 575a providing a separation space 575b, and the cooling unit 575c can be provided in the form of a cooling flow path. That is, cooling water can flow through the cooling unit 575c. In this case, the separator 575 can be a water-cooled separator.

[0134] In the above example, the present invention has been described based on the case where the second circulation line 552 is connected only to the first supply line 533 as an example, but the present invention is not limited thereto. For example, the other end of the second circulation line 552 may be branched into a second-first circulation line 552a and a second-second circulation line 552b. The branched second-first circulation line 552a and the second-second circulation line 552b may be connected to the first supply line 533 and the second supply line 534, respectively. Further, the second circulation line 554 may be equipped with a second-first circulation valve 554a, and the second-second circulation line 552b may be equipped with a second-second circulation valve 554b.

[0135] exist Fig.14 In the present invention, the present invention has been described based on the case where the second-first circulation valve 554a is installed upstream of the branch point as an example, but the present invention is not limited thereto, and the second-first circulation valve 554a may also be installed in the second-first circulation pipeline 552a.

[0136] In the above example, the present invention has been described based on the case where all the mixed fluid is discharged from the processing space 513 through the discharge line 541 in the decompression operation S13 as an example, but the present invention is not limited thereto.

[0137] For example, Fig.15 As shown, the first supply line 533 may further include a third supply valve 538 installed downstream of the first supply valve 535 and the line heater 537. A portion of the mixed fluid discharged from the processing space 513 in the decompression operation S13 may be discharged to the outside of the drying chamber 500 through the discharge line 541, and another portion may be supplied to the drying chamber 500 with the drying fluid SCF via the fluid circulation unit 550. Fig.15 The drying fluid remaining in the region A may maintain the state of the first supply line 533 in a state similar to a processing state until the next substrate W is loaded.

[0138] In the above example, the present invention has been described based on the case where the line heater 537 is provided in the first supply line 533 as an example, but the present invention is not limited thereto. For example, the line heater 537 may also be installed in the second supply line 534.

[0139] In the above example, the present invention has been described based on the situation that the first body 511 is an upper body positioned at the top and the second body 512 is a lower body positioned at the bottom, but the present invention is not limited thereto. For example, the first body 511 and the second body 512 may be arranged in the left-right direction rather than the up-down direction. The second body 512 may be arranged to be fixed, and the first body 511 may be moved laterally. The first body 511 may be provided with a supporting member for supporting the substrate W in the horizontal direction, so that the substrate W may be loaded into and unloaded from the processing space 513 in a drawer-like manner.

[0140] It should be understood that what is disclosed herein is an exemplary embodiment, and other variations are possible. The individual elements or features of a particular exemplary embodiment are generally not limited to that particular exemplary embodiment, but are interchangeable, and even if not specifically illustrated or described, may be used for a selected exemplary embodiment where applicable. These modifications should not be considered as departing from the spirit and scope of the present invention, and all modifications obvious to a person of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. A device for processing a substrate, the device comprising: A body, wherein the body provides a processing space; a supply line for supplying a drying fluid that removes a processing fluid on a substrate supported in the processing space; an exhaust pipeline, the exhaust pipeline being used to exhaust the atmosphere of the processing space; as well as a fluid circulation unit connected to the discharge line and the supply line, Wherein, the fluid circulation unit comprises: a separator for separating the processing fluid and the drying fluid from a mixed fluid in which the processing fluid and the drying fluid discharged from the processing space are mixed; and A liquid reuse line is connected to the separator and is used to extract the treatment fluid separated from the separator from the separator.

2. The device according to claim 1, further comprising: a liquid processing chamber for supplying the processing fluid to the substrate, Wherein, the liquid recycling pipeline is connected to the liquid processing chamber.

3. The device according to claim 1, wherein: The fluid circulation unit comprises: a first circulation line connected to the discharge line and the separator; and a second circulation line connected to the separator and the supply line, and The cross-sectional area of ​​the separation space provided by the separator is larger than the cross-sectional area of ​​the first circulation line.

4. The device according to claim 3, wherein: The separator comprises: a separation housing, the separation housing providing the separation space; and A cooling unit is disposed in the separation shell.

5. The device according to claim 4, wherein: A cooling air flow or cooling water flows in the cooling unit.

6. The device according to claim 3, wherein: An orifice is installed in the first circulation line to maintain a constant pressure difference between the front end and the rear end.

7. The device according to claim 3, wherein: The first circulation line is connected to the discharge line at an upstream of a discharge valve installed on the discharge line.

8. The device according to claim 3, wherein: A fluid pressurizer is installed in the second circulation line, and the fluid pressurizer is used to extract the drying fluid separated from the mixed fluid in the separation space and pressurize the drying fluid.

9. The device according to claim 3, wherein: installing a heater in the supply line to heat the drying fluid supplied to the processing space, and The second circulation line is connected to the supply line upstream of the heater.

10. The device according to claim 3, wherein: The supply line comprises: a first supply line for supplying the drying fluid to a first region of the processing space; and a second supply line for supplying the drying fluid to a second region of the processing space at a location different from the first region of the processing space, and The second circulation line is branched to be connected to the first supply line and the second supply line, respectively.

11. A method for processing a substrate, the method comprising: a liquid processing operation that supplies a processing solution to a substrate and processes the substrate in a liquid processing chamber; as well as a drying operation of removing the processing solution remaining on the substrate by supplying a drying fluid onto the substrate in a drying chamber, The drying operation includes: discharging a mixed fluid including the drying fluid and the processing solution from a processing space provided by the drying chamber; and separating the drying fluid and the processing solution included in the discharged mixed fluid, and At least a portion of the processing solution separated from the mixed fluid is supplied to the liquid processing chamber.

12. The method according to claim 11, wherein: At least a portion of the drying fluid separated from the mixed fluid is supplied back into the processing space.

13. The method according to claim 12, wherein: The drying operation comprises: a pressurizing operation of supplying the drying fluid to the processing space provided by the drying chamber to increase the pressure of the processing space to a set pressure; a flowing operation of flowing the drying fluid supplied to the processing space and removing the processing solution supplied to the substrate after the pressurizing operation; a decompression operation, the decompression operation reducing the pressure of the processing space after the flowing operation, and During the flowing operation, at least a portion of the drying fluid separated from the mixed fluid is supplied back into the processing space.

14. The method according to claim 12, wherein: At least a portion of the drying fluid separated from the mixed fluid is pressurized by a fluid intensifier and supplied back into the processing space.

15. The method according to claim 11, wherein: The drying operation comprises: a pressurizing operation of supplying the drying fluid to the processing space provided by the drying chamber to increase the pressure of the processing space to a set pressure; a flowing operation of flowing the drying fluid supplied to the processing space and removing the processing solution supplied to the substrate after the pressurizing operation; a decompression operation, the decompression operation reducing the pressure of the processing space after the flowing operation, and In the decompression operation, at least a portion of the drying fluid separated from the mixed fluid is supplied to a supply line that supplies the drying fluid to the processing space.

16. The method according to claim 11, wherein: introducing the mixed fluid exhausted from the processing space into a fluid circulation unit connected to an exhaust line exhausted from the processing space and a supply line supplying the drying fluid to the processing space, and The fluid circulation unit decompresses and cools the mixed fluid to separate the drying fluid and the processing solution.

17. The method according to claim 16, wherein: The fluid circulation unit decompresses the mixed fluid by flowing the mixed fluid from a circulation line having a first cross-sectional area to a separation space of a separation housing having a second cross-sectional area greater than the first cross-sectional area, and cools the mixed fluid by cooling the separation space.

18. An apparatus for processing a substrate, the apparatus comprising: a plurality of liquid processing chambers for performing liquid processing on a substrate by supplying a processing solution to the substrate; a drying chamber for removing a processing solution supplied to the substrate from any one of the plurality of liquid processing chambers, Wherein, the drying chamber comprises: A body, wherein the body provides a processing space; a supply line for supplying a drying fluid that removes the processing solution on the substrate supported in the processing space; an exhaust pipeline, the exhaust pipeline being used to exhaust the atmosphere of the processing space; a fluid circulation unit connected to the discharge line and the supply line, and The fluid circulation unit comprises: a separator for separating the processing solution and the drying fluid from the mixed fluid in which the processing solution and the drying fluid discharged from the processing space are mixed, the separator comprising: a separation shell providing a separation space; and a cooling unit provided on the exterior of the separation shell; and A liquid reuse line is connected to the separator and is used to extract the separated processing solution from the separator and supply the extracted processing solution to any one of the plurality of liquid processing chambers, and is connected to a lower portion of the separation housing.

19. The device according to claim 18, wherein: The fluid circulation unit also includes: a first circulation pipeline connected to the discharge pipeline and the separator; a second circulation line connected to the separator and the supply line and connected to an upper portion of the separation shell; an orifice installed in the first circulation line and maintaining a constant pressure difference between the front end and the rear end; a fluid pressurizer installed in the second circulation line and used to extract a dry fluid separated from the mixed fluid in the separation space and pressurize the dry fluid; and A filter is installed downstream of the fluid intensifier in the second circulation line.

20. The device according to claim 19, wherein installing a heater in the supply line to heat the drying fluid supplied to the processing space, and The second circulation line is connected to the supply line upstream of the heater.

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