Chip pin coplanarity detection device and method

Abstract

The invention provides a chip pin coplanarity detection device and method, and the device comprises an objective table which is provided with a through installation through hole, and a transparent bearing sheet is embedded in the installation through hole; the 3D line laser measurement module is arranged below the bearing sheet and is configured to acquire a three-dimensional image of the tested chip and send the three-dimensional image; the controller is in communication connection with the 3D line laser measurement module and is configured to receive and process the three-dimensional image of the tested chip and determine the distance between the tip of each pin of the tested chip and the reference plane; and in response to the fact that the distance corresponding to each pin is smaller than a preset threshold value, determining that the pins of the tested chip are coplanar. According to the chip pin coplanarity detection device and method, physical contact with the detected chip is not needed in the process of carrying out coplanarity detection on the pins of the detected chip, the detected chip does not need to be clamped and fixed either, the safety of the detected chip can be guaranteed, and meanwhile the detection efficiency can be effectively improved.

Description

Technical Field

[0001] The present application relates to the field of chip detection technology, and in particular to a chip pin coplanarity detection device and method. Background Art

[0002] Before the chip enters the circuit board assembly line, the coplanarity of the chip pins needs to be tested to avoid quality problems in the chip installation process caused by chip pin warping. Due to the small size and low mechanical strength of the chip pins, it is difficult to use contact measurement technology for detection. The use of non-contact point and line measurement technology has high requirements for chip tooling accuracy and chip placement accuracy. For small-sized chips or chips that are sensitive to mechanical contact, it may have adverse effects on the chips during the detection process. Summary of the invention

[0003] In view of this, the purpose of the present application is to provide a chip pin coplanarity detection device and method to at least partially solve the problems raised by the background technology.

[0004] Based on the above purpose, the first aspect of the present application provides a chip pin coplanarity detection device, including: a stage, provided with a through mounting through hole, wherein a transparent carrier sheet is embedded in the mounting through hole, and the carrier sheet is used to support the chip under test; the chip under test has a chip body and a plurality of pins connected to the chip body; the end of the pin away from the chip body is the tip of the pin; a 3D line laser measurement module, arranged below the carrier sheet, the 3D line laser measurement module is configured to collect and send a three-dimensional image of the chip under test; a controller, communicatively connected to the 3D line laser measurement module, the controller is configured to receive and process the three-dimensional image of the chip under test, obtain spatial data of each pin of the chip under test, and determine a reference plane according to the spatial data; the controller is also configured to determine the distance between the tip of each pin and the reference plane according to the spatial data and the reference plane; in response to the distance corresponding to each pin being less than a preset threshold, it is determined that the pins of the chip under test are coplanar.

[0005] Optionally, the top of the carrier sheet includes a first surface for supporting the chip under test, and the 3D line laser measurement module includes a line laser emitter, and the optical axis of the line laser emitter is perpendicular to the first surface.

[0006] Optionally, the 3D line laser measurement module includes a 3D laser imaging camera and a scanning drive component capable of driving the 3D laser imaging camera to move back and forth along a first direction, where the first direction is parallel to the first surface.

[0007] Optionally, the scanning drive assembly includes a linear motor module, the linear motor module includes a slider, and the 3D laser imaging camera is fixedly connected to the slider.

[0008] Optionally, the linear motor module also includes a linear guide, a ball screw, a coupling, a servo motor, an encoder and a limit switch; the slider is connected to the nut of the ball screw, the linear guide is arranged on at least one side of the ball screw along the radial direction of the ball screw, and the slider abuts against the linear guide; the screw of the ball screw is transmission-connected to the output shaft of the servo motor through the coupling, the servo motor is electrically connected to the encoder, the limit switch is arranged near the end of the linear guide, and the limit switch is electrically connected to the servo motor.

[0009] Optionally, the chip pin coplanarity detection device also includes a base plate arranged below the stage, a support column is connected between the base plate and the stage, and the linear motor module is installed on the board surface of the base plate close to the stage.

[0010] Optionally, the linear guide is fixedly connected to the base plate, the base plate is fixedly connected to a bracket, and the end of the screw of the ball screw away from the coupling is rotatably connected to the bracket; the scanning drive assembly also includes a motor base fixedly connected to the base plate, and the servo motor is fixedly connected to the motor base.

[0011] Optionally, the moving distance of the 3D laser imaging camera along the first direction is greater than the size of the first surface along the first direction; and the orthographic projection of the first surface on the ball screw in the vertical direction is located in the middle of the ball screw.

[0012] Optionally, the chip pin coplanarity detection device further includes a plurality of shading plates, which are fixedly connected to the support columns; the stage, the base plate and the plurality of shading plates together form a receiving cavity, and the 3D line laser measurement module is disposed in the receiving cavity.

[0013] Based on the same inventive concept, the second aspect of the present application further provides a chip pin coplanarity detection method, using the chip pin coplanarity detection device as described in the first aspect, the method comprising:

[0014] Acquire a three-dimensional image of the chip under test sent by a 3D line laser measurement module;

[0015] Obtaining the three-dimensional coordinates of the tip of each pin through the three-dimensional image of the chip under test;

[0016] Fitting the three-dimensional coordinates of the toes of all the pins of the chip under test into a reference plane;

[0017] The distance from the three-dimensional coordinates of the tip of each pin to the reference plane is determined, and in response to the distance corresponding to each pin being less than a preset threshold, it is determined that the pins of the chip under test are coplanar.

[0018] From the above, it can be seen that the chip pin coplanarity detection device and method provided by the present application can automatically obtain a three-dimensional image of the chip under test through a 3D line laser measurement module after the chip under test is placed on a transparent carrier sheet, and the obtained three-dimensional image of the chip under test is processed by a controller, and the coplanarity of the pins of the chip under test is automatically determined to be qualified. In the process of coplanarity detection of the pins of the chip under test, there is no need to make physical contact with the chip under test, nor is there any need to clamp and fix the chip under test, so damage to the chip under test can be prevented during the detection process, the safety of the chip under test can be guaranteed, and the detection efficiency can also be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present application or related technologies, the drawings required for use in the embodiments or related technical descriptions are briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic diagram of a chip pin coplanarity detection device according to an embodiment of the present application;

[0021] Figure 2 Schematic diagram of the process of detecting chip pin coplanarity according to an embodiment of the present application.

[0022] Description of reference numerals:

[0023] 100, stage; 110, mounting through hole; 120, carrier sheet; 121, first surface;

[0024] 200, support column;

[0025] 300, 3D line laser measurement module; 310, 3D laser imaging camera; 311, line laser transmitter; 312, CMOS sensor; 313, filter; 314, camera housing; 315, input and output connector; 316, data signal connector;

[0026] 400, scanning drive assembly; 410, slider; 420, linear guide; 430, ball screw; 440, coupling; 450, servo motor; 460, encoder; 470, limit switch; 480, motor seat;

[0027] 500, base plate; 510, bracket. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in combination with specific embodiments and with reference to the accompanying drawings.

[0029] It should be noted that the relative arrangement of the components, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

[0030] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0032] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be the usual meanings understood by people with ordinary skills in the field to which the present application belongs. The "first", "second" and similar words used in the embodiments of the present application do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0033] In view of this, if Figure 1The embodiment of the present application provides a chip pin coplanarity detection device, including: a stage 100, provided with a through mounting through hole 110, in which a transparent carrier sheet 120 is embedded, and the carrier sheet 120 is used to support the chip under test; the chip under test has a chip body and a plurality of pins connected to the chip body; the end of the pin away from the chip body is the tip of the pin; a 3D line laser measurement module 300, arranged below the carrier sheet 120, the 3D line laser measurement module 300 is configured to collect and send a three-dimensional image of the chip under test; a controller is connected to the 3D line laser measurement module 300 for communication, the controller is configured to receive and process the three-dimensional image of the chip under test, obtain spatial data of each pin of the chip under test, and determine a reference plane according to the spatial data; the controller is also configured to determine the distance between the tip of each pin and the reference plane according to the spatial data and the reference plane; in response to the distance corresponding to each pin being less than a preset threshold, it is determined that the pins of the chip under test are coplanar.

[0034] Exemplarily, the mounting through hole 110 may be a rectangular hole, and correspondingly, the carrier sheet 120 is a rectangular sheet matching the mounting through hole 110 .

[0035] Exemplarily, the carrier sheet 120 may be a transparent glass sheet.

[0036] When in use, the chip under test is placed on the carrier sheet 120, and the 3D line laser measurement module 300 can obtain a three-dimensional image of the chip under test through the transparent carrier sheet 120, and send the obtained three-dimensional image of the chip under test to the controller. The controller can process the received three-dimensional image of the chip under test and obtain the spatial data of each pin of the chip under test. According to the spatial data of all the pins of the chip under test, a reference plane can be determined, and the distance from the toes of all the pins of the chip under test to the reference plane is the smallest.

[0037] After determining the reference plane, the distance from the tip of each pin to the reference plane is calculated based on the spatial data of each pin and the reference plane. Afterwards, the obtained distance is compared with a pre-stored preset threshold (e.g., 0.1 mm). If all distances are less than the preset threshold, it indicates that all pins of the chip under test are coplanar, and the pin coplanarity of the chip under test is determined to be qualified. If one of the distances is greater than the preset threshold, it means that one of the pins of the chip under test is not coplanar with the other pins, and the pin coplanarity of the chip under test is determined to be unqualified.

[0038] After obtaining the coplanarity judgment result corresponding to the pins of the chip under test (ie, qualified or unqualified), the chip under test can be manually removed from the carrier sheet 120 and replaced with the next chip under test to continue testing.

[0039] The chip pin coplanarity detection device provided in the embodiment of the present application can automatically obtain a three-dimensional image of the chip under test through the 3D line laser measurement module 300 after placing the chip under test on the transparent carrier sheet 120, and process the obtained three-dimensional image of the chip under test through the controller, and automatically determine whether the coplanarity of the pins of the chip under test is qualified. In the process of coplanarity detection of the pins of the chip under test, there is no need to make physical contact with the chip under test, nor is there any need to clamp and fix the chip under test, so damage to the chip under test can be prevented during the detection process, the safety of the chip under test can be guaranteed, and the detection efficiency can also be effectively improved.

[0040] like Figure 1 In some embodiments, the top of the carrier sheet 120 includes a first surface 121 for supporting the chip under test, and the 3D line laser measurement module 300 includes a line laser emitter 311 , and the optical axis of the line laser emitter 311 is perpendicular to the first surface 121 .

[0041] Exemplarily, the carrier sheet 120 may be mounted on the stage 100 by means of fasteners such as screws, and the verticality between the first surface 121 of the carrier sheet 120 and the optical axis of the line laser generator may be fine-tuned by adjusting the tightness of the screws.

[0042] The first surface 121 is at least a portion of the top surface of the carrier sheet 120. In this embodiment, the optical axis of the line laser emitter 311 is designed to be perpendicular to the first surface 121, which can ensure the imaging quality of the 3D line laser measurement module 300, so that the controller can obtain more accurate spatial data of the pins through a higher quality three-dimensional image of the chip under test, so that the coplanarity of the pins of the chip under test can be judged more accurately.

[0043] like Figure 1 In some embodiments, the 3D line laser measurement module 300 includes a 3D laser imaging camera 310 and a 3D laser imaging camera 310 capable of driving the 3D laser imaging camera 310 along a first direction (eg Figure 1 The scanning driving component 400 reciprocates (in the X direction), and the first direction is parallel to the first surface 121.

[0044] Exemplarily, the 3D laser imaging camera 310 includes, in addition to the line laser emitter 311, a CMOS sensor 312 (e.g., a CMOS image sensor), a filter 313, a camera housing 314, an input / output connector 315, and a data signal connector 316. The working principle of the 3D laser imaging camera 310 is based on triangulation. The line laser emitter 311 and the CMOS sensor 312 are arranged in the camera housing 314. The high-brightness laser generated by the line laser emitter 311 can be emitted through the opening of the camera housing 314 and reflected after being irradiated to the chip under test. The reflected light is imaged by the CMOS sensor 312 through the filter 313 and triangulated to obtain a three-dimensional image of the chip under test.

[0045] Exemplarily, the line laser emitter 311 uses a DPL galvanometer, which has the functions of digitally adjusting the dot pitch, scanning frequency, and exposure time.

[0046] Exemplarily, the camera housing 314 is integrally formed of metal material.

[0047] Exemplarily, when there are pins on two opposite sides of the chip under test, when placing the chip under test, the arrangement direction of the pins on one side of the chip under test can be made parallel to the first direction.

[0048] When the 3D laser imaging camera 310 acquires a three-dimensional image of the chip under test, the scanning drive component 400 can drive the 3D laser imaging camera 310 to move from one end of the chip under test to the other end along the first direction, so that the 3D laser imaging camera 310 can complete scanning imaging of the entire chip under test.

[0049] like Figure 1 In some embodiments, the scanning drive assembly 400 includes a linear motor module, the linear motor module includes a slider 410 , and the 3D laser imaging camera 310 is fixedly connected to the slider 410 .

[0050] Exemplarily, the 3D laser imaging camera 310 may be fixedly connected to the slider 410 by fasteners.

[0051] After the 3D laser imaging camera 310 is fixedly connected to the slider 410, the linear motor module can drive the 3D laser imaging camera 310 to move more smoothly, which helps to ensure the imaging quality of the 3D line laser measurement module 300, and then the controller can obtain more accurate spatial data of the pins through a higher-quality three-dimensional image of the chip under test, so that the coplanarity of the pins of the chip under test can be judged more accurately.

[0052] like Figure 1In some embodiments, the linear motor module also includes a linear guide 420, a ball screw 430, a coupling 440, a servo motor 450, an encoder 460 and a limit switch 470; the slider 410 is connected to the nut of the ball screw 430, the linear guide 420 is arranged on at least one side of the ball screw 430 along the radial direction of the ball screw 430, and the slider 410 abuts against the linear guide 420; the screw of the ball screw 430 is transmission-connected to the output shaft of the servo motor 450 through the coupling 440, the servo motor 450 is electrically connected to the encoder 460, the limit switch 470 is arranged near the end of the linear guide 420, and the limit switch 470 is electrically connected to the servo motor 450.

[0053] Exemplarily, the linear guide rail 420 is formed by integrally processing with metal material.

[0054] The encoder 460 can control the start and stop and the speed of the servo motor 450 according to the control instructions. After the servo motor 450 is started, the ball screw 430 can be driven to rotate through the coupling 440, and the rotating ball screw 430 can drive the slider 410 to move linearly along the first direction through the nut. During the movement of the slider 410, the slider 410 always abuts against the linear guide 420, so that the movement trajectory and movement state of the slider 410 are limited by the linear guide 420, ensuring that the slider 410 can drive the 3D laser imaging camera 310 to move linearly along the first direction smoothly.

[0055] When the slider 410 moves to the end close to the linear guide 420, the limit switch 470 is triggered. After the limit switch 470 is triggered, the servo motor 450 can be controlled to stop to prevent the slider 410 from sliding out of the linear guide 420, ensuring that the linear motor module can operate safely and the 3D laser imaging camera 310 can move safely.

[0056] like Figure 1 In some embodiments, the chip pin coplanarity detection device also includes a base plate 500 disposed below the stage 100, a support column 200 is connected between the base plate 500 and the stage 100, and the linear motor module is installed on the board surface of the base plate 500 close to the stage 100.

[0057] Exemplarily, the base plate 500, the support column 200 and the stage 100 may be connected by welding, fastener connection, clamping or bonding.

[0058] Exemplarily, the first direction is the length direction of the bottom plate 500 , and the support columns 200 may be disposed at positions close to two ends of the bottom plate 500 along the length direction of the bottom plate 500 .

[0059] In order to ensure that the optical axis of the line laser emitter 311 can be perpendicular to the first surface 121, the stage 100 and the base plate 500 can be first connected together through the support column 200, and then the board surface of the base plate 500 close to the stage 100 is finely processed to ensure that the board surface is parallel to the first surface 121 of the carrier sheet 120 installed on the stage 100, so that after the linear motor module and the 3D laser imaging camera 310 are installed on the board surface, the verticality error between the optical axis of the line laser emitter 311 and the first surface 121 can be reduced.

[0060] like Figure 1 In some embodiments, the linear guide rail 420 is fixedly connected to the base plate 500, the base plate 500 is fixedly connected to the bracket 510, and the end of the screw of the ball screw 430 away from the coupling 440 is rotatably connected to the bracket 510; the scanning drive assembly also includes a motor base 480 fixedly connected to the base plate 500, and the servo motor 450 is fixedly connected to the motor base 480.

[0061] For example, the linear guide rail 420 may be fixedly connected to the base plate 500 by fasteners such as screws.

[0062] Exemplarily, a bearing is provided between the bracket 510 and the ball screw 430 to reduce the rotational friction between the ball screw 430 and the bracket 510 .

[0063] The servo motor 450 can be stably connected to the bottom plate 500 through the motor base 480 to prevent the servo motor 450 from vibrating during operation. At the same time, the bracket 510 can also ensure that the ball screw 430 can rotate relatively smoothly, further ensuring that the slider 410 can drive the 3D laser imaging camera 310 to move smoothly, thereby ensuring the imaging quality of the 3D laser imaging camera 310.

[0064] like Figure 1 In some embodiments, the moving distance of the 3D laser imaging camera 310 along the first direction is greater than the size of the first surface 121 along the first direction; the orthographic projection of the first surface 121 on the ball screw 430 along the vertical direction is located in the middle of the ball screw 430.

[0065] This embodiment limits the moving distance of the 3D laser imaging camera 310 and its positional relationship with the first surface 121, which can ensure that the 3D laser imaging camera 310 can move from one end of the first surface 121 to the other end, so that the field of view of the 3D laser imaging camera 310 can completely cover the entire area of ​​the first surface 121, thereby ensuring that the 3D laser imaging camera 310 can completely image the chip under test placed on the first surface 121.

[0066] like Figure 1In some embodiments, the chip pin coplanarity detection device further includes a plurality of shading plates, which are fixedly connected to the support column 200; the stage 100, the base plate 500 and the plurality of shading plates together form a receiving cavity, and the 3D line laser measurement module 300 is disposed in the receiving cavity.

[0067] The plurality of shading plates can form a frame structure around the 3D line laser measurement module 300 to prevent ambient light from interfering with the scanning imaging of the 3D laser imaging camera 310. The 3D line laser measurement module 300 is arranged in a receiving cavity formed by the stage 100, the bottom plate 500 and the plurality of shading plates, which not only prevents the external environment from interfering with the operation of the 3D line laser measurement module 300 to ensure the accuracy of the detection result, but also protects the 3D line laser measurement module 300 and helps to improve the service life of the 3D line laser measurement module 300.

[0068] Based on the same inventive concept and combined with the description of the chip pin coplanarity detection device of the above-mentioned embodiments, this embodiment provides a chip pin coplanarity detection method, which has the corresponding technical effects of the chip pin coplanarity detection device of the above-mentioned embodiments, and will not be repeated here.

[0069] like Figure 2 , a chip pin coplanarity detection method, using the chip pin coplanarity detection device as described in each of the above embodiments, the method comprises:

[0070] Step S100, acquiring a three-dimensional image of the chip under test sent by a 3D line laser measurement module.

[0071] After obtaining the three-dimensional image of the chip under test on the carrier sheet 120 , the 3D line laser measurement module 300 sends the three-dimensional image of the chip under test to the controller, and the controller receives and processes the three-dimensional image of the chip under test.

[0072] Step S200, obtaining the three-dimensional coordinates of the tip of each pin through the three-dimensional image of the chip under test.

[0073] After the controller processes the three-dimensional image of the chip under test, the three-dimensional coordinates of the tip of each pin can be obtained. The applicant has found that as long as it is determined that the tips of all the pins of the chip under test are located in the same plane, it can be determined that all the pins of the chip under test are also located in the same plane, and it can be determined that the coplanarity of the pins of the chip under test is qualified.

[0074] Step S300, fitting the three-dimensional coordinates of the tips of all pins of the chip under test into a reference plane.

[0075] Determine the coplanarity of all pins of the chip under test, that is, determine whether all pins are located in the same plane. In order to achieve accurate judgment, a reference plane is first generated based on the spatial position fitting of all pins. Since the reference plane is generated by fitting, the spatial position of the reference plane is relatively accurate. Compared with obtaining a real surface as a judgment reference through a 3D laser imaging camera, the method of this embodiment can avoid the influence of factors such as the imaging accuracy of the 3D laser imaging camera on the position accuracy of the surface used as the judgment reference.

[0076] Step S400, determining the distance from the three-dimensional coordinates of the tip of each pin to the reference plane, and in response to the distance corresponding to each pin being less than a preset threshold, determining that the pins of the chip under test are coplanar.

[0077] After determining the reference plane, the distance from the tip of each pin to the reference plane is calculated based on the spatial data of each pin and the reference plane. Afterwards, the obtained distance is compared with a pre-stored preset threshold (e.g., 0.1 mm). If all distances are less than the preset threshold, it indicates that all pins of the chip under test are coplanar, and the coplanarity of the chip under test is determined to be qualified. If one of the distances is greater than the preset threshold, it means that one of the pins of the chip under test is not coplanar with the other pins, and the coplanarity of the chip under test is determined to be unqualified.

[0078] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims.

[0079] The various embodiments in the present application are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0080] The description of the present application is given for the purpose of illustration and description, and is not intended to be exhaustive or to limit the present application to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present application, and to enable those of ordinary skill in the art to understand the present application and thus design various embodiments with various modifications suitable for specific purposes.

[0081] A person skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present application is limited to these examples. In line with the concept of the present application, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present application as described above, which are not provided in detail for the sake of simplicity.

[0082] Although the present application has been described in conjunction with specific embodiments thereof, many alternatives, modifications and variations of these embodiments will be apparent to those skilled in the art in light of the foregoing description.

[0083] The embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present application should be included in the protection scope of the present application.

Claims

1. A chip pin coplanarity detection device, characterized in that: include: The stage is provided with a through-hole for mounting, wherein a transparent carrier sheet is embedded in the through-hole for supporting the chip under test; the chip under test has a chip body and a plurality of pins connected to the chip body; the end of the pin away from the chip body is the tip of the pin; A 3D line laser measurement module is disposed below the carrier sheet, and the 3D line laser measurement module is configured to collect and send a three-dimensional image of the chip under test; A controller is communicatively connected with the 3D line laser measurement module, and the controller is configured to receive and process the three-dimensional image of the chip under test, obtain spatial data of each pin of the chip under test, and determine a reference plane according to the spatial data; the controller is also configured to determine the distance between the tip of each pin and the reference plane according to the spatial data and the reference plane; In response to the distance corresponding to each pin being smaller than a preset threshold, it is determined that the pins of the chip under test are coplanar.

2. The chip pin coplanarity detection device according to claim 1, characterized in that: The top of the carrier sheet includes a first surface for supporting the chip under test, and the 3D line laser measurement module includes a line laser emitter, and the optical axis of the line laser emitter is perpendicular to the first surface.

3. The chip pin coplanarity detection device according to claim 2, characterized in that: The 3D line laser measurement module includes a 3D laser imaging camera and a scanning driving component capable of driving the 3D laser imaging camera to move back and forth along a first direction, wherein the first direction is parallel to the first surface.

4. The chip pin coplanarity detection device according to claim 3, characterized in that: The scanning drive assembly includes a linear motor module, the linear motor module includes a slider, and the 3D laser imaging camera is fixedly connected to the slider.

5. The chip pin coplanarity detection device according to claim 4, characterized in that: The linear motor module also includes a linear guide rail, a ball screw, a coupling, a servo motor, an encoder and a limit switch; The slider is connected to the nut of the ball screw, the linear guide is arranged on at least one side of the ball screw along the radial direction of the ball screw, and the slider is in contact with the linear guide; the screw of the ball screw is transmission-connected to the output shaft of the servo motor through the coupling, the servo motor is electrically connected to the encoder, the limit switch is arranged at a position close to the end of the linear guide, and the limit switch is electrically connected to the servo motor.

6. The chip pin coplanarity detection device according to claim 5, characterized in that: The chip pin coplanarity detection device also includes a base plate arranged below the stage, a support column is connected between the base plate and the stage, and the linear motor module is installed on the board surface of the base plate close to the stage.

7. The chip pin coplanarity detection device according to claim 6, characterized in that: The linear guide is fixedly connected to the base plate, the base plate is fixedly connected to a bracket, and the end of the screw of the ball screw away from the coupling is rotatably connected to the bracket; the scanning drive assembly also includes a motor base fixedly connected to the base plate, and the servo motor is fixedly connected to the motor base.

8. The chip pin coplanarity detection device according to claim 5, characterized in that: The moving distance of the 3D laser imaging camera along the first direction is greater than the size of the first surface along the first direction; the orthographic projection of the first surface on the ball screw in the vertical direction is located in the middle of the ball screw.

9. The chip pin coplanarity detection device according to claim 6, characterized in that: The chip pin coplanarity detection device also includes a plurality of shading plates, which are fixedly connected to the support pillars; the stage, the base plate and the plurality of shading plates together form a receiving cavity, and the 3D line laser measurement module is arranged in the receiving cavity.

10. A chip pin coplanarity detection method, characterized in that: Using the chip pin coplanarity detection device according to any one of claims 1 to 9, the method comprises: Acquire a three-dimensional image of the chip under test sent by a 3D line laser measurement module; Obtaining the three-dimensional coordinates of the tip of each pin through the three-dimensional image of the chip under test; Fitting the three-dimensional coordinates of the toes of all the pins of the chip under test into a reference plane; The distance from the three-dimensional coordinates of the tip of each pin to the reference plane is determined, and in response to the distance corresponding to each pin being less than a preset threshold, it is determined that the pins of the chip under test are coplanar.

Images