Sensor and electronic product

By setting up an airflow driving structure in the sealing chamber of the MEMS sensor, internal gas circulation is realized, which solves the problem of reducing measurement accuracy caused by temperature gradient and improves the overall performance of the sensor.

CN119880007APending Publication Date: 2025-04-25GOERTEK MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202510023978.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-07
Publication Date
2025-04-25

AI Technical Summary

Technical Problem

Due to the existence of temperature gradients inside the MEMS sensor, the measurement accuracy and reliability are reduced, and the existing temperature compensation mechanism is not effective under the non-uniform temperature distribution.

Method used

An air flow driving structure is arranged in the sealing cavity of the sensor, and the gas flow is controlled through the conductive dielectric layer and the electronic control device to realize internal gas circulation and maintain the consistency of the ambient temperature around the sensor body.

Benefits of technology

It effectively reduces the temperature gradient, improves the uniformity of the temperature distribution inside the sensor, and thus improves the measurement accuracy and stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a sensor and an electronic product, and relates to the technical field of sensors.The sensor comprises a shell, a sensor body and an airflow driving structure, the shell is provided with a sealing cavity, the sensor body is arranged in the sealing cavity, and the airflow driving structure is arranged in the sealing cavity; the driving device is used for driving gas in the sealing cavity to flow; the gas flow driving structure is arranged in the sealing cavity of the shell, gas circulation in the sealing cavity is achieved, the ambient temperature around the sensor body can be kept consistent as much as possible, uneven internal stress of the sensor body caused by the temperature gradient is avoided, and then the measurement precision and stability of the sensor are improved.
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Description

Technical Field

[0001] The present invention relates to the technical field of sensors, and in particular to a sensor and an electronic product. Background Art

[0002] In the application of MEMS (micro-electromechanical system) sensors, ensuring that the minimum temperature gradient is maintained inside the device is crucial to maintaining its performance. This is especially true for MEMS devices such as inertial sensors or pressure sensors. When there is a significant temperature gradient, it may cause changes in the internal stress of the sensitive components, thereby affecting the measurement accuracy and reliability of the sensor. Although modern MEMS sensors are usually equipped with temperature compensation mechanisms and integrated sensors for monitoring internal temperature, the effectiveness of these measures depends on a premise: the temperature distribution within the MEMS structure is uniform. Only in this case can temperature compensation achieve the most ideal effect.

[0003] However, in actual application environments, MEMS sensors are often installed in a relatively closed space, and heat is not easy to dissipate. When there are heat-generating components around the sensor, their number, position and different heat generation will cause uneven temperature distribution inside the MEMS sensor, forming a temperature gradient. This temperature gradient may cause the zero point offset or sensitivity change of the sensor, and these problems are difficult to completely correct through subsequent data processing and calibration. How to alleviate the temperature gradient problem inside the MEMS sensor to improve the overall performance of the sensor is a problem faced by this field. Summary of the invention

[0004] The main purpose of the present invention is to provide a sensor and an electronic product, aiming to alleviate the temperature gradient problem inside the MEMS sensor to improve the overall performance of the sensor.

[0005] To achieve the above object, the sensor proposed by the present invention includes:

[0006] A housing having a sealed cavity;

[0007] a sensor body, disposed in the sealed cavity; and

[0008] The airflow driving structure is arranged in the sealed cavity and is used to drive the gas flow in the sealed cavity.

[0009] In one embodiment, the airflow driving structure comprises:

[0010] At least two conductive medium layers are arranged opposite to each other, the at least two conductive medium layers are spaced apart from each other and are insulated, a driving space is defined between the conductive medium layers, the driving space is communicated with the sealed cavity, at least one of the conductive medium layers is configured as a conductive film capable of elastic deformation; and

[0011] The electric control device is electrically connected to the conductive medium layer to control the power supply and the power supply voltage of the conductive medium layer.

[0012] In one embodiment, three conductive medium layers are provided, and the three conductive medium layers include a base layer, and a first conductive medium layer and a second conductive medium layer installed on the base layer, the driving space is defined between the first conductive medium layer and the second conductive medium layer, and the first conductive medium layer and the second conductive medium layer are both provided as the conductive film.

[0013] In one embodiment, the second conductive medium layer is disposed on a side of the first conductive medium layer away from the base layer;

[0014] The first conductive medium layer is provided with a plurality of via holes.

[0015] In one embodiment, the density of the via holes in the middle region of the first conductive medium layer is set to be greater than the density of the via holes in the periphery.

[0016] In one embodiment, the elastic modulus of the first conductive medium layer is set to be greater than the elastic modulus of the second conductive medium layer.

[0017] In one embodiment, the shell includes a bottom, a top, and side surrounding parts that enclose the sealed cavity, and the bottom forms the base layer.

[0018] In one embodiment, insulating layers are disposed on both sides of the first conductive medium layer.

[0019] In one embodiment, the airflow driving structure is disposed on a peripheral side of the sensor body.

[0020] In one embodiment, the sensor includes an inertial sensor or a pressure sensor.

[0021] The present invention further provides an electronic product, the electronic product comprising a sensor, the sensor comprising:

[0022] A housing having a sealed cavity;

[0023] a sensor body, disposed in the sealed cavity; and

[0024] The airflow driving structure is arranged in the sealed cavity and is used to drive the gas flow in the sealed cavity.

[0025] In the technical solution of the present invention, an airflow driving structure is arranged in the sealed cavity of the shell, so that the gas in the sealed cavity circulates, so that the ambient temperature around the sensor body can be kept as consistent as possible, avoiding uneven internal stress of the sensor body caused by temperature gradient, thereby improving the measurement accuracy and stability of the sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0027] Figure 1 A schematic diagram of the structure of a sensor according to an embodiment of the present invention;

[0028] Figure 2 for Figure 1 Middle AA section view;

[0029] Figure 3 for Figure 1 Middle BB cross section;

[0030] Figure 4 for Figure 2 Schematic diagram of the airflow driving structure in FIG.

[0031] Figure 5 for Figure 3 Schematic diagram of the airflow driving structure in FIG.

[0032] Figure 6 for Figure 4 Schematic diagram of deformation of the second conductive medium layer in FIG.

[0033] Figure 7 and Figure 8 Schematic diagram of the air intake process of the airflow driven structure;

[0034] Fig. 9 and Fig.10 Schematic diagram of the exhaust process of the airflow driven structure.

[0035] Description of Figure Numbers:

[0036] 100. Sensor; 1. Shell; a. Sealed cavity; 11. Bottom; 12. Top; 13. Side surrounding portion; 2. Sensor body; 3. Airflow driving structure; 30. Conductive medium layer; b. Driving space; 31. Base layer; 32. First conductive medium layer; 33. Second conductive medium layer; c. Via hole; 34. First supporting portion; 35. Second supporting portion.

[0037] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0040] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0041] In actual application environments, MEMS sensors are often installed in a relatively closed space, where heat is not easy to dissipate. When there are heat-generating components around the sensor, their number, position, and different heat generation will cause uneven temperature distribution inside the MEMS sensor, forming a temperature gradient. This temperature gradient may cause the zero point offset or sensitivity change of the sensor, and these problems are difficult to completely correct through subsequent data processing and calibration. How to reduce the temperature gradient problem inside the MEMS sensor to improve the overall performance of the sensor is a problem facing this field.

[0042] The present invention provides a sensor, aiming to alleviate the temperature gradient problem inside a MEMS sensor, so as to improve the overall performance of the sensor.

[0043] See also Figures 1 to 3 In one embodiment of the present invention, the sensor 100 includes a shell 1, a sensor body 2 and an airflow driving structure 3, the shell 1 has a sealed cavity a, the sensor body 2 is arranged in the sealed cavity a, and the airflow driving structure 3 is arranged in the sealed cavity a for driving the gas flow in the sealed cavity a.

[0044] The housing 1 is an external protective structure of the sensor 100. The housing 1 has a closed space, namely the sealed cavity a, for accommodating and protecting the internal components of the sensor 100. The housing 1 prevents dust, moisture and other pollutants in the external environment from entering, while keeping the internal conditions stable.

[0045] The sensor body 2 is the part that performs the actual sensing function and is located in the sealed cavity a of the housing 1. The sensor body 2 can be any type of MEMS sensor 100, such as an inertial sensor 100 or a pressure sensor 100, etc., responsible for detecting specific physical quantities and converting them into electrical signals for output.

[0046] The airflow driving structure 3 is disposed in the sealed cavity a to generate gas flow so that the gas in the sealed cavity a can circulate, which can effectively distribute heat and reduce the local temperature rise caused by the heating element, thereby reducing the impact of the temperature gradient on the performance of the sensor 100.

[0047] The airflow driving structure 3 can be a micro fan, which generates airflow by rotating, thereby promoting air circulation in the sealed cavity a. It can also be a piezoelectric vibrating plate, that is, it can undergo mechanical deformation when an electrical signal is applied, thereby pushing the surrounding air to form an airflow. The airflow driving structure 3 can also be a thermoelectric pump. When the current passes through a loop composed of two different metals, it will produce a heating or cooling effect at the contact point, which can make one side heat up and the other side absorb heat. The resulting temperature difference can drive the air flow.

[0048] It is understandable that the appropriate driving mode is selected based on the requirements of the actual application scenario, such as space limitations, power consumption considerations, and required airflow characteristics.

[0049] In the technical solution of the present invention, an airflow driving structure 3 is arranged in the sealed cavity a of the shell 1, so that the gas in the sealed cavity a circulates, so that the ambient temperature around the sensor body 2 can be kept as consistent as possible, avoiding uneven internal stress of the sensor body 2 caused by temperature gradient, thereby improving the measurement accuracy and stability of the sensor 100.

[0050] Specifically, in this embodiment, the airflow driving structure 3 includes at least two conductive medium layers 30 arranged opposite to each other and an electronic control device, the at least two conductive medium layers 30 are spaced apart and insulated from each other, a driving space b is defined between the conductive medium layers 30, the driving space b is connected to the sealed cavity a, at least one of the conductive medium layers 30 is configured as a conductive film that can be elastically deformed; the electronic control device is electrically connected to the conductive medium layer 30 to control the power supply and supply voltage of the conductive medium layer 30.

[0051] “The at least two conductive medium layers 30 are spaced apart from each other and insulated from each other”, that is, the at least two conductive medium layers 30 are not in direct contact with each other, but are separated by a layer of insulating material to ensure that there is no risk of current short circuit between them.

[0052] The driving space b is a part of the sealed cavity a and is communicated with other parts of the sealed cavity a, so that the gas in the sealed cavity a can freely enter and exit the driving space b.

[0053] “At least one of the conductive medium layers 30 is configured as a conductive film capable of elastic deformation” means that at least one of the conductive medium layers 30 is a conductive film made of a material capable of elastic deformation. Therefore, when a voltage is applied to the conductive medium layer 30, it can undergo physical deformation (e.g., bending or stretching) according to the change in the voltage.

[0054] The electric control device supplies power to the conductive medium layer 30 and controls the supply voltage. By adjusting the voltage applied to the conductive medium layer 30, the electric control device can control the degree and manner of deformation of the conductive film.

[0055] It should be noted that when a voltage is applied to the two opposite conductive medium layers 30, an electric field is formed between them, resulting in an attractive force between the charged surfaces. At least one of the conductive medium layers 30 is configured to be elastically deformable, so the electrostatic attraction force can cause them to bend inward or approach each other, thereby changing the volume of the driving space b.

[0056] According to Coulomb's law, the electrostatic force F is proportional to the amount of charge Q1 and Q2 between the two charged bodies, and inversely proportional to the square of the distance r between them F = keQ1 Q2 / r2. In the case of electrostatic drive, the amount of charge is usually determined by the applied voltage V, because the voltage causes the charge to accumulate on the conductive layer. Applying a higher voltage will generate a stronger electric field between the conductive layers, thereby increasing the attraction between them. As a result, the elastically deformable conductive film undergoes more significant deformation, allowing it to bend more or move closer to another layer. On the contrary, a lower voltage forms a weaker electric field and less attraction, so the degree of deformation of the conductive film will also be reduced.

[0057] When the electric control device supplies power to the conductive medium layer 30, a voltage is applied to the conductive film having elastic deformation characteristics, thereby causing physical deformation of the conductive film, thereby changing the volume of the driving space b, and further causing the gas in the sealed cavity a to be compressed or expanded, thereby generating airflow. By precisely controlling the applied voltage, the deformation mode of the conductive film can be regulated to achieve effective control of the airflow speed and direction.

[0058] In this way, efficient internal gas circulation is achieved without the need for traditional mechanical components. This approach not only saves space, but also reduces noise and power consumption, while improving the reliability and life of the system.

[0059] Specifically, see Figure 4 and Figure 5 In this embodiment, three conductive medium layers 30 are provided, and the three conductive medium layers 30 include a base layer 31, and a first conductive medium layer 32 and a second conductive medium layer 33 installed on the base layer 31, the driving space b is defined between the first conductive medium layer 32 and the second conductive medium layer 33, and the first conductive medium layer 32 and the second conductive medium layer 33 are both provided as the conductive film.

[0060] It can be understood that the first conductive medium layer 32 and the second conductive medium layer 33 can both be set as the conductive film. By applying different voltages to the first conductive medium layer 32 and the second conductive medium layer 33 through an electronic control device, at least one of them can undergo elastic deformation at a certain moment, driving the volume of space b, causing the gas in the sealed cavity a to be compressed or expanded, thereby generating airflow.

[0061] With this setup, the airflow intensity and direction can be finely adjusted by precisely controlling the voltage, improving the efficiency of thermal management and temperature uniformity.

[0062] For further information, please refer to Figure 4 and Figure 5In this embodiment, the second conductive medium layer 33 is disposed on a side of the first conductive medium layer 32 away from the base layer 31 ; a plurality of via holes c are disposed on the first conductive medium layer 32 .

[0063] The plurality of vias c are provided on the first conductive medium layer 32, so that the driving space b is connected to the sealed cavity a. In this way, the plurality of vias c allow the gas in the sealed cavity a to flow freely between the driving space b and other areas. When the conductive medium layer 30 is deformed, since the plurality of vias c are provided on the layer, the gas flow will not be hindered during the deformation process, but can be more effectively guided to enter and exit the driving space b, thereby optimizing the generation and control of the gas flow.

[0064] The size and speed of the air flow are not only related to the deformation of the conductive medium layer 30 , but also related to the size, density and position of the plurality of via holes c.

[0065] It can be understood that the first conductive medium layer 32 is supported on the base layer 31 through the first support portion 34, and the second conductive medium layer 33 is supported on the first conductive medium layer 32 through the second support portion 35. In order to ensure that both the first conductive medium layer 32 and the second conductive medium layer 33 can be stably supported, the first support portion 34 and the second support portion 35 can be extended along the circumference of the first conductive medium layer 32, so that the outer periphery of the first conductive medium layer 32 is supported on the base layer 31, and the outer periphery of the second conductive medium layer 33 is supported on the first conductive medium layer 32.

[0066] The first supporting portion 34 and the second supporting portion 35 are both made of insulating materials, or are components with insulating materials on their surfaces, to prevent conduction between the first conductive medium, the second conductive medium layer 33 and the base layer 31 .

[0067] In this embodiment, the density of the via holes c in the middle region of the first conductive medium layer 32 is set to be greater than the density of the via holes c in the periphery.

[0068] It should be noted that, when the first conductive medium layer 32 is deformed, when it is in contact with the base layer 31, the via c at the contact point cannot enable airflow to pass through. Then, when the second conductive medium layer 33 is deformed and the size of the driving space b changes, the airflow can only flow from the via c where the first conductive medium layer 32 is not in contact with the base layer 31. In this way, the number of vias c is reduced, and the airflow velocity per unit time is faster, which has a better effect on the airflow driving effect in the sealed cavity a.

[0069] The density of the vias c in the middle area of ​​the first conductive medium layer 32 is set to be greater than the density of the vias c in the periphery, so that the number of the vias c in the periphery of the first conductive medium layer 32 is as small as possible, so that the flow rate of the airflow is greater, and the airflow can be driven to reach farther places, so that the airflow exchange around the sensor body 2 is more frequent.

[0070] For further information, see Figure 8 In this embodiment, the elastic modulus of the first conductive medium layer 32 is set to be greater than the elastic modulus of the second conductive medium layer 33.

[0071] It should be noted that the elastic modulus is a physical quantity that measures the material's ability to resist elastic deformation. The larger the elastic modulus, the more difficult it is for the material to be stretched or compressed, that is, the smaller the deformation it undergoes when subjected to external force.

[0072] The elastic modulus of the first conductive medium layer 32 is greater than that of the second conductive medium layer 33 , that is, under the same external force, the first conductive medium layer 32 is less likely to deform than the second conductive medium layer 33 .

[0073] It can be understood that when power is supplied to the first conductive medium layer 32 and the second conductive medium layer 33, the second conductive medium layer 33 is more likely to deform and drive the airflow in the driving space b. Since the first conductive medium layer 32 is provided with the plurality of vias c, the rapid deformation of the second conductive medium layer 33 can quickly change the volume of the driving space b, and has a stronger ability to drive the airflow, thereby being able to drive more gas flow.

[0074] For further information, see Figure 2 and Figure 3 In this embodiment, the shell 1 includes a bottom 11, a top 12 and a side surrounding portion 13 which enclose the sealed cavity a, and the bottom 11 forms the base layer 31.

[0075] It should be noted that the bottom 11 can be used as a mounting support component for the conductive medium layer 30 or as a mounting carrier for the sensor body 2. Thus, using the bottom 11 as the base layer 31 can not only simplify the structure but also enhance the functional integration.

[0076] Specifically, in one embodiment, both sides of the first conductive medium layer 32 are provided with an insulating layer.

[0077] The insulating layer may be a material coated on the surface of the first conductive medium layer 32 or a structure installed on the first conductive medium layer 32, and its main function is to prevent or significantly reduce the passage of electric charge (current).

[0078] When the electric control device supplies power to the first conductive medium layer 32 , since insulating layers are provided on both sides of the first conductive medium layer 32 , when the first conductive medium layer 32 is in contact with the second conductive medium layer 33 or the base layer 31 , there is no conduction between the two conductive medium layers 30 .

[0079] Furthermore, the electric field is confined within the conductive medium layer 30 and within the space between the second conductive medium layer 33 and the base layer 31, so that the electric field is more concentrated, the effect of electrostatic force or other electric actuation effects is improved, and the efficiency of airflow drive is enhanced.

[0080] The airflow driving structure 3 can be arranged on the side of the sensor body 2, or can be stacked with the sensor body 2, and both can drive the airflow in the sealed cavity a. However, from the perspective of manufacturing process convenience, in order to further simplify the manufacturing process, further, in this embodiment, the airflow driving structure 3 is arranged on the peripheral side of the sensor body 2.

[0081] It should be noted that, in general, during the manufacturing process of the sensor body 2, especially the micro-electromechanical system (MEMS) sensor 100 and other precision electronic components, processes such as photolithography, etching and plating are used layer by layer. Therefore, the more layers the sensor 100 has, the more complicated the manufacturing process is.

[0082] The airflow driving structure 3 is arranged on the peripheral side of the sensor body 2. When the sensor body 2 is manufactured, the airflow driving structure 3 can also be manufactured or assembled at the same time, avoiding increasing the number of processing layers and achieving efficient manufacturing.

[0083] Specifically, in some embodiments, the sensor 100 includes an inertial sensor 100 or a pressure sensor 100 .

[0084] It will be appreciated that the inertial sensor 100 is used to measure acceleration, angular velocity (rotation rate), and sometimes orientation or attitude information of an object.

[0085] The pressure sensor 100 is used to measure the pressure of gas or liquid.

[0086] Thus, by providing the airflow driving structure 3 in the inertial sensor 100 or the pressure sensor 100 , it is possible to avoid the generation of an internal temperature gradient during the operation of the inertial sensor 100 or the pressure sensor 100 , thereby improving the measurement accuracy and stability of the inertial sensor 100 or the pressure sensor 100 .

[0087] The specific working process of the airflow driving structure 3 is described in detail below:

[0088] In the first embodiment, see Figure 6 , applying a potential V to the second conductive medium layer 33, grounding the first conductive medium layer 32 and the base layer 31, then, the second conductive medium layer 33 generates an electrostatic force with the first conductive medium layer 32 and the base layer 31. Since the elastic modulus of the first conductive medium layer 32 is greater than that of the second conductive medium layer 33, the deformation of the second conductive medium layer 33 is greater than the bending deformation of the first conductive medium layer 32. Then, the second conductive medium layer 33 generates a relative displacement relative to the first conductive medium layer 32, and can drive the airflow in the driving space b to flow from the multiple vias c. When the second conductive medium layer 33 is controlled to change alternately from 0 to V, the second conductive medium layer 33 will be subjected to an alternating downward electrostatic force, generating a bending motion, thereby compressing and stretching the driving space b, so that the outside and the inside of the driving space b are continuously exchanged with each other, and a stable and continuous air flow is generated inside the sealed cavity a. The air flow will alleviate the internal temperature gradient, make the temperature distribution of the internal structure more uniform, and also help to improve the temperature compensation effect of the sensor 100.

[0089] In the second embodiment, see Figures 7 to 10 In the whole control process, three kinds of potentials are used, namely GND, V1, and V2, where GND is grounded and V1 is <V2。

[0090] In the initial state, the second conductive medium layer 33, the first conductive medium layer 32, and the base layer 31 have the same potential, which is GND. Figure 5 , the second conductive medium layer 33 and the first conductive medium layer 32 are applied with the same potential V1, and the base layer 31 is GND. At this time, an electrostatic force F_e1 is generated between the first conductive medium layer 32 and the base layer 31, and the first conductive medium layer 32 is bent and deformed downward, attracted to the base layer 31, and the via c in the central part of the first conductive medium layer 32 is blocked. The second conductive medium layer 33 and the first conductive medium layer 32 have the same potential, no electrostatic force, the distance between the second conductive medium layer 33 and the base layer 31 is large, and the electrostatic force F_e2 between the second conductive medium layer 33 and the base layer 31 is small.

[0091] When exhausting, Figure 7, the second conductive medium layer 33 is at potential V2, the first conductive medium layer 32 is still at potential V1, and the base layer 31 is GND. Since V2>V1, when the difference between V2 and V1 is large enough, the electrostatic force F_e2 between the second conductive medium layer 33 and the base layer 31, and the electrostatic force F_e3 between the second conductive medium layer 33 and the first conductive medium layer 32 increase at the same time, and the second conductive medium layer 33 will bend and deform downward, compressing the driving space b (but not attracting the first conductive medium layer 32), and the gas in the driving space b is discharged through the via c on the first conductive medium layer 32 that is not in contact with the base layer 31.

[0092] After exhaust is completed, Fig. 9 , keep the potential V2 of the second conductive medium layer 33 and the potential V1 of the first conductive medium layer 32, control the base layer 31 and the first conductive medium layer 32 to have the same potential V1, then there is no electrostatic force between the first conductive medium layer 32 and the base layer 31, the electrostatic force F_e3 between the second conductive medium layer 33 and the first conductive medium layer 32 remains unchanged, and the displacement and deformation of the second conductive medium layer 33 remain unchanged. At this time, due to the mechanical restoring force F_m1 of the first conductive medium layer 32, the first conductive medium layer 32 and the base layer 31 are decoupled, the deformation is restored, and the through hole in the central area of ​​the first conductive medium layer 32 is released.

[0093] During air inhalation, the second conductive medium layer 33, the first conductive medium layer 32, and the base layer 31 are grounded together, and there is no electrostatic force between them. Due to the mechanical restoring force F_m2, the second conductive medium layer 33 stretches the driving space b, and the external gas enters the driving space b evenly through all the pores of the first conductive medium layer 32, completing the air inhalation.

[0094] Through the relationship between the electrostatic forces of Fe_1, Fe_2, and Fe_3 and the mechanical restoring forces of F_m1 and F_m2, the same exhaust and intake volumes can be completed in the same time. At this time, since there are fewer pores during exhaust and more intake, the gas velocity during exhaust is faster, and it can reach farther places in the sealed cavity a; the gas velocity during intake is smaller, and the gas near the pores can be evenly absorbed. This reciprocating cycle can realize the internal air circulation of the MEMS sensor 100 and alleviate the internal temperature gradient. At the same time, the built-in temperature compensation effect will be more accurate, improving the performance of the sensor 100. Under the same structure, if the number of pores is not controlled to make the exhaust and intake rates the same, the structure can only control the local air flow in the driving space b, and the efficiency is low.

[0095] The present invention further proposes an electronic product, which includes a sensor 100. The specific structure of the sensor 100 refers to the above embodiment. Since the electronic product adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0096] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A sensor, characterized in that: include: A housing having a sealed cavity; a sensor body, disposed in the sealed cavity; and The airflow driving structure is arranged in the sealed cavity and is used to drive the gas flow in the sealed cavity.

2. The sensor according to claim 1, characterized in that The airflow driving structure comprises: At least two conductive medium layers are arranged opposite to each other, the at least two conductive medium layers are spaced apart from each other and are insulated, a driving space is defined between the conductive medium layers, the driving space is communicated with the sealed cavity, at least one of the conductive medium layers is configured as a conductive film capable of elastic deformation; and The electric control device is electrically connected to the conductive medium layer to control the power supply and the power supply voltage of the conductive medium layer.

3. The sensor according to claim 2, characterized in that The three conductive medium layers include a base layer, and a first conductive medium layer and a second conductive medium layer installed on the base layer. The driving space is defined between the first conductive medium layer and the second conductive medium layer. The first conductive medium layer and the second conductive medium layer are both configured as the conductive film.

4. The sensor according to claim 3, characterized in that The second conductive medium layer is arranged on a side of the first conductive medium layer away from the base layer; The first conductive medium layer is provided with a plurality of via holes.

5. The sensor according to claim 4, characterized in that The density of the via holes in the middle region of the first conductive medium layer is set to be greater than the density of the via holes in the periphery.

6. The sensor according to claim 4, characterized in that The elastic modulus of the first conductive medium layer is set to be greater than the elastic modulus of the second conductive medium layer.

7. The sensor according to claim 3, characterized in that The shell includes a bottom, a top and side surrounding parts which enclose and form the sealed cavity, and the bottom forms the base layer.

8. The sensor according to claim 4, characterized in that Insulating layers are provided on both sides of the first conductive medium layer.

9. The sensor according to claim 1, characterized in that The airflow driving structure is arranged on the peripheral side of the sensor body.

10. The sensor according to claim 1, characterized in that The sensor includes an inertial sensor or a pressure sensor.

11. An electronic product, characterized in that: Comprising the sensor according to any one of claims 1 to 10.