A photosensitive chip detection mechanism

Abstract

The present application discloses a photosensitive chip detection mechanism, which belongs to the field of chip detection technology and includes a frame, a turntable, a test carrier, and a test station. The turntable is rotatably arranged on the frame, and the test carrier includes a fixed seat, a guide mold, a floating seat, a baffle, and a switching assembly. The fixed seat is fixedly connected to the turntable, and the guide mold is installed in the middle of the fixed seat. The guide mold has a mold cavity for placing the photosensitive chip. The top and bottom of the floating seat are respectively provided with an upper probe and a lower probe. The baffle has a through hole and a light hole. The switching assembly is used to change the relative position between the baffle and the guide mold. The test station includes a mounting seat, an upper floating block, a lower floating block, a light cylinder, a PCB test card, a first servo motor, and a linkage structure. The upper floating block and the lower floating block are both vertically slidably connected to the mounting seat. The light cylinder is installed on the upper floating block, and the PCB test card is installed on the lower floating block. The present application can improve the stability and accuracy of photosensitive chip detection.

Description

Technical Field

[0001] The present application belongs to the field of chip detection technology and relates to a photosensitive chip detection mechanism. Background Art

[0002] The application of photosensitive chips in various mobile terminals is becoming more and more extensive, and the performance testing requirements for photosensitive chips are becoming higher and higher, especially for testing needs in different electronic products, different performance requirements, and different application scenarios.

[0003] When testing the photosensitive chip, the photosensitive chip needs to be placed on a test fixture. Light (infrared light, ambient light, light reflection) is transmitted through different beam channels and finally illuminates the photosensitive chip. The photosensitive chip converts the visible light into an electrical signal for testing. Alternatively, the photosensitive chip with its own light source is powered on. The light emitted by the photosensitive chip is reflected by the light tube to the sensing position of the photosensitive chip to convert the light into an electrical signal for testing.

[0004] The existing testing method mainly relies on random inspection, which involves manually transferring the photosensitive chip onto the test fixture. However, this method has low testing efficiency and is prone to contamination or damage to the product during testing.

[0005] Therefore, further testing also includes a mechanical full inspection, that is, using a turntable to transfer each photosensitive chip to the test fixture in turn, which has high test efficiency. However, after transferring to the test fixture, the photosensitive chip needs to be repeatedly positioned and fixed, and after the test is completed, the photosensitive chip needs to be transferred to the turntable again, and the photosensitive chip needs to be repeatedly positioned and fixed, that is, two transfers and two positioning and fixations in total, which can easily cause poor detection accuracy of the photosensitive chip due to inaccurate positioning or poor stability, and the photosensitive chip is easily damaged due to multiple transfers, positioning and fixations. Summary of the Invention

[0006] Aiming at the problem of poor testing accuracy of existing photosensitive chips, a photosensitive chip detection mechanism is provided.

[0007] This application provides a photosensitive chip detection mechanism, which is specifically implemented by the following technical solutions:

[0008] A photosensitive chip detection mechanism includes a frame, a turntable, a test carrier, and a test station. The turntable is rotatably arranged on the frame, and a plurality of test carriers are provided and installed at the outer diameter of the turntable; the test carrier includes a fixed seat, a guide mold, a floating seat, a baffle and a switching component. The fixed seat is fixedly connected to the turntable, the guide mold is installed in the middle of the fixed seat, and the guide mold has a mold cavity for placing the photosensitive chip, and the mold cavity is set through. The floating seat is vertically slidably connected to the fixed seat, and the top and bottom of the floating seat are respectively provided with an upper probe and a lower probe, wherein the upper probe is located directly below the mold cavity; the baffle is located above the guide mold, The baffle has a through hole and a light-through hole, and the switching assembly is used to change the relative position between the baffle and the guide mold so that the guide mold is located below the light-through hole or the through hole; the test station includes a mounting seat, an upper floating block, a lower floating block, a light cylinder, a PCB test card, a first servo motor and a linkage structure, the mounting seat is installed on the side of the frame close to the turntable, the upper floating block and the lower floating block are both vertically slidably connected to the mounting seat, the light cylinder is installed on the upper floating block, and the PCB test card is installed on the lower floating block, and the first servo motor drives the upper floating block and the lower floating block to move closer to or away from each other through the linkage structure.

[0009] Through the above technical solution, the testing method includes the following steps: photosensitive chip placement: the switching component changes the relative position between the baffle and the guide mold so that the through hole is located directly above the guide mold, the aperture of the through hole is larger than the photosensitive chip, and the photosensitive chip enters the mold cavity of the guide mold through the through hole, and the switching component then changes the relative position between the baffle and the guide mold so that the light hole is located directly above the guide mold, and the aperture of the light hole is only for the light of the photosensitive chip to pass through; power-on test and photosensitive test: the turntable rotates to move the photosensitive chip on the test carrier to the test station, the photosensitive chip is located directly below the light cylinder, the first servo motor is started, and the first servo motor drives the upper floating block and the lower floating block to approach each other through the linkage structure, the PCB test card of the upper floating block abuts against the lower probe to drive the floating seat and the upper probe to move up, the upper probe of the floating seat abuts against the lower surface of the photosensitive chip, and drives the photosensitive chip to move up, so that the upper surface of the photosensitive chip fits the lower surface of the baffle, and the baffle is used to ensure the parallelism of the photosensitive chip; the lower floating block The block drives the light cylinder downward, and the tube mouth of the light cylinder abuts the upper surface of the baffle to ensure the light shielding effect; the contact of the PCB test card contacts the lower probe and is energized to perform a power test on the photosensitive chip. At the same time, the light emitted by the photosensitive chip passes through the light hole to the light cylinder and is reflected by the light cylinder to the photosensitive position of the photosensitive chip. The photosensitive chip converts the light into an electrical signal to facilitate the test of the PCB test card, that is, the photosensitivity test is completed; after the test is completed, the first servo motor is started, and the first servo motor drives the upper floating block and the lower floating block to move away from each other through the linkage structure. The upper floating block and the light cylinder move upward and separate from the baffle, and the lower floating block and the PCB test card move downward. The floating seat loses its support and moves downward under the action of gravity, thereby driving the photosensitive chip to move down into the mold cavity of the guide mold. The turntable continues to move the test carrier and the photosensitive chip. When the photosensitive chip needs to be transferred to the next process, the switching component again changes the relative position between the baffle and the guide mold so that the through hole is located directly above the guide mold, so that the photosensitive chip can be sucked out of the test carrier through the through hole.

[0010] In summary, by setting up a test carrier, a test station, a switching component, a baffle, and a linkage structure, it is possible to perform power-on testing and photosensitivity testing without the photosensitive chip leaving the test carrier. There is no need for multiple transfers and positioning fixations, and the test efficiency is further improved, and the damage to the photosensitive chip is reduced. In addition, the photosensitive chip is moved up and the light tube is moved down through the linkage structure, and the upper and lower surfaces of the baffle are used as reference matching surfaces to improve the relative position accuracy of the reflective surface of the photosensitive chip and the reflective surface of the light tube, thereby greatly improving the test accuracy.

[0011] Optionally, the baffle is slidingly connected to the fixed seat, and the through hole and the light-through hole are arranged at intervals along the sliding direction of the baffle; the switching assembly includes a top-opening structure, a first spring and a rocker arm, the middle part of the rocker arm is rotatably connected to the fixed seat, the upper end of the rocker arm is provided with a waist-shaped hole extending along its own length direction, the lower end of the rocker arm is fixed with a driven end block, and a follower is fixed to one side of the baffle, and the follower is slidably matched with the waist-shaped hole, and the elastic force of the first spring is used to drive the rocker arm to swing forward so that the baffle slides to a state where the light-through hole is directly above the mold cavity; the top-opening structure is installed on the frame, and the top-opening structure is used to apply an upward force to the driven end block to drive the rocker arm to swing in the opposite direction, and the reverse-swinging rocker arm will drive the baffle to slide to a state where the through hole is directly above the mold cavity.

[0012] Through the above technical solution, when the photosensitive chip is placed, the top-opening structure applies an upward force to the driven end block to drive the rocker arm to swing in the opposite direction, the first spring stretches and accumulates elastic force, and the rocker arm swinging in the opposite direction will drive the follower and the baffle to slide, so that the through hole of the baffle moves to just above the mold cavity, so that the photosensitive chip can pass through the through hole into the mold cavity of the guide mold, and then the top-opening structure moves downward to release the force on the driven end block, the first spring restores its deformation, and the first spring pulls the rocker arm to swing in the positive direction. The rocker arm swinging in the positive direction will drive the follower and the baffle to slide, so that the light hole of the baffle moves to just above the mold cavity, and the lower surface of the baffle can be used as a reference mating surface for the subsequent upward-moving photosensitive chip to abut and mate.

[0013] Optionally, the floating seat includes an upper guide seat, a movable seat, a PCB board, and a lower guide seat from top to bottom. The upper guide seat and the lower guide seat are fixedly connected to the fixed seat, the movable seat is vertically slidably connected relative to the upper guide seat, the PCB board is installed on the movable seat, and the upper probe and the lower probe are respectively installed on the upper and lower surfaces of the PCB board.

[0014] Through the above technical solution, by setting the vertical sliding cooperation between the movable seat and the upper guide seat, the lower floating block can apply an upward force to the movable seat and the upper probe through the lower probe, so that the movable seat and the upper probe can move upward, so that the upper probe can support and drive the photosensitive chip in the mold cavity to move up to the lower surface of the baffle, so as to facilitate power-on testing and photosensitivity testing.

[0015] Optionally, both the upper probe and the lower probe are spring pins.

[0016] Through the above technical solution, by setting spring needles, each upper probe can elastically extend and retract to adaptively abut the contacts of the photosensitive chip, so that each upper probe can elastically abut the lower surface of the photosensitive chip to ensure the stability of power supply, so as to avoid the situation where individual upper probes do not contact the contacts of the photosensitive chip when the upper ends of the upper probes are not at the same height.

[0017] Optionally, the linkage structure includes an upper connecting rod, a middle connecting rod, a lower connecting rod, a lever and an eccentric wheel, the eccentric wheel is mounted on the output shaft of the first servo motor, the lower end of the lower connecting rod is connected to the eccentric wheel through a bearing, and the upper end of the lower connecting rod is hingedly connected to the lower floating block; the middle part of the lever is hingedly connected to the mounting seat, the upper end of the middle connecting rod is hingedly connected to the lower floating block, the lower end of the middle connecting rod is hingedly connected to one end of the lever, the other end of the lever is hingedly connected to the lower end of the upper connecting rod, and the upper end of the upper connecting rod is hingedly connected to the upper floating block.

[0018] With the above technical solution, when the linkage structure is required to drive the upper and lower floating blocks toward each other, the first servo motor rotates the eccentric wheel, which drives the lower connecting rod upward, thereby driving the lower floating block upward. Simultaneously, the upwardly moving lower floating block drives the middle connecting rod and one end of the lever upward, causing the other end of the lever to move downward. This end of the lever drives the upper floating block and the light tube downward via the upper connecting rod, thereby achieving the upper and lower floating blocks approaching each other. The specific transmission of the upper and lower floating blocks moving away from each other is the same as above. That is, through multiple connecting rods, a large opening and closing distance can be achieved, thereby facilitating the positioning of the test vehicle.

[0019] Optionally, the test station further includes a voice coil motor, the driving direction of the voice coil motor is vertical, the main body of the voice coil motor is installed on the lower floating block, and the PCB test card is fixed to the driving end of the voice coil motor.

[0020] Through the above technical solution, the voice coil motor has excellent performance such as high acceleration, high speed, fast response, and smooth force characteristics. The voice coil motor can perform vertical micro-distance control and force control on the PCB test card. After the test carrier is in place, when the object under test is overloaded, the force can be quickly removed or a certain pressure can be applied to ensure stable power supply, thereby reducing structural damage to the photosensitive chip and improving test accuracy.

[0021] Optionally, the floating seat includes, from top to bottom, an upper guide seat, a second spring, a movable seat, a PCB board, and a lower guide seat, the upper guide seat and the lower guide seat are both fixedly connected to the fixed seat, the movable seat is vertically slidably connected relative to the upper guide seat, the second spring is used to force the movable seat to move downward, the PCB board is installed on the movable seat, the upper probe and the lower probe are respectively installed on the upper and lower surfaces of the PCB board; a guide hole is vertically penetrated through the upper guide seat, the upper probe includes a needle body and a syringe, the syringe is located in the guide hole, the needle body is connected to the upper surface of the PCB board, the needle body penetrates the syringe, the upper end of the needle body is integrally formed with an elastic contact piece, the elastic contact piece radially abuts the inner wall of the syringe, and the lower orifice of the guide hole is provided with a flange for abutting the lower end face of the syringe; the lower vertical damping sliding sleeve of the light cylinder is provided with a light-shielding sleeve, and the mounting seat is fixed with a reset rod for abutting the upper end face of the light-shielding sleeve.

[0022] Through the above technical solution, when the upper floating block and the lower floating block approach each other, the lower floating block applies an upward force to the movable seat and the upper probe through the lower probe (the second spring is compressed and accumulates elastic force), so that the movable seat and the upper probe can move upward, so that the upper probe can support and drive the photosensitive chip in the mold cavity to move up to the lower surface of the baffle, so as to facilitate power-on test and photosensitive test. In this process, since the elastic contact piece elastically abuts against the inner wall of the syringe, the sliding of the syringe relative to the needle body has damping, that is, the upward moving syringe is positioned according to the contact height of the photosensitive chip. The height position is adaptively adjusted so that each syringe can more gently abut against different contacts of the photosensitive chip, ensuring the stability of power supply, thereby reducing the damage to the photosensitive chip or the compression deformation of the syringe due to excessive upward movement of the syringe; at the same time, the lower floating block and the light cylinder move downward, and the lower end face of the light-shielding sleeve adjusts its own height position adaptively according to the height position of the upper surface of the baffle, so that the light-shielding sleeve abuts against the upper surface of the baffle more gently, thereby reducing the compression displacement of the baffle and the photosensitive chip, and thus improving the test accuracy.

[0023] When the upper floating block and the lower floating block move away from each other, the second spring recovers its deformation and drives the movable seat and the needle body to move downward, and the needle body drives the needle cylinder to move downward. During this process, the flange of the upper guide seat abuts against the lower end of the needle cylinder to prevent the needle cylinder from continuing to move downward with the needle body, thereby realizing the reset of the needle cylinder; at the same time, the upper floating block drives the light cylinder and the light-shielding sleeve to move upward. During this process, the reset rod abuts against the upper end surface of the light-shielding sleeve to prevent the light-shielding sleeve from continuing to move upward with the light cylinder, thereby realizing the reset of the light-shielding sleeve.

[0024] Optionally, the baffle is fixedly connected to the fixed seat, and the switching assembly includes a second servo motor, a rotating shaft, a third spring, a connecting column and a sleeve. The second servo motor is installed on the fixed seat, and the second servo motor is used to drive the rotating shaft to rotate. The connecting column is vertically slidably connected to the rotating shaft and the third spring is used to force the connecting column to move upward. The guide mold is provided with multiple and circumferentially arranged and fixed on the outside of the connecting column. The guide mold includes four supporting pieces. Adjacent supporting pieces are fixedly connected by a second support rod. The supporting pieces are used to support the top and bottom of the photosensitive chip. The area enclosed by each supporting piece is the mold cavity. The second servo motor drives each guide mold to rotate. The mold moves in sequence to just below the through hole and the light-through hole; the connecting column is fixed with a circular guide block, the sleeve is fixedly connected to the fixing seat, the sleeve is sleeved on the outer side of the connecting column, and the inner wall of the sleeve is provided with a circumferentially extending wavy guide groove, and the guide block slides in cooperation with the guide groove; when the guide block moves to the trough of the guide groove, there is a gap between the photosensitive chip on the guide mold and the lower surface of the baffle; when the guide block moves to the crest of the guide groove, the guide block does not abut against the inner wall of the crest of the guide groove, and the elastic force of the third spring is applied to the guide mold through the connecting column, so that the photosensitive chip on the guide mold abuts against the lower surface of the baffle.

[0025] According to the above technical solution, when the photosensitive chip is placed, the photosensitive chip enters the mold cavity of one of the guide molds through the through hole, and then the second servo motor drives the connecting column and the guide mold to rotate an angle through the rotating shaft, so that the other guide mold without the photosensitive chip is rotated to the bottom of the through hole, and then a new photosensitive chip is placed. The above action is repeated so that each guide mold is placed with a photosensitive chip, and the guide mold in which the photosensitive chip is initially placed is located directly under the light-through hole. Secondly, during the rotation of the connecting column, the guide block thereon slides along the guide groove. Specifically, the connecting column rotates an angle so that When the guide mold moves from the previous workstation to the next workstation, the guide block moves from the crest of the guide groove to the trough and then to the next crest. The connecting column and the guide mold first descend and then rise to reduce the friction of the photosensitive chip relative to the lower surface of the baffle. Moreover, when the guide block moves to the crest of the guide groove, the guide block does not abut the inner wall of the guide groove at the crest. The elastic force of the third spring is applied to the guide mold through the connecting column, so that the photosensitive chip on the guide mold abuts the lower surface of the baffle. That is, the elastic force of the third spring and the calibration of the lower surface of the baffle are used to improve the position stability and positioning accuracy of the photosensitive chip at the workstation.

[0026] Power-on test and photosensitivity test: the turntable rotates to move multiple photosensitive chips on the test carrier to the test station, and the light hole of the baffle is located directly below the light cylinder (at this time, the photosensitive chip of the guide mold has been attached to the lower surface of the baffle under the elastic force of the third spring), the first servo motor is started, and the first servo motor drives the upper floating block and the lower floating block to approach each other through the linkage structure, and the PCB test card of the upward lower floating block abuts against the lower probe, and the lower floating block applies an upward force to the movable seat and the upper probe through the lower probe (the second spring is compressed and accumulates elastic force), so that the movable seat and the upper probe move upward, and the upward syringe adjusts its own height position adaptively according to the contact height position of the photosensitive chip, so that each syringe can more gently abut against different contacts of the photosensitive chip. At the same time, the lower floating block and the light cylinder move downward, and the lower end face of the light-shielding cover adjusts its own height position adaptively according to the height position of the upper surface of the baffle, so that the light-shielding cover more gently abuts against the upper surface of the baffle.

[0027] After the test of a single photosensitive chip is completed, the second servo motor drives the connecting column and the guide mold to rotate an angle through the rotating shaft, so that the untested photosensitive chip on the other guide mold rotates to the bottom of the light hole. During this process, the guide mold first descends and then rises, and the gravity of the photosensitive chip is not enough to overcome the damping force of the syringe. Therefore, the photosensitive chip does not rise or fall, but only rotates in the circumferential direction. After the untested photosensitive chip on the new guide mold rotates to the bottom of the light hole, the circumferentially moving photosensitive chip may touch the syringe and change the original height position of the syringe. Therefore, to ensure the syringe's contact with the photosensitive chip's contacts, the first servo motor needs to be activated. The first servo motor drives the upper and lower floating blocks closer together through the linkage structure, allowing each syringe to continue to move upward, ensuring stable power supply to each syringe. At the same time, due to the damping cooperation between the light shielding sleeve and the light cylinder, when the light cylinder moves downward, the downward pressure of the light cylinder is transmitted to the baffle through the light shielding sleeve at a small value, that is, it will not interfere with the baffle. After the test is completed, the above action is continued to complete the test of all photosensitive chips. The first servo motor is activated, causing the upper and lower floating blocks to move away from each other, and the syringe and light shielding sleeve to move back to their original position.

[0028] In summary, by setting up a second servo motor, a rotating shaft, a third spring, a connecting column and a sleeve, batch placement of multiple photosensitive chips and batch testing of multiple photosensitive chips can be achieved, which can greatly improve the detection efficiency. Moreover, when multiple photosensitive chips switch detection stations, combined with the reference coordination of the baffle and the damping sliding abutment of the syringe, the tedious and repeated positioning of multiple photosensitive chips can be eliminated. It is only necessary to continue to move the syringe up a short distance to compensate for the positioning error, and it also reduces the pressure damage to the photosensitive chip.

[0029] Optionally, the inclination angle of the portion from the crest to the trough of the guide groove is greater than the inclination angle of the portion from the trough to the crest of the guide groove.

[0030] Through the above technical solution, by setting the inclination angles at different parts of the guide groove, when the inclination angle is larger, the connecting column, the guide mold and the photosensitive chip descend faster, and they can leave the lower surface of the baffle faster; when the inclination angle is smaller, the connecting column, the guide mold and the photosensitive chip rise slower, and the photosensitive chip will abut the lower surface of the baffle more gently, thereby reducing the vibration force on the photosensitive chip and further reducing the structural damage to the photosensitive chip.

[0031] Optionally, the fixed seat fixes the limit block and the slide rail, a slider is fixed to one side of the baffle, the slider slides with the slide rail, the slider is threadedly connected to the limit bolt, the length direction of the limit bolt is the sliding direction of the slider, and the limit block is located on the path where the limit bolt moves with the slider.

[0032] Through the above technical solution, the limit block abuts against the limit bolt to limit the maximum stroke of the baffle, and the limit bolt is rotated to adjust the length of the limit bolt, thereby adjusting the maximum stroke of the baffle to suit photosensitive chips of different sizes.

[0033] The beneficial effects of this application are:

[0034] 1. By setting up a test carrier, a test station, a switching component, a baffle, and a linkage structure, it is possible to perform power-on testing and light-sensing testing without removing the photosensitive chip from the test carrier, eliminating the need for multiple transfers and positioning fixations. This further improves test efficiency and reduces damage to the photosensitive chip. Furthermore, the photosensitive chip is moved upward and the light tube is moved downward through the linkage structure, and the upper and lower surfaces of the baffle are used as reference mating surfaces to improve the relative position accuracy of the reflective surface of the photosensitive chip and the reflective surface of the light tube, thereby greatly improving test accuracy.

[0035] 2. The voice coil motor has excellent performance such as high acceleration, high speed, fast response, and smooth force characteristics. The voice coil motor can perform vertical micro-distance control and force control on the PCB test card. After the test carrier is in place, when the object under test is overloaded, the force can be quickly removed or a certain pressure can be applied to ensure stable power supply, thereby reducing structural damage to the photosensitive chip and improving test accuracy.

[0036] 3. By setting up a second servo motor, a rotating shaft, a third spring, a connecting column and a sleeve, it is possible to realize batch placement of multiple photosensitive chips and batch testing of multiple photosensitive chips, which can greatly improve the detection efficiency. Moreover, when multiple photosensitive chips switch the detection station, combined with the reference coordination of the baffle and the damping sliding abutment of the syringe, the tedious and repeated positioning of multiple photosensitive chips can be eliminated. It is only necessary to continue to move the syringe up a short distance to compensate for the positioning error, and it also reduces the pressure damage to the photosensitive chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the overall structure of Example 1.

[0038] Figure 2 Schematic diagram of the test vehicle of Example 1.

[0039] Figure 3 This is a schematic diagram of Example 1 for showing the bottom of the test vehicle.

[0040] Figure 4 is a cross-sectional view of the test vehicle of Example 1.

[0041] Figure 5 Schematic diagram of the top-opening structure of Example 1.

[0042] Figure 6 It is a schematic diagram of the test station of Example 1.

[0043] Figure 7 This is a schematic diagram of Example 1 for showing the position of the connecting rod on the test station.

[0044] Figure 8 is a cross-sectional view of the test vehicle of Example 2.

[0045] Figure 9 yes Figure 8 A partial enlarged view of point A in the middle.

[0046] Figure 10 is a cross-sectional view of the test vehicle of Example 3.

[0047] Figure 11 yes Figure 10 A partial enlarged view of point B in the middle.

[0048] Figure 12 This is a schematic diagram of the switching component of Example 3.

[0049] Figure 13 It is a cross-sectional view of the sleeve of Example 3.

[0050] Explanation of reference numerals: 10, frame; 100, photosensitive chip; 11, fixing seat; 111, slide rail; 112, limiting bolt; 113, limiting block; 12, guide mold; 121, mold cavity; 122, supporting plate; 1221, guide surface; 1222, supporting surface; 123, second support rod; 125, third support rod; 13, baffle; 131, through hole; 132, light hole; 133, slider; 15, floating seat; 151, upper guide seat; 1511 , guide hole; 1512, flange; 1513, rotating seat; 152, moving seat; 1521, guide column; 1522, guide hole; 1523, second spring; 153, lower guide seat; 154, PCB board; 155, upper probe; 1551, needle body; 1552, syringe; 1553, elastic contact piece; 156, lower probe; 20, nozzle-type transfer mechanism; 21, rocker; 211, first rod body; 212, driven end block; 213, follower ; 214, waist-shaped hole; 215, second rod; 216, third rod; 217, first spring; 22, top opening structure; 221, cylinder; 222, round block; 30, turntable; 31, mounting seat; 311, reset rod; 32, upper floating block; 321, third connecting arm; 33, lower floating block; 331, first connecting arm; 332, second connecting arm; 34, light tube; 341, light shielding sleeve; 342, rubber layer; 35, PCB test card; 36, voice coil Motor; 37. First servo motor; 381. Upper connecting rod; 382. Middle connecting rod; 383. Lower connecting rod; 384. Lever; 385. Eccentric wheel; 386. Bearing; 50. Test carrier; 51. Second servo motor; 511. First support rod; 52. Rotating shaft; 521. Key block; 522. Third spring; 53. Connecting column; 531. Keyway; 532. Guide block; 55. Sleeve; 551. Guide groove; 552. Avoidance groove; 60. Test station. DETAILED DESCRIPTION

[0051] The following describes the embodiments of the present application in detail, and examples of the embodiments are shown in the attached Figures 1-13 Shown in.

[0052] Throughout this specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0053] Example 1

[0054] Example 1 discloses a photosensitive chip detection mechanism, such as Figure 1 、 Figure 2 As shown, the photosensitive chip detection mechanism includes a frame 10, a turntable 30, a test carrier 50, a test station 60 and a nozzle-type transfer mechanism 20, wherein the turntable 30 is rotatably set on the frame 10, the test carrier 50 is set in multiple numbers and installed at the outer diameter of the turntable 30, the nozzle-type transfer mechanism 20 is located on one side of the turntable 30, and the test station 60 can be set in multiple numbers and located near the turntable 30.

[0055] The nozzle-type transfer mechanism 20 uses negative pressure to suck the photosensitive chip 100 and transfers the photosensitive chip 100 to the test carrier 50. The test carrier 50 is used to carry the photosensitive chip 100. The turntable 30 is used to drive the photosensitive chip 100 on each test carrier 50 to move circumferentially, so that the photosensitive chip 100 on the test carrier 50 can enter the test station of the test station 60 for power-on test and photosensitivity test.

[0056] like Figure 2 、 Figure 3 、 Figure 4 As shown, the test carrier 50 includes a fixed seat 11, a guide mold 12, a floating seat 15, a baffle 13 and a switching assembly. The fixed seat 11 is fixedly connected to the turntable 30. In this embodiment, the guide mold 12 is a block structure. The guide mold 12 is installed in the middle of the fixed seat 11. A mold cavity 121 is provided on the upper surface of the guide mold 12. The mold cavity 121 is vertically penetrated. The mold cavity 121 has an inclined inner wall. The mold cavity 121 is used to place the photosensitive chip 100.

[0057] The baffle 13 is located directly above the guide mold 12, and there is a gap between the lower surface of the baffle 13 and the photosensitive chip 100. The baffle 13 is slidably connected to the fixed seat 11. Specifically, a slider 133 is fixed to one side of the baffle 13, and the fixed seat 11 is provided with a slide rail 111. The slider 133 slides with the slide rail 111. The baffle 13 is penetrated by a through hole 131 and a light-through hole 132. The size of the through hole 131 is larger than the photosensitive chip 100, and the size of the light-through hole 132 is smaller than the photosensitive chip 100, and the through hole 131 and the light-through hole 132 are arranged at intervals along the sliding direction of the baffle 13.

[0058] The switching assembly is used to change the relative position between the baffle 13 and the guide mold 12 so that the photosensitive chip 100 of the guide mold 12 is located below the light-through hole 132 or the through hole 131. In this embodiment, the switching assembly is used to drive the baffle 13 to move relative to the guide mold 12. Specifically, the switching assembly includes a top opening structure 22, a first spring 217 and a rocker 21. A horizontally arranged first rod body 211 is fixed to the middle of the rocker 21. The first rod body 211 is rotatably connected to the fixed seat 11. The upper end of the rocker 21 is provided with a waist-shaped hole 214 extending along its own length direction. The lower end of the rocker 21 is fixed with a driven end block 21. 2. A follower 213 is fixed to one side of the slider 133, and the follower 213 slides and cooperates with the waist-shaped hole 214; the elastic force of the first spring 217 is used to drive the rocker 21 to swing forward so that the baffle 13 slides to a state where the light-through hole 132 is located directly above the mold cavity 121. Specifically, the driven end block 212 is fixed with a second rod 215, and the bottom of the fixed seat 11 is fixed with a third rod 216. The two ends of the first spring 217 are fixedly connected to the second rod 215 and the third rod 216 respectively. The tension of the first spring 217 will pull the driven end block 212 to move toward the third rod 216 ( Figure 3 The direction of the arrow in FIG. 2 is the pulling direction of the first spring 217).

[0059] like Figure 5 As shown, the top opening structure 22 is installed on the frame 10. In this embodiment, the top opening structure 22 is a cylinder 221. The telescopic direction of the cylinder 221 is vertical, and the telescopic end of the cylinder 221 has a round block 222.

[0060] When the nozzle transfer mechanism 20 transfers the photosensitive chip 100 to the test carrier 50, the cylinder 221 drives the round block 222 to move upward, and the round block 222 abuts against the driven end block 212 to apply an upward force to the driven end block 212, thereby driving the swing rod 21 to swing in the opposite direction. The first spring 217 stretches and accumulates elastic force, and the swing rod 21 swinging in the opposite direction drives the follower 213 and the baffle 13 to slide, so that the through hole 131 of the baffle 13 moves to the top of the mold cavity 121, and then the nozzle transfer The mechanism 20 releases the adsorption of the photosensitive chip 100, and the photosensitive chip 100 falls into the mold cavity 121 of the guide mold 12 through the through hole 131, and then the cylinder 221 drives the round block 222 to move downward to release the force on the driven end block 212, and the first spring 217 recovers its deformation. The first spring 217 pulls the rocker arm 21 to swing forward, and the rocker arm 21 that swings forward will drive the follower 213 and the baffle 13 to slide, so that the light hole 132 of the baffle 13 moves to directly above the mold cavity 121.

[0061] Furthermore, to control the maximum sliding stroke of the baffle 13, the following configuration can be made: a limit bolt 112 is threadedly connected to one side of the slider 133, the length direction of the limit bolt 112 being the sliding direction of the slider 133, and a limit block 113 is also fixed to the fixing base 11. The limit block 113 is located on the path of the limit bolt 112 as it moves along with the slider 133. The limit block 113 abuts the limit bolt 112 to limit the maximum stroke of the baffle 13, and the limit bolt 112 is rotated to adjust its length, thereby adjusting the maximum stroke of the baffle 13, so as to adapt to photosensitive chips 100 of different sizes.

[0062] like Figure 4 As shown, the floating seat 15 is connected to the fixed seat 11 in a vertical sliding manner. Specifically, the floating seat 15 includes an upper guide seat 151, a movable seat 152, a PCB board 154 and a lower guide seat 153 from top to bottom, wherein the upper guide seat 151 and the lower guide seat 153 are both fixedly connected to the fixed seat 11, the upper guide seat 151 is located directly below the guide mold 12, the PCB board 154 is installed on the movable seat 152, and the movable seat 152 is vertically slidably connected relative to the upper guide seat 151. Specifically, the upper and lower surfaces of the movable seat 152 are fixed with vertically arranged guide columns 1521, and the upper guide seat 151 and the lower guide seat 153 are each provided with a guide hole 1522, and the guide column 1521 slides into the guide hole 1522. The upper surface and lower surface of the PCB board 154 are respectively fixed with an upper probe 155 and a lower probe 156. The distance between adjacent upper probes 155 is smaller than the distance between adjacent lower probes 156. The upper probe 155 slides through the upper guide seat 151, and the upper end of the upper probe 155 is located in the mold cavity 121. The lower probe 156 slides through the lower guide seat 153, and the lower end of the lower probe 156 is located below the lower guide seat 153. In this embodiment, the upper probe 155 and the lower probe 156 can be spring pins.

[0063] Under the action of gravity, the lower surface of the movable seat 152 is attached to the upper surface of the lower guide seat 153. At this time, there is a gap between the upper surface of the movable seat 152 and the lower surface of the upper guide seat 151. At this time, the upper probe 155 is lower than the photosensitive chip 100, that is, the upper probe 155 does not contact the photosensitive chip 100.

[0064] When an upward force is applied to the lower probe 156, the lower probe 156, the movable seat 152 and the upper probe 155 will move upward. The upper probe 155 will support the photosensitive chip 100 and drive the photosensitive chip 100 to move upward, so that the upper surface of the photosensitive chip 100 is attached to the lower surface of the baffle 13.

[0065] like Figure 6 、 Figure 7As shown, the test station 60 includes a mounting base 31, an upper floating block 32, a lower floating block 33, a light cylinder 34, a PCB test card 35, a voice coil motor 36, a first servo motor 37 and a linkage structure. The mounting base 31 is installed on the side of the frame 10 close to the turntable 30. The upper floating block 32 and the lower floating block 33 are both vertically slidably connected to the mounting base 31. The light cylinder 34 is vertically installed on the upper floating block 32. The driving direction of the voice coil motor 36 is vertical. The main body of the voice coil motor 36 is installed on the lower floating block 33. The PCB test card 35 is fixed to the driving end of the voice coil motor 36.

[0066] The first servo motor 37 is mounted on the bottom of the mounting base 31. The first servo motor 37 drives the upper floating block 32 and the lower floating block 33 to move closer to or away from each other through a linkage structure. Specifically, the linkage structure includes an upper connecting rod 381, a middle connecting rod 382, a lower connecting rod 383, a lever 384 and an eccentric wheel 385. The eccentric wheel 385 is mounted on the output shaft of the first servo motor 37. The lower end of the lower connecting rod 383 is connected to the eccentric wheel 385 through a bearing 386. That is, the outer ring of the bearing 386 is fixed to the hole wall of the lower connecting rod 383. The bearing 386 is fixed to the hole wall of the lower connecting rod 383. The inner ring 86 is fixed to the outer wall of the eccentric wheel 385, and the upper end of the lower connecting rod 383 is hingedly connected to the first connecting arm 331 fixed to the lower floating block 33; the middle part of the lever 384 is hingedly connected to the mounting seat 31, the upper end of the middle connecting rod 382 is hingedly connected to the second connecting arm 332 fixed to the lower floating block 33, the lower end of the middle connecting rod 382 is hingedly connected to one end of the lever 384, the other end of the lever 384 is hingedly connected to the lower end of the upper connecting rod 381, and the upper end of the upper connecting rod 381 is hingedly connected to the third connecting arm 321 fixed to the upper floating block 32.

[0067] The test method of Example 1 includes the following steps: Placement of the photosensitive chip 100: When the nozzle-type transfer mechanism 20 transfers the photosensitive chip 100 to the test carrier 50, the cylinder 221 drives the round block 222 to move upward, and the round block 222 abuts against the driven end block 212 to apply an upward force to the driven end block 212 to drive the swing rod 21 to swing in the opposite direction. The first spring 217 stretches and accumulates elastic force, and the swing rod 21 swinging in the opposite direction will drive the follower 213 and the baffle 13 to slide, so that the through hole 131 of the baffle 13 moves to the top of the mold cavity 121, and then The nozzle-type transfer mechanism 20 releases the adsorption of the photosensitive chip 100, and the photosensitive chip 100 falls into the mold cavity 121 of the guide mold 12 through the through hole 131. Then the cylinder 221 moves downward, releasing the force on the driven end block 212, and the first spring 217 recovers its deformation. The first spring 217 pulls the rocker arm 21 to swing forward, and the forward-swinging rocker arm 21 will drive the follower 213 and the baffle 13 to slide, so that the light hole 132 of the baffle 13 moves to the top of the mold cavity 121. The aperture of the light hole 132 is only for light from the photosensitive chip 100 to pass through.

[0068] Power-on test and photosensitivity test: The turntable 30 rotates to move the photosensitive chip 100 on the test carrier 50 to the test station 60. At this time, the photosensitive chip 100 is located directly below the light cylinder 34, and the first servo motor 37 is started. The first servo motor 37 drives the upper floating block 32 and the lower floating block 33 to approach each other through the linkage structure. Specifically, the first servo motor 37 drives the eccentric wheel 385 to rotate, and the eccentric wheel 385 drives the lower connecting rod 383 to move upward, thereby driving the lower floating block 33 to move upward. At the same time, the upward-moving lower floating block 33 drives the middle connecting rod 382 and one end of the lever 384 to move upward, so that the other end of the lever 384 moves downward. This end of the lever 384 is connected to the upper connecting rod 385. The rod 381 drives the upper floating block 32 and the light tube 34 to move downward, thereby realizing the mutual approach of the upper floating block 32 and the lower floating block 33. The contact of the PCB test card 35 of the upward-moving lower floating block 33 abuts against the lower probe 156 to drive the floating seat 15 and the upper probe 155 to move upward. The upper probe 155 of the floating seat 15 abuts against the contact on the lower surface of the photosensitive chip 100, and drives the photosensitive chip 100 to move upward, so that the upper surface of the photosensitive chip 100 is attached to the lower surface of the baffle 13. The baffle 13 is used to ensure the parallelism of the photosensitive chip 100; the downward-moving upper floating block 32 drives the light tube 34 to move downward, and the tube mouth of the light tube 34 abuts against the upper surface of the baffle 13 to ensure the light-shielding effect. The contacts of the PCB test card 35 are in contact with the lower probe 156 and energized to perform a power-on test on the photosensitive chip 100. At the same time, the light emitted by the photosensitive chip 100 passes through the light hole 132 to the light cylinder 34, and is reflected by the top of the light cylinder 34 to the photosensitive position of the photosensitive chip 100. The photosensitive chip 100 converts the light into an electrical signal to facilitate the test of the PCB test card 35, thereby completing the photosensitivity test.

[0069] After the test is completed, the first servo motor 37 is started, and the first servo motor 37 drives the upper floating block 32 and the lower floating block 33 to move away from each other through the linkage structure. Specifically, the first servo motor 37 drives the eccentric wheel 385 to rotate, and the eccentric wheel 385 drives the lower connecting rod 383 to move downward, thereby driving the lower floating block 33 to move downward. At the same time, the lower floating block 33 that moves downward drives the middle connecting rod 382 and one end of the lever 384 to move downward, so that the other end of the lever 384 moves upward, and the end of the lever 384 drives the upper floating block 32 and the light cylinder 34 to move upward through the upper connecting rod 381, thereby realizing the mutual separation of the upper floating block 32 and the lower floating block 33. At this time, the lower floating block 33 and the PCB test card 35 are moved downward. The floating seat 15 loses its support and moves downward under the action of gravity (in order to improve the downward movement speed and stability of the floating seat 15, a spring can be set in the guide hole 1522, and the spring applies a downward elastic force to the movable seat 152), thereby driving the photosensitive chip 100 to move down to the mold cavity 121 of the guide mold 12. The turntable 30 continues to move the test carrier 50 and the photosensitive chip 100. When the photosensitive chip 100 needs to be transferred to the next process, the switching component again changes the relative position between the baffle 13 and the guide mold 12 so that the through hole 131 is located directly above the guide mold 12, so that the photosensitive chip 100 can be sucked out of the test carrier 50 through the through hole 131.

[0070] In summary, by setting up the test carrier 50, the test station 60, the switching component, the baffle 13, and the linkage structure, the photosensitive chip 100 can be subjected to power-on test and photosensitivity test without being separated from the test carrier 50, without the need for multiple transfers and positioning fixations, thereby further improving the test efficiency and reducing the damage to the photosensitive chip 100. In addition, the photosensitive chip 100 is moved upward and the light tube 34 is moved downward through the linkage structure, and the upper and lower surfaces of the baffle 13 are used as reference mating surfaces to improve the relative position accuracy of the reflective surface of the photosensitive chip 100 and the reflective surface of the light tube 34, thereby greatly improving the test accuracy.

[0071] In addition, the voice coil motor 36 has excellent performance such as high acceleration, high speed, fast response, and smooth force characteristics. The voice coil motor 36 can perform vertical micro-distance control and force control on the PCB test card 35. After the test carrier 50 is in place, when the object under test is overloaded, the force can be quickly removed or a certain pressure can be applied to ensure stable power supply, thereby reducing structural damage to the photosensitive chip 100 and improving test accuracy.

[0072] Example 2

[0073] The difference between Example 2 and Example 1 is that Figure 8 、 Figure 9As shown, a second spring 1523 is provided in the guide hole 1522 of the upper guide seat 151 , and the lower end of the second spring 1523 abuts against the top of the guide column 1521 . The second spring 1523 is used to force the movable seat 152 to move downward.

[0074] A guide hole 1511 is vertically penetrated through the upper guide seat 151, and the upper probe 155 includes a needle body 1551 and a syringe 1552. The upper end of the syringe 1552 is a round head, and the syringe 1552 is located in the guide hole 1511. The syringe 1552 and the guide hole 1511 slide vertically together, and the needle body 1551 is connected to the upper surface of the PCB board 154. The needle body 1551 slides into the syringe 1552, and the outer wall of the needle body 1551 can fit into the inner wall of the syringe 1552. A plurality of elastic contact pieces 1553 are integrally formed on the upper end of the needle body 1551, and the elastic contact pieces 1553 radially abut against the inner wall of the syringe 1552. The inner wall of the syringe 1552 can be set to a rough surface to increase the friction damping effect.

[0075] The lower opening of the guide hole 1511 is provided with a flange 1512 for abutting against the lower end surface of the syringe 1552 .

[0076] The lower part of the light cylinder 34 is provided with a light shielding sleeve 341 , which slides vertically with the light cylinder 34 , and the inner wall of the light shielding sleeve 341 is covered with a rubber layer 342 , which fits the outer wall of the light cylinder 34 to achieve a damping sliding effect.

[0077] A reset rod 311 is fixed to the mounting seat 31 for contacting the upper end surface of the light shielding sleeve 341 .

[0078] When the upper floating block 32 and the lower floating block 33 approach each other, the lower floating block 33 applies an upward force to the movable seat 152 and the upper probe 155 through the lower probe 156 (the second spring 1523 is compressed and accumulates elastic force), and the movable seat 152 and the upper probe 155 move upward, so that the upper probe 155 can support and drive the photosensitive chip 100 in the mold cavity 121 to move up to the lower surface of the baffle 13, so as to facilitate the power-on test and the photosensitivity test. In this process, since the elastic contact piece 1553 elastically abuts against the inner wall of the syringe 1552, the sliding of the syringe 1552 relative to the needle body 1551 has damping, that is, the upward moving syringe 1552 is moved according to the contact height position of the photosensitive chip 100. The adaptive adjustment of its own height position enables each syringe 1552 to more gently abut against different contacts of the photosensitive chip 100, ensuring the stability of power supply, thereby reducing the damage to the photosensitive chip 100 or the compression deformation of the syringe 1552 caused by excessive upward movement of the syringe 1552; at the same time, the lower floating block 33 and the light cylinder 34 move downward, and the light cylinder 34 drives the light-shielding sleeve 341 to move downward, and the lower end face of the light-shielding sleeve 341 performs its own height position adaptive adjustment according to the height position of the upper surface of the baffle 13, so that the light-shielding sleeve 341 abuts against the upper surface of the baffle 13 more gently, thereby reducing the compression displacement of the baffle 13 and the photosensitive chip 100, thereby improving the test accuracy.

[0079] When the upper floating block 32 and the lower floating block 33 move away from each other, the second spring 1523 recovers its deformation and drives the movable seat 152 and the needle body 1551 to move downward, and the needle body 1551 drives the syringe 1552 to move downward. During this process, the flange 1512 of the upper guide seat 151 abuts against the lower end of the syringe 1552 to prevent the syringe 1552 from continuing to move downward with the needle body 1551, so as to achieve the reset of the syringe 1552; at the same time, the upper floating block 32 drives the light cylinder 34 and the light-shielding sleeve 341 to move upward. During this process, the reset rod 311 abuts against the upper end surface of the light-shielding sleeve 341 to prevent the light-shielding sleeve 341 from moving upward with the light cylinder 34, so as to achieve the reset of the light-shielding sleeve 341.

[0080] Example 3

[0081] The difference between Example 3 and Example 2 is that Figure 10 、 Figure 11 、 Figure 12 、 Figure 13 As shown, the baffle 13 is fixedly connected to the fixing seat 11. In this embodiment, the switching component is used to move the guide mold 12 so that the guide mold 12 moves relative to the baffle 13 to change the position of the guide mold 12 relative to the through hole 131 and the light-transmitting hole 132.

[0082] Specifically, the switching assembly includes a second servo motor 51, a rotating shaft 52, a third spring 522, a connecting column 53 and a sleeve 55. The second servo motor 51 is located on one side of the upper guide seat 151. The second servo motor 51 is installed on the inner wall of the fixed seat 11 through the first support rod 511. The rotating shaft 52 is vertically arranged. The rotating shaft 52 is rotatably connected to the rotating seat 1513 set on one side of the upper guide seat 151. The second servo motor 51 drives the rotating shaft 52 to rotate through gear transmission.

[0083] The connecting column 53 is vertically slidingly connected to the rotating shaft 52 to prevent rotation. Specifically, the connecting column 53 has an inner hole, and the inner hole is provided with a vertically arranged keyway 531. A key block 521 is fixed to the outer wall of the rotating shaft 52. The key block 521 slides with the keyway 531, so that the torque of the rotating shaft 52 can be transmitted to the connecting column 53, and at the same time, the connecting column 53 is allowed to move vertically relative to the rotating shaft 52. The third spring 522 is located in the inner hole, and the upper and lower ends of the third spring 522 respectively abut against the top of the inner hole and the upper end of the rotating shaft 52. The third spring 522 is used to force the connecting column 53 to move upward.

[0084] The guide mold 12 is provided in multiple pieces and is arranged circumferentially and fixed on the outside of the connecting column 53. Specifically, the guide mold 12 includes four supporting pieces 122. The supporting piece 122 has a supporting surface 1222 and two guide surfaces 1221. The guide surface 1221 can be vertical or inclined. The vertical distance between the top of the guide surface 1221 and the supporting surface 1222 is less than the thickness of the photosensitive chip 100. Adjacent supporting pieces 122 are fixedly connected by second support rods 123. One of the second support rods 123 is fixedly connected to the outer wall of the connecting column 53 through a third support rod 125. The supporting piece 122 is used to support the vertex and bottom of the photosensitive chip 100. The area enclosed by each supporting piece 122 is the mold cavity 121. In this way, the second servo motor 51 will drive each guide mold 12 to move circumferentially through the rotating shaft 52 and the connecting column 53, so that each guide mold 12 moves in turn to the bottom of the through hole 131 and the light hole 132.

[0085] The connecting column 53 is fixed with a circular guide block 532, and the sleeve 55 is fixedly connected to the fixed seat 11 through the first support rod 511. The sleeve 55 is sleeved on the outer side of the connecting column 53, and the inner wall of the sleeve 55 is provided with a circumferentially extending wavy guide groove 551. The guide groove 551 has four crests. The guide block 532 slides with the guide groove 551, and an avoidance groove 552 is provided at the crest of the guide groove 551. The vertical distance between the crest and the trough of the guide surface is smaller than the vertical distance between the top of the guide surface 1221 and the supporting surface 1222.

[0086] Furthermore, the inclination angle of the portion from the wave crest to the wave trough of the guide groove 551 is greater than the inclination angle of the portion from the wave trough to the wave crest of the guide groove 551 .

[0087] When the photosensitive chip 100 is placed, the guide block 532 is located at the crest of the guide groove 551, the guide mold 12 is in the highest position, and the photosensitive chip 100 enters the mold cavity 121 of one of the guide molds 12 through the through hole 131. Then the second servo motor 51 drives the connecting column 53 and the guide mold 12 to rotate an angle (90 degrees in this embodiment) through the rotating shaft 52, so that the other guide mold 12 without the photosensitive chip 100 is rotated to the bottom of the through hole 131, and then a new photosensitive chip 100 is placed. The above actions are repeated so that each guide mold 12 is placed with a photosensitive chip 100, and the guide mold 12 in which the photosensitive chip 100 is initially placed is located directly below the light-through hole 132; and during the rotation process of the connecting column 53, that is, the connecting column 53 rotates an angle to allow the guide mold 12 to enter the next station from the previous station, in essence, the guide block 532 is rotated from When the guide block 532 moves to the peak of the guide groove 551, the guide block 532 does not abut the inner wall of the peak of the guide groove 551, that is, the position structure of the guide block 532 is located in the avoidance groove 552, and the guide groove 551 fails to constrain the guide block 532 from continuing to move upward, so that the elastic force of the third spring 522 can drive the connecting column 53 to move upward relative to the rotating shaft 52, and the connecting column 53 drives the guide mold 12 to move upward, so that the photosensitive chip 100 on the guide mold 12 abuts against the lower surface of the baffle 13, that is, the elastic force of the third spring 522 and the calibration of the lower surface of the baffle 13 are used to improve the position stability and positioning accuracy of the photosensitive chip 100 at the work station.

[0088] Power-on test and photosensitivity test: The turntable 30 rotates to move the multiple photosensitive chips 100 on the test carrier 50 to the test station 60. The light hole 132 of the baffle 13 is located directly below the light cylinder 34 (at this time, the photosensitive chip 100 of the guide mold 12 has been attached to the lower surface of the baffle 13 under the elastic force of the third spring 522). The first servo motor 37 is started, and the first servo motor 37 drives the upper floating block 32 and the lower floating block 33 to move closer to each other through the linkage structure. The PCB test card 35 of the lower floating block 33 that moves upward abuts against the lower probe 156. The lower floating block 33 moves toward the movable seat through the lower probe 156. 152 and the upper probe 155 apply an upward force (the second spring 1523 is compressed and accumulates elastic force), so that the movable seat 152 and the upper probe 155 move upward, and the upward-moving syringe 1552 performs adaptive adjustment of its own height position according to the contact height position of the photosensitive chip 100, so that each syringe 1552 can more gently abut against different contacts of the photosensitive chip 100. At the same time, the lower floating block 33 and the light cylinder 34 move downward, and the lower end face of the light-shielding sleeve 341 performs adaptive adjustment of its own height position according to the height position of the upper surface of the baffle 13, so that the light-shielding sleeve 341 more gently abuts against the upper surface of the baffle 13.

[0089] After the test of a single photosensitive chip 100 is completed, the second servo motor 51 drives the connecting column 53 and the guide mold 12 to rotate an angle through the rotating shaft 52, so that the untested photosensitive chip 100 on the other guide mold 12 is rotated to just below the light-through hole 132. During this process, the guide mold 12 first descends and then rises, and the gravity of the photosensitive chip 100 is not enough to overcome the damping force of the syringe 1552. Therefore, the photosensitive chip 100 cannot move downward with the guide mold 12 under the support of the syringe 1552. Since the supporting plate 122 has a certain height and the descending amount of the supporting plate 122 is small, even after the supporting plate 122 moves downward, the photosensitive chip 100 is still located in the mold cavity 121. Therefore, the circumferentially moving supporting plate 122 can still drive the photosensitive chip 100 to change its position circumferentially. After the untested photosensitive chip 100 of the new guide mold 12 is rotated to just below the light-through hole 132, and the untested The contact of the test photosensitive chip 100 contacts the syringe 1552. Furthermore, considering that the circumferentially moving photosensitive chip 100 may touch the syringe 1552 and change the original height position of the syringe 1552, in order to ensure the contact effect of the syringe 1552 on the contact of the photosensitive chip 100, it is necessary to start the first servo motor 37 again. The first servo motor 37 drives the upper floating block 32 and the lower floating block 33 to approach each other by a small distance through the linkage structure, so that each syringe 1552 continues to move upward to ensure stable power supply to each syringe 1552. At the same time, due to the damping cooperation between the light shielding sleeve 341 and the light cylinder 34, when the light cylinder 34 moves downward, the downward pressure of the light cylinder 34 is transmitted to the baffle 13 through the light shielding sleeve 341. The value is small, that is, it will not interfere with the baffle 13. After the test is completed, the above action is continued to complete the test of all photosensitive chips 100.

[0090] Finally, the first servo motor 37 is started, so that the upper floating block 32 and the lower floating block 33 move away from each other, and the needle cylinder 1552 and the light shielding sleeve 341 move to reset.

[0091] In summary, by setting the second servo motor 51, the rotating shaft 52, the third spring 522, the connecting column 53 and the sleeve 55, the batch placement of multiple photosensitive chips 100 and the batch testing of multiple photosensitive chips 100 can be achieved, which can greatly improve the detection efficiency. Moreover, when multiple photosensitive chips 100 switch the detection station (when they move to the bottom of the light-through hole 132 in turn), combined with the reference fit of the lower surface of the baffle 13 and the damping sliding abutment of the syringe 1552, the tedious and repeated positioning of multiple photosensitive chips 100 can be eliminated. It is only necessary to continue to move the syringe 1552 up a short distance to compensate for the positioning error, and also reduce the pressure damage to the photosensitive chip 100.

[0092] Furthermore, by setting the inclination angles at different positions of the guide groove 551, when the inclination angle is larger, the connecting column 53, the guide mold 12 and the photosensitive chip 100 descend faster, and can separate from the lower surface of the baffle 13 faster; and when the inclination angle is smaller, the connecting column 53, the guide mold 12 and the photosensitive chip 100 rise slower, and the photosensitive chip 100 will abut against the lower surface of the baffle 13 more gently, thereby reducing the vibration force on the photosensitive chip 100 and further reducing the structural damage to the photosensitive chip 100.

[0093] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A photosensitive chip detection mechanism, characterized in that: The invention comprises a frame (10), a turntable (30), a test carrier (50), and a test station (60), wherein the turntable (30) is rotatably arranged on the frame (10), and the test carrier (50) is provided in a plurality and is installed at the outer diameter of the turntable (30); the test carrier (50) comprises a fixed seat (11), a guide die (12), a floating seat (15), a baffle (13), and a switching component, wherein the fixed seat (11) is fixedly connected to the turntable (30), the guide die (12) is installed in the middle of the fixed seat (11), the guide die (12) has a die cavity (121) for placing a photosensitive chip (100), and the die cavity (121) is arranged through the fixed seat (11), the floating seat (15) is vertically slidably connected to the fixed seat (11), and the floating seat (15) is vertically slidably connected to the fixed seat (11). The top and bottom of the movable seat (15) are respectively provided with an upper probe (155) and a lower probe (156), wherein the upper probe (155) is located directly below the mold cavity (121); the baffle (13) is located above the guide mold (12), the baffle (13) has a through hole (131) and a light hole (132), and the switching component is used to change the relative position between the baffle (13) and the guide mold (12) so that the guide mold (12) is located below the light hole (132) or the through hole (131); the test station (60) comprises a mounting seat (31), an upper floating block (32), a lower floating block (33), a light cylinder (34), a PCB test card (35), a first servo motor (37) and a linkage structure, the mounting seat (3 1) is installed on one side of the frame (10) close to the turntable (30), the upper floating block (32) and the lower floating block (33) are both vertically slidably connected to the mounting seat (31), the light cylinder (34) is installed on the upper floating block (32), and the PCB test card (35) is installed on the lower floating block (33), and the first servo motor (37) drives the upper floating block (32) and the lower floating block (33) to move closer to or away from each other through a linkage structure; when the upper floating block (32) and the lower floating block (33) are relatively close, the PCB test card (35) abuts against the lower probe (156) to drive the upper probe (155) to move upward, so that the upper probe (155) abuts against the lower surface of the photosensitive chip (100), and the photosensitive chip (100) is moved away from the upper floating block (32). The upper surface of the optical chip (100) is attached to the lower surface of the baffle (13), and the photosensitive position of the photosensitive chip (100) is opposite to the light hole (132). At the same time, the upper floating block (32) moves downward to drive the optical cylinder (34) to move downward, so that the tube mouth of the optical cylinder (34) abuts against the upper surface of the baffle (13); the linkage structure includes an upper connecting rod (381), a middle connecting rod (382), a lower connecting rod (383), a lever (384) and an eccentric wheel (385), the eccentric wheel (385) is installed on the output shaft of the first servo motor (37), the lower end of the lower connecting rod (383) is connected to the eccentric wheel (385) through a bearing (386), and the upper end of the lower connecting rod (383) is hingedly connected to the lower floating block (33);The middle portion of the lever (384) is hingedly connected to the mounting seat (31), the upper end of the middle connecting rod (382) is hingedly connected to the lower floating block (33), the lower end of the middle connecting rod (382) is hingedly connected to one end of the lever (384), the other end of the lever (384) is hingedly connected to the lower end of the upper connecting rod (381), and the upper end of the upper connecting rod (381) is hingedly connected to the upper floating block (32).

2. The photosensitive chip detection mechanism according to claim 1, characterized in that: The baffle (13) is slidably connected to the fixed seat (11), and the through hole (131) and the light-through hole (132) are arranged at intervals along the sliding direction of the baffle (13); the switching assembly comprises a top opening structure (22), a first spring (217) and a rocker (21); the middle part of the rocker (21) is rotatably connected to the fixed seat (11), the upper end of the rocker (21) is provided with a waist-shaped hole (214) extending along its own length direction, the lower end of the rocker (21) is fixed with a driven end block (212), and a follower (213) is fixed on one side of the baffle (13). The follower (213) is slidably matched with the waist-shaped hole (214), and the elastic force of the first spring (217) is used to drive the rocker (21) to swing in the positive direction so that the baffle (13) slides to a state where the light-through hole (132) is located directly above the mold cavity (121); the top-opening structure (22) is installed on the frame (10), and the top-opening structure (22) is used to apply an upward force to the driven end block (212) to drive the rocker (21) to swing in the reverse direction, and the rocker (21) swinging in the reverse direction will drive the baffle (13) to slide to a state where the light-through hole (131) is located directly above the mold cavity (121).

3. The photosensitive chip detection mechanism according to claim 1 or 2, characterized in that: The floating seat (15) comprises, from top to bottom, an upper guide seat (151), a movable seat (152), a PCB board (154), and a lower guide seat (153). The upper guide seat (151) and the lower guide seat (153) are both fixedly connected to the fixed seat (11). The movable seat (152) is vertically slidably connected relative to the upper guide seat (151). The PCB board (154) is mounted on the movable seat (152). The upper probe (155) and the lower probe (156) are respectively mounted on the upper and lower surfaces of the PCB board (154).

4. The photosensitive chip detection mechanism according to claim 3, characterized in that: The upper probe (155) and the lower probe (156) are both spring pins.

5. The photosensitive chip detection mechanism according to claim 1, characterized in that: The test station (60) further comprises a voice coil motor (36), the driving direction of the voice coil motor (36) is vertical, the main body of the voice coil motor (36) is mounted on the lower floating block (33), and the PCB test card (35) is fixed to the driving end of the voice coil motor (36).

6. The photosensitive chip detection mechanism according to claim 1 or 5, characterized in that: The floating seat (15) includes an upper guide seat (151), a second spring (1523), a movable seat (152), a PCB board (154), and a lower guide seat (153) from top to bottom. The upper guide seat (151) and the lower guide seat (153) are both fixedly connected to the fixed seat (11). The movable seat (152) is vertically slidably connected relative to the upper guide seat (151). The second spring (1523) is used to force the movable seat (152) to move downward. The PCB board (154) is installed on the movable seat (152). The upper probe (155) and the lower probe (156) are respectively installed on the upper and lower surfaces of the PCB board (154). The upper guide seat (151) is vertically penetrated with a guide hole (1511). The upper The probe (155) comprises a needle body (1551) and a syringe (1552), wherein the syringe (1552) is located in the guide hole (1511), the needle body (1551) is connected to the upper surface of the PCB board (154), and the needle body (1551) penetrates into the syringe (1552), and an elastic contact piece (1553) is integrally formed at the upper end of the needle body (1551), and the elastic contact piece (1553) radially abuts against the inner wall of the syringe (1552), and the lower opening of the guide hole (1511) is provided with a flange (1512) for abutting against the lower end surface of the syringe (1552); the lower vertical damping sliding sleeve of the light cylinder (34) is provided with a light shielding sleeve (341), and the mounting seat (31) is fixed with a reset rod (311) for abutting against the upper end surface of the light shielding sleeve (341).

7. The photosensitive chip detection mechanism according to claim 6, characterized in that: The baffle (13) is fixedly connected to the fixing seat (11), and the switching assembly includes a second servo motor (51), a rotating shaft (52), a third spring (522), a connecting column (53) and a sleeve (55). The second servo motor (51) is installed on the fixing seat (11), and the second servo motor (51) is used to drive the rotating shaft (52) to rotate. The connecting column (53) is connected to the rotating shaft (52) in a vertical sliding and anti-rotation manner. The third spring (522) is used to force the connecting column (53) moves upward, the guide mold (12) is set to be multiple and circumferentially arranged and fixed on the outside of the connecting column (53), the guide mold (12) includes four supporting pieces (122), adjacent supporting pieces (122) are fixedly connected by the second support rod (123), the supporting pieces (122) are used to support the top and bottom of the photosensitive chip (100), and the area enclosed by each supporting piece (122) is the mold cavity (121), and the second servo motor (51) drives each guide mold (12) to move in sequence To the right below the through hole (131) and the light through hole (132); the connecting column (53) is fixed with a circular guide block (532); the sleeve (55) is fixedly connected to the fixing seat (11); the sleeve (55) is sleeved on the outside of the connecting column (53); the inner wall of the sleeve (55) is provided with a circumferentially extending wave-shaped guide groove (551); the guide block (532) and the guide groove (551) are slidably matched; when the guide block (532) moves to the wave shape of the guide groove (551), the guide block (532) is in a sliding engagement with the guide groove (551); When the guide block (532) moves to the crest of the guide groove (551), the guide block (532) does not abut against the inner wall of the crest of the guide groove (551), and the elastic force of the third spring (522) is applied to the guide mold (12) through the connecting column (53), so that the photosensitive chip (100) on the guide mold (12) abuts against the lower surface of the baffle (13).

8. The photosensitive chip detection mechanism according to claim 7, characterized in that: The inclination angle of the portion from the wave crest to the wave trough of the guide groove (551) is greater than the inclination angle of the portion from the wave trough to the wave crest of the guide groove (551).

9. The photosensitive chip detection mechanism according to claim 2, characterized in that: The fixing seat (11) fixes the limiting block (113) and the slide rail (111); a slider (133) is fixed on one side of the baffle (13); the slider (133) and the slide rail (111) are slidably matched; the slider (133) is threadedly connected to the limiting bolt (112); the length direction of the limiting bolt (112) is the sliding direction of the slider (133); and the limiting block (113) is located on a path where the limiting bolt (112) moves along with the slider (133).

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