Integrated high-reliability aging case with super-large-scale channel

Abstract

The invention discloses an integrated high-reliability aging case of a super-large-scale channel. The integrated high-reliability aging case comprises a case body, an aging test daughter board, a fan, a display screen, a drawing structure, an aging mother board, a core control board, a signal driving board, a power panel, a power panel radiator and an AC-DC power converter. Functional modules in the aging case are highly integrated, and when the aging case is used, the connection relation between the functional modules does not need to be changed, and an electric power-assisted plugging tool does not need to be used; only the burn-in parameters need to be set on the case screen or the upper computer, and the burn-in seat is opened to place or replace the burn-in chip, so that the operation is convenient and simple. The method has the advantages of simple operation, no related professional quality requirements for operators, saving of purchase, manpower, time and other costs, reduction of the potential safety hazard of poor contact caused by too many plugging times and increase of the troubleshooting difficulty by opening the aging socket and moving the customized drawing type structural member instead of plugging a connector or a golden finger on an aging function printed board in a traditional aging system, and improvement of the production efficiency. Therefore, the reliability, the safety and the convenience of the system are improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip aging equipment, in particular to an integrated high-reliability aging chassis for ultra-large-scale channels. Background Art

[0002] The existing aging chassis is divided into a high-temperature aging test area and a normal temperature equipment area. The two areas are connected to the connectors through high-density cables resistant to high temperatures, or directly connected through connectors. There are many signal connections between the two areas.

[0003] If cables and connectors are used for connection, the wiring before aging testing will be complicated and prone to errors, which will interfere with signal transmission.

[0004] If connectors or gold fingers are used for connection, as the number of plug-in and unplug times increases, the connectors between boards or the gold fingers and connectors will have poor contact, which will pose a safety hazard during the aging process and increase the difficulty of troubleshooting.

[0005] When there are many signal lines connecting the two zones, the plug-in and pull-out force between the connectors or gold fingers is large, and electric plug-in tools are needed. The system status must be carefully checked and confirmed each time the chip is replaced. Users need to purchase electric plug-in tools separately, and operators are required to have high relevant professional knowledge. Each status check and confirmation wastes a lot of manpower costs. The above reasons limit the number of test channels of the aging test system. The existing aging test system has only 128 or 256 test channels, which cannot perform full-function aging verification tests on the chips to be tested. Therefore, the present invention provides an integrated high-reliability aging chassis with ultra-large-scale channels to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide an integrated high-reliability aging chassis for ultra-large-scale channels to solve the problems in the above-mentioned background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an integrated high-reliability aging chassis with ultra-large-scale channels, comprising a chassis, an aging test sub-board, a fan, a display screen, a pull-out structure, an aging motherboard, a core control board, a signal driver board, a power board, a power board radiator, an AC-DC power converter and a fan at the bottom of the chassis.

[0008] A display screen is embedded in the center of the front face of the chassis, a network port is provided at the lower side of the center of the rear face of the chassis, and electrical interfaces are installed on both sides of the network port. A main power button is installed on the right side of the display screen on the front face of the chassis, a pull-out structure is fixed to the bottom face of the chassis by screws, and a fan is provided on the upper side of the rear face of the chassis;

[0009] An aging test sub-board is installed on the top of the chassis. The aging test sub-board is provided with two symmetrical structures on the left and right, and multiple groups are provided in front and back. A aging seat is installed on each group of aging test sub-boards. An aging motherboard is provided at the lower end of the aging test sub-board inside the top of the chassis, and the aging motherboard is connected to the aging test sub-board through a connector.

[0010] A signal driving board is installed inside the chassis below the old refining motherboard. The signal driving boards are two in a left-right symmetrical structure, and multiple groups are arranged front and back. A power board is installed between each group of the signal driving boards. The core control board is fixed to the old refining motherboard through a connector.

[0011] A chassis bottom cooling fan is installed at the bottom of the chassis. The chassis bottom cooling fan is at the bottom of the power board, and multiple chassis bottom cooling fans are arranged at equal intervals from front to back. An AC-DC power converter is arranged at one side of the chassis bottom cooling fan at the rear end of the chassis bottom.

[0012] As a preferred embodiment of the present invention, the pulling structure includes a lockable telescopic guide rail, a foldable cable management rack, a crossbeam and a tray, both ends of the tray are equipped with lockable telescopic guide rails, a crossbeam is installed on the lockable telescopic guide rail, and a foldable cable management rack is installed on the crossbeam on the left side of the tray.

[0013] As a preferred embodiment of the present invention, the rear end of the foldable cable management rack is rotatably connected to the tray.

[0014] As a preferred embodiment of the present invention, the fans are provided in four groups, and the four groups of fans are aligned with the core control board.

[0015] As a preferred embodiment of the present invention, fans are installed on both sides of the display screen inside the front surface of the chassis, and a heat dissipation window is provided in front of the fan.

[0016] As a preferred embodiment of the present invention, a power supply heat sink is installed on the power supply board.

[0017] As a preferred embodiment of the present invention, a gap is provided at the position of the plug-in connector between the aged motherboard and the aged test daughterboard.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The internal functional modules of the burn-in chassis are highly integrated. When using, there is no need to change the connection relationship between the functional modules or use electric-assisted plug-in tools; you only need to set the burn-in parameters on the chassis screen or the host computer, open the burn-in seat to place or replace the burn-in chip, and the operation is convenient and simple. There is no relevant professional quality requirement for the operator, saving procurement, manpower and time costs.

[0020] 2. By opening the aging socket and moving the customized pull-out structural parts, the connectors or gold fingers on the PCB of the aging function in the traditional aging system are replaced, which can reduce the potential safety hazards of poor contact caused by too many plug-in and unplug times and increase the difficulty of troubleshooting, thereby improving the reliability, safety and convenience of the system.

[0021] 3. One burn-in chassis can provide thousands of test channels, which can meet the full-function burn-in verification of a single ultra-large-scale chip or multiple small chips. The number of test channels can be automatically configured according to the actual test channels required by the chip to be tested.

[0022] 4. One aging chassis can independently complete the whole chip aging process, and can also realize the cascading function of chassis and cabinets through network cables, realizing the flexible configuration function of aging chassis. A single chassis is suitable for small batch chip aging tests in laboratories and early chip development, saving scientific research costs. After cascading, chassis and cabinets are suitable for large-scale chip aging tests, and screen out high-reliability chips for high-end manufacturing fields such as weapons and equipment, precision manufacturing, aerospace, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a rear view of the chassis of the present invention;

[0025] Figure 3 It is a front view of the chassis of the present invention;

[0026] Figure 4 It is a schematic diagram of the structure of the chassis bottom tray of the present invention;

[0027] Figure 5 This is a schematic diagram of the open structure of the drawer structure at the bottom of the chassis of the present invention;

[0028] Figure 6 It is a schematic diagram of the connection structure between the aged motherboard and the aged test daughterboard of the present invention;

[0029] Figure 7 It is a schematic diagram of the connection structure of the core control board, the power board and the signal driving board of the present invention;

[0030] Figure 8 It is a top view of the connection structure between the signal driving board and the power board radiator of the present invention;

[0031] Fig. 9 It is a schematic diagram of the structure of the chassis bottom opening of the present invention.

[0032] In the figure: 1. Chassis; 2. Burn-in test daughter board; 3. Burn-in socket; 4. Fan; 5. Electrical interface; 6. Network port; 7. Display screen; 8. Main power button; 9. Pull-out structure; 91. Telescopic guide rail with lock; 92. Folding cable management rack; 93. Crossbeam; 94. Tray; 10. Fixings; 11. Burn-in motherboard; 12. Core control board; 13. Signal driver board; 14. Power board; 15. Power board radiator; 16. AC-DC power converter; 17. Fan at the bottom of the chassis. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, in the description of the present invention, "first", "second", "third", "fourth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be a direct connection or a connection through an intermediate medium. It can be a connection between the two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The meaning of "plurality" in the present invention is two or more, unless otherwise clearly and specifically limited, they all fall within the scope of protection of the present invention.

[0036] Example 1: Figure 1 , 3 -5. The present invention provides a technical solution: including a chassis 1, an aging test sub-board 2, a fan 4, a display screen 7, a pull-out structure 9, an aging motherboard 11, a core control board 12, a signal driver board 13, a power board 14, a power board radiator 15, an AC-DC power converter 16 and a chassis bottom fan 17.

[0037] A display screen 7 is embedded in the center of the front face of the chassis 1, a network port 6 is provided at the lower side of the center of the rear face of the chassis 1, and electrical interfaces 5 are installed on both sides of the network port 6. A main power button 8 is installed on the right side of the display screen 7 on the front face of the chassis 1, a pull-out structure 9 is fixed to the bottom face of the chassis 1 by screws, and a fan 4 is provided on the upper side of the rear face of the chassis 1;

[0038] An aging test sub-board 2 is installed at the top of the chassis 1. The aging test sub-board 2 is provided with two symmetrical structures on the left and right, and multiple groups are provided in the front and back. An aging seat 3 is installed on each group of aging test sub-boards 2. An aging motherboard 11 is provided at the lower end of the aging test sub-board 2 inside the top of the chassis 1, and the aging motherboard 11 is connected to the aging test sub-board 2 through a connector.

[0039] A signal driving board 13 is installed below the aged motherboard 11 inside the chassis 1. The signal driving boards 13 are two symmetrical structures on the left and right, and multiple groups are arranged in front and back. A power board 14 is installed between each group of signal driving boards 13. The core control board 12 is fixed on the aged motherboard 11 through a connector.

[0040] A chassis bottom cooling fan 17 is installed at the bottom of the chassis 1. The chassis bottom cooling fan 17 is located at the bottom of the power board 14, and multiple chassis bottom cooling fans 17 are arranged at equal intervals from front to back. An AC-DC power converter 16 is provided on one side of the chassis bottom cooling fan 17 at the rear end of the bottom of the chassis 1.

[0041] The pulling structure 9 includes a lockable telescopic guide rail 91, a foldable cable management rack 92, a crossbeam 93 and a tray 94. Lockable telescopic guide rails 91 are installed at both ends of the tray 94, and a crossbeam 93 is installed on the lockable telescopic guide rail 91. A foldable cable management rack 92 is installed on the crossbeam 93 on the left side of the tray 94.

[0042] The rear end of the foldable cable management frame 92 is rotatably connected to the tray 94 .

[0043] In this embodiment, the aging socket is opened and the customized pull-out structure is moved to replace the connectors or gold fingers on the aging function printed circuit board in the traditional aging system, thereby reducing the safety hazards of poor contact caused by too many plugging and unplugging times and increasing the difficulty of troubleshooting, thereby improving the reliability, safety and convenience of the system.

[0044] Example 2: Figure 1 , 3 , 6-9, the present invention provides a technical solution: including a chassis 1, an aging test sub-board 2, a fan 4, a display screen 7, a pull-out structure 9, an aging motherboard 11, a core control board 12, a signal driver board 13, a power board 14, a power board radiator 15, an AC-DC power converter 16 and a chassis bottom fan 17.

[0045] A display screen 7 is embedded in the center of the front face of the chassis 1, a network port 6 is provided at the lower side of the center of the rear face of the chassis 1, and electrical interfaces 5 are installed on both sides of the network port 6. A main power button 8 is installed on the right side of the display screen 7 on the front face of the chassis 1, a pull-out structure 9 is fixed to the bottom face of the chassis 1 by screws, and a fan 4 is provided on the upper side of the rear face of the chassis 1;

[0046] An aging test sub-board 2 is installed at the top of the chassis 1. The aging test sub-board 2 is provided with two symmetrical structures on the left and right, and multiple groups are provided in the front and back. An aging seat 3 is installed on each group of aging test sub-boards 2. An aging motherboard 11 is provided at the lower end of the aging test sub-board 2 inside the top of the chassis 1, and the aging motherboard 11 is connected to the aging test sub-board 2 through a connector.

[0047] A signal driving board 13 is installed below the aged motherboard 11 inside the chassis 1. The signal driving boards 13 are two symmetrical structures on the left and right, and multiple groups are arranged in front and back. A power board 14 is installed between each group of signal driving boards 13. The core control board 12 is fixed on the aged motherboard 11 through a connector.

[0048] A chassis bottom cooling fan 17 is installed at the bottom of the chassis 1. The chassis bottom cooling fan 17 is located at the bottom of the power board 14, and multiple chassis bottom cooling fans 17 are arranged at equal intervals from front to back. An AC-DC power converter 16 is provided on one side of the chassis bottom cooling fan 17 at the rear end of the bottom of the chassis 1.

[0049] There are four groups of fans 4 , and the four groups of fans 4 are aligned with the core control board 12 .

[0050] Fans are installed on both sides of the display screen 7 inside the front surface of the chassis 1, and a heat dissipation window is provided in front of the fan.

[0051] A power heat sink 15 is mounted on the power board 14 .

[0052] A gap is provided between the aged motherboard 11 and the aged test daughterboard 2 at the position of the plug connector.

[0053] In this embodiment, the internal functional modules of the burn-in chassis are highly integrated. When in use, there is no need to change the connection relationship between the functional modules or use electric-assisted plug-in tools; only the burn-in parameters need to be set on the chassis screen or the host computer, and the burn-in seat needs to be opened to place or replace the burn-in chip. The operation is convenient and simple. There is no requirement for the operator's relevant professional quality, saving costs such as procurement, manpower and time.

[0054] Among them: 1. Aging chassis: The chassis has external interfaces of 220V power port and network port. The chassis has built-in AC-DC power converter, aging motherboard, core control board, power board, signal driver board, aging test sub-board, aging socket, heat dissipation device, monitoring and alarm device. The AC-DC power converter, aging motherboard, core control board, power board, signal driver board, heat dissipation device, and monitoring and alarm device are installed inside the chassis. The aging test sub-board and aging socket are placed on the upper surface of the chassis. The aging socket has built-in heating, heat dissipation and temperature acquisition devices to separate the normal temperature area from the high temperature area. Partitioning not only avoids the long-term exposure of the aging printed circuit board to high temperature conditions, resulting in unstable circuit operation, cold soldering or welding fracture; it also reduces the cost of components increased to meet high temperature conditions.

[0055] The 220V mains electricity is converted to 12V DC and duty power by an AC-DC power converter. The rear panel and bottom plate of the chassis are both equipped with heat dissipation devices, which are powered by 12V DC. One form of heat dissipation is air cooling, with air inlets reserved on the left and right sides of the front panel of the chassis, multiple fans installed on the rear panel to draw air out, and multiple fans installed on the bottom plate to blow air upwards, forming a heat dissipation air duct inside the chassis that goes from front to back and from bottom to top. The display is fixed in the middle of the front panel of the chassis, and the 220V power port and network port are on the rear panel of the chassis.

[0056] 2. Old refinery cabinet: The old refinery cabinet can be installed with multiple old refinery chassis, equipped with switches and 220V branch terminals. The network port and switch are used to realize the cascading between chassis, and the 220V branch terminal provides 220V mains power for the chassis. The external interface of the cabinet is 220V power port and network port. The 220V power port is connected to the mains power, and the network port is connected to the computer, which is convenient for the computer to uniformly control the cabinet.

[0057] The chassis is fixed in the cabinet by means of a crossbeam, a locking telescopic rail, a tray and a folding cable management rack. The crossbeam is fixed to the inside of the cabinet vertical beam and is perpendicular to the vertical beam. The locking telescopic rail is fixed inside the groove of the crossbeam to form an integral structure. When the rail is fully folded or extended, it will be locked and cannot be pulled out. It can only be pulled out by pressing the unlock button. The tray is fixed to the inside of the locking telescopic rail with screws, and the plane of the tray is perpendicular to the vertical beam. When the chassis is fixed to the tray, the folding cable management rack is fixed to the cabinet vertical beam on one side, and one end is fixed behind the tray. When the tray is pulled out to move the chassis, the folding cable management rack moves with the tray to prevent the 220V power cord and network cable from being pulled when the tray moves.

[0058] By moving the pull-out structural parts, the aged chassis is automatically locked when it is pulled out or pushed into the limited position of the cabinet to prevent the chassis from sliding out of the cabinet.

[0059] 3. Aging motherboard: The aging motherboard is used for the transfer of 12V power and signals between boards. One side of the motherboard is connected to the core control board, power board, and signal driver board, and the other side is connected to the aging test daughter board. The motherboard is fixed on the top of the chassis. The top of the chassis is hollowed out according to the position of the plug connector of the aging motherboard and the aging test daughter board, so that the plug connector can extend to the upper surface of the chassis. The core control board, power board, and signal driver board are fixed on the lower side of the motherboard.

[0060] The DC 12V power supply is connected to the motherboard to provide working power for the heat dissipation device, and is connected to the core control board, power board, and signal driver board through the connector. Each functional board performs secondary power conversion for internal use, and the power board performs secondary power conversion to provide adjustable core power and auxiliary power for the CPU under test.

[0061] 4. Core control board: used to receive control information from the chassis display or computer, control and collect the working status of the chassis during aging, and transmit the aging working status to the chassis display or computer interface display. The chassis display only controls and displays the working status of a single chassis, and the computer can control and display the working status of cascaded chassis and cabinets. The board has a reserved network port for chassis cascading.

[0062] 5. Power board: Provides a core power supply with adjustable voltage and high current and a variety of auxiliary power supplies for the chip under test. The power board can output 12 adjustable voltage and high current power supplies at the same time, and can also output 2 power supplies in parallel to increase the output current value of a single power supply. The number of power supply outputs on the power board is 6 ≤ a ≤ 12, which meets the power supply requirements of the chip under test with greater power consumption. The following is a case where each 2 power supplies on the power board output 6 power supplies in parallel: core power supply 0.8V-2V, total current 600A. 5 kinds of adjustable auxiliary power supplies, 1.2V adjustable range ±0.3V, total current not less than 50A. 1.8V adjustable range ±0.3V, total current not less than 50A. 2.5V adjustable range ±0.5V, total current not less than 50A. 3.3V adjustable range ±0.5V, total current not less than 50A. 5V adjustable range ±0.5V, total current not less than 50A.

[0063] The power board uses a connector to plug into the motherboard, transmits power to the motherboard, and provides working power to the chip to be burned in through the motherboard and the burn-in test daughter board. Each power board is equipped with an independent heat dissipation device, one of which is a radiator, which cooperates with the cooling fan at the bottom of the chassis to form a good heat dissipation duct.

[0064] 6. Signal driver board: Provides test I / O channels for the chips to be aged. The I / O channel frequency is adjustable, and the frequency of each channel is not less than 100MHz. One way is that a single signal driver board can provide 400 test channels, and a chassis can provide 3200 test channels, which can meet the IO test channel requirements of most chip aging. The core control board can configure the number of channels and channel working status of a single signal driver board.

[0065] 7. Burn-in test daughter board: The burn-in test daughter board is connected to the motherboard through a connector and fixed on the fixture on the upper surface of the chassis. The burn-in socket is installed on the burn-in test daughter board and is used to place the chip to be burned in. The burn-in socket has heating, heat dissipation and temperature collection functions, and can control and collect the temperature of the burn-in chip in real time and accurately. Heating can use resistance wire and TEC, heat dissipation can use air cooling, radiator, water cooling, and temperature collection can use PT1000 and PT100.

[0066] When placing or replacing the aging chip in a single chassis, you only need to unscrew the aging socket to replace the aging chip. When placing or replacing the aging chip in a chassis installed in a cabinet, you only need to press the unlocking key of the locking telescopic rail and pull the rail. When the rail is fully extended, the rail will automatically lock. Open the aging socket to replace the aging chip. After the replacement is completed, you only need to press the unlocking key of the locking telescopic rail and push the rail. When the rail is fully shortened, the chassis is fully pushed into the cabinet and the rail will automatically lock.

[0067] During the burn-in process, users only need to move the guide rail and open the burn-in seat to complete the chip replacement, instead of plugging and unplugging the connectors or gold fingers on the burn-in function printed circuit board, thereby improving the reliability, safety, convenience and service life of the system.

[0068] Monitoring and alarm device: The system consists of a chassis display screen / computer monitor and a main power button. The chassis display screen or the host computer monitor can display the aging status and fault information. The chassis main power button is a two-color indicator light. When the main power is working normally, the button indicator light is green; when the main power is abnormal, the button indicator light is red.

[0069] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. An integrated high-reliability aging chassis with ultra-large-scale channels, comprising a chassis (1), an aging test sub-board (2), a fan (4), a display screen (7), a pull-out structure (9), an aging motherboard (11), a core control board (12), a signal drive board (13), a power board (14), a power board radiator (15), an AC-DC power converter (16) and a chassis bottom fan (17), characterized in that: A display screen (7) is embedded in the center of the front face of the chassis (1); a network port (6) is provided on the lower side of the center of the rear face of the chassis (1); and electrical interfaces (5) are installed on both sides of the network port (6); a main power button (8) is installed on the front face of the chassis (1) on the right side of the display screen (7); a pull-out structure (9) is fixed to the bottom face of the chassis (1) by screws; and a fan (4) is provided on the upper side of the rear face of the chassis (1); An aging test sub-board (2) is installed at the top of the chassis (1), and the aging test sub-board (2) is provided with two symmetrical structures on the left and right, and multiple groups are provided in the front and back, and an aging seat (3) is installed on each group of the aging test sub-board (2). An aging motherboard (11) is provided at the lower end of the aging test sub-board (2) inside the top of the chassis (1), and the aging motherboard (11) is connected to the aging test sub-board (2) through a connector; A signal drive board (13) is installed inside the chassis (1) below the aged motherboard (11). The signal drive boards (13) are two in a left-right symmetrical structure and are provided in multiple groups in the front and back. A power supply board (14) is installed between each group of the signal drive boards (13). The core control board (12) is fixed on the aged motherboard (11) via a connector. A chassis bottom cooling fan (17) is installed at the bottom of the chassis (1), the chassis bottom cooling fan (17) is located at the bottom of the power board (14), and a plurality of chassis bottom cooling fans (17) are arranged at equal intervals from front to back, and an AC-DC power converter (16) is arranged at one side of the chassis bottom cooling fan (17) at the rear end of the bottom of the chassis (1).

2. The integrated high-reliability aging chassis for ultra-large-scale channels according to claim 1, characterized in that: The pull-out structure (9) comprises a lockable telescopic guide rail (91), a foldable cable management rack (92), a crossbeam (93) and a tray (94); the lockable telescopic guide rails (91) are installed at both ends of the tray (94); the crossbeam (93) is installed on the lockable telescopic guide rail (91); and the foldable cable management rack (92) is installed on the crossbeam (93) on the left side of the tray (94).

3. The integrated high-reliability aging chassis for ultra-large-scale channels according to claim 2 is characterized in that: The rear end of the foldable cable management frame (92) is rotatably connected to the tray (94).

4. The integrated high-reliability aging chassis for ultra-large-scale channels according to claim 1, characterized in that: The fans (4) are provided in four groups, and the four groups of fans (4) are aligned with the core control board (12).

5. The integrated high-reliability aging chassis for ultra-large-scale channels according to claim 1, characterized in that: Fans are installed on both sides of the display screen (7) inside the front surface of the chassis (1), and a heat dissipation window is provided in front of the fan.

6. The integrated high-reliability aging chassis for ultra-large-scale channels according to claim 1, characterized in that: A power radiator (15) is installed on the power board (14).

7. The integrated high-reliability aging chassis for ultra-large-scale channels according to claim 1, characterized in that: A gap is provided at the position of the plug connector between the aged motherboard (11) and the aged test daughterboard (2).

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