IC chip automatic testing machine and testing method thereof

Abstract

The invention belongs to the technical field of chip testing, and particularly relates to an IC chip automatic testing machine and a testing method thereof.The IC chip automatic testing machine comprises a testing machine body, two Y-axis rails are symmetrically installed at the left and right positions of the top of the testing machine body, and an X-axis rail is slidably installed at the tops of the two Y-axis rails in the front-back direction; and a fixing plate is mounted on the front side of the X-axis track. Through the arrangement of the supporting spring, after the suction cup on the rubber suction head sucks the chip, the conveying belt can drive the chip to move upwards out of the chip tray, and the supporting spring can be gradually elongated along with the movement of the chip out of the chip tray, so that the metal sheet at the bottom is pushed by the supporting rod to move downwards and reset; and along with the resetting of the metal sheet at the bottom, the rubber suction head also finishes resetting, so that the deformation of the rubber suction head caused by long-time extrusion operation is avoided, and the suction effect of the rubber suction head on the chip is ensured.

Description

Technical Field

[0001] The invention belongs to the technical field of chip testing, and in particular relates to an IC chip automatic testing machine and a testing method thereof. Background Art

[0002] An automatic chip tester, also known as automatic test equipment (ATE), is an automated machine used to verify the functionality, performance, and quality of semiconductor chips.

[0003] When testing a chip, an existing chip automatic tester generally uses a suction head to suck the chip placed in the chip tray, and then places the sucked chip in a designated test station on the chip automatic tester for testing. In the process of the suction head sucking the chip, the suction head generally needs to be pressed tightly on the top of the chip, and then the chip is sucked by the suction force generated by the straw. However, since the suction head is generally made of rubber, the suction head will be deformed during a long period of pressing, resulting in the suction head being unable to completely fit with the chip surface, thereby affecting the suction effect of the suction head on the chip. In addition, due to the differences between the chips themselves, the surface of the chip may also be uneven, which will also affect the suction effect of the suction head on the chip.

[0004] Therefore, it is necessary to invent an IC chip automatic tester and a test method thereof to solve the above problems. Summary of the invention

[0005] In view of the above problems, the present invention provides an IC chip automatic testing machine and a testing method thereof to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an IC chip automatic testing machine, comprising a testing machine body, two Y-axis tracks are symmetrically installed at the left and right positions of the top of the testing machine body, an X-axis track is slidably installed on the top of the two Y-axis tracks along the front-back direction, a fixed plate is installed on the front side of the X-axis track, two vertical conveyor belts are symmetrically installed on the front side of the fixed plate, an air pump is installed on the inner side of the conveyor belt, a straw is vertically fixedly connected to the bottom of the air pump, a visual positioning module is arranged on the front side of the two straws, the visual positioning module is installed on the fixed plate, a retractable rubber suction head is connected to the bottom end of the straw, a metal sheet is fixedly connected to the top and bottom inner walls of the rubber suction head, a plurality of support rods are fixedly connected to the metal sheet at the bottom, The top of the support rod is slidably connected with a connecting rod, which is fixedly connected to the metal sheet on the top, and a supporting spring is connected between the bottom end of the connecting rod and the inside of the support rod. The top of the rubber suction head is fixedly connected with a threaded head, and the bottom opening of the rubber suction head is rotatably connected with a spherical tube, and the bottom end of the spherical tube is fixedly connected with a suction cup, and the top of the spherical tube is fixedly connected with a fixing ring, and the top of the fixing ring is fixedly connected with a plurality of threading rings, and a pull rope is passed between two threading rings located in opposite positions, and the end parts of the plurality of pull ropes are fixedly connected with the same pull rod, and the top of the pull rod is fixedly connected with a circular plate, and a fixing sleeve is slidably sleeved on the pull rod, and a reset spring is connected between the fixing sleeve and the circular plate, and a plurality of fixing rods are fixedly connected between the side surface of the fixing sleeve and the inner wall of the threaded head.

[0007] Furthermore, the metal sheets are ring-shaped, and the sizes of the two metal sheets match the sizes of the inner walls of the top and bottom of the rubber suction head respectively.

[0008] Furthermore, a rubber sealing ring concentric with the suction cup is fixedly connected to the bottom of the suction cup, and a plurality of rubber U-shaped protrusions are distributed in an annular shape on the inner side of the sealing ring. The opening of the U-shaped protrusion is connected to the opening at the bottom of the suction cup, and the height of the U-shaped protrusion matches the height of the sealing ring.

[0009] Furthermore, there is a gap between the bottom of the fixing ring and the metal sheet at the bottom, and an elastic rubber ring is arranged in the gap. The rubber ring is fixedly connected to the top of the metal sheet at the bottom, and the height of the rubber ring is equal to the distance between the fixing ring and the metal sheet at the bottom.

[0010] Furthermore, a fixing ball is slidably sleeved on the pull rod, the fixing ball is rotatably mounted on the inner side of the fixing sleeve, and the bottom end of the return spring is fixedly connected to the top of the fixing ball.

[0011] Furthermore, a chip tray is disposed on the top of the test machine body, a tray bracket is disposed on the bottom of the chip tray, and the tray bracket is fixedly connected to the top of the test machine body.

[0012] Furthermore, a test tray is provided on one side of the chip tray, the test tray is installed on the top of the test machine body, and a plurality of test stations are evenly distributed on the top of the test tray.

[0013] Furthermore, the plurality of support rods are evenly distributed in a ring shape, and the support rods are vertically fixedly connected to a metal sheet at the bottom.

[0014] The present invention also provides a testing method for an IC chip automatic testing machine using any one of the above, the process comprising the following steps: Step 1: Evenly stack the chips to be tested on the chip tray, and then place the chip tray with the stacked chips on the tray support; Step 2: Start the test machine body, so that the two straws move to the top of the chip tray under the cooperation of the X and Y tracks and the visual positioning module. Then, as the conveyor belt drives the air pump and the straws to move downward, the rubber suction head at the bottom of the straw can suck the chip in the chip tray; Step 3: After the rubber suction head completes the suction operation on the chip, the conveyor belt can drive the chip upward and out of the chip tray, and then the X and Y tracks and the visual positioning module can cooperate with each other to move the chip to the specified position on the top of the test tray; Step 4: As the conveyor belt drives the air pump to move upward, the suction tube can drive the rubber suction head and the chip to move downward and finally place them in the test station on the test tray. Then the test machine body can automatically test the chip; Step 5: After the test is completed, the pipette can suck the tested chip out of the test tray and put it back into the chip tray. At this point, the chip test is completed.

[0015] Technical effects and advantages of the present invention: 1. The present invention is provided with a support spring. After the suction cup on the rubber suction head completes the suction operation of the chip, the conveyor belt can drive the chip to move upward out of the chip tray. As the chip moves out of the chip tray, the support spring can gradually extend, thereby pushing the metal sheet at the bottom to move downward and reset through the support rod. As the bottom metal sheet is reset, the rubber suction head is also reset together, thereby avoiding deformation of the rubber suction head due to long-term squeezing operation, and ensuring the suction effect of the rubber suction head on the chip; 2. The present invention is provided with a spherical tube. When the chip surface is uneven or the chip is placed unevenly, as the suction cup contacts the top of the chip, the suction cup can drive the spherical tube to rotate adaptively, so that the suction cup can better fit the top of the chip, ensuring the suction effect of the suction cup on the chip; 3. The present invention is provided with a U-shaped protrusion and a sealing ring. When the suction straw generates suction, the air inside the U-shaped protrusion can also be sucked away, so that multiple U-shaped protrusions can also generate suction on the top of the chip, and then cooperate with the sealing ring to improve the suction effect on the chip. Moreover, since each U-shaped protrusion is independent, each U-shaped protrusion can generate suction on different positions on the top of the chip, thereby improving the stability of the suction cup to the chip, and avoiding the loosening of the chip due to poor sealing of the sealing ring or loose adsorption of a certain U-shaped protrusion and the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a three-dimensional schematic diagram of structures such as a fixed plate, a conveyor belt, a straw, and a visual positioning module in the present invention; Figure 3 It is a three-dimensional schematic diagram of the rubber suction head and the threaded head in the present invention; Figure 4 It is a three-dimensional schematic diagram of the rubber suction head, the threaded head, the suction cup, the sealing ring and the U-shaped protrusion in the present invention; Figure 5 is a three-dimensional cross-sectional view of the rubber suction tip of the present invention; Figure 6 It is a three-dimensional schematic diagram of the structure of the rubber suction head and its inner part in the present invention; Figure 7 It is a three-dimensional schematic diagram of structures such as a suction cup, a spherical tube, a pull rope, a pull rod, a fixing sleeve and a circular plate of the present invention.

[0017] In the figure: 1. test machine body; 2. Y-axis track; 3. X-axis track; 4. fixed plate; 5. conveyor belt; 6. air pump; 7. straw; 8. visual positioning module; 9. rubber suction head; 10. metal sheet; 11. support rod; 12. connecting rod; 13. support spring; 14. threaded head; 15. spherical tube; 16. suction cup; 17. fixing ring; 18. threading ring; 19. pull rope; 20. pull rod; 21. round plate; 22. fixing sleeve; 23. reset spring; 24. fixing rod; 25. sealing ring; 26. U-shaped protrusion; 27. rubber ring; 28. fixing ball; 29. ​​chip tray; 30. tray bracket; 31. test tray; 32. test station. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0019] The present invention provides Figures 1 to 7An IC chip automatic testing machine shown in the figure comprises a testing machine body 1, two Y-axis rails 2 are symmetrically installed at the left and right positions of the top of the testing machine body 1, an X-axis rail 3 is slidably installed on the top of the two Y-axis rails 2 along the front-back direction, a fixed plate 4 is installed on the front side of the X-axis rail 3, two vertical conveyor belts 5 are symmetrically installed on the front side of the fixed plate 4, an air pump 6 is installed on the inner side of the conveyor belt 5, a straw 7 is vertically fixedly connected to the bottom of the air pump 6, a visual positioning module 8 is arranged on the front side of the two straws 7, the visual positioning module 8 is installed on the fixed plate 4, a retractable rubber suction head 9 is connected to the bottom end of the straw 7, a metal sheet 10 is fixedly connected to the top and bottom inner walls of the rubber suction head 9, the metal sheet 10 is annular, and the sizes of the two metal sheets 10 match the sizes of the top and bottom inner walls of the rubber suction head 9, a plurality of support rods 11 are fixedly connected to the metal sheet 10 at the bottom, A connecting rod 12 is slidably inserted at the top of 11, and the connecting rod 12 is fixedly connected to the metal sheet 10 at the top. A supporting spring 13 is connected between the bottom end of the connecting rod 12 and the inside of the supporting rod 11. A threaded head 14 is fixedly connected to the top of the rubber suction head 9, and a spherical tube 15 is rotatably connected to the bottom opening of the rubber suction head 9. A suction cup 16 is fixedly connected to the bottom end of the spherical tube 15, and a fixing ring 17 is fixedly connected to the top of the spherical tube 15. A plurality of threading rings 18 are fixedly connected to the top of the fixing ring 17. A pull rope 19 is inserted between two threading rings 18 located at opposite positions, and a same pull rod 20 is fixedly connected between the ends of the plurality of pull ropes 19. A circular plate 21 is fixedly connected to the top of the pull rod 20, and a fixing sleeve 22 is slidably sleeved on the pull rod 20. A reset spring 23 is connected between the fixing sleeve 22 and the circular plate 21, and a plurality of fixing rods 24 are fixedly connected between the side of the fixing sleeve 22 and the inner wall of the threaded head 14. A chip tray 29 is provided on the top of the test machine body 1, and a tray bracket 30 is provided on the bottom of the chip tray 29. The tray bracket 30 is fixedly connected to the top of the test machine body 1. A test disc 31 is provided on one side of the chip tray 29. The test disc 31 is installed on the top of the test machine body 1, and a plurality of test stations 32 are evenly distributed on the top of the test disc 31. The plurality of support rods 11 are evenly distributed in an annular shape, and the support rods 11 are vertically fixedly connected to the metal sheet 10 located at the bottom. Before testing the chip, the chips to be tested are evenly stacked on the chip tray 29, and then the chip tray 29 with the stacked chips is placed on the tray bracket 30, and then the test machine body 1 is started, so that the two suction pipes 7 move to the top of the chip tray 29 under the cooperation of the X and Y tracks and the visual positioning module 8, and then as the conveyor belt 5 drives the air pump 6 and the suction pipe 7 to move downward, the rubber suction head 9 at the bottom of the suction pipe 7 can suck the chip in the chip tray 29, and the rubber suction head 9 moves downward and passes through the suction cup 1 When the rubber suction head 9 is pressed tightly against the top of the chip, the rubber suction head 9 can gradually shrink and deform due to the squeezing force. As the rubber suction head 9 is gradually squeezed, the bottom of the rubber suction head 9 can drive the metal sheet 10 at the bottom to move upward. As the metal sheet 10 moves upward, the support rod 11 can gradually move upward and cooperate with the connecting rod 12 to squeeze the support spring 13. At the same time, as the metal sheet 10 at the bottom moves upward, the return spring 23 can generate an upward pulling force on the pull rod 20 through the circular plate 21, so that the pull rod 20 can always pass through the pull rope 1 9 pairs of fixing rings 17 generate an upward pulling force. After the suction cup 16 completes the suction operation on the chip, the conveyor belt 5 can drive the chip to move upward out of the chip tray 29. As the chip moves out of the chip tray 29, the support spring 13 can gradually extend, thereby pushing the metal sheet 10 at the bottom to move downward and reset through the support rod 11. As the bottom metal sheet 10 is reset, the rubber suction head 9 is also reset together, thereby avoiding the deformation of the rubber suction head 9 due to long-term extrusion operation, ensuring the suction effect of the rubber suction head 9 on the chip. After the chip is removed from the chip tray 29, the X and Y tracks and the visual positioning module 8 can cooperate with each other to move the chip to the designated position on the top of the test tray 31. As the conveyor belt 5 drives the air pump 6 to move upward, the suction pipe 7 can drive the rubber suction head 9 and the chip to move downward and finally place it in the test station 32 on the test tray 31. Then the test machine body 1 can automatically test the chip. After the test is completed, the suction pipe 7 can suck the tested chip out of the test tray 31 and put it back into the chip tray 29. At this point, the chip test is completed; When the suction cup 16 sucks the chip, since the chip surface may be uneven or the chip is not placed straight, as the rubber suction head 9 drives the suction cup 16 to move downward and contact the top of the chip, the bottom surface of the suction cup 16 cannot keep perfect fit with the top of the chip, which will affect the suction effect of the suction cup 16 on the chip. At this time, by providing the spherical tube 15, when the chip surface is uneven or the chip is placed unevenly, as the suction cup 16 contacts the top of the chip, the suction cup 16 can drive the spherical tube 15 to rotate adaptively, so that the suction cup 16 can better keep fit with the top of the chip, and in the process of the deflection of the suction cup 16, the pull rope 19 can adaptively move in the threading ring 18, so as to meet the deflection requirement of the suction cup 16; When the suction cup 16 sucks up the chip and removes it from the chip tray 29, as the support spring 13 presses the support rod 11 to drive the rubber suction head 9 to reset, the reset spring 23 can be compressed by the circular plate 21 again, and the reset spring 23 can restore the fixing ring 17 to a horizontal state through the pulling force of the pull rod 20 on the pull rope 19.

[0020] like Figure 4 As shown, the bottom of the suction cup 16 is fixedly connected with a rubber sealing ring 25 which is concentric therewith, and a plurality of rubber U-shaped protrusions 26 are distributed in an annular manner inside the sealing ring 25, and the opening of the U-shaped protrusion 26 is connected to the bottom opening of the suction cup 16, and the height of the U-shaped protrusion 26 matches the height of the sealing ring 25; By providing the sealing ring 25, when the suction cup 16 is sucking the chip, when the suction cup 16 is in contact with the top of the chip, the sealing ring 25 can be kept in close contact with the chip, and as the air pump 6 generates suction through the suction pipe 7, the air in the sealing ring 25 can be gradually sucked away, so that the chip can be firmly adsorbed on the bottom of the suction cup 16 under the action of atmospheric pressure; In addition, by providing a plurality of rubber U-shaped protrusions 26, during the process of the sealing ring 25 being fitted together with the top of the chip, the plurality of U-shaped protrusions 26 can also remain in contact with the top of the chip, so that when the straw 7 generates suction, the air inside the U-shaped protrusion 26 can also be sucked away, so that the plurality of U-shaped protrusions 26 can also generate suction on the top of the chip, thereby cooperating with the sealing ring 25 to improve the suction effect on the chip, and since each U-shaped protrusion 26 is independent, each U-shaped protrusion 26 can generate suction on different positions on the top of the chip, thereby improving the stability of the suction of the chip by the suction cup 16, and avoiding the loosening of the chip due to poor sealing of the sealing ring 25 or loose adsorption of a certain U-shaped protrusion 26 on the chip.

[0021] like Figure 5 and Figure 6 As shown, there is a gap between the bottom of the fixing ring 17 and the metal sheet 10 at the bottom, and an elastic rubber ring 27 is arranged in the gap. The rubber ring 27 is fixedly connected to the top of the metal sheet 10 at the bottom, and the height of the rubber ring 27 is equal to the distance between the fixing ring 17 and the metal sheet 10 at the bottom; By providing the rubber ring 27, when the suction cup 16 tilts when sucking the chip, the fixing ring 17 can tilt together with the suction cup 16. At this time, the downwardly tilted side of the fixing ring 17 can squeeze the rubber ring 27. As the rubber ring 27 is squeezed, the rubber ring 27 can push the fixing ring 17 upward. When the chip is sucked up from the suction cup 16 tray by the suction cup 16, the rubber ring 27 can cooperate with the pulling force of the pull rope 19 on the fixing ring 17 so that the fixing ring 17 drives the suction cup 16 and the chip to recover to a horizontal state faster.

[0022] like Figure 7 As shown, a fixed ball 28 is slidably sleeved on the pull rod 20, and the fixed ball 28 is rotatably mounted on the inner side of the fixed sleeve 22, and the bottom end of the return spring 23 is fixedly connected to the top of the fixed ball 28; By providing a fixed ball 28, when the suction cup 16 tilts during the up and down movement of the pull rod 20, the pull rod 20 can drive the fixed ball 28 and the return spring 23 to deflect synchronously under the pulling of the pull rope 19, thereby ensuring that the pulling force generated by the return spring 23 on the pull rope 19 through the pull rod 20 always remains coaxial with the suction cup 16, thereby ensuring the pulling effect of the pull rope 19 on the suction cup 16.

[0023] The present invention also provides a testing method for an IC chip automatic testing machine using any one of the above, the process comprising the following steps: Step 1: Evenly stack the chips to be tested on the chip tray 29, and then place the chip tray 29 with the chips stacked on the tray support 30; Step 2: Start the testing machine body 1, so that the two suction pipes 7 move to the top of the chip tray 29 under the cooperation of the X and Y tracks and the visual positioning module 8, and then as the conveyor belt 5 drives the air pump 6 and the suction pipes 7 to move downward, the rubber suction head 9 at the bottom of the suction pipes 7 can suck the chip in the chip tray 29; Step 3: After the rubber suction head 9 completes the suction operation on the chip, the conveyor belt 5 can drive the chip to move upward out of the chip tray 29, and then the X and Y tracks and the visual positioning module 8 can cooperate with each other to move the chip to the designated position on the top of the test tray 31; Step 4: As the conveyor belt 5 drives the air pump 6 to move upward, the suction tube 7 can drive the rubber suction head 9 and the chip to move downward and finally place them in the test station 32 on the test tray 31, and then the test machine body 1 can automatically perform a test operation on the chip; Step 5: After the test is completed, the pipette 7 can suck the tested chip out of the test plate 31 and put it back into the chip tray 29, and the chip test is now completed.

[0024] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. An IC chip automatic tester, comprising a tester body (1), characterized in that: Two Y-axis rails (2) are symmetrically installed at the left and right positions of the top of the testing machine body (1); an X-axis rail (3) is slidably installed on the top of the two Y-axis rails (2) in the front-to-back direction; a fixed plate (4) is installed on the front side of the X-axis rail (3); two vertical conveyor belts (5) are symmetrically installed on the front side of the fixed plate (4); an air pump (6) is installed on the inner side of the conveyor belt (5); a suction pipe (7) is vertically fixedly connected to the bottom of the air pump (6); a visual positioning module (8) is arranged on the front side of the two suction pipes (7); the visual positioning module (8) is installed on the fixed plate (4); a retractable rubber suction head (9) is connected to the bottom end of the suction pipe (7); a metal sheet (10) is fixedly connected to the top and bottom inner wall of the rubber suction head (9); a plurality of support rods (11) are fixedly connected to the metal sheet (10) at the bottom; a connecting rod (12) is slidably inserted at the top of the support rod (11); the connecting rod (12) is fixedly connected to the metal sheet (10) at the top. A support spring (13) is connected between the bottom end of the connecting rod (12) and the inside of the supporting rod (11); a threaded head (14) is fixedly connected to the top of the rubber suction head (9); a spherical tube (15) is rotatably connected to the bottom opening of the rubber suction head (9); a suction cup (16) is fixedly connected to the bottom end of the spherical tube (15); a fixing ring (17) is fixedly connected to the top of the spherical tube (15); and a plurality of threading rings (18) are fixedly connected to the top of the fixing ring (17). A pull rope (19) is threaded between two threading rings (18) at opposite positions, a pull rod (20) is fixedly connected between the ends of a plurality of pull ropes (19), a round plate (21) is fixedly connected to the top of the pull rod (20), a fixed sleeve (22) is slidably sleeved on the pull rod (20), a return spring (23) is connected between the fixed sleeve (22) and the round plate (21), and a plurality of fixed rods (24) are fixedly connected between the side surface of the fixed sleeve (22) and the inner wall of the threaded head (14).

2. The IC chip automatic tester according to claim 1, characterized in that: The metal sheets (10) are ring-shaped, and the sizes of the two metal sheets (10) match the sizes of the top and bottom inner walls of the rubber suction head (9) respectively.

3. The IC chip automatic testing machine according to claim 2, characterized in that: The bottom of the suction cup (16) is fixedly connected to a concentric rubber sealing ring (25), and a plurality of rubber U-shaped protrusions (26) are distributed in an annular manner inside the sealing ring (25), the opening of the U-shaped protrusion (26) is connected to the bottom opening of the suction cup (16), and the height of the U-shaped protrusion (26) matches the height of the sealing ring (25).

4. The IC chip automatic testing machine according to claim 3, characterized in that: There is a gap between the bottom of the fixing ring (17) and the metal sheet (10) at the bottom, and an elastic rubber ring (27) is arranged in the gap. The rubber ring (27) is fixedly connected to the top of the metal sheet (10) at the bottom, and the height of the rubber ring (27) is equal to the distance between the fixing ring (17) and the metal sheet (10) at the bottom.

5. The IC chip automatic testing machine according to claim 4, characterized in that: A fixed ball (28) is slidably sleeved on the pull rod (20), the fixed ball (28) is rotatably mounted on the inner side of the fixed sleeve (22), and the bottom end of the return spring (23) is fixedly connected to the top of the fixed ball (28).

6. The IC chip automatic tester according to claim 5, characterized in that: A chip tray (29) is arranged on the top of the test machine body (1), a tray support (30) is arranged on the bottom of the chip tray (29), and the tray support (30) is fixedly connected to the top of the test machine body (1).

7. The IC chip automatic testing machine according to claim 6, characterized in that: A test tray (31) is provided on one side of the chip tray (29); the test tray (31) is installed on the top of the test machine body (1); and a plurality of test stations (32) are evenly distributed on the top of the test tray (31).

8. The IC chip automatic tester according to claim 7, characterized in that: The plurality of support rods (11) are evenly distributed in a ring shape, and the support rods (11) are vertically fixedly connected to the metal sheet (10) located at the bottom.

9. A testing method using an IC chip automatic testing machine according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: Step 1: evenly stack the chips to be tested on a chip tray (29), and then place the chip tray (29) with the stacked chips on a tray support (30); Step 2: Start the testing machine body (1), so that the two suction pipes (7) move to the top of the chip tray (29) under the cooperation of the X and Y tracks and the visual positioning module (8), and then as the conveyor belt (5) drives the air pump (6) and the suction pipes (7) to move downward, the rubber suction head (9) at the bottom of the suction pipes (7) can suck the chip in the chip tray (29); Step 3: After the rubber suction head (9) completes the suction operation on the chip, the conveyor belt (5) can drive the chip to move upward out of the chip tray (29), and then the X and Y tracks and the visual positioning module (8) can cooperate with each other to move the chip to a designated position on the top of the test tray (31); Step 4: As the conveyor belt (5) drives the air pump (6) to move upward, the suction tube (7) can drive the rubber suction head (9) and the chip to move downward and finally place them in the test station (32) on the test plate (31), and then the test machine body (1) can automatically perform a test operation on the chip; Step 5: After the test is completed, the pipette (7) can suck the tested chip out of the test plate (31) and put it back into the chip tray (29), and the chip test is now completed.

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