Liquid cooling device, server, heat dissipation control method, system and device and medium

Abstract

The invention discloses a liquid cooling device, a server, a heat dissipation control method, system and device and a medium, and relates to the technical field of server heat dissipation. Compared with an air cooling heat dissipation direct blowing heat dissipation technology, a liquid cooling heat dissipation technology is adopted, heat is more effectively taken away, and the heat dissipation efficiency is high. The liquid cooling pipelines are embedded in the interlayer of the server mainboard, and the liquid cooling pipelines are laid at the positions, corresponding to the server mainboard, of the heating devices, so that the problem that the space is large due to the fact that an independent device occupies the occupied space of the devices on the server mainboard is solved. The regulating valve is controlled by the liquid cooling flow control unit, so that the flow of the cooling liquid input by the cooling liquid inlet pipe of the server system is corresponding to the cooling of the server mainboard and the internal environment of the case, and the reliability of the system is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of server heat dissipation, and in particular to a liquid cooling device, a server, a heat dissipation control method, a system, a device and a medium. Background Art

[0002] Conventional servers use an external fan-blown air cooling method. As the computing power requirements of the server increase, the power consumption of the server operation also increases, resulting in the air cooling method being unable to meet the cooling requirements and reducing the server's operating performance. In addition, since the air cooling device is independent of other hardware in the server, it takes up a lot of extra space in the server.

[0003] Therefore, how to improve the heat dissipation capacity while reducing the occupied server space is an urgent problem to be solved by those skilled in the art. Summary of the invention

[0004] The purpose of the present invention is to provide a liquid cooling device, a server, a heat dissipation control method, a system, a device and a medium to solve the problem that the conventional air cooling heat dissipation method of the server cannot meet the heat dissipation requirements, thereby reducing the operating performance of the server and occupying a large space of the server.

[0005] In order to solve the above technical problems, the present invention provides a liquid cooling device, including a liquid cooling flow control unit, a liquid cooling pipeline and a regulating valve; the liquid cooling pipeline is located in the interlayer of the server motherboard;

[0006] The liquid cooling pipeline is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; the regulating valve is arranged at the cooling liquid inlet of each heating device corresponding to the liquid cooling pipeline; the liquid inlet pipe of the liquid cooling pipeline is connected to the liquid cooling flow control unit;

[0007] The liquid cooling flow control unit is used to obtain the current operating environment temperature of each heating device; determine the corresponding liquid cooling output according to each current operating environment temperature; and control the regulating valve corresponding to each heating device to output each liquid cooling output.

[0008] On the one hand, the interlayer includes multiple partitions; a cavity is formed between adjacent partitions, and a liquid cooling pipe is laid in the cavity; the last partition where the cavity is located is connected to the ground layer of the server motherboard; the first partition where the cavity is located is connected to the layer corresponding to the heat-generating device of the server motherboard; the liquid cooling pipes between the multiple partitions are independently staggered.

[0009] On the other hand, it also includes a temperature sensor; the temperature sensor includes a first temperature sensor and a second temperature sensor;

[0010] The first temperature sensor is placed on the server mainboard close to each heating device;

[0011] The second temperature sensor is placed on the chassis wall of the server close to each heating device;

[0012] The temperature sensor is connected to the liquid cooling flow control unit and is used to send the internal ambient temperature of each heating component and the server to the liquid cooling flow control unit to generate the current operating ambient temperature of each heating component.

[0013] In order to solve the above technical problems, the present invention further provides a server, comprising various heating components, a server mainboard and the above liquid cooling device;

[0014] Each of the heating components is located on the server mainboard;

[0015] The liquid cooling device is located in the interlayer of the server mainboard and is used to dissipate heat for each of the heat generating components.

[0016] In order to solve the above technical problems, the present invention also provides a heat dissipation control method for a server, which is applied to a liquid cooling flow control unit of a liquid cooling device, wherein the liquid cooling device comprises the liquid cooling flow control unit, a liquid cooling pipe and a regulating valve; the liquid cooling pipe is located in the interlayer of the server mainboard; the liquid cooling pipe is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; the regulating valve is arranged at the coolant inlet of each heating device corresponding to the liquid cooling pipe; the liquid inlet pipe of the liquid cooling pipe is connected to the liquid cooling flow control unit; the method comprises:

[0017] Obtain the current operating environment temperature of each heating device;

[0018] Determine the corresponding liquid cooling output according to each of the current operating environment temperatures;

[0019] Control the regulating valves corresponding to the heating devices to output the liquid cooling output.

[0020] On the one hand, determining the corresponding liquid cooling output according to each of the current operating environment temperatures includes:

[0021] Acquire a preset range of operating environment temperature and an indoor temperature; wherein the indoor temperature is within the preset range of the operating environment temperature;

[0022] The processing method of responding to the processing instruction of comparing the current operating environment temperature, the preset range of the operating environment temperature and the indoor temperature includes at least one of the following methods:

[0023] Method 1: Output the information that the liquid cooling output is 0;

[0024] Method 2: outputting information that the liquid cooling output is the first preset liquid cooling output;

[0025] Mode three: outputting information that the liquid cooling output is a second preset liquid cooling output; wherein the second preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output, and the second preset liquid cooling output is greater than the first preset liquid cooling output;

[0026] Mode 4: Outputting information that the liquid cooling output is a third preset liquid cooling output; wherein the third preset liquid cooling output is greater than the second preset liquid cooling output, and the third preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output;

[0027] Among them, the first method is a comparison processing method of the current operating environment temperature with the lower limit value of the preset range of the operating environment temperature and the indoor temperature;

[0028] Mode 2 is a comparison processing mode of the current operating environment temperature, the indoor temperature and a first threshold value, wherein the first threshold value is an average value of a difference between an upper limit value of a preset range of the operating environment temperature and the indoor temperature; the upper limit value is greater than the lower limit value;

[0029] Mode three is a comparison processing mode of the current operating environment temperature, the indoor temperature, the first threshold value and the upper limit value of the preset range of the operating environment temperature;

[0030] Method 4 is a comparison processing method of the current operating environment temperature, the indoor temperature and the upper limit value of the preset range of the operating environment temperature.

[0031] On the other hand, determining the corresponding liquid cooling output according to each of the current operating environment temperatures includes:

[0032] Pre-establishing a first functional relationship between the ambient temperature, the heat of each heating device and the preset liquid cooling output;

[0033] Determine a second threshold value corresponding to the ambient temperature according to the first functional relationship; wherein the second threshold value is used to weigh the turning point of the preset liquid cooling output;

[0034] Outputting at least one of the following results according to the comparison between the current operating environment temperature and the second threshold:

[0035] Result 1: outputting information that the liquid cooling output is the fourth preset liquid cooling output;

[0036] Result 2: The fifth preset liquid cooling output is determined according to the exponential relationship between the operating environment temperature difference exceeding the second threshold and the preset liquid cooling output.

[0037] In order to solve the above technical problems, the present invention also provides a heat dissipation control system of a server, which is applied to a liquid cooling flow control unit of a liquid cooling device, wherein the liquid cooling device comprises the liquid cooling flow control unit, a liquid cooling pipe and a regulating valve; the liquid cooling pipe is located in the interlayer of the server mainboard; the liquid cooling pipe is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; the regulating valve is arranged at the coolant inlet of each heating device corresponding to the liquid cooling pipe; the liquid inlet pipe of the liquid cooling pipe is connected to the liquid cooling flow control unit; the heat dissipation control system comprises:

[0038] An acquisition module is used to obtain the current operating environment temperature of each heating device;

[0039] A determination module, used to determine the corresponding liquid cooling output according to each of the current operating environment temperatures;

[0040] The control module is used to control the regulating valves corresponding to the heating devices to output the liquid cooling output.

[0041] In order to solve the above technical problems, the present invention further provides a heat dissipation control device for a server, comprising:

[0042] Memory for storing computer programs;

[0043] The processor is used to implement the steps of the heat dissipation control method of the server as described above when executing the computer program.

[0044] In order to solve the above technical problems, the present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the heat dissipation control method of the server as described above are implemented. The present invention provides a liquid cooling device, including a liquid cooling flow control unit, a liquid cooling pipe and a regulating valve; the liquid cooling pipe is located in the interlayer of the server motherboard; the liquid cooling pipe is laid through the interlayer at the position of each heating device corresponding to the server motherboard, and is connected to the liquid cooling flow control unit; a regulating valve is set at the coolant inlet of each heating device corresponding to the liquid cooling pipe; the liquid inlet pipe of the liquid cooling pipe is connected to the liquid cooling flow control unit; the liquid cooling flow control unit is used to obtain the current operating environment temperature of each heating device; determine the corresponding liquid cooling output according to each current operating environment temperature; and control the regulating valves set corresponding to each heating device to output each liquid cooling output.

[0045] The beneficial effects of the present invention are that firstly, the liquid cooling technology is more effective in removing heat than the direct blowing technology of air cooling, and the heat dissipation efficiency is higher. Secondly, the present invention embeds the liquid cooling pipe in the interlayer of the server motherboard, and lays the liquid cooling pipe at the position of each heat generating device corresponding to the server motherboard, thereby avoiding the problem of large space caused by the independent device occupying the space occupied by the device on the server motherboard. Finally, the liquid cooling flow control unit controls the regulating valve to achieve the flow of the coolant input by the server system cooling liquid inlet pipe corresponding to the cooling of the server motherboard and the internal environment of the chassis, thereby improving the reliability of the system.

[0046] Secondly, liquid cooling pipes are laid in the cavity between multiple partitions, and the liquid cooling pipes between multiple partitions are staggered independently to avoid the same position of the partition bearing a large pressure on the liquid cooling pipe, and are laid evenly in a staggered manner. At the same time, multiple partitions are used to realize the three-dimensional laying of multi-layer liquid cooling pipes, reduce the area of ​​the interlayer of the mainboard in the horizontal direction, increase the number of liquid cooling pipes in the vertical direction, and improve the liquid cooling heat dissipation efficiency. The temperature sensor collects the temperature value so that the liquid cooling flow control unit generates the current operating environment temperature, so that the temperature value of each heating device is collected more accurately, so that the subsequent generation of the corresponding liquid cooling output is also accurate, and the heat dissipation efficiency is improved. Different temperature gears are calculated by the actual ambient temperature being within the preset range of the room temperature and the preset operating environment to output different coolants to achieve real-time flow regulation. By comparing different temperature gears, the scheme is simple and clear, and the purpose of outputting corresponding coolant heat dissipation for different temperature values ​​is achieved. Another process for determining the preset liquid cooling output is used to determine the mapping relationship formed by different heat characteristics at the temperature thresholds corresponding to different turning points, so that the preset liquid cooling output is output more accurately and the heat dissipation efficiency is improved.

[0047] In addition, the present invention also provides a server, a heat dissipation control method, a system, a device and a medium, which have the same beneficial effects as the above-mentioned liquid cooling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0049] Figure 1 A schematic structural diagram of a liquid cooling device provided by the present invention;

[0050] Figure 2 A side view of a liquid cooling device provided by an embodiment of the present invention;

[0051] Figure 3 A heat dissipation control method for a server provided in an embodiment of the present invention;

[0052] Figure 4 A structural diagram of a heat dissipation control system for a server provided in an embodiment of the present invention;

[0053] Figure 5 A structural diagram of a heat dissipation control device for a server provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0055] The core of the present invention is to provide a liquid cooling device, a server, a heat dissipation control method, a system, a device and a medium to solve the problem that the conventional air cooling method of the server cannot meet the heat dissipation requirements, thereby reducing the operating performance of the server and occupying a large space of the server.

[0056] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0057] A server is a device that provides electronic computing services. According to the current existing structural forms, it can be roughly divided into three categories: tower servers, rack servers, and blade servers. Since servers are large electronic devices with high power consumption, they will generate huge heat when working. At present, most servers use the traditional air cooling method of direct fan blowing. With the continuous iteration and update of servers, the traditional cooling method can no longer meet the server's demand for heat dissipation. Due to the rapid growth of information, the requirements for data computing are high, and the data that needs to be processed is also growing explosively, so the computing power requirements for servers have greatly increased, which has invisibly increased the power consumption of server computing. The most direct manifestation is the generation of a large amount of heat energy. In particular, as the most important component, the motherboard, because it carries the main components of the server such as memory and central processing unit (CPU), has become the main source of heat generation for the server. The increase in heat will lead to unstable performance, and even cause the server performance to decline, and even cause the server to crash in severe cases. Therefore, the large amount of heat generated by the motherboard has caused great pressure on the heat dissipation of the server. If the heat cannot be dissipated quickly and effectively in a timely manner, it will have a serious impact on the performance and service life of the server. The liquid cooling device provided by the present invention solves the above technical problems.

[0058] Figure 1 A schematic diagram of the structure of a liquid cooling device provided by the present invention is shown in FIG. Figure 1 As shown, it includes a liquid cooling flow control unit 1, a liquid cooling pipeline 2 and a regulating valve 3; the liquid cooling pipeline 2 is located in the interlayer of the server mainboard 4;

[0059] The liquid cooling pipe 2 is laid through the interlayer at the position of each heat generating device corresponding to the server mainboard 4, and is connected to the liquid cooling flow control unit 1; the liquid cooling pipe 2 is provided with a regulating valve 3 at the coolant inlet corresponding to each heat generating device; the liquid inlet pipe 5 of the liquid cooling pipe 2 is connected to the liquid cooling flow control unit 1;

[0060] The liquid cooling flow control unit 1 is used to obtain the current operating environment temperature of each heating device; determine the corresponding liquid cooling output according to each current operating environment temperature; and control the regulating valve 3 corresponding to each heating device to output each liquid cooling output.

[0061] Specifically, Figure 2 A side view of a liquid cooling device provided by an embodiment of the present invention, such as Figure 2As shown, the liquid cooling pipe 2 is located in the interlayer of the server mainboard, and the interlayer is in the middle of the server mainboard. The corresponding layer of the upper plate of the server mainboard is the heating device layer 8 where the heating device 6 is set, and the corresponding layer of the lower plate is the grounding layer 9. The liquid cooling device 7 can be a microchannel structure, which is formed by welding a metal cap and a metal structure in the mainboard, providing a substrate, making a pad on the back of the substrate, etching a groove on the back substrate to expose the back, and obtaining an adapter board. The first solder ball is made on the back pad of the substrate, and the microchannel structure is welded on the printed circuit board (PCB) board, and the adapter board is attached to the PCB board to obtain the final structure. It is also possible to lay each liquid cooling pipe in the interlayer around the periphery of each heating device position, and to transmit liquid cooling without affecting the operation of the mainboard. The liquid cooling pipes are all connected to the liquid cooling flow control unit. Here, it can also be that after each liquid cooling pipe is connected to each other, the liquid cooling flow control unit is connected, or each liquid cooling pipe is connected to the liquid cooling flow control unit. It can be set according to actual conditions.

[0062] The liquid cooling pipe is located in the mezzanine of the server motherboard. Considering the space of the mezzanine, other components inside the liquid cooling device can also be placed in the mezzanine, which is not limited here.

[0063] It should be noted that the interlayer may be a uniform interlayer of the same thickness for the server motherboard, or may be an interlayer of different thicknesses for different heating components according to the heat generation and heating frequency, which is not limited here. The number and diameter of the liquid cooling pipes in the interlayers of different thicknesses are also different, and can be set according to the actual situation.

[0064] The liquid cooling pipe is laid through the interlayer at the position of each heat generating device corresponding to the server mainboard. It can be laid around each heat generating device without affecting the control logic of the corresponding server mainboard, or laid at the position corresponding to the gap of each heat generating device corresponding to the server mainboard, etc., which is not limited here.

[0065] In order to control the amount of liquid cooling output of each liquid cooling pipe and the control state of opening and closing, the liquid cooling output of the liquid cooling pipe can be turned off when heat dissipation is not needed, or when the operating environment temperature of each heating device is high, different liquid cooling output amounts can be controlled to achieve the purpose of adjustment at any time. The present invention controls and adjusts at any time through the setting of a regulating valve. The regulating valve here can be set for the total liquid cooling pipe under each heating device, or for each liquid cooling pipe, or for a corresponding regulating valve under all heating devices.

[0066] The liquid inlet pipe in the liquid cooling pipeline is connected to the liquid cooling flow control unit, and the liquid outlet pipe is connected to all liquid cooling pipelines arranged outside the heating device position for outputting liquid cooling.

[0067] The liquid cooling flow control unit is used to determine the liquid cooling output of each heating device according to the current operating environment temperature, and to control the output of each liquid cooling output by the regulating valve set based on different liquid cooling outputs. It should be noted that the current operating environment temperature is directly the command data output by the upper controller, or it can be the real-time temperature of each heating device collected by the device for collecting the ambient temperature, and the real-time temperature is transmitted to the liquid cooling flow control unit. The liquid cooling output corresponding to each heating device is obtained by the calculation process of a specific algorithm through the current operating environment temperature, so as to control the output of the regulating valve to cool the heating device. It should be noted that when to output liquid cooling and how to control the regulating valve are not limited here. It can be that when the current operating environment temperature obtained by the average temperature of all the current heating devices exceeds a certain value, the regulating valve is controlled to open, or when it is less than a certain value, the regulating valve is controlled to close, etc., or the respective regulating valves are effectively controlled to output liquid cooling according to the actual ambient temperature of each heating device.

[0068] in addition, Figure 1 There are four types of heat-generating components in the system, which are of different types and correspond to the control platform, hard disk, central processing unit and memory respectively. There are also other heat-generating components.

[0069] The embodiment of the present invention provides a liquid cooling device, including a liquid cooling flow control unit, a liquid cooling pipeline and a regulating valve; the liquid cooling pipeline is located in the interlayer of the server mainboard; the liquid cooling pipeline is laid at the position of each heating device corresponding to the server mainboard through the interlayer, and is connected to the liquid cooling flow control unit; the liquid cooling pipeline is provided with a regulating valve at the coolant inlet corresponding to each heating device; the liquid inlet pipe of the liquid cooling pipeline is connected to the liquid cooling flow control unit; the liquid cooling flow control unit is used to obtain the current operating environment temperature of each heating device; determine the corresponding liquid cooling output according to each current operating environment temperature; and control the regulating valve corresponding to each heating device to output each liquid cooling output. First, the liquid cooling heat dissipation technology is more effective in taking away heat than the heat dissipation technology of direct blowing of air cooling heat dissipation, and the heat dissipation efficiency is higher. Secondly, the present invention embeds the liquid cooling pipeline in the interlayer of the server mainboard, and lays the liquid cooling pipeline at the position of each heating device corresponding to the server mainboard, thereby avoiding the problem of large space caused by the space occupied by the device on the server mainboard occupied by the independent device. Finally, the liquid cooling flow control unit controls the regulating valve to realize the cooling of the server mainboard and the internal environment of the chassis corresponding to the flow of the coolant input by the cooling inlet pipe of the server system, thereby improving the reliability of the system.

[0070] In some embodiments, the interlayer includes multiple partitions; a cavity is formed between adjacent partitions, and liquid cooling pipes are laid in the cavity; the last partition where the cavity is located is connected to the ground layer of the server motherboard; the first partition where the cavity is located is connected to the layer of the server motherboard corresponding to the heat-generating device; the liquid cooling pipes between the multiple partitions are independently staggered.

[0071] It should be noted that in order to dissipate heat for each heat generating device more quickly in this embodiment, the liquid cooling pipes corresponding to the heat generating devices arranged on the server mainboard can be laid in multiple layers, and the interlayer includes multiple partitions, and a cavity is formed between adjacent partitions, and the liquid cooling pipes are laid in the cavity. With respect to the specific side view of each cavity, from the upper and lower levels of the mainboard, the first partition where the cavity is located is connected to the heat generating device layer, and the last partition where the cavity is located is connected to the ground layer. In order to prevent the partitions from bearing the pressure of each liquid cooling pipe, the liquid cooling pipes in each partition are laid in an independent staggered manner, and the liquid cooling pipes in each layer of partitions are independent of each other.

[0072] This embodiment provides for laying liquid cooling pipes in the cavity between multiple partitions, and the liquid cooling pipes between the multiple partitions are independently staggered to avoid the same position of the partition bearing a large pressure of the liquid cooling pipe, and are evenly laid in a staggered manner. At the same time, multiple partitions are used to achieve three-dimensional laying of multiple layers of liquid cooling pipes, reducing the area of ​​the motherboard interlayer in the horizontal direction, increasing the number of liquid cooling pipes in the vertical direction, and improving the liquid cooling heat dissipation efficiency.

[0073] In some embodiments, a temperature sensor is further included; the temperature sensor includes a first temperature sensor and a second temperature sensor;

[0074] The first temperature sensor is placed on the server mainboard close to each heat generating device;

[0075] The second temperature sensor is placed on the chassis wall of the server close to each heating device;

[0076] The temperature sensor is connected to the liquid cooling flow control unit and is used to send the internal ambient temperature of each heating component and the server to the liquid cooling flow control unit to generate the current operating ambient temperature of each heating component.

[0077] Specifically, two types of temperature sensors are included to collect the temperature of each heat-generating component. The first temperature sensor is located on the server mainboard close to each heat-generating component, occupying the space area of ​​the server mainboard. The second temperature sensor is located on the chassis wall of the server. In addition to collecting the temperature of each heat-generating component, it also corresponds to the overall ambient temperature of the entire server during the entire operation process. The temperature collection through the two temperature sensors is connected to the liquid cooling flow control unit to transmit the actual value of the temperature collection to the liquid cooling flow control unit for processing to obtain the current operating environment temperature.

[0078] It should be noted that the specific locations and specific numbers of the two types of temperature sensors are not limited here, and can be set according to the actual space occupied by the server motherboard, the remaining space except for the heating components, and the arrangement of the heating components on the server motherboard. In addition, the heat dissipation strength of each heating component can also be considered. For example, if the heat dissipation of the CPU is larger than that of the memory, more temperature sensors are required for the CPU, and fewer temperature sensors are set for the memory, so as to more timely and accurately measure the real-time temperature of the heating component that requires more heat.

[0079] The current operating environment temperature corresponding to the liquid cooling flow control unit can be calculated by averaging the temperature sensors corresponding to each heating device, or by comprehensively considering the temperatures collected by all heating devices and the chassis temperature sensors of the server, and measuring the temperature through a specific algorithm. In addition, in the process of collecting temperature, before generating the current operating environment temperature, the initial temperature is pre-processed, which is not limited here.

[0080] The temperature sensor provided in this embodiment collects temperature values ​​so that the liquid cooling flow control unit can generate the current operating environment temperature, so that the temperature values ​​of each heating device can be collected more accurately, so that the corresponding liquid cooling output can be generated accurately, thereby improving the heat dissipation efficiency.

[0081] Furthermore, the present invention also provides a server, comprising various heat generating components, a server mainboard and the above-mentioned liquid cooling device;

[0082] Each heat generating device is located on the server mainboard;

[0083] The liquid cooling device is located in the interlayer of the server motherboard and is used to dissipate heat for various heat-generating components.

[0084] The server of this embodiment is not limited and may be a tower server, a rack server, a blade server, etc. mentioned in the above embodiments, and is not limited here.

[0085] For an introduction to a server provided by the present invention, please refer to the above method embodiment, and the present invention will not be repeated here. It has the same beneficial effects as the above liquid cooling device.

[0086] Furthermore, the present invention also provides a heat dissipation control method for a server. Figure 3 A heat dissipation control method for a server provided in an embodiment of the present invention, such as Figure 3As shown, a liquid cooling flow control unit applied to a liquid cooling device comprises a liquid cooling flow control unit, a liquid cooling pipe and a regulating valve; the liquid cooling pipe is located in the interlayer of the server mainboard; the liquid cooling pipe is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; a regulating valve is arranged at the coolant inlet of each heating device corresponding to the liquid cooling pipe; the liquid inlet pipe of the liquid cooling pipe is connected to the liquid cooling flow control unit; the method comprises:

[0087] S11: Obtain the current operating environment temperature of each heating device;

[0088] S12: Determine the corresponding liquid cooling output according to each current operating environment temperature;

[0089] S13: Control the regulating valves corresponding to the heating devices to output the liquid cooling output.

[0090] Specifically, in step S11, the current operating environment temperature is obtained. It should be noted that the acquisition process can be to collect the temperature value corresponding to each heating device through a temperature sensor, or to collect the temperature value around each heating device based on the temperature value of each heating device itself, so as to obtain the corresponding current operating environment temperature through comprehensive processing. In addition, a subsequent preprocessing process can also be performed on the initial temperature value to generate the corresponding current operating environment temperature.

[0091] It should be noted that the current operating environment temperature can be obtained through processing by other controllers, such as by real-time monitoring of the heating conditions of various areas of the mainboard and transmitting them to the control platform, and the control platform outputs the current operating environment temperature.

[0092] The process of determining the liquid cooling output in step S12 of this embodiment can be realized by calculation by a specific controller in the liquid cooling flow control unit, or by integrating a control platform in the liquid cooling flow control unit, and the control platform makes corresponding coolant flow and temperature control instructions according to the requirements of the continuous operating environment temperature of the server and the corresponding different temperature ranges, and adjusts the coolant flow according to the instructions issued by the control platform. The specific calculation process can be through a function method or through comparison of different temperature ranges, which is not limited here.

[0093] In some embodiments, determining the corresponding liquid cooling output according to each current operating environment temperature includes:

[0094] Obtaining a preset range of operating environment temperature and indoor temperature; wherein the indoor temperature is within the preset range of operating environment temperature;

[0095] The processing method of responding to the processing instruction of comparing the current operating environment temperature, the preset range of the operating environment temperature and the indoor temperature includes at least one of the following methods:

[0096] Method 1: Output the information that the liquid cooling output is 0;

[0097] Method 2: outputting information that the liquid cooling output is the first preset liquid cooling output;

[0098] Mode three: outputting information that the liquid cooling output is a second preset liquid cooling output; wherein the second preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output, and the second preset liquid cooling output is greater than the first preset liquid cooling output;

[0099] Mode 4: outputting information that the liquid cooling output is a third preset liquid cooling output; wherein the third preset liquid cooling output is greater than the second preset liquid cooling output, and the third preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output;

[0100] Among them, the first method is a comparison processing method of the current operating environment temperature with the lower limit of the preset range of the operating environment temperature and the indoor temperature;

[0101] Mode 2 is a comparison processing mode of the current operating environment temperature, the indoor temperature and the first threshold value, the first threshold value is the average value of the difference between the upper limit value of the preset range of the operating environment temperature and the indoor temperature; the upper limit value is greater than the lower limit value;

[0102] Mode three is a comparison processing mode of the current operating environment temperature, the indoor temperature, the first threshold value and the upper limit value of the preset range of the operating environment temperature;

[0103] Method 4 is a comparison processing method of the current operating environment temperature, the indoor temperature and the upper limit value of the preset range of the operating environment temperature.

[0104] Specifically, corresponding to method one, the current operating environment temperature is compared with the lower limit value of the preset range of the operating environment temperature and the indoor temperature. If the current operating environment temperature is greater than the lower limit value of the preset range of the operating environment temperature and is less than the indoor temperature, the liquid cooling output is determined to be 0.

[0105] Corresponding to method 2, the comparison processing method of the current operating environment temperature, indoor temperature and the first threshold value, the first threshold value is the average value of the difference between the upper limit value of the preset range of the operating environment temperature and the indoor temperature; the upper limit value is greater than the lower limit value; if the current operating environment temperature is greater than the indoor temperature and less than the first threshold value, the liquid cooling output is determined to be the first preset liquid cooling output.

[0106] Corresponding to method three, a comparison and processing method of the current operating environment temperature, the indoor temperature, the first threshold value and the upper limit value of the preset range of the operating environment temperature, if the current operating environment temperature is greater than the indoor temperature, and greater than or equal to the first threshold value, and less than or equal to the upper limit value of the preset range of the operating environment temperature, then the liquid cooling output is determined to be the second preset liquid cooling output.

[0107] Corresponding to method four, a comparison processing method of the current operating environment temperature, the indoor temperature and the upper limit value of the preset range of the operating environment temperature, if the current operating environment temperature is greater than the upper limit value of the preset range of the operating environment temperature, and the indoor temperature is a negative value, then the liquid cooling output is determined to be a third preset liquid cooling output; wherein the third preset liquid cooling output is greater than the second preset liquid cooling output, and the third preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output.

[0108] Specifically, the preset range of the operating environment temperature is obtained, including an upper limit and a lower limit, the upper limit is greater than the lower limit. The indoor temperature is usually set to 25°C, and the indoor temperature is within the preset range of the operating environment temperature, where the operating environment temperature is the preset operating environment temperature of the corresponding server.

[0109] If the current operating environment temperature is greater than the lower limit of the preset range of the operating environment temperature and is lower than the indoor temperature, the liquid cooling output is determined to be 0; at this time, it means that the heat dissipation of each heating component is normal and no coolant is needed for heat dissipation, so the coolant does not flow and the regulating valve is closed so as to save energy.

[0110] If the current operating environment temperature is greater than the indoor temperature and less than the first threshold, the liquid cooling output is determined to be the first preset liquid cooling output; the first preset liquid cooling output flows at a normal flow rate for cooling and heat dissipation.

[0111] If the current operating environment temperature is greater than the indoor temperature, and greater than or equal to the first threshold, and less than or equal to the upper limit of the preset range of the operating environment temperature, the liquid cooling output is determined to be the second preset liquid cooling output; at this time, it will be more than the first preset liquid cooling output, and heat will be cooled and dissipated.

[0112] If the current operating environment temperature is greater than the upper limit of the preset range of the operating environment temperature and the indoor temperature is a negative value, the liquid cooling output is determined to be the third preset liquid cooling output; at this time, the flow rate will be much higher than the normal flow rate, which will speed up the cooling and heat dissipation.

[0113] For example, the preset range of the operating environment temperature is 5°C~35°C, and the room temperature of 25°C is taken as an example: ① When it is at 5°C~25°C (room temperature + (maximum operating environment temperature - room temperature) / 2), the coolant flow control unit is closed, and the coolant does not flow into the liquid cooling pipe of the liquid cooling interlayer in the mainboard PCB to save energy; ② When it is at 25°C~30°C, the coolant flow control unit controls the coolant to flow into the liquid cooling pipe of the liquid cooling interlayer in the mainboard PCB at a normal flow rate, and cools down and dissipates the main heat-generating parts of the upper layer of the mainboard PCB and the circuit wiring (layout) components; ③ When it is at 30°C~35°C, the coolant flow control unit controls the coolant to flow into the liquid cooling pipe of the liquid cooling interlayer in the mainboard PCB at a flow rate 1.5 times the normal flow rate, and cools down and dissipates the main heat-generating parts of the upper layer of the mainboard PCB and the layout components; ④ When it is greater than 35°C, the output air temperature of the refrigeration equipment is room temperature-5°C, and the coolant flow control unit controls the coolant to flow into the liquid cooling pipe of the liquid cooling interlayer in the mainboard PCB at a flow rate twice the normal flow rate, and cools down and dissipates the main heat-generating parts of the upper layer of the mainboard PCB and the layout components.

[0114] This embodiment outputs different coolants through different temperature gears calculated when the actual ambient temperature is within a preset range of room temperature and a preset operating environment, thereby achieving real-time flow rate regulation. By comparing different temperature gears, the solution is simple and clear, thereby achieving the purpose of outputting corresponding coolants for heat dissipation at different temperature values.

[0115] In some other embodiments, determining the corresponding liquid cooling output according to each current operating environment temperature includes:

[0116] Pre-establishing a first functional relationship between the ambient temperature, the heat of each heating device and the preset liquid cooling output;

[0117] Determine a second threshold value corresponding to the ambient temperature according to the first functional relationship; wherein the second threshold value is used to weigh the turning point of the preset liquid cooling output;

[0118] Output at least one of the following results based on the comparison between the current operating environment temperature and the second threshold:

[0119] Result 1: outputting information that the liquid cooling output is the fourth preset liquid cooling output;

[0120] Result 2: The fifth preset liquid cooling output is determined according to the exponential relationship between the operating environment temperature difference exceeding the second threshold and the preset liquid cooling output.

[0121] Specifically, corresponding to result one, if the current operating environment temperature is less than or equal to the second threshold, the liquid cooling output is determined to be the fourth preset liquid cooling output.

[0122] Corresponding to result two, if the current operating environment temperature is greater than the second threshold, the fifth preset liquid cooling output is determined according to the exponential relationship between the operating environment temperature difference exceeding the second threshold and the preset liquid cooling output.

[0123] Specifically, since the heat generating device under a certain ambient temperature will increase by 1°C as the temperature rises, the corresponding heat generated is not in direct proportion to the temperature. For example, at 25-28°C, it is in direct proportion. After exceeding 28°C, every 1°C increase, at 29°C, the heat is 100, at 30°C, the heat is 150, at 31°C, the heat is 270, etc., resulting in a low heat dissipation efficiency if the mapping relationship corresponding to the direct proportion is followed. Therefore, this embodiment pre-establishes a first functional relationship between the ambient temperature, the heat of each heat generating device and the preset liquid cooling output. The first functional relationship here can be set by a specific learning model or other mathematical functional relationship, and is not limited here. It is necessary to confirm the second threshold here, which corresponds to the second threshold, which is the temperature threshold corresponding to the switch from a regular positive proportional functional relationship to other regular functional relationships. When the current operating environment temperature is less than or equal to the second threshold, the fourth preset liquid cooling output can continue to be output according to the positive proportional functional relationship. After it is greater than the second threshold, it is necessary to determine the fifth preset liquid cooling output according to the difference in operating environment temperature that exceeds the second threshold, that is, the exponential relationship between the data corresponding to each increase of 1°C and the preset liquid cooling output. The specific formation process of the exponential relationship here is not limited and can be collected by calculation or obtained through a learning model.

[0124] Another process for determining a preset liquid cooling output amount provided in this embodiment is used to determine the preset liquid cooling output amount according to the mapping relationship formed according to different thermal characteristics under the temperature thresholds corresponding to different turning points, so as to output the preset liquid cooling output amount more accurately and improve the heat dissipation efficiency.

[0125] In step S13, the control valves corresponding to the heating devices are controlled to output the respective liquid cooling outputs. In this embodiment, the preset liquid cooling outputs calculated in the above embodiment can be output. In some embodiments, considering that the diameters and quantities of the liquid cooling pipes corresponding to different heating devices are different, the control valves corresponding to the heating devices are controlled to output the respective liquid cooling outputs, including:

[0126] Obtain the number and diameter of the liquid cooling pipes corresponding to each heating device;

[0127] According to the position, quantity and diameter of the liquid cooling pipeline corresponding to each heating device, the regulating valve outputs the liquid cooling output corresponding to each liquid cooling pipeline.

[0128] It should be noted that the number of liquid cooling pipes for different heating devices is set differently. In addition, for heating devices with higher heat dissipation requirements, the diameter of the corresponding liquid cooling pipe is larger than the diameter of the liquid cooling pipe of other devices with lower heat dissipation requirements, and the corresponding laying arrangements are different. Therefore, the opening time of the regulating valve for different heating devices and the size of the corresponding output volume are also different.

[0129] In this embodiment, the liquid cooling output of a heating device can be evenly distributed to the corresponding liquid cooling pipes, or the diameter of the liquid cooling pipe corresponding to the position where the heating device emits heat can be set larger. In this case, the liquid cooling output of the regulating valve controlling the liquid cooling pipe is larger, but it will correspond to the sum of all liquid cooling outputs of the heating device within a certain period of time being the preset liquid cooling output calculated in step S12.

[0130] The present embodiment provides consideration for the thermal characteristics of different heat generating devices and the number and diameter of different liquid cooling pipes, so as to achieve precise heat dissipation and improve heat dissipation efficiency.

[0131] For an introduction to a heat dissipation control method for a server provided by the present invention, please refer to the above method embodiment, which will not be described in detail herein. The method has the same beneficial effects as the above liquid cooling device.

[0132] The above describes in detail various embodiments corresponding to the heat dissipation control method of the server. On this basis, the present invention also discloses a heat dissipation control system of the server corresponding to the above method, which is applied to a liquid cooling flow control unit of a liquid cooling device. The liquid cooling device includes a liquid cooling flow control unit, a liquid cooling pipeline and a regulating valve; the liquid cooling pipeline is located in the interlayer of the server mainboard; the liquid cooling pipeline is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; a regulating valve is provided at the coolant inlet of each heating device corresponding to the liquid cooling pipeline; the liquid inlet pipe of the liquid cooling pipeline is connected to the liquid cooling flow control unit; Figure 4 The structure diagram of a heat dissipation control system of a server provided by an embodiment of the present invention. Figure 4 As shown, the heat dissipation control system of the server includes:

[0133] The acquisition module 11 is used to acquire the current operating environment temperature of each heating device;

[0134] A determination module 12, used to determine the corresponding liquid cooling output according to each current operating environment temperature;

[0135] The control module 13 is used to control the regulating valves corresponding to the heating devices to output the liquid cooling outputs.

[0136] In some embodiments, the determination module 12 includes:

[0137] The first acquisition submodule is used to acquire the preset range of the operating environment temperature and the indoor temperature; wherein the indoor temperature is within the preset range of the operating environment temperature;

[0138] The first response submodule is used to respond to the processing instruction of comparing the current operating environment temperature, the preset range of the operating environment temperature and the indoor temperature, wherein the processing method includes at least one of the following methods:

[0139] Method 1: Output the information that the liquid cooling output is 0;

[0140] Method 2: outputting information that the liquid cooling output is the first preset liquid cooling output;

[0141] Mode three: outputting information that the liquid cooling output is a second preset liquid cooling output; wherein the second preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output, and the second preset liquid cooling output is greater than the first preset liquid cooling output;

[0142] Mode 4: outputting information that the liquid cooling output is a third preset liquid cooling output; wherein the third preset liquid cooling output is greater than the second preset liquid cooling output, and the third preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output;

[0143] Among them, the first method is a comparison processing method of the current operating environment temperature with the lower limit of the preset range of the operating environment temperature and the indoor temperature;

[0144] Mode 2 is a comparison processing mode of the current operating environment temperature, the indoor temperature and the first threshold value, the first threshold value is the average value of the difference between the upper limit value of the preset range of the operating environment temperature and the indoor temperature; the upper limit value is greater than the lower limit value;

[0145] Mode three is a comparison processing mode of the current operating environment temperature, the indoor temperature, the first threshold value and the upper limit value of the preset range of the operating environment temperature;

[0146] Method 4 is a comparison processing method of the current operating environment temperature, the indoor temperature and the upper limit value of the preset range of the operating environment temperature.

[0147] In some other embodiments, the determination module 12 includes:

[0148] A first establishing submodule is used to pre-establish a first functional relationship between the ambient temperature, the heat of each heating device and the preset liquid cooling output;

[0149] A first determination submodule is used to determine a second threshold value corresponding to the ambient temperature according to the first functional relationship; wherein the second threshold value is used to weigh the turning point of the preset liquid cooling output;

[0150] The first output submodule is configured to output at least one of the following results according to the comparison between the current operating environment temperature and the second threshold value:

[0151] Result 1: outputting information that the liquid cooling output is the fourth preset liquid cooling output;

[0152] Result 2: The fifth preset liquid cooling output is determined according to the exponential relationship between the operating environment temperature difference exceeding the second threshold and the preset liquid cooling output.

[0153] Since the embodiments of the system part correspond to the above embodiments, please refer to the description of the embodiments of the method part for the embodiments of the system part, and will not be repeated here.

[0154] For an introduction to a heat dissipation control system for a server provided by the present invention, please refer to the above method embodiment, and the present invention will not be repeated here. It has the same beneficial effects as the above server heat dissipation control method.

[0155] Figure 5 A structural diagram of a heat dissipation control device for a server provided in an embodiment of the present invention, such as Figure 5 As shown, the device comprises:

[0156] A memory 21, used for storing computer programs;

[0157] The processor 22 is used to implement the steps of the heat dissipation control method of the server when executing the computer program.

[0158] The heat dissipation control device for a server provided in this embodiment may include, but is not limited to, a smart phone, a tablet computer, a laptop computer, or a desktop computer.

[0159] Among them, the processor 22 may include one or more processing cores, such as a 4-core processor, an 8-core processor, etc. The processor 22 may be implemented in at least one hardware form of a digital signal processor (DSP), a field-programmable gate array (FPGA), and a programmable logic array (PLA). The processor 22 may also include a main processor and a coprocessor. The main processor is a processor for processing data in the awake state, also known as a CPU; the coprocessor is a low-power processor for processing data in the standby state. In some embodiments, the processor 22 may be integrated with a graphics processing unit (GPU), which is responsible for rendering and drawing the content to be displayed on the display screen. In some embodiments, the processor 22 may also include an artificial intelligence (AI) processor, which is used to process computing operations related to machine learning.

[0160] The memory 21 may include one or more computer-readable storage media, which may be non-transitory. The memory 21 may also include a high-speed random access memory, and a non-volatile memory, such as one or more disk storage devices, flash memory storage devices. In this embodiment, the memory 21 is at least used to store the following computer program 211, wherein, after the computer program is loaded and executed by the processor 22, it can implement the relevant steps of the heat dissipation control method of the server disclosed in any of the aforementioned embodiments. In addition, the resources stored in the memory 21 may also include an operating system 212 and data 213, etc., and the storage method may be temporary storage or permanent storage. Among them, the operating system 212 may include Windows, Unix, Linux, etc. The data 213 may include, but is not limited to, data involved in the heat dissipation control method of the server, etc.

[0161] In some embodiments, the heat dissipation control device of the server may further include a display screen 23 , an input / output interface 24 , a communication interface 25 , a power supply 26 , and a communication bus 27 .

[0162] Those skilled in the art can understand that Figure 5 The structure shown in the figure does not constitute a limitation on the heat dissipation control device of the server, and may include more or fewer components than those shown in the figure.

[0163] The processor 22 implements the heat dissipation control method for the server provided in any of the above embodiments by calling the instructions stored in the memory 21 .

[0164] For an introduction to a heat dissipation control system for a server provided by the present invention, please refer to the above method embodiment, and the present invention will not be repeated here. It has the same beneficial effects as the above server heat dissipation control method.

[0165] Furthermore, the present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by the processor 22, the steps of the heat dissipation control method of the server as described above are implemented.

[0166] It is understandable that if the method in the above embodiment is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium to execute all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk and other media that can store program codes.

[0167] For an introduction to a computer-readable storage medium provided by the present invention, please refer to the above method embodiment, which will not be described in detail herein. It has the same beneficial effects as the above server heat dissipation control method.

[0168] Furthermore, the present invention also provides a computer program product, including a computer program / instruction, which implements the steps of the heat dissipation control method of the server when the computer program / instruction is executed by a processor.

[0169] For an introduction to a computer program product provided by the present invention, please refer to the above method embodiment, which will not be described in detail herein. It has the same beneficial effects as the above server heat dissipation control method.

[0170] The above is a detailed introduction to a liquid cooling device, server, heat dissipation control method, system, device and medium provided by the present invention. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the embodiments can be referenced to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

[0171] It should also be noted that, in this specification, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

Claims

1. A liquid cooling device, characterized in that: It includes a liquid cooling flow control unit, a liquid cooling pipeline and a regulating valve; the liquid cooling pipeline is located in the interlayer of the server mainboard; The liquid cooling pipeline is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; the regulating valve is arranged at the cooling liquid inlet of each heating device corresponding to the liquid cooling pipeline; the liquid inlet pipe of the liquid cooling pipeline is connected to the liquid cooling flow control unit; The liquid cooling flow control unit is used to obtain the current operating environment temperature of each heating device; determine the corresponding liquid cooling output according to each current operating environment temperature; and control the regulating valve corresponding to each heating device to output each liquid cooling output.

2. The liquid cooling device according to claim 1, characterized in that: The interlayer includes multiple partitions; a cavity is formed between adjacent partitions, and a liquid cooling pipe is laid in the cavity; the last partition where the cavity is located is connected to the ground layer of the server motherboard; the first partition where the cavity is located is connected to the layer corresponding to the heat-generating device of the server motherboard; the liquid cooling pipes between the multiple partitions are independently staggered.

3. The liquid cooling device according to claim 1 or 2, characterized in that: Also includes a temperature sensor; the temperature sensor includes a first temperature sensor and a second temperature sensor; The first temperature sensor is placed on the server mainboard close to each heating device; The second temperature sensor is placed on the chassis wall of the server close to each heating device; The temperature sensor is connected to the liquid cooling flow control unit and is used to send the internal ambient temperature of each heating component and the server to the liquid cooling flow control unit to generate the current operating ambient temperature of each heating component.

4. A server, characterized in that: It comprises various heat generating components, a server mainboard and a liquid cooling device as claimed in any one of claims 1 to 3; Each of the heating components is located on the server mainboard; The liquid cooling device is located in the interlayer of the server mainboard and is used to dissipate heat for each of the heat generating components.

5. A heat dissipation control method for a server, characterized in that: A liquid cooling flow control unit applied to a liquid cooling device, the liquid cooling device comprising the liquid cooling flow control unit, a liquid cooling pipe and a regulating valve; the liquid cooling pipe is located in the interlayer of a server mainboard; the liquid cooling pipe is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; the regulating valve is arranged at the cooling liquid inlet of each heating device corresponding to the liquid cooling pipe; the liquid inlet pipe of the liquid cooling pipe is connected to the liquid cooling flow control unit; the method comprises: Obtain the current operating environment temperature of each heating device; Determine the corresponding liquid cooling output according to each of the current operating environment temperatures; Control the regulating valves corresponding to the heating devices to output the liquid cooling output.

6. The heat dissipation control method of a server according to claim 5, characterized in that: Determining the corresponding liquid cooling output according to each of the current operating environment temperatures includes: Acquire a preset range of operating environment temperature and an indoor temperature; wherein the indoor temperature is within the preset range of the operating environment temperature; The processing method of responding to the processing instruction of comparing the current operating environment temperature, the preset range of the operating environment temperature and the indoor temperature includes at least one of the following methods: Method 1: Output the information that the liquid cooling output is 0; Method 2: outputting information that the liquid cooling output is the first preset liquid cooling output; Mode three: outputting information that the liquid cooling output is a second preset liquid cooling output; wherein the second preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output, and the second preset liquid cooling output is greater than the first preset liquid cooling output; Mode 4: Outputting information that the liquid cooling output is a third preset liquid cooling output; wherein the third preset liquid cooling output is greater than the second preset liquid cooling output, and the third preset liquid cooling output is in a multiple relationship with the first preset liquid cooling output; Among them, the first method is a comparison processing method of the current operating environment temperature with the lower limit value of the preset range of the operating environment temperature and the indoor temperature; Mode 2 is a comparison processing mode of the current operating environment temperature, the indoor temperature and a first threshold value, wherein the first threshold value is an average value of a difference between an upper limit value of a preset range of the operating environment temperature and the indoor temperature; the upper limit value is greater than the lower limit value; Mode three is a comparison processing mode of the current operating environment temperature, the indoor temperature, the first threshold value and the upper limit value of the preset range of the operating environment temperature; Method 4 is a comparison processing method of the current operating environment temperature, the indoor temperature and the upper limit value of the preset range of the operating environment temperature.

7. The heat dissipation control method of a server according to claim 5, characterized in that: Determining the corresponding liquid cooling output according to each of the current operating environment temperatures includes: Pre-establishing a first functional relationship between the ambient temperature, the heat of each heating device and the preset liquid cooling output; Determine a second threshold value corresponding to the ambient temperature according to the first functional relationship; wherein the second threshold value is used to weigh the turning point of the preset liquid cooling output; Outputting at least one of the following results according to the comparison between the current operating environment temperature and the second threshold: Result 1: outputting information that the liquid cooling output is the fourth preset liquid cooling output; Result 2: The fifth preset liquid cooling output is determined according to the exponential relationship between the operating environment temperature difference exceeding the second threshold and the preset liquid cooling output.

8. A heat dissipation control system for a server, characterized in that: A liquid cooling flow control unit applied to a liquid cooling device, the liquid cooling device comprising the liquid cooling flow control unit, a liquid cooling pipe and a regulating valve; the liquid cooling pipe is located in the interlayer of the server mainboard; the liquid cooling pipe is laid through the interlayer at the position of each heating device corresponding to the server mainboard, and is connected to the liquid cooling flow control unit; the regulating valve is arranged at the cooling liquid inlet of each heating device corresponding to the liquid cooling pipe; the liquid inlet pipe of the liquid cooling pipe is connected to the liquid cooling flow control unit; the heat dissipation control system comprises: An acquisition module is used to obtain the current operating environment temperature of each heating device; A determination module, used to determine the corresponding liquid cooling output according to each of the current operating environment temperatures; The control module is used to control the regulating valves corresponding to the heating devices to output the liquid cooling output.

9. A heat dissipation control device for a server, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the heat dissipation control method for a server as described in any one of claims 5 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the heat dissipation control method for a server according to any one of claims 5 to 7 are implemented.

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