Liquid cooling module, server, and server control method

Abstract

The present application discloses a liquid cooling module, a server and a control method for the server, and relates to the field of server technology. The liquid cooling module includes a liquid cooling plate, a connecting pipe, a detection component, a control valve and a controller. The liquid cooling plate is connected to the preset components of the server. The connecting pipe is connected to the liquid cooling plate to keep the coolant flowing, and cools the preset components, thereby improving the heat dissipation effect and the heat dissipation utilization rate of the coolant. Under the condition of meeting the heat dissipation requirements, the operating power consumption of the server and the performance of the server are improved by the flow of the coolant. The control valve and the pressure detector are arranged on the connecting pipe, and the leakage detector is arranged on the liquid cooling plate to monitor the coolant and reduce the probability of leakage of the liquid cooling module. The detection component and the control valve are both electrically connected to the controller to realize the adaptive operation of the server, so that the server maintains a stable operating state, prevents the temperature of the preset components from being too high, and reduces the impact of the temperature rise of the preset components on the operating power consumption and operating performance of the server.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a liquid cooling module, a server, and a control method for the server. Background Art

[0002] A server is a device used to provide data processing. The performance of the server is closely related to the temperature of the electronic components within the server.

[0003] In the related art, the server dissipates heat from internal electronic components in the form of air cooling. This cooling method increases the power consumption of the server, making it difficult to improve the performance of the server. Summary of the Invention

[0004] The present application provides a liquid cooling module, a server, and a method for controlling the server, so as to at least solve the problem in the related art that it is difficult to improve the performance of the server.

[0005] In a first aspect, the present application provides a liquid cooling module, comprising:

[0006] Liquid cooling plate, which is used to dissipate heat from the server's pre-set components;

[0007] A connecting pipe, the connecting pipe is arranged on the liquid cooling plate;

[0008] A detection component is provided on the connecting pipe to obtain the current liquid cooling information of the liquid cooling module; the detection component includes a pressure detector and a liquid leakage detector. The pressure detector is provided on the connecting pipe downstream of the liquid cooling module, and the liquid leakage detector is provided on the liquid cooling plate;

[0009] A control valve is provided on the connecting pipe upstream of the liquid cooling module and is used to adjust the operating parameters of the liquid cooling module;

[0010] The controller is electrically connected to the detection component and the control valve respectively; the controller is used to obtain current component information of a preset component; when the current component temperature is greater than or equal to the preset temperature, and / or the current component power is greater than or equal to the preset power, the current liquid cooling information of the liquid cooling module is obtained, and the operating parameters of the server are adjusted according to the current component information and the current liquid cooling information.

[0011] In the present application, the liquid cooling module includes a liquid cooling plate, which is connected to the preset components of the server so as to dissipate heat to the preset components through the coolant in the liquid cooling plate, thereby reducing the temperature of the preset components. Since the liquid cooling plate is connected and in contact with the preset components, the contact area between the preset components and the liquid cooling plate is increased, thereby improving the heat dissipation efficiency of the preset components and further improving the operating efficiency of the server. By connecting the connecting pipe and the liquid cooling plate, the coolant is kept in a flowing state, which can continuously cool the preset components to improve the heat dissipation effect of the preset components and improve the heat dissipation utilization rate of the coolant. Under the condition of meeting the same heat dissipation requirements, the operating power consumption of the server and the performance of the server can be improved through the flow of the coolant. Furthermore, the pressure detection part in the detection component is arranged on the connecting pipe, and the leakage detector is arranged on the liquid cooling plate, and is used to perform pressure detection and leakage detection on the flow of the coolant in the liquid cooling module to avoid the increase in the operating power consumption of the server and the deterioration of safety caused by coolant leakage. The control valve is arranged on the connecting pipe. The control valve and the detection component are electrically connected to the controller, which can realize adaptive real-time adjustment and adaptive operation of the server, so that the server maintains a stable operating state, thereby preventing the preset components from being too hot, and reducing the impact of the temperature rise of the preset components on the server's operating power consumption and operating performance. At the same time, when the coolant leaks, it can respond in time and control the operating parameters of the liquid cooling module, reduce the impact of the leaked coolant on the preset components of the server, and improve the safety of the server.

[0012] In a second aspect, the present application provides a server comprising the liquid cooling module provided in the first aspect.

[0013] The server in this application, because it includes the liquid cooling module provided in the first aspect, can improve the operating performance of the server.

[0014] In a third aspect, the present application provides a server control method, which is applied to the server provided in the second aspect, and the method includes:

[0015] Obtain current component information of preset components in the server, including component temperature and component power;

[0016] When the current component temperature is greater than or equal to a preset temperature, and / or the component power is greater than or equal to a preset power, obtaining current liquid cooling information of a liquid cooling module in the server, the liquid cooling module being used to adjust the temperature of the preset component;

[0017] Determine the target operating parameters of the server based on current component information and current liquid cooling information;

[0018] Adjust the server's operating parameters to the target operating parameters.

[0019] The control method in the present application is applied to the server in the second aspect. Through such a control method, the server combines the current component information of the preset components and the current liquid cooling information of the preset components, and combines the different operating goals of the server to autonomously regulate the operating status of the server, ensuring that the server can maintain stable operating temperature, operating power consumption and operating performance under different operating goals, thereby improving the server's performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0021] Figure 1 A schematic diagram of a liquid cooling module provided in an embodiment of the present application;

[0022] Figure 2 A schematic diagram of a liquid cooling module provided in an embodiment of the present application;

[0023] Figure 3 A schematic diagram of a server provided in an embodiment of the present application Figure 1 ;

[0024] Figure 4 A control diagram of a server provided in an embodiment of the present application Figure 1 ;

[0025] Figure 5 A control diagram of a server provided in an embodiment of the present application Figure 2 ;

[0026] Figure 6 A schematic diagram of a server control method provided in an embodiment of the present application;

[0027] Figure 7 A schematic diagram of a server provided in an embodiment of the present application Figure 2 ;

[0028] Figure 8 A schematic diagram of a server provided in an embodiment of the present application Figure 3 ;

[0029] Figure 9 A schematic diagram of an electronic device provided in an embodiment of the present application.

[0030] The above drawings include the following reference numerals:

[0031] 100-Liquid Cooling Module;

[0032] 110 - liquid cooling plate; 111 - first liquid cooling plate; 112 - second liquid cooling plate; 113 - third liquid cooling plate; 114 - fourth liquid cooling plate; 115 - fifth liquid cooling plate;

[0033] 120 - connecting pipe; 120a - first connecting pipe 1; 120b - first connecting pipe 2; 120c - first connecting pipe 3; 120d - first connecting pipe 4;

[0034] 121-second connecting pipe; 1211-first adapter;

[0035] 122-third connecting pipe; 1221-second adapter;

[0036] 130-controller;

[0037] 140a-temperature detector 1; 140b-temperature detector 2;

[0038] 150-flow detector;

[0039] 160-pressure detector;

[0040] 170-leakage detector;

[0041] 180-control valve;

[0042] 190- one-way valve;

[0043] 200-server;

[0044] 210-preset components; 220-cooling distribution unit; 230-baseboard management controller; 240-switch;

[0045] 500-electronic equipment;

[0046] 501 - processor; 502 - memory; 503 - communication component. DETAILED DESCRIPTION

[0047] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0048] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0049] As a data processing device, servers offer high performance. They include pre-defined components, such as the central processing unit (CPU), graphics processing unit (GPU), and power supply unit (PSU). These pre-defined components often generate heat during operation, which raises the overall server temperature, reducing operational efficiency and increasing power consumption, leading to poor performance.

[0050] In the related art, vents are often set on the chassis of the server, and fans are set at the vents. The rotation of the fans allows air to flow inside the chassis of the server. During the flow, the air exchanges heat with the preset components to take away the heat of the preset components, thereby reducing the temperature of the preset components of the server and improving the performance of the server.

[0051] However, for large servers, air cooling is not effective. To improve the cooling effect, the number of fans needs to be increased. However, as the number of fans increases, the fans need to be electrically connected to the server's power supply, which increases the server's operating power consumption and deteriorates its performance.

[0052] Therefore, combined Figure 1 and Figure 2 As shown, the present application provides a liquid cooling module 100, which includes a liquid cooling plate 110. The liquid cooling plate 110 is connected to a preset component 210 of a server 200 so that the coolant in the liquid cooling plate 110 dissipates heat from the preset component 210, thereby reducing the temperature of the preset component 210. Since the liquid cooling plate 110 is connected and in contact with the preset component 210, the contact area between the preset component 210 and the liquid cooling plate 110 is increased, thereby improving the heat dissipation efficiency of the preset component 210 and further improving the operating efficiency of the server 200. The provision of the liquid cooling plate 110 can also reduce the operating power consumption of the server 200, thereby improving the performance of the server 200.

[0053] For example, the cooling liquid flowing in the liquid cooling plate 110 may be water, refrigerant, etc., which is not limited in the embodiment of the present application.

[0054] In some embodiments, the liquid cooling module 100 further includes a connecting pipe 120, which is disposed on the liquid cooling plate 110 so that the coolant flows between the connecting pipe 120 and the liquid cooling plate 110. Thus, by connecting the connecting pipe 120 and the liquid cooling plate 110, the coolant remains in a flowing state, which can continuously cool the preset component 210, thereby improving the heat dissipation effect of the preset component 210 and increasing the heat dissipation utilization rate of the coolant. Under the condition of meeting the same heat dissipation requirements, the flow of the coolant can improve the operating power consumption and performance of the server 200.

[0055] The installation positions of the preset components 210 in the server 200 sometimes cannot be concentrated in the same installation area. That is, the preset components 210 are relatively dispersed in the chassis, and using the same liquid cooling plate 110 to dissipate heat for all preset parts can no longer meet the heat dissipation requirements of each preset component 210.

[0056] Therefore, in some embodiments, there are multiple liquid cooling plates 110 and multiple connecting pipes 120 , and the multiple connecting pipes 120 include a first connecting pipe; the first connecting pipes are respectively connected to different liquid cooling plates 110 .

[0057] See Figure 1 For example, the number of liquid cooling plates 110 may be five. To facilitate the understanding of the technical solution in the present application by those skilled in the art, the embodiment of the present application defines the five liquid cooling plates 110 as a first liquid cooling plate 111, a second liquid cooling plate 112, a third liquid cooling plate 113, a fourth liquid cooling plate 114 and a fifth liquid cooling plate 115.

[0058] There are four first connecting pipes. In order to facilitate technical personnel in this application to understand the technical solution in this application, the embodiment of this application defines the four first connecting pipes as first connecting pipe 120a, first connecting pipe 2 120b, first connecting pipe 3 120c and first connecting pipe 4 120d.

[0059] The first and third liquid cooling plates 111 and 113 are connected via a first connecting pipe 120a, the third and fourth liquid cooling plates 113 and 114 are connected via a first connecting pipe 120b, the fourth and fifth liquid cooling plates 114 and 115 are connected via a first connecting pipe 120c, and the fifth and second liquid cooling plates 115 and 112 are connected via a first connecting pipe 120d. Thus, each of the liquid cooling plates 110 is connected via the first connecting pipes to form a coolant flow path.

[0060] In some embodiments, the liquid cooling plate 110 may be provided in a one-to-one correspondence with the preset components 210 , or multiple preset components 210 may be connected to the same liquid cooling plate 110 . This embodiment of the present application does not make specific requirements for this.

[0061] It should be noted that the first connecting pipe can be a flexible pipe, so that the two ends of the first connecting pipe can be connected to different liquid cooling plates 110. This also facilitates the piping layout of the cooling module in the chassis of the server 200, avoids interference between the first connecting pipe and other components in the chassis, and facilitates the assembly of the server 200, thereby improving the installation efficiency of the server 200. Of course, it can also prevent the first connecting pipe from getting stuck, allowing the coolant to flow smoothly between the liquid cooling plate 110 and the connecting pipe 120, thereby reducing the flow pressure of the coolant and reducing the operating power of the server 200.

[0062] See Figure 1 In some embodiments, the multiple liquid cooling plates 110 include a first liquid cooling plate 111, which is located upstream of the liquid cooling module 100; the multiple connecting pipes 120 include a second connecting pipe 121, one end of the second connecting pipe 121 is connected to the first liquid cooling plate 111, and the other end of the second connecting pipe 121 is provided with a first adapter 1211, which is used to connect to the liquid outlet end of the cooling liquid tank of the server 200.

[0063] It can be understood that the first liquid cooling plate 111 is located upstream of the liquid cooling module 100. The low-temperature coolant first enters the first liquid cooling plate 111 through the second connecting pipe 121. The temperature gradient between the coolant and the preset component 210 is relatively large, and heat exchange can occur rapidly between the coolant and the preset component 210, thereby quickly reducing the temperature of the preset component 210 and achieving rapid cooling of the preset component 210, thereby improving the heat dissipation efficiency of the server 200. The coolant continues to flow in the liquid cooling module 100 and sequentially cools the remaining preset components 210 in the server 200, which can improve the utilization rate of the coolant and reduce the operating power consumption of the server 200.

[0064] It is easy to understand that by placing the first liquid cooling plate 111 upstream of the liquid cooling module 100 , the heat generated by the preset component 210 in the server 200 can be quickly dissipated, thereby improving the performance of the server 200 .

[0065] In the embodiment of the present application, the first liquid cooling plate 111, the third liquid cooling plate 113, the fourth liquid cooling plate 114, the fifth liquid cooling plate 115 and the second liquid cooling plate 112 are connected in series in sequence through the first connecting pipe, which can achieve heat dissipation for multiple preset components 210 with different heat levels, improve the utilization rate of the coolant, reduce the operating power consumption of the server 200, and improve the performance of the server 200.

[0066] It should be noted that the first adapter 1211 in the embodiment of the present application can be a quick connector and / or a blind plug connector, etc., so that the compatibility of the liquid cooling module 100 is enhanced, and it is convenient for the second connecting pipe 121 to be adapted and connected to the outlet end of the cooling liquid tank of different servers 200 through the first adapter 1211.

[0067] See Figure 1 The multiple liquid cooling plates 110 include a second liquid cooling plate 112, which is located downstream of the liquid cooling module 100; the multiple connecting pipes 120 include a third connecting pipe 122, one end of the third connecting pipe 122 is connected to the second liquid cooling plate 112, and the other end of the third connecting pipe 122 is provided with a second adapter 1221, which is used to connect to the return liquid end of the cooling liquid tank of the server 200.

[0068] It is not difficult to understand that the second liquid cooling plate 112 is located downstream of the liquid cooling module 100, and the coolant in the liquid cooling module 100 is led out through the third connecting pipe 122. In this way, the second liquid cooling plate 112 can also cool the preset components 210 in the server 200, thereby improving the heat dissipation utilization rate of the coolant. At the same time, the led-out coolant returns to the coolant tank to ensure smooth circulation of the coolant, avoid the retention of coolant in the liquid cooling module 100, improve the heat dissipation effect of the liquid cooling module 100 on the preset components 210 of the server 200, and reduce the operating energy consumption of the server 200.

[0069] It should be noted that the second adapter 1221 in the embodiment of the present application can be a quick connector and / or a blind plug connector, etc., so that the compatibility of the liquid cooling module 100 is enhanced, and it is convenient for the third connecting pipe 122 to be adapted and connected to the outlet end of the cooling liquid tank of different servers 200 through the second adapter 1221.

[0070] It should be noted that, in some embodiments, the first adapter 1211 and the second adapter 1221 can be the same quick connector or the same blind-plug connector. Alternatively, one of the first adapter 1211 and the second adapter 1221 is a quick connector and the other is a blind-plug connector. In this way, the liquid cooling module 100 can be compatible with different servers 200 through the first adapter 1211 and the second adapter 1221, which facilitates the assembly of the liquid cooling module 100 and the server 200, improves the assembly efficiency of the liquid cooling module 100 and the server 200, and facilitates the maintenance of the liquid cooling module 100 and the server 200, reducing the maintenance difficulty and cost of the liquid cooling module 100 and the server 200.

[0071] In some embodiments, the liquid cooling module 100 further includes a detection component, which is disposed on the connecting pipe 120 and is used to obtain current liquid cooling information of the liquid cooling module 100 .

[0072] It should be noted that the detection component can be electrically connected to the processor of the server 200 so that the processor of the server 200 can obtain the current liquid cooling information of the liquid cooling module 100, which is convenient for understanding the heat dissipation condition of the server 200 and the specific operating conditions of the liquid cooling module 100 based on the current liquid cooling information, and combined with the specific operating conditions of the current preset component 210, the heat dissipation efficiency and operating status of the preset component 210 can be adjusted in a targeted manner to reduce the operating power consumption of the server 200.

[0073] To improve the stability of signal transmission, in the embodiment of the present application, the liquid cooling module 100 further includes a controller 130, which is electrically connected to the detection component. The controller 130 is configured to obtain current component information of a preset component 210. When the current component temperature is greater than or equal to a preset temperature and / or the current component power is greater than or equal to a preset power, the controller 130 obtains the current liquid cooling information of the liquid cooling module 100 in the server 200 and adjusts the operating parameters of the server 200 based on the current component information and the current liquid cooling information. In this way, the liquid cooling module 100 can achieve adaptive real-time adjustment through the controller 130, and achieve adaptive operation of the server 200, so that the server 200 maintains a stable operating state, thereby preventing the temperature of the preset component 210 from being too high and reducing the impact of the temperature rise of the preset component 210 on the operating power consumption and operating performance of the server 200.

[0074] The following describes various assembly structures of the liquid cooling module 100 provided in this application in conjunction with the accompanying drawings and various detection components.

[0075] In some embodiments, the detection component includes a temperature detector, which is disposed on the connecting pipe 120 upstream of the liquid cooling module 100; and / or, the temperature detector is disposed on the connecting pipe 120 downstream of the liquid cooling module 100.

[0076] For example, see Figure 2 and Figure 4 The temperature detector 140a is set in the second connecting pipe 121 upstream of the liquid cooling module 100. The temperature detector 140a is used to detect the current temperature information of the coolant flowing in the second connecting pipe 121, that is, the liquid inlet temperature of the liquid cooling module, and transmit the obtained current temperature information to the controller 130, so that the controller 130 uses the current temperature information to adjust the operating parameters of the server 200.

[0077] Exemplarily, temperature detector 2 140b is arranged in the third connecting pipe 122 downstream of the liquid cooling module 100. Temperature detector 2 140b is used to detect the current temperature information of the coolant flowing in the third connecting pipe 122, that is, the liquid outlet temperature of the liquid cooling module, and transmit the obtained current temperature information to the controller 130, so that the controller 130 uses the current temperature information to adjust the operating parameters of the server 200.

[0078] In some embodiments, the detection component includes a flow detector 150 , which is disposed on the connecting pipe 120 upstream of the liquid cooling module 100 .

[0079] See Figure 2 and Figure 4 The flow detector 150 is disposed in the second connecting pipe 121 upstream of the liquid cooling module 100. The flow detector 150 is configured to detect the flow rate of the coolant flowing in the second connecting pipe 121. The flow detector 150 is electrically connected to the controller 130 so that the controller 130 can obtain coolant flow information and adjust operating parameters of the server 200 based on the coolant flow information.

[0080] In some embodiments, the detection assembly includes a pressure detector 160 , which is disposed on the connecting pipe 120 downstream of the liquid cooling module 100 .

[0081] See Figure 2 and Figure 4 The pressure detector 160 is disposed on the third connecting pipe 122 downstream of the liquid cooling module 100. The pressure detector 160 is used to detect the pressure of the coolant flowing in the third connecting pipe 122. The pressure detector 160 is electrically connected to the controller 130, allowing the controller 130 to obtain the coolant pressure and control and adjust the operating parameters of the server 200 based on the coolant pressure. In this way, the controller 130 can calculate the coolant pressure difference.

[0082] In some embodiments, the detection assembly includes a liquid leakage detector 170, which is disposed on the liquid cooling plate 110. The liquid leakage detector 170 can be disposed on at least one of the first liquid cooling plate 111, the second liquid cooling plate 112, the third liquid cooling plate 113, the fourth liquid cooling plate 114, and the fifth liquid cooling plate 115 to detect liquid leakage on any of the liquid cooling plates 110, thereby improving the safety of the server 200 and ensuring the smooth operation of the server 200.

[0083] For example, see Figure 2 and Figure 4The liquid leakage detector 170 can also be provided on the first connecting pipe, the second connecting pipe 121, and the third connecting pipe 122 to detect whether the coolant in the liquid cooling module 100 and the coolant in the liquid cooling plate 110 are leaking. The liquid leakage detector 170 is electrically connected to the controller 130. The controller 130 can control and issue an alarm for the liquid cooling module 100 based on the leakage signal generated by the liquid leakage detector 170, thereby improving the safety of the liquid cooling module 100 and the server 200, reducing the loss of coolant, and improving the heat dissipation efficiency and effect of the server 200, further ensuring the stable operation of the server 200, and reducing the operating power consumption of the server 200.

[0084] In some embodiments, the liquid cooling module 100 includes a control valve 180 , which is disposed on the connecting pipe 120 upstream of the liquid cooling module 100 .

[0085] See Figure 2 and Figure 4 Exemplarily, the control valve 180 is disposed on the second connecting pipe 121 of the liquid cooling module 100. It is readily understood that the second connecting pipe 121 is connected to the liquid outlet of the coolant tank of the server 200 via the first adapter 1211, so that the coolant is supplied to the liquid cooling plate 110 through the second connecting pipe 121. The control valve 180 is disposed on the second connecting pipe 121, and the operating parameters of the liquid cooling module 100 can be adjusted by adjusting the opening of the valve core of the control valve 180. In other words, the flow rate, flow velocity, and pressure of the coolant can be adjusted through the control valve 180, thereby enhancing the adjustability of the coolant flow.

[0086] Among them, the control valve 180 and the controller 130 are electrically connected. The controller 130 can adjust the operating parameters of the server 200 based on the current component information and the current liquid cooling information to improve the heat dissipation efficiency of the server 200, reduce the operating power consumption of the server 200, and improve the operating performance of the server 200.

[0087] In some embodiments, after the leak detector 170 detects a coolant leak in the liquid cooling module 100, it generates a detection signal. Based on the detection signal, the controller 130 can also control the control valve 180 to shut off the second connecting pipe 121, thereby preventing the coolant from continuing to flow, allowing for inspection and maintenance of the leak in the liquid cooling module 100. Furthermore, after a coolant leak, the probability of the leaked coolant causing an internal short circuit in the server 200 is reduced, thereby improving the safety of the server 200 and extending its service life.

[0088] In some embodiments, the liquid cooling module 100 includes a one-way valve 190 , which is disposed on the connecting pipe 120 downstream of the liquid cooling module 100 .

[0089] See Figure 2 and Figure 4 The third connecting pipe 122 is connected to the return end of the coolant tank of the server 200, which means that the coolant in the liquid cooling module 100 flows in one direction. A one-way valve 190 is installed on the third connecting pipe 122 of the liquid cooling module 100. This valve only allows coolant to flow from the liquid cooling plate 110 through the third connecting pipe 122 into the coolant tank. This prevents pressure buildup within the liquid cooling module 100 caused by coolant backflow after the liquid cooling module 100 is shut down, further preventing damage to the liquid cooling module 100 and extending its service life.

[0090] Secondly, see Figure 3 The present application provides a server 200, comprising the liquid cooling module 100 provided in the first aspect.

[0091] The server 200 provided in the embodiment of the present application includes the liquid cooling module 100 provided in the first direction, which enables the server 200 to adaptively adjust the heat dissipation and the operating state of the server 200, so that the server 200 maintains a stable operating state, thereby preventing the temperature of the preset component 210 from being too high and reducing the impact of the temperature rise of the preset component 210 on the operating power consumption and operating performance of the server 200.

[0092] In some embodiments, the server 200 further includes a coolant tank connected to the connecting pipe 120 of the liquid cooling module 100 .

[0093] It should be noted that the specific connection method between the coolant tank and the liquid cooling module 100 has been described in various embodiments of the first aspect and will not be repeated here.

[0094] It should be noted that the server 200 in the embodiment of the present application can be a cabinet-type single-node server 200, a cabinet-type multi-node server 200, a tower server 200, etc. The embodiment of the present application does not make specific requirements for this.

[0095] Thirdly, see Figure 4 、 Figure 5 and Figure 6 The embodiment of the present application provides a control method for a server 200, which is applied to the server 200 in the second aspect. The method includes:

[0096] S310 , obtaining current component information of a preset component 210 in the server 200 , where the current component information includes component temperature and component power.

[0097] Among them, the server 200 includes a mainboard, and the preset component 210 is set on the mainboard. The preset component 210 has built-in temperature collection components and power collection components. When the server 200 starts working, the current component information of the preset component 210 can be directly obtained through the mainboard.

[0098] In some embodiments, a data acquisition module is provided on the mainboard. After the preset component 210 is electrically connected to the mainboard, the current component information of the preset component 210 can be obtained through the data acquisition module on the mainboard.

[0099] After being collected and acquired, the current component information may be stored in the baseboard management controller (BMC) 230 so as to facilitate data retrieval by the controller 130 .

[0100] S320. When the current component temperature is greater than or equal to the preset temperature, and / or the component power is greater than or equal to the preset power, obtain the current liquid cooling information of the liquid cooling module 100 in the server 200. The liquid cooling module 100 is used to adjust the temperature of the preset component 210.

[0101] S330 : Determine target operating parameters of the server 200 based on current component information and current liquid cooling information.

[0102] S340: Adjust the operating parameters of the server 200 to the target operating parameters.

[0103] In this way, the server 200 uses this control method, combined with the current component information of the preset component 210 and the current liquid cooling information of the preset component 210, and combined with the different operating goals of the server 200, to autonomously regulate the operating state of the server 200, ensuring that the server 200 can maintain stable operating temperature, operating power consumption, and operating performance under different operating goals, thereby improving the performance of the server 200. Specifically, the cooling distribution unit 220 on the coolant tank can be controlled by the BMC to achieve stable heat dissipation for the server 200.

[0104] In some embodiments, S330, determining target operating parameters of the server 200 based on current component information and current liquid cooling information, includes:

[0105] Determining a plurality of initial functions and function weights of the initial functions, the plurality of initial functions including a noise function, a power consumption function, and a performance function;

[0106] Determine an objective function based on a plurality of initial functions and a function weight of each initial function;

[0107] According to the current component information and the current liquid cooling information, the objective function is solved by a preset algorithm to obtain the target operating parameters.

[0108] See Figure 7 , exemplarily, when the server 200 is a single-node server, the noise function in the embodiment of the present application is: ; Power consumption function in the embodiment of the present application: ; Performance function in the embodiment of the present application: .

[0109] The objective function finally determined in the embodiment of this application is:

[0110]

[0111] Among them, W1 is the weight of the noise function; W2 is the weight of the power consumption function; W3 is the weight of the performance function; s is the sound pressure, sound power or pure tone ratio of different frequencies; p is the power consumption of the preset component 210; t is the temperature margin of the preset component 210; TL is the temperature change value of the coolant; L is the flow rate of the coolant; d is the pressure difference of the coolant; rs is the speed of the fan in the server 200; rp is the speed of the power supply in the server 200; rl is the speed of the water pump in the liquid cooling module 100; c is the calculation index; k is the compensation value.

[0112] in, The operating noise of the server 200 is evaluated by measuring the sound pressure level, the rotation speed of the fan, the rotation speed of the power supply, and the rotation speed of the water pump in the server 200 . The evaluation is performed based on the operating power consumption of the server 200 by measuring the power consumption of the preset component 210 , the temperature margin of the preset component 210 , the rotation speed of the fan, the rotation speed of the power supply, the rotation speed of the water pump, and the pressure difference of the coolant. The computing performance of the server 200 is evaluated by measuring the power consumption of the preset component 210, the temperature margin of the preset component 210, the temperature change value of the coolant, the flow rate of the coolant, the pressure difference of the coolant and the computing index.

[0113] Exemplarily, when the current component temperature is greater than or equal to the preset temperature, and / or the component power is greater than or equal to the preset power, the objective function is solved by combining the above-mentioned initial function and weights, and the target operating parameters of the server 200 are obtained. The operation of the server 200 is controlled according to the target operating parameters, so that the operation of the server 200 meets a variety of different operating requirements, and ensures that the server 200 can meet the maximization of noise, power consumption and performance under the operating requirements.

[0114] In some embodiments, see Figure 8When the server 200 is a cabinet-type multi-node or tower-type server 200 and a data processing center architecture, the objective function in the embodiment of the present application can be determined as:

[0115]

[0116] Here, i is each server 200 node.

[0117] In an embodiment of the present application, in the objective function of the present application, variables such as s, p, t, TL, L, d, rs, rp, and rl can be acquired by detection components in the main board and the liquid cooling module 100, and the acquired variable values ​​can be stored in a memory so that the processor of the server 200 can call them when solving the objective function.

[0118] In some embodiments, the objective function is solved using a preset algorithm based on the current component information and the current liquid cooling information to obtain target operating parameters, including:

[0119] In the current component information and the current liquid cooling information, a first parameter set corresponding to the noise function, a second parameter set corresponding to the power consumption function, and a third parameter set corresponding to the performance function are determined.

[0120] Determining a constraint condition, where the constraint condition includes at least one of: a range of the number of iterations and a temperature margin range of a preset component 210;

[0121] According to the first parameter set, the second parameter set, the third parameter set, and the constraint conditions, the objective function is solved by a preset algorithm to obtain the target operating parameters.

[0122] It can be understood that the detection components in the mainboard and the liquid cooling module 100 obtain the current component information of the preset component 210, the detection components in the liquid cooling module 100 obtain the current liquid cooling information, and store the obtained variable values ​​in the BMC, and form different parameter sets in the BMC so that the processor of the server 200 can call it when solving the target variable function.

[0123] In some embodiments, see Figure 5 The baseboard management controller 230 may be multiple, and multiple baseboard management controllers 230 are electrically connected to the switch 240 to achieve signal conversion and interaction between the two. At the same time, the cooling distribution unit 220 is electrically connected to the switch 240 to achieve signal conversion and interaction between the two.

[0124] Among them, the combination of the first parameter set, the second parameter set and the third parameter needs to be selected according to the weight of the initial parameters to meet the operation control scheme of the server 200 under different operation requirements.

[0125] In addition, the limiting conditions in the embodiments of the present application are, for example: the number of iterations of the preset algorithm is less than 500 times; the temperature margin of the preset component 210 is greater than 3°C and less than 5°C; the power of the server 200 is greater than 8KW and less than 1.2KW.

[0126] In the specific solution process, the noise function is solved by a preset algorithm according to the first parameter set and the restriction conditions to obtain multiple noise solution results, which are used to indicate the operating parameters of the server 200 under the corresponding noise.

[0127] In the specific solution process, the power consumption function is solved by a preset algorithm according to the second parameter set and the constraint conditions to obtain multiple power consumption solution results, which are used to indicate the operating parameters of the server 200 under the corresponding power consumption.

[0128] In the specific solution process, the performance function is solved by a preset algorithm according to the third parameter set and the constraint conditions to obtain multiple performance solution results. The performance solution results are used to indicate the operating parameters of the server 200 under the corresponding performance.

[0129] Multiple target solution results of the objective function are determined based on the multiple noise solution results, the multiple power consumption solution results, and the multiple performance solution results, and target operating parameters are determined based on the multiple target solution results.

[0130] It should be noted that the preset algorithms in the embodiments of the present application include: multi-objective genetic algorithm, multi-objective particle swarm optimization algorithm, etc., and the embodiments of the present application do not make specific requirements for this.

[0131] In combination with the aforementioned objective function, it is not difficult to understand that in an embodiment of the present application, the first parameter set includes at least one of the following: noise information of multiple frequencies, the rotation speed of the fan in the server 200, the rotation speed of the power supply of the server 200, and the rotation speed of the water pump in the liquid cooling module 100.

[0132] The second parameter set includes at least one of the following: power consumption of the preset component 210, temperature margin of the preset component 210, fan speed of the server 200, power supply speed of the server 200, water pump speed in the liquid cooling module 100, and coolant pressure difference of the liquid cooling module 100.

[0133] The third parameter set includes at least one of the following: power consumption of the preset component 210, temperature margin of the preset component 210, liquid inlet temperature of the liquid cooling module 100, liquid outlet temperature of the liquid cooling module 100, cooling liquid flow rate of the liquid cooling module 100, and pressure difference of the cooling liquid of the liquid cooling module 100.

[0134] In some embodiments, the method further comprises:

[0135] Historical data is obtained, where the historical data includes historical component information of the preset component 210 and historical liquid cooling information of the liquid cooling module 100 .

[0136] The predicted temperature and predicted power of the preset component 210 in the future period are determined based on the historical data, the current component information and the current liquid cooling information.

[0137] When it is determined that the predicted temperature is greater than or equal to the preset temperature, and / or the predicted power is greater than or equal to the preset power, the operating parameters of the server 200 are adjusted.

[0138] In this way, during the operation of the server 200 , the control method can predict future heat dissipation requirements, thereby achieving more accurate heat dissipation management to ensure the smooth operation of the server 200 .

[0139] In a fourth aspect, a control device for a server 200 includes:

[0140] An information acquisition module, configured to acquire current component information of a preset component 210 in the server 200; and to acquire current liquid cooling information of the liquid cooling module 100 in the server 200 when the current component temperature is greater than or equal to a preset temperature and / or the component power is greater than or equal to a preset power, wherein the liquid cooling module 100 is configured to adjust the temperature of the preset component 210;

[0141] The calculation and control module is used to determine the target operating parameters of the server 200 based on the current component information and the current liquid cooling information.

[0142] Fifth, see Figure 9 , an embodiment of the present application provides an electronic device 500, including:

[0143] The memory 502 is used to store computer programs.

[0144] The processor 501 is configured to implement the control method of the server 200 provided in the third aspect when executing a computer program.

[0145] like Figure 9 As shown, the electronic device 500 provided in the embodiment of the present application includes: at least one processor 501 and a memory 502. Optionally, the electronic device 500 also includes a communication component 503. The processor 501, the memory 502 and the communication component 503 are connected via a bus.

[0146] During the specific implementation process, at least one processor 501 executes the computer execution instructions stored in the memory 502, so that the at least one processor 501 executes the server control method provided in the third aspect above.

[0147] The specific implementation process of the processor 501 can be found in the above method embodiment. Its implementation principle and technical effects are similar and will not be repeated here in this embodiment.

[0148] In the above embodiments, it should be understood that the processor 501 may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the method disclosed in the application may be directly executed by a hardware processor or by a combination of hardware and software modules within the processor.

[0149] The memory 502 may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (NVM), such as at least one disk memory.

[0150] A bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus. Buses can be categorized as address buses, data buses, and control buses. For ease of illustration, the buses in the drawings of this application are not limited to just one bus or just one type of bus.

[0151] In a sixth aspect, an embodiment of the present application provides a computer-readable storage medium, in which a computer program is stored.

[0152] Among them, when the computer program is executed by the processor, the control method of the server 200 provided by the third aspect is implemented.

[0153] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above-mentioned server control method embodiments when running.

[0154] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0155] In a seventh aspect, an embodiment of the present application provides a computer program product, comprising a computer program. When the computer program is executed by a processor, the server control method provided in the third aspect is implemented.

[0156] An embodiment of the present application also provides a computer program product, which includes a computer program. When the computer program is executed by a processor, it implements the server control method provided by any one of the third aspects.

[0157] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, the non-volatile computer-readable storage medium storing a computer program, and when the computer program is executed by a processor, implementing the server control method provided in the third aspect above.

[0158] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0159] The above is a detailed introduction to a liquid cooling module, a server, and a control method for the server provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A method for controlling a server, characterized in that: The method comprises: Acquire current component information of a preset component in the server, the current component information including component temperature and component power; When the current component temperature is greater than or equal to a preset temperature, and / or the component power is greater than or equal to a preset power, obtaining current liquid cooling information of a liquid cooling module in the server, the liquid cooling module being used to adjust the temperature of the preset component; determining target operating parameters of the server based on the current component information and the current liquid cooling information; adjusting the operating parameters of the server to the target operating parameters; The determining target operating parameters of the server according to the current component information and the current liquid cooling information includes: Determining a plurality of initial functions and a function weight of each initial function, wherein the plurality of initial functions include a noise function, a power consumption function, and a performance function; Determining an objective function according to the multiple initial functions and a function weight of each of the initial functions; Solving the objective function using a preset algorithm based on the current component information and the current liquid cooling information to obtain the target operating parameters; Solving the objective function using a preset algorithm based on the current component information and the current liquid cooling information to obtain the target operating parameters includes: Determining, from the current component information and the current liquid cooling information, a first parameter set corresponding to the noise function, a second parameter set corresponding to the power consumption function, and a third parameter set corresponding to the performance function; Determining a constraint condition, wherein the constraint condition includes at least one of a range of iteration times or a temperature range of a key component; Solving the objective function using the preset algorithm according to the first parameter set, the second parameter set, the third parameter set, and the constraint condition to obtain the target operating parameters; The step of solving the objective function by the preset algorithm based on the first parameter set, the second parameter set, the third parameter set, and the constraint condition to obtain the target operating parameters includes: Solving the noise function using the preset algorithm according to the first parameter set and the constraint condition to obtain a plurality of noise solution results, wherein the noise solution results are used to indicate operating parameters of the server under the corresponding noise; Solving the power consumption function using the preset algorithm according to the second parameter set and the constraint condition to obtain a plurality of power consumption solution results, wherein the power consumption solution results are used to indicate operating parameters of the server under corresponding power consumption; Solving the performance function using the preset algorithm according to the third parameter set and the constraint condition to obtain a plurality of performance solution results, wherein the performance solution results are used to indicate operating parameters of the server under corresponding performance conditions; A plurality of target solution results of the objective function are determined according to the plurality of noise solution results, the plurality of power consumption solution results, and the plurality of performance solution results, and the target operating parameters are determined according to the plurality of target solution results.

2. The method according to claim 1, characterized in that The first parameter set includes at least one of the following: noise information of multiple frequencies, a rotation speed of a fan in the server, a rotation speed of a power supply of the server, and a rotation speed of a water pump in the liquid cooling module; The second parameter set includes at least one of the following: power consumption of the preset component, temperature margin of the preset component, rotation speed of a fan in the server, rotation speed of a power supply of the server, rotation speed of a water pump in the liquid cooling module, and coolant pressure difference of the liquid cooling module; The third parameter set includes at least one of the following: the power consumption of the preset component, the temperature margin of the preset component, the liquid inlet temperature of the liquid cooling module, the liquid outlet temperature of the liquid cooling module, the coolant flow rate of the liquid cooling module, and the coolant pressure difference of the liquid cooling module.

3. The method according to claim 1, characterized in that The method further comprises: Acquiring historical data, the historical data including: historical component information of the preset component and historical liquid cooling information of the liquid cooling module; Determining a predicted temperature and a predicted power of the preset component in a future time period based on the historical data, the current component information, and the current liquid cooling information; When it is determined that the predicted temperature is greater than or equal to the preset temperature, and / or the predicted power is greater than or equal to the preset power, the operating parameters of the server are adjusted.

4. A liquid cooling module, characterized in that: The control method according to any one of claims 1 to 3 is applied, comprising: A liquid cooling plate, which is used to dissipate heat from preset components of the server; a connecting pipe, the connecting pipe being arranged on the liquid cooling plate; a detection component, the detection component being disposed on the connecting pipe to obtain current liquid cooling information of the liquid cooling module; the detection component comprising a pressure detector and a liquid leakage detector, the pressure detector being disposed on the connecting pipe downstream of the liquid cooling module, and the liquid leakage detector being disposed on the liquid cooling plate; a control valve, the control valve being disposed on the connecting pipe upstream of the liquid cooling module and being used to adjust operating parameters of the liquid cooling module; a controller, the controller being electrically connected to the detection assembly and the control valve, respectively; the controller being configured to obtain current component information of the preset component; when the current component temperature is greater than or equal to the preset temperature, and / or the current component power is greater than or equal to the preset power, obtain current liquid cooling information of the liquid cooling module, and adjust operating parameters of the server based on the current component information and the current liquid cooling information to achieve adaptive operation of the server, thereby maintaining a stable operating state of the server; There are multiple liquid cooling plates, multiple connecting pipes, and the multiple connecting pipes include a first connecting pipe; The first connecting pipes are respectively connected to different liquid cooling plates, and the first connecting pipes are hoses; The plurality of liquid cooling plates are connected through the first connecting pipe to form a flow path for the cooling liquid.

5. The liquid cooling module according to claim 4, characterized in that: The plurality of liquid cooling plates include a first liquid cooling plate, the first liquid cooling plate being located upstream of the liquid cooling module; The multiple connecting pipes include a second connecting pipe, one end of which is connected to the first liquid cooling plate, and the other end of the second connecting pipe is provided with a first adapter, which is used to connect to the liquid outlet end of the coolant tank of the server.

6. The liquid cooling module according to claim 5, characterized in that: The plurality of liquid cooling plates include a second liquid cooling plate, the second liquid cooling plate being located downstream of the liquid cooling module; The multiple connecting pipes include a third connecting pipe, one end of which is connected to the second liquid cooling plate, and the other end of the third connecting pipe is provided with a second adapter, which is used to connect to the return end of the coolant tank of the server.

7. The liquid cooling module according to any one of claims 4 to 6, characterized in that: The detection component includes a temperature detector, which is arranged on the connecting pipe upstream of the liquid cooling module; And / or, the temperature detector is arranged on the connecting pipe downstream of the liquid cooling module.

8. The liquid cooling module according to any one of claims 4 to 6, characterized in that: The detection component includes a flow detector, which is arranged on the connecting pipe upstream of the liquid cooling module.

9. The liquid cooling module according to any one of claims 4 to 6, characterized in that: The liquid cooling module includes a one-way valve, which is arranged on the connecting pipe downstream of the liquid cooling module.

10. A server, characterized in that: include: A liquid cooling module, wherein the liquid cooling module is the liquid cooling module according to any one of claims 4 to 9.

11. The server according to claim 10, wherein: Also includes: A coolant tank is connected to the connecting pipe of the liquid cooling module.

Images