Wafer cleaning device and wafer processing equipment

Abstract

The invention discloses a wafer cleaning device and wafer processing equipment, and particularly relates to the technical field of wafer processing, the wafer cleaning device comprises a base, one side of the top end of the base is fixedly provided with a first frame body, the top of the first frame body is fixedly provided with a fixed rotation mechanism, and the other side of the top end of the base is fixedly provided with a first transportation mechanism; a rotating mechanism is arranged at the top end of the base, a transferring mechanism is arranged between the rotating mechanism and the first conveying mechanism, a cleaning mechanism is fixedly installed on the side, close to the rotating mechanism, of the top end of the base, and a second conveying mechanism is fixedly installed at the position, at the transferring mechanism, of the top end of the base. And the upper surface and the lower surface of the wafer are synchronously and automatically cleaned in cooperation with the cleaning mechanism, so that the cleaning efficiency of the wafer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, in particular to a wafer cleaning device and wafer processing equipment. Background Art

[0002] Wafers are thin disks used to manufacture semiconductor devices. They are mainly made of silicon or other semiconductor materials. They are produced through multiple steps such as purifying silicon materials, melting, casting, and crystal pulling. After production, the wafers will be processed by processes such as photolithography, etching, and ion implantation. Wafers are the basis for the preparation of integrated circuits.

[0003] When wafers are processed and produced, their surfaces need to be cleaned to remove pollutants and impurities on the wafer surface and enhance the surface adhesion. Traditional wafer cleaning is mostly done by manually placing the wafer on a positioning table for rotation, and then using deionized water to rinse the wafer for single-sided cleaning. After cleaning, the wafer is removed. Among them, the efficiency of single-sided cleaning is low, and it needs to be turned over and cleaned again. In addition, the efficiency of manual loading and unloading is also relatively slow. For this reason, we propose a wafer cleaning device and wafer processing equipment to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a wafer cleaning device and a wafer processing equipment to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a wafer cleaning device and a wafer processing equipment, comprising a base, a first frame body is fixedly installed on one side of the top of the base, a fixed and rotating mechanism is fixedly installed on the top of the first frame body, a first transport mechanism is fixedly installed on the other side of the top of the base, a transfer mechanism is provided between the fixed and rotating mechanism and the first transport mechanism, a cleaning mechanism is fixedly installed on one side of the top of the base close to the fixed and rotating mechanism, and a second transport mechanism is fixedly installed on the top of the base at the position of the transfer mechanism.

[0006] Preferably, the fixed-rotation mechanism includes a positioning outer ring, which is fixedly mounted on the top of the first frame, and the top sliding card of the positioning outer ring is provided with a plurality of positioning slides distributed in a ring array, and the opposite ends of the plurality of positioning slides extend into the positioning outer ring, and the opposite ends of the plurality of positioning slides are fixedly mounted with a rotating frame, a rotating shaft is rotatably mounted in the middle of the rotating frame, and a positioning card wheel is fixedly mounted in the middle of the rotating shaft, and a driving ring frame is movably mounted on the bottom end of the positioning outer ring, and a planar threaded protrusion is integrally formed on the upper surface of the driving ring frame, and a planar threaded groove used in conjunction with the planar threaded protrusion is opened on the lower surfaces of the plurality of positioning slides, and the planar threaded protrusion is movably clamped in the planar threaded groove.

[0007] Preferably, a first motor is fixedly mounted on the top of one of the rotating frames, and a driving end of the first motor is fixedly mounted on the top of the corresponding rotating shaft.

[0008] Preferably, the bottom fixed sleeve of the driving ring frame is provided with a first gear ring, the outer side of the positioning outer ring is fixedly installed with a first seat body, the middle part of the first seat body is rotatably installed with a first shaft, the bottom of the first shaft is fixedly installed with a first gear, the first gear is meshingly connected with the outer side of the first gear ring, the top of the first seat body is fixedly installed with a second motor, and the driving end of the second motor is fixedly installed with the top of the first shaft.

[0009] Preferably, the transfer mechanism includes two symmetrically distributed second frames, the second frames are fixedly mounted on the top of the base, an arc-shaped bracket is fixedly mounted in the middle of the opposite ends of the second frames, a transfer ring frame is provided between the two arc-shaped brackets, the transfer ring frame movably passes through the positioning outer ring, an outer end of the transfer ring frame is provided with an inner ring groove corresponding to the arc-shaped bracket, the arc-shaped bracket is movably clamped in the corresponding inner ring groove, a material placement opening is provided on one side of the transfer ring frame, and two second seats symmetrically distributed up and down are fixedly mounted on the outer wall of the transfer ring frame at the material placement opening position, a telescopic cylinder is fixedly mounted in the middle of the second seat, a positioning plate is fixedly mounted on the driving end of the telescopic cylinder, and protective pads are fixedly mounted on the opposite sides of the positioning plate.

[0010] Preferably, a second shaft is rotatably mounted on the top of the second frame, a second gear is fixedly mounted on the outer side of the second shaft, a second gear ring is integrally formed on the inner side of the transfer ring frame, the outer side of the second gear and the inner side of the second gear ring are meshingly connected, a third motor is fixedly mounted on the top end of one of the second frames, and the driving end of the third motor is fixedly mounted on one end of the second shaft.

[0011] Preferably, the cleaning mechanism includes a fourth frame, which is fixedly mounted on the top of the base near the side of the fixed and rotating mechanism, a third seat body is fixedly mounted on the top of the fourth frame, a rotating seat is provided in the middle of the top of the third seat body, a rotating column is fixedly mounted in the middle of the bottom end of the rotating seat, the rotating column is rotatably mounted in the middle of the third seat body, a fourth motor is fixedly mounted on the bottom end of the third seat body, a driving end of the fourth motor and the bottom end of the rotating column are fixedly mounted, a lifting slide frame is fixedly mounted in the middle of the top of the rotating seat, a sliding card in the lifting slide frame is provided with two symmetrically distributed longitudinal slide seats, and the middle rotation portion of the lifting slide frame A double-headed screw is dynamically installed, and the longitudinal sliding seat is threadedly installed on the outside of the double-headed screw. A fifth motor is fixedly installed on the top of the lifting slide frame, and the driving end of the fifth motor and the top of the double-headed screw are fixedly installed. An L-shaped frame is fixedly installed on the side end of the longitudinal sliding seat, and a cleaning shaft is fixedly installed on the end of the L-shaped frame away from the longitudinal sliding seat, and a cleaning brush roller is fixedly installed on the outside of the cleaning shaft, and a sixth motor is fixedly installed on the end of the L-shaped frame away from the longitudinal sliding seat, and the driving end of the sixth motor and one end of the cleaning shaft are fixedly installed, and a fourth seat body is fixedly installed on the side ends of the L-shaped frame, and a liquid spray pipe is fixedly installed on the fourth seat body.

[0012] Preferably, a connecting hose is fixedly mounted on one end of each of the liquid spraying pipes, and a liquid guiding main pipe is fixedly mounted on the ends of the two connecting hoses.

[0013] Preferably, the first transport mechanism includes two groups of symmetrically distributed transport side frames, the transport side frames are fixedly mounted on the top of the base, a transport shaft is rotatably mounted on the top of the transport side frame, a transport wheel is fixedly mounted on the inner end of the transport shaft, and outer movable sleeves of the two transport wheels on the same side are provided with transport belts, the transfer ring frame is located between the two transport belts, a seventh motor is fixedly mounted on the top of one of the transport side frames, a driving end of the seventh motor and an end of one of the transport shafts are fixedly mounted, and a common drive shaft is fixedly mounted between the two transport shafts.

[0014] The second transport mechanism includes two groups of symmetrically distributed transport longitudinal frames, the transport longitudinal frames are fixedly installed on the top of the base, transport rollers are rotatably installed on the top of the transport longitudinal frames, and outer movable sleeves of the two transport rollers are provided with transport belts, an eighth motor is fixedly installed on the top of one of the transport longitudinal frames, and the driving end of the eighth motor and the end of one of the transport rollers are fixedly installed, the transport belts and transport ring belts in the second transport mechanism are vertically distributed, and the transport belts in the second transport mechanism vertically penetrate the transfer ring frame.

[0015] A wafer processing device comprises a wafer cleaning device.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. By setting up a fixed-rotation mechanism, the wafer can be wheel-positioned, so that the wafer can be controlled to rotate. In conjunction with the cleaning mechanism, the upper and lower surfaces of the wafer can be automatically cleaned synchronously, thereby improving the cleaning efficiency of the wafer.

[0018] 2. By setting up a fixed-rotation mechanism, the spacing between multiple positioning wheels can be flexibly adjusted, which is convenient for wheel positioning of wafers of different sizes and improves the flexibility of the entire cleaning device.

[0019] 3. By setting up a transfer mechanism and using the first transport mechanism and the second transport mechanism in coordination, it is convenient to automatically load the wafers to be cleaned, and it is convenient to automatically unload and continue to transport the cleaned wafers for subsequent processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a schematic diagram of the structure of the present invention.

[0022] Figure 2 It is a structural schematic diagram of the fixed-rotation mechanism in the present invention.

[0023] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle.

[0024] Figure 4 It is a structural schematic diagram of another angle of the fixed-rotation mechanism in the present invention.

[0025] Figure 5 It is a structural schematic diagram of the transfer mechanism in the present invention.

[0026] Figure 6 For the present invention Figure 5 Enlarged view of point B in the middle.

[0027] Figure 7 For the present invention Figure 5 Enlarged view of point C in the middle.

[0028] Figure 8 It is a structural schematic diagram of the cleaning mechanism in the present invention.

[0029] Fig. 9 For the present invention Figure 8 Enlarged view of point D in the middle.

[0030] Fig.10 For the present invention Figure 8 Enlarged view of point E in the middle.

[0031] Fig.11 For the present invention Figure 8 Enlarged view of point F in the middle.

[0032] Fig.12 It is a schematic diagram of the structural connection between the first transport mechanism and the second transport mechanism in the present invention.

[0033] Fig.13 For the present invention Fig.12 Enlarged view of point G in the middle.

[0034] In the figure: 1, base; 2, first frame; 3, fixed rotation mechanism; 4, first transport mechanism; 5, transfer mechanism; 6, cleaning mechanism; 7, second transport mechanism; 31, positioning outer ring; 32, positioning slide; 33, rotating frame; 331, rotating shaft; 332, positioning card wheel; 333, first motor; 34, driving ring frame; 35, first gear ring; 351, first gear; 352, second motor; 36, first seat; 361, first shaft; 51, second frame; 52, arc card frame; 53, transfer ring frame; 531, inner ring groove; 501, material placement opening; 54, second seat; 541, telescopic cylinder; 55, positioning plate; 551, protective pad; 56, second shaft; 561, The second gear; 562, the second gear ring; 563, the third motor; 61, the fourth frame; 62, the third seat body; 63, the rotating seat; 631, the rotating column; 632, the fourth motor; 64, the lifting slide frame; 641, the longitudinal slide seat; 642, the double-headed screw; 643, the fifth motor; 65, the L-shaped frame; 66, the cleaning shaft; 661, the cleaning brush roller; 662, the sixth motor; 67, the fourth seat body; 672, the liquid spray pipe; 673, the connecting hose; 68, the liquid guide main pipe; 41, the transport side frame; 42, the transport shaft; 43, the transport wheel; 431, the transport belt; 44, the seventh motor; 45, the co-drive shaft; 71, the transport longitudinal frame; 72, the transport roller; 73, the transport belt; 74, the eighth motor. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Example: Figure 1-13As shown, the present invention provides a wafer cleaning device and a wafer processing equipment, including a base 1, a first frame 2 is fixedly installed on one side of the top of the base 1, a fixed and rotating mechanism 3 is fixedly installed on the top of the first frame 2, a first transportation mechanism 4 is fixedly installed on the other side of the top of the base 1, a transfer mechanism 5 is provided between the fixed and rotating mechanism 3 and the first transportation mechanism 4, a cleaning mechanism 6 is fixedly installed on one side of the top of the base 1 close to the fixed and rotating mechanism 3, and a second transportation mechanism 7 is fixedly installed on the top of the base 1 at the position of the transfer mechanism 5.

[0037] The fixed-rotation mechanism 3 includes a positioning outer ring 31, which is fixedly mounted on the top of the first frame 2. A plurality of positioning slides 32 distributed in an annular array are slidably clamped on the top of the positioning outer ring 31. The opposite ends of the plurality of positioning slides 32 extend into the positioning outer ring 31. A rotating frame 33 is fixedly mounted on the opposite ends of the plurality of positioning slides 32. A rotating shaft 331 is rotatably mounted in the middle of the rotating frame 33. A positioning clamp wheel 332 is fixedly mounted in the middle of the rotating shaft 331. A driving ring frame 34 is movably clamped on the bottom end of the positioning outer ring 31. A plane threaded protrusion is integrally formed on the upper surface of the driving ring frame 34. A plane threaded groove used in conjunction with the plane threaded protrusion is opened on the lower surfaces of the plurality of positioning slides 32. The plane threaded protrusion is movably clamped in the plane threaded groove.

[0038] The bottom fixed sleeve of the driving ring frame 34 is provided with a first gear ring 35, the outer side of the positioning outer ring 31 is fixedly installed with a first seat body 36, the middle part of the first seat body 36 is rotatably installed with a first shaft 361, the bottom of the first shaft 361 is fixedly installed with a first gear 351, the first gear 351 is meshingly connected with the outer side of the first gear ring 35, the top of the first seat body 36 is fixedly installed with a second motor 352, the driving end of the second motor 352 is fixedly installed with the top of the first shaft 361, when in use, the first shaft 361 is driven to rotate by controlling the second motor 352 to start, thereby driving the first gear 351 to drive the first gear ring 35 and the driving ring frame 34 rotate, and the flat thread convex is movably engaged in the flat thread groove, thereby controlling the multiple positioning slides 32 to slide towards each other. On the contrary, by controlling the second motor 352 to start, the first shaft 361 is driven to rotate in the opposite direction, thereby driving the first gear 351 to drive the first gear ring 35 and the driving ring frame 34 to rotate in the opposite direction, and the flat thread convex is movably engaged in the flat thread groove, thereby controlling the multiple positioning slides 32 to slide back to back, thereby flexibly adjusting the spacing between the multiple positioning clamping wheels 332, which is convenient for wheel positioning of wafers of different sizes, thereby improving the flexibility of the entire cleaning device.

[0039] A first motor 333 is fixedly installed on the top of one of the rotating frames 33. The driving end of the first motor 333 and the top of the corresponding rotating shaft 331 are fixedly installed. When in use, the first motor 333 is controlled to be turned on to drive the corresponding rotating shaft 331 to rotate, thereby controlling the positioning card wheel 332 to rotate, and then driving the wheel-positioned wafer to rotate, so as to facilitate the rotational cleaning of the wafer, thereby improving the cleaning effect of the wafer.

[0040] The transfer mechanism 5 includes two symmetrically distributed second frames 51, the second frames 51 are fixedly mounted on the top of the base 1, and an arc-shaped bracket 52 is fixedly mounted in the middle of the opposite ends of the second frames 51. A transfer ring frame 53 is arranged between the two arc-shaped brackets 52, and the transfer ring frame 53 movably penetrates the positioning outer ring 31. The outer end of the transfer ring frame 53 is provided with an inner ring groove 531 corresponding to the arc-shaped bracket 52, and the arc-shaped bracket 52 is movably engaged in the corresponding inner ring groove 531; a second shaft 56 is rotatably mounted on the top of the second frame 51, and the outer side of the second shaft 56 A second gear 561 is fixedly installed, and a second gear ring 562 is integrally formed on the inner side of the transfer ring frame 53. The outer side of the second gear 561 and the inner side of the second gear ring 562 are meshed and connected. A third motor 563 is fixedly installed on the top of one of the second frames 51. The driving end of the third motor 563 and one end of the second shaft 56 are fixedly installed. When in use, the third motor 563 is controlled to drive the second shaft 56, and the second gear 561 drives the second gear ring 562 to rotate, thereby driving the transfer ring frame 53 to rotate between the two second frames 51;

[0041] A material placement opening 501 is provided on one side of the transfer ring frame 53, and two second seat bodies 54 symmetrically distributed in the upper and lower parts are fixedly installed on the outer wall of the transfer ring frame 53 at the position of the material placement opening 501, and a telescopic cylinder 541 is fixedly installed in the middle of the second seat body 54, and a positioning plate 55 is fixedly installed on the driving end of the telescopic cylinder 541, and a protective pad 551 is fixedly installed on the opposite side of the positioning plate 55. The two positioning plates 55 are driven to rotate back and forth by the rotation of the transfer ring frame 53, thereby switching the position back and forth between the positioning outer ring 31 and the first transport mechanism 4, which is convenient for the subsequent automatic loading and unloading of wafers.

[0042] The cleaning mechanism 6 includes a fourth frame 61, which is fixedly mounted on the top of the base 1 near the side of the fixed rotation mechanism 3, and a third seat body 62 is fixedly mounted on the top of the fourth frame 61, and a rotating seat 63 is provided in the middle of the top of the third seat body 62, and a rotating column 631 is fixedly mounted in the middle of the bottom end of the rotating seat 63, and the rotating column 631 is rotatably mounted in the middle of the third seat body 62, and a fourth motor 632 is fixedly mounted on the bottom end of the third seat body 62, and the driving end of the fourth motor 632 and the bottom end of the rotating column 631 are fixedly mounted, and a lifting slide frame 64 is fixedly mounted in the middle of the top of the rotating seat 63, and the sliding card in the lifting slide frame 64 is provided with two symmetrically distributed longitudinal slide seats 641, and the middle part of the lifting slide frame 64 rotates A double-headed screw 642 is installed, and a longitudinal slide seat 641 is threadedly installed on the outer side of the double-headed screw 642. A fifth motor 643 is fixedly installed on the top of the lifting slide frame 64. The driving end of the fifth motor 643 and the top of the double-headed screw 642 are fixedly installed. An L-shaped frame 65 is fixedly installed on the side end of the longitudinal slide seat 641. A cleaning shaft 66 is fixedly installed on the end of the L-shaped frame 65 away from the longitudinal slide seat 641. A cleaning brush roller 661 is fixedly installed on the outer side of the cleaning shaft 66. By controlling the fourth motor 632 to start, the rotating column 631, the rotating seat 63, and the lifting slide frame 64 are driven to rotate, thereby controlling the cleaning shaft 66 and the cleaning brush roller 661 to rotate horizontally, and flexibly changing the position of the cleaning brush roller 661;

[0043] By controlling the fifth motor 643 to start, the double-headed screw 642 is driven to rotate, thereby controlling the two longitudinal slide seats 641 and the cleaning brush roller 661 to move toward each other. Conversely, by driving the double-headed screw 642 to rotate in the opposite direction, the two longitudinal slide seats 641 and the cleaning brush roller 661 are controlled to move in opposite directions, thereby flexibly adjusting the spacing between the cleaning brush rollers 661.

[0044] A sixth motor 662 is fixedly installed at one end of the L-shaped frame 65 away from the longitudinal slide seat 641. The driving end of the sixth motor 662 is fixedly installed with one end of the cleaning shaft 66. By controlling the sixth motor 662 to be turned on, the cleaning shaft 66 is driven to drive the cleaning brush roller 661 to rotate. The rotation direction is opposite to the rotation direction of the wafer, so that the rotating cleaning brush roller 661 can clean the rotating wafer.

[0045] The side ends of the L-shaped frame 65 are fixedly installed with the fourth base body 67, and the fourth base body 67 is fixedly installed with a liquid spray pipe 672. One end of the liquid spray pipe 672 is fixedly installed with a connecting hose 673, and the ends of the two connecting hoses 673 are fixedly installed with a liquid guide pipe 68. When in use, the end of the liquid guide pipe 68 is connected to the output port of the cleaning liquid output system. When cleaning, the cleaning liquid output system is controlled to start, and the cleaning liquid is introduced into the liquid spray pipe 672 through the liquid guide pipe 68 and the connecting hose 673, and is sprayed on the upper and lower surfaces of the wafer through the liquid spray pipe 672. In conjunction with the rotation of the cleaning brush roller 661, the upper and lower surfaces of the wafer are synchronously and automatically cleaned, thereby improving the cleaning efficiency of the wafer.

[0046] The first transport mechanism 4 includes two groups of transport side frames 41 distributed symmetrically. The transport side frames 41 are fixedly installed on the top of the base 1. A transport shaft 42 is rotatably installed on the top of the transport side frame 41. A transport wheel 43 is fixedly installed on the inner end of the transport shaft 42. A transport belt 431 is movablely sleeved on the outer sides of the two transport wheels 43 on the same side. The transfer ring frame 53 is located between the two transport belts 431. A seventh motor 44 is fixedly installed on the top of one of the transport side frames 41. The driving end of the seventh motor 44 and the end of one of the transport shafts 42 are fixedly installed. The two transport wheels 43 are fixedly sleeved on the outer sides of the two transport wheels 43 on the same side. A co-drive shaft 45 is fixedly installed between the input shafts 42. When in use, the wafers are placed on the two transport belts 431 in the first transport mechanism 4, and the seventh motor 44 is controlled to drive one of the transport shafts 42 to rotate, and the transmission of the co-drive shaft 45 is cooperated to drive the transport belts 431 on both sides to transport, and the wafers to be cleaned are transported to the position of the transfer mechanism 5 in turn, and the wafers are automatically loaded. The wafers are transferred between the two positioning plates 55, and the telescopic cylinder 541 is controlled to drive the corresponding positioning plates 55 to move toward each other, so as to clamp, position and load the wafers.

[0047] The second transport mechanism 7 includes two groups of transport vertical frames 71 distributed symmetrically, the transport vertical frames 71 are fixedly installed on the top of the base 1, and transport rollers 72 are rotatably installed on the top of the transport vertical frames 71. The outer movable sleeves of the two transport rollers 72 are provided with transport belts 73, and an eighth motor 74 is fixedly installed on the top of one of the transport vertical frames 71. The driving end of the eighth motor 74 and the end of one of the transport rollers 72 are fixedly installed. The transport belt 73 and the transport ring belt 431 in the second transport mechanism 7 are vertically distributed, and the transport belt 73 in the second transport mechanism 7 vertically penetrates the transfer ring frame 53; when in use, the eighth motor 74 is controlled to start and drive one of the transport rollers 72 to rotate, and the transport belt 73 is driven for transmission. The wafers after cleaning are transmitted to the transport belt 73 through the first transport mechanism 4, and the wafers are automatically unloaded without affecting the automatic transmission and automatic loading of the next wafer, and the cleaned wafers are continuously transmitted for subsequent processing.

[0048] A wafer processing device comprises a wafer cleaning device.

[0049] Working principle: When in use, the wafer is placed on the two transport belts 431 in the first transport mechanism 4, the seventh motor 44 is controlled to drive one of the transport shafts 42 to rotate, and the transmission of the common drive shaft 45 is cooperated to drive the transport belts 431 on both sides to transport, and the wafers to be cleaned are transported to the position of the transfer mechanism 5 in turn, and the wafers are automatically loaded. The wafers are transported between the two positioning plates 55, and the telescopic cylinder 541 is controlled to drive the corresponding positioning plates 55 to move toward each other, so as to clamp and position the wafers;

[0050] Subsequently, the third motor 563 is controlled to drive the second shaft 56, and the second gear 561 drives the second gear ring 562 to rotate, thereby driving the transfer ring frame 53 to rotate between the two second frames 51, transferring the wafer to the positioning outer ring 31, and automatically loading the wafer;

[0051] The wafer is placed between the multiple positioning clamping wheels 332, and the second motor 352 is controlled to start and drive the first shaft 361 to rotate, thereby driving the first gear 351 to drive the first gear ring 35 and the driving ring frame 34 to rotate, and the plane thread protrusion is movably clamped in the plane thread groove, thereby controlling the multiple positioning slides 32 to slide toward each other, and the wafer is wheel-positioned;

[0052] Then, the telescopic cylinder 541 is controlled to start and drive the corresponding positioning plate 55 to move backward, and the wafer loses its clamping position;

[0053] Subsequently, the fourth motor 632 is controlled to drive the rotating column 631, the rotating seat 63, and the lifting slide frame 64 to rotate, thereby controlling the cleaning shaft 66 and the cleaning brush roller 661 to rotate horizontally, and the cleaning brush roller 661 is rotated horizontally to the upper and lower sides of the wafer;

[0054] Subsequently, the fifth motor 643 is controlled to start driving the double-headed screw 642 to rotate, thereby controlling the two longitudinal slide seats 641 and the cleaning brush roller 661 to move toward each other, and the cleaning brush roller 661 contacts the upper and lower surfaces of the wafer respectively;

[0055] Subsequently, the first motor 333 is controlled to be turned on, driving the corresponding rotating shaft 331 to rotate, thereby controlling the positioning clamp wheel 332 to rotate, and then driving the wheel-positioned wafer to rotate. At the same time, the sixth motor 662 is controlled to be turned on, driving the cleaning shaft 66 to drive the cleaning brush roller 661 to rotate, and the rotation direction is opposite to the rotation direction of the wafer.

[0056] At the same time, the cleaning liquid output system is controlled to start, and the cleaning liquid is introduced into the liquid spraying pipe 672 through the liquid guide pipe 68 and the connecting hose 673, and sprayed on the upper and lower surfaces of the wafer through the liquid spraying pipe 672. With the rotation of the cleaning brush roller 661, the upper and lower surfaces of the wafer are automatically cleaned synchronously, thereby improving the cleaning efficiency of the wafer;

[0057] After the wafer is cleaned, the cleaning brush roller 661 is controlled to move backward and reset, and then rotated horizontally in the opposite direction and reset. Then, the telescopic cylinder 541 is controlled to start again to drive the corresponding positioning plate 55 to move toward each other, and the wafer is clamped and positioned again;

[0058] Subsequently, the plurality of positioning slides 32 are controlled to slide backwards, and the wafer loses wheel positioning;

[0059] Then, the transfer ring frame 53 is controlled to rotate in the opposite direction, and the cleaned wafer is placed again on the transport ring belts 431 on both sides of the first transport mechanism 4. Then, the telescopic cylinder 541 is controlled to start again to drive the corresponding positioning plate 55 to move backward, and the wafer loses the clamping position;

[0060] Subsequently, the transport belts 431 on both sides are driven to transport the cleaned wafers automatically to the transport belts 73 for automatic unloading of the wafers without affecting the automatic transmission and loading of the next wafer, and the cleaned wafers are continuously transported for subsequent processing.

[0061] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning device, comprising a base (1), characterized in that: A first frame (2) is fixedly mounted on one side of the top of the base (1), a fixed-rotation mechanism (3) is fixedly mounted on the top of the first frame (2), a first transport mechanism (4) is fixedly mounted on the other side of the top of the base (1), a transfer mechanism (5) is provided between the fixed-rotation mechanism (3) and the first transport mechanism (4), a cleaning mechanism (6) is fixedly mounted on one side of the top of the base (1) close to the fixed-rotation mechanism (3), and a second transport mechanism (7) is fixedly mounted on the top of the base (1) at the position of the transfer mechanism (5).

2. A wafer cleaning device according to claim 1, characterized in that: The fixed-rotation mechanism (3) comprises a positioning outer ring (31), the positioning outer ring (31) is fixedly mounted on the top of the first frame (2), a plurality of positioning slides (32) distributed in a ring array are slidably mounted on the top of the positioning outer ring (31), the opposite ends of the plurality of positioning slides (32) extend into the positioning outer ring (31), a rotating frame (33) is fixedly mounted on the opposite ends of the plurality of positioning slides (32), a rotating shaft (331) is rotatably mounted in the middle of the rotating frame (33), and the middle of the rotating shaft (331) is fixedly mounted. A positioning clamp wheel (332) is provided, the bottom end of the positioning outer ring (31) is movably clamped with a driving ring frame (34), the upper surface of the driving ring frame (34) is integrally formed with a plane thread protrusion, and the lower surfaces of the plurality of positioning slides (32) are provided with a plane thread groove used in conjunction with the plane thread protrusion, the plane thread protrusion is movably clamped in the plane thread groove, and a first motor (333) is fixedly installed at the top end of one of the rotating frames (33), and the driving end of the first motor (333) is fixedly installed with the top end of the corresponding rotating shaft (331).

3. A wafer cleaning device according to claim 2, characterized in that: The bottom fixed sleeve of the driving ring frame (34) is provided with a first gear ring (35); the outer side of the positioning outer ring (31) is fixedly mounted with a first seat body (36); the middle part of the first seat body (36) is rotatably mounted with a first shaft (361); the bottom of the first shaft (361) is fixedly mounted with a first gear (351); the first gear (351) is meshingly connected with the outer side of the first gear ring (35); the top of the first seat body (36) is fixedly mounted with a second motor (352); the driving end of the second motor (352) is fixedly mounted with the top of the first shaft (361).

4. A wafer cleaning device according to claim 2, characterized in that: The transfer mechanism (5) comprises two symmetrically distributed second frames (51), the second frames (51) being fixedly mounted on the top of the base (1), an arc-shaped bracket (52) being fixedly mounted in the middle of the opposite ends of the second frames (51), a transfer ring frame (53) being arranged between the two arc-shaped brackets (52), the transfer ring frame (53) movably passing through the positioning outer ring (31), an inner ring groove (531) corresponding to the arc-shaped bracket (52) being arranged at the outer end of the transfer ring frame (53), and the arc-shaped bracket (52) The transfer ring frame (53) is movably engaged in the corresponding inner ring groove (531), a material placement opening (501) is provided on one side of the transfer ring frame (53), two second seat bodies (54) symmetrically distributed up and down are fixedly installed on the outer wall of the transfer ring frame (53) at the position of the material placement opening (501), a telescopic cylinder (541) is fixedly installed in the middle of the second seat body (54), a positioning plate (55) is fixedly installed at the driving end of the telescopic cylinder (541), and a protective pad (551) is fixedly installed on the opposite side of the positioning plate (55).

5. A wafer cleaning device according to claim 4, characterized in that: A second shaft (56) is rotatably mounted on the top of the second frame (51), a second gear (561) is fixedly mounted on the outer side of the second shaft (56), a second gear ring (562) is integrally formed on the inner side of the transfer ring frame (53), the outer side of the second gear (561) and the inner side of the second gear ring (562) are meshingly connected, a third motor (563) is fixedly mounted on the top of one of the second frames (51), and a driving end of the third motor (563) is fixedly mounted on one end of the second shaft (56).

6. The wafer cleaning device according to claim 1, characterized in that: The cleaning mechanism (6) comprises a fourth frame (61), wherein the fourth frame (61) is fixedly mounted on the top of the base (1) on one side close to the fixed-rotation mechanism (3), a third seat body (62) is fixedly mounted on the top of the fourth frame (61), a rotating seat (63) is provided in the middle of the top of the third seat body (62), a rotating column (631) is fixedly mounted in the middle of the bottom of the rotating seat (63), the rotating column (631) is rotatably mounted in the middle of the third seat body (62), a fourth motor (632) is fixedly mounted on the bottom of the third seat body (62), a driving end of the fourth motor (632) and the bottom end of the rotating column (631) are fixedly mounted, a lifting slide frame (64) is fixedly mounted in the middle of the top of the rotating seat (63), two longitudinal slide seats (641) symmetrically distributed are provided in the sliding card in the lifting slide frame (64), and a double-headed screw (64) is rotatably mounted in the middle of the lifting slide frame (64) 642), the longitudinal slide seat (641) is threadedly mounted on the outside of the double-headed screw (642), a fifth motor (643) is fixedly mounted on the top of the lifting slide frame (64), the driving end of the fifth motor (643) and the top of the double-headed screw (642) are fixedly mounted, an L-shaped frame (65) is fixedly mounted on the side end of the longitudinal slide seat (641), and a cleaning shaft ( 66), a cleaning brush roller (661) is fixedly mounted on the outer side of the cleaning shaft (66), a sixth motor (662) is fixedly mounted on one end of the L-shaped frame (65) away from the longitudinal sliding seat (641), a driving end of the sixth motor (662) and one end of the cleaning shaft (66) are fixedly mounted, a fourth seat body (67) is fixedly mounted on the side ends of the L-shaped frame (65), and a liquid spray pipe (672) is fixedly mounted on the fourth seat body (67).

7. A wafer cleaning device according to claim 6, characterized in that: A connecting hose (673) is fixedly mounted on one end of each of the liquid spraying pipes (672), and a liquid guiding main pipe (68) is fixedly mounted on the ends of the two connecting hoses (673).

8. The wafer cleaning device according to claim 4, characterized in that: The first transport mechanism (4) comprises two groups of transport side frames (41) which are symmetrically distributed. The transport side frames (41) are fixedly mounted on the top of the base (1). A transport shaft (42) is rotatably mounted on the top of the transport side frames (41). A transport wheel (43) is fixedly mounted on the inner end of the transport shaft (42). A transport belt (431) is movablely sleeved on the outer sides of the two transport wheels (43) on the same side. The transfer ring frame (53) is located between the two transport belts (431). A seventh motor (44) is fixedly mounted on the top of one of the transport side frames (41). The driving end of the seventh motor (44) and the end of one of the transport shafts (42) are fixedly mounted. A common drive shaft (45) is fixedly mounted between the two transport shafts (42).

9. A wafer cleaning device according to claim 8, characterized in that: The second transport mechanism (7) comprises two groups of transport longitudinal frames (71) which are symmetrically distributed. The transport longitudinal frames (71) are fixedly mounted on the top of the base (1). A transport roller (72) is rotatably mounted on the top of the transport longitudinal frames (71). The outer movable sleeves of the two transport rollers (72) are provided with transport belts (73). An eighth motor (74) is fixedly mounted on the top of one of the transport longitudinal frames (71). The driving end of the eighth motor (74) and the end of one of the transport rollers (72) are fixedly mounted. The transport belt (73) and the transport ring belt (431) in the second transport mechanism (7) are vertically distributed. The transport belt (73) in the second transport mechanism (7) vertically penetrates the transfer ring frame (53).

10. A wafer processing device, characterized in that: It comprises a wafer cleaning device as described in any one of claims 1 to 9.

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