Silicon wafer air floating type moving device
By adopting a gas-floating mobile device during silicon wafer transportation, using the air pressure difference and the electrical actuation deformation of the lead-free piezoelectric metamaterial workbench, the contactless movement of the silicon wafer is achieved, solving the problems of wear and scratches in traditional transportation modes, and improving production quality and efficiency.
Patent Information
- Application Number
- CN202510120009.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-25
- Publication Date
- 2025-04-25
AI Technical Summary
Traditional silicon wafer transportation methods are likely to cause silicon wafer wear and surface scratches during transportation, affecting production quality and efficiency.
The silicon wafer air-floating mobile device is adopted, which includes a guide rail, a workbench and an air compressor. The silicon wafer is moved by forming an air pressure difference through the air film, and the electrical actuation deformation of the lead-free piezoelectric metamaterial workbench is used to form a wedge gap in combination with the air film to achieve contactless movement of the silicon wafer.
The contactless movement of the silicon wafer is achieved, avoiding wear and scratches, and improving production quality and efficiency.
Smart Images
Figure CN119890116A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of air-floating guide rails, and in particular to a silicon chip air-floating moving device, and in particular to a contactless novel lead-free piezoelectric metamaterial silicon chip air-floating moving device. Background Art
[0002] The air-floating guide is a precision mechanical component based on the gas static pressure effect. Its working principle is to form a layer of air film between the guide rail and the worktable to achieve contactless smooth movement, thereby reducing friction and wear. The main components of the air-floating guide include the guide rail, the air flow generator and the air film. The guide rail is usually made of metal or composite materials, and has special air flow channels on the surface. The air-floating guide has many significant advantages, including high precision, high speed, high rigidity, strong load capacity, long life, low energy consumption, clean and environmentally friendly, and quiet and stable. These characteristics make it widely used in precision machining, semiconductor manufacturing, optical instruments, medical equipment and other fields. For example, in semiconductor manufacturing, air-floating guides can achieve nanometer-level positioning accuracy, while in fields such as optical grinding and laser cutting, its high speed and stable performance provide significant production efficiency improvements.
[0003] With the continuous development of technology, the design and application of air-floating guide rails are also constantly improving. However, in the manufacturing and transportation of precision devices, traditional transportation methods often have some shortcomings. For example, during transportation, the contact between the product and the track causes product wear and surface scratches, which greatly reduces production quality and efficiency. Summary of the invention
[0004] In view of the deficiencies of the prior art, the present invention provides a silicon wafer air-floating moving device, which can realize contactless movement of silicon wafers.
[0005] To achieve the above object, the present invention provides the following technical solutions: The present invention proposes a silicon wafer air-floating moving device, comprising a power supply system, an air compressor, a guide rail, and a workbench arranged above the guide rail; the guide rail is provided with an air inlet at the front end, an air outlet at the upper part, and a pipeline inside, the air inlet is connected to the air outlet through the pipeline, the air compressor is connected to the air inlet, and is used to supply air to the guide rail and spray it from the air outlet, so that an air film is formed between the guide rail and the workbench; the workbench is provided with through holes, the air outlets are arranged directly below the through holes, and the number of the air outlets is the same as that of the through holes, and is arranged one-to-one; the material of the workbench is lead-free piezoelectric metamaterial, the power supply system is connected to the workbench, and is used to supply power to the upper and lower surfaces of the workbench to cause the workbench to deform, and a wedge-shaped gap is formed between the guide rail and the workbench in combination with the air film.
[0006] By utilizing the special function of the new lead-free piezoelectric metamaterial, the upper and lower surfaces of the workbench are electrified, so that the gap between the workbench and the guide rail is wedge-shaped, that is, the height of the gap at one end is h2, and the height of the gap at the other end is h1, and h1 is greater than h2. Specifically, because the air pressure at one end close to the air joint is greater than the air pressure at the other end, an air pressure difference is formed. This air pressure difference pushes the silicon wafer to move along the pressure gradient direction, so the height of the gap at one end close to the air joint is h2.
[0007] Furthermore, the through hole is configured as a throttle, and the throttle comprises a concave air cavity arranged at the lower part and an air supply hole arranged at the upper part, and the diameter of the concave air cavity is the same as the diameter of the air outlet hole.
[0008] Furthermore, there are at least eight air outlet holes and throttles, which are arranged at equal intervals; and the diameters of the air supply holes decrease in equal amounts from one end to the other.
[0009] Furthermore, the diameter of the air supply hole ranges from 0.1 to 1 mm, the diameter of the air supply hole at the left end is 1 mm, and decreases by 0.1 mm from left to right.
[0010] Furthermore, the moving device of the present invention also includes a base, which is arranged at the lower part of the guide rail and is used to fix the guide rail to prevent it from moving.
[0011] Furthermore, the base is provided with bolt holes, and the base is fixed by bolts to limit the movement of the guide rail.
[0012] Furthermore, the mobile device of the present invention also includes an air connector, which is arranged on the air inlet and matched with the air inlet, and the air compressor is connected to the air connector through a conduit.
[0013] Furthermore, the power supply system includes a power supply and a wire, the upper and lower surfaces of the workbench are sprayed with copper paste, and the upper and lower surfaces of the workbench are respectively connected to the positive and negative electrodes of the power supply through the wires. Further, the positive electrode is connected to the upper surface of the workbench, and the negative electrode is connected to the lower surface of the workbench, and the power supply adopts an AC power supply.
[0014] Furthermore, the mobile device of the present invention also includes a laser displacement sensor and a control system, and the control system is communicatively connected to the laser displacement sensor and the power supply system respectively; a smooth micro-reflective sheet is attached to the surface of the silicon wafer, and the laser displacement sensor is arranged above the silicon wafer, and is used to collect the position of the silicon wafer through the reflective sheet, and transmit the collected silicon wafer position information to the control system; the control system is used to compare the received silicon wafer position with the preset position to obtain the position error, and send an adjustment signal to the power supply system to control the deformation of the workbench according to the position error, thereby controlling the movement of the silicon wafer.
[0015] In order to enable the silicon wafer to move contactlessly, the present invention abandons the traditional linear guide scheme and adopts a new scheme of air-floating guide. The air compressor is connected to the air joint on the front end surface of the guide through an air pipe, etc., and a pipeline is processed inside the guide, thereby changing the flow direction of the gas. The diameter and spacing of the air outlet holes are the same, and a base is used to limit the movement of the guide. The upper and lower surfaces of the workbench are energized by the power supply system to cause a slight deformation, thereby making the air pressure at both ends of the air film different. The air pressure in the area with a larger air film thickness is lower, and the air pressure in the area with a smaller air film thickness is higher. This air pressure difference is used to push the silicon wafer to move along the pressure gradient direction. In addition, the diameter of the air supply hole of the throttle changes evenly. When the gas flows through a throttle with a smaller diameter, the flow rate is larger and the pressure is smaller. The gas flows through a throttle with a smaller diameter. When the throttle is larger, the flow rate is smaller and the pressure is larger. This pressure difference is used to achieve contactless movement of the silicon wafer. A micro reflective sheet is attached to the surface of the silicon wafer, and a laser displacement sensor is placed about 100 mm above the silicon wafer. At least 8 laser displacement sensors are arranged in a row. The laser displacement sensor is used to monitor the position change of the reflective sheet and the position of the silicon wafer at all times. The control system will continuously compare the position obtained by the laser displacement sensor with the preset trajectory, calculate the error by comparing the difference between the actual position and the expected position, and then adjust the movement trajectory of the silicon wafer according to the real-time error through the control system (PID control algorithm). The control system transmits the control signal to the power supply system, and the power supply system fine-tunes the deformation of the workbench according to the control signal, thereby accurately controlling the movement of the silicon wafer.
[0016] It should be noted that: the control system obtains fine-tuning instructions (control signals) to enable the silicon wafer to move along a preset trajectory based on the real-time silicon wafer position error, which is an existing technology. The power supply system adjusts the voltage according to the received control signal, which is also an existing technology.
[0017] Compared with the prior art, the present invention provides a silicon wafer air-floating moving device, which has the following beneficial effects: (1) The present invention utilizes air pressure difference to push the silicon wafer to move, thereby realizing contactless movement of the silicon wafer.
[0018] (2) The present invention can monitor the moving position of the silicon wafer and adjust the position of the silicon wafer according to a preset trajectory by means of a laser displacement sensor, a control system and a micro reflector. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of the main assembly view of the mobile device of the present invention when it is not working; Figure 2 A schematic diagram of the gas flow of the mobile device of the present invention; Figure 3 It is a schematic diagram of the working assembly of the mobile device of the present invention; Figure 4 It is a schematic diagram of the structure of the workbench in the mobile device of the present invention.
[0020] The meanings of the reference numerals in the figures are: 1-guide rail; 11-pipeline; 12-air joint; 13-air outlet; 2-workbench; 21-throttle; 3-silicon wafer; 31-reflector; 4-base; 41-bolt hole. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0022] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values of the parts and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may also include different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so that once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.
[0023] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the protection content of the present invention.
[0024] like Figures 1 to 4As shown, the present invention is a contactless new type lead-free piezoelectric metamaterial silicon wafer air-floating mobile device, comprising a base 4, a guide rail 1 arranged on the base 4, a workbench 2 arranged above the guide rail 1, an air compressor and a power supply system. The guide rail 1 has an air inlet at the front end, an air outlet 13 at the upper part, and a pipeline 11 arranged inside. The air inlet is connected to the air outlet 13 through the pipeline 11, and the pipeline 11 is used to change the flow direction of the gas. An air connector 12 is installed on the air inlet, and the air connector 12 and the air compressor are connected through an air pipe. The air compressor is used to continuously supply high-pressure gas to the guide rail 1, and the high-pressure gas flows out from the air outlet 13 at the upper part of the guide rail 1. The high-pressure gas forms an air film between the guide rail 1 and the workbench 2. The material of the workbench 2 is lead-free piezoelectric metamaterial, and the power supply system is connected to the workbench 2, which is used to supply power to the upper and lower surfaces of the workbench 2 to cause the workbench 2 to deform, and a wedge-shaped gap is formed between the guide rail 1 and the workbench 2 in combination with the air film.
[0025] The workbench 2 is provided with through holes, and the air outlet holes 13 are arranged directly below the through holes, and the number of the through holes is the same as that of the through holes, and they are arranged one by one. By improving the shape of the through holes, a throttle 21 is formed, and the specific improvement scheme is as follows: the throttle 21 includes a concave cavity arranged at the bottom and an air supply hole arranged at the top, the diameter of the concave cavity is the same as the diameter of the air outlet hole 13 of the guide rail 1, and the diameter of the air supply hole becomes smaller and smaller, such as Figure 4 As shown, d1 to d10 all represent the diameter of the air supply hole, and the diameters of the air supply holes decrease successively from d1 to d10, and the diameters of several air supply holes decrease successively by 0.1 mm, thereby achieving different heights of silicon wafers. The throttle 21 is connected to the power supply system, and the power supply system energizes the upper and lower surfaces of the workbench 2.
[0026] In a specific implementation of the present embodiment, the power supply system includes a power supply and a wire. The upper and lower surfaces of the workbench 2 are sprayed with copper paste. The upper and lower surfaces of the workbench 2 are respectively connected to the positive and negative electrodes of the power supply through wires; the positive electrode is connected to the upper surface of the workbench 2, and the negative electrode is connected to the lower surface of the workbench 2. The power supply adopts an AC power supply.
[0027] In a specific implementation of the present embodiment, the workbench 2 adopts a new type of lead-free piezoelectric metamaterial. In this way, by energizing the upper and lower surfaces of the workbench, the workbench can produce a deformation of h1 to h2, and the air pressure at one end close to the air joint is greater than the air pressure at the other end, forming an air pressure difference. The air pressure at both ends of the air film is different. This air pressure difference is used to push the silicon wafer to move along the pressure gradient direction, thereby realizing the contactless movement of the silicon wafer; a micro reflective sheet 31 is attached to the surface of the silicon wafer, a laser sensor is placed about 100 mm above the silicon wafer, and at least 8 laser displacement sensors are arranged in a row. The position change of the micro reflective sheet 31 is monitored by the laser displacement sensor, and the position of the silicon wafer is monitored at all times. The control system will continuously compare the position obtained by the laser displacement sensor with the preset trajectory, and calculate the error by comparing the difference between the actual position and the expected position. Then, the control system (PID control algorithm) will adjust the motion trajectory of the silicon wafer according to the real-time error, and the control system will transmit the control signal to the power supply system, and the power supply system will fine-tune the deformation of the workbench according to the control signal, thereby accurately controlling the movement of the silicon wafer.
[0028] A base 4 is installed at the bottom of the guide rail 1. The base 4 is provided with bolt holes 41, which are fixed by bolts to limit the movement of the guide rail 1 and prevent errors.
[0029] When using the mobile device of the present invention, first, according to Figures 1 to 4 As shown, the moving device of the present invention can realize the contactless movement of the silicon wafer. The air compressor is used to supply air to the air joint 12 on the guide rail 1, so that the pipeline 11 is filled with gas to form a certain air pressure, which can support the workbench 2 and make the silicon wafer form a certain height; the power supply system is used to energize the workbench 2 made of special material (i.e., the new lead-free piezoelectric metamaterial), so that it produces a deformation of h1~h2, and the air film forms a certain air pressure difference. The air pressure difference is used to push the silicon wafer to move along the pressure gradient direction, and the change in the diameter of the through hole of the throttle 21 is used to make the silicon wafer form a certain height difference (h3~h12), thereby realizing the contactless movement of the silicon wafer.
[0030] It should be noted that, in this application, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or equipment including the elements.
[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A silicon wafer air floating moving device, characterized in that: The invention comprises a power supply system, an air compressor, a guide rail and a workbench arranged above the guide rail; an air inlet is provided at the front end of the guide rail, an air outlet is provided at the upper part, and a pipeline is provided inside, the air inlet is connected to the air outlet through the pipeline, the air compressor is connected to the air inlet, and is used to supply air to the guide rail and spray air from the air outlet, so that an air film is formed between the guide rail and the workbench; through holes are provided on the workbench, the air outlets are arranged directly below the through holes, and the number of the air outlets is the same as that of the through holes, and they are arranged one by one; the material of the workbench is lead-free piezoelectric metamaterial, the power supply system is connected to the workbench, and is used to supply power to the upper and lower surfaces of the workbench to cause the workbench to deform, and a wedge-shaped gap is formed between the guide rail and the workbench in combination with the air film.
2. The silicon wafer air-floating moving device according to claim 1, characterized in that: The through hole is configured as a throttle, and the throttle comprises a concave air cavity arranged at the lower part and an air supply hole arranged at the upper part, and the diameter of the concave air cavity is the same as the diameter of the guide rail air outlet hole.
3. The silicon wafer air-floating moving device according to claim 2, characterized in that: There are at least eight air outlet holes and throttles, which are arranged at equal intervals; the diameters of the air supply holes decrease in equal magnitude from one end to the other end.
4. The silicon wafer air-floating moving device according to claim 3, characterized in that: The diameter of the air supply hole ranges from 0.1 to 1 mm, the diameter of the air supply hole at the left end is 1 mm, and decreases by 0.1 mm from left to right.
5. The silicon wafer air-floating moving device according to claim 1, characterized in that: It also includes a base, which is arranged at the lower part of the guide rail and is used to fix the guide rail so that it does not move.
6. The silicon wafer air-floating moving device according to claim 5, characterized in that: The base is provided with bolt holes.
7. The silicon wafer air-floating moving device according to claim 1, characterized in that: It also includes an air connector, which is arranged on the air inlet and matches the air inlet. The air compressor is connected to the air connector through a conduit.
8. The silicon wafer air-floating moving device according to claim 1, characterized in that: The power supply system includes a power supply and a wire. The upper and lower surfaces of the workbench are sprayed with copper paste. The upper and lower surfaces of the workbench are respectively connected to the positive and negative electrodes of the power supply through the wires.
9. The silicon wafer air-floating moving device according to claim 1, characterized in that: It also includes a laser displacement sensor and a control system, which are respectively communicatively connected with the laser displacement sensor and the power supply system; a reflective sheet is attached to the surface of the silicon wafer, and the laser displacement sensor is arranged above the silicon wafer, and is used to collect the position of the silicon wafer through the reflective sheet, and transmit the collected silicon wafer position information to the control system; the control system is used to compare the received silicon wafer position with the preset position to obtain the position error, and send an adjustment signal to the power supply system to control the deformation of the workbench according to the position error, thereby controlling the movement of the silicon wafer.