Manipulator turnover device for special semiconductor equipment

Abstract

The invention discloses a manipulator turnover device for semiconductor special equipment, and relates to the technical field of turnover. The device comprises a device body, a material taking table is arranged on the left side of the device body, a machining assembly is arranged at the top of the inner wall of the device body, an electric sliding rail is arranged at the bottom of the inner wall of the device body, an air cylinder assembly is arranged in the electric sliding rail, an anti-deviation device is arranged above the air cylinder assembly, and an anti-pollution device is arranged on the periphery of the anti-deviation device. An anti-adhesion device is arranged on the inner side of the anti-pollution device, the anti-deviation device comprises a telescopic air rod, and the bottom of the fixed end of the telescopic air rod is fixedly installed on the top of the air cylinder assembly. According to the invention, it can be ensured that the vacuum adsorption assembly always bears the workpiece in the central direction, the vacuum adsorption assembly always adsorbs the semiconductor in the middle, the suction force between the workpiece and the vacuum adsorption assembly is prevented from deviating to reduce the adsorption strength, and the possibility that the semiconductor falls off and is damaged in the overturning process is prevented from being increased.

Description

Technical Field

[0001] The invention relates to the field of flipping technology, in particular to a manipulator flipping device for semiconductor-specific equipment. Background Art

[0002] With the continuous improvement of the automation level of semiconductor-specific equipment, manipulators of various structures and functions are being used more and more widely. As the requirements of wafer processing technology continue to increase, it is often necessary to achieve adsorption, grasping and flipping of wafers to meet different processing requirements.

[0003] The patent with the patent announcement number CN201126814Y discloses a manipulator flipping device for semiconductor special equipment, wherein a vacuum adsorption interface is provided on the surface of the flip output seat, and a closed chamber connected to the vacuum adsorption interface is provided in the flip output seat; the rear end of the flip shaft is fixedly connected to a rotary joint connected to an adsorption drive air source, an airway is provided along the axis of the flip shaft, the front end of the airway is connected to the closed chamber of the flip output seat, and the rear end of the airway is connected to the airway of the rotary joint; the flip shaft is a stepped shaft with a gradually decreasing diameter from front to back, a bearing is sleeved on the frontmost step of the flip shaft, the flip shaft is fixed to the shaft seat by a bearing gland and screws, the shaft seat is fixed on the base, a bearing lock nut is sleeved on a step behind the bearing on the flip shaft, a flip gear is fixed on a step behind the bearing lock nut on the flip shaft, the flip gear is connected to the driving gear in transmission connection, and the driving gear is connected to the output shaft of the flip cylinder, and has the advantages of small size, light weight, simple structure, long service life and low cost.

[0004] However, the device still has some shortcomings: the device has good performance while realizing semiconductor flipping, but the semiconductor is easy to deviate from the center position of the vacuum adsorption component during the process of the vacuum adsorption component adsorbing the semiconductor. At this time, the adsorption force of the vacuum adsorption component on the semiconductor is offset, thereby reducing the adsorption strength during the semiconductor flipping process and increasing the possibility of the semiconductor falling and being damaged during the flipping process. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a robot flipping device for semiconductor-specific equipment, which solves the problems raised in the above-mentioned background technology.

[0006] To achieve the above purpose, the present invention is implemented by the following technical scheme: a manipulator flip device for semiconductor special equipment, comprising a device body, a material picking table is arranged on the left side of the device body, a processing assembly is arranged on the top of the inner wall of the device body, an electric slide rail is arranged at the bottom of the inner wall of the device body, and a cylinder assembly is arranged inside the electric slide rail; An anti-deviation device is arranged above the cylinder assembly, an anti-pollution device is arranged outside the anti-deviation device, and an anti-adhesion device is arranged inside the anti-pollution device; The anti-bias device comprises a telescopic gas rod, the bottom of the fixed end of the telescopic gas rod is fixedly mounted on the top of the cylinder assembly, the telescopic gas rod is connected to the cylinder assembly, a U-shaped plate is fixedly mounted on the top of the telescopic end of the telescopic gas rod, two square grooves are arranged at the bottom of the U-shaped plate, and the two square grooves are symmetrically distributed about the axis of the U-shaped plate, an electric rotating rod is rotatably mounted on the inner wall of the U-shaped plate, a vacuum adsorption assembly is penetrated and fixedly mounted on the outer wall of the electric rotating rod, a flat plate is fixedly mounted on the inner wall of the U-shaped plate, the flat plate is located above the electric rotating rod, a screw rod is penetrated and rotatably mounted inside the flat plate, a limiting plate is fixedly mounted on the outer wall of the processing assembly, a cam is fixedly mounted on the bottom of the screw rod, an L-shaped push plate is slidably mounted on the top of the vacuum adsorption assembly through the limiting groove, and a cylinder is fixedly mounted on the bottom of the inner wall of the L-shaped push plate, a semiconductor workpiece enters from the left side of the device body and is placed inside the processing assembly, and when the processing is completed and the workpiece needs to be transported to the material-retrieving table, the electric slide rail is started, and the electric slide rail drives the cylinder assembly inside itself When the U-shaped plate is reset, the screw rod reverses and releases the limit of the L-shaped push plate on the workpiece.

[0007] According to the above technical solution, the spiral groove on the outer wall of the screw rod is threadedly connected to the inner wall of the limit plate, a spring is arranged between the L-shaped push plate and the vacuum adsorption assembly, and the side of the L-shaped push plate close to the center of the vacuum adsorption assembly is designed as a soft surface, and the outer wall of the cylinder is in contact with the arc surface of the outer wall of the cam.

[0008] According to the above technical solution, the anti-pollution device includes an elastic telescopic rod, a hollow buffer plate, an inclined plate, an elastic strip and a resistance column, the fixed end of the elastic telescopic rod is fixedly installed at the bottom of the inner wall of the device body, the bottom of the hollow buffer plate is fixedly installed at the top of the telescopic end of the elastic telescopic rod, the bottom of the inclined plate is hinged at the top edge of the hollow buffer plate, a slide groove is opened inside the hollow buffer plate, the upper and lower sides of the elastic strip are fixedly installed on the inner wall of the slide groove in the inclined plate, the resistance column is fixedly installed on the outer wall of the U-shaped plate away from the inclined plate, and the bottom of the U-shaped plate and the top of the hollow buffer plate are connected. The U-shaped plate is in contact with the hollow buffer plate, and the hollow buffer plate is stably limited by the elastic telescopic rod. At the same time, when the U-shaped plate moves upward, it drives the resistance column to move synchronously. During the upward movement of the resistance column, it keeps in contact with the inner wall of the inclined plate. As the resistance column rises, the hinge shaft between the inclined plate and the hollow buffer plate begins to rotate, causing the inclined plate to rotate in an arc shape away from the U-shaped plate. As a result, the inclined plate is limited by the torsion spring, causing the force applied by the inclined plate to the U-shaped plate to gradually increase. At this time, the inclined plate drives the elastic strip to move synchronously, and when the elastic strip receives the vibration force caused by the telescopic gas rod during operation, it will slightly deform to absorb the force.

[0009] According to the above technical solution, the top of the hollow buffer plate contacts the bottom of the U-shaped plate, a torsion spring is provided between the bottom of the inclined plate and the hollow buffer plate, and the outer wall of the abutment column contacts the inner wall of the inclined plate.

[0010] According to the above technical scheme, the anti-pollution device also includes a U-shaped telescopic column, a baffle and a scraper. The top of the fixed end of the U-shaped telescopic column is fixedly installed on the bottom of the hollow buffer plate, the top of the baffle is slidably installed on the bottom of the square groove of the U-shaped plate through a limiting groove, the bottom of the baffle is fixedly installed on the top of the telescopic end of the U-shaped telescopic column, the outer wall of the scraper is fixedly installed on the inner wall of the square groove in the U-shaped plate, the bottom of the scraper contacts the top of the baffle, and the hollow buffer plate limits the fixed end of the U-shaped telescopic column. When the U-shaped plate moves to the left, the telescopic end of the U-shaped telescopic column limits the baffle, and as the U-shaped plate moves to the left, the scraper is driven to scrape the top of the baffle.

[0011] According to the above technical solution, the anti-adhesion device includes an L-shaped pull plate, a collection box and a fan. The top of the L-shaped pull plate is fixedly installed on the bottom of the hollow buffer plate, the outer wall of the collection box is fixedly installed on the side of the L-shaped pull plate close to the center of the device body, and the outer wall of the fan is fixedly installed on the inner wall of the L-shaped pull plate. The hollow buffer plate limits the L-shaped pull plate, and the L-shaped pull plate limits the collection box. The collection box collects fallen impurities or dirt in a centralized manner.

[0012] The bottom of the connecting rod slide is slidably mounted on the bottom of the inner wall of the collection box, and at the same time, the telescopic end of the U-shaped telescopic column drives the limiting telescopic rod to move upward, and the telescopic end of the limiting telescopic rod drives the angular arc plate to move synchronously. When the angular arc plate moves upward, the outer wall contacts the inner wall of the air guide plate, causing the hinge shaft between the air guide plate and the L-shaped pull plate to start rotating, and the air guide plate moves toward the inner wall of the L-shaped pull plate. The U-shaped plate is swung to the left, at which time the wind guide plate guides the wind blown out by the fan at an angle, and the wind is poured into the inner wall of the U-shaped plate through the square groove of the U-shaped plate. At the same time, when the U-shaped plate moves to the left, it drives the angular arc plate to move synchronously, and the angular arc plate pulls the telescopic end of the limiting telescopic rod to extend synchronously. At this time, the arc surface of the angular arc plate contacts the arc surface of the arc block, and the arc surface guidance of the arc block prompts the arc block to push the wind guide plate to move toward the inner wall of the L-shaped pull plate. When the angular arc plate passes over a single arc block, the wind guide plate is reset by the torsion spring, and the reciprocating process enables the wind guide plate to swing back and forth to swing and guide the wind force of the fan; in the process of the reciprocating swing of the wind guide plate, it drives the transmission plate to move synchronously, and the bottom of the transmission plate is limited by the top of the connecting rod slide plate, prompting its own hinge shaft to start rotating, and driving the connecting rod slide plate to slide and reset along the bottom of the inner wall of the collection box toward the center of the device body, and so on.

[0013] According to the above technical solution, the top of the angular arc plate is fixedly installed on the left side of the bottom of the U-shaped plate, the arc surface of the arc block is located on the movement trajectory of the angular arc plate, the transmission plate is located below the arc block, and the top of the connecting rod slide plate is hinged to the bottom of the transmission plate.

[0014] The present invention provides a robot flipping device for semiconductor-specific equipment. It has the following beneficial effects: (1) The present invention reduces manual intervention in the semiconductor device processing process and simplifies the work process by setting an anti-bias device and cooperating with a telescopic gas rod, a U-shaped plate, an electric rotating rod, a vacuum adsorption component, a flat plate, a screw rod, a limit plate, a cam, an L-shaped push plate and a cylinder. At the same time, the vacuum adsorption component can be freely flipped 90 degrees or 180 degrees, which is convenient for workers to take materials or observe the processing quality of the workpiece; at the same time, it is ensured that the vacuum adsorption component is always in the center position of the workpiece, so that the vacuum adsorption component always adsorbs the semiconductor in the center, avoids the suction force between the workpiece and the vacuum adsorption component from being offset and reducing the adsorption strength, and prevents the possibility of the semiconductor falling and being damaged during the flipping process. At the same time, the soft surface of the L-shaped push plate and the single clamping push effectively prevent damage to the precision parts of the semiconductor. (2) The present invention sets an anti-pollution device, and cooperates with a U-shaped plate, an elastic telescopic rod, a hollow buffer plate, an inclined plate, an elastic strip, a resistance column, a U-shaped telescopic column, a baffle and a scraper. The elastic telescopic rod and the hollow buffer plate are used to resonate and eliminate the vibration generated by the operation of the equipment when the U-shaped plate moves horizontally, thereby reducing the interference of the vibration on the vacuum adsorption component and the workpiece. At the same time, the inclined plate gradually increases the stable supporting force as the U-shaped plate rises, and then reduces the vibration intensity of the telescopic gas rod when it is extended and retracted through the elastic strip, thereby avoiding the workpiece and the L-shaped push plate from being damaged by collision due to vibration; and after the bottom of the square groove of the U-shaped plate loses the shielding of the baffle, the semiconductor impurities or dirt accumulated at the bottom of the inner wall of the U-shaped plate fall off in time, thereby avoiding the vacuum adsorption component from being contaminated by dirt when carrying the workpiece and turning it over, or from being worn by friction particles. (3) The present invention sets an anti-adhesion device, and cooperates with a U-shaped telescopic column, an L-shaped pull plate, a collection box, a fan, an air guide plate, an arc block, a limit telescopic rod, an angle arc plate, a transmission plate and a connecting rod slide plate to enable the air guide plate to achieve dynamic and static wind guidance work. The impurities and dirt attached to the gap or corner of the inner wall of the U-shaped plate are blown away by wind at different angles, so as to prevent the impurities or dirt from adhering for a long time and volatilizing their own chemical properties to cause corrosion to equipment and other parts, and to achieve centralized collection of dirt to avoid increasing the difficulty of maintenance personnel's work; at the same time, relying on the reciprocating friction of the connecting rod slide plate on the bottom of the inner wall of the collection box, it is effectively prevented that the impurities or dirt collected for a long time in the collection box come into contact and solidify, and to prevent the semiconductor impurities of different materials from mixing with the coating to cause adverse consequences. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the present invention as a whole; Figure 2 It is a cross-sectional schematic diagram of the present invention as a whole; Figure 3 It is a schematic diagram of the anti-deviation device of the present invention; Figure 4 It is a schematic cross-sectional view of a partial structure of the anti-deviation device of the present invention; Figure 5It is a schematic diagram of the anti-pollution device of the present invention; Figure 6 This is a schematic diagram of the anti-pollution device of the present invention from a bottom perspective; Figure 7 It is a schematic diagram of the anti-adhesion device of the present invention; Figure 8 It is a schematic diagram of the structure of the collection box of the present invention.

[0016] In the figure: 1. device body; 2. material-retrieving table; 3. processing assembly; 31. electric slide rail; 32. cylinder assembly; 4. anti-bias device; 41. telescopic gas rod; 42. U-shaped plate; 43. electric rotating rod; 44. vacuum adsorption assembly; 45. flat plate; 46. screw rod; 47. limit plate; 48. cam; 49. L-shaped push plate; 410. cylinder; 5. anti-pollution device; 51. elastic telescopic rod; 52. hollow buffer plate; 53. inclined plate; 54. elastic strip; 55. resistance column; 56. U-shaped telescopic column; 57. baffle; 58. scraper; 6. anti-adhesion device; 61. L-shaped pull plate; 62. collection box; 63. fan; 64. air guide plate; 65. arc block; 66. limit telescopic rod; 67. angular arc plate; 68. transmission plate; 69. connecting rod slide plate. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0018] See also Figure 1-Figure 8 , one embodiment of the present invention is: a manipulator flip device for semiconductor dedicated equipment, comprising a device body 1, a material taking table 2 is arranged on the left side of the device body 1, a processing assembly 3 is arranged on the top of the inner wall of the device body 1, an electric slide rail 31 is arranged on the bottom of the inner wall of the device body 1, and a cylinder assembly 32 is arranged inside the electric slide rail 31; An anti-deviation device 4 is arranged above the cylinder assembly 32, an anti-pollution device 5 is arranged outside the anti-deviation device 4, and an anti-adhesion device 6 is arranged inside the anti-pollution device 5; The anti-bias device 4 includes a telescopic gas rod 41, the bottom of the fixed end of the telescopic gas rod 41 is fixedly installed on the top of the cylinder assembly 32, the telescopic gas rod 41 is connected to the cylinder assembly 32, a U-shaped plate 42 is fixedly installed on the top of the telescopic end of the telescopic gas rod 41, two square grooves are arranged at the bottom of the U-shaped plate 42, and the two square grooves are symmetrically distributed around the axis of the U-shaped plate 42, an electric rotating rod 43 is rotatably installed on the inner wall of the U-shaped plate 42, a vacuum adsorption assembly 44 is penetrated and fixedly installed on the outer wall of the electric rotating rod 43, a flat plate 45 is fixedly installed on the inner wall of the U-shaped plate 42, the flat plate 45 is located above the electric rotating rod 43, a screw rod 46 is penetrated and rotatably installed inside the flat plate 45, a limiting plate 47 is fixedly installed on the outer wall of the processing assembly 3, a cam 48 is fixedly installed on the bottom of the screw rod 46, and a vacuum adsorption assembly 44 is fixedly installed on the top of the vacuum adsorption assembly 44. An L-shaped push plate 49 is slidably installed through a limit groove, and a cylinder 410 is fixedly installed on the bottom of the inner wall of the L-shaped push plate 49. The above cooperation reduces manual participation in the processing of semiconductor devices and simplifies the work process. At the same time, the vacuum adsorption component 44 can be freely flipped ninety degrees or one hundred and eighty degrees, which is convenient for the staff to take materials or observe the processing quality of the workpiece; the above cooperation ensures that the vacuum adsorption component 44 is always in the center position when receiving the workpiece, so that the vacuum adsorption component 44 always adsorbs the semiconductor in the center, avoids the suction force between the workpiece and the vacuum adsorption component 44 from offsetting and reducing the adsorption strength, and prevents the possibility of the semiconductor falling and being damaged during the flipping process. At the same time, the soft surface of the L-shaped push plate 49 and the single clamping push effectively prevent damage to the precision parts of the semiconductor.

[0019] The spiral groove on the outer wall of the screw rod 46 is threadedly connected to the inner wall of the limit plate 47, a spring is arranged between the L-shaped push plate 49 and the vacuum adsorption component 44, and the L-shaped push plate 49 is designed with a soft surface on the side close to the center of the vacuum adsorption component 44, and the outer wall of the cylinder 410 contacts the arc surface of the outer wall of the cam 48.

[0020] When in use, the semiconductor workpiece enters from the left side of the device body 1 and is placed inside the processing component 3. When the processing is completed and the workpiece needs to be transported to the material-retrieving table 2, the electric slide rail 31 is started, and the electric slide rail 31 drives the cylinder assembly 32 to slide to the left inside itself. Before that, the telescopic end of the telescopic gas rod 41 is driven by the cylinder assembly 32 to move upward, and the telescopic end of the telescopic gas rod 41 drives the U-shaped plate 42 to move synchronously, and the U-shaped plate 42 drives the electric rotating rod 43 to move upward, and the electric rotating rod 43 drives the vacuum adsorption assembly 44 to move upward and undertake the adsorption of the workpiece inside the processing assembly 3. When the vacuum adsorption assembly 44 moves to the left edge of the device body 1 through the electric slide rail 31, the electric rotating rod 43 is started, and the electric rotating rod 43 rotates along the inner wall of the U-shaped plate 42, and the electric rotating rod 43 drives the vacuum adsorption assembly 44 to turn over synchronously. Through the above cooperation, manual participation in the semiconductor device processing process is reduced, thereby simplifying the work process. At the same time, the vacuum adsorption assembly 44 is freely turned over by ninety degrees or one hundred and eighty degrees, which is convenient for the staff to take materials or observe the processing quality of the workpiece; When the U-shaped plate 42 moves upward, it drives the flat plate 45 to move synchronously. The flat plate 45 drives the screw rod 46 to slide upward along the inner wall of the limit plate 47. The screw rod 46 generates a rotational force to start rotating by limiting the inner wall of the limit plate 47 through the spiral groove on its outer wall. The screw rod 46 drives the cam 48 to rotate and resist the outer wall of the cylinder 410 to generate a resistance force. At this time, the cylinder 410 pushes the L-shaped push plate 49 to slide along the limit groove on the top of the vacuum adsorption component 44 toward its center through the resistance force. The L-shaped push plate 49 pushes the semiconductor device The workpiece is pushed in the center, and when the U-shaped plate 42 is reset, the screw rod 46 reverses to release the limit of the L-shaped push plate 49 on the workpiece. The above cooperation ensures that the vacuum adsorption component 44 is always in the center position when receiving the workpiece, so that the vacuum adsorption component 44 always adsorbs the semiconductor in the center, avoids the suction force between the workpiece and the vacuum adsorption component 44 to offset and reduce the adsorption strength, and prevents the possibility of the semiconductor falling and being damaged during the flipping process. At the same time, the soft surface of the L-shaped push plate 49 and the single clamping push effectively prevent damage to the precise parts of the semiconductor.

[0021] See also Figure 1-Figure 8 , based on the above embodiment, another embodiment of the present invention further includes an anti-pollution device 5; The anti-pollution device 5 includes an elastic telescopic rod 51, a hollow buffer plate 52, an inclined plate 53, an elastic strip 54 and a resistance column 55. The fixed end of the elastic telescopic rod 51 is fixedly mounted on the bottom of the inner wall of the device body 1, the bottom of the hollow buffer plate 52 is fixedly mounted on the top of the telescopic end of the elastic telescopic rod 51, the bottom of the inclined plate 53 is hinged at the top edge of the hollow buffer plate 52, a slide groove is provided inside the hollow buffer plate 52, the upper and lower sides of the elastic strip 54 are fixedly mounted on the inner wall of the slide groove in the inclined plate 53, and the resistance column 55 is fixedly mounted on the outer wall of the U-shaped plate 42 away from the inclined plate 53. Through the above cooperation, the elastic telescopic rod 51 and the hollow buffer plate 52 are used to resonate and eliminate the vibration generated by the operation of the equipment when the U-shaped plate 42 moves horizontally, so as to reduce the interference of the vibration on the vacuum adsorption component 44 and the workpiece. At the same time, the inclined plate 53 gradually increases the stable support force as the U-shaped plate 42 rises, and then reduces the vibration intensity of the telescopic gas rod 41 during extension and retraction through the elastic strip 54, so as to avoid the workpiece and the L-shaped push plate 49 from colliding and causing damage due to vibration.

[0022] The top of the hollow buffer plate 52 contacts the bottom of the U-shaped plate 42 , a torsion spring is provided between the bottom of the inclined plate 53 and the hollow buffer plate 52 , and the outer wall of the abutment column 55 contacts the inner wall of the inclined plate 53 .

[0023] The anti-pollution device 5 also includes a U-shaped telescopic column 56, a baffle 57 and a scraper 58. The top of the fixed end of the U-shaped telescopic column 56 is fixedly installed on the bottom of the hollow buffer plate 52, the top of the baffle 57 is slidably installed on the bottom of the square groove of the U-shaped plate 42 through a limiting groove, the bottom of the baffle 57 is fixedly installed on the top of the telescopic end of the U-shaped telescopic column 56, and the outer wall of the scraper 58 is fixedly installed on the inner wall of the square groove in the U-shaped plate 42, and the bottom of the scraper 58 contacts the top of the baffle 57. Through the above cooperation, after the bottom of the square groove of the U-shaped plate 42 loses the shielding of the baffle 57, the semiconductor impurities or dirt accumulated at the bottom of the inner wall of the U-shaped plate 42 fall off in time, so as to avoid the vacuum adsorption component 44 from being contaminated by dirt when carrying the workpiece to flip, or causing pollution or contact with friction particles to cause wear.

[0024] When in use, the bottom of the U-shaped plate 42 contacts the top of the hollow buffer plate 52, and the hollow buffer plate 52 is stably limited by the elastic telescopic rod 51. At the same time, when the U-shaped plate 42 moves upward, it drives the resistance column 55 to move synchronously. During the upward movement of the resistance column 55, it keeps in contact with the inner wall of the inclined plate 53. As the resistance column 55 rises, the hinge axis between the inclined plate 53 and the hollow buffer plate 52 begins to rotate, causing the inclined plate 53 to rotate in an arc in the direction away from the U-shaped plate 42. As a result, the inclined plate 53 is limited by the torsion spring to gradually increase the force applied by the inclined plate 53 to the U-shaped plate 42. At this time, the inclined plate 53 drives the elastic strip 54 to move synchronously. When the elastic strip 54 receives the force of the vibration during the operation of the telescopic gas rod 41, it will deform slightly to absorb the force. Through the above cooperation, the elastic telescopic rod 51 and the hollow buffer plate 52 are used to absorb the force generated by the operation of the equipment when the U-shaped plate 42 moves horizontally The vibration is eliminated by resonance, and the interference of vibration on the vacuum adsorption component 44 and the workpiece is reduced. At the same time, the inclined plate 53 gradually increases the stable supporting force as the U-shaped plate 42 rises, and then the elastic strip 54 is used to reduce the vibration intensity of the telescopic gas rod 41 during extension and retraction, so as to avoid the workpiece and the L-shaped push plate 49 from being damaged by collision caused by vibration; the hollow buffer plate 52 limits the fixed end of the U-shaped telescopic column 56, and when the U-shaped plate 42 moves to the left, the telescopic end of the U-shaped telescopic column 56 limits the baffle 57, and as the U-shaped plate 42 moves to the left, it drives the scraper 58 to scrape the top of the baffle 57. Through the above cooperation, the bottom of the square groove of the U-shaped plate 42 loses the shielding of the baffle 57, and the semiconductor impurities or dirt accumulated at the bottom of the inner wall of the U-shaped plate 42 fall off in time, so as to avoid the vacuum adsorption component 44 from being contaminated by dirt when carrying the workpiece to turn over, or causing wear and tear due to contact with friction particles.

[0025] See also Figure 1-Figure 8 , based on the above embodiment, another embodiment of the present invention further includes an anti-adhesion device 6; The anti-adhesion device 6 includes an L-shaped pull plate 61, a collecting box 62 and a fan 63. The top of the L-shaped pull plate 61 is fixedly installed on the bottom of the hollow buffer plate 52, the outer wall of the collecting box 62 is fixedly installed on the side of the L-shaped pull plate 61 close to the center of the device body 1, and the outer wall of the fan 63 is fixedly installed on the inner wall of the L-shaped pull plate 61.

[0026] The anti-adhesion device 6 also includes an air guide plate 64, an arc block 65, a limiting telescopic rod 66, an angular arc plate 67, a transmission plate 68 and a connecting rod slide plate 69. The bottom of the air guide plate 64 is hinged to the bottom of the inner wall of the L-shaped pull plate 61 through a torsion spring. The arc block 65 is fixedly installed on the inner wall of the air guide plate 64 near the outer wall of the hollow buffer plate 52. The right side of the fixed end of the limiting telescopic rod 66 is fixedly installed on the left side of the telescopic end of the U-shaped telescopic column 56. The right side of the angular arc plate 67 is fixedly installed on the left side of the telescopic end of the limiting telescopic rod 66. The top of the transmission plate 68 is hinged to the inner wall of the air guide plate 64. The bottom of the connecting rod slide plate 69 is slidably installed on the bottom of the inner wall of the collection box 62. The cooperation enables the wind guide plate 64 to achieve dynamic and static wind guidance work, and the impurities and dirt attached to the gaps or corners of the inner wall of the U-shaped plate 42 are blown away by wind at different angles, so as to avoid the impurities or dirt adhering for a long time and volatilizing their own chemical properties to cause corrosion to equipment and other parts, and to achieve centralized collection of dirt to avoid increasing the difficulty of maintenance personnel's work; through the above cooperation, the reciprocating friction of the connecting rod slide 69 on the bottom of the inner wall of the collection box 62 can effectively prevent the impurities or dirt collected in the collection box 62 for a long time from contacting and solidifying, and avoid the adverse consequences caused by the mixing of semiconductor impurities of different materials with the coating.

[0027] The top of the angular arc plate 67 is fixedly installed on the left side of the bottom of the U-shaped plate 42, the arc surface of the arc block 65 is located on the movement trajectory of the angular arc plate 67, the transmission plate 68 is located below the arc block 65, and the top of the connecting rod slide plate 69 is hinged to the bottom of the transmission plate 68.

[0028] When in use, the hollow buffer plate 52 limits the L-shaped pull plate 61, and the L-shaped pull plate 61 limits the collection box 62, and the collection box 62 collects the fallen impurities or dirt in a centralized manner. At the same time, the telescopic end of the U-shaped telescopic column 56 drives the limiting telescopic rod 66 to move upward, and the telescopic end of the limiting telescopic rod 66 drives the angle arc plate 67 to move synchronously. When the angle arc plate 67 moves upward, the outer wall of the angle arc plate 67 contacts the inner wall of the air guide plate 64, causing the hinge shaft between the air guide plate 64 and the L-shaped pull plate 61 to start rotating, and the air guide plate 64 swings toward the inner wall of the L-shaped pull plate 61. At this time, the wind guide plate 64 guides the wind blown out by the fan 63 at an angle. At this time, the wind is poured into the inner wall range of the U-shaped plate 42 through the square groove of the U-shaped plate 42. At the same time, when the U-shaped plate 42 moves to the left, it drives the angle arc plate 67 to move synchronously. The angle arc plate 67 pulls the telescopic end of the limit telescopic rod 66 to extend synchronously. At this time, the arc surface of the angle arc plate 67 contacts the arc surface of the arc block 65, and the arc surface guidance of the arc block 65 causes the arc block 65 to push the wind guide plate 64 to move toward the inner wall of the L-shaped pull plate 61. When the angle arc plate 67 passes over a single arc block 65, The wind guide plate 64 is reset by the torsion spring, and the reciprocating movement of the wind guide plate 64 enables the wind guide plate 64 to swing back and forth to guide the wind force of the fan 63. The above cooperation enables the wind guide plate 64 to achieve dynamic and static wind force guidance work, and the impurities and dirt attached to the inner wall gap or corner of the U-shaped plate 42 are blown by wind forces at different angles, so as to avoid the impurities or dirt from being attached for a long time and volatilizing their own chemical properties to cause erosion to parts such as equipment, and to achieve centralized collection of dirt to avoid increasing the difficulty of maintenance personnel; the reciprocating movement of the wind guide plate 64 During the process, the transmission plate 68 is driven to move synchronously. The bottom of the transmission plate 68 is limited by the top of the connecting rod slide 69, which prompts its own hinge shaft to start rotating, and drives the connecting rod slide 69 to slide and reset along the bottom of the inner wall of the collection box 62 toward the center of the device body 1, and repeats this process. Through the above coordination, the reciprocating friction of the connecting rod slide 69 on the bottom of the inner wall of the collection box 62 can effectively prevent the impurities or dirt collected in the collection box 62 for a long time from contacting and solidifying, and avoid the adverse consequences caused by the mixing of semiconductor impurities of different materials with the coating.

[0029] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A robot flipping device for semiconductor-specific equipment, comprising a device body (1), characterized in that: A material taking platform (2) is arranged on the left side of the device body (1), a processing assembly (3) is arranged on the top of the inner wall of the device body (1), an electric slide rail (31) is arranged on the bottom of the inner wall of the device body (1), and a cylinder assembly (32) is arranged inside the electric slide rail (31); An anti-deviation device (4) is arranged above the cylinder assembly (32), an anti-pollution device (5) is arranged outside the anti-deviation device (4), and an anti-adhesion device (6) is arranged inside the anti-pollution device (5); The anti-deflection device (4) comprises a telescopic gas rod (41), the bottom of a fixed end of the telescopic gas rod (41) is fixedly mounted on the top of the cylinder assembly (32), the telescopic gas rod (41) is in communication with the cylinder assembly (32), a U-shaped plate (42) is fixedly mounted on the top of the telescopic end of the telescopic gas rod (41), two square grooves are formed at the bottom of the U-shaped plate (42), and the two square grooves are symmetrically distributed about the axis of the U-shaped plate (42), an electric rotating rod (43) is rotatably mounted on the inner wall of the U-shaped plate (42), and the outer wall of the electric rotating rod (43) is penetrated and fixedly mounted A vacuum adsorption component (44) is installed. A flat plate (45) is fixedly installed on the inner wall of the U-shaped plate (42). The flat plate (45) is located above the electric rotating rod (43). A screw rod (46) is installed inside the flat plate (45) and is rotatably installed. A limit plate (47) is fixedly installed on the outer wall of the processing component (3). A cam (48) is fixedly installed at the bottom of the screw rod (46). An L-shaped push plate (49) is slidably installed on the top of the vacuum adsorption component (44) through a limit groove. A cylinder (410) is fixedly installed at the bottom of the inner wall of the L-shaped push plate (49).

2. A manipulator flipping device for semiconductor-specific equipment according to claim 1, characterized in that: The spiral groove on the outer wall of the screw rod (46) is threadedly connected to the inner wall of the limit plate (47); a spring is provided between the L-shaped push plate (49) and the vacuum adsorption component (44); and the side of the L-shaped push plate (49) close to the center of the vacuum adsorption component (44) is designed as a soft surface; the outer wall of the cylinder (410) is in contact with the arc surface of the outer wall of the cam (48).

3. A manipulator flipping device for semiconductor-specific equipment according to claim 2, characterized in that: The anti-pollution device (5) comprises an elastic telescopic rod (51), a hollow buffer plate (52), an inclined plate (53), an elastic strip (54) and a contact column (55); the fixed end of the elastic telescopic rod (51) is fixedly mounted on the bottom of the inner wall of the device body (1); the bottom of the hollow buffer plate (52) is fixedly mounted on the top of the telescopic end of the elastic telescopic rod (51); the bottom of the inclined plate (53) is hinged at the top edge of the hollow buffer plate (52); a slide groove is provided inside the hollow buffer plate (52); the upper and lower sides of the elastic strip (54) are fixedly mounted on the inner wall of the slide groove in the inclined plate (53); and the contact column (55) is fixedly mounted on the outer wall of the U-shaped plate (42) on the side away from the inclined plate (53).

4. A manipulator flipping device for semiconductor-specific equipment according to claim 3, characterized in that: The top of the hollow buffer plate (52) contacts the bottom of the U-shaped plate (42), a torsion spring is provided between the bottom of the inclined plate (53) and the hollow buffer plate (52), and the outer wall of the abutment column (55) contacts the inner wall of the inclined plate (53).

5. A manipulator flipping device for semiconductor-specific equipment according to claim 4, characterized in that: The anti-pollution device (5) further comprises a U-shaped telescopic column (56), a baffle (57) and a scraper (58); the top of the fixed end of the U-shaped telescopic column (56) is fixedly mounted on the bottom of the hollow buffer plate (52); the top of the baffle (57) is slidably mounted on the bottom of the square groove of the U-shaped plate (42) through a limit groove; the bottom of the baffle (57) is fixedly mounted on the top of the telescopic end of the U-shaped telescopic column (56); the outer wall of the scraper (58) is fixedly mounted on the inner wall of the square groove in the U-shaped plate (42); and the bottom of the scraper (58) contacts the top of the baffle (57).

6. A manipulator flipping device for semiconductor-specific equipment according to claim 5, characterized in that: The anti-adhesion device (6) comprises an L-shaped pull plate (61), a collection box (62) and a fan (63); the top of the L-shaped pull plate (61) is fixedly mounted on the bottom of the hollow buffer plate (52); the outer wall of the collection box (62) is fixedly mounted on a side of the L-shaped pull plate (61) close to the center of the device body (1); and the outer wall of the fan (63) is fixedly mounted on the inner wall of the L-shaped pull plate (61).

7. A manipulator flipping device for semiconductor-specific equipment according to claim 6, characterized in that: The anti-adhesion device (6) further comprises an air guide plate (64), an arc block (65), a limiting telescopic rod (66), an angular arc plate (67), a transmission plate (68) and a connecting rod slide plate (69); the bottom of the air guide plate (64) is hinged to the bottom of the inner wall of the L-shaped pull plate (61) via a torsion spring; the arc block (65) is fixedly mounted on the inner wall of the air guide plate (64) near the outer wall of the hollow buffer plate (52); the right side of the fixed end of the limiting telescopic rod (66) is fixedly mounted on the left side of the telescopic end of the U-shaped telescopic column (56); the right side of the angular arc plate (67) is fixedly mounted on the left side of the telescopic end of the limiting telescopic rod (66); the top of the transmission plate (68) is hinged to the inner wall of the air guide plate (64); and the bottom of the connecting rod slide plate (69) is slidably mounted on the bottom of the inner wall of the collection box (62).

8. The robot flipping device for semiconductor-specific equipment according to claim 7, characterized in that: The top of the angled arc plate (67) is fixedly mounted on the left side of the bottom of the U-shaped plate (42); the arc surface of the arc block (65) is located on the movement track of the angled arc plate (67); the transmission plate (68) is located below the arc block (65); and the top of the connecting rod slide plate (69) is hinged to the bottom of the transmission plate (68).

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